KR101460034B1 - method of manufacturing thin PCB substrate using carrier substrate - Google Patents

Abstract

A method of manufacturing a thin printed circuit board in accordance with one embodiment is provided. In the method of manufacturing the thin printed circuit board, a carrier substrate including a first layer, a release layer, and a second layer which are sequentially stacked is prepared. A laminate structure including at least one circuit pattern layer and an insulating layer for insulating the circuit pattern layers from each other is formed on the carrier substrate. A trench is formed from the stacked structure to at least the release layer. By applying a force in different directions using the trench, the carrier substrate is separated with the release layer as a boundary.

Description

[0001] The present invention relates to a method of manufacturing a thin PCB substrate using a carrier substrate,

The present invention relates to a printed circuit board (PCB), and more particularly, to a method of manufacturing a thin printed circuit board using a carrier substrate.

2. Description of the Related Art In recent years, a variety of process technologies have been researched to reduce the thickness of a printed circuit board and to miniaturize a printed circuit pattern in accordance with the tendency of lightness and shortening of packaged products. One such process technique relates to a lamination method using a carrier substrate. Specifically, a process of forming a laminated structure by providing a carrier substrate and forming a plurality of circuit pattern layers and an insulating layer on the carrier substrate is performed. Then, a chip is mounted on the stacked structure, and then only the carrier substrate is removed to manufacture a thin printed circuit board. As described above, by applying the technique using the carrier substrate, the final printed circuit board can be formed with a thin thickness of 80 占 퐉 or less.

1A and 1B are views schematically showing a method of manufacturing a printed circuit board using a conventional carrier substrate. 1A, a carrier substrate having a core layer 110, a first copper layer 120, a release layer (not shown) on the first copper layer, and a second copper layer 130 on the release layer is prepared . The circuit pattern layer 150, the insulating layer 140 and the solder resist pattern 160 are formed on the second copper layer 130 and the chip 170 is mounted using the wire 190. [ Then, the protective layer 180 for protecting the chip 170 is formed to form a package intermediate structure. Subsequently, by separating the carrier substrate from the package intermediate structure with reference to the release layer, it is possible to achieve the thinning of the printed circuit board.

At this time, the operation of separating the first copper layer 120 and the second copper layer 130 from each other based on the release layer is performed manually, as shown in FIG. 1B. Specifically, after the package intermediate structure shown in FIG. 1A is turned upside down, a cutting tool such as a knife is attached to the interface between the first copper layer 120 and the second copper layer 130 at the side end face portion of the carrier substrate A portion of the release layer is removed. The first copper layer 120 and the core layer 130 are separated from the package intermediate structure by applying a force manually to the first copper layer 120 and the second copper layer 130 spaced apart by a part of the removed release layer, The layer 110 is peeled and removed.

Conventionally, as described above, since the separation operation of the carrier substrate is performed manually, there is a problem that the operation is difficult and the automation process is difficult.

Embodiments of the present invention provide a novel method of removing a carrier substrate from a stacked structure in a method of manufacturing a thin printed circuit board using a carrier substrate.

A method of manufacturing a thin printed circuit board in accordance with an aspect of the present invention is provided. In the method of manufacturing the thin printed circuit board, a carrier substrate including a first layer, a release layer, and a second layer which are sequentially stacked is prepared. A laminate structure including at least one circuit pattern layer and an insulating layer for insulating the circuit pattern layers from each other is formed on the carrier substrate. A trench is formed from the stacked structure to at least the release layer. By applying a force in different directions using the trench, the carrier substrate is separated with the release layer as a boundary.

A method of manufacturing an embedded printed circuit board according to another aspect of the present invention is provided. In the method of manufacturing the thin printed circuit board, a carrier substrate including a first layer, a release layer, and a second layer which are sequentially stacked is prepared. A laminate structure including at least one circuit pattern layer and an insulating layer for insulating the circuit pattern layers from each other is formed on the carrier substrate. A chip is mounted on the stacked structure. A mold layer for molding the chip is formed on the laminate structure. A trench reaching a part of the carrier substrate is formed in an arrangement region of the laminated structure in which the mold layer is not formed. Using the trench, the first layer and the second layer of the carrier substrate are separated from each other.

