KR101467662B1 - Substrate Processing Apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus. Preferably, the present invention relates to a glass substrate processing apparatus for grinding a glass substrate.
A substrate processing apparatus according to the present invention comprises a first grinder, a first grinder, a first substrate, and a second grinder, wherein the first substrate is transported in a first direction so that a side surface thereof is grinded by the first grinder while the first substrate is being transported And a second transportation part for transporting the second substrate in the first direction so that the side surface is grinded by the first grinder while the second substrate is being transported, , While the first substrate is being grinded by the first grinder, the second transfer part moves from a lower side of the first substrate to a second direction (Second Direction) opposite to the first direction, The first transfer unit may move from the lower side of the second substrate in the second direction while the first transfer unit is being ground by the first grinder.

Description

[0001] Substrate Processing Apparatus [0002]

The present invention relates to a substrate processing apparatus. More specifically, the present invention relates to a glass substrate processing apparatus for grinding a glass substrate.

A glass substrate used for a display device or the like is likely to cause cracks due to the characteristics of the glass.

Such cracks may deteriorate the structural characteristics of the glass substrate.

An object of the present invention is to provide a substrate processing apparatus for reducing the time required for manufacturing a glass substrate.

A substrate processing apparatus according to the present invention comprises a first grinder, a first grinder, a first substrate, and a second grinder, wherein the first substrate is transported in a first direction so that a side surface thereof is grinded by the first grinder while the first substrate is being transported And a second transportation part for transporting the second substrate in the first direction so that the side surface is grinded by the first grinder while the second substrate is being transported, , While the first substrate is being grinded by the first grinder, the second transfer part moves from a lower side of the first substrate to a second direction (Second Direction) opposite to the first direction, The first transfer unit may move from the lower side of the second substrate in the second direction while the first transfer unit is being ground by the first grinder.

The first transfer portion includes a portion moving to the lower side of the first substrate after the grinding of the first substrate is completed and a portion moving in the second direction from the lower side of the second substrate, Wherein the second substrate moves to the lower side of the second substrate after the grinding of the second substrate is finished and moves in a horizontal direction crossing the first and second directions, May be included.

The first transfer unit may include a first adsorption unit adsorbed on the first substrate, a first supporter supporting the first adsorption unit, a second supporter supporting the first adsorption unit in the first and second directions And a first vertical actuator for moving the first support part in a first direction or a second direction that moves the first support part in a first direction or a second direction that is perpendicular to the horizontal direction, Wherein the second conveying part includes a second adsorption part adsorbed on the second substrate, a second supporter supporting the second adsorption part, a second supporter supporting the second adsorption part, A first horizontal actuator for moving the second support in the horizontal direction, and a second horizontal actuator for moving the second support in the first direction It may include a second motor unit (Motor Second Part) that moves in the second direction.

In addition, the first grinder can be fixed while the first substrate and the second substrate are being ground.

After the grinding of the first substrate by the first grinder is completed, the first substrate is released from the first conveyance unit, and after the grinding of the second substrate by the first grinder is completed, Can be separated from the second conveying portion.

The apparatus may further include a rotation part that rotates the first and second substrates after the grinding of the first and second substrates by the first grinder is completed.

A second grinder for moving the first substrate in the first direction so that the side is grinded by the second grinder while the first substrate is being rotated; And a fourth transfer part for transferring the second substrate in the first direction so that the side surface is grinded by the second grinder while the second substrate is being transported while being rotated .

Further, the second grinder may be fixed while the first substrate and the second substrate are being ground.

One of the first grinder and the second grinder may grind the long side of the first and second substrates while the other may grind the short side of the first and second substrates. have.

Also, while the first substrate is being grinded by the second grinder, the third transfer part is moved in the second direction from below the first substrate, and while the second substrate is being grinded by the second grinder The fourth transfer unit may move in a second direction from a lower side of the second substrate.

