KR101499279B1 - Substrate for organic electronic device - Google Patents

Abstract

The present invention relates to a substrate for an organic electronic device, a manufacturing method thereof, and an organic electronic device. The exemplary substrate of the present invention can effectively adjust the surface resistance of the electrode, for example, when the organic light emitting element is formed on the substrate, even when the element is configured as a large area, Uniformity can be ensured.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate for organic electronic devices,

The present invention relates to a substrate for an organic electronic device, a manufacturing method thereof, and an organic electronic device.

An organic electronic device (OED) may mean an element that performs various functions through charge exchange between an electrode and an organic material, and examples thereof include an organic light emitting device (OLED), an organic solar cell, (OPC) or an organic transistor.

Electrode properties are very important in organic electronic devices. For example, organic light emitting devices used for illumination usually consist of pixels having a light emitting area of 5 cm or more in length on one side. When the surface resistance of the electrode is high, electrons or holes are not uniformly injected over the entire area because of having such a large light emitting area, so that uneven light emission occurs or a uniform brightness can not be obtained in the whole light emitting region.

Typically, the organic electronic device includes two electrodes, and at least one of the electrodes is composed of a transparent electrode so that light can be extracted or incident. However, in particular, the transparent electrode can not be made too thick in order to ensure transparency, and it is therefore more difficult to control the surface resistance.

Japanese Patent Application Laid-Open No. 2009-146640

An object of the present invention is to provide a substrate for an organic electronic device, a manufacturing method thereof, and an organic electronic device.

An exemplary organic electronic element substrate of the present invention comprises: a substrate; An adhesive layer formed on the main surface of the substrate; And a conductive pattern embedded in the adhesive layer. Wherein the conductive pattern is exposed on a surface of the adhesive layer opposite to the substrate side surface and the surface of the opposite side of the adhesive layer including the exposed surface of the conductive pattern has a maximum height roughness And a flat surface of 1 mu m or less is formed.

In this specification, the term flat surface or reverse surface may refer to a surface formed by the surface of the adhesive layer on the side where the conductive pattern is exposed in the structure of the substrate and the exposed surface of the conductive pattern together. In addition, the surface of the adhesive layer may refer to the surface of the adhesive itself, as well as the surface of the surface layer when the adhesive layer includes a surface layer, for example, as described later.

In one example, the flat surface may be a flat surface on which organic electronic devices are formed.

Fig. 1 is a view showing one example of the structure of the substrate 1, which includes a base material 11, an adhesive layer 12 formed on the base material 11, Pattern 13 as shown in FIG.

A suitable material may be used as the substrate, if necessary, without any particular limitation. In one example, when the organic electronic device is a bottom emission type organic light emitting device, the substrate may be a translucent substrate, for example, a visible light region, for example, a light transmittance in a wavelength range of 400 nm to 700 nm May be 50% or more. As the translucent substrate, a glass substrate or a transparent polymer substrate can be exemplified. Examples of the glass substrate include substrates such as soda lime glass, barium / strontium containing glass, lead glass, aluminosilicate glass, borosilicate glass, barium borosilicate glass or quartz. Examples of the polymer substrate include polycarbonate, Acrylic resin, PET (poly (ethylene terephthalate)), PES (poly (ether sulfide)), PS (polysulfone), and the like. Further, if necessary, the substrate may be a TFT substrate on which a driving TFT exists.

Further, when the organic electronic device is a top emission type, the substrate need not necessarily be a light-transmitting substrate. In this case, a reflective layer using aluminum or the like may be formed on the surface of the substrate as needed.

An adhesive layer may be formed on at least one major surface of the substrate to serve to retain the conductive pattern. As the adhesive layer, various materials can be used as long as they perform the above-mentioned functions.

The adhesive layer is a translucent adhesive layer, for example, having a transmittance of 70% or more, preferably 80% or more, more preferably 90% or more, in a visible light region, for example, a light having a wavelength of 400 nm to 700 nm, Or more of the adhesive layer may be used.