According to one embodiment, when a thin printed circuit board is manufactured using a carrier substrate, a trench is formed in the outer frame of the carrier substrate, and a force is applied by using the trench, thereby easily removing the carrier substrate from the stacked structure can do.

According to one embodiment, the use of the trench has the advantage of automating the carrier substrate separation process.

1A and 1B are views schematically showing a method of manufacturing a printed circuit board using a conventional carrier substrate.
2 is a cross-sectional view schematically showing a method of manufacturing a thin printed circuit board according to an embodiment of the present invention.
3 to 15 are sectional views schematically showing a method of manufacturing a thin printed circuit board according to an embodiment of the present invention.
16A to 16D are views for explaining a method of manufacturing a thin printed circuit board according to another embodiment of the present invention.
17A and 17B are views schematically showing a process of forming a trench according to an embodiment of the present invention.
18A and 18B are schematic views illustrating a process of forming a trench according to another embodiment of the present invention.
19A and 19B are views schematically showing a process of forming a trench according to another embodiment of the present invention.
20A and 20B are views schematically showing a process of forming a trench according to another embodiment of the present invention.

Embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. However, the techniques disclosed in this disclosure are not limited to the embodiments described herein but may be embodied in other forms. It should be understood, however, that the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of this disclosure to those skilled in the art. In the drawings, the width, thickness, and the like of the components are enlarged in order to clearly illustrate the components of each device. It is to be understood that when an element is described as being located on another element, it is meant that the element is directly on top of the other element or that additional elements can be interposed between the elements .

Like numbers refer to like elements throughout the several views. It is to be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise, and the terms "comprise" Or combinations thereof, and does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Further, in carrying out the method or the manufacturing method, the respective steps of the method may take place differently from the stated order unless clearly specified in the context. That is, each process may occur in the same order as described, may be performed substantially concurrently, and may not be excluded in some cases in the reverse order.

2 is a cross-sectional view schematically showing a method of manufacturing a thin printed circuit board according to an embodiment of the present invention. Referring to FIG. 2, in a block 210, a carrier substrate including a first layer, a release layer, and a second layer which are sequentially stacked is prepared. According to one embodiment, the carrier substrate comprises a core insulating layer, a first copper layer as a first layer deposited on the core insulating layer, a release layer formed on the first copper layer, a second copper layer on the second release layer, And a second copper layer as a layer. At block 220, a stacked structure is formed on the carrier substrate. The stacked structure may include at least one circuit pattern layer and an insulating layer that insulates the circuit pattern layer from each other. As an example, the circuit pattern layer may be a copper plated layer formed by a plating method. At 230 block, a trench is formed from the stacked structure to at least the release layer. In one embodiment, the trench may branch from the surface of the stack structure to the release layer of the carrier substrate. Or further processed so that the trench may extend to the underlying first or lower insulating core layer. In one embodiment, the trenches may be formed to be arranged in a line shape on one side of the stacked structure. In one embodiment, the trench may be formed in an outer portion of the carrier substrate. At 240 blocks, a force in different directions is applied to the carrier substrate and the laminated structure by using the trench, thereby separating the carrier substrate with the release layer as a boundary. In one embodiment, a portion of the stacked structure formed in the inward direction with respect to the trench is fixed using a first holding member, and a portion of the stacked structure formed in an outward direction with respect to the trench, Is fixed by the second fixing member. Then, forces are applied to the first fixing member and the second fixing member in directions different from each other with respect to the release layer, thereby separating the first layer and the second layer.

By separating the carrier substrate by the above-described method, the work can be performed more easily and efficiently than in the conventional manual work. Further, there is an advantage that the process of separating the carrier substrate can be automated.

According to one embodiment, before forming the trench, a chip may be mounted on the laminate structure, and a mold layer protecting the chip may be formed on the laminate structure. In this case, after the carrier substrate is separated, a step of forming an external connection pad may be performed on one side of the laminated structure from which the carrier substrate has been removed. Subsequently, by performing the step of forming a connection structure such as a solder ball on the external connection pad, a thin printed circuit board on which the chip is mounted can be manufactured.

