KR101612122B1 - Mold for manufacturing shadow mask and method of manufacturing shadow mask using the same - Google Patents

Abstract

The shadow mask manufacturing frame includes a base layer, a warping frame, and an insulating pattern. The base layer includes a conductive material and has a flat plate shape. The inclined frame includes an inclined surface having an inclination of 50 degrees or less and a process margin projecting from a top of the inclined surface in a direction perpendicular to an upper surface of the base layer and disposed on the base layer. The insulating pattern includes an inorganic insulating material and is disposed on the inclined frame and exposes an upper surface of the base layer. Therefore, the shadow mask can be easily manufactured.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mold for manufacturing a shadow mask, and a method of manufacturing the shadow mask using the shadow mask.

The present invention relates to a mold for manufacturing a shadow mask and a method of manufacturing a shadow mask using the mold. More particularly, the present invention relates to a mold for manufacturing a shadow mask, and a method of manufacturing a shadow mask using the mold.

A process of transferring a pattern to form a semiconductor device on a substrate is required. Various methods such as a photolithography process and a photoresist process are used for transferring the pattern onto the substrate.

However, the photolithography process and the photoresist process require high-priced equipment such as an exposure apparatus, and a consumable photomask is continuously consumed. Further, when a thick pattern such as an organic pattern is formed, defects tend to occur during the development process or the etching process.

In order to solve the above-mentioned problems, a shadow mask for passing the deposited material has been developed. When the side surface of the shadow mask is vertical, the deposited material interferes with the side surface of the shadow mask, making it difficult to form a precise pattern. Therefore, the side surface of the shadow mask must be inclined so that accurate pattern formation is possible.

However, the oblique pattern of the shadow mask is technically difficult to implement. In the prior art, a method of repeating exposure operations several times while tilting the exposure apparatus is used to form an inclined pattern in the shadow mask.

However, if an alignment error occurs during repeated exposure, defects may occur in the completed shadow mask. Also, even if the above method is used, there is a problem that a shadow mask having an inclined plane angle of 50 degrees or less can not be manufactured. Furthermore, since the design margin is very small during the manufacturing process of the shadow mask itself, the defect rate sharply increases even if the precision is slightly lowered.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a mold for manufacturing a shadow mask which forms an inclined pattern.

Another object of the present invention is to provide a method of manufacturing a shadow mask using the frame.

According to an embodiment of the present invention, a shadow mask manufacturing frame includes a base layer, a warping frame, and an insulating pattern. The base layer includes a conductive material and has a flat plate shape. The inclined frame includes an inclined surface having an inclination of 50 degrees or less and a process margin projecting from a top of the inclined surface in a direction perpendicular to an upper surface of the base layer and disposed on the base layer. The insulating pattern includes an inorganic insulating material and is disposed on the inclined frame and exposes an upper surface of the base layer.

In one embodiment, the base layer and the tilt frame comprise the same material and may be integrally formed.

According to an embodiment of the present invention, a shadow mask manufacturing frame includes a base layer and a warping frame. The base layer includes a conductive material and has a flat plate shape. The inclined frame includes a slope having a slope of 50 degrees or less and a process margin projecting from a top of the slope in a direction perpendicular to the top surface of the base layer, and disposed on the base layer and electrically insulated. The base layer and the inclined frame are detachable from each other.

In the method of manufacturing a shadow mask according to an embodiment of the present invention for realizing the object of the present invention, first, a metal plate is processed to form a base layer having a flat plate shape, a slope having a slope of 50 degrees or less, And a process margin projecting in a direction perpendicular to the upper surface of the base layer from the base layer. Then, an inorganic insulating material is deposited on the inclined frame to form an insulating layer. Thereafter, the insulating layer is patterned to form an insulating pattern which is disposed on the inclined frame and exposes an upper surface of the base layer. Subsequently, a metal is plated on the upper surface of the base layer exposed by the insulation pattern using the base layer as an electrode, thereby creating a shadow mask between adjacent inclined plates. Then, the shadow mask is separated from the inclined frame.

In one embodiment, the step of forming the insulating pattern includes: forming a photoresist pattern covering the inclined frame on the insulating layer; Etching the exposed portion of the insulating layer using the photoresist pattern as an etch mask; And stripping the photoresist pattern.

