KR101466978B1 - Organic Light Emitting Display - Google Patents

Abstract

The present invention provides a display device comprising: a display unit including a plurality of subpixels arranged in a matrix on a substrate; A pad portion which is located at an outer periphery of the display portion and is electrically connected to the external device; A main power supply wiring arranged in a first direction adjacent to a region where the pad portion is located to supply a positive power supplied through the pad portion to a plurality of subpixels; A divided power supply line connected to the main power supply line and divided in a second direction different from the first direction; And a sub power supply wiring connected to the divided power supply wiring in a first direction, wherein the width of the main power supply wiring is wider than the width of the divided power supply wiring and the sub power supply wiring, and the width of the sub power supply wiring is larger than the width of the divided power supply wiring A wide organic electroluminescent display device is provided.

Organic electroluminescent display device, wiring, power source

Description

[0001] The present invention relates to an organic light emitting display,

The present invention relates to an organic light emitting display.

An organic electroluminescent device used in an organic electroluminescent display device is a self-luminous device in which a light emitting layer is formed between two electrodes.

The organic electroluminescent device is classified into a passive matrix organic light emitting diode (PMOELD) and an active matrix organic light emitting diode (AMOELD) according to a driving method.

In such an organic light emitting display device, a plurality of subpixels are arranged in a matrix form in a display portion. The plurality of subpixels emit light by receiving a scan signal, a data signal, and a power source from an external device, thereby displaying an image.

On the other hand, in the power source supplied to the organic light emitting display device, a current or a voltage drop due to the resistance of the power source wiring occurs, and a power source supplied through the power source wiring has a deviation. If a deviation occurs in the power source as described above, the display quality is degraded, and improvement thereof is required.

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic light emitting display device capable of improving display quality.

According to an aspect of the present invention, there is provided a display device comprising: a display unit including a plurality of subpixels arranged in a matrix on a substrate; A pad portion which is located at an outer periphery of the display portion and is electrically connected to the external device; A main power supply wiring arranged in a first direction adjacent to a region where the pad portion is located to supply a positive power supplied through the pad portion to a plurality of subpixels; A divided power supply line connected to the main power supply line and divided in a second direction different from the first direction; And a sub power supply wiring connected to the divided power supply wiring in a first direction, wherein the width of the main power supply wiring is wider than the width of the divided power supply wiring and the sub power supply wiring, and the width of the sub power supply wiring is larger than the width of the divided power supply wiring A wide organic electroluminescent display device is provided.

The sub power supply wiring may be located in a region facing the main power supply wiring.

The divided power supply lines may be connected to a plurality of subpixels, respectively.

And one or more connection power supply lines connected to the divided power supply lines and positioned to pass between the plurality of subpixels.

The width of one or more connection power supply lines may be narrower than the width of sub power supply lines.

The width of the one or more connection power supply wirings may be narrower as they are located in the region adjacent to the main power supply wiring and located in the region adjacent to the sub power supply wiring.

The one or more connection power lines may be connected to the plurality of subpixels, respectively.

According to another aspect of the present invention, there is provided a display device comprising: a display unit arranged on a substrate in a matrix form and including three or more subpixels emitting different colors; A pad portion which is located at an outer periphery of the display portion and is electrically connected to the external device; First, second and third main power supply wirings divided and arranged in a first direction adjacent to a region where the pad portion is positioned to supply a positive power supplied through the pad portion to three or more subpixels, respectively; First, second and third divided power supply lines respectively connected to the first, second and third main power supply wirings and wired in a second direction different from the first direction; And first, second, and third sub power supply wirings connected to the first, second, and third divided power supply wirings and divided and wired in a first direction, wherein the first, second, and third main power supply wirings Second, and third sub power supply wirings are wider than the widths of the first, second and third sub power supply wirings and the first, second, and third sub power supply wirings, and the widths of the first, And the width of the third divided power supply wiring.

The first, second, and third sub power supply wirings may be separately located in regions facing the first, second, and third main power supply wirings.

The first, second and third divided power supply lines may be connected to three or more subpixels, respectively.

Second, and third connection power supply wirings connected to the first, second, and third divided power supply wirings and positioned so as to pass between the three or more subpixels.

The widths of the first, second and third connection power supply wirings may be narrower than the widths of the first, second and third sub power supply wirings.

The widths of the first, second and third connection power supply wirings are set so as to be larger in a region adjacent to the first, second and third main power supply wirings and in a region adjacent to the first, The closer it is located, the narrower it can be.