The third transfer unit may include a third adsorption unit to be adsorbed on the first substrate, a third supporter to support the third adsorption unit, a third supporter to move the third support unit in the vertical direction, And a third motor part (Third Motor Part) for moving the third vertical actuator and the third support part in the first direction or the second direction, and the fourth transfer part includes a third motor part A fourth supporter for supporting the fourth adsorption part, a fourth vertical actuator for moving the fourth supporter in the vertical direction, and a fourth vertical actuator for moving the fourth support part in the vertical direction, And a fourth motor part for moving the supporting part in the first direction or the second direction.

In addition, any one of the third conveyance unit and the fourth conveyance unit may further include a second horizontal actuator for moving the third support unit or the fourth support unit in the horizontal direction.

The first direction may be a direction in which the first and second substrates are processed.

The substrate processing apparatus according to the present invention has the effect of reducing the time spent for grinding and fixing by grinding the side surface of the glass substrate in the process of transferring the glass substrate.

1 to 18 are views for explaining a substrate processing apparatus and a substrate processing method according to the present invention; And
19 to 23 are views for explaining an apparatus and a method for rotating a substrate and processing a substrate in a rotated state.

Hereinafter, a glass substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood that the present invention is not intended to be limited to the specific embodiments but includes all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In describing the present invention, the terms first, second, etc. may be used to describe various components, but the components may not be limited by the terms. The terms may only be used for the purpose of distinguishing one element from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The term " and / or " may include any combination of a plurality of related listed items or any of a plurality of related listed items.

When an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may be present in between Can be understood. On the other hand, when it is mentioned that an element is "directly connected" or "directly connected" to another element, it can be understood that no other element exists in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used interchangeably to designate one or more of the features, numbers, steps, operations, elements, components, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries can be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are, unless expressly defined in the present application, interpreted in an ideal or overly formal sense .

In addition, the following embodiments are provided to explain more fully to the average person skilled in the art. The shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 to 18 are views for explaining a substrate processing apparatus and a substrate processing method according to the present invention.

A method of processing a substrate according to the present invention will be schematically described with reference to Fig.

First, a predetermined substrate may be placed in a transportation part (S100).

Then, the substrate can be grinded (S110) with the substrate placed on the transfer section.

Thereafter, the ground substrate can be rotated (S120).

The substrate can be grinded again while the substrate is rotated (S130)

Hereinafter, the grinding performed before the substrate is rotated is referred to as a first grinding, and the grinding performed after the substrate is rotated is referred to as a second grinding.

Referring to FIG. 2, the substrate processing apparatus according to the present invention may include a first grinder 200 to perform the first grinding step.

The first grinder 200 may include a plurality of grinder wheels 201. For example, the first grinder 200 includes at least one grinder wheel 201 disposed on the first long side (LS1) side of the first substrate S1 and a first grinder wheel 201 disposed on the first long side And at least one grinder wheel 201 disposed on the second long side (LS2) side against the long side LS1.

The first grinder 200 can be fixed while the substrate is being ground.

For example, as in the case of FIG. 3A, when the first substrate S1 is being transported in the first direction DR1 while the first grinder 200 is stationary, the first substrate S1 The first long side LS1 and the second long side LS2 may be ground.

Here, the first direction DR1 may be the proceeding direction of the substrate processing process. In other words, the grinding process of the substrate can proceed in the first direction DR1.

3B illustrates a case where the first substrate S1 is grinded while the first grinder 200 is moved in the first direction DR1 while the first substrate S1 is fixed, .

In this case, after the first substrate S1 is fixed and the grinding process is completed, the first substrate S1 must be transferred in the process direction. Accordingly, since the first substrate S1 is stopped during the grinding process, the time required for the grinding process may be increased.

On the other hand, in the case of grinding while moving the first substrate S1 while the first grinder 200 is fixed, as in the case of FIG. 3A, in the grinding process, the first substrate S1 is stopped It is possible to proceed with the process flow continuously. Thus, the time required for grinding and fixing can be saved.

Meanwhile, in the first grinding step, a first transfer part for transferring a predetermined first substrate and a second transfer part for transferring a predetermined second substrate may be used together to further improve the speed of the process. This will be described in more detail below.

