JP6795060B1 - Control device and laser machining system equipped with it, laser machining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a control device capable of appropriately correcting a laser machining position when a positional deviation occurs in a height direction and a plane direction regardless of the shape of a work, a laser machining system provided with the control device, and laser machining. Provide a method. A control device (10) includes a processing control unit (11), an image processing unit (12), and a storage unit (13). The storage unit 13 includes a registration pattern RP including a part of the shape of the work 50 set in a state where the work 50 is at the reference position and the reference height, a target reference position (P0, Q0) corresponding thereto, and a guide. The reference coordinates (X0, Y0) of the position where the work 50 irradiated with light exists are stored. The machining control unit 11 refers to the reference coordinates (X0, Y0) stored in the storage unit 13 and the target reference positions (P0, Q0) corresponding to the registration pattern RP, and the machining surface of the work 50 by the laser beam. The machining position on 50c is corrected. [Selection diagram] Fig. 3

Description

The present invention relates to a control device that controls a laser machining device that irradiates a machined surface of a work with a laser to machine the machined surface of the work, a laser machining system provided with the control device, and a laser machining method.

In recent years, a laser processing device that irradiates a work with a laser beam to process the machined surface of the work has been used.
Such laser machining devices include those that irradiate the machined surface of the work with laser light to mark the machined surface with characters, figures, and the like, and those that perform processing such as drilling and cutting.
For example, Patent Document 1 has a pointer light emitter for distance measurement that emits pointer light toward the surface of a work, and a light receiving shaft branched from an emission axis of a laser beam, and the pointer light hits the surface of the work. Based on the imaging unit that captures the generated bright spot, the memory that records the distance derivation information for deriving the working distance, the distance derivation information of the memory, and the position of the bright spot in the image captured by the imaging unit. A laser processing apparatus having a working distance measuring means for obtaining a working distance is disclosed.

Further, in Patent Document 2, an attachment is attached to the bottom surface of a laser head including a galvano mirror that houses an observation optical system composed of a camera, a lens, and a mirror and scans a processed laser beam from the processed surface. The light is reflected by a mirror, incident on a lens, and an image of a machined surface is formed by the lens in an image pickup element of a camera.

Japanese Unexamined Patent Publication No. 2016-36841 (Patent No. 6305270) Japanese Unexamined Patent Publication No. 2015-44212 (Patent No. 6299111)

However, the above-mentioned conventional laser processing apparatus has the following problems.
That is, in the configuration of the laser processing apparatus disclosed in Patent Document 1, the shape of the work is measured because the pointer light emitted from the pointer light emitter for distance measurement is fixed at the center position of the work. For example, in the case of a shape field having an opening at the center position such as an annular work, there is a problem that the distance to the work cannot be measured.

Similarly, in the laser processing apparatus of Patent Document 2, since the focus pointer is adjusted so as to pass through the processing center on the focused surface of the observation optical system from an oblique direction, the portion irradiated with the guide light is irradiated. When laser processing is performed on a work having no work surface, there is a problem that the processing height cannot be adjusted by measuring the focus position (condensing position of laser light) of the processing optical system.

An object of the present invention is a control device capable of appropriately correcting a laser machining position when a positional deviation occurs in a plane direction in the height direction regardless of the shape of the work, and a laser machining system provided with the control device. , To provide a laser processing method.

The control device according to the first invention includes a laser head including an exit portion that irradiates a laser beam for processing the work to be processed and a scanning means for scanning the laser light on the processed surface of the work. An observation optical system that includes a camera that acquires an observation image including the work and is arranged so that the optical axes of the camera intersect with the irradiation direction of the laser light, and the machined surface of the work that is scanned coaxially with the laser light. It is a control device for controlling a laser processing apparatus including a guide light irradiating unit for irradiating the irradiated guide light, and includes a processing control unit and a storage unit. The machining control unit controls machining of the workpiece by the laser head using the observation image acquired by the camera. The storage unit is set with the work at the reference position and the reference height, and the registration pattern including a part of the shape of the work and the target reference position corresponding to the registration pattern, and the guide light irradiation unit irradiates the storage unit with the guide light. Save the reference coordinates of the position where the work is located. The machining control unit corrects the machining position on the machining surface of the workpiece by the laser beam with reference to the reference coordinates stored in the storage section and the target reference position corresponding to the registration pattern.

Here, the laser head that processes the machined surface by scanning the laser beam emitted to the machined surface of the work and the optical axis are arranged obliquely with respect to the irradiation direction of the laser light, and include the work. A control device that controls a laser processing device including an observation optical system having a camera for acquiring an observation image and a guide light irradiation unit that irradiates a machined surface of the work with a reference guide light, and stores the laser processing device in advance in a storage unit. With reference to the set reference coordinates and the target reference position corresponding to the registration pattern, the machining position of the workpiece to be machined on the machined surface by the laser beam is corrected.

Here, the processing by the laser beam emitted from the laser head includes, for example, printing processing of characters, numbers, symbols and the like on the processed surface, drilling processing, cutting / cutting processing and the like.
The reference position of the work means a reference position on a plane substantially perpendicular to the irradiation direction of the laser beam. Further, the reference height of the work means a reference position in the irradiation direction of the laser beam.

Further, the guide light is, for example, red light that is coaxially irradiated to the machined surface with the laser light scanned by the laser head and is referred to at the time of machining. It is irradiated on the surface.
Further, the registration pattern means, for example, the contour of the work in a portion having a characteristic shape for each of various types of works in consideration of the shape of the work. The target reference position of the work corresponding to the registration pattern means, for example, the origin of the camera coordinates of the camera set for the characteristic shape portion of the work and the origin of the processing coordinates by the laser beam. ..

As a result, in the observation image of the work to be machined, the amount of deviation between the coordinates of the machined surface irradiated with the guide light irradiated in the same direction as the reference coordinates stored in the storage unit and the reference coordinates, and the characteristics of the work. It is possible to calculate the amount of deviation between the target reference position and the target reference position stored in the storage unit based on the specific shape or the like.
As a result, the reference coordinates and the target reference position can be set not only at the center position of the work, so that the laser machining position occurs when the position shift occurs in the height direction and the plane direction regardless of the shape of the work. Can be corrected appropriately.