As the adhesive layer, an adhesive layer containing an organic or inorganic adhesive agent of room temperature curing type, moisture curing type, thermosetting type, active energy ray curing type or hybrid curing type can be used. The adhesive may include, for example, an adhesive resin such as an acrylic resin, a silicone resin, a polyurethane, an epoxy resin, a fluororesin or a styrene resin, or a condensation reaction product of a zirconium alkoxide, a titanium alkoxide or a silicon alkoxide. As used herein, the term "curing" refers to a process that exhibits physical properties that can act as an adhesive layer by chemical or physical reaction or action of the components contained therein. Examples of the curing type include room temperature curing type, moisture curing type, thermosetting type, active energy ray curing type, May mean a type of adhesive in which the above-mentioned curing is induced by keeping at room temperature, applying moisture, applying heat or irradiating an active energy ray, or curing a combination of two or more of the above methods. In the above, the term active energy ray includes microwaves, infrared (IR), ultraviolet (UV), X-rays or gamma rays, alpha-particle beams, proton beams, , A particle beam such as a neutron beam or an electron beam, and the like.

In one example, an adhesive layer comprising an active energy ray-curable adhesive may be used as the adhesive layer in terms of process or property realization.

In one example, when the organic electronic device is formed on the flat surface, the adhesive layer may have a refractive index equal to or higher than that of the high refractive index adhesive layer, for example, the organic electronic device formed on the flat surface, May be an adhesive layer. In one example, the absolute value of the difference between the refractive index of the adhesive layer and the refractive index of the organic electronic device formed on the flat surface may be 1 or less, 0.8 or less, 0.6 or less, 0.4 or less or 0.2 or less. In one example, the index of refraction of the adhesive layer may be 1.6 or higher, 1.7 or higher, 1.8 or higher, or 1.9 or higher. In such a refractive index range, for example, when the organic electronic device is an organic light emitting device, light generated from the device can be efficiently incident on the adhesive layer while minimizing total reflection phenomenon. The upper limit of the refractive index of the adhesive layer is not particularly limited as long as it is similar to or higher than that of the organic electronic device. For example, it may be 4.0 or less, 3.5 or less, 3.0 or less, 2.5 or less or 2.0 or less.

The manner of imparting a high refractive index to the adhesive layer is not particularly limited. For example, an additive for an adhesive resin or an adhesive layer for forming an adhesive layer may be a monomer containing an aromatic group such as phenol in the structure, or a monomer in which a halogen atom other than fluorine, a sulfur atom, a phosphorus atom or a nitrogen atom is introduced, Or a fine particle exhibiting high refractive index properties such as an oxide or hydrate of a metal such as titanium, zirconium, aluminum, indium, zinc, tin or antimony is dispersed in the adhesive The refractive index can be controlled by a method. Specific examples of the monomer capable of exhibiting a high refractive index as described above include bis (4-methacryloylthiophenyl) sulfide, vinylnaphthalene, vinylphenylsulfide, 4-methacryloxyphenyl-4'-methoxyphenyl Thioethers, and the like, but are not limited thereto.

The adhesive layer may further comprise scattering particles. As used herein, the term scattering particles may mean particles having a refractive index different from that of the adhesive layer containing the scattering particles. Such particles may mean particles that function to scatter light incident on the adhesive layer. For example, when the refractive index of the adhesive layer is adjusted to a level similar to or higher than that of the organic electronic device as described above, and scattering particles are included, the ratio of guiding light generated from the device to the outside, that is, . The scattering particles are not particularly limited as far as they have refractive indices different from those of the adhesive layer, and various organic particles, inorganic particles or organic-inorganic composite particles can be used. Examples of the organic particles include particles made of organic polymers such as polystyrene or a derivative thereof, an acrylic resin, a silicone resin or a novolac resin, and examples of the inorganic particles include metal oxide such as silica, alumina, titania or zirconia Particles can be exemplified. In addition, for example, fine particles or hollow particles in which fine particles are dispersed in a core / shell structure may also be used.

In one example, the adhesive layer may further comprise a surface layer forming said opposing surface. 2 is a schematic diagram exemplarily showing a substrate 2 on which a surface layer 21 is formed.