The first, second, and third connection power supply wirings may be separately connected to three or more subpixels.

The three or more subpixels may include red, blue, and green subpixels.

INDUSTRIAL APPLICABILITY The present invention has the effect of improving display quality by varying the power wiring structure of an organic light emitting display device. Further, there is an effect that the problem of current or voltage drop occurring in a specific region can be improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A is a plan view of an organic light emitting display device.

The organic light emitting display shown in FIG. 1A may include a display unit 120 including a plurality of subpixels P arranged in a matrix form on a substrate 110. The plurality of subpixels P may include three or more subpixels emitting different colors. Here, three or more sub-pixels emitting different colors may include red, green, and blue, but may further include white or orange.

The sub pixel P disposed on the display unit 120 is susceptible to moisture or oxygen, so that the adhesive member 140 can be formed on the substrate 110 and sealed with the sealing substrate 130.

On the other hand, the pad unit 150 may be positioned on the outer side of the substrate 110 on which the display unit 120 is located. The pad unit 150 may be electrically connected to an external device (not shown). The external device can supply a scan signal, a data signal, a power source, and the like to the subpixel P disposed on the display unit 120 through the pad unit 150. The subpixel P receiving a scan signal, a data signal, and a power supply can selectively emit light.

Hereinafter, the structure of the sub-pixel located in FIG. 1A will be described in more detail with reference to FIG. 1B.

Figure 1B is an illustration of a sub-pixel located in Figure 1A.

Referring to FIG. 1B, a buffer layer 111 may be disposed on the substrate 110. The buffer layer 111 may be formed to protect a thin film transistor formed in a subsequent process from an impurity such as an alkali ion or the like flowing out from the substrate 110. The buffer layer 111 may be made of silicon oxide (SiO ₂ ), silicon nitride (SiN x), or the like.

The semiconductor layer 112 may be located on the buffer layer 111. The semiconductor layer 112 may comprise amorphous silicon or polycrystalline silicon crystallized therefrom. Although not shown here, the semiconductor layer 112 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities.

A gate insulating layer 113 may be disposed on the substrate 110 including the semiconductor layer 112. The gate insulating film 113 can be selectively formed using silicon oxide (SiO ₂ ), silicon nitride (SiN x), or the like.

The gate electrode 114 may be positioned on the gate insulating layer 113 to correspond to a channel region which is a predetermined region of the semiconductor layer 112. Gate electrode 114 is made of aluminum (Al), aluminum alloy (Al alloy), titanium (Ti), silver (Ag), molybdenum (Mo), molybdenum alloy (Mo alloy), tungsten (W), tungsten silicide (WSi ₂ ). ≪ / RTI >

The interlayer insulating film 115 may be positioned on the substrate 110 including the gate electrode 114. [ The interlayer insulating film 115 may be an organic film or an inorganic film, or a composite film thereof.

When the interlayer insulating film 115 is an inorganic film, it may include silicon oxide (SiO ₂ ), silicon nitride (SiNx), or silicate on glass (SOG). On the other hand, an organic film may include an acrylic resin, a polyimide resin, or a benzocyclobutene (BCB) resin. The first and second contact holes 115a and 115b for exposing a part of the semiconductor layer 112 may be disposed in the interlayer insulating film 115 and the gate insulating film 113. [

The first electrode 116a may be located on the interlayer insulating film 115. [ The first electrode 116a may be an anode and may include a transparent conductive layer such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), and the first electrode 116a may include a layered structure such as ITO / Ag / ITO Lt; / RTI >

Source and drain electrodes 116b and 116c may be located on the interlayer insulating film 115. [ The source and drain electrodes 116b and 116c may be electrically connected to the semiconductor layer 112 through the first and second contact holes 115a and 115b. A part of the drain electrode 116c may be located on the first electrode 116a and may be electrically connected to the first electrode 116a.

The source and drain electrodes 116b and 116c may include a low-resistance material for lowering the wiring resistance. The source and drain electrodes 116b and 116c may be a single layer or a multilayer film made of molybdenum (Mo), molybdenum tungsten (MoW), titanium (Ti), aluminum (Al), or aluminum alloy. In the case of a multilayer film, a laminated structure of titanium / aluminum / titanium (Ti / Al / Ti) or molybdenum / aluminum / molybdenum (Mo / Al / Mo) or molybdenum tungsten / aluminum / molybdenum have. However, the laminated structure in the case of the multilayer film is not limited thereto.

