KR101589812B1 - Semi-conductive Nano Compound Blend and Components for Power Cable - Google Patents

Abstract

Disclosed is a semiconductive resin composition for a medium / high voltage power line, which can significantly reduce volume resistance while minimizing the content of carbon nanotubes in a semi-conductor resin composition for a high-voltage / high-voltage power line of a nanocomposite using a carbon nanotube. The present invention relates to a resin composition comprising 100 parts by weight of a base resin comprising a polyethylene derivative; 1 to 7 parts by weight of carbon nanotubes; 0.5 to 5 parts by weight of a conductive polymer; 0.1 to 1 part by weight of a primary antioxidant; 0.01 to 0.2 parts by weight of a secondary antioxidant; 0.5 to 3 parts by weight of a crosslinking agent; And 0.1 to 1 part by weight of a crosslinking accelerator. The present invention also provides a semiconductive resin composition for high-voltage / high-voltage power lines.

Description

TECHNICAL FIELD The present invention relates to a semi-conductive nano compound blend and a composition thereof,

The present invention relates to a semiconductive resin composition for high-voltage / high-voltage electric power lines, and more particularly, to a semiconducting resin composition for high-voltage / high-voltage electric power lines based on an experimental design with high heat resistance compared to conventional semiconductive materials.

Semi-conductor materials for medium / high-voltage power lines depend on imports due to high prices. Ethylene ethyl acrylate (EEA) and ethylene butyl acrylate (EBA) are currently used for ultra high voltage power lines, and ethylene vinyl acetate (EVA) is used as a semi-conductor material used in medium voltage lines.

Generally, a power line is composed of a conductor portion made of metal such as aluminum and copper, an insulating layer insulating the conductor from the outside, an inner semiconductive layer provided between the conductor and the insulating layer to protect the conductor and the insulating layer from electric shock, And a coating layer provided on the outer surface of the outer semiconductive layer to protect the power line itself. The structure of the outer semiconductive layer may be varied as required. , The required properties are slightly different because the purpose of use is somewhat different.

Various polymeric materials have been used to provide electrical insulation and semiconducting properties by power lines, and maintenance of power lines and continuous performance over a long period of time are required. Therefore, polymeric materials constituting power lines require appropriate electrical characteristics and durability, It is necessary to satisfy the characteristic of stably maintaining the initial performance. The purpose of using such a semi-conductive material is to protect the insulating layer by making the local electric field radially uniform because a high voltage may be applied to the insulating layer due to electric field distortion that may occur between the conductor of the power line and the neutral line. Therefore, in order to realize the original role of the semi-conductive material, conventional carbon black was added.

However, carbon black which imparts conductivity to a semiconductive material has a tendency to be easily generated due to its inherent properties such as electrical conductivity, mechanical properties and the like, when it is added in a large amount in an amount of about 30% by weight or more, There is a disadvantage in that the weight of the power line is increased and the transportation cost is increased and the productivity is decreased.

Accordingly, Japanese Patent Publication No. 1113207 discloses a resin composition for an ultra high-voltage power cable semiconductive layer having improved electrical characteristics and mechanical characteristics using carbon nanotubes, carbon nanotube dispersants, and crosslinking assistants.

In this patent, to improve the volume resistance, the content of carbon nanotubes is increased, or hybrid compounds of carbon nanotubes and carbon black are used. This is because, when a small amount of carbon nanotubes are added, volume resistivity is increased due to thermal expansion of the nanocomposite at high temperature crosslinking. That is, a small amount of carbon nanotubes of about 3 to 5 wt% is added to the nanocomposite, so that a large amount of the base resin is occupied. Therefore, in the high temperature crosslinking process of the nanocomposite, the electic path is broken due to the resin expansion, and the volume resistance is high after the crosslinking. In order to solve this problem, there is a problem that a large amount of carbon nanotubes should be added in an amount of about 15% by weight or more.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above problems, and it is an object of the present invention to provide a nanocomposite semiconducting resin composition for a high-voltage / high-voltage power line using carbon nanotubes, which is capable of minimizing the carbon nanotube content, Pressure / high-voltage power line.