In one example, the surface layer may be a layer that plays a role in adjusting the adhesion with the releasable substrate in the process of manufacturing the substrate in a manner to be described later. In this case, it is preferable that the surface layer exhibits an appropriate adhesive force with the surface of the releasable substrate, and is stably attached to the releasable substrate during the process, and that the releasable substrate can be effectively removed in the process of removing the releasable substrate, It is also preferable that the material is a material exhibiting a high adhesive force with the adhesive layer.

In one example, the surface layer has a light transmittance, for example, a transmittance of 70% or more, 80% or more, or 90% or more to a visible light region, specifically a light having a wavelength of 400 nm to 700 nm, And may include a material representing the characteristics.

The surface layer may be made of a material such as a polyester such as polycarbonate (PC) or poly (ethylene terephthalate), an acrylic resin, poly (ether sulfide) (PES), an urethane resin, , Polysulfone (PS), or polyimide, silicon oxide such as SiO ₂ , silicon nitride, or an inorganic material such as FeO. The surface layer containing such a material can be formed through a coating method such as a wet coating method or a sputtering or vacuum deposition method.

In one example, the surface layer may be made of a conductive material, or it may be a conductive surface layer comprising a conductive material. In this way, the surface resistance of the opposite surface can be more efficiently controlled. Examples of the conductive material that can constitute the surface layer or may be included in the surface layer include a polythiophene-based material such as PEDOT (3,4-polyethylenedioxythiophene) or PEDOT / PSS (mixture of polystyrene sulfonate and PEDOT) A conductive polymer such as a polymer, polyacetylene, polypyrrole, polyaniline, polyfluorene, polytetrathiafulvalene, polynaphthalene, poly (p-phenylene sulfide) A metal such as copper, palladium, chromium, platinum or gold or a metal such as Ag, Au, Pd, Al, Pt, Cu, Zn, Cd, In, Si, Zr, Mo, Ni, Cr, Mg, Aluminum, copper, palladium, chromium, platinum or gold doped with at least one element selected from the group consisting of aluminum, copper, Or carbon nanotubes, and the surface layer using such a material can be formed by, for example, a wet coating method or a vapor deposition method.

In the substrate, a conductive pattern is embedded in the adhesive layer. The conductive pattern is exposed on the surface opposite to the substrate of the adhesive layer, that is, the surface opposite to the surface of the adhesive layer in contact with the substrate, and exists as a part of the flat surface. That is, the exposed surface of the conductive pattern and the surface of the adhesive layer form a flat surface as the same surface, and in one example, when the adhesive layer includes the surface layer, the surface of the adhesive layer forming the flat surface And may be the surface of the surface layer.

Since the conductive pattern is exposed to the flat surface, when the electrode of the organic electronic device is formed on the flat surface, the electrode and the conductive pattern can contact with each other, .

The shape of the pattern formed by exposing the conductive pattern to the flat surface is not particularly limited and can be adjusted as needed. For example, when the flat surface is viewed from the top, the exposure pattern may be a pattern in which a plurality of exposed surfaces are arranged in parallel with each other with a stripe shape, a lattice pattern, a quadrangular or honeycomb shape Or may be amorphous rather than a uniform pattern.

3 shows a pattern of an exposed portion of one exemplary conductive pattern 13 and the exposed conductive pattern 13 forms a flat surface together with the adhesive layer 12 or the surface layer 21. [

In one example, the surface resistance of the flat surface on which the conductive pattern is exposed may be 10 Ω / □ or less, preferably 5 Ω / □ or less. However, the surface resistance value is an example, and may be, for example, an area where the conductive pattern is exposed on the flat surface or a depth of the conductive pattern embedded in the adhesive layer or the like depending on the surface resistance value of the target electrode Can be adjusted and changed.

