KR101550955B1 - Polyimide film - Google Patents

Polyimide film Download PDF

Info

Publication number
KR101550955B1
KR101550955B1 KR1020120032669A KR20120032669A KR101550955B1 KR 101550955 B1 KR101550955 B1 KR 101550955B1 KR 1020120032669 A KR1020120032669 A KR 1020120032669A KR 20120032669 A KR20120032669 A KR 20120032669A KR 101550955 B1 KR101550955 B1 KR 101550955B1
Authority
KR
South Korea
Prior art keywords
dianhydride
polyimide film
repeating unit
unit derived
diaminodiphenylsulfone
Prior art date
Application number
KR1020120032669A
Other languages
Korean (ko)
Other versions
KR20130110589A (en
Inventor
김재일
정학기
박효준
Original Assignee
코오롱인더스트리 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코오롱인더스트리 주식회사 filed Critical 코오롱인더스트리 주식회사
Priority to KR1020120032669A priority Critical patent/KR101550955B1/en
Publication of KR20130110589A publication Critical patent/KR20130110589A/en
Application granted granted Critical
Publication of KR101550955B1 publication Critical patent/KR101550955B1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements

Abstract

본 발명은 폴리이미드 필름에 관한 것으로, 디아민계 모노머로서 3,3'-디아미노 디페닐 술폰(3DDS) 및 1,4-디아미노 사이클로헥산(TCHD)으로부터 유래된 반복단위와 디안하이드라이드계 모노머로부터 유래된 반복단위를 포함하는 폴리아미드산을 이미드화하여 제조되어, 투명하며 복굴절이 낮은 광학 특성을 나타내는 폴리이미드 필름에 관한 것이다.The present invention relates to a polyimide film, and more particularly, to a polyimide film which comprises a repeating unit derived from 3,3'-diaminodiphenylsulfone (3DDS) and 1,4-diaminocyclohexane (TCHD) as a diamine monomer and a repeating unit derived from a dianhydride monomer To a polyimide film which is transparent and which exhibits optical properties with low birefringence.

Description

폴리이미드 필름 {Polyimide film} Polyimide film [0002]

본 발명은 폴리이미드 필름에 관한 것으로, 투명하며 복굴절이 낮고 광학 특성이 우수한 폴리이미드 필름에 관한 것이다.The present invention relates to a polyimide film, and relates to a polyimide film which is transparent and has a low birefringence and an excellent optical property.

일반적으로 폴리이미드(PI) 필름은 폴리이미드 수지를 필름화한 것으로, 폴리이미드 수지는 방향족 디안하이드라이드와 방향족 디아민 또는 방향족 디이소시아네이트를 용액 중합하여 폴리아믹산 유도체를 제조한 후, 고온에서 폐환 탈수시켜 이미드화하여 제조되는 고내열 수지를 일컫는다.In general, a polyimide (PI) film is a film made of a polyimide resin, and a polyimide resin is produced by solution polymerization of an aromatic dianhydride and an aromatic diamine or aromatic diisocyanate to prepare a polyamic acid derivative, Refers to a high heat-resistant resin produced by imidization.

폴리이미드 필름은 뛰어난 기계적, 내열성, 전기절연성을 가지고 있기 때문에 반도체의 절연막, TFT-LCD의 전극 보호막 플랙시블 인쇄 배선 회로용 기판 등의 전자재료에 광범위한 분야에서 사용되어지고 있다. Since polyimide films have excellent mechanical, heat resistance and electrical insulation properties, they are used in a wide range of electronic materials such as semiconductor insulating films and substrates for flexible printed wiring circuits of electrode-protective films of TFT-LCD.

그러나 폴리이미드 수지는 높은 방향족 고리 밀도로 인하여 갈색 및 황색으로 착색되어 있어 가시광선 영역에서의 투과도가 낮고 노란색 계열의 색을 나타내어 광투과율을 낮게 하며 큰 복굴절률을 가지게 하여 광학부재로 사용하기에는 곤란한 점이 있다.  However, the polyimide resin is colored in brown and yellow due to its high aromatic ring density, and thus has low transmittance in the visible light region and yellowish color to lower the light transmittance and has a large birefringence, making it difficult to use the polyimide resin as an optical member have.

이러한 점을 해결하기 위하여 단량체 및 용매를 정제하여 중합하는 방법이 시도 되었으나, 투과율의 개선점은 크지 않았다.To solve this problem, a method of purifying monomers and a solvent and polymerizing them has been attempted, but the improvement of the transmittance has not been remarkable.

미국특허 제5053480호에는 방향족 디안하이드라이드 대신 지방족 고리계 디안하이드라이드 성분을 사용하는 방법이 기재되어 있는데, 정제방법에 비해서는 용액상이나 필름화하였을 경우 투명도 및 색상의 개선이 있었으나, 역시 투과도의 개선에 한계가 있어 높은 투과도는 만족하지 못하였으며, 또한 열 및 기계적 특성의 저하를 가져오는 결과를 나타내었다.U.S. Patent No. 5,053,480 discloses a method of using an aliphatic cyclic dianhydride component instead of an aromatic dianhydride. In comparison with the purification method, there is an improvement in transparency and color in the case of a solution phase or a film, And thus the high transmittance was not satisfied and the thermal and mechanical properties were deteriorated.

또한 미국특허 제4595548호, 제4603061호, 제4645824, 제4895972호, 제5218083호, 제5093453호, 제5218077호, 제5367046호, 제5338826호. 제5986036호, 제6232428호 및 대한민국 특허공개공보 제2003-0009437호에는 -O-, -SO2-, CH2- 등의 연결기와 p-위치가 아닌 m-위치로의 연결된 굽은 구조의 단량체이거나 -CF3 등의 치환기를 갖는 방향족 디안하이드라이드 이무수물과 방향족 디아민 단량체를 사용하여 열적 특성이 크게 저하되지 않는 한도에서 투과도 및 색상의 투명도를 향상시킨 신규 구조의 폴리이미드를 제조한 보고가 있으나, 복굴절에 있어서는 부족한 결과를 보였다.
U.S. Patent Nos. 4595548, 4603061, 4645824, 4895972, 5218083, 5093453, 5218077, 5367046, 5338826. 5986036 and 6232428 and Korean Patent Laid-Open Publication No. 2003-0009437 disclose monomers having a backbone structure connected to a linking group such as -O-, -SO 2 -, or CH 2 - and the like at an m-position other than the p-position There has been reported a novel structure of polyimide having improved transparency and color transparency as far as the thermal property is not significantly deteriorated by using aromatic dianhydride dianhydride and aromatic diamine monomer having a substituent such as -CF 3 , But showed insufficient results in birefringence.

본 발명은 투명하며 복굴절이 낮은 광학 특성을 나타내는 폴리이미드 필름을 제공하고자 한다.The present invention provides a polyimide film which is transparent and exhibits low birefringence optical properties.

