KR101460899B1 - Electronic control apparatus for vehicle - Google Patents

Abstract

The present invention relates to an electronic control device for a vehicle. The electronic control device according to the present invention includes an electronic circuit substrate that has a heating element mounted on an upper surface and electrically controls each part of the vehicle; a heat-radiating thin film that is arranged on the upper surface of the electronic circuit substrate to be adjacent to the heating element so as to have a predetermined width and a predetermined length from one side surface of the heating element and is formed to be capable of absorbing heat of the heating element; a base that is positioned on the lower surface of the electronic circuit substrate, absorbs the heat generated from the heating element, and discharges the heat outside; a first heat-radiating member that is inserted between the lower surface of the electronic circuit substrate and the contact surface of the heat sink and transmits the heat of the heating element to the base; a cover that is coupled with the base and accommodates the electronic circuit substrate to be capable of forming a predetermined space in the upper surface of the electronic circuit substrate and has a curved portion, which is capable of being adjacent toward the heat-radiating thin film, formed therein so that the heat generated from the heating element can be absorbed by the heat-radiating thin film and be discharged outside; and a second heat-radiating member that is inserted between the upper surface of the heat-radiating thin film and a contact surface of the curved portion of the cover and transmits the heat of the heating element to the cover through the heat-radiating thin film.

Description

[0001] ELECTRONIC CONTROL APPARATUS FOR VEHICLE [0002]

An embodiment of the present invention relates to an electronic control device for a vehicle, and more particularly to an electronic control device for an electronic control device such as an engine ECU (Electronic Control Unit) of a vehicle, which radiates heat of a heating element in both directions, .

Generally, an electronic control device such as an ECU for electronically controlling various devices is mounted on a vehicle. Such an electronic control device is provided with information from sensors or switches installed in each part of the vehicle. The electronic control unit processes the information thus provided to improve ride comfort and safety of the vehicle or to perform various electronic controls to provide drivers and passengers with various conveniences.

For example, electronic control devices such as ECUs that control the state of an engine, an automatic transmission, and an ABS (Anti-Lock Brake System) of a vehicle with a computer are developed not only with the development of automobiles and computers but also with automatic transmission control, Braking system, steering system and so on.

An electronic control device such as an ECU or the like includes a case composed of an upper cover and a lower base, a printed circuit board (PCB) accommodated in the case, a connector coupled to the front end of the PCB for external socket connection .

The cover and the base are assembled together while covering the PCB. Especially, when assembled between the cover and the base, the connector interposed therebetween has a sealing structure with the cover side and the base side.

A heating element is formed on the upper surface of the PCB, and a heat radiation pad is attached to the lower surface of the PCB. The cover and base are then screwed together.

On the upper surface of the PCB, a heating element such as a capacitor, a transistor, or various ICs is mounted, and heat is generated from the element by operation. At this time, a heat-radiating pad having a high thermal conductivity is attached to the lower surface of the PCB so that the generated heat can be discharged to the outside. If the heat-dissipating function of the heat-generating element is not smooth, malfunction of the element due to heat generation may occur, durability of the component may be deteriorated, and abnormal operation of the electronic control unit may occur.

The embodiments of the present invention are intended to provide an electronic control device for a vehicle having excellent heat dissipation performance by dissipating the heat of the heat generating element in both directions. An object of the present invention is to provide an electronic control device which is easy in the manufacturing process and can improve the heat dissipation performance through the pressing force in forming the bidirectional heat dissipating structure.

An electronic control device of the present invention includes: an electronic control board having a heating element mounted on an upper surface thereof and electrically controlling each part of the vehicle; A heat dissipation thin plate arranged on the upper surface of the electron control substrate adjacent to the heat generating element to have a predetermined width and length from the one side of the heat generating element and capable of absorbing heat of the heat generating element; A base disposed on a lower surface of the electronic control board and absorbing heat generated from the heating element and discharging the heat to the outside; A first heat dissipating member inserted between a lower surface of the electronic control board and a contact surface of the base to transmit heat of the heat generating element to the base; The electronic control board is coupled to the base so as to form a predetermined space on the upper surface of the electronic control board so as to accommodate the electronic control board so that the heat generated from the heating element can be absorbed through the heat- A cover having a curved portion adjacent to the heat radiating thin plate; And a second radiating member inserted between the upper surface of the radiating thin plate and the contact surface of the curved portion of the cover to transmit the heat of the radiating element to the cover through the radiating thin plate.

