KR101638687B1 - Laser processing apparatus - Google Patents

Abstract

The present invention observes a wide range of the processing area by the laser light while suppressing the increase of the installation area of the apparatus.
The attachment 112 includes a laser head 152 which houses an observation optical system constituted by a camera 161, a lens 162 and a mirror 163 and which has a galvanometer mirror 156 for scanning the machining laser light Lp (111). The light from the processing surface S is reflected by the mirror 163 and is incident on the lens 162. The image of the processing surface S in the imaging element of the camera 161 is imaged by the lens 162, do. The present invention can be applied to, for example, a laser marker.

Description

[0001] LASER PROCESSING APPARATUS [0002]

The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus having an observation optical system for observing a work.

2. Description of the Related Art Conventionally, a laser machining apparatus including an observation optical system including a camera, a lens, and the like for positioning a work to be machined and confirming a machining state of a work is popularized.

Some of the laser processing apparatuses provided with the observation optical system include, for example, observing a work in the same direction as the optical axis of a processing optical system (hereinafter referred to as a processing optical axis) (see, for example, Patent Document 1) (For example, see Patent Documents 2 and 3). Some of the laser machining apparatuses for observing a workpiece in a direction different from the machining optical axis include observing the workpiece directly above (see, for example, Patent Document 2) or observing the workpiece in an oblique direction , Patent Document 3).

Fig. 1 schematically shows an example of the configuration of an optical system of the laser marker 1, which is a kind of laser machining apparatus for observing a work in the same direction as the machining optical axis. The laser head 11 of the laser marker 1 includes a processing optical system including a laser oscillator 21, a 3D optical system 22 as a focus adjusting mechanism, a dichroic mirror 23 and a galvanometer mirror 24, And an optical system 25 are provided.

The laser light Lp emitted from the laser oscillator 21 is emitted from the laser head 11 through the 3D optical system 22, the dichroic mirror 23 and the galvanometer mirror 24, S). At this time, the laser beam Lp is scanned by the galvanometer mirror 24 in the biaxial directions of the X-axis and the Y-axis on the processing surface S.

The observation optical system 25 can take the processed surface S through the mirror 23 and the galvanometer mirror 24. The optical axis after the mirror 23 of the observation optical system 25 coincides with the processing optical axis. Thereby, the optical axis of the observation optical system 25 can be directed by the galvanometer mirror 24 to an arbitrary position in the machining area where the laser beam Lp can be scanned.

Fig. 2 schematically shows an example of the configuration of an optical system of the laser marker 31, which is a type of laser machining apparatus for observing a work from directly above. The laser beam Lp emitted from the laser head 41 is scanned by the galvanometer mirror 51 in the laser head 41 in the biaxial directions of the X and Y axes on the processing surface S. [

An observation optical system 42 including a camera is provided beside the laser head 41 so that its optical axis is perpendicular to the processing surface S. [ Therefore, the observation optical system 42 can photograph the processed surface S directly above. Further, by exchanging the lenses included in the observation optical system 42, it is possible to photograph the processing area at a desired enlargement ratio.

Fig. 3 schematically shows an example of the configuration of an optical system of the laser marker 61, which is a type of laser machining apparatus for obliquely observing a work. In the figure, the same reference numerals are given to the parts corresponding to the laser markers 31 in Fig.

In the laser marker 61, the observation optical system 42 is provided beside the laser head 41 such that the optical axis thereof is directed in an oblique direction with respect to the processing surface S. Therefore, the observation optical system 42 can directly photograph the processing area by the laser light Lp.

Patent Document 1: Japanese Patent Application Laid-Open No. 2004-148379 Patent Document 2: Japanese Patent Application Laid-Open No. 11-156566 Patent Document 3: Japanese Patent Laid-Open Publication No. 2012-143785

However, as shown in Fig. 4, in the laser marker 1, since the surface F on which the observation optical system 25 is focused is a curved surface, the focus can not be focused only in the vicinity of the center of the machining area. A small mirror capable of high-speed driving is used for the galvanometer mirror 24, but since the observation optical system 25 photographs the processed surface S through this small mirror, it can not photograph a wide area at once . Therefore, in the laser marker 1, it is difficult to observe a wide range of the machining area with a clear image.

Further, in the laser marker 31, since the processing area can not be directly photographed by the observation optical system 42, it is necessary to move the workpiece at the time of observation and at the time of processing, and the control becomes complicated.

In addition, in the laser marker 61, since the photographing angle of the observation optical system 42 with respect to the processed surface S becomes large, it is difficult to focus on the entire photographing range, blurred or distorted images tend to occur, For example, it may be difficult to observe the periphery of the image.

In the laser marker 31 and the laser marker 61, the observation optical system 42 is provided beside the laser head 41, thereby increasing the size of the apparatus and increasing the installation area (footprint).

Therefore, in the present invention, it is possible to observe a wide range of the machining area by laser light while suppressing an increase in the installation area of the apparatus.

A laser machining apparatus of the present invention is a laser machining apparatus having a laser head including a laser head for emitting a laser beam for machining a work to be machined and a scanning means for scanning the laser beam on the machined surface of the work And an observation optical system including a camera, a lens for imaging an image of a machining surface on an image pickup element of the camera, and a mirror for reflecting light from the machined surface and making it incident on the lens, Direction between the scanning means and the processing surface.

In the laser processing apparatus of the present invention, in the observation optical system provided between the scanning means and the processing surface in the laser head, light from the processing surface is reflected by the mirror and is incident on the lens. And is imaged on the image pickup device.

Therefore, it is possible to observe a wide range of the machining area by laser light while suppressing an increase in the installation area of the apparatus.

This observation optical system can be arranged below the bottom surface of the laser head.

Thereby, an observation optical system can be provided as a unit separate from the laser head.

This mirror can be arranged between the lenses in the image in which the laser light and the start point are set.

Thereby, the mirror can be downsized and the imaging range can be increased.

This laser light can be passed between the lens and the mirror.

This makes it possible to reduce the size limitation of the lens. Further, it is easy to provide a mirror so as not to block the laser beam. In addition, it becomes possible to photograph a work in a direction closer to the vertical direction.

