KR101581669B1 - Multi-frequency driving type particle attachment preventing apparatus and particle attachment preventing method using the same - Google Patents

Multi-frequency driving type particle attachment preventing apparatus and particle attachment preventing method using the same Download PDF

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KR101581669B1
KR101581669B1 KR1020140096173A KR20140096173A KR101581669B1 KR 101581669 B1 KR101581669 B1 KR 101581669B1 KR 1020140096173 A KR1020140096173 A KR 1020140096173A KR 20140096173 A KR20140096173 A KR 20140096173A KR 101581669 B1 KR101581669 B1 KR 101581669B1
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South Korea
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frequency
signal
sub
main
frequency signal
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KR1020140096173A
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Korean (ko)
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이영진
김세기
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한국세라믹기술원
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Abstract

A multi-frequency drive type apparatus for preventing adhesion of internal by-products in piping and a method of preventing adhesion of internal by-products using the multi-frequency drive system by using a multi-frequency drive system when driving the ultrasonic wave can be effectively prevented.
According to the present invention, there is provided a multi-frequency driving type piping internal byproduct preventing device comprising: a vacuum chamber; A vacuum pump provided in the vacuum chamber; A pipe through which the byproducts are transferred through the vacuum pump; A scrubber for treating by-products transferred through the pipe; And an ultrasonic generator for providing vibration to the pipe, wherein the ultrasonic generator includes: an oscillation device composed of an energy conversion material that converts an input electric signal into a vibration signal; and a main body adapted to the resonance or antiresonance frequency of the oscillation device, Frequency signal and a multi-frequency drive module for providing a multi-frequency signal in which at least one sub-frequency signal is combined in a neighboring band of the main frequency signal.

Description

TECHNICAL FIELD [0001] The present invention relates to a multi-frequency driving system, and more particularly, to a multi-frequency driving system and a piping system,

[0001] The present invention relates to an apparatus for preventing adhesion of a by-product in a pipe and a method of preventing adhesion of a by-product in the pipe using the same, and more particularly to a multi-frequency drive system And a method for preventing adhesion of by-products in a pipe using the same.

2. Description of the Related Art [0002] Generally, in a manufacturing process of a semiconductor and a liquid crystal display (LCD), a wafer or a glass substrate is patterned to form a desired pattern, a wafer or a glass substrate is cut to a desired size, A lining process and a packing process.

At this time, the pattern forming process can be classified into a photoresist coating process, a diffusion process (CVD PVD), an etching process (dry, wet etching), an ion implantation process, and a cleaning process.

Among them, the deposition process and the etching process mainly decompose necessary gases with plasma and heat source in vacuum equipment, and perform deposition and etching. However, by-products are generated during the process, and the by-products are discharged through the pipe.

If byproducts are transported through the piping, by-products are accumulated on the inner wall of the piping due to various causes (for example, temperature difference), and as a result, the piping is blocked.

In order to solve this problem, recently, a technique of removing the by-products in the pipe by generating vibration by connecting to the outside of the pipe has been introduced, but most of them use a method of applying ultrasonic vibration through a single frequency driving signal. It is difficult to effectively remove the by-products in the piping.

A related prior art is Korean Patent Laid-Open Publication No. 10-2001-0090301 (published October 18, 2001), which discloses a plasma etching apparatus and an etching method using the same.

An object of the present invention is to provide an apparatus for preventing adhesion of internal by-products in a pipe of a multi-frequency driving system which can effectively prevent adhesion of internal by-products in a pipe by using a multi-frequency driving system when driving an ultrasonic wave, will be.

According to an aspect of the present invention, there is provided an apparatus for preventing adhesion of internal by-products to a piping in a multi-frequency driving system, A vacuum pump provided in the vacuum chamber; A pipe through which the byproducts are transferred through the vacuum pump; A scrubber for treating by-products transferred through the pipe; And an ultrasonic generator for providing vibration to the pipe, wherein the ultrasonic generator includes: an oscillation device composed of an energy conversion material that converts an input electric signal into a vibration signal; and a main body adapted to the resonance or antiresonance frequency of the oscillation device, Frequency signal and a multi-frequency drive module for providing a multi-frequency signal in which at least one sub-frequency signal is combined in a neighboring band of the main frequency signal.

According to an aspect of the present invention, there is provided a method of preventing adhesion of internal by-products to a piping in a multi-frequency driving system, the method comprising: (a) simultaneously inputting a main frequency signal and a sub- ; (b) generating a multi-frequency driving signal by combining the main frequency signal and the sub-frequency signal input from the main signal generator and the sub signal generator; And (c) outputting the multi-frequency driving signal to the vibration device, and applying vibration to the pipe.