In one embodiment, further comprising the step of forming a sacrificial pattern on the base layer by dripping a sacrificial material between the adjacent slopes before forming the insulating layer, Depositing the inorganic insulating material on the warping frame and the sacrificial pattern, and the step of forming the insulating pattern includes removing the sacrificial pattern and a part of the insulating layer disposed on the sacrificial pattern .

In one embodiment, the step of forming the insulating pattern may comprise physically shaving off a portion of the insulating layer disposed on the base layer.

In the method of manufacturing a shadow mask according to an embodiment of the present invention for realizing the object of the present invention, first, an inclined surface having an inclination of 50 degrees or less using an insulating material, and a process margin projected from the top of the inclined surface To form an inclined frame. Then, the inclined frame is placed on the base layer having a flat shape including the conductive material. Thereafter, metal is plated by using the base layer as an electrode to create a shadow mask between adjacent tilt frames. Subsequently, the shadow mask is separated from the inclined frame.

In one embodiment, separating the shadow mask from the tilt frame includes: first separating the shadow mask and the tilt frame from the base layer; And secondarily separating the shadow mask from the inclined frame.

According to the shadow mask manufacturing frame and the method for manufacturing a shadow mask using the frame, a shadow mask having a tilt of 50 degrees or less can be easily manufactured.

Furthermore, the base layer and the warp frame can be manufactured in a detachable form, simplifying the manufacturing process. In addition, the shadow mask manufactured using the separable inclined frame can be easily detached from the base layer. Furthermore, the shadow mask can be detached from the substrate for a display device by using the magnet, so that the manufacturing process becomes convenient.

In addition, the manufacturing cost can be reduced by easily forming the insulating pattern without using the photoresist process.

1 is a cross-sectional view illustrating a mold for manufacturing a shadow mask according to an embodiment of the present invention.
2 is an enlarged cross-sectional view of part A of Fig.
FIGS. 3 to 10 are cross-sectional views illustrating a mold for manufacturing a shadow mask shown in FIG. 1 and a shadow mask manufacturing method using the same.
11 is a cross-sectional view illustrating a mold for manufacturing a shadow mask according to another embodiment of the present invention.
12 to 14 are cross-sectional views illustrating a mold for manufacturing a shadow mask shown in FIG. 11 and a method of manufacturing a shadow mask using the same.
FIGS. 15 to 17 are cross-sectional views illustrating a method of forming an organic material pattern using a shadow mask manufactured according to the method of FIGS. 11 to 14. FIGS.
18 to 21 are cross-sectional views illustrating a method of manufacturing a mold for manufacturing a shadow mask according to an embodiment of the present invention.
22 to 25 are cross-sectional views illustrating a method of manufacturing a mold for manufacturing a shadow mask according to an embodiment of the present invention.
10: substrate for display device 20: magnet
30: Organic material 31: Organic pattern
110, 210, 310: Base layer
120, 220, 320: an inclined frame 122, 222, 322:
124, 224, 324: process margin 130, 330: insulation pattern
131: insulating layer 140: etch stop layer
141: etch stop pattern 150, 250: shadow mask
335: Sacrificial pattern 336: Sacrificial material
401: Boring

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a mold for manufacturing a shadow mask according to an embodiment of the present invention.

Referring to FIG. 1, a mold for manufacturing a shadow mask includes a base layer 110, a warp 120, and an insulating pattern 130. Shadow mask manufacturing molds include rigid materials such as metals, plastics, and ceramics. In this embodiment, the mold for manufacturing a shadow mask includes a metal having a high melting point and a non-rusting property. For example, the mold for manufacturing a shadow mask may include a metal such as iron, chromium, molybdenum, nickel, tungsten, manganese, stainless steel, or an alloy thereof.

The base layer 110 constitutes the lower part of the frame for manufacturing the shadow mask and covers the entire surface. In this embodiment, the base layer 110 has a flat plate shape having a flat surface.

2 is an enlarged cross-sectional view of part A of Fig.

Referring to FIGS. 1 and 2, the tilt frame 120 includes an inclined surface 122 and a process margin 124. In this embodiment, the warp mold 120 includes the same material as the base layer 110. [ The inclined surface 122 is disposed on the base layer 110 and protrudes from the base layer 110 in an oblique direction. For example, the inclined surface 122 is inclined at an angle of 50 degrees or less with respect to the upper surface of the base layer 110. [

When the inclined surface 122 is inclined at an angle of 50 degrees or less, an inclined surface having an angle of 50 degrees or less is formed on the side surface of the shadow mask 150 (FIG. 10) manufactured using the shadow mask manufacturing frame.

