KR101634673B1 - Manufacturing Apparatus For Bulk Single Crystal of Compound Semiconductor - Google Patents
Manufacturing Apparatus For Bulk Single Crystal of Compound Semiconductor Download PDFInfo
- Publication number
- KR101634673B1 KR101634673B1 KR1020150063634A KR20150063634A KR101634673B1 KR 101634673 B1 KR101634673 B1 KR 101634673B1 KR 1020150063634 A KR1020150063634 A KR 1020150063634A KR 20150063634 A KR20150063634 A KR 20150063634A KR 101634673 B1 KR101634673 B1 KR 101634673B1
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- Prior art keywords
- container
- wall
- temperature
- raw material
- heater
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
An apparatus for producing a bulk single crystal of a compound semiconductor according to the present invention comprises a container outer wall having a cylindrical shape, a container bottom surface having a first through hole at a central portion thereof, and a container inner wall extending upward from the first through- And a container cover for sealing an upper end of the raw material container; A disk-shaped longitudinal substrate; An elevating mechanism for vertically moving the sown substrate upward and downward; A cylindrical base plate guiding unit for guiding the vertical movement of the longitudinal base plate; a frame outer wall formed to include the container base and the longitudinal base plate guiding unit therein; A guide frame made of a heat insulating material including a ceiling portion; An upper heater and a lower heater installed between the heat blocking wall of the heating furnace and the guide frame; An upper and lower separation wall installed across the side wall of the heating furnace and the guide frame; A first temperature sensor for measuring the temperature of the inner upper center of the raw material container; A second temperature sensor for measuring the temperature of the upper heater; A third temperature sensor for measuring the temperature of the lower heater; And the like.
Description
The present invention relates to a manufacturing apparatus for manufacturing a bulk single crystal of a compound semiconductor such as silicon carbide or aluminum nitride.
In order to produce a bulk single crystal of a compound semiconductor such as silicon carbide or aluminum nitride, a sublimation method is mainly used.
The sublimation method is a method of sublimating a solid raw material (for example, silicon carbide or aluminum nitride) at a high temperature of about 2000 ° C or higher in a growth vessel to grow crystals of a raw material on a seed substrate (seed substrate).
A conventional silicon carbide bulk single crystal manufacturing apparatus will now be described in more detail with reference to FIG.
The
Such a
However, in the above conventional technology, it is difficult to control the temperature distribution inside the growth chamber because the growth chamber, which requires a lower temperature than the sublimation chamber, is located above the sublimation chamber, and thus polycrystals are generated, And there is a problem that it is lowered.
In addition, since the single crystal grows from the seed substrate toward the bottom, there arises a problem that the single crystal grows larger and becomes separated from the seed substrate. Further, there is a problem that mass production of the bulk single crystal is difficult due to the limited size of the growth chamber and the sublimation chamber.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a method of manufacturing a bulk single crystal by appropriately controlling sublimation and single crystal growth temperature, do.
According to an aspect of the present invention, there is provided an apparatus for producing a bulk single crystal of a compound semiconductor,
A container inner wall extending upward from the first through hole of the bottom surface of the container at a lower height than the outer wall of the container; A raw material container in the form of a cylinder including a container cover for sealing an upper end of the raw material container;
A disc-shaped seed substrate having a diameter larger than that of the first through-hole on the bottom surface of the container;
An elevating mechanism installed at a lower portion of the longitudinal substrate for moving the longitudinal substrate up and down;
A cylindrical base plate guide unit extending from a lower end of the base plate and guiding up and down movement of the base plate; A guide frame made of a heat insulating material including a frame outer wall and a frame ceiling portion formed to be included in the frame;
An upper heater and a lower heater installed between the heat blocking wall of the heating furnace and the guide frame;
An upper and lower separation wall installed across the guide frame and the heat end wall of the heating furnace so that the upper heater can heat each of the raw material containers and the lower heater respectively;
A first temperature sensor for measuring the temperature of the inner upper center of the raw material container;
A second temperature sensor for measuring the temperature of the upper heater;
A third temperature sensor for measuring the temperature of the lower heater; And the like.
The elevating mechanism may further include a cooling unit for cooling the seed substrate.
It is preferable that a load cell for measuring the amount of the single crystal formed on the seed substrate is attached to the elevating mechanism.
Since the sublimation and monocrystal growth temperature can be appropriately controlled, the present invention is not only capable of obtaining a bulk monocrystal of high quality, but also capable of mass production.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conventional apparatus for producing a silicon carbide bulk single crystal. FIG.
Fig. 2 is an embodiment of a bulk single crystal manufacturing apparatus according to the present invention. Fig.
Hereinafter, the present invention will be described in more detail with reference to the drawings in accordance with embodiments thereof. In this embodiment, an apparatus for obtaining a silicon carbide (SiC) bulk single crystal will be described.
