KR101456381B1 - Auto packing machine for wafer carrier - Google Patents

Abstract

The present invention relates to an apparatus for automatically packing a wafer which packs a wafer storage box by inserting the wafer storage box inside a packing film having an opened upper portion. Provided is an apparatus for automatically packing a wafer storage box which includes: a frame having a storage space inside; a packing film supply unit connected to one side of the frame to grip both side surfaces of the packing film in order to open an upper portion of the packing film; a loading unit disposed at a lower side of the packing film supply unit and extended from the frame to be lifted while the wafer storage box is mounted; a moving unit, while disposed above the packing film supply unit, connected to the frame to be slid to insert the wafer storage box into the packing film while gripping the wafer storage box; a packing unit disposed at a side surface of the moving unit and movably connected to one side of the frame to discharge air inside the packing film to absorb the wafer storage box while the wafer storage box is inserted inside the packing film; and a heat-welding unit disposed at a lower side of the packing unit and heating and pressing the upper portion of the packing film packing the wafer storage box to seal the upper portion of the packing film. Accordingly, the wafer storage box is automatically packed to prevent a worker from overworking in order to reduce the required labor force. Continuous primary and secondary packing processes are performed with one apparatus to save production costs. The packing apparatus is miniaturized to enable the packing work to be done even in a narrow space. The simplified apparatus for automatically packing a wafer storage box can be easily maintained and managed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic packaging apparatus for a wafer storage box, and more particularly, to a wafer storage box automatic packaging apparatus for automatically and continuously packaging a wafer storage box using a packaging film.

Generally, a semiconductor wafer produced by a manufacturer is stored in a shipping container in order to prevent contamination and protect it from an external impact. Typically, the storage compartment in which the wafer is housed is double wrapped to protect it from moisture and ultraviolet radiation. It is firstly packed with a laminate film and then packed with an aluminum film. Such packaging work is carried out by hand, which causes a decrease in productivity. On the other hand, as the semiconductor wafer is largely cured, the size and weight of the semiconductor wafer are increasing. For example, a storage box containing 300 mm diameter wafers weighs 10 kg. Storage boxes containing small-diameter wafers of 300 mm or less in diameter are easy to pack because they weigh up to 5 kg, but storage boxes containing large-diameter wafers are not easy to package. Also, since the wafer is easy to break, the operator should handle the storage case more carefully. Korean Patent Laid-Open Publication No. 10-2001-0012649 discloses an automatic packaging apparatus for wafers using such wrapped vinyl, which comprises a semiconductor device automatic packaging apparatus for storing and sealing a predetermined number of trays containing semiconductor elements in a packaging container A tray loading unit on which a tray stacked with a plurality of trays containing semiconductor elements stacked thereon is mounted, and a tray loading unit having a tray loading unit And a gas introducing / discharging means for introducing gas into or out of the supplied packaging container and for introducing gas into and out of the supplied packaging container, An insertion guide block for guiding the insertion of water into the packaging container; And an inlet squeeze means for pressing the inlet portion of the packaging container in which the tray stack is housed, and a thermal sealing means for thermally pressing and sealing the inlet portion of the squeezed packaging container A packaging container inserting portion having a pusher for inserting the tray stack into the packaging container; and a first packing device for supplying the packaging container from the packaging container loading portion to the dry packing portion, And a second conveying portion for conveying the tray stack from the tray loading portion to the packaging container inserting portion.

However, in the conventional automatic packaging apparatus, it is necessary to repeat the same steps after wrapping the storage box containing the wafer once, so that the dry packing packaging step can be completed, which requires one or more automatic packaging apparatuses, There is a problem that space is limited when the automatic packaging apparatus is used.

The present invention relates to a device for packaging semiconductor wafers, which automates the manual labor of a worker to reduce labor required, reduces the production cost by not requiring a separate conveyor equipment for packaging two or more times, And to automatically pack the wafer storage compartment even in a narrow space.

The present invention relates to a wafer automatic packaging apparatus for inserting a wafer storage box into a packaging film having an open top and packaging the wafer, comprising: a frame having a storage space therein; A packaging film supply unit connected to one side of the frame and holding both sides of the packaging film to open an upper portion of the packaging film; A loading unit disposed below the packaging film supply unit and extending from the frame to move up and down in a state where the wafer storage box is seated; A moving part that is slidably connected to the frame and is inserted into the packaging film while holding the wafer storage box in a state of being disposed above the packaging film supply part; A packing unit disposed on a side surface of the moving unit and movably connected to one side of the frame for discharging air inside the packaging film and adsorbing the inside of the wafer while the wafer storage box is inserted; And a thermal fusing unit disposed under the packing unit for heat-sealing and sealing the upper portion of the packaging film in a state of packing the wafer storage box.