The control device according to the second invention is the control device according to the first invention, and has the same direction as the reference coordinates stored in the storage unit and the reference coordinates on the work included in the observation image acquired by the camera. The displacement in the height direction of the work is detected based on the position of the guide light irradiated to the workpiece.
As a result, the amount of deviation of the coordinates on the machined surface of the work to be irradiated with the guide light irradiated in the same direction as when the reference coordinates are set (diagonal direction with respect to the origin of the machined coordinate system) is calculated. The processing position can be appropriately corrected by calculating the positional deviation in the height direction in the laser beam irradiation direction from the deviation amount in the plane perpendicular to the light irradiation direction.

The control device according to the third invention is the control device according to the first or second invention, and is included in the target reference position corresponding to the registration pattern stored in the storage unit and the observation image acquired by the camera. The positional deviation in the plane direction substantially perpendicular to the irradiation direction of the laser beam is detected based on the position corresponding to the registration pattern of the workpiece.
As a result, the target reference position set based on the position of the registration pattern including the characteristic shape for each work is compared with the position obtained based on the position of the registration pattern in the observation image of the work to be processed. By doing so, it is possible to detect the displacement of the work in a plane substantially perpendicular to the irradiation direction of the laser beam and appropriately correct the machining position.

The control device according to the fourth invention is the control device according to any one of the first to third inventions, and the processing control unit has a target reference position corresponding to the registration pattern stored in the storage unit. , The position shift in the rotation direction about the optical axis of the laser beam of the work is detected based on the position of the work included in the observation image acquired by the camera.
As a result, the target reference position set based on the position of the registration pattern including the characteristic shape for each work and the target reference position obtained based on the position of the registration pattern in the observation image of the work to be processed By comparing with the coordinates, it is possible to detect the positional deviation of the work in the rotation direction about the optical axis of the laser beam and appropriately correct the machining position.

The control device according to the fifth invention is a control device according to any one of the first to fourth inventions, and a plurality of control devices set in the storage unit according to a change in the height position of the work. The registration pattern is saved.
As a result, in a configuration in which the laser machining position is corrected by using a camera that acquires an observation image from an oblique direction with respect to the machined surface of the workpiece, there is a position change in the height direction of the workpiece and the shape of the workpiece viewed from diagonally above. Even when is changed, since a plurality of registered patterns are stored according to the height, it is possible to perform appropriate correction of the laser processing position in response to the height fluctuation.

The control device according to the sixth invention is a control device according to any one of the first to fifth inventions, and the processing control unit is a circle, ellipse, or polygon irradiated from the guide light irradiation unit. The position of the guide light forming the characteristic spot light including any one is detected and compared with the reference coordinates.
Thereby, by searching for the spot of the guide light having a characteristic shape in the observation image acquired by the camera, it is possible to easily compare the position with the reference coordinate set by the guide light.

The control device according to the seventh invention is the control device according to any one of the first to sixth inventions, and the target reference position is the origin of the camera coordinates of the camera and the processed coordinates by the laser beam. It is the origin of the system.
As a result, for example, by using the origin of the camera coordinates and the origin of the laser beam processing coordinate system as the target reference position of the substantially annular work, the central position without the substantially annular work is set as the target reference position. Even in this case, the displacement of the work to be machined can be easily detected.

The control device according to the eighth invention is the control device according to any one of the first to seventh inventions, and the guide light irradiation unit is within a range including the work toward the machined surface of the work. On the other hand, the guide light is irradiated at multiple points.
As a result, among the guide lights irradiated from the guide light irradiation unit at multiple points, the position of the guide light irradiated on the machined surface of the work is memorized, so that the work on the plane perpendicular to the irradiation direction of the laser light is stored. The misalignment of the light can be easily detected.

The control device according to the ninth invention is the control device according to the eighth invention, and in the storage unit, among the guide lights irradiated at multiple points by the guide light irradiation unit, the work is set to the reference position and the reference height. In a certain state, the position of the guide light irradiated on the work is saved.
As a result, among the guide lights irradiated at multiple points by the guide light irradiation unit, the position of the guide light irradiated on the work in the state where the work is at the reference position and the reference height is saved as the reference position, so that the laser can be used. It is possible to detect the displacement of the work in a plane perpendicular to the light irradiation direction.

The control device according to the tenth invention is the control device according to the ninth invention, and the processing control unit includes the position of the guide light stored in the storage unit and the work included in the observation image acquired by the camera. The machining position on the machining surface of the workpiece by the laser beam is corrected by comparing with the position of the guide light irradiated above.
As a result, by comparing the position of the guide light stored in the storage unit with the position of the guide light actually irradiated on the machined surface of the work to be machined, it is perpendicular to the irradiation direction of the laser beam. It is possible to detect the displacement of the work on a flat surface and appropriately correct the machining position on the machining surface.

The control device according to the eleventh invention is a control device according to any one of the eighth to tenth inventions, and the processing control unit acquires the position of the guide light stored in the storage unit and the camera. The machining position on the machining surface of the work is corrected based on the inclination of the work detected by comparing with the position of the guide light on the work included in the observed image.
As a result, for example, by detecting that the position of the guide light irradiated at multiple points on the machined surface of the work has changed as compared with the case where the work is at the reference position and the reference height, the machined surface of the work The inclination of can be detected.
Therefore, the machining position on the machining surface of the work can be appropriately corrected according to the amount of inclination of the machining surface.

The control device according to the twelfth invention is a control device according to any one of the first to eleventh inventions, and the work has an annular shape.
As a result, even if the work has a shape such as a substantially circular ring without a central portion, the machining position on the machining surface of the workpiece can be appropriately corrected by setting the target reference position and the reference coordinates described above. it can.

The laser processing system according to the thirteenth invention includes a control device according to any one of the first to twelfth inventions, a laser head, an observation optical system, and a guide light irradiation unit.
As a result, by performing machining control that corrects the machining position of the laser beam by the control device described above, the position shift of the workpiece in the plane direction in the height direction is detected regardless of the shape of the workpiece, and the machining position is determined. It can be corrected appropriately.

The laser processing method according to the fourteenth invention includes a laser including an exit portion that irradiates a laser beam for processing the work to be processed, and a scanning means for scanning the laser light on the processed surface of the work. The work is scanned coaxially with the laser beam and an observation optical system that includes a head and a camera that acquires an observation image including the workpiece, and the optical axes of the camera are arranged so as to intersect the irradiation direction of the laser beam. A laser processing apparatus provided with a guide light irradiation unit that irradiates a guide light that is applied to the processed surface, and a processing control unit that controls processing of a workpiece by a laser head using an observation image acquired by a camera. It is a laser processing method according to the above, and includes a preservation step and a correction step. In the storage step, the guide light is irradiated by the guide light irradiation unit and the registration pattern including a part of the shape of the work and the target reference position corresponding to the registration pattern, which are set with the work at the reference position and the reference height. The reference coordinates of the position where the work is present and the reference coordinates are stored in the storage unit. In the correction step, the machining position on the machining surface of the workpiece by the laser beam is corrected with reference to the reference coordinates stored in the storage unit and the target reference position corresponding to the registration pattern.