The first substrate S1 referred to below collectively refers to a substrate conveyed by the first conveyance unit 100 and the second substrate S2 collectively refers to a substrate conveyed by the second conveyance unit 110. [

4 to 6, in the first grinding step S110, the first substrate S1 may be disposed on the first transportation part 100 (S400).

Thereafter, the first transfer unit 100 is moved in the first direction S1 to be grinded by the first grinder 200 on the side of the first substrate S1 in a state where the first substrate S1 is disposed in the first transfer unit 100, DR1. Accordingly, the first substrate S1 can be grinded while being transferred in the first direction DR1 by the first transfer unit 100 (S410).

Thereafter, the first substrate S1 subjected to the grinding process may be separated from the first transfer unit 100 (S420).

In addition, the second substrate S2 different from the first substrate S1 may be disposed in the second transportation part 110 that is different from the first transfer part 100 (S450).

The process of disposing the second substrate S2 on the second transfer unit 110 may be performed while the first substrate S1 subjected to the grinding process is separated from the first transfer unit 100, (S1) is released from the first transfer unit 100. [

The second transfer unit 110 is moved in the first direction DR1 so as to be grinded by the first grinder 200 on the side of the second substrate S2 in a state where the second substrate S2 is disposed on the second transfer unit 110. [ . Accordingly, the second substrate S2 can be grinded while being transferred in the first direction DR1 by the second transfer unit 110 (S460). The method of grinding the side surface of the second substrate S2 may be the same as the method of grinding the side surface of the first substrate S1.

Thereafter, the second substrate S2 subjected to the grinding process may be separated from the second transfer unit 110 (S470).

Meanwhile, in the process of grinding the second substrate S2, the first transfer unit 100 in which the first substrate S1 is separated may be moved backward to grind another first substrate S1 (S430 ).

Another first substrate S1 may be disposed in the first transport unit 100 moved backward (S440).

5, when the first transfer unit 100 is moved in the first direction DR1 while the first substrate S1 is disposed in the first transfer unit 100, the second transfer unit 110, Can move from the lower side of the first substrate S1 to the second direction (DR2) which is opposite to the first direction DR1 in a state in which the second substrate S2 is detached.

On the contrary, when the second transfer unit 110 moves in the first direction DR1 while the second substrate S2 is disposed in the second transfer unit 110, the first transfer unit 100 is moved in the first direction DR1, The second substrate S2 can move in a second direction DR2 which is a direction opposite to the first direction DR1 from the lower side of the second substrate S2.

If the grinding process is performed while the first transfer unit 100 and the second transfer unit 110 transfer substrates alternately, the time required for the grinding process can be further reduced.

6A, when the first substrate S1 is disposed on the first transfer unit 100 so that the first substrate 100 is grinded by the first grinder 200, 2 substrate S2 can be separated from the second transfer unit 110. [ In this case, the second transfer unit 110 can move in the vertical direction (DRV), for example, the downward direction.

The second substrate S2 may then proceed in a first direction DR1 for another process.

6B, when grinding is completed by the first grinder 200 in a state where the first substrate S1 is disposed in the first transfer unit 100, the second substrate S2 is detached The second transfer unit 110 moved in the second direction DR2 from the lower side of the first substrate S1 moves in the vertical direction DRV such as the upward direction to transfer another second substrate S2 .

One of the first transfer unit 100 and the second transfer unit 110 is capable of moving up and down and moving forward and backward while the other is moving up and down, It can be possible.

Hereinafter, the case where the second transfer unit 110 is allowed to move up and down, forward and backward, and leftward / rightward movement among the first transfer unit 100 and the second transfer unit 110 will be described as an example, 100) can be moved up / down, before / after, and left / right.

7, the first transfer part 100 includes a first adsorption part 101 adsorbed on a first substrate S1, a first supporter supporting a first adsorption part 101, A first vertical actuator 103 for moving the first support part 102 in the first and second directions DR1 and DR2 and a vertical direction DRV intersecting the horizontal direction DRH, And a first motor part 104 for moving the first support part 102 in the first direction DR1 or the second direction DR2.