3 to 15 are sectional views schematically showing a method of manufacturing a thin printed circuit board according to an embodiment of the present invention. Referring to FIG. 3, a carrier substrate 300 is prepared. The carrier substrate 300 includes an insulating core layer 310, a first layer 320, and a second layer 330. A release layer (not shown) may be disposed between the first layer 320 and the second layer 330. The release layer can function to bond the first layer 320 and the second layer 330 and to desorb the same. The first layer 320 and the second layer 330 may be formed of a copper layer.

Referring to FIG. 4, a first circuit pattern layer 340 is formed on a second layer 330. The first circuit pattern layer 340 may be a copper pattern layer, and may be formed by a known copper plating method and a patterning method. As an example, the copper plating method may be performed by electroplating, electroless plating or a combination thereof. For example, the pattern forming method may be a subtractive method, an additive method, a semi-additive method, or the like.

Referring to FIG. 5, an interlayer insulating layer 350 covering the first circuit pattern layer 340 is formed on the carrier substrate 300. According to one embodiment, the method of forming the interlayer insulating layer 350 may be performed by preparing an intermediate substrate including an insulating member and bonding the intermediate substrate to the first circuit pattern layer 340.

Referring to FIG. 6, the interlayer insulating layer 350 is selectively etched to form a contact pattern partially exposing the first circuit pattern layer 340. A via layer 360 filling the inside of the contact pattern and a second circuit pattern layer 370 formed on the upper surface of the interlayer insulating layer 350 are formed. The via layer 360 and the second circuit pattern layer 370 may be a copper pattern layer and may be formed by known copper plating and patterning methods.

Referring to FIG. 7, a solder resist coating layer is formed on the second circuit pattern layer 370 and the interlayer insulating layer 350, and the solder resist coating layer is patterned to partially expose the second circuit pattern layer 370 A solder mask pattern layer 380 is formed. The solder mask pattern layer 380 can function to protect the second circuit pattern layer 370 from the external environment.

7, a portion of the second circuit pattern layer 370 exposed by the solder mask pattern layer 380 is defined as a connection pad for external connection, and a surface treatment layer 390 is formed on the connection pad. . The surface treatment layer 390 may be a coating layer for preventing oxidation of the connection pad.

Referring to FIG. 8, a chip 410 is mounted on the stacked structure. In the drawing, the chip 410 is connected to the connection pad using a wire 420 as one embodiment. However, in other embodiments not shown, the chip 410 may be connected to the second circuit pattern layer 370 on the stack by the bump structure.

Referring to FIG. 9, a mold layer 430 for molding the chip 410 is formed on the stacked structure. The mold layer 430 may be formed, for example, by coating a known epoxy material on the laminate structure. The mold layer 430 may be formed to cover at least a part of the laminated structure.

Referring to FIG. 10, a trench 440 is formed from the stacked structure to a portion of the carrier substrate 300 in the region of the stacked structure where the mold layer 430 is not formed. As shown, a trench 440 may be formed to extend from the surface of the stack structure to the release layer of the carrier substrate 300. The trench 440 may be formed to reach the first layer 320 or the insulating core layer 310 by further processing.

According to one embodiment, the process of forming the trench 440 may proceed in the following order. The portion of the laminated structure in which the mold layer 430 is not formed is laser-processed to expose the second layer 330. The exposed second layer 330 is further laser processed to remove the release layer. Alternatively, the exposed layer may be further laser processed to remove the first layer 320. Alternatively, although not shown in the figure, the exposed first layer 320 may be further laser processed to remove the insulating core layer 310.

According to another embodiment, the process of forming the trench 440 may proceed in the following order. The portion of the laminated structure in which the mold layer 430 is not formed is laser-processed to expose the second layer 330. The exposed second layer 330 is removed by chemical etching to expose the release layer. When the second layer 330 is a copper plating layer, the second layer 330 may be removed by a wet etching method using, for example, copper chloride, iron chloride, an alkali solution, or sulfuric acid. Alternatively, although not shown, the trench 440 may be formed to expose the insulating core layer 310 by further removing the release layer and the first layer 320 by a chemical etching method.