Here, the laser head that processes the machined surface by scanning the laser beam emitted to the machined surface of the work and the optical axis are arranged obliquely with respect to the irradiation direction of the laser light, and include the work. A control device that controls a laser processing device including an observation optical system having a camera for acquiring an observation image and a guide light irradiation unit that irradiates a machined surface of the work with a reference guide light, and stores the laser processing device in advance in a storage unit. With reference to the set reference coordinates and the target reference position corresponding to the registration pattern, the machining position of the workpiece to be machined on the machined surface by the laser beam is corrected.

Here, the processing by the laser beam emitted from the laser head includes, for example, printing processing of characters, numbers, symbols and the like on the processed surface, drilling processing, cutting / cutting processing and the like.
The reference position of the work means a reference position on a plane substantially perpendicular to the irradiation direction of the laser beam. Further, the reference height of the work means a reference position in the irradiation direction of the laser beam.

Further, the guide light is, for example, red light that is coaxially irradiated to the machined surface with the laser light scanned by the laser head and is referred to at the time of machining. It is irradiated on the surface.
Further, the registration pattern means, for example, the contour of the work in a portion having a characteristic shape for each of various types of works in consideration of the shape of the work. The target reference position of the work corresponding to the registration pattern means, for example, the origin of the camera coordinates of the camera set for the characteristic shape portion of the work and the origin of the processing coordinates by the laser beam. ..

As a result, in the observation image of the work to be machined, the amount of deviation between the coordinates of the machined surface irradiated with the guide light irradiated in the same direction as the reference coordinates stored in the storage unit and the reference coordinates, and the characteristics of the work. It is possible to calculate the amount of deviation between the target reference position and the target reference position stored in the storage unit based on the specific shape or the like.
As a result, the reference coordinates and the target reference position can be set not only at the center position of the work, but the laser can be used when the work is displaced in the plane direction in the height direction regardless of the shape of the work. The machining position can be corrected appropriately.

According to the control device according to the present invention, the laser machining position can be appropriately corrected when the position shift occurs in the height direction and the plane direction regardless of the shape of the work.

The schematic diagram which shows the structure of the laser processing system provided with the control device which concerns on one Embodiment of this invention. The perspective view which shows the shape of the workpiece machined by the laser machining system of FIG. The control block diagram of the laser processing system of FIG. (A) is a schematic view showing a positional deviation in a plane direction of a workpiece machined by the laser machining system of FIG. (B) is a schematic view showing a positional deviation in the height direction of the work machined by the laser machining system of FIG. FIG. 1C is a diagram showing positional deviations of the workpiece machined by the laser machining system of FIG. 1 in the plane direction and the height direction. FIG. 1A is a diagram showing an observation image including a reference height shown in FIG. 1 and a laser machining position when laser machining is performed on a machined surface of a workpiece at a reference position. FIG. 4B is a diagram showing an observation image including a laser machining position when laser machining is performed on a machined surface of a workpiece in which a positional deviation occurs in the plane direction and the height direction shown in FIG. 4 (c). In the laser machining system of FIG. 1, the reference height and the registration pattern of the workpiece at the reference position, the target reference position, and the reference coordinates stored in the memory in order to detect the positional deviation in the height direction and the plane direction of the workpiece are set. The figure which shows the observation image including. FIG. 3 is a diagram illustrating a process for detecting and correcting a positional deviation in the height direction and the plane direction of a work using a registration pattern, a target reference position, and reference coordinates in the laser machining system of FIG. 1. FIG. 5 is a diagram illustrating a process of calculating a positional deviation in the height direction from a positional deviation of reference coordinates in the plane direction of FIG. 7. The schematic diagram which shows the diameter of the laser at the laser emission position in the laser head of the laser processing system of FIG. The flowchart which shows the processing flow of the laser processing method which concerns on one Embodiment of this invention. (A) is a figure which shows the reference position of the multi-point irradiation of the guide light used in the laser processing system which concerns on other embodiment of this invention. (B) is a diagram showing the difference from the reference position of multi-point irradiation when the position of the work is displaced.

The laser processing system 1 provided with the control device 10 according to the embodiment of the present invention will be described below with reference to FIGS. 1 to 10.
In the following description, the height direction is the direction in which the laser beam is applied from the laser head 20 to the machined surface 50c of the work 50 (vertical direction in FIG. 1), and the plane direction is the direction in which the laser beam is emitted. It shall mean the direction of the plane substantially orthogonal to the direction of irradiation (the left-right direction in FIG. 1).

Further, the misalignment of the work 50 in the height direction, which will be described later, means a state in which the work 50 is offset from the reference height of the work 50 shown in FIG. 1 in the height direction (Z direction). .. Further, the positional deviation of the work 50 described later in the plane direction means a state in which the work 50 is offset from the reference position of the work 50 in FIG. 1 in the plane direction (XY direction) substantially orthogonal to the irradiation direction of the laser beam. doing.

As shown in FIG. 1, the laser processing system 1 of the present embodiment is a system that irradiates the processed surface 50c of the work 50 with a laser beam to perform laser processing of characters and the like, and includes a control device 10 and a control device 10. It includes a laser head 20, an observation optical system 30, and a display device 40.
Here, the work 50 used as an object for laser machining in the present embodiment has a substantially annular shape as shown in FIG. The work 50 shown in FIG. 1 shows a state in which the work 50 is arranged at a reference height and a reference position in the laser machining system 1.

Specifically, as shown in FIG. 2, the work 50 includes a substantially annular main body portion 50a, an opening portion 50b formed at the center of the main body portion 50a, and a flat surface portion (machined surface 50c) of the main body portion 50a. And have.
Then, the laser processing system 1 performs printing processing of characters and the like on the processing surface 50c of the substantially annular work 50 having the opening 50b in the central portion of the main body portion 50a.

(1) Control device 10
The control device 10 performs processing control using the laser beam by the laser head 20 by using the observation image acquired by the camera 31 included in the observation optical system 30 and the position of the guide light emitted from the guide light irradiation unit 22. As shown in FIG. 3, the apparatus includes a processing control unit 11, an image processing unit 12, and a storage unit 13.