The first transfer part 100 may include a first base part 105 for mounting / fixing the first vertical actuator 103 and / or the first motor part 104. [

The first motor unit 104 can move the entire first transfer unit 100 in the first direction DR1 or the second direction DR2.

The first transfer unit 100 having such a configuration may include a first transfer unit 100A and a first transfer unit 100B to support at least the first substrate S1. Here, the configurations of the first-first transfer unit 100A and the first-second transfer unit 100B are the same and may be symmetrical with respect to the Y-axis (longitudinal direction). Although the first conveyance unit 100 includes the first conveyance unit 100A and the first conveyance unit 100B, the number of the second conveyance units included in the first conveyance unit 100 may vary can be changed.

As in the case of Fig. 8A, the first adsorption unit 101 may have a circular or elliptic shape.

Such a first adsorption unit 101 can be adsorbed to the first substrate S1 by the suction force of air as in the case of FIG. 8 (B).

The first adsorption unit 101 may be disposed at an end of the first support unit 102.

The first support part 102 may be movably connected to the first vertical actuator 103. The first support portion 102 can move in the vertical direction DRV in conjunction with the movement of the first vertical actuator 103 installed in the first base portion 105 in the vertical direction DRV.

For example, as in the case of FIG. 9A, the first vertical actuator 103 can move the first support portion 102 in the upward direction of the vertical direction DRV. In this case, as in the case of FIG. 8B, the first adsorption unit 101 can be adsorbed on the first substrate S1.

9 (B), the first vertical actuator 103 can move the first support portion 102 in the downward direction of the vertical direction DRV. In this case, the first suction portion 101 is separated from the first substrate S1 so that the first transfer portion 100 can be separated from the first substrate S1.

Referring to FIG. 10A, the first conveying unit 100A includes a first conveying unit 100A, a first conveying unit 100B, a first conveying unit 100C, and a first conveying unit 100D. The first substrate 100 can transfer the first substrate S1 in the first direction DR1. In this transfer process, the first substrate S1 can be ground. The first to third transfer units 100A to 100B of the first transfer unit 100 are connected to the first substrate S1, And can support a corner portion of the light emitting diode.

Thereafter, as in the case of FIG. 10B, the first transfer unit 100 may move in the downward direction of the vertical direction DRV so that the first substrate S1 may be separated from the first transfer unit 100.

Thereafter, as in the case of FIG. 10C, the first substrate S1 subjected to the grinding process moves in the first direction DR1, and the first transfer section 100 is moved by the transfer of another first substrate S1 In the second direction DR2. As such, while the first transfer unit 100 moves in the second direction DR2, the second substrate S2 can move in the first direction DR1 from above the first transfer unit 100. [

On the other hand, although not shown, rollers for moving the first and second substrates S1 and S2 may be further disposed. In this case, the first and second substrates S1 and S2 can move above the rollers according to the guidance of the first and second transfer units 100 and 110. [ In such a configuration, the first and second transfer units 100 and 110 can balance the first and second substrates S1 and S2 and align the alignment of the first and second substrates S1 and S2 .

11, the second transfer part 110 includes a second adsorption part 111 to be adsorbed on the second substrate S2, a second supporter to support the second adsorption part 111, A second vertical actuator 113 for moving the second support part 112 in the vertical direction DRV and a first horizontal actuator 112 for moving the second support part 112 in the horizontal direction DRH, And a second motor part 114 for moving the first horizontal actuator 117 and the second support part 112 in a first direction DR1 or a second direction DR2.

The second transfer unit 110 may further include a second base unit 115 for mounting / fixing the second vertical actuator 113.

The second conveyance unit 110 may further include a third base unit 116 connected to the second base unit 115 and the first horizontal actuator 117 may be movable to the second base unit 115 Can be connected.

The second transfer unit 110 may further include a fourth base unit 118 for mounting / fixing the first horizontal actuator 117 and / or the second motor unit 114.

