KR101553816B1 - Large size electrostatic manufacturing method for display boards - Google Patents

Abstract

The present invention relates to a method for manufacturing a large-area electrostatic chuck which is used in a display substrate. The method includes: a first step of preparing a base material which is formed as a rectangular plate and is made by mixing one or more ceramic materials selected from a group including the ceramic materials such as Al_2O_3, Y_2O_3, Al_2O_3/Y_2O_3, ZrO_2, AlC, TiN, AlN, TiC, MgO, CaO, CeO_2, TiO_2, BxCy, BN, SiO_2, SiC, YAG, Mullite, and AlF_3; a second step of conducting a thermal spraying operation to spray ceramic thermal coating powder onto the outer surface of the base material at the thickness of 0.1-1 mm and processing the upper part of the base material to make the flatness rate to be in the range of 5-30 μm; connecting a connector to the base material to supply a voltage to the base material; a fourth step of conducting a thermal coating operation to coat the ceramic thermal coating powder on top of the base material at the thickness of 0.1-1 mm to form an insulation layer; a fifth step of forming a printed layer according to a pattern set on top of the insulation layer; a sixth step of conducting a thermal coating operation to coat metal thermal coating powder on the upper part of the printed layer and the insulation layer to surround the upper part of the printed layer and the insulation layer to form a conductive electrode layer; a seventh step of removing the electrode layer formed on top of the printed layer and the printed layer; and an eighth step of forming the electrode layer on top of the insulation layer to surround the insulation layer, conducting a thermal coating operation to coat the ceramic thermal coating powder on the electrode layer at the thickness of 0.1-1 mm, and processing the upper surface to make the flatness rate to be in the range of 5-30 mm to form a dielectric layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a large-sized electrostatic chuck for a display substrate,

The present invention relates to a method of manufacturing a large area electrostatic chuck for a display substrate, and more particularly, to a method for manufacturing a large area electrostatic chuck for a display substrate, which is capable of increasing the attraction force of a large area electrostatic chuck used for adsorbing a large- A non-incombustible printing layer having a closely spaced pattern is formed on the upper portion of the insulating layer by a silk screen printing method or an inkjet printing method so that the fabrication of the electrostatic chuck can be facilitated. And the electrode layer formed on the upper portion of the print layer is removed to form an electrode layer having a closely spaced pattern, so that the large-area electrostatic chuck can be easily manufactured, and the attraction force can be increased. To an area electrostatic chuck manufacturing method.

BACKGROUND ART [0002] Recent trends in the fabrication of wafer or glass substrates such as semiconductors and display panels, high integration of circuits and ultrafine processing, and plasma etching processes are well known in the field of thin film deposition and etching, And the like.

Conventionally, a wafer or a glass substrate, which is a material to be processed, has been fixed by using a mechanical clamp or a vacuum chuck. However, electrostatic chucks using electrostatic force are used as core parts in recent semiconductor and display panel processing equipments Thereby fixing the wafer or the glass substrate.

The electrostatic chuck is characterized in that at least two dielectric layers are formed in a base material and an electrode is inserted between the dielectric layers, and an insulating layer and a dielectric layer are formed on the base material, When a direct current voltage is applied to an electrode having conductivity, an opposite polarity is generated on a wafer or a glass substrate to be processed according to polarization of a dielectric, so that a wafer or glass substrate and a dielectric substance And fixes the wafer or glass substrate to be processed by the generated electrostatic force.

The electrostatic chuck for chucking an object to be attracted by an electrostatic force includes a base member, a plurality of dielectric plate units assembled on one surface of the base member, each of which is provided with electrodes, And a coating layer filling a gap between the dielectric plate and the dielectric plate unit. The method of manufacturing an electrostatic chuck for adsorbing an object to be attracted by an electrostatic force comprises the steps of: performing a ceramic sintering process A step of assembling a plurality of dielectric plate units to one surface of the base member so as to be spaced apart from each other, and a plasma spraying step to fill a gap between the dielectric plate units, Characterized by comprising Technology is a known bar, as in Patent Publication No. 10-1109743 call.

However, the above-described technology is to form an electrostatic chuck by performing a ceramic sintering process and a plasma spray process, and it is impossible to form an electrode layer having a fine pattern with a width of 1 mm or less due to the characteristics of a ceramic sintering process and a plasma spray process, There is a problem that it takes a long time to form a pattern of the electrode layer.