As shown in FIG. 3, the processing control unit 11 is connected to a laser light emitting unit 21, a guide light irradiation unit 22, and a galvano scanner (scanning means) 24 included in the laser head 20, and is capable of irradiating the laser light. Controls such as irradiation of guide light and correction of processing position of laser light. Then, the processing control unit 11 irradiates the laser light emitted from the laser light emitting unit 21 and the guide light emitted from the guide light irradiation unit 22 to a desired processing position on the processing surface 50c of the work 50. Controls the galvano scanner 24. Further, the machining control unit 11 sets the reference coordinates (X0, Y0) as the position of the guide light irradiated on the machining surface 50c with the work 50 described later at the reference height and the reference position (see FIG. 6). Then, it is stored in the storage unit 13.

The correction control of the machining position by the machining control unit 11 due to the reference height of the work 50 and the deviation from the reference position will be described in detail later.
As shown in FIG. 3, the image processing unit 12 is connected to the camera 31 of the observation optical system 30, receives an observation image including the processed surface of the work 50 acquired by the camera 31, and processes the work 50. Various image processing such as setting the processing position on the surface 50c is performed. Further, the image processing unit 12 is connected to the display device 40 and transmits the observation image received from the camera 31 to the display device 40. Further, the image processing unit 12 sets the registration pattern RP and the target reference positions (P0, Q0) in a state where the work 50 described later is at the reference height and the reference position (see FIG. 6), and stores the work 50 in the storage unit 13. Let me.

As shown in FIG. 3, the storage unit 13 is connected to the processing control unit 11 and the image processing unit 12, and stores various data created and set by the processing control unit 11 and the image processing unit 12. Further, the storage unit 13 uses the registration pattern RP, the target reference position (P0, Q0), and the reference coordinates (X0, Y0) used for the correction control of the reference height of the work 50 and the machining position due to the deviation from the reference position, which will be described later. ) (See FIG. 6 for both).

In the present embodiment, two substantially arc-shaped portions (see the thick line in the broken line square portion A1 in FIG. 6) are registered as the registration pattern RP stored in advance in the storage unit 13, and the corresponding target As the reference position, the center positions (P0, Q0) of the two substantially arc-shaped portions are set.
In the present embodiment, the target reference positions (P0, Q0) are set so as to coincide with the origin of the processing coordinate system and the origin of the camera coordinate system.

(2) Laser head 20
The laser head 20 is a laser processing device that irradiates the processed surface 50c of the work 50 with laser light to perform various processing, and includes a laser light emitting unit (exhausting unit) 21, a guide light irradiation unit 22, and a dichroic filter. It has a mirror 23 and a galvano scanner (scanning means) 24.

The laser light emitting unit (exhausting unit) 21 has a laser light source, a lens, and the like, and irradiates the laser light so that the processed surface 50c of the work 50 is in focus.
The guide light irradiation unit 22 indicates and adjusts the irradiation position of the laser light on the processing surface 50c in order to assist the processing by the laser light emitted from the laser light emission unit 21 (auxiliary light). Irradiate.

As the guide light emitted from the guide light irradiation unit 22, for example, visible visible light (infrared rays or the like) is used.
Further, in the present embodiment, the guide light emitted from the guide light irradiation unit 22 is configured so that the shape of the spot irradiated on the processed surface 50c of the work 50 is substantially circular.
The dichroic mirror 23 is an optical element that reflects light of a specific wavelength and transmits light of other wavelengths, and in the present embodiment, as shown in FIG. 1, a laser irradiated from a laser light emitting unit 21. While transmitting the light, the guide light emitted from the guide light irradiation unit 22 is reflected, and the laser light and the guide light are coaxially guided to the galvano scanner 24.

The galvano scanner (scanning means) 24 is a stepping motor having a reflection mirror and scanning the laser beam to a desired position, and processes the laser beam and the guide light by accurately controlling the rotation stop angle. Irradiate to a desired position on the surface 50c. Then, the galvano scanner 24 is controlled by the processing control unit 11 of the control device 10, and the laser light emitted from the laser light emitting unit 21 and the guide light emitted from the guide light irradiation unit 22 are coaxially transferred to the work 50. Scan on the machined surface 50c.

As a result, the laser head 20 performs printing processing of desired characters on the machined surface 50c of the work 50 by the laser light, and works the guide light coaxially with the laser light before the processing by the laser light. It is possible to irradiate 50 processed surfaces 50c.
Here, in the present embodiment, as shown in FIG. 1, the laser head 20 is arranged so as to irradiate the machined surface 50c of the work 50 with laser light and guide light from directly above.

That is, the optical axis op1 of the laser beam and the guide light emitted from the laser head 20 is arranged substantially perpendicular to the machined surface 50c of the work 50, and is scanned by the galvano scanner 24 to obtain the optical axis op1. Is laser-machined to a desired position on the machined surface 50c while tilting with respect to the machined surface 50c.
The optical axis op1 of the laser light and the guide light is set so as to face the origin of the processing coordinate system in the unprocessed state.

(3) Observation optical system 30
The observation optical system 30 includes a camera 31 that acquires an observation image including a machined surface 50c of the work 50 that is irradiated with laser light by the laser head 20, and a mirror 32.
As shown in FIG. 1, the camera 31 is attached to the lower surface of the laser head 20, acquires an observation image including the machined surface 50c of the work 50 via the mirror 32, and transmits the observation image to the control device 10. ..

Further, in the present embodiment, as shown in FIG. 1, the camera 31 acquires an observation image taken from an oblique direction with respect to the machined surface 50c via the mirror 32. That is, the camera optical axis op2 (the optical axis of the lens included in the camera 31) is diagonally arranged so as to intersect the optical axis op1 of the laser beam and the guide light at an angle φ.
The mirror 32 is arranged in the vicinity of the camera 31 attached to the lower surface of the laser head 20, and sets the camera optical axis op2 of the camera 31 at the reference height and the center position of the work 50 at the reference position.

In the laser processing system 1 of the present embodiment, as described above, the optical axis op1 of the laser light emitted from the laser head 20 and the camera optical axis op2 of the camera 31 of the observation optical system 30 are as shown in FIG. Is arranged so as to intersect each other on the machined surface 50c of the work 50.
Therefore, for example, as shown in FIG. 4C described later, when the work 50 is displaced in both the height direction and the plane direction along the camera optical axis op2, the camera 31 causes the work 50 to shift the position. On the acquired observation image, it seems that there is no misalignment.

