KR20190081459A - Method of preparing Polyamic acid and Polyamic acid, Polyimide resin and Polyimide film thereby - Google Patents
Method of preparing Polyamic acid and Polyamic acid, Polyimide resin and Polyimide film thereby Download PDFInfo
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- KR20190081459A KR20190081459A KR1020170184018A KR20170184018A KR20190081459A KR 20190081459 A KR20190081459 A KR 20190081459A KR 1020170184018 A KR1020170184018 A KR 1020170184018A KR 20170184018 A KR20170184018 A KR 20170184018A KR 20190081459 A KR20190081459 A KR 20190081459A
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- South Korea
- Prior art keywords
- polyamic acid
- pmda
- bpda
- bis
- block structure
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- 229920005575 poly(amic acid) Polymers 0.000 title claims abstract description 55
- 229920001721 polyimide Polymers 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000009719 polyimide resin Substances 0.000 title claims abstract description 17
- 150000004985 diamines Chemical class 0.000 claims abstract description 29
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 41
- -1 3,4-dicarboxyphenyl Chemical group 0.000 claims description 18
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 13
- 238000002834 transmittance Methods 0.000 claims description 9
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 8
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 claims description 7
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 6
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 claims description 5
- JSHWBHGGAJRODW-UHFFFAOYSA-N O.C(=O)(O)C=1C=C(C=CC1C(=O)O)NC(C(C(F)(F)F)(F)F)(NC1=CC(=C(C=C1)C(=O)O)C(=O)O)F Chemical compound O.C(=O)(O)C=1C=C(C=CC1C(=O)O)NC(C(C(F)(F)F)(F)F)(NC1=CC(=C(C=C1)C(=O)O)C(=O)O)F JSHWBHGGAJRODW-UHFFFAOYSA-N 0.000 claims description 5
- RXNKCIBVUNMMAD-UHFFFAOYSA-N 4-[9-(4-amino-3-fluorophenyl)fluoren-9-yl]-2-fluoroaniline Chemical compound C1=C(F)C(N)=CC=C1C1(C=2C=C(F)C(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 RXNKCIBVUNMMAD-UHFFFAOYSA-N 0.000 claims description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 3
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims 2
- 229910052731 fluorine Inorganic materials 0.000 claims 2
- 239000011737 fluorine Substances 0.000 claims 2
- 150000004678 hydrides Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000004642 Polyimide Substances 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 50
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 48
- 239000000243 solution Substances 0.000 description 35
- 229910052757 nitrogen Inorganic materials 0.000 description 26
- 239000011521 glass Substances 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 20
- 239000002904 solvent Substances 0.000 description 18
- 239000007787 solid Substances 0.000 description 14
- 238000007792 addition Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 6
- 238000006358 imidation reaction Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- DLEPYXFUDLQGDW-UHFFFAOYSA-N FC(F)(F)NC1=CC=C(C2=CC=C(NC(F)(F)F)C=C2)C=C1 Chemical compound FC(F)(F)NC1=CC=C(C2=CC=C(NC(F)(F)F)C=C2)C=C1 DLEPYXFUDLQGDW-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- BZWQHSCNVYSILN-UHFFFAOYSA-N 4-(4-aminophenyl)-3,4-bis(trifluoromethyl)cyclohexa-1,5-dien-1-amine Chemical compound FC(C1(C(C=C(N)C=C1)C(F)(F)F)C1=CC=C(N)C=C1)(F)F BZWQHSCNVYSILN-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- HQWRUBJTAODMDK-UHFFFAOYSA-N O.FC(C(C(N)(N)F)(F)F)(F)F Chemical compound O.FC(C(C(N)(N)F)(F)F)(F)F HQWRUBJTAODMDK-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 125000006159 dianhydride group Chemical group 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- DUTLDPJDAOIISX-UHFFFAOYSA-N 3-(1,1,1,3,3,3-hexafluoropropan-2-yl)aniline Chemical compound NC1=CC=CC(C(C(F)(F)F)C(F)(F)F)=C1 DUTLDPJDAOIISX-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- LBVMWHCOFMFPEG-UHFFFAOYSA-N 3-methoxy-n,n-dimethylpropanamide Chemical compound COCCC(=O)N(C)C LBVMWHCOFMFPEG-UHFFFAOYSA-N 0.000 description 1
- IFYXKXOINSPAJQ-UHFFFAOYSA-N 4-(4-aminophenyl)-5,5-bis(trifluoromethyl)cyclohexa-1,3-dien-1-amine Chemical compound FC(F)(F)C1(C(F)(F)F)CC(N)=CC=C1C1=CC=C(N)C=C1 IFYXKXOINSPAJQ-UHFFFAOYSA-N 0.000 description 1
- AEJWKVGGBGUSOA-UHFFFAOYSA-N 4-[(1,3-dioxo-2-benzofuran-4-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)C2=C1C=CC=C2S(=O)(=O)C1=CC=CC2=C1C(=O)OC2=O AEJWKVGGBGUSOA-UHFFFAOYSA-N 0.000 description 1
- HNHQPIBXQALMMN-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)-dimethylsilyl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1[Si](C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 HNHQPIBXQALMMN-UHFFFAOYSA-N 0.000 description 1
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004262 Ethyl gallate Substances 0.000 description 1
- NMUBIDWDJVCGKV-UHFFFAOYSA-N FC1(CC=C(C=C1)C1=C(C=2CC3=CC=CC=C3C2C=C1)C1=CCC(C=C1)(F)N)N Chemical compound FC1(CC=C(C=C1)C1=C(C=2CC3=CC=CC=C3C2C=C1)C1=CCC(C=C1)(F)N)N NMUBIDWDJVCGKV-UHFFFAOYSA-N 0.000 description 1
- PSRWSMDJMXWQFH-UHFFFAOYSA-N NC1(CCCCC1)N.NC1(CCCCC1)N Chemical compound NC1(CCCCC1)N.NC1(CCCCC1)N PSRWSMDJMXWQFH-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- QJQAMHYHNCADNR-UHFFFAOYSA-N n-methylpropanamide Chemical compound CCC(=O)NC QJQAMHYHNCADNR-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
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Abstract
Description
본 발명은 폴리아믹산의 제조방법, 이로부터 제조된 폴리아믹산, 폴리이미드 수지 및 폴리이미드 필름에 관한 것이다. The present invention relates to a process for producing a polyamic acid, a polyamic acid, a polyimide resin and a polyimide film produced therefrom.
일반적으로 폴리이미드(PI) 필름은 폴리이미드 수지를 필름화한 것으로, 폴리이미드 수지는 방향족 디안하이드라이드와 방향족 디아민 또는 방향족 디이소시아네이트를 용액 중합하여 폴리아믹산 유도체를 제조한 후, 고온에서 폐환 탈수시켜 이미드화하여 제조되는 고내열 수지를 일컫는다.In general, a polyimide (PI) film is a film made of a polyimide resin, and a polyimide resin is produced by solution polymerization of an aromatic dianhydride and an aromatic diamine or aromatic diisocyanate to prepare a polyamic acid derivative, Refers to a high heat-resistant resin produced by imidization.
이와 같은 폴리이미드 필름은 뛰어난 기계적, 내열성, 전기절연성을 가지고 있기 때문에 반도체의 절연막, TFT-LCD의 전극 보호막 플렉시블 인쇄 배선 회로용 기판 등의 전자재료에 광범위한 분야에서 사용되어지고 있다. Since such a polyimide film has excellent mechanical, heat resistance and electrical insulation properties, it is used in a wide range of electronic materials such as a semiconductor insulating film, a substrate for an electrode protection film flexible printed wiring circuit of a TFT-LCD, and the like.
그러나 폴리이미드 수지는 높은 방향족 고리 밀도로 인하여 갈색 및 황색으로 착색되어 있어 가시광선 영역에서의 투과도가 낮고 노란색 계열의 색을 나타내어 광투과율을 낮게 하며 큰 복굴절률을 가지게 하여 광학부재로 사용하기에는 곤란한 점이 있다. However, the polyimide resin is colored in brown and yellow due to its high aromatic ring density, and thus has low transmittance in the visible light region and yellowish color to lower the light transmittance and has a large birefringence, making it difficult to use the polyimide resin as an optical member have.
미국특허 제4595548호, 제4603061호, 제4645824, 제4895972호, 제5218083호, 제5093453호, 제5218077호, 제5367046호, 제5338826호. 제5986036호, 제6232428호 및 대한민국 특허공개공보 제2003-0009437호에는 -O-, -SO2-, CH2- 등의 연결기와 p-위치가 아닌 m-위치로의 연결된 굽은 구조의 단량체이거나 -CF3 등의 치환기를 갖는 방향족 디안하이드라이드 이무수물과 방향족 디아민 단량체를 사용하여 열적 특성이 크게 저하되지 않는 한도에서 투과도 및 색상의 투명도를 향상시킨 신규 구조의 폴리이미드를 제조한 보고가 있으나, 기계적 특성, 내열성, 복굴절 측면에서 OLED, TFT-LCD, 플렉시블 디스플레이 등의 표시소자 소재로 사용하기에는 부족한 결과를 보였다.U.S. Patent Nos. 4595548, 4603061, 4645824, 4895972, 5218083, 5093453, 5218077, 5367046, 5338826. 5986036 and 6232428 and Korean Patent Laid-Open Publication No. 2003-0009437 disclose monomers having a backbone structure connected to a linking group such as -O-, -SO 2 -, or CH 2 - and the like at an m-position other than the p-position There has been reported a novel structure of polyimide having improved transparency and color transparency as far as the thermal property is not significantly deteriorated by using aromatic dianhydride dianhydride and aromatic diamine monomer having a substituent such as -CF 3 , It is inadequate for use as a display element material for OLED, TFT-LCD, and flexible display in terms of mechanical properties, heat resistance and birefringence.