The camera, the lens, and the mirror can be installed such that the machining surface, the main surface of the lens, and the imaging surface of the imaging element substantially cross each other.

Thereby, a clear observation image free from distortion and blur can be obtained.

In this laser processing apparatus, an illumination device for irradiating illumination light onto the processing surface from the obliquely upward direction is also provided, and this illumination device is installed so that the regularly reflected light of the illumination light on the surface to which the observation optical system is focused matches the optical axis of the observation optical system .

Thereby, it becomes possible to observe the work using only regularly reflected light.

This lens can be a telecentric lens.

Thereby, an observation image without trapezoidal distortion can be obtained.

In this laser processing apparatus, an image processing section that performs image processing of an observation image that is an image captured by a camera, and a processing control section that controls processing of the work based on the result of image processing of the observation image can be provided.

Thus, it is possible to perform processing control of the work using an observation image photographed over a wide range of the machining area.

The image processing unit and the machining control unit are implemented by a processor such as a CPU.

This machining control section can set the machining position based on the result of the image processing of the observed image.

Thereby, positioning of the machining position can be performed simply and accurately.

This image processing section can be judged based on the result of the image processing of the observed image whether or not the processing is to be performed.

Thus, for example, when the workpiece is not installed or the workpiece is not in a desired state, the machining can be stopped.

The image processing section can check the processing state of the work based on the result of the image processing of the observed image of the processed work.

As a result, the machining state of the work can be inspected with high accuracy.

In this image processing section, the used region of the observed image can be restricted to the region whose center is coincident with the center of the machining area, based on the shift amount between the center of the machining area by the laser beam and the center of the photographing range of the camera.

Thereby, the center of the machining area can be made coincident with the center of the observation area without performing mechanical adjustment.

This image processing section can correct trapezoidal distortion of the observed image.

Thereby, an observation image without trapezoidal distortion can be obtained.

This image processing section can cause the observation image to be reversed in the vertical direction.

Thereby, the image of the workpiece inverted upside down by the mirror can be observed in the correct direction.

The laser processing apparatus further includes a light source that emits a predetermined measurement light in an oblique direction toward the center of the processing area by the laser light on the surface to which the observation optical system is focused, The position of the focus of the processing optical system for emitting the laser beam can be adjusted on the basis of the irradiation position of the measurement light in the observation image have.

Thus, the processing height of the laser processing apparatus can be adjusted simply and appropriately.

This laser processing apparatus is further provided with a light source for irradiating a predetermined measurement light to the processing surface through the scanning means and the image processing section is provided with an irradiation position of the measurement light in the observation image obtained by photographing the processing surface irradiated with the measurement light And the position of the focus of the processing optical system for emitting the laser beam can be adjusted on the basis of the irradiation position of the measurement light in the observation image.

Thus, the processing height of the laser processing apparatus can be adjusted simply and appropriately.

According to the present invention, it is possible to observe a wide range of the processing area by the laser light while suppressing an increase in the installation area of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram schematically showing a first example of the configuration of a conventional optical system of a laser marker. Fig.
2 is a diagram schematically showing a second example of the configuration of an optical system of a conventional laser marker.
3 is a diagram schematically showing a third example of the configuration of a conventional optical system of a laser marker.
4 is a view for explaining a problem of a conventional laser marker.
Fig. 5 is a perspective view showing a configuration of an appearance of a laser marker according to a first embodiment of the present invention in a state in which a laser shielding cover is removed. Fig.
6 is a perspective view showing a configuration of an appearance of a laser marker according to a first embodiment of the present invention to which a laser shielding cover is attached;
7 is a diagram schematically showing an example of the configuration of an optical system of a first embodiment of a laser marker to which the present invention is applied;
8 is a view for explaining a modification of the installation method of the observation optical system;
9 is a view for explaining a modification of the installation method of the observation optical system;
10 is a block diagram showing a configuration example of the function of the control unit;
11 is a flowchart for explaining the first embodiment of the processing.
12 is a view showing an example of a processing recipe;
13 is a diagram showing a first example of a registration pattern;
14 is a diagram showing a first example of an observation image;
15 is a diagram showing an example of a result of pattern matching;
16 is a diagram showing an example of setting a machining position;
17 is a view showing a working example of a work.
18 is a flowchart for explaining a second embodiment of the machining process;
Fig. 19 is a flowchart for explaining a third embodiment of the machining process. Fig.
20 is a view showing an example of a work.
21 is a view showing an example of a processing recipe;
22 is a diagram showing a second example of a registration pattern;
23 is a diagram showing a normal example of a processing state of a work;
24 is a diagram showing an abnormal example of a work state of a work;
25 is a diagram for explaining a first example of a method of correcting a deviation between a machining area and a center of an observation area;
26 is a diagram for explaining a second example of a correction method of deviation between the machining area and the center of the observation area;
27 is a diagram for explaining a first example of countermeasures against trapezoidal distortion of an observed image;
28 is a view for explaining a second example of measures against trapezoidal distortion of an observed image;
29 is a diagram for explaining an inversion process of an observed image;
30 is a diagram for explaining a first example of a method of adjusting a processing height;
31 is a diagram for explaining a first example of a method of adjusting a processing height;
32 is a diagram for explaining a second example of a method of adjusting a processing height;
33 is a diagram for explaining a second example of a method of adjusting the processing height;
Fig. 34 is a diagram for explaining a comparison with the conventional one in the second example of the method of adjusting the processing height. Fig.
35 is a diagram schematically showing an example of the configuration of an optical system of a second embodiment of a laser marker to which the present invention is applied;
36 is a diagram schematically showing an example of the configuration of an optical system of a third embodiment of a laser marker to which the present invention is applied;
37 is a diagram schematically showing an example of the configuration of an optical system according to a fourth embodiment of the laser marker to which the present invention is applied;

Hereinafter, a mode for carrying out the present invention (hereinafter referred to as an " embodiment ") will be described. The description will be made in the following order.

1. First Embodiment

2. Second Embodiment (Example in which a falling illumination is provided in the first embodiment)

3. Third embodiment (an example in which the machining laser light passes between the lens and the mirror)

4. Fourth embodiment (an example in which an illumination is provided in the third embodiment)

5. Modifications

<1. First Embodiment>

First, the first embodiment of the present invention will be described with reference to Figs. 5 to 34. Fig.