The multi-frequency drive system of the present invention prevents multi-frequency drive by preventing the adhesion of internal by-products to the piping and the multi-frequency drive system that drives the sub- It is possible to more effectively prevent the byproducts from adhering to the inside of the pipe and to remove the internal by-products adhering to the pipe, It is possible to improve the efficiency of the equipment and improve the productivity.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing an apparatus for preventing adhesion of internal by-products in a piping according to an embodiment of the present invention. FIG.
FIG. 2 is an enlarged view of the multi-frequency driving module of FIG. 1. FIG.
3 is a view showing a modification of the multi-frequency driving module.
4 is a graph showing the waveform of the main input signal.
5 is a graph showing a waveform of a sub input signal.
6 is a graph showing a summed waveform of main and sub input signals.
FIG. 7 is a process flow chart illustrating a method of preventing adhesion of internal by-products in a pipe of a multi-frequency driving system according to an embodiment of the present invention.
FIG. 8 is a process schematic diagram showing a method for preventing adhesion of internal by-products in a pipe of a multi-frequency driving system according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a multi-frequency driving system according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view showing an apparatus for preventing adhesion of internal by-products in a pipe of a multi-frequency driving system according to an embodiment of the present invention, and FIG. 2 is an enlarged view of the multi-frequency driving module of FIG.

Referring to FIGS. 1 and 2, an apparatus 100 for preventing internal by-pipe adhesion of piping in a multi-frequency driving system according to an embodiment of the present invention includes a vacuum chamber 110, a vacuum pump 120, a pipe 130, A scrubber 140 and an ultrasonic generator 150.

In the vacuum chamber 110, any one selected from a photolithography process, an ion implantation process, a deposition process, an etching process, and a cleaning process is performed. During this process or after the process, by-products are generated, and such by-products are transferred to the scrubber 140 through the pipe 130.

The vacuum pump 120 is mounted on one wall surface of the vacuum chamber 110 to exhaust the byproducts generated in the vacuum chamber 110. The vacuum pump 120 may be mounted on the outer wall of the vacuum chamber 110, but it is not limited thereto and may be mounted on the inner wall of the vacuum chamber 110.

The pipe 130 is connected to the rear end of the vacuum pump 120 to connect the vacuum chamber 110 and the scrubber 140. Byproducts generated during or after the process in the vacuum chamber 110 by the pipe 130 can be transferred to the scrubber 140. At this time, the pipe 130 is a part where the by-product moves, and may be clogged by by-products when used for a long period of time. Therefore, it is necessary to replace the piping 130 or to perform maintenance, which causes the productivity to be lowered because the operation of the equipment must be stopped irrespective of the performance of the equipment.

Therefore, by installing the ultrasonic generator 150 on the outer wall of the pipe 130, it is possible to prevent the byproducts from adhering to the inside of the pipe 130, or to delay the adherence of byproducts.

The scrubber 140 is connected to the vacuum chamber 110 through a pipe 130. The scrubber 140 processes the byproducts conveyed through the piping 130.

The ultrasonic generator 150 is located on the outer wall of the pipe 130. The ultrasonic generator 150 includes an oscillation device 152 composed of an energy conversion material that converts an input electrical signal into a vibration signal, a main frequency signal adapted to the resonance or antiresonance frequency of the oscillation device 152, Frequency drive module 154 for providing a multi-frequency signal in which at least one or more sub-frequency signals are combined in a neighboring band of the multi-frequency drive module 154. [

At this time, a magnetostrictive element or a piezoelectric element can be used as the vibration device 152. The piezoelectric element may be formed of a piezoelectric material or a magnetostrictive material in which elastic deformation occurs. As a material of such a piezoelectric element is Ni, Fe-Co, Fe- Al, Zn-ferrite, Pb (Zr, Ti) O 3 + Pb (Zn, Nb) O 3, Pb (Zr, Ti) O 3 + Pb (Ni, Nb) O 3, can Pb (Zr, Ti) O 3 + PVDF polymer, Pb (Zr, Ti) O 3 + silicone polymer, Pb (Zr, Ti) O 3 + 1 or more kinds selected from an epoxy polymer may be used.

The multi-frequency driving module 154 includes a main signal generating unit 154a, a sub signal generating unit 154b, a multi-frequency generating unit 154c, and a multi-frequency processing unit 154d.