본 발명은 기존 조성의 같은 원료 및 사용량을 유지하되, 투입 방법을 변경하여 광학 물성을 유지하면서 선형열팽창계수가 개선된 폴리아믹산의 제조방법, 이로부터 제조된 폴리아믹산, 폴리이미드 수지 및 폴리이미드 필름, 이를 포함하는 영상 표시소자를을 제공하는데 있다. The present invention relates to a method for producing a polyamic acid having an improved linear thermal expansion coefficient while maintaining the same raw materials and the same amount of an existing composition but changing the method of injection to maintain the optical properties and a polyamic acid, a polyimide resin and a polyimide film And an image display device including the same.
본 발명의 바람직한 일 구현예는 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 피로멜리틱 디안하이드라이드(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA)를 포함하는 디안하이드라이드를 투입하는 단계; 및 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상을 포함하는 디안하이드라이드를 투입하는 단계를 포함하는 폴리아믹산의 제조방법을 제공하는 것이다.One preferred embodiment of the present invention is a process for the preparation of a mixture of a diamine and a pyromellitic dianhydride including 1,2,4-benzene tetracarboxylic acid (2,2'-bis (trifluoromethyl) benzidine, TFDB) dianhydride, < RTI ID = 0.0 > PMDA) < / RTI > Bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA), and diamines including 2,2'-bis (trifluoromethyl) And a dianhydride containing at least one selected from 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA), and a process for producing the polyamic acid. .
상기 PMDA대 6FDA 및 BPDA 중에서 선택되는 1종 이상의 몰비는 90 내지 25 : 10 내지 75인 것을 특징으로 한다.And the molar ratio of at least one selected from PMDA to 6FDA and BPDA is 90 to 25:10 to 75.
상기 PMDA대 6FDA의 몰비는 90 내지 70 : 10 내지 30인 것을 특징으로 한다.And the molar ratio of PMDA to 6FDA is 90 to 70: 10 to 30.
상기 PMDA대 BPDA의 몰비는 90 내지 25 : 10 내지 75인 것을 특징으로 한다. Wherein the molar ratio of PMDA to BPDA is 90 to 25: 10 to 75.
상기 PMDA대 6FDA대 BPDA의 몰비는 90 내지 50 : 5 내지 30 : 5 내지 20인 것을 특징으로 한다.The molar ratio of PMDA to 6FDA to BPDA is 90 to 50: 5 to 30: 5 to 20.
상기 디아민은 비스 아미노 페닐 풀루오렌 (9,9-Bis(4-aminophenyl)fluorene, FDA) 및 비스 플루오로 아미노 페닐 플루오렌 ( 9,9-Bis(3-fluoro-4-aminophenyl)fluorene, FFDA) 중에서 선택된 1종 이상을 추가로 투입하는 것을 특징으로 한다.The diamine may be selected from the group consisting of 9,9-bis (4-aminophenyl) fluorene (FDA) and 9,9-bis (3-fluoro- , And the like.
상기 비스 아미노 페닐 풀루오렌 (9,9-Bis(4-aminophenyl)fluorene, FDA) 및 비스 플루오로 아미노 페닐 플루오렌 ( 9,9-Bis(3-fluoro-4-aminophenyl)fluorene, FFDA) 중에서 선택된 1종 이상은 디아민 총 몰에 대하여 1몰% 내지 20몰%의 함량으로 투입되는 것을 특징으로 한다.(9,9-bis (4-aminophenyl) fluorene, FDA) and 9,9-bis (3-fluoro-4-aminophenyl) fluorene And at least one of them is added in an amount of 1 mol% to 20 mol% based on the total molar amount of the diamine.
본 발명의 바람직한 다른 일 구현예는 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)로부터 유래된 반복단위 및 피로멜리틱 디안하이드라이드(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA)로부터 유래된 반복단위를 포함하는 블록 구조 및 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)로부터 유래된 반복단위 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상으로부터 유래된 반복단위를 포함하는 블록 구조를 포함하는 것인 폴리아믹산을 제공하는 것이다.In another preferred embodiment of the present invention, the repeating unit derived from 2,2'-bis (trifluoromethyl) benzidine (TFDB) and the repeating unit derived from pyromellitic dianhydride (1,2,4,5- bis (trifluoromethyl) benzidine (TFDB), and a repeating unit derived from 2,2-bis (3-methylphenyl) benzene tetracarboxylic dianhydride , 4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA), and 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA). Wherein the polyamic acid comprises a block structure comprising repeating units.
상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 6FDA 및 BPDA 중에서 선택되는 1종 이상의 몰비는 90 내지 25 : 10 내지 75인 것을 특징으로 한다.And the molar ratio of at least one selected from the group consisting of 6FDA and BPDA in the second block structure to the PMDA in the first block structure is 90 to 25:10 to 75.
상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 6FDA의 몰비는 90 내지 70 : 10 내지 30인 것을 특징으로 한다.Wherein the molar ratio of PMDA in the first block structure to 6FDA in the second block structure is 90 to 70: 10 to 30.
상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 BPDA의 몰비는 90 내지 25 : 10 내지 75인 것을 특징으로 한다.Wherein the molar ratio of PMDA in the first block structure to BPDA in the second block structure is 90 to 25: 10 to 75.
상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 6FDA대 제2 블록 구조에서의 BPDA의 몰비는 90 내지 50 : 5 내지 30 : 5 내지 20인 것을 특징으로 한다.The molar ratio of PMDA in the first block structure to 6FDA in the second block structure to BPDA in the second block structure is 90 to 50: 5 to 30: 5 to 20.
상기 비스 TFDB로부터 유래된 반복단위 및 6FDA 및 BPDA 중에서 선택되는 1종 이상으로부터 유래된 반복단위를 포함하는 블록 구조는 비스 아미노 페닐 풀루오렌 (9,9-Bis(4-aminophenyl)fluorene, FDA) 및 비스 플루오로 아미노 페닐 플루오렌 (9,9-Bis(3-fluoro-4-aminophenyl)fluorene, FFDA) 중에서 선택된 1종 이상으로부터 유래된 반복단위를 더 포함하는 것을 특징으로 한다.The block structure containing repeating units derived from bis TFDB and repeating units derived from at least one selected from 6FDA and BPDA is composed of 9,9-bis (4-aminophenyl) fluorene (FDA) and (9,9-Bis (3-fluoro-4-aminophenyl) fluorene, and FFDA).
상기 FDA 및 FFDA 중에서 선택된 1종 이상의 함량은 디아민 총 몰에 대하여 1몰% 내지 20몰%인 것을 특징으로 한다.The content of at least one selected from FDA and FFDA is 1 mol% to 20 mol% based on the total molar amount of diamine.
본 발명의 바람직한 다른 일 구현예는 상술한 폴리아믹산으로부터 제조된 폴리이미드 수지를 제공하는 것이다.Another preferred embodiment of the present invention is to provide a polyimide resin produced from the above-mentioned polyamic acid.
본 발명의 바람직한 다른 일 구현예는 상기 폴리이미드 수지로 제조된 폴리이미드 필름을 제공하는 것이다.Another preferred embodiment of the present invention is to provide a polyimide film made of the polyimide resin.
상기 폴리이미드 필름은 50~350℃에서 열팽창계수(Coefficient of Thermal Expansion)가 30ppm/℃ 이하이고, UV분광계로 투과도 측정시 550㎚에서 투과도가 85% 이상이고, 황색도가 10 이하인 것을 특징으로 한다.The polyimide film is characterized by having a coefficient of thermal expansion of 30 ppm / ° C or less at 50 to 350 ° C, a transmittance of 85% or more at 550 nm when measured by a UV spectrometer, and a yellowness of 10 or less .
본 발명의 바람직한 다른 일 구현예는 폴리이미드 필름을 포함하는 영상 표시소자를 제공하는 것이다.Another preferred embodiment of the present invention is to provide an image display device including a polyimide film.
본 발명에 따르면, 필름이나 막 형성 후, 황색도 및 투과도를 유지하면서 선형열팽창계수가 개선된 폴리아믹산의 제조방법, 이로부터 제조된 폴리아믹산, 폴리이미드 수지 및 폴리이미드 필름을 제공할 수 있다.According to the present invention, it is possible to provide a method for producing a polyamic acid having an improved linear thermal expansion coefficient while maintaining a yellowness and a transmittance after forming a film or a film, and a polyamic acid, a polyimide resin and a polyimide film produced therefrom.