{Example of Configuration of Laser Marker 101}

First, referring to Figs. 5 to 7, an example of the configuration of the laser marker 101 which is the first embodiment of the laser machining apparatus to which the present invention is applied will be described. Fig. 5 shows an example of the external appearance of the laser marker 101 with the laser shielding cover 114 removed. Fig. 6 shows an example of the external appearance of the laser marker 101 with the laser shielding cover 114 removed. As shown in Fig. Fig. 7 schematically shows an example of the configuration of the optical system of the laser marker 101. As shown in Fig. Hereinafter, each of the drawings of the optical system including Fig. 7 is a schematic diagram, and there is also a portion which is not optically accurate in terms of a portion where accuracy is not required.

Hereinafter, the left side of Fig. 5 is set to the front of the laser marker 101, and the right side is set to the rear of the laser marker 101. [ 5, the side on which the side is seen is set to the right side of the laser marker 101, and the side opposite to the side is set to the left side of the laser marker 101. [ In the following description, the left and right direction of the laser marker 101 is the X axis direction, the front and rear direction is the Y axis direction, and the vertical direction is the Z axis direction.

The laser marker 101 is a laser machining apparatus that performs marking on the surface of a work to be machined using laser light. The laser marker 101 is configured to include the laser head 111, the attachment 112 and the attachments 113FR to 113BL (provided that the attachment 113BL is not shown).

The laser head 111 has a box-like shape, and its size is, for example, 140 mm wide × 415 mm deep × 220 mm high. In addition, the depth including the fan behind the laser head 111 is, for example, 450 mm. As will be described later, the laser head 111 is provided with a processing optical system or the like for irradiating a work as an object to be processed with a laser beam for processing (hereinafter referred to as processing laser beam).

The attachment 112 is attached to the rear of the bottom surface of the laser head 111. As will be described later, an observation optical system for observing the processing area of the laser marker 101 is housed in the attachment 112.

The attachments 113FR to 113BL are attached near the four corners of the bottom surface of the laser head 111 and constitute a leg for supporting the laser head 111. [ Further, the attachments 113FR to 113BL secure a space for attaching the attachment 112 below the laser head 111. [

6, a laser shielding cover 114 is attached to the lower portion of the laser head 111 so as to surround the attachment 112 and the attachments 113FR to 113BL. By this laser shielding cover 114, the machining laser beam emitted from the laser head 111 is prevented from leaking to the surroundings.

7, the laser head 111 is provided with a laser oscillator 151, a light source 152, a dichroic mirror 153, a 3D optical system 154, a mirror 155, a galvanometer mirror 156 And a light source 157 are provided. Among them, the processing optical system is constituted by the laser oscillator 151, the dichroic mirror 153, the 3D optical system 154, the mirror 155 and the galvanometer mirror 156.

An observation optical system constituted by a camera 161, a lens 162 and a mirror 163 is housed in the attachment 112. [ Therefore, the observation optical system is disposed between the galvanometer mirror 156 and the processing surface S in the height direction below the bottom surface of the laser head 111.

The laser oscillator 151 emits a machining laser beam for machining a work. The kind of the laser oscillator 151 is not particularly limited, and any arbitrary one can be employed.

The machining laser light is transmitted through the dichroic mirror 153 and the 3D optical system 154 and is then reflected by the mirror 163 and the galvanometer mirror 156 to irradiate the work surface S of the work do. At this time, the focus position of the machining optical system in the Z-axis direction (the condensing position in the Z-axis direction of the machining laser light) can be adjusted by the 3D optical system 154 as the focus adjusting mechanism. Further, as shown in Fig. 7, the galvanometer mirror 156 can scan the machining surface S in the biaxial directions of the X and Y axes.

Hereinafter, a range that can be processed by scanning the machining laser beam is called a machining area. When the machining laser beam is emitted from the laser head 111 in a vertically downward direction, the position where the machining laser beam is irradiated is set as the center of the machining area and is hereinafter referred to as machining center.

The light source 152 emits laser light of visible light (hereinafter referred to as a guide laser). The guide laser light is transmitted through the dichroic mirror 153 and the 3D optical system 154 and then reflected by the mirror 163 and the galvanometer mirror 156 to irradiate the work surface S of the work do. Similarly to the machining laser light, the guide laser can be adjusted by the 3D optical system 154 to adjust the converging position in the Z-axis direction or to be converged by the galvanometer mirror 156 in the two-axis directions of the X- It can be injected or.

The guide laser is used to confirm the machining shape. That is, before machining by the machining laser light, the image of the machined shape can be visually confirmed by scanning the guide laser S on the machined surface S in the same manner as during machining.

As will be described later, the guide laser measures the focus position of the machining optical system (the focused position of the machining laser light) and determines the machining position in the Z-axis direction (height direction) It may be used as measurement light for adjustment.

The light source 157 emits laser light of visible light (hereinafter referred to as a focus pointer). Further, the focus pointer is adjusted so as to pass through the machining center in the plane on which the observing optical system is focused (hereinafter, referred to as the observing system focal plane) in the oblique direction. Then, as will be described later, the focus pointer is used as measurement light for measuring the focus position of the processing optical system (focusing position of the machining laser light) and adjusting the processing height, like the guide laser.

The camera 161, the lens 162, and the mirror 163 take an image (hereinafter referred to as an observation image) for observing the processed surface S. The user can observe the state of the machining area and the like with this observation image.

The camera 161 is provided in the horizontal direction so that the imaging surface of the imaging element (not shown) is perpendicular to the processing surface S. The lens 162 is provided so that its optical axis coincides with the optical axis of the camera 161. The mirror 163 is provided so that the reflecting surface faces the inclined lower surface with respect to the main surface of the lens 162. [

The light from the processing surface S is reflected by the mirror 163 and enters the lens 162 to be imaged on the imaging surface of the imaging element of the camera 161 by the lens 162. [ Then, the image of the processed surface S is photographed by the camera 161. [ Further, by adjusting the angle of the mirror 163, the angle at which the camera 161 is photographed (hereinafter also referred to as the observation area) and the angle at which the processed surface S is photographed (hereinafter referred to as the photographing angle) are adjusted.