When the side surface of the shadow mask is close to the vertical direction rather than the inclined surface, the material deposited during the deposition process collides with the side surface of the shadow mask. When the deposited material collides with the side surface of the shadow mask, the deposited material is deposited at a predetermined distance from the side surface by causing interference with the side surface of the shadow mask. Therefore, defects are generated at the edges of the deposited pattern, which makes it difficult to form an accurate pattern.

However, as in the embodiment of the present invention, when an inclined surface having an angle of 50 degrees or less is formed on the side surface of the shadow mask (150 in Fig. 10), the material to be deposited collides with the side surface of the shadow mask (Not shown) after the collision. That is, since the side surface of the shadow mask (150 in FIG. 10) is inclined at an angle of 50 degrees or less, the material colliding with the side surface in the deposition process is repelled upward and does not move to a pattern (not shown). Accordingly, an accurate design pattern can be formed along the lower boundary surface of the shadow mask (150 in Fig. 10).

The process margin 124 protrudes from the top of the inclined surface 122. In this embodiment, the process margin 124 is projected in a direction perpendicular to the upper surface of the base layer 110. [ In another embodiment, the process margin 124 may be tilted from the top surface of the base layer 110 toward the centerline of the ramp 120.

When the inclined frame 120 does not include the process margin 124, the plated metal may flow over the upper surface of the inclined surface 122 in the process of forming the shadow mask (150 in FIG. 9). When the plated metal overflows to the upper part of the inclined surface 122, the opening of the shadow mask (150 in FIG. 9) may be blocked and a failure may occur.

However, as in the embodiment of the present invention, when the shadow mask 120 (150 in FIG. 9) is generated by using the warp frame 120, the metal portion generated over the proper time is used as the process margin of the warp frame 120 (150 in Fig. 9) and is not formed in the space between the adjacent shadow masks (150 in Fig. 9). That is, when the amount of the plated metal is filled up to the upper part of the inclined surface 122 in the process of forming the shadow mask (150 in FIG. 9) . Therefore, even if the amount of plated metal is not correct, a shadow mask (150 in Fig. 9) having an accurate dimension can be produced.

The insulating pattern 130 is disposed on the warper 120 so that a shadow mask 150 of FIG. 9 is formed only on the base layer 110 but only between adjacent warper frames 120. In this embodiment, the shadow mask (150 in FIG. 9) is formed by growing from the upper surface of the base layer 110 exposed between the adjacent inclined surfaces 122.

The shape of the shadow mask (150 in FIG. 9) may become irregular when the insulating pattern 130 is partially or entirely omitted, so that the shadow mask (150 in FIG. 9) is also generated from the inclined frame 120.

However, as in the present embodiment, when the insulating pattern 130 is disposed on the inclined frame 120, a shadow mask (150 in FIG. 9) is formed between the adjacent insulating patterns 130. 9) is formed between the adjacent insulating patterns 130, the shadow mask (150 in Fig. 9) is formed at a uniform height from the top of the exposed busi- ness layer 110. In this case,

FIGS. 3 to 10 are cross-sectional views illustrating a mold for manufacturing a shadow mask shown in FIG. 1 and a shadow mask manufacturing method using the same.

3 is a cross-sectional view showing a step of forming an inclined frame on a metal plate.

1 to 3, a metal plate (not shown) is processed to form a base layer 110 and a warp 120. [ In this embodiment, a groove 120 is formed on a metal plate (not shown) by using a nano-machining apparatus. In another embodiment, after forming a master frame (not shown) having an opposite shape to the base layer 110 and the warping frame 120 shown in FIG. 3, the base layer 110 and The inclined frame 120 may be formed. In another embodiment, the casting may be used to form the base layer 110 and the warp mold 120.

4 is a cross-sectional view illustrating a step of forming an insulating layer on the base layer and the slanting mold shown in FIG.

Referring to FIGS. 1, 2 and 4, an insulating layer 131 is formed on the base layer 110 and the warp 120. In this embodiment, the insulating layer 131 is formed by depositing an insulating material such as silicon oxide or silicon nitride on the base layer 110 and the warping frame 120. For example, various methods such as chemical vapor deposition, physical vapor deposition, atomic layer deposition, and the like can be used.