본 발명의 일 구현예에 따르면, 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 피로멜리틱 디안하이드라이드(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA)를 포함하는 디안하이드라이드를 투입하는 단계; 및 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상을 포함하는 디안하이드라이드를 투입하는 단계를 포함하는 폴리아믹산의 제조방법을 제공한다.According to one embodiment of the present invention, diamines including 1,2-bis (trifluoromethyl) benzidine (TFDB) and pyromellitic dianhydride (1,2,4,5-benzene tetracarboxylic dianhydride, PMDA); Bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA), and diamines including 2,2'-bis (trifluoromethyl) And a dianhydride containing at least one selected from 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA), and a process for producing the polyamic acid. do.
본 발명은 1종의 디아민을 특정 조건 하에 1회 이상, 예를 들어 1차 및 2차로 나누어 투입하여 광학특성을 우수한 수준으로 유지하면서 선형열팽창계수를 향상시키는 효과를 얻을 수 있다.In the present invention, one kind of diamine can be added under one or more conditions, for example, primary and secondary, under specific conditions, and the linear thermal expansion coefficient can be improved while keeping the optical characteristics at a good level.
이하, 본 발명을 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail.
본 발명의 일 구현예에 따른 폴리아믹산의 제조방법에서는 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 피로멜리틱 디안하이드라이드(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA)를 포함하는 디안하이드라이드를 투입하는 단계; 및 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상을 포함하는 디안하이드라이드를 2차 투입하는 단계를 포함하여 실시하는 것이 바람직하다.In the method for producing a polyamic acid according to an embodiment of the present invention, a diamine containing pyrazolinic dianhydride (1,2, 3, 4, 5, 6, 7, 4,5-benzene tetracarboxylic dianhydride, PMDA); Bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA), and diamines including 2,2'-bis (trifluoromethyl) And a dianhydride containing at least one selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA) and biphenyltetracarboxylic dianhydride (BPDA) .
상기 PMDA대 6FDA 및 BPDA 중에서 선택되는 1종 이상의 몰비는 90 내지 25 : 10 내지 75, 바람직하게는 90 내지 30 : 10 내지 70인 것이 좋다. The molar ratio of at least one selected from the PMDA to 6FDA and BPDA is preferably 90 to 25:10 to 75, and more preferably 90 to 30:10 to 70.
상기 PMDA 및 6FDA 및 BPDA 중에서 선택되는 1종 이상이 상기 몰비 범위를 벗어나는 경우 10 이상의 황색도를 가지거나 30ppm/℃ 이상의 열팽창계수를 가지는 문제가 있을 수 있다.When at least one selected from the above-mentioned PMDA, 6FDA and BPDA is out of the above-mentioned molar ratio range, there may be a problem that it has a yellowness degree of 10 or more or a thermal expansion coefficient of 30 ppm / DEG C or more.
본 명세서에서는 상기 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 피로멜리틱 디안하이드라이드(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA)를 포함하는 디안하이드라이드를 투입하는 단계를 1차 투입으로 명명하고, 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상을 포함하는 디안하이드라이드를 투입하는 단계를 2차 투입으로 명명할 수 있으나, 이는 투입 순서를 한정하는 것이 아니며, 투입단계를 구분하기 위하여 명명할 뿐이다.(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA) comprising the above-mentioned bis (trifluoromethyl) benzidine (TFDB) And a diamine containing 2,2-bis (trifluoromethyl) benzidine (TFDB) and 2,2-bis (3,5-bis , 4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA), and 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA). The step of introducing dianhydride may be termed a second input, but this is not intended to limit the order of input, but merely to distinguish the input step.
이 때, 상기 2차 투입시의 6FDA 및 BPDA 중에서 선택되는 1종 이상에서 2종 이상이 투입되는 경우 2차 투입시의 디안하이드라이드 총 몰을 상기 1차 투입시의 PMDA 대비 투입함을 의미한다. In this case, when two or more kinds of at least one selected from 6FDA and BPDA are added during the second addition, it means that the total molar amount of dianhydride at the second addition is added to the PMDA at the first injection .
또한, 상기 2차 투입시의 6FDA 및 BPDA 중에서 선택되는 1종 이상에서 6FDA를 선택하여 투입하는 경우 상기 1차 투입시의 PMDA대 2차 투입시의 6FDA의 몰비는 90 내지 70 : 10 내지 30, 바람직하게는 90 내지 75 : 10 내지 25 인 것이 좋다.When 6FDA is selected from at least one of 6FDA and BPDA at the time of the second charging, the molar ratio of 6FDA at the time of the first charging to the amount of 6FDA at the time of the second charging is 90 to 70:10 to 30, And preferably 90 to 75: 10 to 25.
상기 1차 투입시의 PMDA 및 2차 투입시의 6FDA가 상기 몰비 범위를 벗어나는 경우 PMDA의 비율이 범위보다 높아지면 선형열팽창계수는 매우 낮아지지만 황색도가 매우 높아지는 문제가 있을 수 있으며, 6FDA의 비율이 범위보다 높아지면 황색도는 매우 낮아지는 장점이 있지만 선형열팽창계수가 증가하는 문제가 있을 수 있다. If the ratio of PMDA is higher than the above range when the PMDA at the first charging and the 6FDA at the second charging are out of the above-mentioned molar ratio range, the linear thermal expansion coefficient may be very low, but the yellowing degree may be very high. If it is higher than this range, the yellowness index is very low, but the linear thermal expansion coefficient may increase.
또한, 상기 2차 투입시의 6FDA 및 BPDA 중에서 선택되는 1종 이상에서 BPDA를 선택하여 투입하는 경우 상기 1차 투입시의 PMDA대 2차 투입시의 BPDA의 몰비는 90 내지 25 : 10 내지 75, 바람직하게는 85 내지 30 : 15 내지 70 인 것이 좋다.When BPDA is selected and added in at least one of 6FDA and BPDA at the time of the second charging, the molar ratio of the BPDA at the time of the first charging to the BPDA at the time of the second charging is 90 to 25:10 to 75, And preferably from 85 to 30: 15 to 70. [
상기 1차 투입시의 PMDA 및 2차 투입시의 BPDA가 상기 몰비 범위를 벗어나는 경우 PMDA의 비율이 범위보다 높아지면 선형열팽창계수는 매우 낮아지지만 황색도가 매우 높아지는 문제가 있을 수 있으며, BPDA의 비율이 범위보다 높아지면 PMDA 대비 황색도는 낮아지는 장점이 있지만 선형열팽창계수가 증가되는 문제가 있을 수 있다.If the ratio of PMDA is higher than the above range, the linear thermal expansion coefficient may be very low, but the yellowness may become very high. If the ratio of BPDA If it is higher than this range, the yellowness of PMDA is lowered, but the linear thermal expansion coefficient may be increased.
본 발명의 일 구현에서는 상기 2차 투입시의 6FDA 및 BPDA 중에서 선택되는 1종 이상에서 2종 이상이 투입되는 경우 상기 1차 투입시의 PMDA대 2차 투입시의 6FDA대 2차 투입시의 BPDA의 몰비는 90 내지 50 : 5 내지 30 : 5 내지 20인 것이 보다 바람직하다. In one embodiment of the present invention, when more than one kind of at least one selected from 6FDA and BPDA is input at the time of the second input, the PMDA at the first input, the 6FDA at the second input, and the BPDA Is in the range of 90 to 50: 5 to 30: 5 to 20.
상기 1차 투입시의 PMDA 및 2차 투입시의 6FDA 및 BPDA가 상기 몰비 범위를 벗어나는 경우 10 이상의 황색도를 가지거나 30ppm/℃ 이상의 열팽창계수를 가지는 문제가 있을 수 있다.There may be a problem of having a yellowness degree of 10 or more or a thermal expansion coefficient of 30 ppm / [deg.] C or more when the PMDA at the first charging and the 6FDA and BPDA at the second charging are out of the above-mentioned molar ratio range.
본 발명에서는 상기 PMDA를 포함하는 디안하이드라이드를 먼저 투입한 후, 6FDA 및 BPDA 중에서 선택되는 1종 이상을 포함하는 디안하이드라이드를 투입하는 것이 PMDA를 포함하는 디안하이드라이드를 나중에 투입하는 경우보다 선형열팽창계수 및 황색도를 동시에 향상시킬 수 있다는 점에서 보다 바람직하다. In the present invention, it is preferable that the dianhydride containing at least one selected from the group consisting of 6FDA and BPDA is added to the dianhydride containing the PMDA, The thermal expansion coefficient and the yellowness degree can be improved at the same time.
즉, 본 발명의 일 구현예에서는 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 피로멜리틱 디안하이드라이드(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA)를 포함하는 디안하이드라이드를 먼저 투입하고, 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드(3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상을 포함하는 디안하이드라이드를 나중에 투입하는 것이 본 발명의 물성을 보다 개선시킬 수 있다는 점에서 바람직하다.That is, in one embodiment of the present invention, diamines including 1,2-bis (trifluoromethyl) benzidine (TFDB) and pyromellitic dianhydride (1,2,4,5-benzene tetramarboxylic dianhydride (PMDA) and diamines including 2,2'-bis (trifluoromethyl) benzidine (TFDB) and 2,2-bis (3,4 (Biphenyltetracarboxylic dianhydride, BPDA), which is a dianhydride containing at least one member selected from the group consisting of dihydrocarbyl, dihydrocarbyl, dicarboxyphenyl, hexafluoropropane dianhydride (6FDA) and biphenyltetracarboxylic dianhydride It is preferable to add the rides later in that the physical properties of the present invention can be further improved.