이에 본 발명은 바람직한 제1 구현예로서, 디아민계 모노머로서 3,3'-디아미노 디페닐 술폰(3DDS) 및 1,4-디아미노 사이클로헥산(TCHD)으로부터 유래된 반복단위와 디안하이드라이드계 모노머로부터 유래된 반복단위를 포함하는 폴리아미드산을 이미드화하여 얻어지는 폴리이미드 필름를 제공한다.Accordingly, the present invention provides, as a first preferred embodiment, a resin composition comprising a repeating unit derived from 3,3'-diaminodiphenylsulfone (3DDS) and 1,4-diaminocyclohexane (TCHD) as a diamine monomer and a repeating unit derived from a dianhydride system There is provided a polyimide film obtained by imidizing a polyamic acid containing a repeating unit derived from a monomer.

상기 3,3'-디아미노 디페닐 술폰으로부터 유래된 반복단위는 그 함량이 전체 디아민계 모노머로부터 유래된 반복단위 중 30~90중량%인 것일 수 있다.The repeating unit derived from the 3,3'-diaminodiphenylsulfone may be 30 to 90% by weight of the repeating units derived from the entire diamine-based monomer.

상기 3,3'-디아미노 디페닐 술폰으로부터 유래된 반복단위는 그 함량이 전체 디아민계 모노머로부터 유래된 반복단위 중 30~70중량%인 것일 수 있다.The repeating unit derived from the 3,3'-diaminodiphenylsulfone may be 30 to 70% by weight of the repeating units derived from the entire diamine-based monomer.

상기 3,3'-디아미노 디페닐 술폰으로부터 유래된 반복단위는 그 함량이 전체 디아민계 모노머로부터 유래된 반복단위 중 50~70중량%인 것일 수 있다.The repeating unit derived from the 3,3'-diaminodiphenylsulfone may be 50 to 70% by weight of the repeating units derived from the entire diamine-based monomer.

상기 폴리이미드 필름은 복굴절이 0.003이하인 것일 수 있다.The polyimide film may have a birefringence of 0.003 or less.

상기 폴리이미드 필름은 Ro(면방향 위상차)가 1nm 이하이고, Rth(두께방향 위상차)가 70nm 이하(두께 35㎛)인 것임을 특징으로 하는 폴리이미드 필름.Wherein the polyimide film has a Ro (plane direction retardation) of 1 nm or less and an Rth (thickness direction retardation) of 70 nm or less (35 mu m in thickness).

상기 폴리이미드 필름은 평균 투과도가 85% 이상인 것일 수 있다.The polyimide film may have an average transmittance of 85% or more.

상기 디안하이드라이드계 모노머는 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드 (6FDA), 사이클로부탄테트라카르복실릭 디안하이드라이드 (CBDA), 비페닐테트라카르복실릭 디안하이드라이드 (BPDA), 바이시클로[2.2.2]옥트-7-엔-2,3,5,6-테트라카르복실릭 디안하이드라이드(BTA), 4-(2,5-디옥소테트라하이드로푸란-3-일)-1,2,3,4-테트라하이드로나프탈렌-1,2-디카르복실릭디안하이드라이드(TDA), 피로멜리틱산 디안하이드라이드(1,2,4,5-벤젠 테트라카르복실릭 디안하이드라이드(PMDA), 벤조페논 테트라카르복실릭 디안하이드라이드 (BTDA), 비스카르복시페닐 디메틸 실란 디안하이드라이드(SiDA), 옥시디프탈릭 디안하이드라이드(ODPA), 비스 디카르복시페녹시 디페닐 설파이드 디안하이드라이드 (BDSDA), 술포닐 디프탈릭안하이드라이드 (SO2DPA) 및 이소프로필리덴이페녹시 비스 프탈릭안하이드라이드(6HDBA) 중 선택된 1종 이상인 것일 수 있다.
The dianhydride monomer may be at least one selected from the group consisting of 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydride (6FDA), cyclobutane tetracarboxylic dianhydride (CBDA), biphenyltetracarboxyl Ricinanhydride (BPDA), bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BTA), 4- (2,5-dioxotetra (Tetrahydrofuran-3-yl) -1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic dianhydride (TDA), pyromellitic acid dianhydride Benzene tetracarboxylic dianhydride (PMDA), benzophenone tetracarboxylic dianhydride (BTDA), biscarboxyphenyldimethylsilanediamine hydride (SiDA), oxydiphthalic dianhydride (ODPA), bisdicarboxy phenoxy diphenyl sulfide dianhydride (BDSDA), sulfonyl adipic anhydride (SO 2 DPA) and the Talic The propylidene may be at least one selected from phenoxy-bis phthalic anhydride (6HDBA).

본 발명은 또한 바람직한 제2 구현예로서, 상기 폴리이미드 필름을 포함하는 영상표시소자를 제공한다.
The present invention also provides, as a second preferred embodiment, an image display device comprising the polyimide film.

본 발명에 따르면, 투명하며 복굴절이 낮고 광학 특성이 우수한 폴리이미드 필름을 제공할 수 있다.
According to the present invention, it is possible to provide a polyimide film which is transparent and has a low birefringence and an excellent optical property.

이하 본 발명을 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail.

본 발명은 무색 투명하고 광학적 특성이 우수한 종래 투명 폴리이미드 수지의 물성을 유지하면서도, 복굴절이 개선된 폴리이미드 필름에 관한 것으로, The present invention relates to a polyimide film improved in birefringence while maintaining physical properties of a conventional transparent polyimide resin which is colorless transparent and excellent in optical properties,

본 발명의 일 구현예에 따른 폴리이미드 필름은 디아민계 모노머로서 3,3'-디아미노 디페닐 술폰(3DDS) 및 1,4-디아미노 사이클로헥산(TCHD)으로부터 유래된 반복단위와 디안하이드라이드계 모노머로부터 유래된 반복단위를 포함하는 폴리아미드산을 이미드화하여 얻어지는 것일 수 있다.The polyimide film according to one embodiment of the present invention includes a repeating unit derived from 3,3'-diaminodiphenylsulfone (3DDS) and 1,4-diaminocyclohexane (TCHD) as a diamine monomer and a repeating unit derived from dianhydride Or may be obtained by imidizing a polyamic acid containing a repeating unit derived from a monomer.

이때, 3DDS은 그 함량인 전체 디아민 중 30~90중량%일 수 있고, 바람직하게는 30~70중량%, 더욱 바람직하게는 50~70중량%인 것일 수 있다. In this case, 3DDS may be 30 to 90% by weight, preferably 30 to 70% by weight, and more preferably 50 to 70% by weight, of the total diamine.

3DDS의 함량이 30중량% 미만이면 복굴절에 문제가 있고, 90중량% 초과이면 중합이 잘 되지 않아 필름 생성이 힘들 수 가 있다.If the content of 3DDS is less than 30% by weight, there is a problem in birefringence. If the content of 3DDS is more than 90% by weight, polymerization may not be performed well and film formation may be difficult.

또한, 3DDS의 함량이 70중량% 초과이면 중합점도가 충분히 자라지 않아 제막이 힘든 문제가 있고, 50 중량% 미만이면 복굴절 개선이 미미한 문제가 있다.When the content of 3DDS is more than 70% by weight, the polymerization viscosity is not sufficiently grown, and therefore, there is a problem that film formation is difficult. When the content is less than 50% by weight, improvement of birefringence is insufficient.