Also, the area of the conductive pattern exposed on the flat surface is not particularly limited, and can be appropriately adjusted in consideration of the surface resistance value of the target electrode, for example. In one example, the exposed area of the conductive pattern may have a ratio of 0.01% to 40%, preferably 0.1% to 40%, more preferably 0.1% to 20% of the area of the entire flat surface. The surface resistivity of the electrode can be effectively controlled through the conductive pattern at the above-mentioned area ratio, and the overall light transmittance of the substrate can be maintained in an appropriate range.

The dimensions of the conductive pattern can be adjusted in consideration of the shape of the conductive pattern or the surface resistance value of the conductive material or the target electrode used in the conductive pattern. In one example, the conductive pattern may have a thickness of 0.01 to 50 탆, preferably 0.01 to 40 탆, more preferably 0.01 to 30 탆, more preferably 0.01 to 20 탆, more preferably 0.1 to 탆, And may have a thickness of 10 [mu] m. In the case of a predetermined pattern having a stripe shape or a stripe shape exposed on the flat surface of the conductive pattern, each stripe shape is 0.1 to 500 mu m, preferably 0.1 to 400 mu m, more preferably 0.1 mu m To 300 mu m, more preferably from 0.1 mu m to 200 mu m, and more preferably from 1 mu m to 100 mu m.

In one example, the conductive pattern can be a polythiophene such as PEDOT or PEDOT / PSS, polyacetylene, polypyrrole, polyaniline, polyfluorene, poly (3-alkylthiophene), polytetrathiafulvalene, p-phenylene sulfide) or poly (para-phenylene vinylene); Ag, Al, Cu, Pd, Cr, Pt, or Au; At least two alloy materials or carbon nanotubes selected from the group consisting of Ag, Au, Pd, Al, Pt, Cu, Zn, Cd, In, Si, Zr, Mo, Ni, Cr, Mg, Mn, Based carbon material and the like.

The conductive pattern including the above-mentioned material can be obtained by, for example, preparing a conductive paste or ink of a dry type or a firing type by using the above-mentioned material, and then, by using a printing method using the paste or ink .

The exposed surface of the conductive pattern and the surface of the adhesive layer or the surface layer on the substrate together form a flat surface having the same surface. The flat surface may have a maximum height roughness of 1 占 퐉 or less, preferably 0.5 占 퐉 or less. In the present specification, the maximum height roughness means a distance between a straight line passing through the highest point of the roughness curve and a straight line passing through the lowest point in parallel with the center line in the roughness curve in the cut off, Can be measured by the method described in the following examples. In the present specification, the maximum height roughness may be the maximum height roughness measured in any area of the flat surface having an area of 100 mu m < ² >. In the above, an arbitrary region means an area of 100 탆 ² selected at random on the flat surface of the substrate. That is, in a preferred example, the flat surface of the substrate has only a region having a maximum height illuminance of 1 μm or less, preferably 0.5 μm or less. If the flatness of the flat surface is excellent, it is possible to efficiently form the organic electronic device on the flat surface. For example, when the organic electronic device has the electrodes, the organic material layer and the electrodes sequentially on the flat surface, It is possible to prevent defects such as short-circuiting between the electrodes. The maximum height of the flat surface means that the smaller the numerical value is, the better the smooth surface is formed, and therefore the lower limit is not particularly limited.

For example, the lower limit of the maximum height illuminance may be 0 占 퐉, 0.001 占 퐉, or 0.01 占 퐉.

In one example, the flat surface may be the transfer surface of the surface of the releasable substrate. When the flat surface is the transfer surface of the releasable substrate, it is possible to form a flat surface having better smoothness.

The term " transfer surface of a releasable substrate " in the present specification means that the exposed surface of the conductive pattern and the flat surface formed by the surface of the adhesive layer or the surface layer are formed as a mold on the surface of the releasable substrate, Hereinafter, the surface of the releasable substrate may be referred to as the surface to which the flatness is transferred by removing the releasable substrate. Thus, in order to form the flat surface with the transfer surface of the surface of the releasable substrate, for example, the flat surface may be formed by applying a manufacturing method described later.

In one example, the substrate may further include a conductive layer formed on the flat surface. The conductive layer may be, for example, a hole injection electrode or an electron injection electrode of an organic electronic device.