또한, 상기 2차 투입시의 디아민은 비스 아미노 페닐 풀루오렌(9,9-Bis(4-aminophenyl)fluorene, FDA) 및 비스 플루오로 아미노 페닐 플루오렌(9,9-Bis(3-fluoro-4-aminophenyl)fluorene, FFDA) 중에서 선택된 1종 이상을 추가로 투입할 수 있다. 상기 FDA 및 FFDA 중에서 선택된 1종 이상을 추가로 투입하는 경우 유리전이온도를 개선시키는 효과를 얻을 수 있다.In addition, the diamine at the time of the second addition may be 9,9-Bis (4-aminophenyl) fluorene, FDA and 9,9-Bis (3-fluoro-4 -aminophenyl) fluorene, and FFDA) may be further added. When at least one selected from the above FDA and FFDA is further added, an effect of improving the glass transition temperature can be obtained.
상기 FDA 및 FFDA 중에서 선택된 1종 이상은 디아민 총 몰에 대하여 1몰% 내지 20몰%, 바람직하게는 1 내지 10몰%의 함량으로 포함되는 것이 좋다. 상기 FDA 및 FFDA 중에서 선택된 1종 이상이 상기 범위를 벗어나는 경우 1몰% 미만인 경우 함량이 적어 유리전이온도 개선효과가 거의 없을 수 있으며, 20몰%을 초과하는 경우 황색도 및 열팽창계수가 저하되는 문제가 있을 수 있다.It is preferable that at least one selected from the above FDA and FFDA is contained in an amount of 1 mol% to 20 mol%, preferably 1 to 10 mol%, based on the total molar amount of diamine. When the content of the at least one selected from the above FDA and FFDA is out of the above range, the content is less than 1 mol% and the glass transition temperature may not be improved. When the content is more than 20 mol%, the yellowness and thermal expansion coefficient .
본 발명의 일 구현예에 따르면, 상기 2차 투입하고, 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)를 포함하는 디아민 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상을 포함하는 디안하이드라이드를 3차 투입하는 단계는 포함하여 실시할 수 있다.According to one embodiment of the present invention, the diamine containing the secondary addition and containing bis (trifluoromethyl) benzidine (TFDB) and 2,2-bis (3,4- Dianhydride comprising at least one member selected from dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA) and 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA) May be carried out in a third step.
상기 3차 투입시의 디아민 및 디안하이드라이드는 상술한 1차 및 2차 투입시의 디아민 및 디안하이드라이드의 몰비 범위 내에서 적절히 조절하여 첨가할 수 있다. The diamine and dianhydride at the time of the third addition may be appropriately adjusted within the range of the molar ratio of the diamine and the dianhydride at the time of the first and second additions.
본 발명의 일 구현예에서 사용되는 디아민으로서 TFDB, FDA 및 FFDA 이외에 옥시디아닐린(4,4'-Oxydianiline, ODA), p-페닐렌디아민(para-phenylene diamine, pPDA), m-페닐렌디아민(meta-phenylene diamine, mPDA), p-메틸렌디아닐린(para-Methylene Dianiline, pMDA), m-메틸렌디아닐린(meta-Methylene Dianiline, mMDA), 비스 아미노페녹시 벤젠(1,3-bis(3-aminophenoxy) benzene, 133APB), 비스 아미노페녹시 벤젠(1,3-bis(4-aminophenoxy) benzene, 134APB),비스 아미노 페녹시 페닐 헥사플루오로프로판 (2,2'-bis[4(4- aminophenoxy)phenyl] hexafluoropropane, 4BDAF), 비스 아미노페닐 헥사플루오로 프로판(2,2'-bis(3-aminophenyl)hexafluoropropane, 33-6F), 비스 아미노페닐 헥사플루오로 프로판(2,2'-bis(4-aminophenyl)hexafluoropropane, 44-6F), 비스 아미노페닐술폰(bis(4- aminophenyl)sulfone, 4DDS), 비스 아미노페닐술폰(bis(3- aminophenyl)sulfone, 3DDS), 사이클로헥산디아민(1,3-Cyclohexanediamine,13CHD), 사이클로헥산 디아민(1,4-Cyclohexanediamine, 14CHD), 비스 아미노 페녹시 페닐프로판(2,2-Bis[4-(4-aminophenoxy)-phenyl]propane, 6HMDA), 비스 아미노하이드록시 페닐 헥사플로오로프로판2,2-Bis(3-amino-4-hydroxy -phenyl)-hexafluoropropane, 6FAP), 비스 아미노페녹시 디페닐 술폰(4,4'-Bis(3-amino phenoxy) diphenyl sulfone, DBSDA) 중에서 선택되는 1종 이상을 포함할 수 있으며, 이에 언급한 종류로 한정하진 않는다.In addition to TFDB, FDA and FFDA as the diamine used in one embodiment of the present invention, oxydianiline (ODA), para-phenylene diamine (pPDA), m-phenylenediamine (meta-phenylene diamine, mPDA), p-methylene dianiline (pMDA), m-methylene dianiline (mMDA), bisaminophenoxybenzene bis (4-aminophenoxy) benzene, 133APB), 1,3-bis (4-aminophenoxy) benzene, 134APB, bisaminophenoxyphenylhexafluoropropane aminophenoxy) phenyl] hexafluoropropane, 4BDAF, 2,2'-bis (3-aminophenyl) hexafluoropropane, 33-6F, bisaminophenylhexafluoropropane 4-aminophenyl) hexafluoropropane, 44-6F, bis (4-aminophenyl) sulfone, bis (3-aminophenyl) sulfone and 3-DDS, cyclohexanediamine -Cyclo hexanediamine, 13CHD), 1,4-cyclohexanediamine, 14CHD, 2,2-Bis [4- (4-aminophenoxy) -phenyl] propane, 6HMDA), bisaminodihydroxy Bis (3-amino phenoxy) diphenyl sulfone, 6-aminophenoxy diphenyl sulfone, 6FAP, DBSDA), but the present invention is not limited thereto.
한편, 본 발명에서 사용되는 디안하이드라이드는 PMDA, 6FDA, BPDA 이외에, 4-(2,5-디옥소테트라하이드로푸란-3-일)-1,2,3,4-테트라하이드로나프탈렌-1,2-디카르복실릭안하이드라이드(TDA), 벤조페논 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Benzophenone tetracarboxylic dianhydride, BTDA), 옥시디프탈릭 디안하이드라이드 (4,4-Oxydiphthalic dianhydride,ODPA), 비스카르복시페닐 디메틸 실란 디안하이드라이드( Bis(3,4dicarboxyphenyl)dimethyl-silane dianhydride, SiDA), 비스 디카르복시페녹시 디페닐 설파이드 디안하이드라이드(4,4-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride, BDSDA), 술포닐 디프탈릭안하이드라이드(Sulfonyldiphthalic anhydride, SO2DPA), 사이클로부탄 테트라카르복실릭 디안하이드라이드(Cyclobutane -1,2,3,4 - tetracarboxylic dianhydride, CBDA), 이소프로필리덴이페녹시 비스 프탈릭안하이드라이드(4,4'-(4,4'-Isopropylidenediphenoxy)bis(phthalic anhydride), 6HBDA) 중에서 선택되는 1종 이상을 포함할 수 있으며, 이에 언급한 종류로 한정하진 않는다.The dianhydride used in the present invention may contain, in addition to PMDA, 6FDA and BPDA, 4- (2,5-dioxotetrahydrofuran-3-yl) -1,2,3,4-tetrahydronaphthalene- 2-dicarboxylic anhydride (TDA), benzophenone tetracarboxylic dianhydride (BTDA), 4,4-oxydiphthalic dianhydride , ODPA), bis (3,4dicarboxyphenyl) dimethyl-silane dianhydride (SiDA), bisdicarboxyphenoxydiphenylsulfide dianhydride (4,4-bis (3,4-dicarboxyphenoxy ) diphenyl sulfide dianhydride (BDSDA), sulfonyldiphthalic anhydride (SO 2 DPA), cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) Isopropylidene is phenoxybisphthalic anhydride (4 , 4 '- (4,4'-Isopropylidenediphenoxy) bis (phthalic anhydride), 6HBDA), and the present invention is not limited thereto.
본 발명의 일 구현예에서는 상술한 디아민 및 디안하이드라이드 성분을 포함하여 중합 반응에 참여한다. In one embodiment of the present invention, the above-mentioned diamine and dianhydride components are involved in the polymerization reaction.
상기 반응시의 조건은 특별히 한정되지 않지만 반응 온도는 0~80℃가 바람직하고, 반응시간은 2~48시간이 바람직하다. 또한 반응 시 아르곤이나 질소 등의 불활성 기체 분위기인 것이 보다 바람직하다.The conditions for the reaction are not particularly limited, but the reaction temperature is preferably 0 to 80 ° C, and the reaction time is preferably 2 to 48 hours. It is more preferable that the atmosphere is an inert gas atmosphere such as argon or nitrogen during the reaction.