The packaging film supply unit may include a first transfer frame and a second transfer frame, the first transfer frame and the second transfer frame each having a cylinder at an upper portion of the frame and spaced apart from each other, and connected to the frame, A first clamping bar, a first clamping bar movably connected on one side of the first transfer frame and a second clamping bar on the other side of which a plurality of suction portions are mounted to hold the one side of the packaging film so as to move up and down and left and right, A second conveying frame movably connected to the conveying frame and having a second clamping bar on which a plurality of suction portions are mounted to hold the other surface of the packaging film and to separate the first conveying frame and to spread the upper portion of the packaging film, .

The loading unit may include a pedestal extending from a bottom surface of the frame and on which the wafer storage box is seated, and the pedestal may include a driving device to move the wafer storage box up and down to a lower height of the packing unit.

The moving unit may include a first guide frame having one side connected to the frame and a rail on the upper side, a connection block having a driving device and moving along the first guide frame, and one end connected to the connection block A second guide frame disposed in a direction perpendicular to the first guide frame, and a gripper that is raised and lowered on the second guide frame to grip the wafer storage box and insert the wafer storage box into the packaging film.

The packing portion may include a first rail bar disposed on a side surface of the moving unit and having one end connected to the frame, a guide block slid on the first rail bar and horizontally moving with a driving device, And a second rail bar connected to the block and to which the connecting fixture is mounted.

The connecting rod includes a first guide block having one side thereof movably connected to the second rail bar and having a first guide bar and horizontally moving to closely contact one side of the upper side of the packaging film, And a second guide bar is provided to engage with the first guide bar to suck air between the upper part of the packaging film and the second guide block and the first rail bar and the second rail bar, And an air suction hole for discharging the air.

The heat sealing portion may include a pair of heating guide portions disposed below the packing portion and having a driving device, one end of which is connected to the frame and a heating bar that is horizontally movable inward, The upper part can be thermally pressed and sealed.

The wafer automatic packaging apparatus according to the present invention provides the following effects.

First, by automatically packing the wafer storage box, it is possible to prevent excessive work of the worker, thereby reducing labor required and improving productivity.

Second, since the continuous first and second packaging processes are performed by a single device, the production cost can be saved and the packaging device can be miniaturized, so that the packaging operation can be performed even in a narrow place, and the simplified wafer container automatic packaging device is easy to maintain.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an automatic packaging apparatus for a wafer storage compartment according to an embodiment of the present invention; FIG.
2 is a front view of the automatic packaging apparatus for the wafer storage box of Fig. 1;
3 is a side view of the automatic wafer packing apparatus of FIG. 1;
4A is a plan view of a packaging film supply unit of the automatic packaging apparatus for a wafer storage box of the present invention.
FIG. 4B is a front view of the packaging film supply unit of the automatic wafer packaging apparatus of the present invention. FIG.
4C is a side view of the packaging film supply unit of the automatic packaging apparatus for a wafer storage box of the present invention.
5A is a plan view of the loading unit of the automatic wafer packing apparatus of the present invention.
FIG. 5B is a front view of the loading unit of the automatic wafer packing apparatus of the present invention. FIG.
5C is a side view of the loading unit of the automatic wafer packing apparatus of the present invention.
FIG. 6A is a plan view of a moving part of the automatic wafer packing apparatus of the present invention. FIG.
6B is a front view of the moving part of the automatic packaging apparatus of the wafer storage box of the present invention.
FIG. 6C is a side view of the moving part of the automatic wafer packing apparatus of the present invention. FIG.
7A is a plan view of a packing part of the automatic packaging apparatus for a wafer storage box of the present invention.
7B is a front view of a packing part of the automatic packaging apparatus for a wafer storage box of the present invention.
FIG. 7C is a side view of a packing part of the automatic wafer packing apparatus of the present invention. FIG.
8A is a plan view of a thermal fusing part of the automatic packaging apparatus for a wafer storage room of the present invention.
FIG. 8B is a front view of the heat seal part of the automatic wafer packing apparatus of the present invention. FIG.
FIG. 8C is a side view of the heat seal portion of the wafer storage container automatic packing apparatus of the present invention. FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view of an automatic packaging apparatus for a wafer storage compartment according to an embodiment of the present invention, FIG. 2 is a front view of the automatic packaging apparatus for the wafer storage compartment of FIG. 1, and FIG. 3 is a side view of the automatic packaging apparatus for the wafer storage compartment of FIG.

FIG. 4A is a plan view of a packaging film supply unit of the automatic wafer packing apparatus of the present invention, FIG. 4B is a front view of a packaging film supply unit of the automatic wafer packaging apparatus of the present invention, FIG. And is a side view of the packaging film supply portion.

FIG. 5A is a plan view of the loading unit of the automatic wafer packing apparatus of the present invention, FIG. 5B is a front view of the loading unit of the automatic wafer packing apparatus of the present invention, and FIG. 5C is a side view of the loading unit of the automatic wafer packing apparatus of the present invention .

