KR101512136B1 - The apparatus for attaching the sustrates - Google Patents

Abstract

The present invention relates to a substrate adhering apparatus in which the gap between both upper and lower substrates is constantly maintained with respect to all portions to ensure uniformity in spacing between adhering substrates, 1. A substrate adhering apparatus for adhering a substrate, comprising: an upper substrate adsorption plate for adsorbing an upper substrate; An upper plate driving unit for driving the upper substrate attracting plate; A first parallelism maintaining elastic coupling unit coupling the upper substrate suction plate to the upper plate driving unit and coupling the upper substrate suction plate such that the upper substrate suction plate is elastically changed in parallelism with the upper plate driving unit; An upper gap holding jig extending outward from the upper substrate attracting plate to form a plurality of upper jig; A lower substrate adsorption plate for adsorbing the lower substrate; A lower plate driving unit for driving the lower substrate adsorption plate; A second parallelism holding elastic coupling unit coupling the lower substrate suction plate to the lower plate driving unit and coupling the lower substrate suction plate such that the lower substrate suction plate is elastically changed in parallel with the lower plate driving unit; A lower space holding jig extending outward from the lower substrate adsorption plate and formed with a plurality of holes; And a gap holding member provided at least at one side of the upper gap holding jig or the lower gap holding jig and maintaining a gap between the upper substrate attracting plate and the lower substrate attracting plate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate adhering apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate cementing apparatus, and more particularly, to a substrate cementing apparatus in which the gap between both upper and lower substrates is constantly maintained with respect to all portions to ensure uniformity of spacing between the cementing substrates.

In recent years, for convenience of use, a touch screen panel is widely used in mobile communication devices such as mobile phones, tablet PCs, and notebooks, and electronic devices such as navigation devices.

Such a touch screen panel is largely divided into a resistive type touch panel, a capacitive type, and an infrared type touch panel.

Among these, a capacitive touch screen panel, which is the most widely used method, has a structure in which a film or a panel formed with a transparent electrode is mounted on a liquid crystal panel and a voltage is applied to each corner or corner of the film or panel so that a uniform electric field is generated on the transparent electrode A voltage drop is generated by touching a point through an input means such as a pen or a finger to find a position coordinate.

In recent years, in order to secure and protect the durability of the surface of the touch screen panel, a window glass made of tempered glass or a structure for installing the cover glass on the entire surface of the touch screen panel or the display panel is widely used.

In the manufacturing process of the touch screen panel having such a structure, a process of stably bonding the window glass to the entire surface of the touch screen panel is inevitably performed. As a method of bonding the window glass to the front surface of the touch screen panel, a method of applying a combination resin on the front surface of the touch screen panel and irradiating ultraviolet rays in a state in which the window glass is in close contact with the top surface, .

In a panel laminating process using a resin, a certain kind of dam is used to confine the area to be coated with the resin before application of the combined resin to the entire surface of the panel or window glass in advance, Is formed on the surface of the panel or the window glass.

However, the method of forming such a dam line has a problem that the process itself is complicated and a lot of defects occur. Recently, there has been introduced a method of curing a joining resin which is irradiated with ultraviolet rays from the side of a panel and a window glass and which spreads to the edge of the panel without forming a dam line so that the resin itself is prevented from being pushed out of the panel have.

It is very important to ensure the uniformity of the spacing in which the interval between both substrates to be bonded together in a process of attaching the other substrates on one panel or substrate is kept constant with respect to all the parts. The same optical or display characteristics can be ensured for all parts of the bonded substrate and the occurrence of defects can be prevented.

Accordingly, various methods for securing the uniformity of spacing in the process of attaching the substrates have been proposed. However, since the process is complicated and there is a possibility of occurrence of errors, Development is urgently required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate adhering apparatus capable of reliably ensuring uniformity of spacing between both substrates to be adhered by using a mechanical structure which is free from the occurrence of errors in the driving process.