상기 단량체들의 용액 중합반응을 위한 유기용매는 폴리아믹산을 용해하는 용매이면 특별히 한정되지 않는다. 공지된 반응용매로서 m-크레졸, N-메틸-2-피롤리돈(NMP), 디메틸포름아미드(DMF), 디메틸아세트아미드(DMAc), 디메틸설폭사이드(DMSO), 아세톤, 에틸아세테이트, 디에틸포름아미드(DEF), 디에틸아세트아미드(DEA), Propylene glycol monomethyl ether(PGME), Propylene glycol monomethyl ether Acetate(PGMEA), Ethyl, Lactate, 3-Methoxy-N,N-Dimethylpropionamide, 3-Butoxy-N,N-methylpropionamide 중에서 선택된 하나 이상의 극성용매를 사용한다. 이외에도 테트라하이드로퓨란(THF), 클로로포름과 같은 저비점 용액 또는 γ-부티로락톤과 같은 저흡수성 용매를 사용할 수 있다. 이에 언급한 종류로 한정하지 않으며 이러한 용매는 목적에 따라 단독 혹은 2종 이상 사용할 수 있다.The organic solvent for the solution polymerization of the monomers is not particularly limited as long as it is a solvent dissolving the polyamic acid. As known reaction solvents there may be used m-cresol, N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), dimethylacetamide (DMAc), dimethylsulfoxide (DMSO), acetone, (DEF), diethylacetamide (DEA), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate, 3-methoxy-N, N-dimethylpropionamide and 3-butoxy-N , And N-methylpropionamide. In addition, a low boiling point solution such as tetrahydrofuran (THF), chloroform or a low-absorbency solvent such as? -Butyrolactone may be used. But the solvent is not limited to those mentioned above, and these solvents may be used alone or in combination of two or more.
유기용매의 함량에 대하여 특별히 한정되지는 않으나, 적절한 폴리아믹산 용액의 분자량과 점도를 얻기 위하여 유기용매의 함량은 전체 폴리아믹산 용액 중 50~95중량%가 바람직하고, 더욱 좋게는 70~90중량%인 것이 보다 바람직하다. The content of the organic solvent is preferably 50 to 95% by weight, more preferably 70 to 90% by weight in the total polyamic acid solution in order to obtain the molecular weight and viscosity of an appropriate polyamic acid solution, Is more preferable.
본 발명의 다른 일 구현예에 따르면, 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)로부터 유래된 반복단위 및 피로멜리틱 디안하이드라이드(1,2,4,5-benzene tetracarboxylic dianhydride, PMDA)로부터 유래된 반복단위를 포함하는 제1 블록 구조 및 비스 트리플루오로메틸 벤지딘(2,2'-bis(trifluoromethyl)benzidine, TFDB)로부터 유래된 반복단위 및 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 디안하이드라이드(6FDA) 및 비페닐 테트라카르복실릭 디안하이드라이드 (3,3,4,4-Biphenyltetracarboxylic dianhydride, BPDA) 중에서 선택되는 1종 이상으로부터 유래된 반복단위를 포함하는 제2 블록 구조를 포함하는 것인 폴리아믹산을 제공하는 것이다.According to another embodiment of the present invention, there is provided a process for preparing a copolymer comprising repeating units derived from bis (trifluoromethyl) benzidine (TFDB) and pyromellitic dianhydride (1,2,4,5 (2,2'-bis (trifluoromethyl) benzidine (TFDB)) and a second block structure containing a repeating unit derived from 2,2'-bis (tetrabutylammonium) benzene tetracarboxylic dianhydride At least one selected from bis (3,4-dicarboxyphenyl) hexafluoropropanediamine hydrate (6FDA) and 3,3,4,4-biphenyltetracarboxylic dianhydride (BPDA) And a second block structure including a repeating unit derived from the polyamic acid.
상기 폴리아믹산은 상술한 제조방법으로 제조되는 것이 바람직하다.The polyamic acid is preferably produced by the above-described production method.
상기 제조방법으로 제조된 폴리아믹산은 1종의 디아민을 분할 투입하여 1종의 디아민이 특정함량으로 포함된 제1 블록 구조 및 제2 블록 구조를 포함함으로써 기존 방법처럼 한꺼번에 투입하는 방법에 의해 제조된 폴리아믹산에 비해 황색도 및 투과도가 저하되지 않고 선형열팽창계수가 개선된 효과를 얻을 수 있는 것이다.The polyamic acid prepared by the above-mentioned method can be prepared by adding one diamine in one portion so as to contain a first block structure and a second block structure containing one diamine in a specific amount, It is possible to obtain an effect of improving the linear thermal expansion coefficient without lowering the yellowness and permeability as compared with polyamic acid.
상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 6FDA 및 BPDA 중에서 선택되는 1종 이상의 몰비는 90 내지 25 : 10 내지 75, 바람직하게는 90 내지 30 : 10 내지 70인 것이 좋다. The molar ratio of at least one selected from the group consisting of 6FDA and BPDA in the second block structure to the PMDA in the first block structure is 90 to 25:10 to 75, preferably 90 to 30:10 to 70.
상기 제1 블록 구조에서의 PMDA 및 제2 블록 구조에서의 6FDA 및 BPDA 중에서 선택되는 1종 이상이 상기 몰비 범위를 벗어나는 경우 10 이상의 황색도를 가지거나 30ppm/℃ 이상의 열팽창계수를 가지는 문제가 있을 수 있다.If at least one of PMDA in the first block structure and 6FDA and BPDA in the second block structure is out of the molar ratio range, it may have a yellowness degree of 10 or more or a thermal expansion coefficient of 30 ppm / have.
또한, 상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 6FDA의 몰비는 90 내지 70 : 10 내지 30, 바람직하게는 90 내지 75 : 10 내지 25 인 것이 좋다.It is also preferable that the molar ratio of PMDA in the first block structure to 6FDA in the second block structure is 90 to 70: 10 to 30, preferably 90 to 75: 10 to 25.
상기 제1 블록 구조에서의 PMDA 및 제2 블록 구조에서의 6FDA가 상기 몰비 범위를 벗어나는 경우 PMDA의 비율이 범위보다 높아지면 선형열팽창계수는 매우 낮아지지만 황색도가 매우 높아지는 문제가 있을 수 있으며, 6FDA의 비율이 범위보다 높아지면 황색도는 매우 낮아지는 장점이 있지만 선형열팽창계수가 증가하는 문제가 있을 수 있다.If PMDA in the first block structure and 6FDA in the second block structure are out of the molar ratio range, if the ratio of PMDA is higher than the range, the linear thermal expansion coefficient may be very low, but the yellowness may be very high. Is higher than the range, the yellowness degree is very low, but the linear thermal expansion coefficient may increase.
또한, 상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 BPDA의 몰비는 90 내지 25 : 10 내지 75, 바람직하게는 85 내지 30 : 15 내지 70 인 것이 좋다.The molar ratio of the PMDA in the first block structure to the BPDA in the second block structure is preferably 90 to 25:10 to 75, and more preferably 85 to 30:15 to 70.
상기 제1 블록 구조에서의 PMDA 및 제2 블록 구조에서의 BPDA가 상기 몰비 범위를 벗어나는 경우 PMDA의 비율이 범위보다 높아지면 선형열팽창계수는 매우 낮아지지만 황색도가 매우 높아지는 문제가 있을 수 있으며, BPDA의 비율이 범위보다 높아지면 PMDA 대비 황색도는 낮아지는 장점이 있지만 선형열팽창계수가 증가되는 문제가 있을 수 있다.If the ratio of PMDA in the first block structure and the BPDA in the second block structure deviate from the above-mentioned molar ratio range, the linear thermal expansion coefficient may be very low but the yellowness may be very high. If BPDA Is higher than the range, the yellowness degree of PMDA is lowered, but the linear thermal expansion coefficient may be increased.
본 발명의 일 구현에서는 상기 제1 블록 구조에서의 PMDA대 제2 블록 구조에서의 6FDA대 제2 블록 구조에서의 BPDA의 몰비는 90 내지 50 : 5 내지 30 : 5 내지 20, 바람직하게는 90 내지 55 : 5 내지 30 : 5 내지 15인 것이 보다 바람직하다. In one embodiment of the present invention, the molar ratio of PMDA in the first block structure to 6FDA in the second block structure to BPDA in the second block structure is 90 to 50: 5 to 30: 5 to 20, More preferably from 55: 5 to 30: 5 to 15.
상기 제1 블록 구조에서의 PMDA 및 제2 블록 구조에서의 6FDA 및 BPDA가 상기 몰비 범위를 벗어나는 경우 10 이상의 황색도를 가지거나 30ppm/℃ 이상의 열팽창계수를 가지는 문제가 있을 수 있다.When the PMDA in the first block structure and the 6FDA and BPDA in the second block structure are out of the molar ratio range, there may be a problem of having a yellowness degree of 10 or more or a thermal expansion coefficient of 30 ppm /
또한, 상기 비스 TFDB로부터 유래된 반복단위 및 6FDA 및 BPDA 중에서 선택되는 1종 이상으로부터 유래된 반복단위를 포함하는 블록 구조는 비스 아미노 페닐 풀루오렌 (9,9-Bis(4-aminophenyl)fluorene, FDA) 및 비스 플루오로 아미노 페닐 플루오렌 ( 9,9-Bis(3-fluoro-4-aminophenyl)fluorene, FFDA) 중에서 선택된 1종 이상으로부터 유래된 반복단위를 더 포함할 수 있다. 상기 FDA 및 FFDA 중에서 선택된 1종 이상을 더 포함하는 경우 유리전이 온도를 개선시키는 효과를 얻을 수 있다.Also, the block structure containing repeating units derived from bis TFDB and repeating units derived from at least one selected from 6FDA and BPDA may be a 9,9-bis (4-aminophenyl) fluorene, FDA ) And bis (4-fluoro-4-aminophenyl) fluorene (FFDA). When at least one selected from the above-mentioned FDA and FFDA is further contained, an effect of improving the glass transition temperature can be obtained.