The electronic control device is characterized in that heat generated in the heat generating element is transmitted to the curved portion of the cover through the base and the heat-radiating thin plate so that heat can be radiated in both directions.

The heat radiating thin plate is a plurality of copper foil patterns formed on the electronic control substrate in contact with the side surface of the heat generating element.

The second radiation member may be a radiating paste or a liquid glue, and may be applied in a zigzag pattern on the top of the copper foil pattern.

The first heat dissipating member and the second heat dissipating member may be a heat dissipation pad, a heat dissipation paste, or a liquid glue having conductivity and adhesiveness.

According to the embodiment of the present invention, heat dissipation performance is further improved by dissipating the heat of the heat generating element in both directions.

Further, since the heat dissipation performance is improved, it is possible to use a less expensive heat-dissipating material without using an expensive heat-dissipating material excellent in heat dissipation performance, thereby reducing the cost.

Further, in forming the bidirectional heat dissipation structure, according to the embodiment of the present invention, the manufacturing process is comparatively easy.

Further, since the pressing force can be applied to the heat radiation member through the curved portion of the cover, the heat radiation effect is maximized.

1 is an assembled perspective view of an electronic control unit of an automobile.
2 is a cross-sectional view showing an electronic control unit of an automobile.
3 is a cross-sectional view showing an electronic control unit of an automobile according to an embodiment of the present invention.
4 is a plan view for explaining an upward heat dissipation structure of an electronic control unit for an automobile according to an embodiment of the present invention.
5 is a reference view for explaining a heat dissipation mechanism of an electronic control unit of an automobile according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The configuration of the present invention and the operation and effect thereof will be clearly understood through the following detailed description. Before describing the present invention in detail, the same components are denoted by the same reference symbols as possible even if they are displayed on different drawings. In the case where it is judged that the gist of the present invention may be blurred to a known configuration, do.

1 is an assembled perspective view of an electronic control unit of an automobile.

As shown in the figure, the electronic control unit is an electronic control unit for electrically controlling each part of a vehicle, for example, a component mounted with integrated control circuit means such as a PCB (Printed Circuit Board) A tight sealing structure is required to prevent the inflow of foreign matter.

The cover 10 and the base 20 are provided with a cover 10 and a base 20 which are vertically combined with each other while receiving a substrate such as a PCB. 30 are combined. The connector 30 is joined together in such a manner that the cover 10 and the base 20 are sandwiched therebetween through the rear end body portion when they are coupled to each other in the up and down directions.

As shown in Fig. 1, an electronic control unit is an electronic control unit that electrically controls each part of an automobile, for example, an integrated control circuit unit such as a PCB, and the like. The electronic control unit includes a capacitor A heat dissipating structure for discharging heat generated from the heat generating element to the outside is required.

1, an electronic control board is received between the cover 10 and the base 20, including electronic control elements for electrically controlling each part of the automobile. On the upper surface of the electronic control board, a heating element such as a capacitor, a transistor, and an IC is mounted. A heat dissipation pad made of a conductive material is inserted between the lower surface of the electronic control board and the base 20 to emit heat generated in the heat dissipation element. Accordingly, the heat generated in the heat generating element is conducted to the electronic control board and the heat radiating pad, and is conducted to the lower base 20, thereby forming the heat dissipating mechanism.

The heat dissipation pad is generally configured to have an adhesive force on at least one side or both sides to be closely fixed to the heat sink bonding surface of the base 20 and the lower surface of the electronic control board. The heat radiating pad can be pressed and inserted between the base 20 and the electronic control board to increase the thermal conductivity, and the torque can be adjusted through the screw to have a predetermined pressure between the electronic control board and the heat sink.

However, such a heat dissipating structure has a heat dissipating performance only in the side of the base 20, which limits the heat dissipating performance. Accordingly, the heat generated by the heat generating element can not be sufficiently transmitted to the outside, and the heat generating element may malfunction or malfunction. In order to prevent this, a relatively expensive heating element which is robust against heat can be employed, but the manufacturing cost is increased when a large amount of expensive heating elements are used.