The second motor unit 114 can move the entire second transfer unit 110 in the first direction DR1 or the second direction DR2.

The second transfer unit 110 having such a configuration may include a second-first transfer unit 110A and a second-second transfer unit 110B to support at least both sides of the second substrate S2. Here, the configurations of the second-first transfer unit 110A and the second-second transfer unit 110B are the same and may be symmetrical with respect to the Y-axis (longitudinal side). Although the second conveying unit 110 includes the second conveying unit 110A and the second conveying unit 110B, the number of the second conveying units included in the second conveying unit 110 may vary can be changed.

The second adsorption unit 111 can be adsorbed to the second substrate S2 by the force of sucking air, as described above with reference to FIG.

The second adsorption part 111 may be disposed at the end of the second support part 112.

The second support 112 may be movably connected to the second vertical actuator 113. The second support portion 112 can move in the vertical direction DRV in conjunction with the movement of the second vertical actuator 113 in the vertical direction DRV.

This can be sufficiently inferred from the description of FIGS. 9 (A) and 9 (B), so that further explanation is omitted.

The first horizontal actuator 117 is movably connected to the third base portion 116 so that the fourth base portion 118 to which the first horizontal actuator 117 is installed / fixed is connected to the first horizontal actuator 117 In the horizontal direction DRH in conjunction with the movement in the horizontal direction DRH.

For example, as in the case of FIG. 12A, the first horizontal actuator 117 can move the third base portion 116 in the right direction of the horizontal direction DRH. In this case, the second base portion 115 can move in the right direction in association with the movement of the third base portion 116. [

On the other hand, as in the case of FIG. 12B, the first horizontal actuator 117 can move the third base portion 116 in the left direction of the horizontal direction DRH. In this case, the second base portion 115 can move in the left direction in association with the movement of the third base portion 116.

As described above, the first transfer unit 100 moves to the lower side of the first substrate S1 after the grinding of the first substrate S1 is completed, and then moves downward from the second substrate S2 in the second direction DR2 ). ≪ / RTI >

On the other hand, the second transfer part 110 moves to the lower side of the second substrate S2 after the grinding of the second substrate S2 is finished, and the second transfer part 110 moves in the horizontal direction crossing the first and second directions DR1 and DR2 DRH), and then moves from the lower side of the first substrate S1 to the second direction DR2.

Referring to FIG. 13A, the second conveying unit 110A includes a second conveying unit 110A, a second conveying unit 110B, a second conveying unit 110C, and a second conveying unit 110D. The first substrate 110 can transfer the second substrate S2 in the first direction DR1. In this transfer process, the second substrate S2 can be ground.

The second-first transfer unit 110A, the second-second transfer unit 110B, the second-third transfer unit 110C, and the second-fourth transfer unit 110D of the second transfer unit 110 are connected to the second substrate S2, And can support a corner portion of the light emitting diode.

13 (B), when the second conveying unit 110 moves downward in the vertical direction DRV, the second substrate S2 can be separated from the second conveying unit 110 . In addition, the second substrate S2 separated from the second transfer unit 110 and subjected to the grinding process can move in the first direction D1.

Then, the second transfer unit 110 can move in the second direction DR2 for transferring another second substrate S2. The first substrate S1 can move in the first direction DR1 from above the second transfer unit 110 while the second transfer unit 110 moves in the second direction DR2.

During the period from when the second substrate S2 is released from the second transfer unit 110 to before the second transfer unit 110 moves in the second direction DR2, The second support part 115 of the second conveyance part 110 can be moved in the horizontal direction DRH to smoothly shift the position between the first conveyance part 100 and the second conveyance part 110. [

In this case, when the first conveying unit 100 moves in the first direction DR1 and the second conveying unit 110 moves in the second direction DR2, the vertical direction DRV of the second conveying unit 110, The first conveyance unit 100 and the second conveyance unit 110 can be prevented from colliding or contacting with each other even when the movement of the first conveyance unit 100 to the second conveyance unit 110 is relatively small.