The main signal generator 154a generates a main frequency signal, and the sub signal generator 154b generates a sub frequency signal.

The multi-frequency generating unit 154c generates a multi-frequency driving signal by combining the main frequency signal and the sub-frequency signal input from the main and sub signal generators 154a and 154b, respectively.

The multi-frequency processing unit 154d outputs the multi-frequency driving signal input to the multi-frequency generating unit 154c to the vibration device 152, and applies the vibration to the pipe 130. [ By applying vibration to the pipe 130 by using the multi-frequency driving module 154 as described above, the by-product floating inside the pipe 130 can be prevented from vibrating on the inner wall of the pipe 130 by vibrating the pipe 130 So that it can be prevented from being attached.

In particular, the multi-frequency processing unit 154d generates a multi-frequency driving signal, which is a harmonic signal of sum and difference between the main frequency signal and the sub frequency signal, by applying the main frequency signal and the sub frequency signal at the same time.

Here, the multi-frequency driving signal means multi-frequency driving having two or more frequency components in a neighboring band of the main frequency, which is not the single frequency driving but the center frequency. At this time, the main frequency may have a range of 20 kHz to 10 MHz. For example, when the main frequency is 28 kHz, the sub-frequency may be 26 kHz, resulting in a combined drive of 26 kHz and 28 kHz.

Therefore, it is preferable that the sub-frequency has a frequency different from the main frequency. More preferably, the sub-frequency is selected to be within the frequency range of the adjacent frequency band of the main frequency but within the main frequency x 2, which must be simultaneously driven with two or more multiple frequencies, As a result, it is possible to simultaneously drive various vibration modes by increasing the probability of additionally generating various sub-resonance / antiresonance frequencies near the main / sub frequency.

Conventionally, a single frequency signal such as a sine wave or a rectangular wave is mainly applied to the resonance / antiresonance frequency of the vibration device in order to maximize the vibration efficiency.

Alternatively, in the present invention, by applying the multi-frequency driving method that drives the sub-frequencies near the main frequency rather than the single frequency driving, composite vibrations having a plurality of vibration frequencies are generated, And it is also possible to remove the internal byproducts that have been fixed in the pipe 130 together.

At this time, the multi-frequency driving signal processed by the multi-frequency driving module 154 is preferably provided in the form of a traveling wave to the pipe 130. If a driving signal of a single frequency is applied as in the conventional art, standing wave vibration occurs in the pipe 130. Accordingly, there may be a problem that an anti-node point where no vibration occurs occurs.

In contrast, according to the present invention, a traveling wave is generated by providing a multi-frequency driving signal, thereby preventing an anti-node point from being generated. Here, the multi-frequency processing unit 154d may include a VCO (Voltage Controlled Oscillator) circuit. Further, it may be constituted by various circuits which are conventionally known.

3 is a diagram showing a modification of the multi-frequency driving module.

The multi-frequency driving module 154 shown in FIG. 3 has substantially the same configuration except for the detailed configuration of the multi-frequency driving module and the sub-signal generating unit of FIG. 2, and a repeated description thereof will be omitted.

In this case, the sub-signal generator 154b of the multi-frequency driving module 154 according to the modification may include a first sub-signal generator 154b-1 for generating a first sub-frequency signal, And a n-th sub-signal generator 154b-n for generating an n-th sub-frequency signal. That is, the first to n-th sub signal generating units 154b-1 to 154b-n generate first to nth sub frequency signals which are two or more sub frequency signals.

In this way, when one main frequency signal and two or more sub-frequency signals, that is, first through nth sub-frequency signals, are simultaneously driven, a sum signal and a harmonic signal of the driving signal can be generated more efficiently As a result, it is possible to further increase the probability of additionally generating various sub-resonance / anti-resonance frequencies in the vicinity of the main frequency and the first to n-th sub-frequencies. Thus, It is possible to remove the internal byproducts fixed in the piping.

4 is a graph showing a waveform of a main input signal, FIG. 5 is a graph showing a waveform of a sub input signal, and FIG. 6 is a graph showing a summed waveform of main and sub input signals.

As shown in FIGS. 4 and 5, a main frequency signal is generated from a main signal generator, and a sub signal generator generates a main frequency waveform and a sub frequency waveform when a sub frequency signal is generated, respectively.