2 is a cross-sectional view showing an electronic control device of a vehicle to which a bi-directional heat dissipation structure is applied.

2 shows a bidirectional heat dissipation structure for forming a heat dissipation path not only on the base 20 side but also on the cover 11 side in order to maximize the heat dissipation performance of the heat dissipation element.

An electronic control board 40 containing electronic control elements for electrically controlling each part of the automobile is received between the cover 11 and the base 20 as described above with reference to Fig. On the upper surface of the electronic control board 40, a heating element 50 such as a capacitor, a transistor, and an IC is mounted. A heat radiation pad 70 made of a conductive material is inserted between the lower surface of the electronic control board 40 and the base 20 in order to radiate heat generated in the heat generating element. The cover 11 is coupled with the base 20 to accommodate the electronic control board 40 so as to form a predetermined space on the upper surface of the electronic control board 40. At this time, the curved portion A is formed so that the cover 11 is adjacent to the heat generating element 50 so that the heat generated from the heat generating element 50 can be emitted to the outside through the cover 11. [ A heat radiation pad (60) is inserted between the curved portion (A) of the cover (11) and the heat generating element (50).

The heat generated in the heat generating element 50 is conducted to the electronic control board 40 and the lower heat dissipating pad 70 and is conducted to the lower base 20 so as to be discharged to the outside, And is conducted to the curved portion A of the cover 11 to be released to the outside. Thus, the overall heat dissipation structure can be formed in both directions of the lower base 20 and the upper cover 11.

The bidirectional heat dissipating structure as described above is advantageous in that the heat dissipating performance is maximized because the heat dissipating paths are diversified as compared with the conventional one-way heat dissipating structure. However, in the heat dissipating structure shown in FIG. 2, the curved portion A should be formed directly on the upper surface of the heat generating element 50. Considering that the size is not the same depending on the heating elements, The manufacturing process is complicated.

FIG. 3 is a cross-sectional view showing an electronic control device of a vehicle to which a bidirectional heat radiating structure according to an embodiment of the present invention is applied.

2, an electronic control board 40 is received between the cover 12 and the base 20, which includes electronic control elements for electrically controlling each part of the vehicle. On the upper surface of the electronic control board 40, a heating element 50 such as a capacitor, a transistor, and an IC is mounted. A heat dissipating member 70 made of a conductive material is inserted between the lower surface of the electronic control board 40 and the base 20 to emit heat generated in the heat generating element 50.

The heat dissipation member 70 has conductivity and adhesiveness, and liquid glues such as a heat radiation pad, a heat dissipation paste, or a Q1 glue may be used.

A heat radiating thin plate (90) is formed on one side of the heat generating element (50) so as to emit heat generated from the heat generating element (50). The heat dissipation thin plate 90 is extended from a side of the heat dissipation element 50 to have a predetermined width and length and is arranged on the upper surface of the electronic control board 40, So that it can be absorbed and conducted. The radiating thin plate 90 may be formed of solder or a copper foil, and it is preferable that the surface is formed as wide as possible so that the heat can be easily released to the outside. According to another embodiment of the present invention, the radiating thin plate 90 may be formed of a plurality of line-shaped copper foil patterns.

4 is a plan view for explaining a heat dissipation structure through a heat dissipation thin plate 90 of an electronic control unit of an automobile according to an embodiment of the present invention.

4 is a top plan view of a configuration in which a heat generating element 50, a heat radiating thin plate 90, and a heat radiating member 61 formed on an electronic control board 40 with the cover 12 removed are arranged. In this embodiment, the heat dissipating thin plate 90 is a copper foil pattern composed of four lines, and the heat dissipating member 61 applies a liquid Q1 glue.

A thin radiating thin plate 90 is formed on the electronic control board 40 from one side of the heat generating element 50 and a Q1 glue 61 is coated in a zigzag form on the radiating thin plate 90. Then, the curved portion B of the cover is brought into contact with the radiating thin plate 90 to which the Q1 glue 61 is applied to form a heat radiating structure.