In this state, when the laser head 20 irradiates the work 50 determined to have no misalignment with a laser, the plane position of the work 50 is actually misaligned to the left in FIG. 4C. Therefore, laser processing cannot be performed at a desired position.
Therefore, the laser machining system 1 of the present embodiment does not correspond only to the positional deviation in the plane direction shown in FIG. 4A and the positional deviation in the height direction shown in FIG. 4B, but also corresponds to FIG. 4C. ), The laser machining position is corrected in consideration of the positional deviation in both the height direction and the plane direction.

(4) Display device 40
The display device 40 displays set values and the like when performing various settings of the laser processing system 1, and also displays an observation image and the like including the processed surface 50c of the work 50 acquired by the camera 31 included in the observation optical system 30. indicate.

<Correction processing of machining position due to misalignment in height direction and plane direction>
In the laser processing system 1 of the present embodiment, based on the reference height shown in FIG. 1 and the state in which the work 50 is arranged at the reference position, for example, the work 50 conveyed to the laser processing system 1 is in the height direction. And / or detect the amount of misalignment when a misalignment occurs in the plane direction, and correct the machining position.
That is, the work 50 machined by the laser processing system 1 is as shown in FIGS. 4A to 4C with respect to the reference height shown in FIG. 1 and the position of the work 50 arranged at the reference position. In addition, the positional deviation in the plane direction substantially perpendicular to the laser irradiation direction (optical axis op1 direction) (see FIG. 4A) and the positional deviation in the height direction in the laser irradiation direction (optical axis op1 direction) (FIG. 4 (b)). ), Positional deviation in both directions (see FIG. 4C) may occur.

For example, when the work 50 is arranged at the reference height and the reference position, the observation image shows the origin of the processing coordinate system at the center position of the work 50 having a substantially annular shape, as shown in FIG. 5A. In the combined state, character information such as "ABCDE" is printed on the machined surface 50c of the work 50 at a height h1 from the origin of the machined coordinate system.
On the other hand, with respect to the work 50 having a positional deviation from the reference height (positional deviation in the height direction) and a positional deviation from the reference position (positional deviation in the plane direction) shown in FIG. 4C, the laser head 20 is used as it is. When the character information is printed by irradiating the laser beam, as shown in FIG. 5B, the origin of the processing coordinate system shifts upward from the center coordinates of the camera 31, so the printing is performed at a position at a height h1 from the origin. When processed, the letters "ABCDE" will protrude upward.

Therefore, when laser machining is performed on the work 50 having a positional deviation in the planar direction and the planar direction, it is necessary to detect the positional deviation in the height direction and the planar direction and correct the laser machining position.
In the laser machining system 1 of the present embodiment, the work 50 is at the reference height and the reference position in order to appropriately correct the laser machining position even when the work 50 is displaced in the height direction and the plane direction. In this state, as shown in FIG. 6, the image processing unit 12 aligns the origin of the camera coordinate system with the origin of the processed coordinate system, and sets the registration pattern RP and the target reference position (P0, Q0) corresponding to the registration pattern RP. ) And set.

Here, as the registration pattern RP in the present embodiment, as shown in FIG. 6, the arcuate contour on the inner diameter side and the circle on the outer diameter side are characteristic parts in the top view of the substantially annular work 50. An arcuate contour is set.
Then, as the target reference positions (P0, Q0) corresponding to the registration pattern RPs set in the two arc-shaped portions, the center positions of the two arc-shaped registration pattern RPs are set as shown in FIG. .. In the present embodiment, the target reference positions (P0, Q0) are the origins of the camera coordinates of the camera 31, and are the origins of the laser processing processing coordinate system.

Further, in the laser machining system 1 of the present embodiment, the work 50 is in the reference height and the reference position in order to correct the laser machining position when the work 50 has a positional deviation in the height direction and the plane direction. Then, the guide light emitted from the guide light irradiation unit 22 is scanned, and the reference coordinates (X0, Y0) are set at arbitrary positions on the machined surface 50c of the work 50.

The reference coordinates (X0, Y0) are set on the machined surface 50c of the work 50 irradiated with the guide light by controlling the galvano scanner 24. That is, the reference coordinates (X0, Y0) are set at positions on the machining surface 50c away from the origin of the machining coordinate system. Therefore, the guide light irradiated at the reference coordinates (X0, Y0) is irradiated obliquely onto the machined surface 50c from the emitting portion of the laser head 20.

Then, the registration pattern RP set in FIG. 6, the target reference position (P0, Q0), and the reference coordinates (X0, Y0) are stored in the storage unit 13.
In the laser machining system 1 of the present embodiment, the laser machining position is corrected by using the registration pattern RP and the target reference positions (P0, Q0) stored in the storage unit 13 and the reference coordinates (X0, Y0). ..

That is, for example, when the work 50 set directly under the laser head 20 has misalignment in the height direction and the plane direction, the machining control unit 11 calculates the amount of misalignment in the height direction of the work 50. Therefore, the deviation amount of the processed coordinate system is calculated in the camera coordinate system. After that, pattern matching is performed, the position of the target reference position is obtained from the position of the registered pattern of the work 50, and the deviation of the target reference position is added to the print position information to perform position correction.

More specifically, first, in the image processing unit 12, the origin of the processed coordinate system (including the XY direction) and the reference point of the camera coordinate system (including the XY direction) are aligned. At this time, the user confirms that the target print image displayed by the guide light can be printed without any deviation while looking at the display screen of the display device 40.
Next, with the work 50 at the reference height and the reference position, the image processing unit 12 performs the registration pattern RP (two arc-shaped portions in the broken line) shown in FIG. 6 and the target reference position of the registration pattern. (P0, Q0) is set and stored in the storage unit 13.

In the present embodiment, as described above, the target reference position (P0, Q0) is the position of the center of the two arcuate portions, is also the origin of the camera coordinates, and is also the origin of the processed coordinate system. is there.
Next, with the work 50 at the reference height and the reference position, the machining control unit 11 controls the guide light irradiation unit 22 and the galvano scanner 24 to provide guide light to a portion of the work 50 (machined surface 50c). The coordinates (X0, Y0) on the machined surface 50c irradiated with the guide light shown in FIG. 6 are stored in the storage unit 13.

