KR101639154B1 - Apparatus for laser direct image process of module case - Google Patents

Abstract

The present invention relates to a laser module box for a LDI exposure device comprising: a case which is placed on a profile configured in a main body; and a cassette which is withdrawn a certain height away from the case and in which is installed a circuit board of a laser module or other components, wherein, by providing a laser module box which enables the cassette of a particular portion to be withdrawn a certain height away to enable maintenance work when maintenance of the laser module is required, the efficiency of the maintenance work may be improved. For this purpose, the present invention comprises: at least one case (110) placed on a profile configured in a main body (2) and configured so as to be open on both ends; a cassette having a circuit board of a laser module in an LDI exposure device fixed to the inside and configured to be withdrawn a certain height away from the case (110) to enable convenient maintenance of the circuit board; and a cover (130) which covers both open ends of the case (110).

Description

Technical Field [0001] The present invention relates to a laser module box for an LDI exposure apparatus,

The present invention relates to a laser module box of an LDI exposure apparatus, and more particularly, to a laser module box of an LDI exposure apparatus, which comprises a case which is seated on a profile formed on a main body, A laser module box is provided which is capable of performing a maintenance operation by drawing a cassette of a specific portion at a certain height when maintenance work of the laser module is required, To a laser module box.

In general, a printed circuit board (PCB) is a device that easily connects various electronic devices according to a certain frame, and is used for all electronic products, such as digital TVs, wired and wireless telephones, Is a widely used component. Also, it can be divided into general purpose PCB, module PCB, and package PCB depending on the application.

That is, the circuit board is formed by attaching a thin plate of copper or the like to one side of a phenol resin insulating plate or an epoxy resin insulating plate or the like and then etching (a step of etching and leaving only a circuit on the line) , Double-sided boards, multi-layer boards and the like depending on the number of wiring circuit surfaces. The higher the number of layers, the better the mounting force of components and the higher the precision of the products. In recent years, ultra-thin printed circuit boards (0.04 to 0.2 mm) have been widely used in the electronics industry. There has been an increase in the use of a double-sided substrate in which circuits are formed on both sides and interconnected through holes, or a multi-layer substrate on which both sides thereof are expanded as well as a plurality of layers.

Currently, photo lithography, which forms a pattern by photographic transfer, has been widely used for manufacturing a printed circuit board. Particularly, a semi-analytical method capable of coping with high density of wiring density is widely used. The method for manufacturing a printed circuit board using the semimaritive method includes a seed layer forming step, a pre-treatment step, a dry film laminating step, an exposure step, a development step, an electrolytic copper plating step, a dry film peeling step, (flash etching) process. Among them, since the circuit pattern is formed by using the artwork film, the artwork film is liable to be damaged and its correction is difficult. Accordingly, there is provided a laser direct imaging (LDI) exposure apparatus for directly exposing a layer to be exposed on a substrate using a laser diode as a light source without using a photomask.

That is, in order to print the PCB, Rigid, and FPCB patterns, UV light is passed through a film mask to form a desired pattern. Recently, by replacing UV light with a UV laser and irradiating the laser directly onto the film, And an LDI exposure apparatus which makes it possible to quickly form a more precise pattern than a film is used.

In addition, the LDI exposure apparatus adopts a method of forming an image by scanning a laser light source through a polygon mirror or using a DMD (Digital Micro Device) chip.

On the other hand, an array block for fixing a bundle of optical fibers to irradiate the laser light source to the pattern is used.

The array block is made of silicon and is manufactured through an intrinsic wet etching process and is widely used for PLC (planar lightwave circuit) device packaging, optical switch, splitter, and multiplexer as an optical component for optical coupling between an optical fiber and an optical device.

The array block is used for stably connecting an optical fiber to an input end and an output end, and each optical fiber from which the end shell of the single-core optical fiber or the multi-core optical fiber ribbon is removed is aligned in a V- groove, .

The array block is fabricated by: 1. forming an optical fiber fixing part 130, which is formed on the upper surface of the optical fiber fixing board 110 made of a material such as silicon, quartz, glass or the like and has a constant width, , And seats the optical fiber heat in a plurality of V-grooves. At this time, the optical fiber heat is generally obtained by removing the coating of a part of the ribbon optical fiber.