In order to solve the above-mentioned problems, the present invention provides a resin composition comprising 100 parts by weight of a base resin made of a polyethylene derivative; 1 to 7 parts by weight of carbon nanotubes; 0.5 to 5 parts by weight of a conductive polymer; 0.1 to 1 part by weight of a primary antioxidant; 0.01 to 0.2 parts by weight of a secondary antioxidant; 0.5 to 3 parts by weight of a crosslinking agent; And 0.1 to 1 part by weight of a crosslinking accelerator. The present invention also provides a semiconductive resin composition for high-voltage / high-voltage power lines.

The base resin may be selected from the group consisting of ethylene ethyl acrylate copolymer, ethylene butyl acrylate copolymer, ethylene vinyl acetate copolymer and ehtylene methyl acrylate copolymer And at least one member selected from the group consisting of copper, aluminum, and combinations thereof.

And the base resin has a melt index (ASTM 1238, 190 ° C, 2.16 kgf) of 0.1 to 10 g / 10 min.

The conductive polymer may be at least one selected from the group consisting of polyaniline, polypyrrole, polythiophene, polyparaphenylene, polyparaphenylenevinylene, polyazine, poly- Characterized in that it is at least one selected from the group consisting of poly-p-phenylene sulfide, polyfurane, polyselenophene, and polyacetylene. A full-layer resin composition is provided.

The primary antioxidant may be 2,6-di-t-butyl-4-methylphenol, tetrakis [methylene-3- (3,5- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane), 2,2-methylene Bis (4-methyl-6-tert-butylphenol) and octadecyl-3,5-di-tertiary-butyl- Octadecyl-3,5-di-t-butyl-4-hydroxyhydrocinnamate. The present invention also provides a semi-conductor resin composition for high-voltage / high-voltage power lines.

The second antioxidant may be tris (2,4-di-t-butylphenyl) phosphite, bis (2,4-di-tert- Wherein the at least one selected from the group consisting of bis (2,4-di-t-butyl) pentaerythritol diphosphite and alkylester phosphite is at least one selected from the group consisting of bis To provide a resin composition.

The crosslinking agent may be at least one selected from the group consisting of 1,1- (tert-butylperoxy) -3,3,5-trimethylcyclohexane (TMC), 1,1- 4,4- (bis-butylperoxy) valerate (TVP), dicumylperoxide (DCP), 1,1-bis Butylperoxy-diisopropylbenzene (BPPB), benzoylperoxide (BPO), 2,5-dimethyl-2,5-ditertene 2,5-dimethyl-2,5-di-t-butylperoxyhexane (25B), tert-butylperoxybenzoate (Z), ditertiary-butylperoxide (2,5-dimethyl-2,5-di-t-butylperoxylhexane, Hexyne-3), di-t-butylperoxide (DTBP) and 2,5- And at least one member selected from the group consisting of a high-pressure / high-voltage power line.

The crosslinking accelerator may be at least one selected from the group consisting of ethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylolpropane trimethacrylate, and triallyl isocyanurate. Which is used for high-voltage / high-voltage power lines.

According to the present invention, by using a hybrid nanocomposite in which a conductive polymer is added together with a carbon nanotube in a nanocomposite semiconductive resin composition for a high-voltage / high-voltage power line using carbon nanotubes, carbon nanotubes It is possible to provide a semi-conductor full-layer resin composition for a medium / high-voltage power line which can greatly reduce the volume resistance while minimizing the tube content.

Hereinafter, preferred embodiments of the present invention will be described in detail. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Throughout the specification, when an element is referred to as "including " an element, it means that it can include other elements, not excluding other elements, unless specifically stated otherwise.

The present inventors have found that the use of carbon nanotubes in a semi-conductor resin composition for a high-voltage / high-voltage power line of a nano compound can significantly reduce volume resistance while minimizing the content of carbon nanotubes As a result of extensive studies, it has been found that when a base resin made of a polyethylene derivative is mixed with a hybrid nanocomposite in which a minimum amount of carbon nanotubes and a conductive polymer are added together with an antioxidant, a crosslinking agent and a crosslinking accelerator having an optimum composition, It is possible to greatly reduce the volume resistance while minimizing the nanotube content, leading to the present invention.