By the above processing, the storage unit 13 has the registration pattern RP used for correction according to the positional deviation in the height direction and the plane direction of the work 50, the target reference position (P0, Q0), and the reference coordinates (X0, Y0). Is saved.
Next, when the work 50 to be actually processed is set at a predetermined processing position, the image processing unit 12 performs image processing on the observation image acquired by the camera 31 to position the work 50 in the height direction and the plane direction. Check if there is any deviation.

Here, for example, assuming that the work 50 set at the machining position has a positional deviation in the height direction shown in FIG. 4B, the machining control unit 11 has the observation image shown in FIG. Using the solid line in FIG. 7), the position (X1, Y1) of the guide light moved from the reference coordinates (X0, Y0) due to the change in the height position of the work 50, and the amount of change dX, dY. Is defined as follows.

dX = X1-X0
dY = Y1-Y0
Here, the misalignment amount Z in the height direction is calculated from X0 and X1.
That is, the reference coordinates (X0, Y0) on the machined surface 50c of the work 50 irradiated with the guide light are obliquely irradiated with the guide light at a predetermined angle with respect to the machined surface 50c by the scanning means (galvano scanner 24). Assuming that, as shown in FIG. 8, the coordinates in the X direction move from X0 to X1 by lowering the height position of the machined surface 50c of the work 50.

Therefore, the displacement amount Z in the height direction is X0 and X1 by using the similarity relationship between the right triangle of height Z0 and base X0 shown in FIG. 8 and the right triangle of height (Z0 + Z) and base X1. Calculated from.
Specifically, from the similarity relationship between the right triangle with height Z0 and base X0 shown in FIG. 8 and the right triangle with height (Z0 + Z) and base X1, the work 50 is in the reference height and reference position. , X0, X1 of the coordinates (X0, Y0) irradiated with the guide light, and the coordinates (X1, Y1) irradiated with the guide light in the state where there is a position shift (moving downward) in the height direction, are used for height. The misalignment amount Z in the vertical direction is calculated by the following formula (1).

Z = {(X1-X0) / X0)} ・ Z0 ・ ・ ・ ・ ・ (1)
Next, the machining control unit 11 determines the angle φ formed by the camera optical axis op2 and the laser beam optical axis op1 with respect to the work 50 at a position where the height position is displaced by the amount of displacement Z in the height direction. , The origin (Pa, Qa) of the machining coordinate system on the machining surface 50c displaced in the height direction shown in FIG. 7 by the following relational expressions (2) and (3) using the displacement amount Z in the height direction. ) Is calculated as a misalignment reference point in the height direction.

Pa = P0 ・ ・ ・ (2)
Qa = Q0 + Z ・ tanφ ・ ・ ・ (3)
Next, the image processing unit 12 performs pattern matching on the observed image of the work 50 whose position is displaced in the height direction, and the target reference positions (P1, Q1) corresponding to the two arc-shaped registration pattern RPs shown in FIG. Ask for.

As a result, the machining control unit 11 adds the difference between the coordinates (Pa, Qa) of the origin of the machining coordinate system and the target reference position (P1, Q1) to the reference height and the print coordinates for the work 50 at the reference position. By doing so, it is possible to correct the laser machining position in consideration of the amount of misalignment Z in the height direction.
That is, in the laser machining system 1 of the present embodiment, the reference coordinates of the guide light set on the machining surface 50c of the work 50 at the reference height / reference position using the observation image having the two-dimensional information in the XY direction ( With reference to X0, Y0), the amount of misalignment Z in the height direction can be calculated using the coordinates (X1, Y1) of the guide light radiated in the same direction to the work 50 to be machined. it can.

Then, the position shift reference point (Pa, Qa) in the height direction is calculated using the calculated position shift amount Z in the height direction and the target reference position (P0, Q0) in the plane direction, and this height is calculated. Positional deviation of the work 50 in the three-dimensional direction by calculating the difference between the target reference positions (P1, Q1) obtained from the registration pattern RP of the displaced work 50 from the positional deviation reference points (Pa, Qa) in the direction. It is possible to correct the laser processing position in consideration of the amount.

Here, the guide light that irradiates the machined surface 50c of the work 50 to detect the positional deviation in the height direction is not at the center position of the outer shape of the work 50, but at the position where the machined surface 50c of the work 50 exists. Be irradiated.
As a result, regardless of the shape of the work 50, the laser machining position can be appropriately corrected when the position shift occurs in the height direction and the plane direction regardless of the shape.

Further, in the configuration of the laser processing system 1 of the present embodiment, as shown in FIG. 9, the guide light emitted from the guide light irradiation unit 22 is focused on the processed surface 50c of the work 50 by the galvano scanner 24. ..
Therefore, the beam diameter r1 of the guide light emitted from the lower surface of the housing of the laser head 20 is, for example, about 7 to 8 mm.

On the other hand, for example, in the conventional configuration in which the displacement sensor for detecting the displacement of the work is provided, the displacement sensor emits light having a beam diameter of about 1 mm, so that the surface of the displacement sensor is exposed to light. When dust such as dust generated by laser processing adheres, it is difficult to accurately detect the displacement of the work.
In the present embodiment, as described above, the guide light emitted from the lower surface of the housing of the laser head 20 has a laser diameter of about 7 to 8 mm on the surface of the housing, so that dust or the like is collected on the lower surface of the laser head 20. Even if it adheres, it does not significantly affect the detection of the positional deviation in the height direction and the plane direction of the work 50 using the guide light.
As a result, it is possible to provide the laser processing system 1 that is resistant to dirt.

<Laser processing method by laser processing system 1>
The laser machining method of the present embodiment is carried out by the laser machining system 1 described above according to the flowchart shown in FIG.
That is, in step S11, with respect to the work 50 set at the reference height / reference position, the image processing unit 12 of the control device 10 aligns the origin of the processing coordinate system with the origin of the camera coordinate system. , The registration pattern RP shown in FIG. 6 and the target reference positions (P0, Q0) are set and stored in the storage unit 13.

Next, in step S12, the work 50 set at the reference height / reference position in the same state where the image processing unit 12 of the control device 10 aligns the origin of the processing coordinate system with the origin of the camera coordinate system. On the other hand, the reference coordinates (X0, Y0) of the guide light shown in FIG. 6 are set and stored in the storage unit 13.
Next, in step S13, the machining control unit 11 of the control device 10 irradiates the work 50 actually set in the laser machining system 1 in the same direction as the guide light (X1, Y1). ) And the reference coordinates (X0, Y0) stored in the storage unit 13 in step S12, and the amount of misalignment due to the change in the height position of the work 50 is calculated.