본 발명에서 사용되는 디안하이드라이드계 모노머는 특별히 한정되는 것은 아니나, 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드 (6FDA), 사이클로부탄테트라카르복실릭 디안하이드라이드 (CBDA), 비페닐테트라카르복실릭 디안하이드라이드 (BPDA), 바이시클로[2.2.2]옥트-7-엔-2,3,5,6-테트라카르복실릭 디안하이드라이드(BTA) 4-(2,5-디옥소테트라하이드로푸란-3-일)-1,2,3,4-테트라하이드로나프탈렌-1,2-디카르복실릭디안하이드라이드(TDA), 피로멜리틱산 디안하이드라이드(1,2,4,5-벤젠 테트라카르복실릭 디안하이드라이드 (PMDA), 벤조페논 테트라카르복실릭 디안하이드라이드 (BTDA), 비스카르복시페닐 디메틸 실란 디안하이드라이드(SiDA), 옥시디프탈릭 디안하이드라이드(ODPA), 비스 디카르복시페녹시 디페닐 설파이드 디안하이드라이드 (BDSDA), 술포닐 디프탈릭안하이드라이드 (SO2DPA), 이소프로필리덴이페녹시 비스 프탈릭안하이드라이드(6HDBA) 중 선택된 1종 이상 일 수 있다. The dianhydride-based monomer used in the present invention is not particularly limited, but may be 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA), cyclobutane tetracarboxylic dianhydride (CBDA), biphenyl tetracarboxylic dianhydride (BPDA), bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BTA) 4 - (2,5-dioxotetrahydrofuran-3-yl) -1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic dianhydride (TDA), pyromellitic acid dianhydride (1,2,4,5-benzene tetracarboxylic dianhydride (PMDA), benzophenone tetracarboxylic dianhydride (BTDA), biscarboxyphenyldimethylsilanediamine hydride (SiDA), oxydipthalic dianhydride Hydride (ODPA), bisdicarboxyphenoxy diphenylsulfide dianhydride (BDSDA), Sulfonated diphthalic anhydride (SO 2 DPA), and isopropylidene may be at least one selected from phenoxy bisphthalic anhydride (6HDBA).

위의 디안하이드라이드계 모노머와 디아민계 모노머를 1:1당량비로 하여, 반응온도 -10~80℃, 반응시간 2~48시간 정도, 질소 또는 아르곤 분위기에서 폴리아믹산 용액을 제조할 수 있다.The polyamic acid solution can be prepared in a nitrogen / argon atmosphere at a reaction temperature of -10 to 80 ° C and a reaction time of 2 to 48 hours at a 1: 1 equivalent ratio of the dianhydride monomer and the diamine monomer.

상기 단량체들의 용액 중합반응을 위한 용매는 폴리아믹산을 용해하는 용매이면 특별히 한정되지 않는다. 공지된 반응용매로서 m-크레졸, N-메틸-2-피롤리돈(NMP), 디메틸포름아미드(DMF), 디메틸아세트아미드(DMAc), 디메틸설폭사이드(DMSO), 아세톤, 디에틸아세테이트 중에서 선택된 하나 이상의 극성용매를 사용한다. 이외에도 테트라하이드로퓨란(THF), 클로로포름과 같은 저비점 용액 또는 γ-부티로락톤과 같은 저흡수성 용매를 사용할 수 있다.The solvent for the solution polymerization of the monomers is not particularly limited as long as it is a solvent dissolving the polyamic acid. As the known reaction solvent, there may be used, for example, m-cresol, N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), dimethylacetamide (DMAc), dimethylsulfoxide (DMSO) One or more polar solvents are used. In addition, a low boiling point solution such as tetrahydrofuran (THF), chloroform or a low-absorbency solvent such as? -Butyrolactone may be used.

용매의 함량에 대하여 특별히 한정되지는 않으나, 적절한 폴리아믹산 용액의 분자량과 점도를 얻기 위하여 제1용매의 함량은 전체 폴리아믹산 용액 중 50~95중량%가 바람직하고, 더욱 좋게는 70~90중량%인 것이 보다 바람직하다. The content of the first solvent is preferably 50 to 95% by weight, more preferably 70 to 90% by weight in the total polyamic acid solution in order to obtain the molecular weight and viscosity of the appropriate polyamic acid solution, Is more preferable.

이와 같이 제조된 폴리아믹산 용액을 이미드화하여 제조된 폴리이미드 수지는 열안정성을 고려하여 유리전이온도가 200~400℃인 것이 바람직하다.The polyimide resin prepared by imidizing the polyamic acid solution thus prepared preferably has a glass transition temperature of 200 to 400 ° C in consideration of thermal stability.

본 발명에 따른 투명 폴리이미드 필름 제조방법에 있어서, 중합된 폴리아믹산을 지지체에 캐스팅하여 이미드화하는 단계에서, 적용되는 이미드화법으로는 열이미드화법, 화학이미드화법, 또는 열이미드화법과 화합이미드화법을 병용하여 적용할 수 있다. In the method for producing a transparent polyimide film according to the present invention, in the step of casting and polymerizing the polymerized polyamic acid on a support, imidation methods to be applied include a thermal imidation method, a chemical imidation method, And can be applied by combination of the compounding method and the compounding method.

화학이미드화법은 폴리아믹산 용액에 아세트산무수물 등의 산무수물로 대표되는 탈수제와 이소퀴놀린, β-피콜린, 피리딘 등의 3급 아민류 등으로 대표되는 이미드화 촉매를 투입하는 방법이다. 열이미드화법 또는 열이미드화법과 화학이미드화법을 병용하는 경우 폴리아믹산 용액의 가열 조건은 폴리아믹산 용액의 종류, 제조되는 폴리이미드 필름의 두께 등에 의하여 변동될 수 있다.In the chemical imidation method, a dehydrating agent represented by an acid anhydride such as acetic anhydride and a imidation catalyst represented by tertiary amines such as isoquinoline, p-picoline, and pyridine are added to a polyamic acid solution. When the thermal imidation method or the thermal imidation method and the chemical imidization method are used in combination, the heating conditions of the polyamic acid solution may be varied depending on the type of the polyamic acid solution, the thickness of the polyimide film to be produced, and the like.

열이미드화법과 화학이미드화법을 병용하는 경우의 폴리이미드 필름의 제조예를 보다 구체적으로 설명하면, 폴리아믹산 용액에 탈수제 및 이미드화 촉매를 투입하여 지지체상에 캐스팅한 후 80~200℃, 바람직하게는 100~180℃에서 가열하여 탈수제 및 이미드화 촉매를 활성화함으로써 부분적으로 경화 및 건조한 후 , 200~400℃에서 5~400초간 가열함으로써 폴리이미드 필름을 얻을 수 있다. More specifically, a polyimide film is prepared by adding a dehydrating agent and an imidation catalyst to a polyamic acid solution. The polyamic acid solution is cast on a support, and then heated at 80 to 200 ° C, Preferably at 100 to 180 ° C to activate the dehydrating agent and the imidization catalyst to partially cure and dry the polyimide film, and then heat at 200 to 400 ° C for 5 to 400 seconds to obtain a polyimide film.