In one example, the conductive layer may have transparency and be formed of a material having a high work function and serving as a hole injection electrode. As such a material, ITO, IZO, ZnO, SnO ₂ or In ₂ O ₃ can be exemplified, and usually ITO is used.

In another example, the conductive layer may have transparency and be formed of a material having a relatively low work function and serving as an electron injection electrode. As such a substance, a metal such as K, Li, Na, Mg, La, Ce, Ca, Sr, Ba, Al, Ag, In, Sn, Zn or Zr or two or more alloys have. Examples of the alloy system include Ag / Mg, Al / Li, In / Mg, and Al / Ca.

The thickness of the conductive layer can be appropriately adjusted in consideration of the desired surface resistance, light transmittance, and the like.

The substrate for an organic electronic device as described above may be formed by, for example, forming a conductive pattern on a release surface of a releasable substrate; Forming a precursor of the adhesive layer on the substrate on which the conductive pattern is formed; Laminating the precursor of the adhesive layer and the substrate, and converting the precursor into an adhesive layer; And a step of removing the releasable substrate.

4 is a diagram schematically showing the above-described manufacturing method.

The type of the releasable substrate 41 used in the above production method is not particularly limited. As the releasable substrate, for example, a normal film or sheet having at least one surface thereof exhibiting an appropriate peeling property with the conductive pattern and the adhesive layer or the surface layer, and having excellent smoothness of the surface can be used.

A conductive pattern 42 is formed on the release surface of the releasable base 41. [ The method for forming the conductive pattern in this process is not particularly limited. For example, after a conductive paste or ink of a dry or plastic type is manufactured using a material for forming a conductive pattern, the paste or ink is applied to a printing method . As the printing method, for example, screen printing, inkjet printing, offset printing, gravure printing, or reverse gravure printing method can be exemplified.

Following the printing process, a conductive pattern may be formed by conducting a necessary baking or drying process depending on the type of paste or ink.

The precursor 43 of the adhesive layer can be formed on the surface of the moldable substrate 41 on which the pattern is formed after the conductive pattern 42 is formed. The precursor of the adhesive layer is, for example, a substance capable of forming an adhesive layer by the curing reaction described above, and may be a room temperature curing type, a moisture curing type, a thermosetting type, an active energy ray curing type or a hybrid curing type adhesive composition, . The sol-gel coating solution can be formed, for example, by dissolving a metal alkoxide such as zirconium alkoxide, titanium alkoxide or silicon alkoxide in a solvent such as alcohol or water, and appropriately blending a catalyst and the like as necessary. Also, as described above, the precursor may be a precursor containing a monomer having high refractive index nanoparticles dispersed therein or exhibiting a high refractive index, or a polymer containing the monomer, Scattering particles described above may be included. A layer of the precursor can be formed by applying the adhesive composition or the sol-gel coating solution on a releasable surface on which the conductive pattern is formed by, for example, bar coating, spin coating, gravure coating or the like.

After forming a layer 43 of precursor, the substrate 45 may be laminated on the layer 43 of precursor and the layer 43 of the precursor may be converted into an adhesive layer 44 in that state. have. The conversion of the layer of the precursor to the adhesive layer can be carried out by inducing suitable curing according to the type of precursor used or by inducing a condensation reaction.

After the adhesive layer 44 is formed, the releasable substrate 41 is peeled off, so that the substrate can be manufactured.

5 is an example of further performing the step of forming the surface layer 51 described above on the releasable substrate before the step of forming the precursor 43 of the adhesive layer as another example of the manufacturing method.

The exemplary fabrication process shown in FIG. 5 can be performed in a manner similar to the fabrication process described in FIG. 4, except that it goes through the way of forming the surface layer 51 before forming the layer 43 of precursor of the adhesive layer have.

The surface layer 51 can be formed by, for example, a coating method such as wet coating using a material forming the above-described surface layer, or a vapor deposition method.

In the exemplary manufacturing method, after removing the releasable substrate, the step of forming the conductive layer described above on the surface from which the releasable substrate is removed may be further performed.