10C, the second supporting portions 115 of the second conveying portion 110 are moved in directions close to each other. However, the second supporting portions 115 of the second conveying portion 110 may be spaced apart from each other It is also possible to move in the direction of the arrow.

10 (C), after the second support portion 115 of the second conveyance portion 110 moves in the second direction DR2 while being moved in the horizontal direction DRH, The position of the second support portions 115 of the second transfer portion 110 may be reduced to the previous position to dispose another second substrate S2 on the second transfer portion 110. [

The first suction unit 101 of the first transfer unit 100 is sucked to the first substrate S1 and the second suction unit 111 of the second transfer unit 110 is sucked to the second substrate S2, May be approximately the same.

Specifically, as in the case of Fig. 14A, the first adsorption portion 101 of the first transfer portion 100 is adsorbed on the first substrate S1, Assume that the interval W1 between the ends of one substrate S1 is the first interval. 14 (B), the second suction portion 111 of the second transfer portion 110 is attracted to the second substrate S2, and the second suction portion 111 and the second suction portion 111 And the interval W2 between the ends of the substrate S2 is a second interval.

In this case, the difference between the first interval W1 and the second interval W2 may be included within a predetermined threshold range. Alternatively, the first interval W1 and the second interval W2 may be substantially the same.

15 to 16, in order to reduce interference between the first transfer unit 100 and the second transfer unit 110, the shape of the second support unit 112 of the second transfer unit 110 Can be variously changed.

16, the second support portion 112 includes a base support portion 112a extending in the vertical direction DRV, a horizontal support portion 112b extending in the horizontal direction DRH from the base support portion 112a, And a vertical support portion 112c extending in the vertical direction DRV from the horizontal support portion 112b.

And the second adsorption part 111 may be disposed on the vertical support part 112c.

In addition, the vertical support portion 112c may be located closer to the end of the first panel S1 than the base support portion 112a.

17, when the first transfer unit 100 transfers the first substrate S1 and the second transfer unit 110 moves in the second direction DR2, the vertical direction DRV The second adsorption unit 111 and the first substrate S1 are separated from each other by a predetermined distance d1 and the first support unit 102 and the vertical support unit 112c of the second support unit 112 in the horizontal direction DRH, Can also be spaced apart by a predetermined distance d2.

This is because the second support portion 112 has moved in the horizontal direction (DRH) as described in Figs. 12 to 13 above.

On the other hand, when the second transfer unit 110 transfers the second substrate S2 and the first transfer unit 100 moves in the second direction DR2, The first adsorption unit 101 and the second substrate S2 are separated by a predetermined distance d5 and the first support unit 102 and the base support unit 112a of the second support unit 112 are also rotated in the horizontal direction DRH, Distance d4.

More specifically, the first transfer part 100 moves in the downward direction of the vertical direction DRV, so that the first suction part 101 moves in the vertical direction DRV to the lower part of the vertical support part 112c of the second support part 112 Lt; / RTI > The first adsorption unit 101 may be separated from the vertical support unit 112c of the second support unit 112 by a predetermined distance d3 in the vertical direction DRV.

The first conveying unit 100 moves in the first direction DR1 and the second direction DR2 while the first conveying unit 100 moves in the vertical direction DRV, 2 transferring unit 110 can be suppressed.

19 to 23 are views for explaining an apparatus and a method for rotating a substrate and processing a substrate in a rotated state. Hereinafter, the description of the parts described in detail above will be omitted.

19, after the first and second substrates S1 and S2 are grinded in the first grinding step, the first and second substrates S1 and S2 may be rotated.

19A, the first long side LS1 and the second long side LS2 of the first substrate S1 are grinded by the first grinder 200 in the first grinding step The first substrate S1 is rotated 90 degrees to grind the first short side SS1 and the second short side SS2 of the first substrate S1, .

19 (B), the substrate processing apparatus according to the present invention for rotating the first and second substrates S1 and S2 has a structure in which the first and second substrates S1 and S2 are rotated by the first grinder 200, S1 and S2 after the grinding of the first and second substrates S1 and S2 is completed.