The angle of the mirror 163 may be manually or mechanically adjusted, for example, in a state where the attachment 112 is attached to the laser head 111. [

Therefore, according to the laser marker 101, the observation magnification of the processed surface S can be freely set by exchanging the lens 162. [ In addition, like the laser marker 1 shown in Fig. 1, since the processed surface S is directly photographed without passing through the galvanometer mirror 156, vignetting of light by the galvanometer mirror 156 does not occur. Therefore, it is also possible to photograph and observe a wide range including the entire machining area by the camera 161. [

By providing the mirror 163, it is not necessary to direct the camera 161 to the processing surface S in order to photograph the processed surface S, and it is possible to mount the camera 161 in the horizontal direction Do. As a result, the attachment 112 for accommodating the observation optical system can be attached to the bottom surface of the laser head 111. [ This makes it possible to reduce the size of the apparatus and prevent an increase in the footprint by providing an observation optical system such as the laser markers 31 of FIG. 2 and the laser markers 61 of FIG.

Further, by providing the mirror 163, it is possible to set the photographing angle in a direction perpendicular to the processing surface S, as compared with the laser marker 61 in Fig. Thereby, the angle between the observation focal plane and the processing surface S can be made small, and it becomes easy to focus on the entire observation area (imaging range). As a result, it is possible to suppress blurring and distortion of the observed image.

{Variation Example of Installation Direction of Camera 161 and Lens 162}

The installation direction of the camera 161 and the lens 162 is not necessarily limited to the example shown in Fig. For example, the angle of the mirror 163 can be made closer to horizontal by installing the camera 161 so as to face the inclined upward direction. As a result, the photographing angle can be made closer to vertical, and the focus can be easily adjusted by the entire observation area (photographing range).

8, the image pickup surface of the image pickup element 161a of the camera 161, the main surface 162a of the lens 162, and the processed surface S intersect on a substantially straight line, for example, , The camera 161, the lens 162, and the mirror 163 may be provided so as to satisfy the condition of the shine proof. That is, when the optical path from the processed surface S to the camera 161 is simulated without being bent by the mirror 163, the image pickup surface of the image pickup element 161a of the camera 161, The lens 162 and the mirror 163 may be provided so that the main surface 162a of the lens 162 and the machining surface S intersect on a straight line. This can be realized by, for example, tilting the main surface of the lens 162 toward the upper oblique direction and adjusting the angle as shown in Fig. 9, for example.

Thereby, the focus of the observing optical system can be satisfactorily adjusted in all areas in the observation area, and a clear observation image free from distortion and blur can be obtained.

{Processing of Laser Marker 101}

Next, the processing of the laser marker 101 will be described with reference to Figs. 10 to 34. Fig.

(Configuration Example of Control Unit 201)

10 is a block diagram showing a structural example of the function of the control unit 201 provided in the laser marker 101. In Fig. The control unit 201 is constituted by a processor such as a CPU (Central Processing Unit), for example. The control unit 201 may be provided either on the laser head 111 or on the attachment 112 or may be provided on the laser head 111 and the attachment 112 in a dispersed manner.

The control unit 201 is configured to include an imaging control unit 211, an image processing unit 212, and a machining control unit 213. [

The photographing control unit 211 controls the camera 161 to photograph an observation image.

The image processing unit 212 performs various types of image processing on the observation image photographed by the camera 161, as described later. Further, the image processing section 212 outputs the result of the image processing to the outside in response to the necessity.

The machining control section 213 controls the laser oscillator 151, the 3D optical system 154 and the galvanometer mirror 156 to control the machining of the workpiece by the laser head 111. [

(First Embodiment of Processing Process)

Next, the first embodiment of the processing executed by the laser marker 101 will be described with reference to the flowchart of Fig.

In step S1, the control unit 201 acquires a processing recipe input from the outside.

Here, the processing recipe is information indicating the size and shape of marks (e.g., characters, figures, etc.) marked by the laser markers 101 and the processing positions in the work to be machined. Fig. 12 shows an example of a processing recipe in which a circular mark 301 is registered.

In step S2, the control unit 201 acquires a registration pattern input from the outside. Here, the registration pattern is a pattern used for detecting a work by pattern matching in an observation area. For example, an image of a workpiece before machining, an image (e.g., outline diagram) showing characteristics of a workpiece before machining, and the like are given as registration patterns.

Fig. 13 shows an example of the pattern image 311 including the registration pattern 312. Fig. In this pattern image 311, a square registration pattern 312 is shown.

In step S3, the camera 161 photographs the machining area under the control of the photographing control section 211. [ Then, the control unit 201 acquires an observation image obtained as a result of photographing. At this time, as described above, it is possible to obtain a high-quality observation image including a wide range in the entire machining area or the machining area and little distortion and blur.

Fig. 14 shows an example of an observation image. In the observation image 321, two works of a work 322a and a work 322b are taken.

In step S4, the image processing unit 212 performs pattern matching. For example, the image processing unit 212 searches the observation image 321 in Fig. 14 for a pattern matching the registration pattern 312 in Fig. Then, for example, as shown in Fig. 15, the work 322a and the work 322b are detected from among the observed image 321. Fig.

The pattern matching performed by the image processing unit 212 may be any arbitrary technique.

In step S5, the machining control section 213 sets the machining position. For example, the machining control unit 213 calculates the coordinates (machining coordinates) of the machining position in the work 322a and the work 322b detected in the observation image 321 based on the machining recipe. For example, in the case of marking the center of the work 322a and the work 322b, the center 331a of the pattern 322a and the center 332b of the pattern 322b in the observed image 321, (331b) are calculated as machining coordinates. Then, the machining control unit 213 converts the machining coordinates from the observed image 321 into the coordinates in the machining area of the laser marker 101, and sets the obtained coordinates to the machining position.

Here, in the observed image 321, the entire machining area or a wide range within the machining area is photographed. Therefore, for example, it is possible to detect all the work in the machining area by using only one observation image 321, and to set all the machining positions at once.