Next, in step S14, the machining control unit 11 of the control device 10 determines whether or not the work 50 is displaced based on the calculation result in step S13. Here, if it is determined that there is a misalignment, the process proceeds to step S15. On the other hand, if it is determined that there is no misalignment, the process proceeds to step S17, and only the correction of the machining position in the plane direction is performed.
Next, in step S15, when it is determined in step S14 that there is a misalignment, the machining control unit 11 of the control device 10 has a misalignment in the height direction of the work 50 (position misalignment amount Z in the height direction). (Pa, Qa) is calculated as the origin (reference point) of the processing coordinate system at the deviated height position.

Next, in step S16, the image processing unit 12 of the control device 10 matches the position of the registration pattern RP stored in the storage unit 13 with the position of the registration pattern RP of the actual work 50, and performs a target reference position. (P1, Q1) is derived.
Next, in step S17, the machining control unit 11 of the control device 10 determines the amount of deviation between the target reference position (P1, Q1) of the registration pattern RP of the actual work 50 and the origin (Pa, Qa) of the machining coordinate system. The misalignment amount Z in the height direction is transmitted to the laser head 20.
Next, in step S18, the machining control unit 11 of the control device 10 corrects the machining position in consideration of the positional deviation in the height direction and / or the plane direction.

[Other Embodiments]
Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention.

(A)
In the above embodiment, the position of one point of the guide light emitted from the guide light irradiation unit 22 is used as the reference coordinates to detect the displacement of the work 50 and correct the processing position. However, the present invention is not limited to this.
For example, as shown in FIG. 11A, the positions of a plurality of guide lights irradiated from the guide light irradiation unit 22 at regular intervals (multi-point irradiation) are used in the height direction and the plane direction of the work. The misalignment may be detected and the machining position may be corrected.

Specifically, first, as shown in FIG. 11A, the guide light irradiating unit 22 sequentially transmits the guide light to the work at the reference height and the reference position in two dimensions in the XY directions at multiple points. Only the spot position of the guide light that is irradiated and reflected on the processed surface is stored as an effective point (see the filled circle in FIG. 11A) in the storage unit.
Then, when the work as the laser processing target is set, only the guide light corresponding to the spot position of the guide light stored in the storage unit is irradiated at a single point or multiple points, and the reflected light is detected (FIG. 11). (Refer to the filled circle in (b)) and a point where the reflected light is not detected due to the misalignment (see the broken line circle in FIG. 11 (b)).

Thereby, the position deviation amount Z in the height direction can be calculated by using the positions of the points where the reflected light is detected and the points where the reflected light is not detected, as in the method using the reference coordinates of the guide light described above. ..
Further, in the control device of the present invention, when not only the positional deviation in the height direction and the plane direction but also the inclination of the work surface is assumed, the multi-point irradiation of the guide light shown in FIG. 11A is used. The inclination of the work may be detected, the inclination information may be input to the laser head, and the laser machining position may be corrected in consideration of the inclination.
That is, when the work to be machined is set at an angle, it is detected that the reflection position of the multi-point irradiation of the guide light shown in FIG. 11 has changed from the reflection position stored in the storage unit in advance. As a result, it is possible to correct the laser machining position including the inclination of the work.

(B)
In the above embodiment, an example of correcting the machining position in the plane (XY) direction and the height (Z) direction has been described. However, the present invention is not limited to this.

For example, the configuration may be such that the positional deviation in the rotation (θ) direction of the work is detected and the machining position is corrected.
In this case, the registration pattern having the characteristic information of the work is corrected according to the amount of the positional deviation in the height direction. Alternatively, the registration patterns according to the height position in the Z direction are stored in the storage unit as a plurality of data in advance, and the registration patterns are selectively switched according to the detected position shift amount in the height direction to XYθ. The correction may be performed.

(C)
In the above embodiment, an example in which a portion of the work 50 having a characteristic shape is stored in the storage unit 13 as a registration pattern RP has been described. However, the present invention is not limited to this.
For example, a plurality of registration patterns set according to a change in the height position of the work may be stored in the storage unit.
As a result, when the amount of misalignment in the height direction changes depending on the shape of the work, it is possible to cope with the case where the appearance of the registered pattern portion seen from the camera installed diagonally upward also changes.

(D)
In the above embodiment, an example has been described in which the guide light emitted from the guide light irradiation unit 22 is configured to form a substantially circular spot on the machined surface 50c of the work 50. However, the present invention is not limited to this.

For example, the guide light may be irradiated so as to form a spot having another characteristic shape such as a polygon such as a quadrangle or an ellipse, or it may be a point.
However, when the guide light is irradiated so as to form a spot having a characteristic shape as in the above embodiment, the control device searches for the spot of the guide light having a characteristic shape. The effect is that the coordinates to be compared with the above-mentioned reference coordinates can be easily found by using the observation image. Therefore, it is more desirable that the spot shape of the guide light emitted from the guide light irradiation unit is not a mere point but a spot having a characteristic shape such as a circle.

(E)
In the above embodiment, an example in which the arcuate contour portion of the annular work 50 is used as the registration pattern RP indicating the characteristic portion of the work 50 has been described. However, the present invention is not limited to this.
For example, depending on the shape of the work, a portion characteristic of each shape may be used as a registration pattern.

(F)
In the above embodiment, an example in which the origin of the camera coordinates of the camera and the origin of the processed coordinate system by the laser beam is used as the target reference position corresponding to the registration pattern has been described. However, the present invention is not limited to this.
For example, a position different from the camera coordinates and the origin of the processed coordinate system may be set as the target reference position corresponding to the registration pattern.
That is, the target reference position may be an arbitrary position in which a characteristic portion of the shape of the work is set as a registration pattern and is set with reference to this registration pattern.

(G)
In the above embodiment, an example in which the camera 31 and the mirror 32 are used as the observation optical system 30 for acquiring the observation image has been described. However, the present invention is not limited to this.

For example, the observation optical system may have a configuration in which an observation image including a work is directly acquired by a single camera without having a mirror.
(H)
In the above embodiment, an example of printing the character information "ABCDE" on the machined surface 50c of the work 50 by using the laser beam emitted from the laser head 20 has been described. However, the present invention is not limited to this.
For example, the processing using the laser beam is not limited to printing characters, and may be other processing such as symbols, figures, and pictures.

(I)
In the above embodiment, the laser machining system 1 that performs laser machining on the substantially annular workpiece 50 has been described as an example. However, the present invention is not limited to this.
For example, the shape of the work is not limited to a substantially annular shape, and may be any other shape.