According to an aspect of the present invention, there is provided a substrate adhering apparatus for adhering an upper substrate and a lower substrate, the apparatus comprising: an upper substrate adsorption plate for adsorbing an upper substrate; An upper plate driving unit for driving the upper substrate attracting plate; A first parallelism maintaining elastic coupling unit coupling the upper substrate suction plate to the upper plate driving unit and coupling the upper substrate suction plate such that the upper substrate suction plate can be elastically changed in parallelism with the upper plate driving unit according to the bonding pressure; An upper gap holding jig extending outward from the upper substrate attracting plate to form a plurality of upper jig; A lower substrate adsorption plate for adsorbing the lower substrate; A lower plate driving unit for driving the lower substrate adsorption plate; A second parallelism maintaining elastic coupling unit coupling the lower substrate adsorption plate to the lower plate driving unit and coupling the lower substrate adsorption plate such that the lower substrate adsorption plate can be elastically changed in parallelism with the lower plate driving unit according to the adhesion pressure; A lower space holding jig extending outward from the lower substrate adsorption plate and formed with a plurality of holes; And a gap holding member provided at least at one side of the upper gap holding jig or the lower gap holding jig and maintaining a gap between the upper substrate attracting plate and the lower substrate attracting plate.

In the present invention, the parallelism maintaining elastic coupling unit may include a free rotation coupling unit that freely rotatably couples the center portion of the upper substrate attracting plate to the central portion of the upper plate driving unit; And a plurality of elastic engaging portions provided at a plurality of positions of the edge portions of the upper substrate attracting plate and elastically coupling the upper substrate attracting plate to the upper plate driving portion to maintain parallelism.

In the present invention, it is preferable that the elastic coupling portion is any one of a pneumatic cylinder, a rubber material, and a spring.

The free-rotation coupling portion may be a floating ball or a floating joint capable of 360 ° free rotation.

According to the substrate cementing apparatus of the present invention, since the uniformity of the gap between the upper substrate and the lower substrate can be matched by using a simple mechanical structure without any possibility of error, the process time can be shortened, There is an advantage.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing the structure of a substrate laminating apparatus according to an embodiment of the present invention; Fig.
2 is a plan view showing a structure of a lower substrate adsorption plate according to an embodiment of the present invention.
3 is a view showing the structure of a substrate laminating apparatus according to another embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

≪ Example 1 >

The substrate sticking apparatus 100 according to the present embodiment includes components of a general substrate sticking apparatus as it is. 1, the upper substrate attracting plate 110, the upper plate driving part 120, the first parallelism maintaining elastic coupling part 130, and the upper gap holding jig 140 are different from each other, The plate 150, the lower plate driving part 160, the second parallelism maintaining elastic coupling part 170, and the lower space holding jig 180 are different from the conventional substrate cementing device. Therefore, the different components described above will be mainly described, and a description of the same components as those of the conventional substrate cementing apparatus will be omitted.

First, the upper substrate adsorption plate 110 approaches the lower substrate 2 in a state of adsorbing the upper substrate 1 to be adhered, and adheres the two substrates together. Accordingly, the upper substrate adsorption plate 110 is provided with adsorption means for adsorbing the back surface of the upper substrate such as a vacuum suction hole (not shown).

The upper substrate attracting plate 110 is composed of a plate having an area enough to absorb the upper substrate 1 sufficiently. At this time, as shown in FIG. 2, a plurality of upper gap holding jigs 140, which will be described later, are formed at an outer edge of the upper substrate attracting plate 110.

Meanwhile, in the present embodiment, the upper substrate attracting plate 110 is vertically or horizontally moved while being coupled to the upper plate driving unit 120, and the substrate laminating process is performed. At this time, the upper substrate attracting plate 110 is coupled to the upper plate driving part 120 by the first parallelism-maintaining elastic coupling part 130 in this embodiment.

Next, the upper plate driving unit 120 is a component that is coupled with the upper substrate attracting plate 110 to drive the upper substrate attracting plate 110 in the vertical direction or the horizontal direction, as described above.