5 is a cross-sectional view showing a step of forming an etch stop layer on the insulating layer shown in FIG.

Referring to FIGS. 1, 2 and 5, an etch stop layer 140 is formed on the insulating layer 131. In this embodiment, a photoresist is applied on the insulating layer 131 to form an etch stop layer 140. The upper surface of the etch stop layer 140 may be parallel to the base layer 110.

FIG. 6 is a cross-sectional view illustrating a step of patterning the etch stop layer shown in FIG. 5 to form an etch stop pattern.

Referring to FIGS. 1, 2 and 6, an etching stopper pattern 140 is formed by exposing and developing the remaining portions of the etching stopper layer 140 except for the inclined frame 120. A part of the insulating layer 131 is exposed between the adjacent etching stop patterns 141. In this embodiment, a portion of the insulating layer 131 disposed on the warp 120 is covered by the etching stopper pattern 141, and a portion of the insulating layer 131 disposed on the base layer 110 is covered with adjacent etching stopper patterns (Not shown).

7 is a cross-sectional view illustrating a step of forming an insulating pattern using the etch stopping pattern shown in FIG.

Referring to FIGS. 1, 2 and 7, an insulating pattern 130 is formed by etching the exposed portions of the insulating layer 131 (FIG. 6) using the etching stopper pattern 141 as an etching mask. For example, wet etching, dry etching, or the like can be used. The insulating pattern 130 is disposed only on the inclined frame 120. In this embodiment, the edge of the insulating pattern 130 corresponds to the interface between the inclined frame 120 and the base layer 110.

8 is a cross-sectional view illustrating a step of removing the etch stopping pattern shown in FIG. 7 to complete a mold for manufacturing a shadow mask.

1, 2, and 8, the etch stopping pattern 141 disposed on the insulating pattern 131 is removed to complete a mold for manufacturing a shadow mask.

9 is a cross-sectional view illustrating a step of fabricating a shadow mask using the shadow mask manufacturing frame shown in FIG.

Referring to FIGS. 1, 2 and 9, a shadow mask 150 is formed by electroplating metal on a base layer 110 exposed between insulating patterns 131 using a frame for shadow mask fabrication as an electrode. For example, after the shadow mask manufacturing mold is immersed in a solution containing metal ions, electricity can be applied to the base layer 110. [ When electricity is applied to the base layer 110, the metal ions in the solution are plated on the exposed upper surface of the base layer 110. When the plating time is adjusted, the size of the shadow mask 150 formed on the base layer 110 is adjusted.

10 is a sectional view showing the step of separating the shadow mask shown in FIG.

1, 2, and 10, the completed shadow mask 150 is detached from the shadow mask manufacturing frame. For example, the shadow mask 150 may be physically separated from the shadow mask manufacturing frame. Alternatively, after the shadow mask 150 is attached to a magnet (not shown), an adhesive tape (not shown), or the like, the shadow mask 150 attached to a magnet or the like may be detached from the shadow mask manufacturing frame.

According to the present embodiment as described above, it is possible to easily create a shadow mask having an inclined surface.

11 is a cross-sectional view illustrating a mold for manufacturing a shadow mask according to another embodiment of the present invention. In this embodiment, the remaining components except for the base layer and the insulation pattern are the same as those in the embodiment shown in FIG. 1, so duplicate descriptions are omitted.

Referring to FIG. 11, a frame for manufacturing a shadow mask includes a base layer 210 and a warp frame 220. In this embodiment, the base layer 210 comprises a material different from the warp mold 220. For example, the base layer 210 may comprise electrically conductive material, and the bevel 220 may comprise an insulating material. In this embodiment, the base layer 210 includes a metal, and the warp mold 220 may include a metal, a metal oxide, a plastic, a ceramic, or the like.

When a shadow mask (250 in FIG. 14) is manufactured by using the shadow mask manufacturing mold, a shadow mask (250 in FIG. 14) is formed in a space between the adjacent warping frames.

12 to 14 are cross-sectional views illustrating a mold for manufacturing a shadow mask shown in FIG. 11 and a method of manufacturing a shadow mask using the same.

12 is a sectional view showing the step of forming the inclined frame shown in Fig.

Referring to Figs. 11 and 12, a metal plate (not shown) is microfabricated to produce a warp frame 220. Fig. For example, a metal plate (not shown) may be physically machined to create the bevel 220.