Accordingly, the present invention provides a resin composition comprising 100 parts by weight of a base resin comprising a polyethylene derivative; 1 to 7 parts by weight of carbon nanotubes; 0.5 to 5 parts by weight of a conductive polymer; 0.1 to 1 part by weight of a primary antioxidant; 0.01 to 0.2 parts by weight of a secondary antioxidant; 0.5 to 3 parts by weight of a crosslinking agent; And 0.1 to 1 part by weight of a crosslinking accelerator, based on the total weight of the composition. First, components constituting the resin composition according to the present invention will be described in detail.

In the present invention, it is preferable to select a polyethylene derivative in the form of a copolymer which is composed of a polyethylene derivative and can improve the filling property of the conductive particles.

Examples of such a polyethylene derivative include ethylene ethyl acrylate copolymer, ethylene butyl acrylate copolymer, ethylene vinyl acetate copolymer or ehtylene methyl acrylate, Copolymer, and preferably ethylene ethyl acrylate copolymer, ethylene butyl acrylate copolymer or ethylene vinyl acetate copolymer can be used.

Wherein the polyethylene derivative is required to have a suitable melt index for uniform blending with the additives and for improving the dispersibility of the additives. In the present invention, the polyethylene derivative preferably has a melt index (ASTM 1238, 190 캜, 2.16 kgf) of 0.1 to 10 g / 10 min, more preferably 0.5 to 3 g / 10 min. When the melt index is less than 0.1 g / 10 min, the melt strength and viscosity are high, which makes processing difficult and difficult to mix with additives. When the melt index is more than 10 g / 10 min, the processability is improved while the physical properties have.

The carbon nanotubes are mixed with a polyethylene derivative to form a matrix structure to improve the electrical conductivity and mechanical characteristics of a high-voltage / high-voltage direct current power line. The carbon nanotube is a conductive material that provides conductivity to a conventional resin composition for a semiconductive layer, Black, and the amount of power consumption during kneading and production of a semi-conductor full-layer resin composition is reduced to reduce the manufacturing cost, improve the extrusion productivity, reduce the hygroscopicity, suppress the space charge accumulation due to the smoothening of the extruded surface, Can be minimized.

In the present invention, a carbon nanotube, which is conventionally added in a large amount, is replaced with a carbon nanotube, and a small amount of carbon nanotubes are added to the carbon nanotube, thereby ensuring physical properties equal or superior to those of conventional semiconductive materials. A carbon nanotube refers to a nanomaterial having a diameter of several nanometers in size, having a shape of a tube made by rolling a graphene sheet made of carbon into a cylindrical shape. In particular, carbon nanotubes have mechanical strength of tens of times higher than that of high-strength alloys, electrical conductivity of more than copper, thermal conductivity of twice that of diamond, and stable thermal stability of atmospheric to 750 ° C., , Mechanical properties, and the like, and it is possible to reduce the input amount of carbon black, carbon fiber, and other conductive fillers in a large amount, so that it is possible to maintain the original processability and impact characteristics of the polymer.

In general, there are volume resistances in the important electrical properties required in the semiconductive layer material, and the volume resistivity is influenced by the conductive filler and crosslinking degree. Nanocomposites have the advantage of lowering the carbon nanotube content, but they can affect the volume resistivity because the proportion of the base resin is very large. That is, in the high-temperature crosslinking process of the nanocomposite, the conductive path is destroyed due to the resin expansion and the volume resistance is high, so that the carbon nanotubes can not be added in a large amount in excess of 15 wt%. However, the present invention solves this problem by using a hybrid nanocomposite in which a conductive polymer is added together with a small amount of carbon nanotubes to greatly reduce the volume resistance.

Therefore, the content of the carbon nanotubes and the conductive polymer constituting the hybrid nanocomposite is very important in terms of improving the volume resistance.

In the present invention, the amount of the carbon nanotubes is preferably 1 to 7 parts by weight, more preferably 3 to 5 parts by weight, based on 100 parts by weight of the base resin. If the content of the carbon nanotubes is less than 1 part by weight, it may be difficult to prevent an increase in volume resistance despite the hybrid nanocomposite with the conductive polymer, and the specific gravity may be decreased to reduce the mechanical strength. If the content exceeds 7 parts by weight The weight ratio of the carbon black is lower than that of the conventional carbon black. However, since the specific gravity of the base resin is increased because the volume ratio is increased, the polymer as a product has a complete conductivity and thus can lose its original function as a semiconductive resin composition, But do not meet the purpose of the present invention by themselves.