한편, 본 발명에서는 상기 수득된 폴리아믹산 용액으로부터 다음과 같이 폴리이미드 필름을 제조할 수도 있다. 즉, 수득된 폴리아믹산 용액을 이미드화한 후, 이미드화한 용액을 제2용매에 투입하고 침전, 여과 및 건조하여 폴리이미드 수지의 고형분을 수득하고, 수득된 폴리이미드 수지 고형분을 제1용매에 용해시킨 폴리이미드 용액을 이용하여 제막공정을 통하여 얻을 수 있다.In the present invention, a polyimide film may be prepared from the polyamic acid solution as follows. Namely, after the obtained polyamic acid solution is imidized, the imidized solution is put into a second solvent, followed by precipitation, filtration and drying to obtain a solid content of the polyimide resin, and the solid content of the obtained polyimide resin is added to the first solvent Can be obtained through a film-forming process using a dissolved polyimide solution.

상기 폴리아믹산 용액을 이미드화할 때는 상기 설명한 바와 마찬가지로 열이미드화법, 화학이미드화법, 또는 열이미드화법과 화합이미드화법을 병용하여 적용할 수 있다. 열이미드화법과 화학이미드화법을 병용하는 경우의 구체적인 이미드화의 예를 들면, 수득된 폴리아믹산 용액에 탈수제 및 이미드화 촉매를 투입하고 20~180℃에서 1~12시간동안 가열하여 이미드화할 수 있다.When the polyamic acid solution is imidized, the thermal imidation method, the chemical imidization method, or the thermal imidation method and the compound imidation method may be used in combination as described above. Examples of imidization in the case where the thermal imidation method and the chemical imidization method are used in combination include a method in which a dehydrating agent and an imidation catalyst are added to the obtained polyamic acid solution and heated at 20 to 180 ° C for 1 to 12 hours to form imide It can be changed.

상기 제1용매는 폴리아믹산 용액 중합시 사용한 용매와 동일한 용매를 사용할 수 있으며, 상기 제2용매는 폴리이미드 수지의 고형분을 수득하기 위하여 제1용매보다 극성이 낮은 것을 사용하며, 구체적으로는 물, 알코올류, 에테르류 및 케톤류 중 선택된 1종 이상인 것일 수 있다.The first solvent may be the same solvent as that used in the polymerization of the polyamic acid solution. The second solvent may be one having a lower polarity than the first solvent in order to obtain the solid content of the polyimide resin, Alcohols, ethers, and ketones.

이 때 상기 제2용매의 함량은 특별히 한정되는 것은 아니지만, 폴리아믹산 용액의 중량 대비 5~20중량%인 것이 바람직하다.At this time, the content of the second solvent is not particularly limited, but it is preferably 5 to 20% by weight based on the weight of the polyamic acid solution.

수득된 폴리이미드 수지 고형분을 여과한 후 건조하는 조건은 제2용매의 끓는점을 고려하여 온도는 50~120℃, 시간은 3시간~24시간인 것이 바람직하다.The polyimide resin solids obtained after filtration and drying are preferably subjected to a temperature of 50 to 120 캜 and a time of 3 to 24 hours in consideration of the boiling point of the second solvent.

이후 제막공정에서 폴리이미드 수지 고형분이 용해되어 있는 폴리이미드 용액을 지지체상에 캐스팅하여 40~400℃의 온도범위에서 서서히 승온시키면서 1분~8시간 가열하여 폴리이미드 필름을 얻는다.Thereafter, the polyimide solution in which the solid polyimide resin is dissolved is cast on a support, and heated at a temperature in the range of 40 to 400 ° C for 1 minute to 8 hours while gradually heating the polyimide solution to obtain a polyimide film.

얻어지는 폴리이미드 필름의 두께는 특별히 한정되는 것은 아니지만, 10~250㎛의 범위인 것이 바람직하고, 보다 바람직하게는 25~150㎛인 것이 좋다.The thickness of the obtained polyimide film is not particularly limited, but is preferably in the range of 10 to 250 탆, more preferably 25 to 150 탆.

이상에서 설명한 바와 같은 방법으로 얻어지는 폴리이미드 필름은 복굴절이 0.003이하이며, Ro(면방향 위상차)=1nm이하 Rth(두께방향 위상차)=70nm(35μm 기준) 이하이며, 평균투과도가 85%이상이다.
The polyimide film obtained by the method as described above has a birefringence of 0.003 or less, an R o (retardation in the thickness direction) of 70 nm or less (based on 35 μm) and an average transmittance of 85% or more.

이하, 본 발명을 실시예를 통하여 보다 상세히 설명하나, 본 발명의 범위가 하기 실시예로 한정되는 것은 아니다.
Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited to the following Examples.

<비교예 1> &Lt; Comparative Example 1 &

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 364.53g을 채운 후, 반응기의 온도를 60℃로 맞춘 후 TCHD 18.5g(0.162mol)과 3DDS 4.47g(0.018mol)을 용해하여 이 용액을 60℃로 유지하였다. 여기에 6FDA 55.98g(0.126mol)과 CBDA 10.59g(0.054mol)을 첨가한 후 1시간 동안 60℃에서 반응 시킨 후 25℃로 냉각하여 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 101 poise인 폴리아믹산 용액을 얻었다. 364.53 g of N, N-dimethylacetamide (DMAc) was charged into a 500-mL reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser while passing nitrogen through the reactor. 18.5 g (0.162 mol) of TCHD and 4.47 g (0.018 mol) of 3DDS were dissolved and the solution was maintained at 60 ° C. 55.98g (0.126mol) of 6FDA and 10.59g (0.054mol) of CBDA were added and reacted at 60 ° C for 1 hour and then cooled to 25 ° C and subjected to 18HR reaction to obtain a polymer having a solid content of 20% by weight and a viscosity of 101 poise solution of polyamic acid was obtained.

반응이 종료된 후 수득된 용액을 스테인레스판에 도포한 후 180㎛로 캐스팅하고 150℃의 열풍으로 1시간, 200℃에서 1시간, 300℃에서 30분 열풍으로 건조한 후 서서히 냉각해 판으로부터 분리하여 36㎛ 폴리이미드 필름을 수득하였다.
After the reaction was completed, the obtained solution was coated on a stainless steel plate, cast to 180 μm, dried with hot air at 150 ° C. for 1 hour, 200 ° C. for 1 hour and 300 ° C. for 30 minutes with hot air, 36 占 퐉 polyimide film was obtained.

<실시예 2> &Lt; Example 2 >

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 379g을 채운 후, 반응기의 온도를 60℃로 맞춘 후 TCHD 14.39g(0.126mol)을 용해하여 이 용액을 60℃로 유지하였다. 여기에 6FDA 55.98g(0.126mol)을 첨가하고, 1시간 동안 교반하여 반응시켰다. 그다음 반응기의 온도를 25℃ 냉각 후 여기에 3DDS 13.409g(0.054mol)를 첨가하여 완전히 용해 시켜 1시간 동안 반응 시켰다. 그 후 CBDA 10.59g(0.054mol)을 첨가한 후 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 82 poise인 폴리아믹산 용액을 얻었다. 379 g of N, N-dimethylacetamide (DMAc) was charged into a 500-mL reactor equipped with a stirrer, a nitrogen-introducing device, a dropping funnel, a temperature controller and a condenser while nitrogen was passed through the reactor. 14.39 g (0.126 mol) of TCHD was dissolved and the solution was maintained at 60 占 폚. 55.98 g (0.126 mol) of 6FDA was added thereto, and the mixture was reacted by stirring for 1 hour. Then, after the temperature of the reactor was cooled to 25 ° C, 13.409 g (0.054 mol) of 3DDS was added thereto, and the solution was completely dissolved and reacted for 1 hour. Thereafter, 10.59 g (0.054 mol) of CBDA was added, followed by 18HR reaction to obtain a polyamic acid solution having a solid content of 20 wt% and a viscosity of 82 poise.