2 (a), 2 (b), 2 (c) and 2 (d) show the entire structure of the apparatus for manufacturing a bulk single crystal of the present embodiment, Fig.
The
The
The
The
The heater is divided into an upper heater (600) and a lower heater (700). The
Such individual heating is enabled by the upper and
In order to control the temperature, a
Hereinafter, the operation of the bulk single crystal manufacturing apparatus of the present invention will be described.
First, raw material powder (1) is filled into raw material container (100). In this embodiment, since silicon carbide is adopted as a compound semiconductor, silicon carbide powder is introduced. If aluminum nitride is selected as the compound semiconductor, aluminum nitride powder and, if selenium zinc is selected, selenium zinc powder is supplied.
The inside of the heating furnace is repeatedly injected with vacuum and inert gas to finally form a reduced pressure or atmospheric pressure atmosphere while operating the
The
The
According to this embodiment as described above, the sublimation and the growth temperature of the single crystal can be controlled appropriately, so that a high-quality bulk single crystal can be obtained and mass production can be performed.
In the above embodiment, the driving relationship of the elevating mechanism, the circulation relation of the cooling means, the constitution related to the supply of the vacuum and the inert gas, and the measurement and control of the temperature are not described in detail. However, There will be no difficulty in understanding and implementing the invention.
1: raw material powder 2: single crystal 10: growth vessel 12: sublimation chamber
14:
100: raw material container 110: container outer wall 120: container bottom surface 125: first through hole
130: container inner wall 140: container lid 300: elevating mechanism 400: guide frame
410: container holder 415: second through hole 420: longitudinal substrate guide portion
430: frame outer wall 440: frame ceiling part 500: heat blocking wall
550: upper and lower separation wall 600: upper heater 700: lower heater
810,820,830: First, second and third temperature sensors
Claims (3)
A disc-shaped seed substrate having a diameter larger than that of the first through-hole on the bottom surface of the container;
An elevating mechanism installed at a lower portion of the longitudinal substrate for moving the longitudinal substrate up and down;
A cylindrical base plate guide unit extending from a lower end of the base plate and guiding up and down movement of the base plate; A guide frame made of a heat insulating material including a frame outer wall and a frame ceiling portion formed to be included in the frame;
An upper heater and a lower heater installed between the heat blocking wall of the heating furnace and the guide frame;
An upper and lower separation wall installed across the guide frame and the heat end wall of the heating furnace so that the upper heater can heat each of the raw material containers and the lower heater respectively;
A first temperature sensor for measuring the temperature of the inner upper center of the raw material container;
A second temperature sensor for measuring the temperature of the upper heater;
A third temperature sensor for measuring the temperature of the lower heater; Wherein the compound semiconductor is a compound semiconductor.
Wherein the elevating mechanism further comprises a cooling means for cooling the seed substrate.
Wherein the elevating mechanism is equipped with a load cell for measuring the amount of the single crystal formed on the seed substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150063634A KR101634673B1 (en) | 2015-05-07 | 2015-05-07 | Manufacturing Apparatus For Bulk Single Crystal of Compound Semiconductor |
Applications Claiming Priority (1)
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KR1020150063634A KR101634673B1 (en) | 2015-05-07 | 2015-05-07 | Manufacturing Apparatus For Bulk Single Crystal of Compound Semiconductor |
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KR101634673B1 true KR101634673B1 (en) | 2016-06-29 |
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KR1020150063634A KR101634673B1 (en) | 2015-05-07 | 2015-05-07 | Manufacturing Apparatus For Bulk Single Crystal of Compound Semiconductor |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005263553A (en) * | 2004-03-18 | 2005-09-29 | Sumitomo Electric Ind Ltd | Method and apparatus for producing compound semiconductor single crystal |
JP2009209015A (en) * | 2008-03-05 | 2009-09-17 | Denso Corp | Apparatus for producing silicon carbide single crystal |
JP2012206875A (en) | 2011-03-29 | 2012-10-25 | Shin Etsu Handotai Co Ltd | APPARATUS FOR GROWING SiC |
KR101333668B1 (en) * | 2013-06-26 | 2013-11-27 | 주식회사 에이에스이 | Auto seeding system of single crystal growth furnace |
-
2015
- 2015-05-07 KR KR1020150063634A patent/KR101634673B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005263553A (en) * | 2004-03-18 | 2005-09-29 | Sumitomo Electric Ind Ltd | Method and apparatus for producing compound semiconductor single crystal |
JP2009209015A (en) * | 2008-03-05 | 2009-09-17 | Denso Corp | Apparatus for producing silicon carbide single crystal |
JP2012206875A (en) | 2011-03-29 | 2012-10-25 | Shin Etsu Handotai Co Ltd | APPARATUS FOR GROWING SiC |
KR101333668B1 (en) * | 2013-06-26 | 2013-11-27 | 주식회사 에이에스이 | Auto seeding system of single crystal growth furnace |
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