As a laser processing method for forming the trench 440, for example, a carbon dioxide (CO2) laser, an ultraviolet (UV) laser, an excimer laser, or the like can be used.

Referring again to FIG. 10, the trench 440 may be formed in the outer portion of the carrier substrate 300. As an example, the trench 440 may be formed on the outer portion of the carrier substrate 300, which corresponds to a region of the laminate structure that does not affect the operation of the printed circuit board.

In some embodiments, the trench 440 may be formed by preparing a separate dummy area on the carrier substrate 300 in anticipation of the location at which the trench 440 is to be formed, and processing the stacked structure on the dummy area have.

The trenches 440 may be formed in a line-shaped arrangement along a predetermined direction on one side of the laminated structure. Such an arrangement in the form of a line can be understood more clearly through Figs. 16A to 16D to be described later.

Referring to FIG. 11, a portion of the laminated structure formed in the inner direction with respect to the trench 440 is attached and fixed to the first fixing member 450. One region of the stacked structure formed in the inner direction with respect to the trench 440 is denoted by 'A' region in the drawing. As shown in the figure, the mold layer 430 may be formed in the 'A' region.

The portion of the laminate structure formed on the outer side with respect to the trench 440 and the portion of the carrier substrate 300 are attached to the second fixing member 460 and fixed. One region of the stacked structure formed in the outward direction with respect to the trench 440 is denoted by 'B' region in the drawing. The B region may be an outer portion of the carrier substrate.

The second fixing member 460 has a bottom surface and one side surface of the insulating core layer 310, one side surface of the first layer 320, one side surface of the release layer, one side surface of the second layer 330, One end face of the interlayer insulating layer 350 and one end face of the solder mask pattern 380 can be fixed. However, in some other embodiments, the second fastening member 460 may not fix the entirety of the illustrated components but only a portion thereof. That is, by way of example, the second fixing member 460 may have one side surface of the insulating core layer 310, one side surface of the first layer 320, one side surface of the release layer, one side surface of the second layer 330, Only one end surface of the interlayer insulating layer 350 and one end surface of the solder mask pattern 380 may be fixed and the lower surface of the insulating core layer 310 may not be fixed. Alternatively, when fixing the portion 300 of the carrier substrate, only a part of the lower surface of the insulating core layer 310 may be fixed without fixing the entire lower surface of the insulating core layer 310. Such various modifications can be easily made based on knowledge of those skilled in the art.

The first fixing member 450 and the second fixing member 460 may be formed of any one of various known and various types and forms of structures so long as it is easy to receive force from the outside without damaging the carrier substrate 300 and the stacked structure A mechanical member may be applied. As an example, at least one of the first fixing member 450 and the second fixing member 460 may include a vacuum device, and a corresponding portion may be fixed using an adsorption method using a vacuum.

Referring to FIGS. 12 and 13, the first and second fixing members 450 and 460 are operated to receive forces in different directions with respect to the release layer, and the first layer 320 and the second layer The second layer 330 is separated. In the present specification, "receiving forces in different directions" means not only a case in which a pair of forces act in opposite directions but also a case in which both forces act in the same direction It can be meaningful. In this specification, the operation to receive forces in different directions is performed when a force in different directions is applied to each of the first fixing member 450 and the second fixing member 460, 450 and the second fixing member 460 are fixed and the force is applied only to the remaining one. The first layer 320 and the insulating core layer 310 can be peeled from the laminate structure over the second layer 320 and the second layer 320 by operating to receive forces in different directions have. Thus, the structure after the first layer 320 and the insulating core layer 310 are peeled off is shown in FIG.

Referring to FIG. 14A, the second layer 330 is further removed from the stack structure through etching. A portion of the first circuit pattern layer 340 may be exposed in a form suitable for the solder ball on one side of the laminated structure from which the second layer 330 has been removed. A portion of the exposed first circuit pattern layer 340 may function as an external connection pad. The exposed first circuit pattern layer 340 may be disposed on substantially the same surface as the interlayer insulating layer 350, as shown in FIG. 14A. Alternatively, as shown in FIG. 14B, a portion of the first circuit pattern layer 340 may be further recessed so that the surface of the exposed first circuit pattern layer 340 may be lower than the surface of the interlayer dielectric layer 350.