The transistor located on the substrate 110 includes the gate electrode 114, the source and drain electrodes 116b and 116c, and the transistor array having a plurality of transistors and capacitors can be electrically connected to the following organic light emitting diodes have. (However, the structure of the capacitor is omitted)

An insulating film 117 that exposes a part of the first electrode 116a may be disposed on the first electrode 116a (e.g., an anode). The insulating film 117 may include an organic material such as a benzocyclobutene (BCB) resin, an acrylic resin, or a polyimide resin.

The organic light emitting layer 118 may be disposed on the exposed first electrode 116a and the second electrode 119 may be disposed on the organic light emitting layer 118. [ The second electrode 119 may be a cathode that supplies electrons to the organic light emitting layer 118 and may include magnesium (Mg), silver (Ag), calcium (Ca), aluminum (Al) .

The organic light emitting diode connected to the source or drain electrodes 116b and 116c of the transistor array on the substrate 110 includes the first electrode 116a, the organic light emitting layer 118, and the second electrode 119 .

However, the first electrode 116a located on the source or drain electrodes 116b and 116c of the transistor array may be located on the planarization film for planarizing the surface of the transistor array. Further, the structure of the transistor array may be different depending on whether it is a top gate or a batam gate. These structures may also vary depending on the number of masks used in forming the transistor array and the semiconductive layer material. Therefore, the structure of the subpixel is not limited thereto.

Referring again to FIG. 1A, the scan signal, the data signal, and the power source may be supplied to the plurality of subpixels P through a scan line, a data line, and a power line, respectively. Here, the power supply wiring may have various structures as described below to improve the current or voltage drop problem, and the width of the wiring may be different depending on the position and purpose.

≪ Embodiment 1 >

2 is a power supply wiring structure according to the first embodiment of the present invention. The power supply wiring structure shown in FIG. 2 is schematically shown for convenience of description, and subpixels are shown as R (red), G (green), and B (blue), respectively.

2, the main power supply line 210 includes a pad portion (not shown) for supplying a positive power supplied through a pad portion (not shown) to a plurality of sub pixels R, G and B And can be wired in the first direction adjacent to the region. The divided power supply line 220 may be connected to the main power supply line 210 and may be divided and wired in a second direction different from the first direction. Further, the sub power supply wiring 230 may be connected to the divided power supply wiring 220 and wired in the first direction.

Here, the divided power supply lines 220 may be connected to the plurality of sub-pixels P, respectively. The sub power supply wiring 230 may be connected to the divided power supply wiring 220 and may be located in a region facing the main power supply wiring 210 like the first sub power supply wiring 230a. However, the sub power supply wiring 230 is not limited to this and may be selectively located within the display portion (not shown) like the second sub power supply wiring 230b or the third sub power supply wiring 230c.

The width of the main power supply wiring 210 is larger than the width of the divided power supply wiring 220 and the sub power supply wiring 230 and the width of the sub power supply wiring 230 is formed wider than the width of the divided power supply wiring 220 . This is because the power supplied from the external device is divided into the divided power supply wiring 220 and the sub power supply wiring 230 through the main power supply wiring 210 and the like. That is, the amount of current or voltage flowing into the main power supply line 210 is the largest.

The reason why the width of the sub power supply wiring 230 is formed to be wider than the width of the divided power supply wiring 220 is that the width of the sub power supply wiring 230 is wider than the width of the divided power supply wiring 220, As well.

≪ Embodiment 2 >

3 is a power supply wiring structure according to a second embodiment of the present invention. The power supply wiring structure shown in FIG. 3 is schematically shown for convenience of description, and subpixels are shown as R (red), G (green), and B (blue), respectively. However, the subpixel may further include not only R, G, and B but also subpixels that emit W (white) or other colors.

3, the main power supply line 210 includes a pad portion (not shown) for supplying a positive power supplied through a pad portion (not shown) to a plurality of sub pixels R, G, and B And can be wired in the first direction adjacent to the region. Further, the divided power supply line 220 may be connected to the main power supply line 210 and may be wired in a second direction different from the first direction. Further, the sub power supply wiring 230 may be connected to the divided power supply wiring 220 and wired in the first direction.

Here, the divided power supply lines 220 may be connected to the plurality of sub-pixels P, respectively. The sub power supply wiring 230 may be located in a region facing the main power supply wiring 210.