Accordingly, there is a need for a method of manufacturing a large-area electrostatic chuck for a display substrate which solves the above-described conventional problems.

Patent Registration No. 10-1109743

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above. In the conventional art, a ceramic sintering process and a plasma spray process are performed to fabricate a large area electrostatic chuck to form an electrostatic chuck, It is impossible to form an electrode layer having a pattern of an electrode layer and it takes a long time to form a pattern of an electrode layer. The incombustible print layer having a pattern with a closely spaced interval on the insulating layer is formed by a silk screen printing method An ink layer is formed to cover the insulating layer and the print layer on the upper part of the insulating layer and the print layer, and the electrode layer formed on the print layer and the print layer is removed to form a pattern with a closely spaced By forming the electrode layer, it is easy to fabricate a large-area electrostatic chuck, and the adsorption force is increased To provide a large area of the electrostatic chuck manufacturing method for a display substrate it is an object.

In order to achieve the above-mentioned object, the present invention provides a ceramic material comprising at least one of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC, TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, BN, SiO2, SiC, YAG, Mullite, and AlF3. The first step includes a base material formed into a square plate shape. The first step includes a step of forming a ceramic material having a thickness of 0.1 to 1 mm on the outer surface of the base material. A second step of spray coating the powder for spray coating of the ash and processing the base material to have a flatness of 5 to 30 占 퐉 or less and a connector for supplying a voltage to the base material; A fourth step of spray-coating a spraying powder for thermal spraying of a ceramic material to a thickness of 0.1 to 1 mm to form an insulating layer; and a fifth step of forming a printed layer according to a pattern set on the insulating layer, The top of the insulating layer and the top of the insulating layer A sixth step of forming an electrode layer of a conductive material by spray coating a powder for spray coating of a metal material so as to surround the electrode layer, a seventh step of removing the electrode layer formed on the print layer and the print layer, And a step of forming a dielectric layer by processing the powder for thermal spraying of a ceramic material to a thickness of 0.1 to 1 mm from the electrode layer and processing the flatness of the upper surface within 5 to 30 占 퐉 to form a dielectric layer. A large area electrostatic chuck manufacturing method is provided.

In the method of manufacturing a large area electrostatic chuck for a display substrate according to the present invention, a ceramic sintering process and a plasma spray process are performed to fabricate a large area electrostatic chuck to form an electrostatic chuck, It is impossible to form an electrode layer having an electrode layer and it takes a long time to form a pattern of an electrode layer. The incombustible print layer having a pattern of closely spaced intervals on the insulating layer is formed by a silk screen printing method, An electrode layer is formed to cover the insulating layer and the print layer on the upper portion of the insulating layer and the print layer, and then the electrode layer formed on the print layer and the print layer is removed to form an electrode layer It is easy to fabricate a large-area electrostatic chuck, and the attraction force of the adsorbed material There is an advantage of being raised.

1 is a flowchart of a method of manufacturing a large area electrostatic chuck for a display substrate according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1, a method of manufacturing a large area electrostatic chuck for a display substrate according to the present invention comprises the steps of: preparing a ceramic substrate by using a ceramic material such as Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC, TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, (S1) in which a base material (2) formed of a mixture of one or more of the group consisting of BN, SiO2, SiC, YAG, Mullite and AlF3 is formed, Coating a powder for thermal spraying with a ceramic material to a thickness of 0.1 to 1 mm on the outer surface of the base material 2 and processing the upper surface of the base material 2 to have a flatness of 5 to 30 μm or less, And a connector 10 for supplying a voltage to the base material 2 is connected to the upper part of the base material 2. The third step S3 includes the steps of: A fourth step (S4) of forming an insulating layer (20) by thermal spray coating, and forming a printing layer (30) according to a pattern set on the insulating layer And a fifth step S5 of spraying and coating a powder for thermal spraying to cover the upper portion of the insulating layer 20 and the printed layer 30 on the insulating layer 20 and the printed layer 30 A sixth step S6 of forming an electrode layer 40 of a conductive material and a seventh step S7 of removing the electrode layer 40 formed on the print layer 30 and the print layer 30, The electrode layer 40 is formed on the upper side of the layer 20 and the powder for thermal spraying of the ceramic material is sprayed from the electrode layer 40 to a thickness of 0.1 to 1 mm. And an eighth step (S8) of forming a dielectric layer 50 by processing the dielectric layer 50 within a predetermined range.