At this time, as shown in FIG. 6, there is shown a multi-frequency which is a sum waveform that appears when two multi-frequency signals, i.e., a main frequency signal and a sub-frequency signal are simultaneously driven. In this case, a sum signal and a harmonic signal between the main frequency signal and the sub frequency signal are generated. As a result, the probability of generating various sub-resonance / anti-resonance frequencies near the main / sub frequency is increased, The maximum vibration can be realized. As a result, it is possible to prevent the byproducts from adhering to the inside of the piping, and to remove the internal byproducts that have been fixed in the piping.

In the multi-frequency driving type piping internal by-product adherence prevention device according to the embodiment of the present invention, a plurality of vibration frequencies are applied by applying a multi-frequency driving method that multiples the sub- It is possible to more effectively prevent the byproducts from adhering to the inside of the piping and to remove the internal byproducts that have been fixed in the piping, As a result, equipment efficiency can be improved and productivity can be improved.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for preventing adhesion of internal by-products in a pipe according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 7 is a flow chart showing a method of preventing adhesion of internal by-products in a multi-frequency driving system according to an embodiment of the present invention, and FIG. 8 is a view illustrating a method of preventing multi- Fig.

As shown in FIGS. 7 and 8, the multi-frequency driving method of preventing internal product adherence of piping according to an embodiment of the present invention includes applying a main frequency signal and a sub frequency signal simultaneously (S210) Generating step S220 and applying to the multi-frequency driving signal oscillating device S230.

Simultaneous main frequency signal and sub frequency signal

In step S210, the main frequency signal f1 and the sub frequency signal f2 are input simultaneously from the main signal generator 154a and the sub signal generator 154b. At this time, the main frequency may have a range of 20 kHz to 10 MHz. For example, when the main frequency is 28 kHz, the sub-frequency may be 26 kHz, resulting in a combined drive of 26, 28 kHz.

Therefore, it is preferable that the sub-frequency has a frequency different from the main frequency. More preferably, the sub-frequency is selected to be within the frequency range of the adjacent frequency band of the main frequency but within the main frequency x 2, which must be simultaneously driven with two or more multiple frequencies, As a result, it is possible to simultaneously drive various vibration modes by increasing the probability of additionally generating various sub-resonance / antiresonance frequencies near the main / sub frequency.

Particularly, it is preferable to input the main frequency signal f1 and the sub frequency signal f2 at the same time, in order to additionally generate a sum signal and a harmonic signal of the respective driving signals at the same time.

Multi-frequency drive signal generation

In the multi-frequency driving signal generation step S210, the main frequency signal f1 and the sub-frequency signal f2 input from the main signal generation unit 154a and the sub signal generation unit 154b are combined to generate the multi-frequency driving signal f3 ).

At this time, the multi-frequency driving signal f3 means multi-frequency driving having two or more frequency components in a neighboring band of the main frequency, which is not the single frequency driving but the center frequency. The multi-frequency drive signal f3 is preferably output to the vibration device to provide vibration to the pipe in the form of a traveling wave.

Applied to multi-frequency drive signal vibration device

In the applying step S230 to the multi-frequency driving signal oscillating device, the multi-frequency driving signal f3 is outputted to the oscillating device to apply vibration to the pipe.

In this case, when a multi-frequency driving method for driving a sub-frequency in a band close to the main frequency is applied instead of a single frequency driving, when the frequency of the multi-frequency driving signal f3 is adjusted to the resonance or antiresonance frequency of the vibration device, The electric impedance is instantaneously lowered, and a relatively large current flows in the vibration device. As a result, vibration of a shock wave type caused by strong vibration of the vibration device is applied to the pipe, thereby preventing the by-products from sticking to the pipe, and also removing the internal by-products adhering to the pipe .

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

100: internal by-product adhesion prevention device 110: vacuum chamber
120: Vacuum pump 130: Piping
140: scrubber 150: ultrasonic generator
152: Vibrating device 154: Multi-frequency drive module
154a: Main signal generator 154b: Sub signal generator
154c: Multi-frequency generating unit 154d: Multi-frequency processing unit
S210: simultaneous application of main frequency signal and sub frequency signal
S220: Multi-frequency driving signal generating step
S230: Application step to multi-frequency driving signal oscillation device

Claims (15)