The width of the main power supply wiring 210 is larger than the width of the divided power supply wiring 220 and the sub power supply wiring 230 and the width of the sub power supply wiring 230 is formed wider than the width of the divided power supply wiring 220 . This is because the power supplied from the external device is divided into the divided power supply wiring 220 and the sub power supply wiring 230 through the main power supply wiring 210 and the like. That is, the amount of current or voltage flowing into the main power line 210 is the largest.

The width of the sub power supply wiring 230 is formed wider than the width of the divided power supply wiring 220 because the width of the sub power supply wiring 230 is set to be larger than the width of the divided power supply wiring 220, As well.

Meanwhile, one or more connection power supply wirings 240 connected to the divided power supply wirings 220 and positioned to pass between the plurality of subpixels R, G, and B may be included. One or more connection power supply wirings 240 may be connected to the plurality of sub-pixels R, G, and B, respectively.

Here, the width of one or more connection power supply wirings 240 may be narrower than the width of the sub power supply wirings 230. This is because one or more connection power supply wirings 240 are positioned between the respective lines to serve as reinforcing wirings.

The one or more connection power supply lines 240 can reduce a power supply deviation to be supplied to a plurality of sub-pixels R, G, B microscopically located on each line and macroscopically supply power through the main power supply line 210 Can be supplied to the entire display unit in the same manner. That is, by adding one or more connection power supply wirings 240, the power supply wirings can be netted to reinforce the power supply wiring so that no current or voltage drop appears in a specific region.

Here, one or more connection power supply wirings 240 may all be formed to have the same width. However, the width of one or more connection power supply wirings 240 may be narrower as they are located in a region adjacent to the main power supply wiring 210, and may be located in a region adjacent to the sub power supply wiring 230. This takes into account the fact that the current or voltage is lowered from the main power source line 210 to the area farther from the main power source line 210 under the condition that the width of the wiring is the same.

The width of the one or more connection power supply wirings 240 may be larger than the width of the divided power supply wirings 220. The reason for this is that the width between the subpixel located in the nth row and the subpixel located in the (n + 1) th row is wider than the width between the subpixels located in the nth row.

However, this may vary depending on the width between the subpixels located in the nth row or between the subpixel located in the nth row and the (n + 1) th row. Therefore, the width of the divided power supply wiring 220 may be formed to be wider than the width of the at least one connecting power supply wiring 240.

≪ Third Embodiment >

4 is a power supply wiring structure according to a third embodiment of the present invention. The power supply wiring structure shown in Fig. 4 is schematically shown for convenience of explanation, and subpixels are shown as R (red), G (green), and B (blue), respectively.

Referring to FIG. 4, the first, second and third main power supply lines 210R, 210G and 210B are connected to three or more sub-pixels R, G and B (Not shown) so as to be supplied to each of the first and second substrates. When the first, second, and third main power supply lines 210R, 210G, and 210B are divided and positioned as described above, three or more sub-pixels R, G, and B may receive different power supplies. That is, three or more sub-pixels R, G, and B may have different amounts of power required.

The first, second and third divided power supply lines 220R, 220G and 220B are connected to the first, second and third main power supply lines 210R, 210G and 210B, respectively, Direction. The first, second and third sub power supply lines 230R, 230G and 230B are connected to the first, second and third divided power supply lines 220R, 220G and 220B, respectively, .

Here, the first, second and third divided power supply lines 220R, 220G and 220B may be connected to a plurality of sub-pixels R, G and B, respectively. The first, second, and third sub power supply lines 230R, 230G, and 230B may be located in regions facing the first, second, and third main power supply lines 210R, 210G, and 210B, It does not. That is, the first, second, and third sub power supply lines 230R, 230G, and 230B may be selectively positioned within the display unit (not shown).

The widths of the first, second and third main power supply wirings 210R, 210G and 210B are the same as the widths of the first, second and third divided power supply wirings 220R, 220G and 220B and the first, The widths of the first, second and third sub power supply wirings 230R, 230G and 230B are larger than the widths of the sub power supply wirings 230R, 230G and 230B and the widths of the first, second and third divided power supply wirings 220R, The first, second and third main power supply wirings 210R, 210G and 210B are connected to the first, second and third divided power supply wirings 210R, 220G and 220B through the main power supply wiring 210 220R, 220G and 220B and the first, second and third sub power supply lines 230R, 230G and 230B. That is, the amount of current or voltage flowing into the first, second, and third main power supply wirings 210R, 210G, and 210B is the largest.