In step S6, the laser head 111 performs processing under the control of the machining control section 213. [ That is, under the control of the machining control section 213, the laser head 111 processes the marks appearing in the machining recipe at the machining positions set in the processing of step S5. For example, as shown in Fig. 17, a mark Ma and a mark Mb having the same shape as the mark 301 of Fig. 12 are machined at the centers of the work 322a and the work 322b .

Thereafter, the processing is terminated.

As described above, in the laser marker 101, the processing position can be quickly detected and marked by pattern matching using the high-quality observation image including the entire machining area or a wide range in the machining area. In addition, the marking can be accurately performed at a desired position of the work, irrespective of the installation position and the installation direction of the work.

(Second Embodiment of Processing Process)

Next, a second embodiment of the processing performed by the laser marker 101 will be described with reference to the flowchart of Fig.

In steps S31 to S34, the same processing as steps S1 to S4 in Fig. 11 described above is executed.

In step S35, the image processing unit 212 determines whether the match degree is equal to or greater than the threshold value, based on the result of the pattern matching. That is, the image processing unit 212 calculates the degree of agreement between the pattern detected in the observation image and the registration pattern in the process of step S34, and determines whether or not the degree of agreement is equal to or greater than a predetermined threshold value. If the match degree is judged to be equal to or larger than the threshold value, the process proceeds to step S36.

Then, in steps S36 and S37, processing similar to that in steps S5 and S6 in Fig. 11 is performed, and the work is machined.

Thereafter, the processing is terminated.

On the other hand, if it is determined in step S35 that the match degree is less than the threshold value, the process proceeds to step S38. This is the case, for example, when no work is present in the observation area, or when the work is not in a desired state.

In step S38, the image processing unit 212 outputs an abnormal signal. That is, the image processing unit 212 generates and outputs an abnormal signal indicating that the workpiece is not normally processed. Then, for example, a warning lamp provided outside the laser marker 101 is lighted on the basis of this abnormal signal to notify that an abnormality has occurred in the machining of the work.

Thereafter, the processing is terminated.

In this way, it is determined whether or not the machining is to be performed based on the matching degree of the pattern matching. Thus, for example, it is possible to determine whether or not a workpiece is present, perform machining only when a workpiece exists, determine whether or not the workpiece is in a desired state, and perform machining only in a desired state .

(Third Embodiment of Processing Process)

Next, a third embodiment of the processing performed by the laser marker 101 will be described with reference to the flowchart of Fig. Hereinafter, a case of machining a square work 351 shown in Fig. 20 will be described.

In step S61, the machining recipe is acquired in the same manner as the processing in step S1 in Fig. The case where the processing recipe shown in Fig. 21 is given will be described below. In the processing recipe of Fig. 21, a circular mark 361 is registered.

In step S62, the control unit 201 acquires a registration pattern input from the outside. The registration pattern acquired here is a pattern used for inspection of the machining state of the work, unlike the registration pattern used in the first and second embodiments of the machining process. For example, an image of a work after machining (after marking), an image (e.g., outline drawing) showing characteristics of a work after machining, and the like are given as registration patterns.

Fig. 22 shows an example of the pattern image 371 including the registration pattern 372. Fig. This pattern image 371 shows the registration pattern 372 in which the mark 361 in Fig. 21 is arranged in the center of the work 351 in Fig.

In step S63, the laser head 111 is processed under the control of the machining control section 213. [ That is, under the control of the machining control section 213, the laser head 111 processes a mark appearing in the machining recipe at a predetermined position of the work.

In step S64, a machining area is photographed similarly to the process in step S3 in Fig. Thereby, an observed image including the work after the processing is obtained.

In step S65, pattern matching is performed similarly to the processing in step S4 in Fig. That is, inspection of the machining state of the workpiece is performed using pattern matching. More specifically, it is checked whether the machining state of the work is in a state appearing in the registration pattern.

In step S66, similar to the process in step S35 in Fig. 18, it is determined whether or not the match degree is equal to or larger than the threshold value. For example, in step S63, when the mark Mc having the same shape as the mark 361 in Fig. 21 is marked on the almost center of the work 351 as shown in Fig. 23, the work 351 and The pattern made of the mark Mc is very close to the registration pattern 372 in Fig. Therefore, in this case, it is determined that the degree of agreement is not less than the threshold, that is, the machining state is determined to be normal, and the machining process is ended.

On the other hand, when the machining position of the mark Md is deviated from the center of the work 351 as shown in Fig. 24, for example, the pattern composed of the work 351 and the mark Md, Registration pattern 372 is large. Therefore, in this case, it is determined in step S66 that the match degree is less than the threshold value, that is, it is determined that the machining state is abnormal, and the process proceeds to step S67.

In step S67, the image processing unit 212 outputs an abnormal signal. That is, the image processing unit 212 generates and outputs an abnormal signal indicating that the machining state of the workpiece is abnormal. Then, for example, a warning lamp provided outside the laser marker 101 is lighted on the basis of this abnormal signal to notify that an abnormality has occurred in the machining of the work.

As described above, in the laser marker 101, inspection of the processing state can be performed with high accuracy by pattern matching using a high-quality observation image including a wide range in the entire machining area or machining area.

(Correction method of deviation between the machining area and the center of the observation area)

Next, with reference to Figs. 25 and 26, a description will be given of a method of correcting a deviation between the machining area of the laser marker 101 and the center of the observation area. Fig.

When attaching the attachment 112 to the laser head 111, a deviation occurs between the center C1 of the processing area 401 and the center C2 of the viewing area 402 as shown in the upper part of Fig. 25 . The size (misalignment amount) of the misalignment can be detected, for example, by the following method.

For example, first, the laser head 111 performs machining on the center C1 of the machining area 401 under the control of the machining control section 213. [ Thereby, as shown in the center of Fig. 25, the machining point Me is formed at the center C1 of the machining area 401. [

Next, the camera 161 photographs the machining area where the machining point Me is formed, under the control of the photographing control unit 211. Then, Then, the image processing unit 212 detects a machining point (Me) in the observed image by an arbitrary method such as edge extraction or pattern matching. The image processing unit 212 also detects the shift amounts DELTA X and DELTA Y between the detected machining point Me and the center C2 of the observation image to the center C1 of the machining area 401 and the observation area 402 As a shift amount between the center C2 of the center of gravity G2.