First, one or more of ceramic materials such as Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC, TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, BN, SiO2, SiC, YAG, Mullite, Two or more types are mixed and formed, and a base material 2 formed in a square plate shape is provided (step S1)

The top surface of the base material 2 is processed to have a flatness of 5 to 30 μm or less by spray-coating a powder for spray coating with a ceramic material to a thickness of 0.1 to 1 mm on the outer surface of the base material 2. Step S2)

The powder for spray coating of the ceramic material is coated on the base material 2 in two steps. The powder for thermal spraying of the ceramic material to be coated first is a powder for soft coating material for thermal spraying. Is coated with a powder for a soft ceramic spray coating, and the second is to spray-coat a powder for a ceramic powder coating having a high strength.

When the spray coating is completed on the base material 2, the flatness of the upper surface of the base material 2 is processed within 5 to 30 μm.

In this case, when the flatness of the upper surface of the base material 2 is made to be 5 탆 or less, there is a problem that the processing time is long, The flatness of the insulating layer 20, the electrode layer 40 and the dielectric layer 50 formed on the upper surface of the base material 2 described later can not be uniformly formed, 4) is used for oxidation, deposition, or etching of a large-area display substrate used for various flat panel displays, etc., there is a problem that the attraction force is lowered.

And a connector 10 for supplying a voltage to the base material 2 is connected (step S3)

At this time, the connector 10 transmits a high voltage supplied from the outside to an electrode layer 40 to be described later, and one or more electrodes are connected to the electrode layer 40.

In addition, the connector 10 is preferably formed of a conductive material such as tungsten, molybdenum, or titanium, but any conductive material may be used.

The insulating layer 20 is formed by spray-coating a spraying powder of a ceramic material to a thickness of 0.1 to 1 mm on the base material 2 (step S4)

In this case, the insulating layer 20 is formed by spray coating on the base material 2 using an amorphous ceramic material. The ceramic material may include Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC, TiN, AlN, TiC, MgO , CaO, CeO2, TiO2, BxCy, BN, SiO2, SiC, YAG, Mullite and AlF3.

When the insulating layer 20 is formed to have a thickness of 0.1 mm or less, the electrode layer 40 to be described later is formed to have a thickness of 0.1 to 1 mm. There is a problem in that the insulation property between the base material 2 and the electrode layer 40 is deteriorated when the insulation layer 20 has a volume resistance of at least 1 mm. But also the cost of production is increased because a large amount of ceramic powder for spray coating is added.

The print layer 30 is formed in accordance with a pattern formed on the insulating layer 20 (step S5)

The printing layer 30 is formed on the insulating layer 20 using a silk screen printing method or an inkjet printing method and is formed on the insulating layer 20 by a silk screen printing method or an ink jet printing method The printing layer 30 may be formed on the insulating layer 20 using another printing method.

The spacing between the pattern and the pattern formed on the print layer 30 is preferably 0.1 to 3 mm for the interval of the pattern and the pattern of the electrode layer 40 to be described later. As the spacing of the pattern becomes more dense, the interval of the pattern and the pattern of the electrode layer 40 described later can be formed densely.

The printed layer 30 is easily peeled off from the insulating layer 20 while being resistant to heat when the electrode layer 40 to be described later is spray coated to cover the upper portion of the insulating layer 20 and the printed layer 30 (Meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, ethyl acrylate, butyl acrylate, butyl cellosolve, (Meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, isobonyl Hydroxypropyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2- Acrylate, 4-hydroxy (Meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, , Methoxytriethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxytripropylene glycol (meth) acrylate, poly (ethylene glycol) methyl ether (meth) acrylate, phenoxydiethylene glycol (Meth) acrylate, p-nonylphenoxypolyethylene glycol (meth) acrylate and p-nonylphenoxypolypropylene glycol (meth) acrylate, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, ethylene glycol dimethyl Ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, di But are not limited to, ethylene glycol methyl ethyl ether, 2-ethoxypropanol, 2-methoxypropanol, 3-methoxybutanol, cyclohexanone, cyclopentanone, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, Acetate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate, and dipropylene glycol monomethyl ether.