2. The glass 120 is covered on the upper surface of a plurality of V-grooves having a constant width, thickness and spacing. The glass fixes the optical fiber heat and protects the optical fiber heat from the external environment.

3. Block, fiber optic heat and glass are fixed with adhesive such as epoxy resin.

4. Polishing the cross section of the array block.

As shown in FIG. 1, a conventional LDI exposure apparatus is provided with a laser generating means 10 for generating a multi-channel laser beam, a laser beam generating means 10 for receiving multi-channel laser beams from the laser generating means 10, A laser irradiating means 30 for irradiating a multi-channel laser beam received from the optical fiber means 20 onto a substrate 1 to be a target layer; (40) for moving the substrate (1) to form a circuit pattern on the substrate (1), and a control unit (50) for controlling each of the above configurations.

In addition, the optical fiber unit 20 includes a plurality of module boxes each having a laser module including multi-channel optical fibers and control units for controlling laser output.

However, since the conventional laser module box is fixedly mounted on the LDI exposure apparatus, there is a problem in that it is inconvenient to dismantle the entire laser module box when one optical fiber is exchanged.

Korean Patent Publication No. 2002-95866 (published on December 28, 2002) Korean Patent Publication No. 2004-48581 (published on Jun. 10, 2004)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a laser module which is mounted on a profile formed on a main body and a circuit board or other parts of the laser module which are drawn out at a certain height from the case, And a laser module box which is made of a cassette and which allows the maintenance work to be carried out by withdrawing a cassette of a specific portion to a certain height when the maintenance work of the laser module is required is provided so that the efficiency of the maintenance work can be improved. And to provide a laser module box.

According to an aspect of the present invention, there is provided an electronic device comprising: at least one case seated on a profile formed in a main body and configured to open at both ends; A cassette for fixing the circuit board of the laser module of the LDI exposure apparatus to the inside of the case and drawing out a predetermined height from the case to enable easy maintenance of the circuit board; And a lid to cover both open ends of the case.

In the present invention, it is preferable that both sides of the case have a predetermined length, and the retaining piece is provided so as to maintain stable seating as it is in close contact with the outer periphery of each side of the pair of profiles.

In the present invention, the profile is formed with an insertion groove having a predetermined depth; A second fastening hole is formed in the fastening piece of the case; A pressing piece inserted into the insertion groove of the profile is formed; And the fastening bolt is inserted through the second fastening hole formed in the fastening piece of the case which is seated in the profile, so that the fastening piece and the pressing piece are fastened to each other by the pressing force, It is desirable to ensure that the case is firmly fixed.

In the present invention, a guide hole is formed in the case and a first fastening hole is formed below the guide hole; The cassette is guided by the guide hole and the second latching piece is inserted into the case at the lower end thereof; Inserting a cassette into the case and inserting a fastening bolt through the first fastening hole to fasten and fix the second fastening piece; When the maintenance work is required, it is preferable that the fastening bolt is loosened so that the cassette is drawn out to a certain height along the guide hole of the case.

According to the present invention, there is provided a laser module, comprising: a case which is seated on a profile formed on a main body; and a cassette which is drawn out at a certain height from the case and on which a circuit board or other parts of the laser module are mounted. There is an effect that the efficiency of the maintenance work can be improved by providing the laser module storage box that allows the maintenance work to be performed by withdrawing the cassette of a specific portion to a certain height.

1 is a schematic view of a general LDI exposure apparatus;
2 is a schematic perspective view of an LDI exposure apparatus according to the present invention;
3 is a schematic side view of an LDI exposure apparatus according to the present invention.
4 is a schematic exploded perspective view of a module box according to the present invention;
5 is a schematic sectional view of the module box according to the present invention,
5a is a state in which the cassette is coupled to the case, and 5b is a state in which the cassette is drawn out by a certain length from the case.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings (the same reference numerals are used for the same components as the conventional ones, and a detailed description thereof will be omitted).

The laser module box 100 of the present invention is mounted on the profile 200 constructed in the main body 2 of the LDI exposure apparatus and mounted with a circuit board and an optical fiber for controlling the output of the laser etc., It is a means for controlling to be performed smoothly.

2 to 5, the laser module box 100 includes a case 110, a cassette 120 configured to be pulled out from the upper end of the case 110, And a cover 130 closing both ends.