이후 상기 비교예 1과 동일한 방법으로 기재 폴리이미드 필름을 제조하였다.
Thereafter, a base polyimide film was prepared in the same manner as in Comparative Example 1.

<실시예 3>&Lt; Example 3 >

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 403.16g을 채운 후, 반응기의 온도를 60℃로 맞춘 후 TCHD 10.28g(0.09mol)을 용해하여 이 용액을 60℃로 유지하였다. 여기에 6FDA 39.98g(0.09mol)을 첨가하고, 1시간 동안 교반하여 반응시켰다. 그다음 반응기의 온도를 25℃ 냉각 후 여기에 3DDS 22.348g(0.009mol)를 첨가하여 완전히 용해 시켜 1시간 동안 반응 시켰다. 그 후 CBDA 10.59g(0.054mol)와 6FDA 15.99g(0.036mol)을 첨가한 후 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 42poise인 폴리아믹산 용액을 얻었다. The reactor was charged with 403.16 g of N, N-dimethylacetamide (DMAc) while passing nitrogen through a 500-mL reactor equipped with a stirrer, a nitrogen inlet, a dropping funnel, a temperature controller and a condenser. 10.28 g (0.09 mol) of TCHD was then dissolved and the solution was maintained at 60 &lt; 0 &gt; C. 39.98 g (0.09 mol) of 6FDA was added thereto, and the mixture was reacted by stirring for 1 hour. Then, after the temperature of the reactor was cooled to 25 ° C, 22.348 g (0.009 mol) of 3DDS was added thereto, and completely dissolved and reacted for 1 hour. Thereafter, 10.59 g (0.054 mol) of CBDA and 15.99 g (0.036 mol) of 6FDA were added, followed by 18HR reaction to obtain a polyamic acid solution having a solid content of 20% by weight and a viscosity of 42 poise.

이후 상기 비교예 1과 동일한 방법으로 기재 폴리이미드 필름을 제조하였다.Thereafter, a base polyimide film was prepared in the same manner as in Comparative Example 1.

<실시예 4> <Example 4>

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 416.08g을 채운 후, 반응기의 온도를 60℃로 맞춘 후 TCHD 6.17g(0.054mol)을 용해하여 이 용액을 60℃로 유지하였다. 여기에 6FDA 23.99g(0.054mol)을 첨가하고, 1시간 동안 교반하여 반응시켰다. 그다음 반응기의 온도를 25℃ 냉각 후 여기에 3DDS 31.287g(0.126mol)를 첨가하여 완전히 용해 시켜 1시간 동안 반응 시켰다. 그 후 CBDA 10.59g(0.054mol)와 6FDA 31.99g(0.072mol)을 첨가한 후 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 2.5poise인 폴리아믹산 용액을 얻었다. As a reactor, 416.08 g of N, N-dimethylacetamide (DMAc) was charged while passing nitrogen through a 500-mL reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser. 6.17 g (0.054 mol) of TCHD was dissolved and the solution was maintained at 60 캜. 23.99 g (0.054 mol) of 6FDA was added thereto, and the mixture was reacted by stirring for 1 hour. Then, the temperature of the reactor was cooled to 25 DEG C, and 31.287 g (0.126 mol) of 3DDS was added thereto to completely dissolve and react for 1 hour. Then, 10.59 g (0.054 mol) of CBDA and 31.99 g (0.072 mol) of 6FDA were added and subjected to 18HR reaction to obtain a polyamic acid solution having a solid content of 20 wt% and a viscosity of 2.5 poise.

이후 상기 비교예 1과 동일한 방법으로 기재 폴리이미드 필름을 제조하였다.
Thereafter, a base polyimide film was prepared in the same manner as in Comparative Example 1.

<실시예 5> &Lt; Example 5 >

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 435.39g을 채운 후, 반응기의 온도를 60℃로 맞춘 후 TCHD 2.06g(0.018mol)을 용해하여 이 용액을 60℃로 유지하였다. 여기에 6FDA 8g(0.018mol)을 첨가하고, 1시간 동안 교반하여 반응시켰다. 그다음 반응기의 온도를 25℃ 냉각 후 여기에 3DDS 40.226g(0.162mol)를 첨가하여 완전히 용해 시켜 1시간 동안 반응 시켰다. 그 후 CBDA 10.59g(0.054mol)와 6FDA 47.98g(0.108mol)을 첨가한 후 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 1.8poise인 폴리아믹산 용액을 얻었다. The reactor was charged with 435.39 g of N, N-dimethylacetamide (DMAc) while passing nitrogen through a 500-mL reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser. 2.06 g (0.018 mol) of TCHD was then dissolved and the solution was maintained at 60 &lt; 0 &gt; C. 8 g (0.018 mol) of 6FDA was added thereto, and the mixture was reacted by stirring for 1 hour. Then, after the temperature of the reactor was cooled to 25 ° C, 40.226 g (0.162 mol) of 3DDS was added thereto to completely dissolve and reacted for 1 hour. Thereafter, 10.59 g (0.054 mol) of CBDA and 47.98 g (0.108 mol) of 6FDA were added, followed by 18HR reaction to obtain a polyamic acid solution having a solid content of 20 wt% and a viscosity of 1.8 poise.

이후 상기 비교예 1과 동일한 방법으로 기재 폴리이미드 필름을 제조하였다.
Thereafter, a base polyimide film was prepared in the same manner as in Comparative Example 1.

<비교예 2>&Lt; Comparative Example 2 &

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 354.88g을 채운 후, 반응기의 온도를 60℃로 맞춘 후 TCHD 20.55g(0.18mol)을 용해하여 이 용액을 60℃로 유지하였다. 여기에 6FDA 55.98g(0.126mol)과 CBDA 10.59g을 첨가하여 1시간 동안 교반하여 반응시킨 후 25℃ 냉각하여 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 67 poise인 폴리아믹산 용액을 얻었다. 354.88 g of N, N-dimethylacetamide (DMAc) was charged into a 500-mL reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser while passing nitrogen through the reactor. 20.55 g (0.18 mol) of TCHD was dissolved and the solution was maintained at 60 캜. 55.98 g (0.126 mol) of 6FDA and 10.59 g of CBDA were added and reacted for 1 hour with stirring. The mixture was cooled to 25 ° C and subjected to 18HR reaction to obtain a polyamic acid solution having a solid content of 20 wt% and a viscosity of 67 poise .

이후 상기 비교예 1과 동일한 방법으로 기재 폴리이미드 필름을 제조하였다.
Thereafter, a base polyimide film was prepared in the same manner as in Comparative Example 1.