It is preferable that the thickness of the print layer 30 is 0.03 to 0.1 mm so that the thickness of the electrode layer 40 to be described later has a thickness of 0.03 to 0.1 mm.

A spray coating powder of a metallic material is sprayed over the insulating layer 20 and the exposed portion of the printed layer 30 to cover the upper portion of the insulating layer 20 and the printed layer 30, 40 are formed. (Step S6)

The electrode layer 40 is formed to be connected to the connector 10 to generate an electrostatic force. The electrode layer 40 may be formed of tungsten, which is a conductive material, but may be formed of a conductive material such as tungsten, molybdenum, or titanium. will be.

When the thickness of the electrode layer 40 is 0.03 mm or less, the resistance value of the electrode layer 40 may be lowered due to porosity and other defects in the electrode layer 40, When the thickness of the electrode layer 40 is greater than 0.1 mm, the time for spray coating increases and the cost due to spray coating increases. There is a problem.

The interval between the pattern and the pattern in which the electrode layer 40 is formed is formed according to the interval between patterns and patterns formed in the print layer 30. The interval between the patterns and the patterns formed in the print layer 30 after the electrode layer 40 is spray- The pattern of the electrode layer 40 is completed by removing the electrode layer 40 and the print layer 30 formed on the upper part.

The spacing between the pattern and the pattern formed on the electrode layer 40 is preferably 0.1 to 3 mm, and when the pattern and the pattern spacing are less than 0.1 mm, the large-area sintering chuck 4 is manufactured There is a problem in that the electrostatic chuck 4 is expensive and time consuming, and the withstand voltage characteristic is deteriorated and the electrostatic attraction force is lowered. In forming the pattern and the pattern interval of 3 mm or more, But the electrostatic attraction force is lowered.

The print layer 30 and the electrode layer 40 formed on the print layer 30 are removed (step S7)

The electrode layer 40 formed on the print layer 30 is removed by blasting, milling, shot peening, or the like. The electrode layer 40 is formed on the print layer 30, Only the electrode layer 40 remains on the upper portion of the insulating layer 20 because the operator peels off the print layer 30 which is easily peeled off after the removal of the insulating layer 40.

The electrode layer 40 is formed on the insulating layer 20 so as to cover the electrode layer 40. The electrode layer 40 is spray-coated with a powder for thermal spraying of a ceramic material in a thickness of 0.1 to 1 mm, And the dielectric layer 50 is formed (step S8)

In this case, the dielectric layer 50 is formed by spray coating with an amorphous ceramic material. The dielectric layer 50 may be formed of a material such as Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC, TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, SiO 2, SiC, YAG, Mullite, and AlF 3, or a mixture of two or more of them.

The dielectric layer 50 is preferably formed by processing the flatness of the upper surface to 5 to 30 μm or less. When the flatness of the upper surface is reduced to 5 μm or less, the dielectric layer 50 is polished There is a problem that not only the time is long but also the cost is increased according to the polishing time, and when the flatness of the upper surface is machined to 30 μm or more, the attraction force is weakened.

The upper surface spaced from the outer side to the inner side is formed in the dielectric layer 50 in a predetermined pattern to form a protrusion 52 having a predetermined width on the upper side edge of the dielectric layer 50, And a plurality of protrusions 54 are formed on the surface.

The inside of the upper surface of the dielectric layer 50 is formed on the upper side edge of the dielectric layer 50 while being engraved by blasting, milling, shot peening or the like. .

It is preferable that the protrusions 54 are formed by processing the protrusions 54 in a pattern set at the time of forming the protrusions 52 and the heights of the protrusions 54 and the protrusions 52 are preferably the same will be.

The protrusions 52 and the protrusions 54 are preferably formed by embossing on the upper surface of the dielectric layer 50. The protrusions 52 and the protrusions 54 may be formed on the upper surface of the dielectric layer 50 without forming the protrusions 52 and the protrusions 54 on the dielectric layer 50, (4) may be used.

The large area electrostatic chuck 4 formed as described above is provided with a plurality of unillustrated portions for vertically penetrating the base material 2, the insulating layer 20, the electrode layer 40 and the dielectric layer 50 to supply helium gas. The holes 55 may be formed.