The case 110 is a means for protecting a laser output circuit or terminals that are seated in the profile 200 formed in the main body 2 and housed or configured inside.

The case 110 has a rectangular rim and both ends open. In this case, the lid 130 is configured to be coupled or separated by the fastening means to the openings of both ends of the case 110. Accordingly, by separating the lid 130 from the case 110 and opening the inside of the case 110, it is possible to perform work such as repair or washing.

Further, a guide hole 112 for guiding the draw of the cassette 120 is formed in the case 110. A space is formed in the guide hole 112 at a position having a predetermined length on both sides of the upper end of the case 110 and the upper end. Accordingly, the cassette 120 is inserted into and supported by the guide hole 112.

In addition, on both sides of the case 110, a first fastening hole 113 is formed for fastening the cassette 120 received in the guide hole 112 by fastening means.

A hook 114 is formed at the lower end of the case 110 to support the state of the main body 2 in the profile 200.

The engaging piece 114 is formed with a second fastening hole 115 into which the fastening bolt 117 is inserted.

When the case 110 is placed on the upper end of the profile 200, the engaging pieces 114 formed on both sides of the case 110 are seated on the outer circumferential side of the profile 200, So that the case 110 is seated on the upper end of the case 110.

In addition, the case 110 is formed with a compression piece 116 to be inserted into the profile 200 so that the case 200 can be stably fixed to the profile 200.

In this case, the profile 200 has insertion grooves 202 having a predetermined depth in the upper, lower, left, and right directions. The insertion groove 202 preferably has a T shape.

That is, after the case 110 is seated on the upper end of the profile 200 and the pressing piece 116 is inserted into the insertion groove 202 of the profile 200, The fastening bolt 117 is inserted through the second fastening hole 115 formed in the lower end of the fastening bolt 117 and the fastening bolt 117 is fastened to the insertion groove 202 The engaging piece 114 and the pressing piece 116 are pressed against each other so that the case 110 is stably fixed to the profile 200.

In addition, the case 110 has a guide rail 118 for guiding the lifting and lowering of the cassette 120. The guide rail 118 is formed in a channel shape, but is not limited thereto. Further, a wheel or the like may be formed at one end of the cassette 120 to support the guide rails 118 smoothly lifted and lowered.

In this case, the guide rails 118 may be disposed on one side of the case 110, but the present invention is not limited thereto, and any position can be used as long as it can guide the lifting and lowering of the cassette 120 . For example, on one side of the lid 130.

A circuit board or the like is fixed to the inside of the cassette 120 and is fixed to the case 110 so as to be drawn out to a predetermined length so that the cassette 120 is drawn out from the case 110 by a predetermined length, Maintenance is easily performed.

A handle 122 is formed at the upper end of the cassette 120 to facilitate drawing.

A second latching piece 124 is formed at the lower end of the cassette 120 and is positioned inside the case 110 after being guided by the guide hole 112 of the case 110.

That is, when the cassette 120 is inserted along the guide hole 112 of the case 110, the second latching piece 124 formed at the lower end of the cassette 120 is positioned inside the case 110 The cassette 120 is stably fixed to the case 110 by inserting the fastening bolt through the first fastening hole 113 of the case 110 and fastening the second fastening piece 124.

The assembly and use of the laser module box of the LDI exposure apparatus configured as described above will be described below.

First, the circuit board constituting the laser module is fixed to the inside of the cassette 120.

After the cassette 120 is guided along the guide hole 112 of the case 110 and the fastening bolt is inserted through the first fastening hole 113 of the case 110, The cassette 120 is stably fixed to the case 110 by fastening the second latching piece 124 of the cassette 120 provided at the inside of the case 110. [

Then, the case 110 is seated on the profile 200 of the main body 2. In this case, a plurality of module boxes 100 in which one laser module is formed on a plurality of channels, for example, 64 channels, and then installed in one module box, is seated. In this case, when eight module boxes are provided on each of the two sets of profiles 200 constituting a set, 64 channels are provided in one module box, and '64 * 16 = 1024 channels' . Of course, the present invention is not limited to this, and if the number of module boxes is increased according to the number of channels to be configured, the number of modules can be expanded by the number of channels desired by the user. In this case, the optical fibers connected to the module box 100 are bundled and formed into a bundle, so that the optical fibers can be easily aligned in the main body 2. A plurality of bundles of bundles of optical fibers are connected to the lens formed on one side of the main body 2.

