KR101605704B1 - Manufacturing method of Large Size Bipolar Electrostatic chuck and Large Size Electrostatic chuck manufactured by the same - Google Patents

Abstract

The present invention relates to a method for manufacturing a large size bipolar electrostatic chuck and a large size bipolar electrostatic chuck manufactured by the same, wherein the method comprises the steps of: forming a basic material (Step 1); performing a bead plastic process on the surface of the basic material (Step 2); forming an insulation layer on the upper surface of the basic material on which the bead blasting process is performed (Step 3); polishing the surface of the insulation layer (Step 4); performing a bead blasting process on the surface of the polished insulation layer (Step 5); performing screen printing on the upper surface of the insulation layer on which the bead blasting process is performed to form a bipolar electrode pattern (Step 6); heat-treating the screen printed bipolar electrode pattern (Step 7); forming a dielectric layer on the upper surface of the heat-treated bipolar electrode pattern (Step 8); and polishing the surface of the dielectric layer (Step 9). By changing the method for forming the electrode pattern, the method for rapidly and stably manufacturing the large size bipolar electrostatic chuck can be assured, thereby having an economically most effective advantage.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bipolar electrostatic chuck having a large area bipolar electrostatic chuck and a large area bipolar electrostatic chuck manufactured by the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a large-area bipolar electrostatic chuck and a large-area bipolar electrostatic chuck manufactured thereby, and more particularly, to a method of forming electrodes of a large-area bipolar electrostatic chuck using a plasma spray coating, Area bipolar electrostatic chuck, and a large-area bipolar electrostatic chuck manufactured by the method.

A chuck for fixing the substrate is provided inside the processing chamber for manufacturing the semiconductor and display device.

The use range of the chuck has been expanded to the entire semiconductor and display substrate processing processes such as chemical vapor deposition (CVD), etching, sputtering, ion implantation, evaporation and the like.

Conventionally, a clamping chuck for fixing a semiconductor and a display substrate by a mechanical method and a vacuum chuck for fixing a semiconductor substrate by using a vacuum have been employed.

However, since the vacuum chuck is processed under vacuum, there is a drawback that deformation occurs in the substrate because the adsorption effect is small due to a small pressure difference between the two, and even if the vacuum chuck can be adsorbed, the adsorbed portion becomes localized.

Current substrates are generally processed in a downward direction, but recently there is a demand for an upwardly shaped process. In case of the upside type, when the substrate is wide, the center of the substrate is deflected due to gravity. However, it can not be controlled by the clamping chuck which fixes only the outer edge of the substrate.

In order to compensate for the drawbacks of the prior art, electrostatic chucks using electrostatic force have been developed and widely adopted. The electrostatic chuck can be divided into a uni-polar electrostatic chuck using one electrode and a bi-polar electrostatic chuck using two electrodes.

The unipolar electrostatic chuck has a stronger electrostatic force than the bipolar electrostatic chuck, but is limited to a plasma atmosphere in a vacuum atmosphere. The bipolar electrostatic chuck has a relatively low electrostatic force as compared with the unipolar electrostatic chuck, but has an advantage that it can be used in both a vacuum and an atmospheric environment without being limited by the use atmosphere.

The bipolar electrostatic chuck has an insulating layer and electrodes as basic components, and an adsorbent such as a wafer is placed on the insulating layer. That is, the wafer and the electrode are disposed to face each other through the insulating layer. When a + current is applied to one electrode and a - current is applied to the other electrode in this state, a coulomb acts between these charges. As a result, the adsorbent is adsorbed by the Coulomb force.

The bipolar electrostatic chuck for adsorbing the adsorbent according to such an operation is formed of an electrode pattern as shown in Fig. That is, a positive electrode pattern is formed on the front surface of the bipolar electrostatic chuck, and a negative electrode is formed between the positive electrodes. More specifically, a positive electrode in the form of a finger is patterned across the entire surface of the electrostatic chuck, and a finger-shaped negative electrode is sandwiched between the positive electrodes and patterned. The interdigitated pattern is a pattern in which a positive electrode and a negative electrode are interdigitated and patterned in this manner.