The method of forming the conductive layer is not particularly limited, and a conventional method known in the art can be applied. For example, when the conductive layer is a transparent conductive oxide (TCO) such as ITO or IZO, the conductive layer may be formed by a sputtering method such as a pulsed DC sputtering method or by a wet coating method or an ion plating method can do. When the conductive layer is an electron injecting electrode, the conductive layer can be formed through resistance heating deposition, electron beam deposition, reactive deposition, ion plating, sputtering or the like.

The present invention also relates to organic electronic devices. An exemplary organic electronic device of the present invention may include an organic electronic device formed on the substrate and the flat surface of the substrate.

In one example, the organic electronic device may be an organic light emitting diode (OLED). When the organic electronic device is an organic light emitting device, the organic electronic device may have, for example, a structure in which an organic layer including at least a light emitting layer is interposed between the hole injection electrode and the electron injection electrode. The hole injection electrode or the electron injection electrode may be a conductive layer formed on the flat surface of the substrate described above.

Illustratively, the organic light emitting device includes: (1) a form of a hole injection electrode / an organic light emitting layer / electron injection electrode formed sequentially from the flat surface of the substrate; (2) the form of hole injection electrode / hole injection layer / organic light emitting layer / electron injection electrode; (3) a form of hole injection electrode / organic light emitting layer / electron injection layer / electron injection electrode; (4) Forms of hole injection electrode / hole injection layer / organic light emitting layer / electron injection layer / electron injection electrode; (5) a form of hole injection electrode / organic semiconductor layer / organic light emitting layer / electron injection electrode; (6) Forms of hole injection electrode / organic semiconductor layer / electron barrier layer / organic light emitting layer / electron injection electrode; (7) Forms of hole injecting electrode / organic semiconductor layer / organic light emitting layer / adhesion improving layer / electron injecting electrode; (8) Forms of hole injecting electrode / hole injecting layer / hole transporting layer / organic light emitting layer / electron injecting layer / electron injecting electrode; (9) Forms of hole injecting electrode / insulating layer / organic light emitting layer / insulating layer / electron injecting electrode; (10) Forms of hole injection electrode / inorganic semiconductor layer / insulating layer / organic light emitting layer / insulating layer / electron injection electrode; (11) Forms of hole injection electrode / organic semiconductor layer / insulating layer / organic light emitting layer / insulating layer / electron injection electrode; (12) Hole injection electrode / Insulation layer / Hole injection layer / Hole transport layer / Organic light emitting layer / Insulation layer / Form of electron injection electrode or (13) Hole injection electrode / Insulating layer / Hole injection layer / Hole transport layer / And may be in the form of an injection layer / electron injection electrode. In some cases, at least two light emission layers may be disposed between the hole injection electrode and the electron injection electrode, and may be an intermediate electrode or a charge generation layer (CGL) But the present invention is not limited thereto.

In this field, various materials for forming a hole or electron injection electrode and an organic layer such as a light emitting layer, an electron injecting or transporting layer, a hole injecting or transporting layer, and a forming method thereof are known. All of the same methods can be applied.

The exemplary substrate of the present invention can effectively adjust the surface resistance of the electrode, for example, when the organic light emitting element is formed on the substrate, even when the element is configured as a large area, Uniformity can be ensured.

Figures 1 and 2 are schematic diagrams illustrating an exemplary substrate.
3 is a diagram exemplarily showing a form of a conductive pattern exposed on a flat surface of a substrate.
Figs. 4 and 5 are diagrams schematically showing a method of manufacturing an exemplary substrate.
Figures 6 and 7 are views showing the substrate produced in the embodiment.
8 is a view showing a maximum height illuminance of the substrate manufactured in the embodiment.

Hereinafter, the present invention will be described in more detail with reference to Examples of the present invention and Comparative Examples which are not according to the present invention, but the scope of the present invention is not limited by the following Examples.

The physical properties in the following examples were measured in the following manner.