As described above, the carbon nanotubes of the present invention contain much less than the conventional carbon black, and the same is true even when considering the hybrid nanocomposite content with the conductive polymer described later.

The kind of the carbon nanotubes is not particularly limited, but single wall carbon nanotubes or multi wall carbon nanotubes can be used.

The conductive polymer constitutes a hybrid nanocomposite together with the carbon nanotubes so that a volume resistivity equivalent to that of carbon nanotubes can be realized by adding a small amount of carbon nanotubes to the conventional carbon nanotubes.

In the present invention, it is preferable that the conductive polymer is an inherently conductive polymer (ICP) that conducts electricity. Examples of the conductive polymer include polyaniline, polypyrrole, polythiophene, polyparaphenylene, Polyparaphenylenevinylene, polyazine, poly-p-phenylene sulfide, polyfurane, polyselenophene, polyacetylene, polyacetylene, Etc. may be used, and more preferably, polyaniline, polypyrrole or polythiophene may be used. Among them, polypyrrole is the most effective conductive polymer for improving the volume resistance in a final resin composition comprising a hybrid nano compound together with a carbon nanotube and a polyethylene derivative as a base resin.

The conductive polymer may be contained in an amount of 0.5 to 5 parts by weight, preferably 1 to 3 parts by weight, based on 100 parts by weight of the base resin. If the content of the conductive polymer is less than 0.5 parts by weight, it may be difficult to exhibit satisfactory volume resistance improving effect. When the amount of the conductive polymer is more than 5 parts by weight, the dispersion may be difficult and complete conductivity may be lost and the original function as a semiconductive resin composition may be lost.

In the present invention, the antioxidant is added in order to prevent excessive oxidative deformation while imparting thermal stability of the base resin even at a high temperature or in an oxidizing atmosphere when the resin composition to be finally produced is used for high-pressure / high- It is important not only to suppress the crosslinking reaction by the crosslinking reaction but also to be able to withstand the high temperature during the crosslinking reaction and to contain the antioxidant of a certain kind in an optimum amount in order to satisfy the weatherability by long-term use by power line. Therefore, in the present invention, a primary antioxidant that inhibits the generation of an unstable free radical generated by an oxidative action or makes a free radical to a stable form, a hydroperoxide (hydroperoxide) formed by combining an unstable free radical with oxygen ) Is used in combination with a secondary antioxidant for inhibiting the generation of another unstable free radical which may be caused by oxidation of the base resin. Specifically, 0.1 to 1 part by weight of a primary antioxidant is added to 100 parts by weight of the base resin, Is used in an amount of 0.2 to 0.5 parts by weight and 0.01 to 0.2 parts by weight, preferably 0.02 to 0.1 part by weight, of a secondary antioxidant.

If the content of the first antioxidant is less than 0.1 part by weight or the content of the second antioxidant is less than 0.01 part by weight, the antioxidant power of the final resin composition may be weakened, and the heat resistance of the composition may be deteriorated. If the amount of the antioxidant is more than 1 part by weight or the amount of the second antioxidant is more than 0.2 part by weight, the effect of the antioxidant may be insufficient compared to the amount of the antioxidant, and the antioxidant may be transferred to the surface of the wire.

The primary antioxidant may be a phenol-based or amine-based antioxidant commonly used in the art to which the present invention pertains, preferably 2,6-di-tertiary-butyl-4-methylphenol (2 , 6-di-t-butyl-4-methylphenol), tetrakis [methylene-3- (3,5-di- tert- butyl-4-hydroxyphenyl) propionate] methane - (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, 2,2-methylenebis (4-methyl -6-t-butylphenol), octadecyl-3,5-di-t-butyl-4-hydroxyhydrocinnamate .