The reason why the widths of the first, second and third sub power supply lines 230R, 230G and 230B are formed to be wider than the widths of the first, second and third divided power supply lines 220R, 220G and 220B, Second and third main power supply lines 210R, 210G and 210B so as not to cause a deviation in current or voltage flowing through the second and third divided power supply lines 220R, 220G and 220B This is because it plays a role.

<Fourth Embodiment>

5 is a power supply wiring structure according to a fourth embodiment of the present invention. The power supply wiring structure shown in FIG. 5 is schematically shown for convenience of description, and subpixels are shown as R (red), G (green), and B (blue), respectively.

5, the first, second and third main power supply lines 210R, 210G and 210B are connected to three or more sub-pixels R, G, B (not shown) via a pad unit (Not shown) so as to be supplied to each of the first and second substrates. When the first, second, and third main power supply lines 210R, 210G, and 210B are divided and positioned as described above, three or more sub-pixels R, G, and B may receive different power supplies. That is, three or more sub-pixels R, G, and B may have different amounts of power required.

The first, second and third divided power supply lines 220R, 220G and 220B are connected to the first, second and third main power supply lines 210R, 210G and 210B, respectively, Direction. The first, second and third sub power supply lines 230R, 230G and 230B are connected to the first, second and third divided power supply lines 220R, 220G and 220B, respectively, .

Here, the first, second and third divided power supply lines 220R, 220G and 220B may be connected to a plurality of sub-pixels R, G and B, respectively. The first, second, and third sub power supply lines 230R, 230G, and 230B may be located in regions facing the first, second, and third main power supply lines 210R, 210G, and 210B, It does not. That is, the first, second, and third sub power supply lines 230R, 230G, and 230B may be selectively positioned within the display unit (not shown).

The widths of the first, second and third main power supply wirings 210R, 210G and 210B are the same as the widths of the first, second and third divided power supply wirings 220R, 220G and 220B and the first, The widths of the first, second and third sub power supply wirings 230R, 230G and 230B are larger than the widths of the sub power supply wirings 230R, 230G and 230B and the widths of the first, second and third divided power supply wirings 220R, The first, second and third main power supply wirings 210R, 210G and 210B are connected to the first, second and third divided power supply wirings 210R, 220G and 220B through the main power supply wiring 210 220R, 220G and 220B and the first, second and third sub power supply lines 230R, 230G and 230B. That is, the amount of current or voltage flowing into the first, second, and third main power supply wirings 210R, 210G, and 210B is the largest.

The reason why the widths of the first, second and third sub power supply lines 230R, 230G and 230B are formed to be wider than the widths of the first, second and third divided power supply lines 220R, 220G and 220B, Second and third main power supply lines 210R, 210G and 210B so as not to cause a deviation in current or voltage flowing through the second and third divided power supply lines 220R, 220G and 220B This is because it plays a role.

The first, second, and third connection power sources, which are connected to the first, second, and third divided power source lines 220R, 220G, 220B and are located across the plurality of sub pixels R, G, And may include a wiring 240. The first, second, and third connection power supply wirings 240 may be connected to the plurality of sub-pixels R, G, and B, respectively.

Here, the widths of the first, second, and third connection power supply wirings 240 may be narrower than the widths of the first, second and third sub power supply wirings 230R, 230G, and 230B. This is because the first, second, and third connection power supply wirings 240 are positioned between the respective lines to serve as reinforcing wirings.

The first, second, and third connection power supply wirings 240 can microscally reduce a power supply deviation supplied to a plurality of sub-pixels R, G, and B located in respective lines, and macroscopically, The power supplied through the second and third main power supply lines 210R, 210G, and 210B may be supplied to the entire display unit in the same manner. In other words, by adding the first, second, and third connection power supply wirings 240), the power supply wirings can have a net shape so that the power supply wiring can be reinforced so that no current or voltage drop appears in a specific region.

Here, the first, second, and third connection power supply wirings 240 may all be formed to have the same width. However, the widths of the first, second, and third connection power supply wirings 240 are wider as they are located in the region adjacent to the first, second, and third main power supply wirings 210R, 210G, and 210B, , And the second and third sub power supply lines 230R, 230G, and 230B. This takes into account the fact that the current or voltage is lowered toward the region far from the first, second and third main power supply wirings 210R, 210G, 210B under the condition that the width of the wiring is the same.