At this time, the spray holes 55 supply helium gas serving as a cooling gas to various flat panel or large-area display substrates adsorbed on the large-area electrostatic chuck 4, etc. to increase the temperature of various flat panel or large- And to reduce the defects caused by the defects.

The method of manufacturing a large area electrostatic chuck for a display substrate according to the present invention as described above is characterized in that a non-incombustible print layer 30 having a closely spaced pattern is formed on the insulating layer 20 by a silk screen printing method or an inkjet printing method An electrode layer 40 is formed to cover the insulating layer 20 and the print layer 30 on the upper portion of the insulating layer 20 and the upper portion of the print layer 30, The electrostatic chuck 4 is easily manufactured and the attracting force of the adsorbed material is increased by forming the electrode layer 40 having a closely spaced pattern by removing the electrode layer 40 formed on the upper portion of the electrostatic chuck 30 .

2: Base material 4: Large area electrostatic chuck
10: connector 20: insulating layer
30: print layer 40: electrode layer
50: Dielectric layer 52:
54: protrusion 55:

Claims (5)

The ceramic material may be one or two kinds selected from the group consisting of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC, TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, BN, SiO2, SiC, YAG, Mullite, A first step (S1) in which the base material (2) is formed in the form of a square plate, and the first step (S1) is performed;
Coating a powder for thermal spraying with a ceramic material to a thickness of 0.1 to 1 mm on the outer surface of the base material 2 and processing the upper surface of the base material 2 to have a flatness of 5 to 30 μm or less, S2);
(S3) connecting and connecting a connector (10) for supplying a voltage to the base material (2);
A fourth step (S4) of forming an insulating layer (20) by spray coating a spraying powder for thermal spraying of a ceramic material to a thickness of 0.1 to 1 mm on the base material (2);
A fifth step (S5) of forming a print layer (30) according to a pattern set on the insulating layer (20);
An electrode layer 40 made of a conductive material is formed by spray coating a metal powder spray coating to cover the top of the insulating layer 20 and the print layer 30 on the insulating layer 20 and the print layer 30 (Step S6);
A seventh step (S7) of removing the print layer (30) and the electrode layer (40) formed on the print layer (30);
The electrode layer 40 is formed on the insulating layer 20 so as to cover the electrode layer 40. The electrode layer 40 is spray-coated with a powder for thermal spraying of a ceramic material in a thickness of 0.1 to 1 mm, And an eighth step (S8) of forming the dielectric layer (50) by processing to a thickness of 30 占 퐉 or less. The method according to claim 1,
Wherein the printing layer (30) is formed by a silk screen printing method or an ink jet printing method. The method according to claim 1,
The printing layer 30 may be formed of an acrylic resin, hydroxyethyl methacrylate, butyl cellosolve, solvent naphtha, benzyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) Acrylate, isobutyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl Acrylate, 2-hydroxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydroperfuryl (meth) acrylate, hydroxyethyl (Meth) acrylate, glycerol (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2-hydroxypropyl Acrylate, 3-methoxy (Meth) acrylate, methoxytriethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxytripropylene glycol (Meth) acrylate, p-nonylphenoxypolyethylene glycol (meth) acrylate and p-nonylphenoxypolypropylene glycol (meth) acrylate, methyl ethyl ketone, methyl cellosolve, ethyl cell Propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 2-ethoxypropanol, diethylene glycol dimethyl ether, ethylene glycol dimethyl ether, , 2-methoxypropanol, 3-methoxybutanol, cyclohexanone, cyclopentanone, propylene glycol methyl ether Ethyl acetate, ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate and dipropyleneglycol monomethyl ether, in any of the group consisting of propyleneglycol ethyl ether acetate, propyleneglycol ethylether acetate, 3-methoxybutyl acetate, ethyl 3-ethoxypropionate, Wherein at least one of the first electrode and the second electrode is formed of a mixture of two or more materials. The method according to claim 1,
Wherein the printing layer (30) and the electrode layer (40) are formed to a thickness of 0.03 to 0.1 mm, respectively. The method according to claim 1,
The upper surface spaced from the outer side to the inner side is formed in the dielectric layer 50 in a predetermined pattern to form a protrusion 52 having a predetermined width on the upper side edge of the dielectric layer 50, And a plurality of protrusions (54) are formed on the surface of the substrate.

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