A vacuum chamber;
A vacuum pump provided in the vacuum chamber;
A pipe through which the byproducts are transferred through the vacuum pump;
A scrubber for treating by-products transferred through the pipe; And
And an ultrasonic generator for providing vibration to the pipe,
Wherein the ultrasonic generator includes a vibration device composed of an energy conversion material that converts an input electrical signal into a vibration signal, a main frequency signal adapted to the resonance or antiresonance frequency of the vibration device, and at least one Frequency drive module for providing a multi-frequency signal in which a sub-frequency signal is combined,
Wherein the main frequency signal has a frequency in the range of 20 kHz to 10 MHz and the sub frequency signal has a frequency different from the main frequency signal,
Wherein the sub frequency signal has a frequency range of a neighboring band of the main frequency signal and is selected within a main frequency × 2 times to generate a nearby sub-resonance frequency and a semi-vacuum frequency in addition to the main frequency and the sub- A device for preventing adhesion of internal by-products in a pipe of a multi-frequency drive system.
The method according to claim 1,
The multi-frequency drive module
A main signal generator for generating the main frequency signal,
A sub-signal generator for generating the sub-frequency signal,
A multi-frequency generator for generating a multi-frequency driving signal by combining the main frequency signal and the sub-frequency signal respectively input from the main and sub signal generators,
And a multi-frequency processing unit for outputting the multi-frequency driving signal inputted to the multi-frequency generating unit to the vibration device and applying vibration to the pipe.
3. The method of claim 2,
The multi-
Wherein the main frequency signal and the sub frequency signal are simultaneously applied to generate the multi frequency driving signal which is a harmonic signal of sum and difference between the main frequency signal and the sub frequency signal. Prevention device.
3. The method of claim 2,
The multi-frequency drive signal
Wherein the pipe is provided with a traveling wave in the form of a traveling wave.
3. The method of claim 2,
The multi-
And a VCO (Voltage Controlled Oscillator) circuit.
delete delete delete 3. The method of claim 2,
The sub-
A first sub-signal generator for generating a first sub-frequency signal,
A second sub-signal generator for generating a second sub-
And an n-th sub-signal generator for generating an n-th sub-frequency signal.
The method according to claim 1,
The vibrating device
Wherein the device is a magnetostrictive element or a piezoelectric element.
A method of preventing adhesion of internal by-products in a piping using the multi-frequency drive type piping internal by-product adhering prevention apparatus according to any one of claims 1 to 5, 9 and 10,
(a) simultaneously inputting a main frequency signal and a sub frequency signal from the main signal generator and the sub signal generator;
(b) generating a multi-frequency driving signal by combining the main frequency signal and the sub-frequency signal input from the main signal generator and the sub signal generator; And
(c) outputting the multi-frequency drive signal to the vibration device, and applying vibration to the pipe,
Wherein the main frequency signal has a frequency in the range of 20 kHz to 10 MHz and the sub frequency signal has a frequency different from the main frequency signal,
Wherein the sub frequency signal has a frequency range of a neighboring band of the main frequency signal and is selected within a main frequency × 2 times to generate a nearby sub-resonance frequency and a semi-vacuum frequency in addition to the main frequency and the sub- A method of preventing adhesion of internal by-products in a piping by a multi-frequency driving method.
12. The method of claim 11,
In the step (c)
The multi-frequency drive signal
Wherein a vibration is provided to the pipe in the form of a traveling wave.
delete delete delete
KR1020140096173A 2014-07-29 2014-07-29 Multi-frequency driving type particle attachment preventing apparatus and particle attachment preventing method using the same KR101581669B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002330690A (en) * 1997-11-19 2002-11-19 Hazama Gumi Ltd Method and device for preventing attachment of marine organism to structure built on ocean and corrosion thereof
KR100704421B1 (en) * 2005-10-26 2007-04-06 한국에너지기술연구원 Three-dimensional electronic anti-fouling device and method thereof
JP2011125815A (en) * 2009-12-18 2011-06-30 Canon Inc Drive circuit of vibration device, and driving method of vibration device
KR20140002821A (en) * 2012-06-26 2014-01-09 한국세라믹기술원 Particle attachment preventing apparatus by ultrasonic and system of particle attachment preventing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002330690A (en) * 1997-11-19 2002-11-19 Hazama Gumi Ltd Method and device for preventing attachment of marine organism to structure built on ocean and corrosion thereof
KR100704421B1 (en) * 2005-10-26 2007-04-06 한국에너지기술연구원 Three-dimensional electronic anti-fouling device and method thereof
JP2011125815A (en) * 2009-12-18 2011-06-30 Canon Inc Drive circuit of vibration device, and driving method of vibration device
KR20140002821A (en) * 2012-06-26 2014-01-09 한국세라믹기술원 Particle attachment preventing apparatus by ultrasonic and system of particle attachment preventing

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