The secondary antioxidant may be a phosphorus-based or thio-based antioxidant commonly used in the art to which the present invention belongs, preferably tris (2,4-di-tertiary-butylphenyl) phosphite bis (2,4-di-t-butyl) pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) phosphite, Alkylester phosphite and the like can be used.

In the present invention, the crosslinking agent is used to improve the heat resistance and physical properties by changing the structure of the base resin into a crosslink structure, thereby contributing to the improvement of the longevity in application of the electric wire to the semiconductive layer. At this time, the crosslinking agent generates a radical to cause a crosslinking reaction, and the antioxidant acts as a radical scavenger, which may affect the crosslinking. Therefore, in order to maximize the degree of crosslinking, it is necessary to add a large amount of crosslinking agent to the antioxidant. In the present invention, the amount of the antioxidant contained in the antioxidant ranges from 100 parts by weight To be contained in an amount of 0.5 to 3 parts by weight, preferably 0.8 to 2 parts by weight, based on the total weight of the composition.

If the content of the crosslinking agent is less than 0.5 parts by weight, crosslinking may not be sufficiently carried out and the physical properties of the final product may be deteriorated. If the amount exceeds 3 parts by weight, the excessive amount of the crosslinking agent may deteriorate the formability upon wire extrusion, The foreign matter may be observed on the surface of the final product.

In consideration of the crosslinking property and compatibility of the base resin, the crosslinking agent is preferably 1,1- (tert-butylperoxy) -3,3,5-trimethylcyclohexane (1,1- , 3,5-trimethylcyclohexane (TMC), n-butyl-4,4- (bis-butyl peroxy) valerate (TVP), dicumyl peroxide dicumylperoxide (DCP), 1,1-bis (tert-butylperoxy) -diisopropylbenzene (BPPB), benzoylperoxide (BPO) 2,5-dimethyl-2,5-di-t-butylperoxyhexane (25B), tert-butylperoxybenzoate (t- butylperoxybenzoate (Z), di-t-butylperoxide (DTBP), 2,5-dimethyl-2,5-di-tert- butylperoxylhexane , 5-di-t-butylperoxylhexane, Hexyne-3) and the like are preferably used, but are not limited thereto.

When the cross-linking agent and the antioxidant are added together in an amount exceeding the proper amount, the preliminary thermal decomposition of the excessive amount of the cross-linking agent results in a local premixed portion such as a scorch during the extrusion process.

Therefore, in the present invention, by using the crosslinking accelerator, it is possible to increase the amount of the antioxidant added to increase the thermal oxidation stability to increase the thermal oxidation stability of the crosslinked polyethylene derivative, to reduce the scorching phenomenon as an early crosslinking phenomenon, And serves to complement the function of lowering the crosslinking efficiency of the crosslinking agent.

As such a crosslinking accelerator, ethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylolpropane trimethacrylate, triallyl isocyanurate and the like may be used in the present invention. The amount of the crosslinking accelerator may be 0.1 to 1 part by weight based on 100 parts by weight of the base resin, and preferably 0.3 to 0.7 part by weight. When the content of the crosslinking accelerator is less than 0.1 part by weight, the effect of accelerating the crosslinking may not be satisfactory. When the amount of the crosslinking accelerator is more than 1 part by weight, excessive crosslinking may be promoted and premature crosslinking may occur.

The resin composition according to the present invention may further contain another additive depending on the purpose of use within the scope of the present invention. As additional additives, flame retardants, processing aids, inorganic additives, crosslinking aids, etc. may be added alone or in admixture of two or more in the range of general use, and 0.1 to 10 parts by weight .

The resin composition according to the present invention can be simply manufactured by applying a melt mixing method. That is, it can be produced by melt mixing the additives except the polyethylene derivative and the cross-linking agent under specific conditions, stabilizing the composition for a predetermined time, adding the cross-linking agent and crosslinking the mixture under specific conditions in the press.