Referring to FIG. 20, in order to perform the second grinding step, the substrate processing apparatus according to the present invention may include a second grinder (400).

The second grinder 400 may include a plurality of grinder wheels 401. For example, the second grinder 400 includes at least one grinder wheel 401 disposed on the first short side SS1 side of the first substrate S1 and a first short side SS1 of the first substrate S1, And at least one grinder wheel 401 disposed on the second short side SS2 side opposite to the second short side SS2.

The second grinder 400 may be fixed while the substrate is being ground. That is, the first substrate S1 or the second substrate S2 can be grinded while the second grinder 400 is fixed. This can be sufficiently inferred from FIG.

Also, in the second grinding step, a third transfer part for transferring the first substrate and a fourth transfer part for transferring the second substrate may be used together to improve the speed of the process, similar to the first grinding step. This will be described in more detail below.

Although the first substrate S1 is transferred by the third transfer unit 500 and the second substrate S2 is transferred by the fourth transfer unit 510, And the second substrate S2 may be conveyed by the third conveyance unit 500. The second substrate S2 may be conveyed by the third conveyance unit 500,

Referring to FIG. 21, in the second grinding process (S130), the first substrate S1 may be disposed on the third transportation part 500 (S500).

The first and second short sides SS1 and SS2 of the first substrate S1 are grinded by the second grinder 400 in a state where the first substrate S1 is disposed in the third transfer unit 500, The transfer unit 500 can be moved in the first direction DR1. Accordingly, the first substrate S1 can be grinded while being transferred in the first direction DR1 by the third transfer unit 500 (S510).

Thereafter, the first substrate S1 subjected to the grinding process may be separated from the third transfer unit 500 (S520).

In addition, the second substrate S2 may be disposed on the fourth transportation part 510 (S550).

The first and second short sides SS1 and SS2 of the second substrate S2 are grinded by the second grinder 400 in a state where the second substrate S2 is disposed on the fourth transfer unit 510, 510 in the first direction DR1. Accordingly, the second substrate S2 can be grinded while being transferred in the first direction DR1 by the fourth transfer unit 510 (S560).

Thereafter, the second substrate S2 subjected to the grinding process may be separated from the fourth transfer unit 510 (S570).

Meanwhile, in the process of grinding the second substrate S2, the third transfer part 500 in which the first substrate S1 is separated may be moved backward to grind another first substrate S1 (S530 ).

Another first substrate S1 may be disposed in the third transfer part 500 moved backward (S540).

The operation and configuration of the third transfer unit 500 and the fourth transfer unit 510 can be sufficiently inferred from the operation and configuration of the first transfer unit 100 and the second transfer unit 110.

Hereinafter, the third transfer unit 500 corresponds to the first transfer unit 100, and the fourth transfer unit 510 corresponds to the second transfer unit 110.

22, the third transfer part 500 and the fourth transfer part 510 have the same structure as the first transfer part 100 and the second transfer part 110 described above and the first and second substrates S1, S2), and the remainder may be substantially the same. Therefore, a detailed description of FIG. 22 is omitted.

For example, the first and second transfer units 100 and 110 may include first and second substrates S1 and S2 for grinding long sides LS1 and LS2 of the first and second substrates S1 and S2, The third transfer unit 500 and the fourth transfer unit 510 transfer the first and second substrates S1 and S2 to grind the short sides SS1 and SS2 of the first and second substrates S1 and S2 To be transferred.

23A, the distance between the first transfer unit 100A of the first transfer unit 100 and the first support unit 102 of the first transfer unit 100B is a first distance L1 .

Referring to FIG. 23B, the distance between the third-first transfer unit 500A of the third transfer unit 500 and the first support unit 502 of the third-second transfer unit 500B is a second distance L2 .

Here, the second distance L2 may be larger than the first distance L1. The reason is that the third transfer part 500 transfers the substrates S1 and S2 in the first direction DR1 to grind the short sides SS1 and SS2 of the substrates S1 and S2, 502 may be larger than the distance L2 between the first transfer part 100 and the first transfer part 100. [

As described above, it is to be understood that the technical structure of the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

It should be understood, therefore, that the embodiments described above are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, And all changes or modifications derived from equivalents thereof should be construed as being included within the scope of the present invention.