1. Measurement of surface roughness

The surface roughness of the flat surface of the substrate was measured in a tapping mode using an AFM instrument (model name: D3100, manufacturer: Digital Instrument), and the radius of the tip used was 8 nm. After designating three areas with an area of 100 占 퐉 ² with respect to the substrate, the surface roughness was measured in the above-described manner for the designated area. Table 1 below shows the average values of the measurement results. Fig. 8 shows a photograph measuring the surface roughness of the substrate of Example 1. Fig.

2. Measurement of substrate surface resistance

The surface resistance of the flat surface of the substrate was measured using a 4-point probe (MCP-T610, manufacturer: MITSUBISHI CHEMICAL) commonly used in surface resistance measurement, and using an ESP type probe with a pin interval of 5 mm Respectively.

Example 1.

A lattice type conductive pattern was printed on the surface of a PET (poly (ethylene terephthalate)) film not subjected to a primer treatment by an offset gravure printing method using an Ag paste. In this process, the line width of the conductive pattern was adjusted to 20 탆, the interval between the lines was adjusted to 280 탆, and the height of the conductive pattern was adjusted to about 1 탆. Thereafter, the pattern was fired by maintaining the printed conductive pattern at a temperature of 150 DEG C for about 30 minutes. Next, an ultraviolet curable adhesive composition (NOA65, Norland Products Inc.) was applied to the surface of the PET film having the conductive pattern formed thereon, the glass substrate was laminated on the surface thereof, and the composition was sufficiently spread by applying pressure with a rubber roller . Then, the composition was irradiated with ultraviolet rays (2 J / cm ² ) to form an adhesive layer. After the formation of the adhesive layer, the PET film was peeled off to produce a substrate for an organic electronic device. Figures 6 and 7 show photographs of the substrate produced.

Example 2.

A substrate was prepared in the same manner as in Example 1, except that the line width was adjusted to 40 탆, the line spacing to 260 탆, and the height to about 2 탆 in the formation of the conductive pattern.

Example 3.

A lattice type conductive pattern was printed on the surface of a PET (poly (ethylene terephthalate)) film not subjected to a primer treatment by an offset gravure printing method using an Ag paste. In this process, the line width of the conductive pattern was adjusted to 20 탆, the interval between the lines was adjusted to 280 탆, and the height of the conductive pattern was adjusted to about 1 탆. Thereafter, the pattern was fired by maintaining the printed conductive pattern at a temperature of 150 DEG C for about 30 minutes. Subsequently, a coating liquid (TYT-80-01, Toyo ink) for forming a surface layer on the surface of the PET film having the conductive pattern formed thereon was applied, and the substrate was dried at a temperature of 100 DEG C for about 10 minutes, . Thereafter, a UV-curable adhesive composition (NOA65, Norland Products Inc.) was applied to a substrate having a conductive pattern and a surface layer formed thereon, the glass substrate was laminated, and a pressure was applied by a rubber roller to sufficiently spread the composition. Thereafter, the composition was irradiated with ultraviolet light (2 J / cm ² ) to form an adhesive layer, and then the PET film was peeled off to produce a substrate for an organic electronic device.

The surface roughness and the surface resistance of each substrate prepared in the above examples were measured and are shown in Table 1 below.

Example 1 Example 2 Example 3 Surface roughness (탆) 0.20 0.27 0.21 Surface resistance (Ω / □) 5.1 1.2 4.9

From the results in Table 1, it can be confirmed that when the flat surface is composed of the transfer surface of the releasable substrate, the flatness of the flat surface is extremely excellent. It can also be seen from the results of Table 1 that the surface resistance of the substrate can be effectively controlled depending on the purpose by adjusting the material constituting the conductive pattern, the pattern thereof, and the like.