상기 FDA 및 FFDA 중에서 선택된 1종 이상은 디아민 총 몰에 대하여 1몰% 내지 20몰%, 바람직하게는 1 내지 10의 함량으로 포함되는 것이 좋다. 상기 FDA 및 FFDA 중에서 선택된 1종 이상이 상기 범위를 벗어나는 경우 1몰% 미만인 경우 함량이 적어 유리전이온도 개선효과가 거의 없을 수 있으며, 20몰%을 초과하는 경우 황색도 및 열팽창계수가 저하되는 문제가 있을 수 있다.It is preferable that at least one selected from the above FDA and FFDA is contained in an amount of 1 mol% to 20 mol%, preferably 1 to 10 mol, based on the total molar amount of diamine. When the content of the at least one selected from the above FDA and FFDA is out of the above range, the content is less than 1 mol% and the glass transition temperature may not be improved. When the content is more than 20 mol%, the yellowness and thermal expansion coefficient .
상술한 폴리아믹산을 이미드화하여 폴리이미드 수지를 제조하는 방법은 특별히 한정되는 것이 아니고, 종래부터 공지된 방법을 사용할 수 있다. 상기 폴리아믹산의 이미드화시키는 방법으로는 열이미드화법, 화학이미드화법, 열이미드화법과 화학이미드화법을 병용하여 적용할 수 있는데, 열이미드화법을 사용하는 것이 보다 바람직하다. 보다 바람직하기는 화학이미드화법을 실시한 용액을 침전을 실시한 후 정제, 건조 후 다시 용매에 녹여서 사용한다. 이 용매는 상기에 언급한 용매와 같다. 화학 이미드화법은 폴리아믹산 용액에 아세트산무수물 등의 산무수물로 대표되는 탈수제와 이소퀴놀린, β-피콜린, 피리딘 등의 3급 아민류 등으로 대표되는 이미드화 촉매를 적용시키는 방법이다. 화학 이미드화법에 열 이미드화법을 병용할 수 있으며, 가열 조건은 폴리아믹산 용액의 종류, 필름의 두께 등에 의하여 변동될 수 있다.The method for producing the polyimide resin by imidizing the polyamic acid described above is not particularly limited, and conventionally known methods can be used. As the imidization method of the polyamic acid, a thermal imidation method, a chemical imidization method, a thermal imidation method and a chemical imidation method may be used in combination, and it is more preferable to use a heat imidation method. More preferably, the solution subjected to the chemical imidation method is subjected to precipitation, followed by purification, drying, and then dissolving in a solvent. This solvent is the same as the above-mentioned solvent. In the chemical imidization method, a dehydrating agent represented by an acid anhydride such as acetic anhydride and a imidization catalyst represented by tertiary amines such as isoquinoline, p-picoline, and pyridine are applied to a polyamic acid solution. The thermal imidation method can be used in combination with the chemical imidization method, and the heating conditions can be varied depending on the type of the polyamic acid solution, the thickness of the film, and the like.
본 발명의 다른 일 구현예에 따르면, 상기 폴리이미드 수지로 제조된 폴리이미드 필름을 제공하는 것이다. According to another embodiment of the present invention, there is provided a polyimide film made of the polyimide resin.
상기 폴리이미드 필름은 수득된 폴리아믹산 용액을 이미드화한 후, 이미드화한 용액을 제 2 용매에 투입하고 침전, 여과 및 건조하여 폴리이미드 수지의 고형분을 수득하고, 수득된 폴리이미드 수지 고형분을 제 1 용매에 용해시킨 폴리이미드 용액을 이용하여 제막공정을 통하여 얻을 수도 있다.The polyimide film is obtained by imidizing the obtained polyamic acid solution, adding the imidized solution to a second solvent, precipitating, filtering and drying to obtain a solid component of the polyimide resin, 1 < / RTI > solvent dissolved in a solvent.
즉, 상술한 폴리아믹산을 화학 이미드화법으로 폴리이미드 수지를 제조한 후 침전, 건조하여 용매에 녹여 용액화 하여 지지체에 도포하는데 도포된 용액은 건조 공기 및 열처리에 의해 지지체 위에서 필름화된다. That is, the above-mentioned polyamic acid is formed into a polyimide resin by a chemical imidization method, followed by precipitation, drying, dissolution in a solvent, and dissolution into a solvent to be applied to a support film. The solution is filmed on the support by dry air and heat treatment.
상기 제 1 용매는 폴리아믹산 용액 중합시 사용한 용매와 동일한 용매를 사용할 수 있고, 상기 제 2 용매는 폴리아믹산 수지의 고형분을 수득하기 위하여 제 1 용매보다 극성이 낮은 것을 사용하며, 구체적으로는 물, 알코올류, 에테르류 및 케톤류 중 선택된 1종 이상인 것일 수 있다. 이때, 상기 제 2 용매의 함량은 특별히 한정되는 것은 아니지만, 폴리아믹산 용액의 중량 대비 5 내지 20 중량배인 것이 바람직하다.The first solvent may be the same solvent as the solvent used in the polyamic acid solution polymerization. The second solvent may be one having a lower polarity than that of the first solvent in order to obtain a solid content of the polyamic acid resin, Alcohols, ethers, and ketones. At this time, the content of the second solvent is not particularly limited, but is preferably 5 to 20 times by weight of the polyamic acid solution.
상기 도포된 필름의 필름화 온도 조건은 250~500℃가 바람직하며 지지체로는 유리판, 알루미늄박, 순환 스테인레스 벨트, 스테인레스 드럼 등을 사용할 수 있다.The film-forming temperature condition of the applied film is preferably 250 to 500 ° C, and a glass plate, an aluminum foil, a circulating stainless belt, a stainless steel drum, or the like can be used.
필름화에 필요한 처리 시간은 온도, 지지체의 종류, 도포된 폴리아믹산 용액의 양, 촉매의 혼합조건에 따라 다르며 일정한 시간으로 한정되어 있지 않다. 바람직하기로는 5분~30분 사이의 범위에서 시행하는 것이 좋다.The time required for film formation varies depending on the temperature, the type of the support, the amount of the applied polyamic acid solution, and the mixing conditions of the catalyst, and is not limited to a certain time. Preferably in a range of 5 minutes to 30 minutes.
열처리온도는 100~500℃ 사이에서 진행하며 처리 시간은 1분~30분 사이에서 진행한다. 열처리하여 건조 및 이미드화를 완료시킨 후, 지지체로부터 박리한다. The heat treatment temperature is in the range of 100 to 500 ° C. and the treatment time is 1 to 30 minutes. After the drying and imidization are completed by heat treatment, the support is peeled off.
얻어지는 폴리이미드 필름의 두께는 특별히 한정되는 것은 아니지만, 10~250㎛의 범위인 것이 바람직하고, 보다 바람직하게는 10~100㎛인 것이 좋다.The thickness of the obtained polyimide film is not particularly limited, but is preferably in the range of 10 to 250 탆, more preferably 10 to 100 탆.
본 발명에서 제조된 폴리이미드 필름은 50~350℃에서 열팽창계수(Coefficient of Thermal Expansion)가 30ppm/℃ 이하인 것이 바람직하다. The polyimide film produced in the present invention preferably has a coefficient of thermal expansion of 30 ppm / ° C or less at 50 to 350 ° C.
본 발명에서 제조된 폴리이미드 필름은 두께 10~100㎛를 기준으로 UV분광계로 투과도 측정시 550㎚에서 투과도가 85% 이상, 바람직하게는 90% 이상인 것이 좋다. The polyimide film produced in the present invention preferably has a transmittance of 85% or more, preferably 90% or more at 550 nm when measuring the transmittance with a UV spectrometer based on a thickness of 10 to 100 탆.
또한 폴리이미드 필름은 필름 두께 10~100㎛를 기준으로 황색도가 10 이하, 바람직하게는 5 이하인 것이 좋다.The polyimide film preferably has a yellowing degree of 10 or less, preferably 5 or less, based on a film thickness of 10 to 100 탆.
이하, 본 발명을 실시예를 통하여 보다 상세히 설명하나, 본 발명의 범위가 하기 실시예로 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited to the following Examples.