Claims (13)

A first grinder;
A first transfer part for transferring the first substrate in a first direction so that a side surface of the first substrate is grinded by the first grinder while the first substrate is being transferred; And
A second transfer part for transferring the second substrate in the first direction so that the side surface is grinded by the first grinder while the second substrate is being transferred;
Lt; / RTI >
The second transfer part is moved from a lower side of the first substrate in a second direction opposite to the first direction while the first substrate is being grinded by the first grinder,
The first transfer part moves in the second direction from the lower side of the second substrate while the second substrate is ground by the first grinder,
Wherein the first transfer portion includes a portion that moves to the lower side of the first substrate after the grinding of the first substrate is finished and moves in the second direction from the lower side of the second substrate,
Wherein the second transfer part moves to a lower side of the second substrate after the grinding of the second substrate is completed and moves in a horizontal direction crossing the first and second directions, And moving in the second direction. The method according to claim 1,
The first conveying portion
A first adsorption unit adsorbed on the first substrate;
A first supporter for supporting the first adsorption unit;
A first vertical actuator for moving the first supporting portion in a first direction, a second direction and a vertical direction intersecting the horizontal direction; And
A first motor part for moving the first support part in the first direction or the second direction;
Lt; / RTI >
The second conveying portion
A second adsorption part adsorbed on the second substrate;
A second supporter for supporting the second adsorption part;
A second vertical actuator for moving the second support in the vertical direction;
A first horizontal actuator for moving the second support in the horizontal direction; And
A second motor part for moving the second support part in the first direction or the second direction;
And the substrate processing apparatus. The method according to claim 1,
Wherein the first grinder is fixed while the first substrate and the second substrate are grinded. The method according to claim 1,
After the grinding of the first substrate by the first grinder is completed, the first substrate is separated from the first conveyance unit,
And the second substrate is separated from the second transfer unit after the grinding of the second substrate by the first grinder is completed. 3. The method of claim 2,
Further comprising a rotation part for rotating the first and second substrates after the grinding of the first and second substrates by the first grinder is completed. 6. The method of claim 5,
A second grinder;
A third transfer part for transferring the first substrate in the first direction so that the side surface is grinded by the second grinder while the first substrate is being transported while being rotated; And
A fourth transfer part for transferring the second substrate in the first direction so that the side surface is grinded by the second grinder while the second substrate is being transported while being rotated;
And the substrate processing apparatus. The method according to claim 6,
Wherein the second grinder is fixed while the first substrate and the second substrate are grinded. The method according to claim 6,
Wherein one of the first grinder and the second grinder grinds the long side of the first and second substrates and the other grinds the short side of the first and second substrates, . The method according to claim 6,
While the first substrate is being grinded by the second grinder, the third transfer part moves in the second direction from the lower side of the first substrate,
And the fourth transfer section moves in the second direction from the lower side of the second substrate while the second substrate is grinded by the second grinder. The method according to claim 6,
The third conveying portion
A third adsorption part adsorbed on the first substrate;
A third supporter for supporting the third adsorption unit;
A third vertical actuator for moving the third support in the vertical direction; And
A third motor part for moving the third support part in the first direction or the second direction;
Lt; / RTI >
The fourth conveying portion
A fourth adsorption part adsorbed on the second substrate;
A fourth supporter for supporting the fourth adsorption unit;
A fourth vertical actuator for moving the fourth support in the vertical direction; And
A fourth motor part for moving the fourth support part in the first direction or the second direction;
And the substrate processing apparatus. 11. The method of claim 10,
Wherein one of the third transferring portion and the fourth transferring portion further comprises a second horizontal actuator for moving the third supporting portion or the fourth supporting portion in the horizontal direction. The method according to claim 1,
Wherein the first direction is a progressing direction of a processing step of the first and second substrates. delete

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