1, 2: substrate for organic electronic device
11: substrate 12: adhesive layer
13: conductive pattern 21: surface layer
41: releasability substrate 42: conductive pattern
43: precursor of adhesive layer 44: adhesive layer
45: Base material 51: Surface layer

Claims (20)

materials; An adhesive layer formed on the main surface of the substrate; And a conductive pattern embedded in the adhesive layer, wherein the conductive pattern is exposed on a surface of the adhesive layer opposite the surface of the substrate side, and the adhesive layer including the surface of the exposed conductive pattern Is a flat surface having a maximum height of not more than 1 占 퐉 and the adhesive layer includes a surface layer forming the flat surface, and the surface layer is formed of a polyester, an acrylic resin, a polyether sulfide, a urethane resin, A substrate for an organic electronic device comprising at least one organic polymer selected from the group consisting of an epoxy resin, an olefin resin, a polysulfone and a polyimide, silicon oxide, silicon nitride or FeO, or a conductive material or a conductive material . The organic electronic element substrate according to claim 1, wherein the planar surface is a surface on which the organic electronic device is formed. The organic electronic element substrate according to claim 1, wherein the substrate is a translucent substrate having a transmittance of 50% or more with respect to light in a visible light region. The organic electronic element substrate according to claim 1, wherein the adhesive layer is an active energy ray curable adhesive layer. The organic electronic element substrate according to claim 2, wherein an absolute value of a difference between a refractive index of the adhesive layer and a refractive index of the organic electronic device formed on the flat surface is 1 or less. The organic electronic element substrate according to claim 1, wherein the adhesive layer comprises scattering particles having a refractive index different from that of the adhesive layer. The method of claim 1 wherein the conductive material is selected from the group consisting of a polythiophene based polymer, polyacetylene, polypyrrole, polyaniline, polyfluorene, polytetrathiafulvalene, polynaphthalene, poly (p-phenylene sulfide) Wherein the substrate is an organic electronic device substrate. The method of claim 1, wherein the conductive material is at least one selected from the group consisting of silver, aluminum, copper, palladium, chromium, platinum or gold or a metal selected from Ag, Au, Pd, Al, Pt, Cu, Zn, Cd, In, Si, Zr, Au, Pd, Al, Pt, Cu, Zn, and the like doped with at least one element selected from the group consisting of Cr, Mg, Mn, Co and Sn, aluminum, copper, palladium, chromium, Wherein the alloy is at least one selected from the group consisting of aluminum, copper, palladium, chromium, platinum or gold, or an alloy of at least one selected from the group consisting of Cd, In, Si, Zr, Mo, Ni, Cr, Mg, Mn, A substrate for an organic electronic device. The organic electronic element substrate according to claim 1, wherein the flat surface has a surface resistance of 10 Ω / □ or less. The organic electronic device substrate according to claim 1, wherein the ratio of the area of the conductive pattern exposed on the flat surface is 0.01% to 40% of the total area of the flat surface. The substrate for an organic electronic device according to claim 1, wherein the conductive pattern comprises a conductive polymer, a metal, an alloy, or a carbon-based material. The organic electronic element substrate according to claim 1, wherein the maximum height illuminance is an illuminance of an arbitrary area of a flat surface having an area of 100 mu m < ^{2 &} gt ;. The organic electronic element substrate according to claim 1, wherein the planar surface is a transfer surface of the surface of the releasable substrate. The organic electronic element substrate according to claim 1, further comprising a conductive layer formed on a flat surface. Forming a conductive pattern on a release surface of the releasable substrate; Forming a precursor of the adhesive layer on the substrate on which the conductive pattern is formed; Laminating the precursor of the adhesive layer and the substrate, and converting the precursor into an adhesive layer; And removing the releasable substrate. 16. The method of manufacturing a substrate for an organic electronic device according to claim 15, wherein the conductive pattern is formed by printing conductive paste or ink on the surface of the releasable substrate. The method according to claim 16, wherein the printing method is screen printing, inkjet printing, offset printing, gravure printing or reverse gravure printing. 16. The method according to claim 15, further comprising the step of forming a surface layer on the surface of the releasable substrate before forming the precursor of the adhesive layer. An organic electronic device comprising a substrate for an organic electronic device according to claim 1 and an organic electronic device formed on a flat surface of the substrate. 20. The organic electronic device according to claim 19, wherein the organic electronic device is an organic light emitting device.

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