Korean Patent Registration No. 10-1189815 (Oct. 10, 2012) discloses a method for manufacturing an electrostatic chuck in which a tungsten electrode is formed using a plasma spray coating method and a bipolar electrode pattern is formed by using a processing method, .

Although the fabrication method of the electrostatic chuck has an advantage that a large area electrostatic chuck can be manufactured, it takes considerable time and expense to implement the pattern using the large area processing method, and there is a possibility that the pattern may be damaged in the process, It has a disadvantage that it can be applied only to a pattern having a thickness of about 1 mm or more because it is directly influenced by the processing tool.

KR 10-1189815 B1 Oct 10,

It is an object of the present invention to provide a method of manufacturing an electrostatic chuck using a plasma spray coating method capable of manufacturing a bipolar electrostatic chuck having a large area by applying a screen printing method to a cross- A method of manufacturing a large area bipolar electrostatic chuck capable of forming a high quality electrode pattern compared to a processing method depending on the shape of a bipolar electrode and a sputtering method depending on a deposition mask, Thereby providing an electrostatic chuck.

In order to achieve the above object, the present invention provides the following means.

The present invention relates to a method of manufacturing a semiconductor device, comprising: forming a base material (step 1); A step of bead blasting the surface of the base material (step 2); Forming an insulating layer on the bead-blasted base material (step 3); Polishing the surface of the insulating layer (step 4); Treating the surface of the polished insulating layer with bead blasting (step 5); Forming a bipolar electrode pattern by screen printing on the bead-blasted insulating layer (step 6); (7) heat-treating the screen-printed bipolar electrode pattern; Forming a dielectric layer on the heat-treated bipolar electrode pattern (step 8); And polishing the surface of the dielectric layer (step 9); The present invention also provides a method of manufacturing a large area bipolar electrostatic chuck.

In step 4, the flatness of the polished insulating layer is 20 to 30 占 퐉.

In step 5, the surface roughness of the bead-blasted insulating layer is 2 to 10 mu m.

In step 6, the screen printed thickness is 3 to 9 占 퐉.

In the step 7, the heat treatment uses a plasma flame to remove foreign matters generated after the screen printing.

In step 9, the polished dielectric layer has a thickness of 100 to 300 mu m.

The present invention also provides a large area bipolar electrostatic chuck manufactured by the above manufacturing method.

The large-area bipolar electrostatic chuck according to the present invention applies a screen printing method to construct an electrode having a structure in which a cathode and an anode intersect in a method of manufacturing a large-area bipolar electrostatic chuck manufactured by using a plasma spray coating method, It is possible to form a pattern with a higher precision than an electrode pattern formed by a method such as machining or the like and to form an electrode pattern having a large area (2,500 mm x 2,200 mm), a process time of about 15 days is required When the screen printing method is applied, it takes about 2 days. Therefore, it is possible to shorten the time dramatically.

1 is a schematic view of an electrostatic chuck having a general bipolar electrode pattern formed thereon.
FIGS. 2 to 9 are sectional views sequentially illustrating a method of manufacturing a large-area bipolar electrostatic chuck according to the present invention.

Hereinafter, the present invention will be described in detail.

1 is a schematic view of an electrostatic chuck having a general bipolar electrode pattern formed thereon.

FIGS. 2 to 9 are sectional views sequentially illustrating a method of manufacturing a large-area bipolar electrostatic chuck according to the present invention.

First, a method of manufacturing a large-area bipolar electrostatic chuck according to the present invention will be described with reference to FIGS. 2 to 9. FIG.

A method of manufacturing a large area bipolar electrostatic chuck of the present invention comprises:

Forming the base material 10 (step 1);

A step of bead blasting the surface of the base material 10 (step 2);

Forming an insulating layer 20 on the bead blasted base material 10 (step 3);

Polishing the surface of the insulating layer 20 (step 4);

Treating the surface of the polished insulating layer 20 'by bead blasting (step 5);

(Step 6) forming a bipolar electrode pattern 30 by screen printing on the upper surface of the insulating layer 20 'subjected to the bead blasting process;

A step (7) of heat-treating the screen-printed bipolar electrode pattern (30) using a plasma flame;

A step (step 8) of forming a dielectric layer 40 on the top surface of the heat-treated bipolar electrode pattern 30; And

Polishing the surface of the dielectric layer 40 (step 9);

.