The deviation can be corrected mechanically by, for example, adjusting the position of the camera 161 or the lens 162, the angle of the mirror 163, and adjusting the position of the observation area. At this time, for example, the angle of the mirror 163 may be automatically adjusted on the basis of the detected shift amount to correct the shift.

As shown in Fig. 26, it is also possible to correct misalignment by image processing. For example, the image processing unit 212 may divide an area used in an image (i.e., an observation image) in the observation area 402 into an area in which the center C3 is coincident with the center C1 of the processing area 401 403). Specifically, for example, the image processing unit 212 extracts an image in the area 403 from the observation image, and outputs it to the subsequent stage. When the image output from the image processing unit 212 is displayed, for example, the center of the displayed image (that is, the viewing area) coincides with the center C1 of the processing area 401 apparently.

This makes it possible to correct the deviation between the center of the machining area and the center of the observation area without adjusting the position and angle of the camera 161, the lens 162, or the mirror 163.

(Countermeasure against trapezoidal distortion of the observed image)

Next, countermeasures against trapezoidal distortion of the observed image will be described with reference to Figs. 27 and 28. Fig.

In the laser marker 101, since the work is taken from the obliquely upward direction through the mirror 163, when the lens 162 is the non-telecentric lens, as shown in the upper drawing of Fig. 27, Trapezoidal distortion occurs in the image. That is, for example, when a quadrangle work is photographed, the width of the image 451 of the work in the observed image becomes narrower as it goes up.

On the other hand, first, a lens 162 may be a telecentric lens. 27, trapezoidal distortion does not appear on the image 452 of the work and the shape of the image 452 becomes a quadrangle in the observed image.

Also in the laser marker 61 of Fig. 3, it is possible to employ a telecentric lens. However, the effect of the telecentric lens is increased because the angle of view of the laser marker 101 with respect to the processing surface S is small and the trapezoidal distortion is small as compared with the laser marker 61.

Further, for example, the image processing section 212 may perform image processing for eliminating trapezoidal distortion in the observed image. For example, the image processing unit 212 uses the affine transformation defined by the following equations (1) and (2) to calculate the coordinates (x, y) of each pixel in the observation image as the coordinates (x ' ).

x '= a * x + b * y + c ... (One)

y '= d * x + e * y + f ... (2)

In addition, a to f in equations (1) and (2) are predetermined coefficients.

Then, the image processing unit 212 converts the pixel value at the coordinates (x ', y') after the change into bilinear interpolation using pixel values of four pixels around the coordinates (x ', y') in the original observation image Or the like, and generates an image after conversion.

Thus, without using an expensive telecentric lens, it is possible to obtain an image 461 of a work deformed into a quadrangle by removing the trapezoidal distortion as shown in Fig.

(Inversion processing of the observed image)

In the laser marker 101, the image reflected by the mirror 163 is photographed by the camera 161. Therefore, as shown in the upper drawing of Fig. 29, the image 471 of the work in the observation image is inverted in the vertical direction as compared with the case of viewing in the photographing direction. Thus, for example, as shown in the lower drawing of Fig. 29, the image processing unit 212 can obtain the observation image so that the image 471 in the observation image looks in the photographing direction and the vertical direction coincides with the observation image The inversion process may be performed.

(How to adjust the processing height)

Next, a method of adjusting the processing height of the laser marker 101 will be described with reference to FIGS. 30 to 33. FIG.

First, the case of adjusting the processing height by using the focus pointer Lf emitted from the light source 157 will be described with reference to Figs. 30 and 31. Fig. Hereinafter, the machining plane S2 and the observing system focal plane are coincident with each other, the machining plane S1 is higher than the machining plane S2, and the machining plane S3 is located at a position lower than the machining plane S2 . The irradiation points of the focal point Lf on the processed surfaces S1, S2, and S3 are set as irradiation points Pf1, Pf2, and Pf3, respectively.

Fig. 31 schematically shows an example of an observed image obtained by photographing the processed surfaces S1 to S3 irradiated with the focus pointer Lf by the camera 161. Fig. The left end is an observation image of the processed surface S1, the center is an observation image of the processed surface S2, and the right end is an observed image of the processed surface S3.

In the observation image of the processed surface S2 (just focus) that coincides with the observation-system focal plane, the position of the irradiation point Pf2 is roughly the center of the vertical direction. On the other hand, in the observation image of the processing surface S1 at a position higher than the processing surface S2, the position of the irradiation point Pf1 is lower than the center in the vertical direction. Then, the position of the irradiation point Pf1 in the observation image is decreased in proportion to the distance from the observation-system focal plane of the processing surface S1. Further, in the observation image of the processing surface S3 at a position lower than the processing surface S2, the position of the irradiation point Pf3 is above the center in the up-down direction. Then, the position of the irradiation point Pf3 in the observation image rises in proportion to the distance from the observation-system focal plane of the processing surface S3.

Therefore, for example, the image processing section 212 can detect the height of the processing surface with reference to the observation-system focal plane by detecting the position in the vertical direction of the irradiation point of the focus point Lf in the observation image have. Then, for example, the machining control section 213 controls the 3D optical system 22 to adjust the focusing position of the machining laser light in the Z-axis direction (focus position of the machining optical system) to the height of the detected machining plane , The processing height can be appropriately adjusted.

Next, with reference to Figs. 32 and 33, the case of adjusting the processing height by using the guide laser Lg emitted from the light source 152 will be described. 32, irradiation points of the guide laser Lg on the processing surfaces S1, S2, and S3 are set as irradiation points Pg1, Pg2, and Pg3, respectively. The positions of the machined surfaces S1, S2, and S3 are the same as those in Fig.

33 schematically shows an example of an observed image taken by the camera 161 on the processed surfaces S1 to S3 irradiated with the guide laser Lg. The left end is an observation image of the processed surface S1, the center is an observation image of the processed surface S2, and the right end is an observed image of the processed surface S3.