Referring to FIG. 3, the cover 12 is coupled to the base 20 to receive the electronic control board 40 so as to form a predetermined space on the upper surface of the electronic control board 40. The cover 12 is formed so as to be adjacent to the heat dissipating thin plate 90 such that the heat generated from the heat generating element 50 can be conducted to the cover 12 through the heat dissipating thin plate 90 do. A heat dissipating member (61) is inserted between the curved portion (B) of the cover (12) and the heat dissipating thin plate (90). The heat radiating member 61 may be a radiating paste or a liquid Q1 glue.

The heat generated in the heat generating element 50 is conducted to the electronic control board 40 and the lower heat dissipating pad 70 and is conducted to the lower base 20 so as to be discharged to the outside, And is conducted to the curved portion B of the cover 12 through the heat radiation member 61 so as to be emitted to the outside. Therefore, the overall heat dissipation structure can be formed in both directions of the lower base 20 and the upper cover 12.

The bidirectional heat dissipating structure as described above has the advantage that the heat dissipating performance is maximized because the heat dissipating paths are diversified as compared with the conventional unidirectional heat dissipating structure, and the manufacturing process is easier than the heat dissipating structure shown in FIG. That is, since the curved portion B is formed on the thin heat dissipating thin plate 90 such as the copper foil pattern instead of forming the curved portion A directly on the heating element 50, it is possible to keep the standardized structure constant .

5 is a reference view for explaining a heat dissipation mechanism of an electronic control unit of an automobile according to an embodiment of the present invention.

The heat generated in the heat generating element 50 is transmitted to the curved portion B of the cover 12 through the base 20 and the radiating thin plate 90 so that heat can be radiated in both directions.

On the other hand, the curved portion B of the cover 12 can form a higher thermal conductivity by forming a pressing force on the heat radiation member 61 due to its structural characteristics. That is, when a pressing force is applied to the heat radiating pads 61 and 70, the thickness of the heat radiating pad is reduced and the thermal impedance value of the heat radiating pad is lowered.

Therefore, the heat radiating effect can be further maximized through the bidirectional heat radiating structure.

The foregoing description is merely illustrative of the present invention, and various modifications may be made by those skilled in the art without departing from the spirit of the present invention. Accordingly, the embodiments disclosed in the specification of the present invention are not intended to limit the present invention. The scope of the present invention should be construed according to the following claims, and all the techniques within the scope of equivalents should be construed as being included in the scope of the present invention.

10, 11, 12: Cover 20: Base
30: connector 40: electronic control board
50: heat generating element 60, 61, 70: heat radiating member, heat radiating pad
80: Screws A and B:

Claims (5)

An electronic control board on which a heating element is mounted on an upper surface and electrically controls each part of the vehicle;
A heat dissipation thin plate arranged on the upper surface of the electron control substrate adjacent to the heat generating element to have a predetermined width and length from the one side of the heat generating element and capable of absorbing heat of the heat generating element;
A base disposed on a lower surface of the electronic control board and absorbing heat generated from the heating element and discharging the heat to the outside;
A first heat dissipating member inserted between a lower surface of the electronic control board and a contact surface of the base to transmit heat of the heat generating element to the base;
The electronic control board is coupled to the base so as to form a predetermined space on the upper surface of the electronic control board so as to accommodate the electronic control board so that the heat generated from the heating element can be absorbed through the heat- A cover having a curved portion adjacent to the heat radiating thin plate; And
And a second radiating member inserted between the upper surface of the radiating thin plate and the contact surface of the curved portion of the cover to transmit the heat of the radiating element to the cover through the radiating thin plate.
The method according to claim 1,
Wherein heat generated in the heat generating element is transmitted to the curved portion of the cover through the base and the heat radiating thin plate so that heat can be radiated in both directions.
The method according to claim 1,
Wherein the heat radiating thin plate is a plurality of copper foil patterns formed on the electronic control board in contact with the side surface of the heat generating element.
The method of claim 3,
Wherein the second heat radiation member is a heat dissipation paste or a liquid glue and is applied in a zigzag pattern on the top of the copper foil pattern.
The method according to claim 1,
Wherein the first heat dissipating member and the second heat dissipating member are heat dissipation pads, heat dissipating paste, or liquid glue having conductivity and adhesion.

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