<비교예 3>&Lt; Comparative Example 3 &

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 447.31g을 채운 후, 반응기의 온도를 25℃로 맞춘 후 TFDB 51.24g(0.16mol)을 용해하고 여기에 6FDA 49.76g(0.112mol)과 CBDA 9.413g(0.048mol)을 첨가하여 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 3400poise인 폴리아믹산 용액을 얻었다. As a reactor, 447.31 g of N, N-dimethylacetamide (DMAc) was charged while passing nitrogen through a 500-mL reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser. (0.112 mol) of 6FDA and 9.413 g (0.048 mol) of CBDA were added thereto, followed by 18HR reaction to obtain a polyamic acid solution having a solid content of 20% by weight and a viscosity of 3400 poise &Lt; / RTI &gt;

이후 상기 비교예 1과 동일한 방법으로 기재 폴리이미드 필름을 제조하였다.
Thereafter, a base polyimide film was prepared in the same manner as in Comparative Example 1.

<비교예 4>&Lt; Comparative Example 4 &

반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500mL 반응기에 질소를 통과시키면서 N,N-디메틸아세타아미드(DMAc) 392.98g을 채운 후, 반응기의 온도를 60℃로 맞춘 후 TCHD 14.39g(0.126mol)을 용해하여 이 용액을 60℃로 유지하였다. 여기에 6FDA 55.98g(0.126mol)을 첨가하고, 1시간 동안 교반하여 반응시켰다. 그다음 반응기의 온도를 25℃ 냉각 후 여기에 TFDB 17.292g(0.054mol)를 첨가하여 완전히 용해 시켜 1시간 동안 반응 시켰다. 그 후 CBDA 10.59g(0.054mol)을 첨가한 후 18HR 반응하여 고형분의 농도가 20중량%이고, 점도가 420 poise인 폴리아믹산 용액을 얻었다. N, N-dimethylacetamide (DMAc) 392.98 g was charged into a 500-mL reactor equipped with a stirrer, a nitrogen-introducing device, a dropping funnel, a temperature controller and a condenser as a reactor, and the temperature of the reactor was adjusted to 60 ° C 14.39 g (0.126 mol) of TCHD was dissolved and the solution was maintained at 60 캜. 55.98 g (0.126 mol) of 6FDA was added thereto, and the mixture was reacted by stirring for 1 hour. Then, after the temperature of the reactor was cooled to 25 ° C, 17.292 g (0.054 mol) of TFDB was added thereto to completely dissolve and reacted for 1 hour. Thereafter, 10.59 g (0.054 mol) of CBDA was added, followed by 18HR reaction to obtain a polyamic acid solution having a solid content of 20 wt% and a viscosity of 420 poise.

이후 상기 비교예 1과 동일한 방법으로 기재 폴리이미드 필름을 제조하였다.
Thereafter, a base polyimide film was prepared in the same manner as in Comparative Example 1.

상기 실시예 및 비교예로 제조된 폴리이미드 필름을 하기의 방법으로 물성을 평가하였으며, 그 결과를 하기 표 1에 나타내었다..The properties of the polyimide films prepared in Examples and Comparative Examples were evaluated by the following methods, and the results are shown in Table 1 below.

(1) 투과도 (1) Transmission

UV분광계(Varian사, Cary100)를 이용하여 380~780㎚에서의 평균 투과도를 측정하였다.The average transmittance at 380 to 780 nm was measured using a UV spectrometer (Varian, Cary100).

(2) 황색도(2) Yellowness

ASTM E313규격으로 황색도를 측정하였다.Yellowness was measured according to ASTM E313 standard.

(3) 복굴절 (3) Birefringence

복굴절 분석기(Prism Coupler, Sairon SPA4000)를 이용하여 630nm에서 3회 측정하여 평균값을 측정하였다.The average value was measured three times at 630 nm using a birefringence analyzer (Prism Coupler, Sairon SPA4000).

(4) 점도(4) Viscosity

Brookfield 점도계(RVDV-II+P)를 25ㅀC에서 2번 또는 6번 scandal을 사용하여 50rpm에서 2회 측정하여 평균값을 측정하였다.The Brookfield viscometer (RVDV-II + P) was measured twice at 50 rpm using a 2 or 6 scandal at 25 ° C and averaged.

(5) Retardation(5) Retardation

Retardation은 OTSUKA ELECTRONICS의 RETS를 사용하여 측정하였다. 샘플 크기는 가로 세로 각각 1인치 정사각형 형태로 시편을 샘플 홀더에 장착하고 모노크로미터를 이용하여 550nm로 고정하였고, Ro(면방향 위상차)는 입사각이 0ㅀ에서 측정하여 면내 복굴절을 측정, Rth(두께방향 위상차)는 입사각을 45ㅀ에서 측정하여 두께 위상차를 측정할 수 있다. Retardation was measured using RETS from OTSUKA ELECTRONICS. The specimen was mounted on a sample holder in the shape of a square of 1 inch square, fixed at 550 nm using a monochrometer, and the in-plane retardation (R o) was measured at an incident angle of 0 ° to measure R b Thickness direction retardation) can be measured by measuring the incident angle at 45 두께.

Ro= (nx-ny)*d Ro = (n x -n y) * d

Rth= [(ny-nz)*d+(nx-nz)*d]/2 Rth = [(n y -n z ) * d + (n x -n z) * d] / 2

여기서, nx는 x방향으로의 굴절율이고, ny는 y방향으로의 굴절율이며, nz는 z방향으로의 굴절율이고, d는 폴리이미드 필름의 두께이다.
Here, n x is the refractive index in the x direction, n y is the refractive index in the y direction, n z is the refractive index in the z direction, and d is the thickness of the polyimide film.

성분ingredient 몰비Mole ratio 두께()thickness() 투과도 (%)Permeability (%) Prism CouplerPrism Coupler TE(transverse electric) 모드Transverse electric (TE) mode TM(transverse magnetic) 모드TM (transverse magnetic) mode 복굴절Birefringence 비교예1Comparative Example 1 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 90:10:70:3090: 10: 70: 30 3535 85.4385.43 1.57221.5722 1.56941.5694 0.003 0.003 실시예2Example 2 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 70:30:70:3070: 30: 70: 30 3636 85.9485.94 1.57431.5743 1.57371.5737 0.001 0.001 실시예3Example 3 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 50:50:70:3050: 50: 70: 30 3535 86.14 86.14 1.5868 1.5868 1.5864 1.5864 0.000 0.000 실시예4Example 4 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 30:70:70:3030: 70: 70: 30 3434 86.45 86.45 1.5992 1.5992 1.5995 1.5995 0.000 0.000 실시예5Example 5 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 10:90:70:3010: 90: 70: 30 3535 87.12 87.12 1.6013 1.6013 1.6010 1.6010 0.000 0.000 비교예2Comparative Example 2 TCHD+6FDA+CBDATCHD + 6FDA + CBDA 100:70:30100: 70: 30 3434 89.49 89.49 1.5645 1.5645 1.5594 1.5594 0.005 0.005 비교예3Comparative Example 3 TFDB+6FDA+CBDATFDB + 6FDA + CBDA 100:70:30100: 70: 30 3535 90.34 90.34 1.5590 1.5590 1.5448 1.5448 0.014 0.014 비교예4Comparative Example 4 TCHD+TFDB+6FDA+CBDATCHD + TFDB + 6FDA + CBDA 70:30:70:3070: 30: 70: 30 3636 88.07 88.07 1.5510 1.5510 1.5411 1.5411 0.010 0.010