Specifically, 1 to 7 parts by weight of carbon nanotubes, 0.5 to 5 parts by weight of a conductive polymer, 0.1 to 1 part by weight of a primary antioxidant, 0.01 to 0.2 parts by weight of a secondary antioxidant, and 0.1 to 5 parts by weight of a crosslinking accelerator are added to 100 parts by weight of a polyethylene derivative. And mixing the resultant mixture at a temperature ranging from 20 to 40 rpm, 40 to 60 rpm and 70 to 90 rpm in a Brabender mixer at 100 to 120 ° C for 3 to 5 minutes while raising the mixing speed for 8 to 15 minutes; Immersing the mixture in the mixing step at room temperature for about 24 hours, and impregnating 0.5 to 3 parts by weight of the crosslinking agent in an oven at 90 to 110 DEG C with the nanocomposite; And a cross-linking step of cross-linking at a temperature of 150 to 200 DEG C for 7 to 20 minutes so as to cause decomposition of the added cross-linking agent and cross-linking reaction. Here, considering the preferable composition of the present invention at a temperature outside the melting-mixing temperature range, it may be difficult to uniformly mix and disperse the additives, and when the stabilization is not performed, sufficient crosslinking characteristics are hardly exhibited in the subsequent crosslinking treatment, At a temperature outside the press temperature range, crosslinking may be insufficient or moldability may be deteriorated.

Hereinafter, a specific embodiment of the present invention will be described.

Example  One

3 parts by weight of carbon nanotubes, 1 part by weight of polypyrrole as a conductive polymer, and 0.25 parts by weight of 2,6-di-tert-butyl-4-methylphenol as a primary antioxidant were added to 100 parts by weight of ethylene ethyl acrylate copolymer as a polyethylene derivative 0.05 part by weight of tris (2,4-di-tertiary-butylphenyl) phosphite as a secondary antioxidant and 0.5 part by weight of triallyl isocyanurate as a crosslinking accelerator were added, and the mixture was stirred at 30 rpm in a Brabender mixer at 110 ° C., The mixture was melt-mixed for 8 to 15 minutes while raising the mixing speed at 50 rpm and 80 rpm, and the mixture was stabilized at room temperature for 24 hours. 1 kg of 1,1- (tertiarybutylperoxy) -3,3,5-trimethylcyclohexane Was impregnated with the nanocomposite in an oven at 90 to 110 캜 and crosslinked at a temperature of 150 to 200 캜 for 7 to 20 minutes to prepare a resin composition specimen.

Example  2

A resin composition specimen was prepared in the same manner as in Example 1, except that 2 parts by weight of polypyrrole was added in Example 1.

Example  3

A resin composition specimen was prepared in the same manner as in Example 1, except that 3 parts by weight of polypyrrole was added in Example 1.

Example  4

A resin composition specimen was prepared in the same manner as in Example 1, except that 5 parts by weight of carbon nanotubes were added in Example 1.

Example  5

A resin composition specimen was prepared in the same manner as in Example 1, except that 2 parts by weight of polypyrrole and 5 parts by weight of carbon nanotubes were added in Example 1.

Example  6

A resin composition specimen was prepared in the same manner as in Example 1, except that 3 parts by weight of polypyrrole and 5 parts by weight of carbon nanotubes were added in Example 1.

Comparative Example  One

A resin composition specimen was prepared in the same manner as in Example 1, except that polypyrrole and triallyl isocyanurate were not added in Example 1.

Comparative Example  2

A resin composition specimen was prepared in the same manner as in Example 1, except that polypyrrole and triallyl isocyanurate were not added in Example 4.

The composition (unit: parts by weight) of the resin composition according to the above Examples and Comparative Examples is summarized in Table 1 below.

Experimental Example

The volume resistivity and the degree of crosslinking of the resin compositions prepared according to Examples and Comparative Examples were measured in the following manner, and the results are shown in Table 2 below. In the case of volume resistance, the measurement results are also shown for ungraded specimens for reference.

[Measurement method of volume resistance]

The specimens prepared according to Examples and Comparative Examples were measured using a measuring instrument (Ultra High Resistance Meter, ADVANTEST R8340A, Japan).

[Crosslinking degree measuring method]

ASTM D2765 method.

First, in the case of using the hybrid nanocomposite in which the conductive polymer and the carbon nanotube are added in an optimum amount, the volume resistivity of the carbon nanotube according to the present invention is lowered to 10 ⁵ Ω · cm or less in spite of the application of a small amount of carbon nanotubes . On the other hand, the volume resistivity was measured to be lower as the conductive polymer content increased, and the volume resistivity was lower when the carbon nanotube was added in an amount of 5 parts by weight. On the other hand, when the conductive polymer and the crosslinking accelerator were not added, the volume resistivity was not measurable.