In the step 1, the base material 10 may be made of a metal such as aluminum (Al), SUS, or titanium (Ti). One end of the power supply line formed through the base material 10 is connected to the high voltage power supply and the other end is connected to the electrode. (See Fig. 2)

Step 2 is a step of bead blasting the surface of the base material 10 in order to improve the adhesion between the base material 10 and the insulating layer. (See Fig. 3)

The surface roughness of the bead blasting-treated base material 10 is preferably 2 to 10 탆.

In the step 3, a ceramic powder is coated on the upper surface of the bead blast-treated base material 10 by using a plasma spray method to form an insulating layer 20. (See Fig. 4)

Step 4 is a step of polishing to secure the flatness of the surface of the insulating layer 20. It is preferable to secure a flatness of 50 mu m or less and more preferably to secure a flatness of 20 to 30 mu m Do. The polished insulating layer 20 'preferably has a thickness of 100 to 300 탆, more preferably 100 to 200 탆. (See Fig. 5)

Step 5 is a step of bead blasting the surface of the polished insulating layer 20 'in order to increase the adhesion between the electrode layer and the dielectric layer. It is preferable that the surface roughness of the bead blasting-treated insulating layer 20 'is 2 to 10 탆. (See Fig. 6)

In the step 6, a bipolar electrode pattern 30 is formed by screen printing using a metal paste on the upper surface of the bead-blasted insulating layer 20 '. As a material of the electrode pattern used in the screen printing method, either silver paste or tungsten paste may be used.

The present invention optimizes the illuminance of the bead-blasted insulating layer 20 'and the thickness of the screen-printed electrode pattern 30 so that the surface roughness of the screen-printed electrode pattern 30 is at least 2 탆 So that strong adhesion with the dielectric layer 40 formed in the next process can be maintained without additional bead blasting after screen printing of the electrode pattern.

If the printing thickness is less than 3 mu m, the electric conductivity becomes weak. If the printing thickness is more than 9 mu m, the dielectric layer 40 formed in the next process can be easily There is a problem that it is peeled off. (See Fig. 7)

Step 7 is a step of performing heat treatment using a plasma flame to remove foreign substances generated after screen printing.

Step 8 is a step of forming a dielectric layer 40 by coating a ceramic powder on the upper surface of the bipolar electrode pattern 30 using a plasma spray method. The dielectric layer 40 may have a thickness of 400 to 600 탆. (See Fig. 8)

The step 9 is a step of polishing to secure the flatness of the surface of the dielectric layer 40. The polished dielectric layer 40 'is preferably formed to a thickness of 100 to 300 탆. If the polished dielectric layer 40 'is constructed with a thickness of less than 100 탆, the electrical stability may be degraded, and if the polished dielectric layer 40' is configured with a thickness exceeding 300 탆, the electrostatic power may be lowered. The surface roughness of the polished dielectric layer 40 'is preferably 1 탆 or less, more preferably 0.1 to 0.8 탆. (See Fig. 9)

After the step 9, a step of impregnating the coating layer with a liquid organic or inorganic sealing liquid may be added. The sealing treatment may minimize the porosity of the ceramic coating layer and improve the electrical stability.

A curing step may be added after the sealing step.

The power supply unit and the power supply line are commonly used in a bipolar electrostatic chuck, and thus a detailed description thereof will be omitted.

The present invention also provides a large area bipolar electrostatic chuck manufactured by the above manufacturing method.

The large-area bipolar electrostatic chuck according to the present invention is a method of forming electrodes of a large-area bipolar electrostatic chuck, which is manufactured by a plasma spray coating method, by replacing a conventional post-coating method with a screen printing method, There is no risk, and the time required for machining is remarkably reduced. The effect of bipolar electrostatic chuck with screen printing is higher when it is large area electrostatic chuck.