성분ingredient 몰비Mole ratio 두께()thickness() 점도(poise)Viscosity (poise) 위상차 측정기 (RETS)Phase difference meter (RETS) RoRo RthRth 비교예1Comparative Example 1 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 90:10:70:3090: 10: 70: 30 3535 101101 0.790.79 102102 실시예2Example 2 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 70:30:70:3070: 30: 70: 30 3636 8282 0.920.92 65.66465.664 실시예3Example 3 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 50:50:70:3050: 50: 70: 30 3535 42 42 0.90 0.90 63.42 63.42 실시예4Example 4 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 30:70:70:3030: 70: 70: 30 3434 25 25 0.82 0.82 65.12 65.12 실시예5Example 5 TCHD+3DDS+6FDA+CBDATCHD + 3DDS + 6FDA + CBDA 10:90:70:3010: 90: 70: 30 3535 1.81.8 0.78 0.78 62.12 62.12 비교예2Comparative Example 2 TCHD+6FDA+CBDATCHD + 6FDA + CBDA 100:70:30100: 70: 30 3434 67 67 0.74 0.74 186.00 186.00 비교예3Comparative Example 3 TFDB+6FDA+CBDATFDB + 6FDA + CBDA 100:70:30100: 70: 30 3535 3400 3400 0.82 0.82 435.21 435.21 비교예4Comparative Example 4 TCHD+TFDB+6FDA+CBDATCHD + TFDB + 6FDA + CBDA 70:30:70:3070: 30: 70: 30 3636 420 420 0.520.52 223.344223.344

물성평가 결과, 3DDS의 함량이 30%이상 함유될 경우 복굴절이 0에 가까워지며, Rth값이 70nm이하로 매우 작은 값을 가지게 되는 것을 확인할 수 있었다.As a result of the physical property evaluation, it was confirmed that when the content of 3DDS was 30% or more, the birefringence was close to zero, and the Rth value was extremely small as 70 nm or less.

실시예의 결과로부터, 폴리이미드 필름 내의 3DDS 함량이 증가할수록 복굴절 특성이 낮아지는 것을 알 수 있으며, 이는 3DDS가 연결기가 m-위치에 있어 구조적으로 분자 배향을 어렵게 하여 복굴절 값의 향상을 일으킨 것으로 볼 수 있다.From the results of the examples, it can be seen that the birefringence characteristics are lowered as the 3DDS content in the polyimide film is increased. This is because the 3DDS is structurally difficult to align the molecules due to the m-position of the connecting group, have.

한편, 3DDS 함량이 높아질수록 점도가 낮아져서 필름 생성이 어렵기 때문에 3DDS의 함량은 30~70몰% 정도가 적절하다고 할 수 있다.On the other hand, the higher the content of 3DDS, the lower the viscosity and the difficulty in film production. Therefore, the content of 3DDS is preferably about 30 to 70 mol%.

실시예2와 비교예4을 비교해 볼 때, 3DDS 30몰% 대신 분자내에 상대적으로 많은 Benzene링을 가지고 있는 TFDB 30몰%를 사용할 경우, 복굴절 값이 10배정도 상승 되는 것을 볼 수 있다.Comparing Example 2 and Comparative Example 4, it can be seen that the birefringence value is increased about 10 times when 30 mol% of TFDB having a relatively large number of Benzene rings in the molecule is used instead of 30 mol% of 3DDS.

Claims (9)

디아민계 모노머로서 3,3'-디아미노 디페닐 술폰(3DDS) 및 1,4-디아미노 사이클로헥산(TCHD)으로부터 유래된 반복단위와 디안하이드라이드계 모노머로부터 유래된 반복단위를 포함하는 폴리아미드산을 이미드화하여 얻어지되,
상기 3,3'-디아미노 디페닐 술폰으로부터 유래된 반복단위는 그 함량이 전체 디아민계 모노머로부터 유래된 반복단위 중 30~90중량%인 것이고,
필름의 복굴절율은 0.003이하인 폴리이미드 필름.
A polyamide comprising a repeating unit derived from 3,3'-diaminodiphenylsulfone (3DDS) and 1,4-diaminocyclohexane (TCHD) as a diamine-based monomer and a repeating unit derived from a dianhydride-based monomer Acid is obtained by imidation,
The content of the repeating unit derived from the 3,3'-diaminodiphenylsulfone is 30 to 90% by weight in the repeating units derived from the entire diamine-based monomer,
Wherein the film has a birefringence of 0.003 or less.
삭제delete 제1항에 있어서,
상기 3,3'-디아미노 디페닐 술폰으로부터 유래된 반복단위는 그 함량이 전체 디아민계 모노머로부터 유래된 반복단위 중 30~70중량%인 것임을 특징으로 하는 폴리이미드 필름.
The method according to claim 1,
Wherein the content of the repeating unit derived from the 3,3'-diaminodiphenylsulfone is 30 to 70% by weight in the repeating units derived from the whole diamine-based monomer.
제3항에 있어서,
상기 3,3'-디아미노 디페닐 술폰으로부터 유래된 반복단위는 그 함량이 전체 디아민계 모노머로부터 유래된 반복단위 중 50~70중량%인 것임을 특징으로 하는 폴리이미드 필름.
The method of claim 3,
Wherein the content of the repeating unit derived from the 3,3'-diaminodiphenylsulfone is 50 to 70% by weight based on the total repeating units derived from the diamine-based monomer.
삭제delete 제1항에 있어서,
상기 폴리이미드 필름은 Ro(면방향 위상차)가 1nm 이하이고, Rth(두께방향 위상차)가 70nm 이하(두께 35㎛)인 것임을 특징으로 하는 폴리이미드 필름.
The method according to claim 1,
Wherein the polyimide film has a Ro (plane direction retardation) of 1 nm or less and an Rth (thickness direction retardation) of 70 nm or less (35 mu m in thickness).
제1항에 있어서,
상기 폴리이미드 필름은 380 내지 780nm에서의 평균 투과도가 85% 이상인 것임을 특징으로 하는 폴리이미드 필름.
The method according to claim 1,
Wherein the polyimide film has an average transmittance at 380 to 780 nm of 85% or more.
제1항에 있어서,
상기 디안하이드라이드계 모노머는 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드 (6FDA), 사이클로부탄테트라카르복실릭 디안하이드라이드 (CBDA), 비페닐테트라카르복실릭 디안하이드라이드 (BPDA), 바이시클로[2.2.2]옥트-7-엔-2,3,5,6-테트라카르복실릭 디안하이드라이드(BTA), 4-(2,5-디옥소테트라하이드로푸란-3-일)-1,2,3,4-테트라하이드로나프탈렌-1,2-디카르복실릭디안하이드라이드(TDA), 피로멜리틱산 디안하이드라이드(1,2,4,5-벤젠 테트라카르복실릭 디안하이드라이드(PMDA), 벤조페논 테트라카르복실릭 디안하이드라이드 (BTDA), 비스카르복시페닐 디메틸 실란 디안하이드라이드(SiDA), 옥시디프탈릭 디안하이드라이드(ODPA), 비스 디카르복시페녹시 디페닐 설파이드 디안하이드라이드 (BDSDA), 술포닐 디프탈릭안하이드라이드 (SO2DPA) 및 이소프로필리덴이페녹시 비스 프탈릭안하이드라이드(6HDBA) 중 선택된 1종 이상인 것임을 특징으로 하는 폴리이미드 필름.
The method according to claim 1,
The dianhydride monomer may be at least one selected from the group consisting of 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydride (6FDA), cyclobutane tetracarboxylic dianhydride (CBDA), biphenyltetracarboxyl Ricinanhydride (BPDA), bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BTA), 4- (2,5-dioxotetra (Tetrahydrofuran-3-yl) -1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic dianhydride (TDA), pyromellitic acid dianhydride Benzene tetracarboxylic dianhydride (PMDA), benzophenone tetracarboxylic dianhydride (BTDA), biscarboxyphenyldimethylsilanediamine hydride (SiDA), oxydiphthalic dianhydride (ODPA), bisdicarboxy phenoxy diphenyl sulfide dianhydride (BDSDA), sulfonyl adipic anhydride (SO 2 DPA) and the Talic Propylidene bis phenoxy phthalic anhydride polyimide film, characterized in that the selected one or more species of (6HDBA).
제1항, 제3항 내지 제4항 및 제 6항 내지 제8항 중 어느 한 항에 따른 폴리이미드 필름을 포함하는 영상표시소자.An image display device comprising the polyimide film according to any one of claims 1 to 7.
KR1020120032669A 2012-03-29 2012-03-29 Polyimide film KR101550955B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120032669A KR101550955B1 (en) 2012-03-29 2012-03-29 Polyimide film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120032669A KR101550955B1 (en) 2012-03-29 2012-03-29 Polyimide film