In this embodiment, the inclined frame 220 is opened at the bottom, and the top width of the opening is larger than the bottom width. Further, the side surface of the warp frame 220 is inclined at an angle of 50 degrees or less.

13 is a cross-sectional view showing a step of forming a shadow mask using the inclined frame shown in FIG.

11 and 13, a warp frame 220 is disposed on the base layer 210. As shown in FIG. In this embodiment, the warp frame 220 is brought into close contact with the base layer 210. For example, an inclined frame 220 may be attached to the upper surface of the base layer 210 using an adhesive material, an adhesive material, or the like. In another embodiment, the tilt frame 220 may be disposed on the base layer 210 in a detachable manner.

Subsequently, the base layer 210 is used as an electrode to electroplate the metal to create the shadow mask 250. For example, after the inclined frame 220 combined with the base layer 210 is immersed in a solution containing metal ions, electricity may be applied to the base layer 210. The metal ions in the solution are plated on the upper surface of the base layer 210 between the adjacent inclined plates 220 to form the shadow mask 250.

14 is a cross-sectional view showing a step of separating the shadow mask generated in FIG.

Referring to FIGS. 11 and 14, the completed shadow mask 250 is separated from the shadow mask manufacturing frame. For example, the shadow mask 250 may be physically separated from the tilt frame 220 and the base layer 210. In this embodiment, after the shadow mask 250 is firstly separated from the base layer 210 together with the tilt frame 220, the shadow mask 250 and the tilt frame 220 can be secondarily separated.

FIGS. 15 to 17 are cross-sectional views illustrating a method of forming an organic material pattern using a shadow mask manufactured according to the method of FIGS. 11 to 14. FIGS.

FIG. 15 is a cross-sectional view illustrating a method of depositing an organic material using a shadow mask manufactured according to the method of FIGS. 11 to 14. FIG.

Referring to FIG. 15, a shadow mask 250 is disposed on one surface of a substrate 10 for a display device. Thereafter, the magnets 20 are disposed on the other surface of the substrate 10 for a display device so that the shadow mask 250 is brought into close contact with the substrate 10 for a display device. In this embodiment, the magnet 20 includes a permanent magnet having a flat plate shape. In another embodiment, the magnets 20 may comprise electromagnets.

Subsequently, the shadow mask 250 is used to deposit the organic material 30 on the display substrate 10. In another embodiment, an inorganic material (not shown) may be deposited.

16 is a cross-sectional view showing a method of forming an organic pattern using the organic material shown in FIG.

The organic material 30 is then deposited and the organic pattern 31 is formed on the surface of the substrate 10 for a display device exposed by the shadow mask 250.

In this embodiment, the side surface of the shadow mask 250 is inclined at an angle of 50 degrees or less with respect to the surface of the substrate for a display device 10 so that the organic material (30 in Fig. 15) interferes with the side surface of the shadow mask 250 The shape of the organic pattern 31 is not affected. 15) protruded in the lateral direction of the shadow mask 250 or in a direction opposite to the surface of the substrate for a display device 10, Is not deposited on the surface of the substrate 10. In this embodiment, only the organic material (30 in Fig. 15) which is not interfered with the side surface of the shadow mask 250 can be deposited on the surface of the substrate 10 for the display device. Therefore, the side surface of the organic pattern 31 has a direction perpendicular to the surface of the substrate 10 for a display device.

17 is a cross-sectional view showing the step of removing the magnet and the shadow mask from the display device substrate shown in Fig.

Referring to Fig. 17, the magnet (20 in Fig. 16) is then released from the display-use substrate 10.

The shadow mask 250 attached to the surface of the substrate for display device 10 by the magnetic force of the magnet (20 in Fig. 16) And is detached from the substrate 10 for a display device.

Thus, the organic pattern 31 is completed on the substrate 10 for a display device.

According to the present embodiment as described above, the base layer 210 and the warping frame 220 are manufactured in a detachable form, thereby simplifying the manufacturing process. In addition, the shadow mask 250 manufactured using the detachable warp frame 220 can be easily detached from the base layer 210. Furthermore, since the shadow mask 250 can be detached from the display device substrate 10 by using the magnet 20, the manufacturing process becomes convenient.