Hereinafter, the constitution and effects of the present invention will be described in more detail through examples. These embodiments are only for illustrating the present invention, and the scope of the present invention is not limited by these embodiments.

The electrostatic chuck base material 10 is made of aluminum, and the surface of the base material 10 is bead blasted. A ceramic powder was coated on the bead blasted base material 10 using a plasma spray method to form an insulating layer 20. The surface of the insulating layer 20 was polished to secure a flatness of 30 占 퐉 or less. The surface of the polished insulating layer 20 'was bead blasted so that the surface roughness of the bead blasted insulating layer 20' was 4 탆. A bipolar electrode pattern 30 was formed by screen printing on the upper surface of the bead blast-treated insulating layer 20 ', and the screen-printed thickness of the printed layer was 3 μm. The bipolar electrode pattern 30 was thermally treated using a plasma flame. After the heat treatment was completed, the ceramic powder was coated by using a plasma spray method to form a dielectric layer 40. The dielectric layer 40 was formed of 450 Mu m. The surface of the dielectric layer 40 was polished and the polished dielectric layer 40 'was 150 microns thick. The surface roughness of the polished dielectric layer 40 'was 0.6 탆.

In Example 1, the remainder were the same except that the screen-printed thickness of the printing was 5 占 퐉.

In Example 1, the remainder were the same except that the screen-printed printing thickness was 7 탆.

In Example 1, the remainder were the same except that the screen-printed thickness of the printing was 9 탆.

[Comparative Example 1]

In Example 1, the rest were the same except that the screen-printed thickness of the printing was 10 탆.

[Comparative Example 2]

In Example 1, the remainder were the same except that the screen-printed thickness of the printing was 11 탆.

[Comparative Example 3]

In Example 1, the remainder were the same except that the screen-printed thickness of the printing was 13 탆.

[Experimental Example 1]

The adhesive strength between the electrode layer and the dielectric layer prepared in Examples 1 to 4 and Comparative Examples 1 to 3 was tested. The results are shown in Table 1.

division Adhesion Example 1 9.9 Mpa Example 2 8.4 Mpa Example 3 7.8 Mpa Example 4 6.5 Mpa Comparative Example 1 4.6 Mpa Comparative Example 2 3.4 Mpa Comparative Example 3 2.9 Mpa

It can be seen from Table 1 that the adhesive strength between the electrode layers and the dielectric layers of Examples 1 to 4 is superior to that of the electrode layers of Comparative Examples 1 to 3 and the dielectric layer.

The present invention relates to a method of forming an electrode of a large-area bipolar electrostatic chuck by a plasma spray coating method, characterized in that an optimum screen printing printing thickness is set so as to prevent not only the electric conductivity but also the adhesion between the electrode layer and the dielectric layer from being weakened .

10: base metal
20: insulating layer 20 ': polished insulating layer
30: Bipolar electrode Pattern
40: Dielectric layer 40 ': Polished dielectric layer

Claims (7)

Forming a base material (step 1);
A step of bead blasting the surface of the base material (step 2);
Forming an insulating layer on the bead-blasted base material (step 3);
Polishing the surface of the insulating layer (step 4);
Treating the surface of the polished insulating layer with bead blasting (step 5);
Forming a bipolar electrode pattern by screen printing on the bead-blasted insulating layer (step 6);
(7) heat-treating the screen-printed bipolar electrode pattern;
Forming a dielectric layer on the heat-treated bipolar electrode pattern (step 8); And
Polishing the surface of the dielectric layer (step 9);
, ≪ / RTI &
Wherein in step 6, the screen printed printing thickness is from 3 to 9 占 퐉.
2. The method of claim 1, wherein in step 4,
Wherein the polished insulating layer has a flatness of 20 to 30 占 퐉.
2. The method of claim 1, wherein in step 5,
Wherein the surface roughness of the insulating layer subjected to the bead blasting is 2 to 10 占 퐉.
delete delete 2. The method of claim 1, wherein in step 9,
Wherein the polished dielectric layer has a thickness of 100 to 300 mu m.
delete

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