A plurality of crimping pieces 116 are inserted into the insertion groove 202 of the profile 200 so that the crimping pieces 116 are positioned on each of the plurality of cases 110 seated in the profile 200 .

The fastening bolt 117 is inserted through the second fastening hole 115 formed in the fastening piece 114 of the case 110 and then the fastening bolt 117 inserted into the insertion groove 202 of the profile 200 The pressing force of the engaging piece 114 and the pressing piece 116 are pressed against each other by the fastening force of the fastening bolt 117 so that the case 110 is stably fixed to the profile 200 Lt; / RTI >

When the module box 100 is fixed to the profile 200 as described above and maintenance of the laser module is required during maintenance, the first fastening hole 113 formed in the case 110 of the module box 100 Loosen the tightening bolts.

5B, the second engaging piece 124 of the cassette 120, which has been fastened to the fastening bolt through the first fastening hole 113, releases the fastening force. As a result, A predetermined height from the case 110 is extracted.

As a result, the circuit board fixed in the cassette 120 is exposed to the outside as much as a predetermined height is drawn out from the case 110, so that the operator can easily repair the circuit board.

Particularly, in the related art, when an abnormality occurs in a specific part, there is a problem that the maintenance work must be performed by separating the entire storage box fixed to the profile. However, according to the present invention, Thereby improving the efficiency of the work.
In addition, in the conventional case, maintenance is difficult due to a structure in which 1,000 to 1,500 channels of multi-channel laser diodes are connected to one box. However, since a plurality of laser module boxes are separated by 128 channels, Maintenance should be easy.

The above description is only one embodiment for implementing the laser module box of the LDI exposure apparatus, and the present invention is not limited to the above embodiment. It will be understood by those skilled in the art that various changes may be made without departing from the spirit of the invention.

100: laser module box 110: case
112: guide ball 113: first fastener
114: latching piece 115: second fastening hole
116: crimping piece 117: fastening bolt
120: cassette 122: handle
124: second latching piece 130: cover
200: profile 202: insertion groove

Claims (4)

In a laser module box of an LDI exposure apparatus to which a multi-channel optical fiber is connected,
Constructing a plurality of laser module boxes (100) so as to separate and connect optical fibers of multiple channels by a predetermined amount;
The laser module box 100 includes at least one case 110 mounted on a profile 200 formed in the main body 2 and configured to open at both ends thereof;
A cassette 120 for fixing the circuit board of the laser module of the LDI exposure apparatus to the inside of the case 110 and pulling out the case 110 at a predetermined height to enable easy maintenance of the circuit board; And
And a cover (130) covering the opened both ends of the case (110);
And a locking piece 114 having a predetermined length on both sides of the case 110 so as to maintain stable seating as it is in close contact with the outer periphery of each side of the pair of profiles 200;
The profile 200 is formed with an insertion groove 202 having a predetermined depth;
A second fastening hole 115 is formed in the fastening piece 114 of the case 110;
A compression piece (116) inserted into the insertion groove (202) of the profile (200) is formed;
The pressing piece 116 is inserted into the insertion groove 202 and the fastening bolt 117 is inserted through the second fastening hole 115 formed in the fastening piece 114 of the case 110 seated in the profile 200. [ The case 110 is firmly fixed to the profile 200 by the mutual pressing force of the engaging piece 114 and the pressing piece 116 as the pressing piece 116 is fastened.
So that the laser beam is incident on the laser diode module.
delete delete The method according to claim 1,
A guide hole 112 is formed in the case 110 and a first fastening hole 113 is formed below the guide hole 112;
The cassette 120 is guided by the guide hole 112 and a second latching piece 124 is formed at the lower end of the cassette 120 to be inserted into the case 110;
The cassette 120 is inserted into the case 110 and the fastening bolt is inserted through the first fastening hole 113 to fasten and fix the second fastening piece 124;
When the maintenance work is required, the fastening bolt is loosened to pull the cassette 120 up to a certain height along the guide hole 112 of the case 110;
And the laser diode module is configured so that the laser diode module of the LDI exposure apparatus is constructed.

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