Next, the degree of crosslinking increased with the increase of the conductive polymer content and the degree of crosslinking decreased with the addition of the conductive polymer and the crosslinking accelerator. This indicates that the crosslinking agent is affected by the crosslinking promoter and the conductive polymer, and in particular, the crosslinking degree is increased as the conductive polymer content is increased. The increase in the degree of crosslinking also means that the crosslinking efficiency is improved. Therefore, it can be seen that the crosslinking stability of the hybrid nano compound is improved along with the volume resistance.

The preferred embodiments of the present invention have been described in detail above. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning, range, and equivalence of the claims are included in the scope of the present invention Should be interpreted.

Claims (8)

In a semi-conductor full-layer resin composition for medium / high-voltage power lines,
100 parts by weight of a base resin composed of a polyethylene derivative; A hybrid nano compound comprising 1 to 7 parts by weight of carbon nanotubes and 0.5 to 5 parts by weight of a conductive polymer as a conductive material for providing conductivity to the semiconductive composition resin composition; 0.1 to 1 part by weight of a primary antioxidant; 0.01 to 0.2 parts by weight of a secondary antioxidant; 0.5 to 3 parts by weight of a crosslinking agent; And 0.1 to 1 part by weight of a crosslinking accelerator. The method according to claim 1,
The base resin may be selected from the group consisting of ethylene ethyl acrylate copolymer, ethylene butyl acrylate copolymer, ethylene vinyl acetate copolymer and ethylene methyl acrylate copolymer Wherein the resin composition is at least one selected from the group consisting of polyvinyl chloride resin and polyvinyl chloride resin. The method according to claim 1,
Wherein the base resin has a melt index (ASTM 1238, 190 캜, 2.16 kgf) of 0.1 to 10 g / 10 min. The method according to claim 1,
The conductive polymer may be at least one selected from the group consisting of polyaniline, polypyrrole, polythiophene, polyparaphenylene, polyparaphenylenevinylene, polyazine, poly-p-phenyl Wherein the at least one layer is at least one selected from the group consisting of poly-p-phenylene sulfide, polyfurane, polyselenophene, and polyacetylene. Resin composition. The method according to claim 1,
The primary antioxidant may be 2,6-di-t-butyl-4-methylphenol, tetrakis [methylene-3- (Tert-butyl-4-hydroxyphenyl) propionate] methane (Tetrakis [methylene-3- (4-methyl-6-t-butylphenol) and octadecyl-3,5-di-tertiary-butyl-4-hydroxy Wherein the resin composition is at least one selected from the group consisting of octadecyl-3,5-di-t-butyl-4-hydroxyhydrocinnamate. The method according to claim 1,
The second antioxidant may be tris (2,4-di-t-butylphenyl) phosphite, bis (2,4-di-tert-butylphenyl) phosphite, ) Pentaerythritol diphosphite, bis (2,4-di-t-butyl) pentaerythritol diphosphite, and alkylester phosphite. Composition. The method according to claim 1,
The crosslinking agent is selected from the group consisting of 1,1- (tert-butylperoxy) -3,3,5-trimethylcyclohexane (TMC), 1,1- 4,4- (bis-butylperoxy) valerate (TVP), dicumylperoxide (DCP), 1,1-bis -Butylperoxy-diisopropylbenzene (BPPB), benzoylperoxide (BPO), 2,5-dimethyl-2,5-di-tertiary 2,5-dimethyl-2,5-di-t-butylperoxyhexane (25B), tert-butylperoxybenzoate (Z), ditertiary-butylperoxide di-t-butylperoxide (DTBP) and 2,5-dimethyl-2,5-di-t-butylperoxylhexane (Hexyne-3) Wherein the resin composition is at least one selected from the group consisting of polyvinyl chloride resin and polyvinyl chloride resin. The method according to claim 1,
Wherein the crosslinking accelerator is 2 ethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylol propane trimethacrylate, and triallyl isocyanurate. (1).