The widths of the first, second, and third connection power supply wirings 240 may be greater than the widths of the first, second, and third divided power supply wirings 220R, 220G, and 220B. The reason for this is that the width between the subpixel located in the nth row and the subpixel located in the (n + 1) th row is wider than the width between the subpixels located in the nth row.

However, this may vary depending on the width between the subpixels located in the nth row or between the subpixel located in the nth row and the (n + 1) th row. Accordingly, the widths of the first, second, and third divided power supply lines 220R, 220G, and 220B may be wider than the widths of the first, second, and third connection power supply lines 240.

Meanwhile, in the first, second, third, and fourth embodiments, the current or voltage becomes stronger due to the wiring resistance as the distance from the region where the power source is introduced increases, thereby solving the problem of luminance deviation between subpixels .

Here, if the width of the wiring is made wide, the wiring resistance can be lowered than if the width of the wiring is narrow. However, in the present invention, the reason why the power supply wiring of a certain region is formed differently according to the width between the subpixels is to wire the power supply wiring within a range that does not reduce the aperture ratio of the subpixel. However, this method can be applied in a different thickness instead of widening the power supply wiring.

The present invention has the effect of improving the display quality by varying the power wiring structure of the organic light emitting display device. Further, there is an effect that the problem of current or voltage drop occurring in a specific region can be improved.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, As will be understood by those skilled in the art. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

1A is a plan view of an organic electroluminescent display device;

Figure 1B is an illustration of a subpixel located in Figure 1A;

FIG. 2 is a power supply wiring structure according to the first embodiment of the present invention. FIG.

3 is a power wiring structure according to a second embodiment of the present invention;

4 is a power wiring structure according to a third embodiment of the present invention;

5 is a power supply wiring structure according to a fourth embodiment of the present invention;

DESCRIPTION OF THE REFERENCE NUMERALS

110: substrate 120: display unit

130: sealing substrate 140: adhesive member

150: pad portion P: sub-pixel

Claims (15)

A display comprising a plurality of subpixels arranged in a matrix on a substrate; A pad unit located at an outer periphery of the display unit and electrically connected to an external device; A main power wiring line arranged in a first direction adjacent to a region where the pad portion is positioned to supply a positive power supplied through the pad portion to the plurality of subpixels; A divided power supply line connected to the main power supply line and divided in a second direction different from the first direction; And And a sub power supply wiring connected to the divided power supply wiring and arranged in a region facing the main power supply wiring, the sub power supply wiring being wired in the first direction, Wherein a width of the main power supply wiring is wider than a width of the divided power supply wiring and sub power supply wiring, a width of the sub power supply wiring is wider than a width of the divided power supply wiring, And one or more connection power supply wirings connected to the divided power supply wirings and wired in the first direction to pass between the plurality of subpixels, The width of the at least one connection power supply wiring is narrower than the width of the sub power supply wiring, The width of the one or more connection power supply wirings is larger as it is located in a region adjacent to the main power supply wiring, and narrower in a region adjacent to the sub power supply wiring, Wherein the width of the at least one connection power supply wiring is larger than the width of the divided power supply wiring. delete delete delete delete delete delete A display unit arranged on the substrate in a matrix form and including three or more subpixels emitting different colors; A pad unit located at an outer periphery of the display unit and electrically connected to an external device; First, second, and third main power wiring lines arranged in a first direction adjacent to an area where the pad unit is positioned to supply a positive power supplied through the pad unit to the three or more subpixels, respectively; First, second and third divided power supply lines respectively connected to the first, second and third main power supply lines and divided in a second direction different from the first direction; And Second, and third sub power supply wirings connected to the first, second, and third divided power supply wirings and divided in the first direction and separated from each other in a region facing the main power supply wiring, &Lt; / RTI &gt; Second, and third main power supply wirings are wider than the widths of the first, second, and third divided power supply wirings and the first, second, and third sub power supply wirings, and the widths of the first, And the width of the third sub power supply wiring are wider than the widths of the first, second and third divided power supply wirings, Second, and third connection power supply wirings connected to the first, second, and third divided power supply wirings and wired in the first direction so as to divide the three or more subpixels, The widths of the first, second, and third connection power supply wirings are narrower than the widths of the first, second, and third sub power supply wirings, The width of the first, second, and third connection power supply wirings is larger as the width of the first, second, and third connection power supply wirings is in a region adjacent to the first, second, and third main power supply wirings, The closer to the region, Wherein the widths of the first, second, and third connection power supply wirings are larger than the widths of the first, second, and third divided power supply wirings. delete delete delete delete delete delete delete

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