Referring to FIG. 15, a surface treatment layer (not shown) may be formed on the external connection pad to form a connection structure 480. The external connection pad may have the form of the exposed first circuit pattern layer 340 of FIG. 14A or the exposed first circuit pattern layer 340 of FIG. 14B.

Thus, by performing the above-described process, a thin printed circuit board on which the chip 410 is mounted can be manufactured. Although the above embodiment describes a method of manufacturing a thin printed circuit board on which the chip 410 is mounted, a thin printed circuit board on which the chip 410 is not mounted may also be implemented as another embodiment of the present invention. In this case, the mounting process of the chip 410 described above with reference to FIG. 8 may be omitted.

16A to 16D are views for explaining a method of manufacturing a thin printed circuit board according to another embodiment of the present invention. FIGS. 16A and 16C are plan views showing a method of manufacturing the thin printed circuit board, and FIGS. 16B and 16D are sectional views taken along line I-I 'in plan views of FIGS. 16A and 16C.

16A and 16B, an insulating core layer 1610, a first layer 1620 and a second layer 1630 and a release layer (not shown) between the first layer 1620 and the second layer 1630 A carrier substrate 1600 is prepared. The laminated structure 1640 is formed by performing a process of forming at least one circuit pattern layer and an insulating layer on the second layer 1630. A plurality of chips 1660 are mounted on the laminated structure 1640, and a mold layer 1650 is formed. The mold layer 1650 is patterned to cover at least a portion of the stack structure 1640 on the carrier substrate 1600. At this time, as shown in the figure, a region where the mold layer 1650 is not formed is formed on the stacked structure 1640 along the outer region of the carrier substrate 1600.

Referring to FIGS. 16C and 16D, a stacked structure 1640 in which a mold layer 1650 is not formed is processed to form a trench 1670. The trenches 1670 may be formed to be arranged in a line shape on one surface of the laminated structure 1640. In the figure, a trench 1670 is formed along the second direction at the outer surface of the laminate structure 1640. Although not shown, as another embodiment, a trench 1670 may be formed along the first direction at the outer surface of the laminate structure 1640. As another example, the trench 1670 may be formed along the oblique direction at a predetermined angle with the first direction or the second direction at the outer surface of the laminated structure 1640.

Trench 1670 may be formed to reach the release layer from the surface of laminate structure 1640, as described above. Or may be formed to reach the first layer 1620 or the core insulating layer 1610 by further processing. Then, a process of separating the first layer 1620 and the second layer 1630 using the trench 1670 may be performed.

17A and 17B are views schematically showing a process of forming a trench according to an embodiment of the present invention. 17A, a release layer (not shown) is provided between an insulating core layer 1710, a first layer 1720 and a second layer 1730, a first layer 1720 and a second layer 1730 A carrier substrate 1700 is prepared. A first circuit pattern layer 1740, a via layer 1750 and a second circuit pattern layer 1760 are formed on the second layer 1730 and an interlayer insulating layer 1755 is formed. A solder mask pattern layer 1770 is formed to expose a part of the second circuit pattern layer 1760 on the interlayer insulating layer 1755. The chip 1780 is mounted, and the second circuit pattern layer 1760 and the chip 1780 are electrically connected by wire bonding. A mold layer 1790 is formed to protect the chip 1780.

Referring to FIG. 17B, a trench 1810 may be formed from the surface of the solder mask pattern layer 1770 to reach the release layer, the first layer 1720, or the core insulating layer 1710. The process of forming the trenches 1810 can be performed to include processing the solder mask pattern layer 1770, the second circuit pattern layer 1760, the interlayer insulating layer 1755, and the second layer 1730 . The processing method may be, for example, a laser drilling method, a chemical etching method, or a combination thereof.

18A and 18B are schematic views illustrating a process of forming a trench according to another embodiment of the present invention. 18A, the second circuit pattern layer 1762 does not exist in the depth direction of the region where the trench 1830 is to be formed, as compared with the laminated structure of FIG. 17A. In this case, the process of forming the trenches 1830 may be performed to include processing the solder mask pattern layer 1770, the interlayer insulating layer 1755, and the second layer 1730. The processing method may be, for example, a laser drilling method, a chemical etching method, or a combination thereof.