(J)
In the above embodiment, the laser processing system 1 in which the control device 10, the laser head 20, and the observation optical system 30 (camera 31, mirror 32) are separately provided has been described as an example. However, the present invention is not limited to this.
For example, the present invention may be realized as a laser processing device in which the above-mentioned control device, laser head, and observation optical system are integrated.

(K)
In the above embodiment, the present invention has been described with reference to an example in which the present invention is specified as a control device 10, a laser processing system 1 provided with the control device 10, and a laser processing method. However, the present invention is not limited to this.

For example, the present invention may be realized as a laser machining program for causing a computer to execute a laser machining method carried out according to the flowchart shown in FIG.
This laser machining program is stored in the storage unit, and the CPU reads the program stored in the storage unit to cause the hardware to execute each step shown in FIG.
Alternatively, the present invention may be realized as a recording medium in which this laser processing program is stored.

Since the control device of the present invention has an effect that the laser machining position can be appropriately corrected when the positional deviation occurs in the height direction and the plane direction regardless of the shape of the work, the laser machining can be performed. It can be widely applied as a control device mounted on a device to perform.

1 Laser processing system 10 Control device 11 Processing control unit 12 Image processing unit 13 Storage unit 20 Laser head 21 Laser light emitting unit (exhausting unit)
22 Guide light irradiation unit 23 Dichroic mirror 24 Galvano scanner (scanning means)
30 Observation optical system 31 Camera 32 Mirror 40 Display device 50 Work 50a Main body 50b Opening 50c Machined surface h1 Height op1 Laser light optical axis op2 Camera optical axis r1 Beam diameter RP Registration pattern Z0 Height Z Position in the height direction Amount of deviation

Claims (13)

Acquires a laser head including an exit portion that irradiates a laser beam for processing a work to be processed, a scanning means for scanning the laser light on the processed surface of the work, and an observation image including the work. The observation optical system is arranged so that the optical axes of the camera intersect with the irradiation direction of the laser beam, and the processed surface of the work is irradiated coaxially with the laser beam. A control device that controls a laser processing device equipped with a guide light irradiation unit that irradiates a guide light.
Using the observation image acquired by the camera, a processing control unit that controls processing of the work by the laser head, and a processing control unit.
A registration pattern including a part of the shape of the work, a target reference position corresponding to the registration pattern, and a guide light irradiation unit set the work in a state where the work is at a reference position and a reference height. A storage unit that stores the reference coordinates of the position on the XY plane where the irradiated work exists, and
With
The processing control unit irradiates the guide in the same direction as the reference coordinates on the work included in the observation image acquired by the camera from the reference coordinates on the XY plane stored in the storage unit. The amount of misalignment in the height direction of the work is calculated based on the amount of change to the coordinates on the XY plane indicating the position of light, and the misalignment reference point and the registration pattern due to the misalignment in the height direction. Based on the difference from the target reference position corresponding to, the machining position is corrected in consideration of the amount of misalignment in the three-dimensional direction on the machining surface of the work by the laser beam .
Control device. The processing control unit receives the laser beam based on the target reference position corresponding to the registration pattern stored in the storage unit and the position of the work included in the observation image acquired by the camera. Detects misalignment in the plane direction approximately perpendicular to the irradiation direction,
The control device according to claim 1 . The processing control unit is based on the target reference position corresponding to the registration pattern stored in the storage unit and the position of the work included in the observation image acquired by the camera. Detects misalignment in the direction of rotation around the optical axis of the laser beam,
The control device according to claim 1 or 2 . A plurality of registration patterns set according to changes in the height position of the work are stored in the storage unit.
The control device according to any one of claims 1 to 3 . The processing control unit detects the position of the guide light forming a characteristic spot light including any one of a circle, an ellipse, and a polygon irradiated from the guide light irradiation unit, and determines the position of the guide light with respect to the reference coordinates. Make a comparison,
The control device according to any one of claims 1 to 4 . The target reference position is the origin of the camera coordinates of the camera, and is the origin of the processed coordinate system by the laser beam.
The control device according to any one of claims 1 to 5 . The guide light irradiating unit irradiates a range including the work toward a processing surface of the work at multiple points.
The control device according to any one of claims 1 to 6 . The storage unit is the position of the guide light irradiated on the work in a state where the work is at the reference position and the reference height among the guide lights irradiated at multiple points by the guide light irradiation unit. Save,
The control device according to claim 7 . The processing control unit compares the position of the guide light stored in the storage unit with the position of the guide light irradiated on the work included in the observation image acquired by the camera. Correcting the processing position of the work on the processing surface by the laser beam.
The control device according to claim 8 . The processing control unit is detected by comparing the position of the guide light stored in the storage unit with the position of the guide light on the work included in the observation image acquired by the camera. The machining position of the work on the machined surface is corrected based on the inclination of the work.
The control device according to any one of claims 7 to 9 . The work has an annular shape.
Control device according to any one of claims 1 1 0. The control device according to any one of claims 1 to 11.
With the laser head
With the observation optical system
With the guide light irradiation unit
Laser processing system equipped with. A laser head including an emitting portion that irradiates a laser beam for processing a workpiece to be processed, and a scanning means for scanning the laser beam on the processed surface of the workpiece.
An observation optical system including a camera that acquires an observation image including the work, and arranged so that the optical axes of the camera intersect with the irradiation direction of the laser beam.
A guide light irradiation unit that irradiates a guide light that is scanned coaxially with the laser light and irradiates the machined surface of the work.
Using the observation image acquired by the camera, a processing control unit that controls processing of the work by the laser head, and a processing control unit.
It is a laser processing method using a laser processing device equipped with
A registration pattern including a part of the shape of the work, a target reference position corresponding to the registration pattern, and a guide light irradiation unit set the work in a state where the work is at a reference position and a reference height. A saving step of saving the reference coordinates of the position where the irradiated work exists in the storage unit, and
XY indicating the position of the guide light irradiated in the same direction as the reference coordinates on the work included in the observation image acquired by the camera from the reference coordinates on the XY plane stored in the storage unit. The amount of misalignment in the height direction of the work is calculated based on the amount of change to the coordinates on the plane, and the misalignment reference point due to the misalignment in the height direction and the target reference corresponding to the registration pattern. A correction step of correcting the machining position based on the difference from the position in consideration of the amount of misalignment in the three-dimensional direction on the machining surface of the workpiece by the laser beam .
Laser processing method equipped with.

Images