18 to 21 are cross-sectional views illustrating a method of manufacturing a mold for manufacturing a shadow mask according to an embodiment of the present invention. In this embodiment, the remaining components except for the sacrificial pattern 335 and the insulating pattern 330 are the same as those of the embodiment shown in FIGS. 1 to 10, so that duplicate descriptions of the same components will be omitted.

18 is a cross-sectional view showing a step of forming an inclined frame on a metal plate.

Referring to FIG. 18, a metal plate (not shown) is processed to form a base layer 110 and a warp 120. The inclined frame 120 includes the inclined surface 122 and the process margin 124. [

19 is a cross-sectional view showing a step of forming a sacrificial pattern on the base layer and the slanting mold shown in Fig.

Referring to FIG. 19, a sacrificial material 336 is dropped onto the base layer 110 and the warp 120 to form a sacrificial pattern 335. In this embodiment, a sacrificial material 336 is dripped onto the base layer 110 and the warp 120 using various methods such as inkjet, nozzle, and the like. For example, the sacrificial material 336 may be dropped only on the upper surface of the base layer 110 exposed by the adjacent inclined molds 120.

The sacrificial material 336 includes a material that is easily melted by alcohol, an organic solvent, water, or the like. For example, the sacrificial material 336 may comprise a photoresist.

20 is a cross-sectional view showing a step of forming an insulating layer on a slope frame including the sacrificial pattern shown in Fig.

Referring to FIG. 20, an insulating layer 331 is formed by depositing an insulating material such as silicon oxide or silicon nitride on the base layer 110 and the inclined frame 120 covered by the sacrificial pattern 335. In this embodiment, the insulating layer 331 is formed on the upper surface of the sacrificial pattern 335, the surface of the process margin 124 and the inclined surface 122.

21 is a cross-sectional view showing a step of removing the sacrificial pattern and a part of the insulating layer shown in Fig.

20 and 21, the sacrificial pattern 335 is removed using a solvent such as an organic solvent, alcohol, or water. In this embodiment, a portion of the insulating layer 331 disposed on the sacrificial pattern 335 in the process of removing the sacrificial pattern 335 is also removed.

For example, when a solvent such as an organic solvent, alcohol, or water is sprayed onto the sacrificial pattern 335, the insulating layer 331 disposed on the sacrificial pattern 335 is torn by the impact applied. The solvent penetrates into the gap where the insulating layer 331 is torn and the sacrificial pattern 335 is melted. When the sacrificial pattern 335 is melted, a part of the insulating layer 331 disposed on the sacrificial pattern 335 is separated and removed by the flow of the solvent. In this embodiment, since the thickness of the insulating layer 331 is very thin and has little elasticity, it can be easily removed.

Therefore, the insulating pattern 330 is formed by the insulating layer 331 remaining on the inclined frame 120, thereby completing the frame for manufacturing the shadow mask.

The steps of fabricating the shadow mask are the same as those of the embodiment shown in FIGS. 9 to 10, so that redundant description of the same components will be omitted.

According to the present embodiment as described above, the insulation pattern 330 can be easily formed without using a photoresist process, thereby reducing the manufacturing cost.

22 to 25 are cross-sectional views illustrating a method of manufacturing a mold for manufacturing a shadow mask according to an embodiment of the present invention. In this embodiment, the remaining components except for the boring are the same as those in Figs. 1 to 10, and thus redundant description of the same components is omitted.

22 is a cross-sectional view showing a step of forming an inclined frame on a metal plate.

Referring to FIG. 22, a metal plate (not shown) is processed to form the base layer 110 and the warping frame 120. The inclined frame 120 includes the inclined surface 122 and the process margin 124. [

23 is a cross-sectional view showing a step of forming an insulating layer on the base layer and the slanting mold shown in Fig.

Referring to FIG. 23, an insulating layer 131 is formed by depositing an insulating material on the base layer 110 and the warping frame 120. The insulating layer 131 is formed on the upper surface of the base layer 110, the upper surface of the warp 120.

FIG. 24 is a cross-sectional view showing a step of patterning the insulating layer shown in FIG. 23, and FIG. 25 is a cross-sectional view showing a mold for producing a shadow mask produced using the process of FIG.