19A and 19B are views schematically showing a process of forming a trench according to another embodiment of the present invention. 19A, there is no solder mask pattern layer 1772 in the region where the trench 1850 is to be formed, as compared with the stacked structure of FIG. 17A. In this case, the step of forming the trench 1850 can be performed to include the step of processing the second circuit pattern layer 1760, the interlayer insulating layer 1755, and the second layer 1730. The processing method may be, for example, a laser drilling method, a chemical etching method, or a combination thereof.

20A and 20B are views schematically showing a process of forming a trench according to another embodiment of the present invention. 20A, there is no solder mask pattern layer 1772 and second circuit pattern layer 1762 in the region where the trench 1870 is to be formed, as compared with the stacked structure of FIG. 17A. In this case, the process of forming the trenches 1870 may be performed to include the step of processing the interlayer insulating layer 1755 and the second layer 1730. The processing method may be, for example, a laser drilling method, a chemical etching method, or a combination thereof.

As described above, according to an embodiment of the present invention, there is provided a method of manufacturing a thin printed circuit board using a carrier substrate, comprising: forming a trench in an outer frame of a carrier substrate; separating the carrier substrate using the trench; By adopting the method, the carrier substrate can be more easily removed from the laminated structure. Further, by using the trench, there is an advantage that the process of separating the carrier substrate can be automated.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It can be understood that

A method of manufacturing a semiconductor device comprising the steps of: forming a core layer on a semiconductor substrate, the core layer comprising a first copper layer, a first copper layer, and a second copper layer,
A second circuit pattern layer and a third circuit pattern layer are formed on the first circuit pattern layer and the second circuit pattern layer, respectively. A first solder mask pattern layer and a second solder mask layer are formed on a surface of the solder mask pattern layer, , 480: connection structure,
1600: Carrier substrate, 1610: Insulating core layer, 1620: First layer, 1630: Second layer, 1640: Lamination structure, 1650: Mold layer, 1660: Chip, 1670: Trench,
1700: carrier substrate, 1710: insulating core layer, 1720: first layer, 1730: second layer, 1740: first circuit pattern layer, 1750: via layer, 1755: interlayer insulating layer, 1760: 1762: second circuit pattern layer, 1770, 1772: solder mask pattern layer, 1780: chip, 1790: mold layer, 1810, 1830, 1850, 1870: trench.

Claims (20)