1, the first parallelism-maintaining elastic coupling unit 130 is configured to couple the upper substrate adsorption plate 110 to the upper plate driving unit 120, and the upper substrate adsorption plate 110 Is elastically coupled to the upper plate driving part 120 so that the parallelism can be changed. Therefore, in this embodiment, the first parallelism-maintaining elastic coupling part 130 is composed of the free rotation coupling part 131 and the elastic coupling part 135 as shown in FIG.

The free-rotation coupling unit 131 is a component that connects the center of the upper substrate attracting plate 110 to the center of the upper plate driving unit 120 so as to freely turn 360 °. The structure of the free-rotation coupling part 131 for this purpose may be variously changed, for example, as shown in FIG. 1, it may be constituted by a floating ball. The floating ball 131 is installed in an installation groove formed between the upper substrate attracting plate 110 and the upper plate driving unit 120 and is also in contact with the upper substrate attracting plate 110 through a curved surface 133, (120) and a curved surface (132) so as to be freely rotatable.

Next, as shown in FIG. 1, a plurality of the elastic coupling portions 135 are provided. Specifically, the elastic coupling portions 135 are provided at a plurality of points of the edge portion of the upper substrate suction plate 110, and the upper substrate suction plate 110 is elastically coupled to the upper plate driving portion 120 . The elastic coupling part 135 may have various structures for elastically supporting and supporting the upper substrate attracting plate 110 and the upper plate driving part 120. For example, as shown in FIG. 1, (ball plunger) structure. The elastic coupling portion may be formed of any one of a pneumatic cylinder, a rubber material, and a spring.

The upper space holding jig 140 is formed at a position facing the lower space holding jig 180. The upper space holding jig 140 extends outward from the upper substrate attracting plate 110 and has a plurality of openings. Therefore, when the upper substrate attracting plate 110 and the lower substrate attracting plate 150 approach each other, the upper gap holding jig 140 and the lower gap holding jig 180 approach each other. At this time, the spacing members 190 are spaced apart from each other by the spacing members 190 interposed between the upper space-maintaining jig 140 and the lower space-maintaining jig 180, The spacing between the substrate 1 and the lower substrate 2 is maintained, and the uniformity of the gap between the substrates is ensured.

In this embodiment, the upper space holding jig 140 is preferably formed integrally with the upper substrate attracting plate 110 and has a lower surface having the same height as the lower surface of the upper substrate attracting plate 110 .

Next, the lower substrate adsorption plate 150 is a component for adsorbing and fixing the lower substrate 2, as shown in FIG. At this time, the combining resin (R) may be coated on the lower substrate (2). In this embodiment, the lower substrate adsorption plate 150 is also coupled to the lower plate driving unit 160 in the same structure as the upper substrate adsorption plate 110.

The lower plate driving unit 160 is a component for driving the lower substrate adsorption plate 150 in a vertical direction or a horizontal direction and serves to fix the lower substrate adsorption plate 150 in the process of adhesion.

The second parallelism maintaining elastic coupling part 170 may be configured to couple the lower substrate adsorption plate 150 to the lower plate driving part 160 such that the lower substrate adsorption plate 150 contacts the lower plate driving part 160 So that the parallelism can be changed elastically. The second parallelism maintaining elastic coupling part 170 may have substantially the same structure as the first parallelism maintaining elastic coupling part 130. Therefore, a detailed description thereof will be omitted.

1 and 2, the lower space-holding jig 180 is extended outward from the lower substrate suction plate 150, and a plurality of the lower space- .

The interval holding member 190 is installed at least either one of the upper gap holding jig 140 or the lower gap holding jig 180 and the space between the upper substrate attracting plate 110 and the lower substrate attracting plate 150 In order to maintain the spacing between them. The thickness of the gap holding member 190 may be a value that can maintain a predetermined gap between the upper substrate 1 and the lower substrate 2.

The gap between the upper space holding jig 140 and the lower space holding jig 180 is determined by the thickness of the space holding member 190 and is set to be larger than that of the upper substrate 1, And the gap between the lower substrate 2 adsorbed by the lower substrate adsorption plate 150 is also determined.