24 and 25, the insulating layer 131 disposed on the base layer 110 is removed using a boring 401 of a nanomechanical processing apparatus (not shown) to form an insulating pattern 130 do. In this embodiment, the borings 401 physically shave the insulating layer 131 disposed on the base layer 110. In another embodiment, the insulating layer 130 disposed on the base layer 110 may be irradiated with a laser to form the insulating pattern 130. [

Thus, the mold for manufacturing the shadow mask is completed.

The steps of fabricating the shadow mask are the same as those of the embodiment shown in FIGS. 9 to 10, so that redundant description of the same components will be omitted.

According to the present embodiment as described above, the insulating pattern 130 can be easily formed without using a photoresist process, thereby reducing the manufacturing cost.

As described above, a shadow mask having an inclination of 50 degrees or less can be easily manufactured.

Furthermore, the base layer and the warp frame can be manufactured in a detachable form, simplifying the manufacturing process. In addition, the shadow mask manufactured using the separable inclined frame can be easily detached from the base layer. Furthermore, the shadow mask can be detached from the substrate for a display device by using the magnet, so that the manufacturing process becomes convenient.

In addition, the manufacturing cost can be reduced by easily forming the insulating pattern without using the photoresist process.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. You will understand.

10: substrate for display device 20: magnet
30: Organic material 31: Organic pattern
110, 210: base layer 120, 220: inclined frame
122, 222: sloped surfaces 124, 224: process margin
130, 330: Insulation pattern 131: Insulation layer
140: etch stop layer 141: etch stop pattern
150, 250: shadow mask 335: sacrificial pattern
336: Sacrificial material 401: boring

Claims (9)

A base layer including a conductive material and having a plate shape;
An inclined surface having an inclination of 50 degrees or less and a process margin projecting from a top of the inclined surface in a direction perpendicular to an upper surface of the base layer, the inclined surface being disposed on the base layer; And
A mold for manufacturing a shadow mask, comprising: an inorganic insulating material; and an insulating pattern disposed on the inclined frame and exposing an upper surface of the base layer. The frame for manufacturing a shadow mask according to claim 1, wherein the base layer and the inclined frame include the same material and are integrally formed. A base layer including a conductive material and having a plate shape; And
An inclined surface having an inclination of 50 degrees or less and a process margin projecting in a direction perpendicular to an upper surface of the base layer from an upper portion of the inclined surface and electrically insulated from the base layer,
Wherein the base layer and the inclined frame are detachable from each other. A base layer having a flat plate shape obtained by processing a metal plate, a slope having a slope of 50 degrees or less, and a process margin projecting from a top of the slope in a direction perpendicular to the top surface of the base layer, Forming an inclined frame;
Depositing an inorganic insulating material on the inclined frame to form an insulating layer;
Patterning the insulating layer to form an insulating pattern disposed on the inclined frame and exposing an upper surface of the base layer;
Plating a metal on an upper surface of the base layer exposed by the insulation pattern using the base layer as an electrode, thereby creating a shadow mask between adjacent inclined plates; And
And separating the shadow mask from the inclined frame. 5. The method of claim 4, wherein forming the insulation pattern comprises:
Forming a photoresist pattern covering the inclined frame on the insulating layer;
Etching the exposed portion of the insulating layer using the photoresist pattern as an etch mask; And
And stripping the photoresist pattern. ≪ RTI ID = 0.0 > 21. < / RTI > 5. The method of claim 4, further comprising forming a sacrificial pattern on the base layer by dropping a sacrificial material between the adjacent slopes before forming the insulating layer,
Wherein the step of forming the insulating layer includes depositing the inorganic insulating material on the warping frame and the sacrificial pattern,
Wherein the forming of the insulating pattern includes removing the sacrificial pattern and a part of the insulating layer disposed on the sacrificial pattern. 5. The method of claim 4, wherein forming the insulating pattern comprises physically shaving off a portion of the insulating layer disposed on the base layer using boring of the nanomechanical processing device. ≪ Desc / ≪ / RTI > Forming an inclined surface including an inclined surface having an inclination of 50 degrees or less using the insulating material and a process margin protruding from the top of the inclined surface;
Disposing the inclined frame on a base layer including a conductive material and having a flat plate shape;
Plating the metal using the base layer as an electrode to create a shadow mask between adjacent tilt frames; And
And separating the shadow mask from the tilt frame. 9. The method of claim 8, wherein separating the shadow mask from the tilt frame comprises:
Separating the shadow mask and the inclined frame from the base layer; And
And secondarily separating the shadow mask from the inclined frame.

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