Publications (2)

Publication Number Publication Date
KR20130110589A KR20130110589A (en) 2013-10-10
KR101550955B1 true KR101550955B1 (en) 2015-09-07

Family

ID=49632380

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120032669A KR101550955B1 (en) 2012-03-29 2012-03-29 Polyimide film

Country Status (1)

Country Link
KR (1) KR101550955B1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015099478A1 (en) * 2013-12-26 2015-07-02 코오롱인더스트리 주식회사 Transparent polyamide-imide resin and film using same
KR101870341B1 (en) 2013-12-26 2018-06-22 코오롱인더스트리 주식회사 Colorless Polyamide―imide Resin and Film Thereof
CN107522860B (en) 2014-05-30 2020-09-25 株式会社Lg化学 Polyimide-based liquid and polyimide-based film prepared using the same
KR101501875B1 (en) * 2014-05-30 2015-03-11 주식회사 엘지화학 Polyimide-based solution and polyimide-based film prepared by using same
KR102227672B1 (en) 2014-12-31 2021-03-16 코오롱인더스트리 주식회사 Polyamide-imide precursor composition, polyamide-imide film and display device
WO2016108675A1 (en) * 2014-12-31 2016-07-07 코오롱인더스트리 주식회사 Polyamide-imide precursor, polyamide-imide film, and display device comprising same
WO2016158825A1 (en) * 2015-03-31 2016-10-06 旭化成株式会社 Polyimide film, polyimide varnish, product using polyimide film, and laminate
KR102417428B1 (en) * 2015-12-21 2022-07-06 주식회사 두산 Polyamic acid composition comprising alicyclic monomer and trasparent polyimide film using the same
KR102385237B1 (en) * 2016-08-11 2022-04-12 에스케이이노베이션 주식회사 Polyamic acid resin, polyamideimide film and method for preparing the same
KR102385244B1 (en) * 2016-08-11 2022-04-12 에스케이이노베이션 주식회사 Polyamic acid resin and polyamideimide film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008230018A (en) * 2007-03-20 2008-10-02 Toyobo Co Ltd Method of manufacturing transparent polyimide film
JP5092426B2 (en) 2006-07-21 2012-12-05 東レ株式会社 RESIN COMPOSITION FOR retardation film, color filter substrate for liquid crystal display device, liquid crystal display device, and method for producing color filter substrate for liquid crystal display device with retardation film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5092426B2 (en) 2006-07-21 2012-12-05 東レ株式会社 RESIN COMPOSITION FOR retardation film, color filter substrate for liquid crystal display device, liquid crystal display device, and method for producing color filter substrate for liquid crystal display device with retardation film
JP2008230018A (en) * 2007-03-20 2008-10-02 Toyobo Co Ltd Method of manufacturing transparent polyimide film

Also Published As

Publication number Publication date
KR20130110589A (en) 2013-10-10

Similar Documents

Publication Publication Date Title
KR101550955B1 (en) Polyimide film
KR101593267B1 (en) Polyimide resin and film thereof
KR101870341B1 (en) Colorless Polyamide―imide Resin and Film Thereof
US10662290B2 (en) Polyamide-imide precursor, polyamide-imide film and display device comprising same
KR101543478B1 (en) Transparent Polyimide film and Method for Preparing the Same
KR102339037B1 (en) Polyamide-imide precursor composition, polyamide-imide film and display device
JP5948443B2 (en) Diamine compound containing two substituents as asymmetric structure, and polymer produced using the same
KR102529151B1 (en) Composition for preparing article including polyimide or poly(amide-imide) copolymer, article obtained therefrom, and display device including same
KR101292886B1 (en) Transparent Polyimide film with improved Solvent Resistance
KR102281093B1 (en) Polyamic acid rasin, polyimide films, and display device comprising thereof
KR101862028B1 (en) Polyamic acid, And Polyimide Resin And Polyimide Film
KR102227672B1 (en) Polyamide-imide precursor composition, polyamide-imide film and display device
KR20170079896A (en) Polyimidepolymer composition, method for producing thereof and method for producing polyimide film using the same
KR101602686B1 (en) Polyamic Acid, Polyimide and Display Device
KR20110108898A (en) Polyimide film
KR20110108894A (en) Polyimide film
KR20170112475A (en) Polyimide resin composition having improved frictional property and Film thereof
KR101721555B1 (en) Process for polyimide resin
KR20170079743A (en) Polyimide resin comprising a pigment and Polyimide film thereof
KR102271025B1 (en) Polyamic acid, Polyimide Resin, Polyimide Film and Display Device Comprising Thereof
KR20170100792A (en) Polyamic acid, Polyimide Resin, Polyimide Film and Display Device Comprising Thereof
KR20100023451A (en) Polyimide resin and film
KR102251519B1 (en) Polyamic acid, And Polyimide Resin And Polyimide Film
KR20160113754A (en) Precursor of polyimide and polyimide manufactured thereof and polyimide film including the same
KR20190081459A (en) Method of preparing Polyamic acid and Polyamic acid, Polyimide resin and Polyimide film thereby

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180903

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190902

Year of fee payment: 5