Therefore, in the substrate bonding apparatus 100 according to the present embodiment, it is not necessary to provide a separate measuring instrument, a control unit, and a driving unit in order to adjust the uniformity of the gap between the upper substrate 1 and the lower substrate 2. [ That is, if the upper substrate attracting plate 110 and the lower substrate attracting plate 120 are brought close to each other as much as possible, the uniformity of the gap between the upper substrate 1 and the lower substrate 2 can be matched. This shortens the process time and reduces the possibility of errors in the process.

≪ Example 2 >

In the present invention, as shown in FIG. 3, the lower substrate adsorption unit 250 may be structured to have a fixed state by adjusting the absolute parallelism, rather than changing the parallelism, in the substrate adhesion apparatus 200 . That is, in this case, the parallelism of the lower substrate adsorption unit 250 is kept fixed to the absolute parallelism, and the parallelism of the upper substrate adsorption plate 210 is adjusted to the parallelism of the lower substrate adsorption unit 250 . At this time, a plurality of lower space holding jigs 260 are formed in the lower substrate adsorption unit 250. And a gap holding member 270 may be provided on the lower space holding jig 260.

The upper substrate suction plate 210, the upper plate driving unit 220, the parallelism maintaining elastic coupling unit 230, and the upper gap holding jig 240 are provided to achieve the above object. They are substantially the same. Therefore, repetitive description thereof will be omitted.

When the upper substrate suction plate 210 is moved downward in a state where the upper substrate 1 is mounted, the upper gap holding jig 240 contacts the gap holding member 270, The uniformity of the gap between the upper substrate 1 and the lower substrate 2 is adjusted without lowering.

In this embodiment, the structure in which the lower substrate adsorption unit maintains the absolute parallelism is described. However, the upper substrate adsorption unit may be configured to maintain absolute parallelism, and the lower substrate adsorption unit may be configured to change the parallelism.

1: upper substrate 2: lower substrate
100: A substrate bonding apparatus according to an embodiment of the present invention
200: A substrate bonding apparatus according to another embodiment of the present invention

Claims (4)

A substrate laminating apparatus for laminating an upper substrate and a lower substrate,
An upper substrate adsorption plate for adsorbing the upper substrate;
An upper plate driving unit for driving the upper substrate attracting plate;
A first parallelism maintaining elastic coupling unit coupling the upper substrate suction plate to the upper plate driving unit and coupling the upper substrate suction plate such that the upper substrate suction plate can be elastically changed in parallelism with the upper plate driving unit according to the bonding pressure;
An upper gap holding jig extending outwardly from the upper substrate attracting plate or having a plurality of inner slots formed therein;
A lower substrate adsorption plate for adsorbing the lower substrate;
A lower plate driving unit for driving the lower substrate adsorption plate;
A second parallelism maintaining elastic coupling unit coupling the lower substrate adsorption plate to the lower plate driving unit and coupling the lower substrate adsorption plate such that the lower substrate adsorption plate can be elastically changed in parallelism with the lower plate driving unit according to the adhesion pressure;
A lower space holding jig extending outward from the lower substrate adsorption plate and formed with a plurality of holes;
And a gap holding member which is provided on at least one of the upper gap holding jig or the lower gap holding jig and which maintains a gap between the upper substrate attracting plate and the lower substrate attracting plate. 2. The connector according to claim 1, wherein the parallelism-
A free rotation coupling unit for freely rotatably coupling a central portion of the upper substrate attracting plate to a central portion of the upper plate driving unit;
And a plurality of elastic engaging portions provided at a plurality of positions of the edge portions of the upper substrate attracting plate and elastically coupling the upper substrate attracting plate to the upper plate driving portion to maintain parallelism, Device. The connector according to claim 2,
Wherein the pneumatic cylinder is a pneumatic cylinder, a rubber material, and a spring. The portable terminal according to claim 2, wherein the free-
Wherein the substrate is a floating ball or a floating joint.

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