<실시예 1> ≪ Example 1 >
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 273.882g을 채운 후에 TFDB 28.821을 용해한 후, PMDA 19.631g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 3.202g을 용해시킨 후, 6FDA 4.443g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.273.882 g of N-methyl-2-pyrrolidone (NMP) was charged while passing nitrogen through a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, and then TFDB 28.821 was dissolved. g, and the mixture was stirred for 3 hours. Then, 3.202 g of TFDB was further dissolved, and then 4.443 g of 6FDA was added, followed by reaction for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<실시예 2> ≪ Example 2 >
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 284.922g을 채운 후에 TFDB 25.618g을 용해한 후, PMDA 17.450g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 6.405g을 용해시킨 후, 6FDA 8.885g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.284.922 g of N-methyl-2-pyrrolidone (NMP) was charged while passing nitrogen through a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, 25.618 g of TFDB was dissolved, And the mixture was stirred for 3 hours. Thereafter, 6.405 g of TFDB was further dissolved, and 8.885 g of 6FDA was added thereto, followed by reaction for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<실시예 3>≪ Example 3 >
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 295.963g을 채운 후에 TFDB 22.416g을 용해한 후, PMDA 15.268g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 9.607g을 용해시킨 후, 6FDA 13.328g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.Into a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser was charged with 295.963 g of N-methyl-2-pyrrolidone (NMP) while passing nitrogen, 22.416 g of TFDB was dissolved therein, And the mixture was stirred for 3 hours. After the addition of 9.607 g of TFDB, 13.328 g of 6FDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<실시예 4><Example 4>
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 295.963g을 채운 후에 TFDB 9.607g을 용해한 후, 6FDA 13.328g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 22.416g을 용해시킨 후, PMDA 15.268g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.Nitrogen was passed through a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, and 295.963 g of N-methyl-2-pyrrolidone (NMP) was charged. After 9.607 g of TFDB was dissolved, And the mixture was stirred for 3 hours. Thereafter, 22.416 g of TFDB was further dissolved, and 15.268 g of PMDA was added thereto, followed by reaction for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<실시예 5> ≪ Example 5 >
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 281.419g을 채운 후에 TFDB 16.012g을 용해한 후, PMDA 10.906g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 16.012g을 용해시킨 후, BPDA 14.711g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 350℃ 도달 후 10분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.N-methyl-2-pyrrolidone (NMP) was charged in a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, nitrogen was passed through the reactor, and 16.012 g of TFDB was dissolved. 10.906 g was added thereto, followed by stirring for 3 hours. Thereafter, 16.012 g of TFDB was further dissolved, and 14.711 g of BPDA was added thereto, followed by reaction for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 ° C for 20 minutes, reached 350 ° C, and was cured by isothermal treatment for 10 minutes. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<실시예 6> ≪ Example 6 >
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N,N-디메틸아세트아마이드(DMAc) 283.076g을 채운 후에 TFDB 13.450g을 용해한 후, PMDA 9.161g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 23.825g과 FFDA 1.384g을 용해시킨 후, BPDA 22.949g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 20 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 350℃ 도달 후 10분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.Nd, N-dimethylacetamide (DMAc) 283.076 g was charged into a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, nitrogen was passed through the reactor and 13.450 g of TFDB was dissolved. And the mixture was stirred for 3 hours. After that, 23.825 g of TFDB and 1.384 g of FFDA were dissolved, and then 22.949 g of BPDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 20% by weight was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 ° C for 20 minutes, reached 350 ° C, and was cured by isothermal treatment for 10 minutes. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<실시예 7> ≪ Example 7 >
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 288.638을 채운 후에 TFDB 22.416g을 용해한 후, PMDA 15.268g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 9.607g을 용해시킨 후, 6FDA 8.885g을 넣고 3시간 반응하였다. 마지막으로 BPDA 2.942g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.N-methyl-2-pyrrolidone (NMP) 288.638 was charged while passing nitrogen through a 500-ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, 22.416 g of TFDB was dissolved, and PMDA 15.268 g, and the mixture was stirred for 3 hours. After that, 9.607 g of TFDB was further dissolved, and then 8.885 g of 6FDA was added and reacted for 3 hours. Finally, 2.942 g of BPDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<실시예 8> ≪ Example 8 >
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 288.638을 채운 후에 TFDB 22.416g을 용해한 후, PMDA 15.268g을 투입한 후 3시간 교반하였다. 그 후 추가로 TFDB 6.405g을 용해시킨 후, 6FDA 8.885g을 넣고 3시간 반응하였다. 마지막으로 TFDB 3.202g을 용해시킨 후, BPDA 2.942g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.N-methyl-2-pyrrolidone (NMP) 288.638 was charged while passing nitrogen through a 500-ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, 22.416 g of TFDB was dissolved, and PMDA 15.268 g, and the mixture was stirred for 3 hours. Then, 6.405 g of TFDB was further dissolved, and 8.885 g of 6FDA was added thereto, followed by reaction for 3 hours. Finally, after dissolving 3.202 g of TFDB, 2.942 g of BPDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<비교예 1> ≪ Comparative Example 1 &
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 268.362g을 채운 후에 TFDB 32.023g을 용해한 후, PMDA 20.721g을 투입한 후 3시간 교반하였다. 그 후 6FDA 2.221g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.Into a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, 268.362 g of N-methyl-2-pyrrolidone (NMP) was charged while passing nitrogen, 32.023 g of TFDB was dissolved, And the mixture was stirred for 3 hours. Then 2.221 g of 6FDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<비교예 2> ≪ Comparative Example 2 &
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 295.963g을 채운 후에 TFDB 32.023g을 용해한 후, PMDA 15.268g을 투입한 후 3시간 교반하였다. 그 후 6FDA 13.328g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.Into a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser was charged with 295.963 g of N-methyl-2-pyrrolidone (NMP) while passing nitrogen, 32.023 g of TFDB was dissolved, And the mixture was stirred for 3 hours. Then, 13.328 g of 6FDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<비교예 3> ≪ Comparative Example 3 &
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 295.963g을 채운 후에 TFDB 32.023g을 용해한 후, 6FDA 13.328g을 투입한 후 3시간 교반하였다. 그 후 PMDA 15.268g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.Into a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser was charged with 295.963 g of N-methyl-2-pyrrolidone (NMP) while passing nitrogen, 32.023 g of TFDB was dissolved, And the mixture was stirred for 3 hours. Then, 15.268 g of PMDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
<비교예 4> ≪ Comparative Example 4 &
반응기로써 교반기, 질소주입장치, 적하깔때기, 온도조절기 및 냉각기를 부착한 500ml 반응기에 질소를 통과시키면서 N-메틸-2-피롤리돈(NMP) 301.483g을 채운 후에 TFDB 32.023g을 용해한 후, PMDA 14.178g을 투입한 후 3시간 교반하였다. 그 후 6FDA 15.549g을 넣고 15시간 반응하였다. 그 결과 고형분의 농도가 17 중량%인 폴리아믹산 용액을 수득하였다. 반응 종료 후 수득된 용액을 유리판에 도포한 후 80℃의 열풍으로 20분 처리하고 370℃ 도달 후 30분간 등온 처리하여 경화하였다. 그 후 서서히 냉각해 유리판으로부터 분리하여 폴리이미드 필름을 얻었다.Into a 500 ml reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser, 301.483 g of N-methyl-2-pyrrolidone (NMP) was charged while passing nitrogen, 32.023 g of TFDB was dissolved, And the mixture was stirred for 3 hours. After that, 15.549 g of 6FDA was added and reacted for 15 hours. As a result, a polyamic acid solution having a solid concentration of 17 wt% was obtained. After the completion of the reaction, the obtained solution was coated on a glass plate, treated with hot air at 80 DEG C for 20 minutes, reached to 370 DEG C, is isothermalized for 30 minutes, and cured. Thereafter, the film was gradually cooled and separated from the glass plate to obtain a polyimide film.
상기 실시예 및 비교예로 제조된 폴리이미드 필름을 하기의 방법으로 물성을 평가하였으며, 그 결과를 하기 표 1에 나타내었다. The properties of the polyimide films prepared in Examples and Comparative Examples were evaluated by the following methods. The results are shown in Table 1 below.
(1) 투과도(TT) 측정(1) Measurement of permeability (TT)
UV분광계(코티카 미놀타 CM-3700d)를 이용하여 550nm에서 투과도를 3번 측정 하여 평균값을 표 1에 기재하였다.The transmittance was measured three times at 550 nm using a UV spectrometer (Kotikaminolta CM-3700d) and the average values are shown in Table 1.
(2) 황색도(Y.I.) 측정(2) Yellowness (Y.I.) measurement
UV분광계 (Konita Minolta, CM-3700d)를 이용하여 ASTM E313규격으로 황색도를 측정하였다.Yellowness was measured according to ASTM E313 standard using a UV spectrometer (Konita Minolta, CM-3700d).
(3) 열팽창 계수(CTE) 측정(3) Coefficient of thermal expansion (CTE) measurement
TMA(TA Instrument사, Q400)을 이용하여 TMA- Method에 따라 2번에 걸쳐 50~350℃에서의 선형 열팽창 계수를 측정하였다. 시편의 크기는 4mm×24mm, 하중은 0.02N으로 승온 속도는 10℃/min으로 하였다. 필름을 제막하고 열처리를 통하여 필름 내에 잔류 응력이 남아 있을 수 있기 때문에 첫 번째 작동(Run)으로 잔류응력을 완전히 제거 후, 두 번째 값을 실측정치로 제시하였다.The linear thermal expansion coefficient at 50 ~ 350 ° C was measured twice using TMA (TA Instrument, Q400) according to the TMA method. The size of the specimen was 4 mm × 24 mm, the load was 0.02 N, and the temperature raising rate was 10 ° C./min. Since the residual stress may remain in the film through the film formation and heat treatment, the residual stress is completely removed in the first run and the second value is presented as the measured value.