The position of the irradiation point of the guide laser Lg in the observation image with respect to the height of the processing surface shows the same tendency as the focus point Lf. That is, the position of the irradiation point Pg2 is substantially the center in the vertical direction in the observation image of the processing surface S2 (just focus) coinciding with the observation system focal plane. On the other hand, in the observation image of the processing surface S1, the position of the irradiation point Pg1 is decreased in proportion to the distance from the observation system focal plane of the processing surface S1. In addition, in the observed image of the processed surface S3, the position of the irradiation point Pg3 rises in proportion to the distance from the observation-system focal plane of the processed surface S3.

Thus, as in the case of using the focus pointer Lf, the image processing section 212 detects the position of the irradiation point of the guide laser Lg in the observation image in the vertical direction, The height of the surface can be detected. Then, for example, the machining control section 213 controls the 3D optical system 22 to adjust the focusing position of the machining laser light in the Z-axis direction (focus position of the machining optical system) to the height of the detected machining plane , The processing height can be appropriately adjusted.

Further, for example, in the laser marker 1 shown in Fig. 1, when the height of the machined surface is detected by using the guide laser, the image of the guide laser is observed through the galvanometer mirror 24. Therefore, as shown in Fig. 34, the position of the irradiation point of the guide laser in the observation image in the vertical direction hardly changes even if the height of the processing surface is changed. Therefore, in the laser marker 1, it is not possible to adjust the processing height by using only the guide laser. In the laser marker 1, the processing height is adjusted based on whether or not the irradiation positions of the guide laser and the focus point coincide with each other, for example.

<2. Second Embodiment>

Next, a second embodiment of the present invention will be described with reference to Fig.

{Example of Configuration of Laser Marker 501}

Fig. 35 schematically shows an example of the configuration of an optical system of the laser marker 501, which is the second embodiment of the laser machining apparatus to which the present invention is applied. In the figure, parts corresponding to those of the laser marker 101 in Fig. 7 are denoted by the same reference numerals.

The laser marker 501 is obtained by adding an attachment fixture 511 and a lighting device 512 to the laser marker 101. The illumination device 512 is attached to the front of the bottom surface of the laser head 111 via the mounting fixture 511. That is, the illumination device 512 is attached to the opposite side of the mirror 622, with reference to the outgoing position of the processed laser beam from the laser head 111. [ The mounting fixture 511 and the illumination device 512 may be housed in the same attachment as the camera 161, the lens 162, and the mirror 163, or in another attachment.

The illumination device 512 is used as a sub illumination to shoot the illumination light Le1 in the oblique direction on the processing surface S. When the processed surface S coincides with the observation system focal plane so that the central axis of the regularly reflected light on the processed surface S of the illumination light Le1 from the illumination device 512 coincides with the optical axis of the observation optical system , The position of the illumination device 512 and the inclination (the direction of emission of the illumination light Le1) are adjusted.

This makes it possible to observe the work using only the regularly reflected light. For example, by observing the regularly reflected light from the work surface S of the work, the surface of the work can be mirror- It is possible to make a determination of whether or not it is possible.

1, the illumination light reflected by the processing surface S is incident on the observation optical system 25 through the galvanometer mirror 24. [ Therefore, in the laser marker 1, the regularly reflected light from the processed surface S can not always be incident on the observation optical system 25, and the reflected light other than regularly reflected light enters the observation optical system 25 do. Therefore, for example, the surface of the workpiece can not be determined by the above-described method.

Further, since the illumination device 512 is provided on the bottom surface of the laser head 111, the increase in the footprint can be prevented.

<3. Third Embodiment>

Next, a third embodiment of the present invention will be described with reference to Fig.

{Example of Configuration of Laser Marker 601}

Fig. 36 schematically shows an example of the configuration of the optical system of the laser marker 601, which is the third embodiment of the laser machining apparatus to which the present invention is applied. In the figure, parts corresponding to those of the laser marker 101 in Fig. 7 are denoted by the same reference numerals. Further, the illustration of the light source 157 in the laser head 111 is omitted.

The laser marker 601 differs from the laser marker 101 in that the attachment 611 is attached to the bottom of the laser head 111 instead of the attachment 112. [

The attachment 611 is configured to include a camera 161, a lens 621, and a mirror 622. Although the mirror 622 is housed in the attachment 611 such as the camera 161 and the lens 621 in this example, the mirror 622 may be housed in, for example, another attachment, Alternatively, it may be provided directly on the bottom surface of the laser head 111.

The laser marker 601 is provided with a lens 621 and a mirror 622 so that the machining laser beam passes between the lens 621 and the mirror 622. Thus, the space between the camera 161 and the mirror 622 is widened, and the restriction of the size of the lens is reduced. Therefore, for example, as shown in FIG. 36, it is possible to provide a lens 621 of a larger size than the lens 162 of the laser marker 101.

Thereby, it is possible to realize an improvement in image quality such as making the observed image clearer. In addition, with the improvement of the image quality of the observed image, more accurate image processing can be performed, for example, the accuracy of positioning of the processing position can be improved.

In addition, the mirror 622 can be provided in a direction closer to vertical than the mirror 163 of the laser marker 101. Therefore, it is easy to provide the mirror 622 so as not to block the machining laser light.

On the other hand, the mirror 163 of the laser marker 101 can be made smaller than the mirror 622 of the laser marker 601. Alternatively, when the sizes of the mirror 163 and the mirror 622 are made the same, the laser markers 101 are wider in the observation area, and a wider range can be photographed.

<4. Fourth Embodiment >

Next, a fourth embodiment of the present invention will be described with reference to Fig.

{Example of Configuration of Laser Marker 701}

37 schematically shows an example of the configuration of the optical system of the laser marker 701 as the fourth embodiment of the laser machining apparatus to which the present invention is applied. In the figure, the same reference numerals are given to the parts corresponding to those of the laser marker 601 in Fig.

The laser marker 701 enables the work to be observed by the regularly reflected light, like the laser marker 501 in Fig. More specifically, the laser marker 701 differs from the laser marker 601 in that the attachment 711 is attached to the bottom surface of the laser head 111 instead of the attachment 611. The attachment 711 differs from the attachment 611 in that a lens 721 is provided instead of the lens 621 and an attachment fixture 722 and a lighting device 723 are added.