(a) preparing a carrier substrate comprising a sequentially sequentially deposited first layer, a release layer and a second layer;
(b) forming a laminate structure on the carrier substrate, the laminate structure including at least one or more circuit pattern layers and an insulating layer for insulating the circuit pattern layers from each other;
(c) forming a trench from the stacked structure to at least the release layer;
(d) separating the carrier substrate with the release layer as a boundary by applying a force in different directions using the trench,
Wherein the carrier substrate comprises a core insulating layer, a first copper layer as the first layer located on the core insulating layer, a second copper layer as the second layer on the release layer on the first copper layer, Included
A method of manufacturing a thin printed circuit board. delete The method according to claim 1,
(b)
(b1) forming a first circuit pattern layer on the second layer;
(b2) forming an interlayer insulating layer covering the first circuit pattern layer on the carrier substrate and selectively etching the interlayer insulating layer to form a contact pattern partially exposing the first circuit pattern layer;
(b3) forming a via layer filling the inside of the contact pattern and a second circuit pattern layer formed on an upper surface of the interlayer insulating layer; And
(b4) forming a solder resist coating layer on the second circuit pattern layer and the interlayer insulating layer, and patterning the solder resist coating layer to form a solder mask pattern layer partially exposing the second circuit pattern layer Included
A method of manufacturing a thin printed circuit board. The method according to claim 1,
(c)
(c1) forming a mold layer on the carrier substrate to cover at least a portion of the laminate structure;
(c2) exposing the second layer by laser machining a portion of the laminate structure where the mold layer is not formed; And
(c3) removing the exposed second layer by laser machining
A method of manufacturing a thin printed circuit board. The method according to claim 1,
(c)
(c1) forming a mold layer on the carrier substrate to cover at least a portion of the laminate structure;
(c2) exposing the second layer by laser machining a portion of the laminate structure where the mold layer is not formed; And
(c3) removing the exposed second layer by chemical etching
A method of manufacturing a thin printed circuit board. The method according to claim 4 or 5,
The laser may include any one of a carbon dioxide (CO2) laser, an ultraviolet (UV) laser, and an excimer laser
A method of manufacturing a thin printed circuit board. The method according to claim 4 or 5,
(c)
Removing at least one of the release layer and the first layer after removing the second layer
A method of manufacturing a thin printed circuit board. The method according to claim 1,
The trenches of step (c) are formed to be arranged in a line shape on one side of the stacked structure
A method of manufacturing a thin printed circuit board. The method according to claim 1,
wherein the trenches of step (c) are formed on the outer frame of the carrier substrate
A method of manufacturing a thin printed circuit board. The method according to claim 1,
(d)
(d1) attaching and fixing a portion of the laminated structure formed in an inner direction with respect to the trench to a first fixing member;
(d2) attaching and fixing a portion of the laminate structure formed on the outer side with respect to the trench and a portion of the carrier substrate to a second fixing member; And
(d3) applying force to the first fixing member and the second fixing member in different directions with respect to the release layer to separate the first layer and the second layer from each other
A method of manufacturing a thin printed circuit board. 11. The method of claim 10,
Wherein at least one of the first fixing member and the second fixing member is made to adhere and attach the corresponding portion using a vacuum apparatus
A method of manufacturing a thin printed circuit board. (a) preparing a carrier substrate comprising a sequentially sequentially deposited first layer, a release layer and a second layer;
(b) forming a laminate structure on the carrier substrate, the laminate structure including at least one or more circuit pattern layers and an insulating layer for insulating the circuit pattern layers from each other;
(c) mounting a chip on the stacked structure;
(d) forming a mold layer covering at least a portion of the laminate structure and molding the chip;
(e) forming a trench in a region of the stacked structure where the mold layer is not formed, the trench reaching a portion of the carrier substrate;
(f) using the trench to separate the first layer and the second layer of the carrier substrate from each other
A method of manufacturing a thin printed circuit board. 13. The method of claim 12,
(e)
(e1) exposing the second layer by laser processing a portion of the laminate structure where the mold layer is not formed; And
(e2) laser processing the exposed second layer to remove
A method of manufacturing a thin printed circuit board. 13. The method of claim 12,
(e)
(e1) exposing the second layer by laser processing a portion of the laminate structure where the mold layer is not formed; And
(e2) removing the exposed second layer by chemical etching
A method of manufacturing a thin printed circuit board. The method according to claim 13 or 14,
(e)
Removing at least one of the release layer and the first layer after removing the second layer
A method of manufacturing a thin printed circuit board. 13. The method of claim 12,
the trenches of step (e) are formed to be arranged in a line form on one side of the laminate structure
A method of manufacturing a thin printed circuit board. 13. The method of claim 12,
wherein the trench of step (e) is formed on the outer frame of the carrier substrate
A method of manufacturing a thin printed circuit board. 13. The method of claim 12,
(f)
(f1) attaching and fixing a portion of the laminated structure formed in the inner direction with respect to the trench to the first fixing member;
(f2) attaching and fixing a portion of the laminate structure formed on the outer side with respect to the trench and a portion of the carrier substrate to a second fixing member; And
(f3) separating the first layer and the second layer with respect to the first fixing portion and the second fixing portion by applying a force in different directions with respect to the release layer,
A method of manufacturing a thin printed circuit board. 13. The method of claim 12,
Removing the second layer from the laminate structure;
Forming an external connection pad on one side of the laminated structure from which the second layer is removed; And
Forming a connection structure on the external connection pad;
More included
A method of manufacturing a thin printed circuit board. 20. The method of claim 19,
The step of removing the second layer
Conducted by chemical etching
A method of manufacturing a thin printed circuit board.

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