두께(㎛)film
Thickness (㎛)
시
예room
city
Yes
-TFDB(10)-6FDA(10)TFDB 90 - PMDA 90 -
-TFDB (10) -6FDA (10)
-TFDB(20)-6FDA(20)TFDB 80 - PMDA 80 -
-TFDB (20) -6FDA (20)
-TFDB(30)-6FDA(30)The TFDB 70 - the PMDA 70 -
-TFDB (30) -6FDA (30)
TFDB(70)-PMDA(70)TFDB (30) -6FDA (30)
The TFDB 70 - the PMDA 70 -
-TFDB(50)-BPDA(50)TFDB 50-PMDA 50,
-TFDB (50) -BPDA (50)
-TFDB(62)-FFDA(3)-BPDA(65)TFDB (35) -PMDA (35)
-TFDB (62) -FFDA (3) -BPDA (65)
-TFDB(30)-6FDA(20)-BPDA(10)The TFDB 70 - the PMDA 70 -
-TFDB (30) -6FDA (20) -BPDA (10)
-TFDB(20)-6FDA(20)
-TFDB(10)-BPDA(10)The TFDB 70 - the PMDA 70 -
-TFDB (20) -6FDA (20)
-TFDB (10) -BPDA (10)
교
예ratio
School
Yes
-PMDA(95)-6FDA(5)The TFDB (100)
-PMDA (95) -6FDA (5)
-PMDA(70)-6FDA(30)The TFDB (100)
-PMDA (70) -6FDA (30)
-6FDA(30)-PMDA(70)The TFDB (100)
-6FDA (30) -PMDA (70)
-PMDA(65)-6FDA(35)The TFDB (100)
-PMDA (65) -6FDA (35)
상기 표 1에서 보는 바와 같이 실시예와 비교예를 각각 비교해보면 TFDB를 나누어서 투입하는 실시예 1 내지 8의 경우 황색도, 투과도 및 선형열팽창계수 모두를 우수한 수준으로 만족하고 있으나, 비교예 1은 투과도가 현저히 저하되었으며, 비교예 2 내지 4는 선형열팽창계수가 현저하게 저하되는 물성을 보였다. As shown in Table 1, when Examples and Comparative Examples are compared with each other, in Examples 1 to 8 in which TFDB is dividedly introduced, both of the yellowness degree, the transmittance and the linear thermal expansion coefficient are satisfactory, And Comparative Examples 2 to 4 showed properties that the linear thermal expansion coefficient was remarkably lowered.
이로부터 실시예 1 내지 8은 TFDB를 나누어서 투입하여 황색도 및 선형열팽계수의 트레이드 오프(trade-off) 관계를 극복하였음을 알 수 있었다. From these results, it can be seen that Examples 1 to 8 overcome the trade-off relationship between yellowness and linear thermal expansion coefficient by dividing TFDB.
또한, 1차 디안하이드라이드를 PMDA로 2차 디안하이드라이드를 6FDA로 할 경우 PMDA 함량은 30ppm/℃ 이하의 선형열팽창계수를 갖기 위해 65몰% 넘는 것이 바람직하고, 황색도 저하를 막기 위해 90몰%를 넘지 않는 것이 바람직하다. 또한 2차 디안하이드라이드를 BPDA로 적용하여도 같은 효과를 볼 수 있으며, 추가적으로 FFDA를 적용하여도 TFDB를 분할 투입함으로써 선형열팽창계수를 개선시킬 수 있다. 실시예 3 및 4를 보면 1차 투입 디안하이드라이드가 PMDA일 경우가 6FDA일 경우보다 개선 효과가 큰 것을 알 수 있다. 그리고 실시예 7 및 8을 보면 3차 디안하이드라이드 적용 시 TFDB의 분할 투입이 많아질수록 선형열팽창계수는 더욱 개선됨을 확인할 수 있었다.When the primary dianhydride is PMDA and the secondary dianhydride is 6FDA, the PMDA content is preferably more than 65 mol% in order to have a linear thermal expansion coefficient of 30 ppm / DEG C or lower, and 90 mol %. In addition, the same effect can be obtained by applying the second dianhydride to BPDA, and the linear thermal expansion coefficient can be improved by additionally adding TFDB even if FFDA is applied. It can be seen from Examples 3 and 4 that the improvement effect is greater when the first-input dianhydride is PMDA than when it is 6FDA. In Examples 7 and 8, it was confirmed that the linear thermal expansion coefficient was further improved as the amount of TFDB added in the tertiary dianhydride was increased.
Claims (18)
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KR1020170184018A KR102271028B1 (en) | 2017-12-29 | 2017-12-29 | Method of preparing Polyamic acid and Polyamic acid, Polyimide resin and Polyimide film thereby |
CN201880084832.2A CN111542562B (en) | 2017-12-29 | 2018-12-26 | Method for preparing polyamic acid, polyamic acid prepared by same, polyimide resin and polyimide film |
JP2020532593A JP6980919B2 (en) | 2017-12-29 | 2018-12-26 | Method for producing polyamic acid, polyamic acid, polyimide resin, and polyimide film produced from this. |
PCT/KR2018/016671 WO2019132515A1 (en) | 2017-12-29 | 2018-12-26 | Method for preparing polyamic acid, and polyamic acid, polyimide resin, and polyimide film which are manufactured thereby |
TW107147873A TWI785179B (en) | 2017-12-29 | 2018-12-28 | Method of preparing polyamic acid and polyamic acid, polyimide resin, polyimide film and image display element thereby |
TW110114548A TW202132413A (en) | 2017-12-29 | 2018-12-28 | Method of preparing polyamic acid and polyamic acid, polyimide resin, polyimide film and image display element thereby |
JP2021187189A JP7206358B2 (en) | 2017-12-29 | 2021-11-17 | Method for producing polyamic acid, polyamic acid produced therefrom, polyimide resin, and polyimide film |
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KR (1) | KR102271028B1 (en) |
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JP2000290372A (en) * | 1999-04-08 | 2000-10-17 | Kanegafuchi Chem Ind Co Ltd | Polyimide film |
WO2015122032A1 (en) * | 2014-02-14 | 2015-08-20 | 旭化成イーマテリアルズ株式会社 | Polyimide precursor and resin composition containing same |
KR20160037489A (en) * | 2014-09-29 | 2016-04-06 | 주식회사 엘지화학 | Polyimide-based solution and polyimide-based film prepared by using same |
KR20170088981A (en) * | 2015-03-13 | 2017-08-02 | 아사히 가세이 가부시키가이샤 | Polyimide precursor resin composition |
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KR20110010009A (en) * | 2009-07-23 | 2011-01-31 | 코오롱인더스트리 주식회사 | Manufacturing method of polyimide, polyimide manufactured by thereof and film manufactured using said polyimide |
US20130289202A1 (en) * | 2011-01-07 | 2013-10-31 | Toray Industries, Inc. | Polyamic acid resin composition and method of producing the same |
CN107522860B (en) * | 2014-05-30 | 2020-09-25 | 株式会社Lg化学 | Polyimide-based liquid and polyimide-based film prepared using the same |
KR101992525B1 (en) * | 2014-07-17 | 2019-06-24 | 아사히 가세이 가부시키가이샤 | Resin precursor, resin composition containing same, polyimide resin membrane, resin film, and method for producing same |
ES2760976T3 (en) * | 2015-02-11 | 2020-05-18 | Kolon Inc | Polyamic acid, polyimide resin and polyimide film |
WO2016209060A1 (en) * | 2015-06-26 | 2016-12-29 | 코오롱인더스트리 주식회사 | Polyamide-imide precursor, polyamide-imide film, and display device comprising same |
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2017
- 2017-12-29 KR KR1020170184018A patent/KR102271028B1/en active IP Right Grant
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2018
- 2018-12-26 CN CN201880084832.2A patent/CN111542562B/en active Active
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- 2018-12-26 JP JP2020532593A patent/JP6980919B2/en active Active
- 2018-12-28 TW TW107147873A patent/TWI785179B/en active
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Patent Citations (4)
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JP2000290372A (en) * | 1999-04-08 | 2000-10-17 | Kanegafuchi Chem Ind Co Ltd | Polyimide film |
WO2015122032A1 (en) * | 2014-02-14 | 2015-08-20 | 旭化成イーマテリアルズ株式会社 | Polyimide precursor and resin composition containing same |
KR20160037489A (en) * | 2014-09-29 | 2016-04-06 | 주식회사 엘지화학 | Polyimide-based solution and polyimide-based film prepared by using same |
KR20170088981A (en) * | 2015-03-13 | 2017-08-02 | 아사히 가세이 가부시키가이샤 | Polyimide precursor resin composition |
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TW201934612A (en) | 2019-09-01 |
JP2022010372A (en) | 2022-01-14 |
CN111542562B (en) | 2023-04-18 |
JP6980919B2 (en) | 2021-12-15 |
WO2019132515A1 (en) | 2019-07-04 |
JP2021505744A (en) | 2021-02-18 |
TWI785179B (en) | 2022-12-01 |
KR102271028B1 (en) | 2021-06-29 |
CN111542562A (en) | 2020-08-14 |
TW202132413A (en) | 2021-09-01 |
JP7206358B2 (en) | 2023-01-17 |
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