The illumination device 723 is attached to the bottom surface of the laser head 111 via the mounting jig 722 on the opposite side of the mirror 622 with reference to the exit position of the machining laser beam from the laser head 111. It is possible to use the lens 621 in Fig. 36 instead of the lens 721, but an example in which a lens 721 smaller than the lens 621 is provided is shown for easy understanding. In this example, the mirror 622, the mounting fixture 722, and the illumination device 723 are housed in the attachment 711 such as the camera 161 and the lens 721, It may be directly attached to the bottom surface of the laser head 111 without being housed in another attachment or housed in the attachment.

The illumination device 723 is used as an illumination light for shooting the illumination light Le2 in the oblique direction on the processing surface S as in the illumination device 512 of the laser marker 501 in Fig. The center axis of the regularly reflected light on the processed surface S of the illumination light Le2 from the illumination device 723 coincides with the optical axis of the observation optical system , The position of the illumination device 723 and the inclination (the direction of emission of the illumination light Le2) are adjusted.

35, it is possible to observe the workpiece by the regularly reflected light. For example, by observing the regularly reflected light from the work surface S of the workpiece, the surface of the workpiece It is possible to determine whether it is a mirror surface or a rough surface.

Further, since the illumination device 723 is provided on the bottom surface of the laser head 111, the increase in the footprint can be prevented.

<5. Modifications>

Modifications of the above-described embodiment of the present invention will be described below.

Although the present invention is applied to laser markers in the above description, the present invention can be applied to various types of laser machining apparatuses other than the laser markers having the observation optical system (for example, drilling, cutting, Dimensional machining, laser repairing, and the like).

In the above description, an example of detecting a work in an observation area using pattern matching has been described. However, it is also possible to detect a predetermined pattern in a work and set a processing position based on the detected pattern. It is also possible to detect a pattern in a work or a work by using, for example, an image processing method other than pattern matching such as edge extraction or feature point extraction.

Further, for example, a part or all of the observation optical system may be provided in the laser head 111. [ However, in this case as well, it is preferable to arrange an observation optical system between the galvanometer mirror 156 and the processing surface S in the height direction.

Further, for example, the laser oscillator 151 may be provided outside the laser head 111.

It is also possible to omit one or both of the light source 152 and the light source 157 of the laser head 111, for example.

Further, for example, the functions of part or all of the control unit 201 may be realized by a computer or the like provided outside the laser marker.

The series of processes of the control unit 201 described above may be executed by hardware or by software. When a series of processes are executed by software, a program constituting the software is installed in the computer. Here, the computer includes a computer incorporated in dedicated hardware or a general-purpose personal computer capable of executing various functions by installing various programs, for example.

The program executed by the computer can be recorded on a removable medium, for example, as a package medium and provided. The program may be provided via a wired or wireless transmission medium, such as a local area network, the Internet, or a digital satellite broadcasting.

The program executed by the computer may be a program that is processed in time series in accordance with the procedure described in this specification, or may be a program that is processed at necessary timing such as in parallel or when a call is made.

The embodiments of the present invention are not limited to the above-described embodiments, and various modifications are possible without departing from the gist of the present invention.

101: laser marker 111: laser head
112: Attachment 151: Laser oscillator
152: light source 154: 3D optical system
156: Galvano mirror 157: Light source
161: camera 161a:
162: lens 162a:
163: Mirror 201:
211: photographing control unit 212: image processing unit
213: Processing control section 501: Laser marker
512: illumination device 601: laser marker
611: Attachment 621: Lens
622: mirror 701: laser marker
711: Attachment 721: Lens
723: Lighting system

Claims (17)

A laser machining apparatus comprising a laser head including a laser head emitting laser light for machining a work to be machined and scanning means for scanning the laser beam on a machining surface of the work,
Camera,
A lens that forms an image of the processed surface on an image pickup element of the camera;
And an observation optical system including a mirror that reflects light from the processing surface and makes the light incident on the lens,
Wherein the observation optical system is provided between the scanning means and the processing surface in the height direction,
And the laser beam passes between the lens and the mirror. delete delete The method according to claim 1,
Wherein the observation optical system is disposed below the bottom surface of the laser head. delete delete The method according to claim 1,
Further comprising an illuminating device for irradiating the processing surface with illumination light from an oblique upper direction,
Wherein the illuminating device is provided so that the regularly reflected light of the illumination light on the surface to which the observation optical system is focused matches the optical axis of the observation optical system. The method according to claim 1,
Wherein the lens is a telecentric lens. The method according to claim 1,
An image processing unit that performs image processing of an observation image that is an image captured by the camera;
Further comprising a machining control section for controlling the machining of the work based on the result of the image processing of the observed image. 10. The method of claim 9,
And the machining control section sets the machining position on the basis of the result of the image processing of the observation image. 10. The method of claim 9,
Wherein the image processing section determines whether or not to perform processing based on a result of the image processing of the observation image. 10. The method of claim 9,
Wherein the image processing section inspects the processing state of the work based on the result of the image processing of the observation image obtained by photographing the work after processing. 10. The method of claim 9,
Wherein the image processing section is configured to divide an area to be used for the observation image into a region whose center is coincident with the center of the processing area on the basis of a shift amount between the center of the processing area by the laser light and the center of the shooting range of the camera Of the laser beam. 10. The method of claim 9,
Wherein the image processing section corrects trapezoidal distortion of the observed image. 10. The method of claim 9,
Wherein the image processing unit performs a vertical inversion of the observed image. 10. The method of claim 9,
Further comprising a light source that emits a predetermined measurement light in an oblique direction toward the center of the processing area by the laser light on the surface to which the observation optical system is in focus,
The image processing section detects an irradiation position of the measurement light in the observation image on which the processing surface irradiated with the measurement light is photographed,
Wherein the machining control section adjusts a focus position of a processing optical system for emitting the laser beam based on an irradiation position of the measurement light in the observation image. 10. The method of claim 9,
Further comprising a light source for irradiating a predetermined measurement light onto the processing surface through the scanning means,
The image processing section detects an irradiation position of the measurement light in the observation image on which the processing surface irradiated with the measurement light is photographed,
Wherein the machining control section adjusts a focus position of a processing optical system for emitting the laser beam based on an irradiation position of the measurement light in the observation image.

Images