FIG. 6A is a plan view of the moving part of the automatic wafer packing machine of the present invention, FIG. 6B is a front view of the moving part of the automatic wafer packing machine of the present invention, and FIG. 6C is a side view of the moving part of the automatic wafer packing machine of the present invention .

FIG. 7A is a plan view of a packing part of a wafer storage room automatic packing apparatus of the present invention, FIG. 7B is a front view of a packing part of the wafer storage room automatic packing apparatus of the present invention, and FIG. 7C is a side view of a packing part of the wafer storage room automatic packing apparatus of the present invention .

FIG. 8A is a plan view of the thermal fusing unit of the wafer storage container automatic packing apparatus of the present invention, FIG. 8B is a front view of the thermal fusing unit of the automatic wafer packing apparatus of the present invention, FIG. 8C is a cross- It is a side view of wealth.

Referring to FIG. 1, the automatic packaging apparatus 100 for a wafer storage room according to an embodiment of the present invention includes a frame 10, a packaging film supply unit 20, a loading unit 30, a moving unit 40, (50) and a heat fusion portion (60).

A control unit (not shown) may be provided outside the frame 10 and the control unit may control the packaging film supply unit 20, the loading unit 30, the moving unit 40, the packing unit 50, (60) can be controlled.

The frame 10 may be provided in the form of a rectangular parallelepiped with a storage space formed therein. The packaging film supply unit 20, the loading unit 30, the moving unit 40, the packing unit 50, 60) coupled to a driving device (not shown) and fixed to be movable in a horizontal or vertical direction.

It is preferable that the driving unit mounts a cylinder connected to the control unit, but a lead screw or the like may be provided.

The frame 10 is provided with a storage space and at the same time the packaging film supply part 20, the loading part 30, the moving part 40, the packing part 50 and the heat fusion part 60 are connected without interfering with each other And a moving unit may be provided on the lower portion of the frame 10 to move the automatic wafers packaging apparatus 100.

4A, 4B and 4C, the packaging film supply unit 20 includes a packaging film holder 22 on which a packaging film 21 having an open top is continuously stacked, and the packaging film supply unit 20 Holds the upper portion of the packaging film 21 loaded on the packaging film holder 22 and opens them one by one. Further, the packaging film supply unit 20 includes a first transfer frame 23 and a second transfer frame 24.

The packaging film 21 to be loaded on the packaging film holder 22 is preferably a bag-shaped rectangular parallelepiped having an opened top and the wafer storage box 70 can be inserted.

The packaging film 21 may be manufactured in various sizes corresponding to the size of the wafer storage box 70. When the packaging film 21 is primarily packed with a laminate film, Folded and laminated successively.

On the other hand, the packaging film holder 22 includes a structure that can be replaced with an aluminum film loaded for secondary packaging of the wafer storage box 70.

In addition, the packaging film holder 21 has a mounting hole formed on an upper portion of the packaging film 21, and a fitting bar is provided so that the upper and lower portions of the two packaging films having different standards pass through the mounting hole, May be alternately stacked. Therefore, it is possible to deal with packaging films 21 of various sizes.

The method of replacing the packaging film holder 22 is characterized in that the automatic packing apparatus 100 of the wafer storage box 100 can complete the packaging film wrapping operation for two times in one apparatus.

The first transfer frame 23 and the second transfer frame 24 are provided with a cylinder (not shown) on the upper portion thereof. The first transfer frame 23 is provided with a first clamping bar 25, The second transfer frame 24 is provided with a second clamping bar 26. One side of the first clamping bar 25 is movably connected to the upper rail of the first transfer frame 23 and the other side of the first clamping bar 25 is equipped with a plurality of suction units 27, And grips one side of the packaging film 21 on which it is mounted.

The adsorption unit 27 may include two vacuum adsorption units (not shown) for holding the upper end of the packaging film 21.

The first clamping bar 25 can be lifted and lowered in the vertical direction after grasping the upper surface of one side of the packaging film 21 stacked on the packaging film holder 22 through the suction unit 27, It is possible to move leftward and rightward as the cylinder of the frame 23 is driven.

The second clamping bar 26 is movably connected with the driving of the cylinder of the second transfer frame 24 and a plurality of suction units 27 corresponding to the first clamping bar 25 are mounted. The second clamping bar 26 can move in the horizontal direction while gripping the opposite surface of the packaging film 21 held by the first clamping bar 25.

Therefore, the first culling bar 25 is raised in accordance with the driving of the cylinder on the first transfer frame 23 while holding the one side of the packaging film 21 laminated on the packaging film cradle 22, When the second conveying frame 24 moves in the horizontal direction while the second clamping bar 26 grasps the opposite surface of the packaging film 21, the upper open packaging film is conveyed to the first conveying frame 23 And the second transfer frame 24 are spaced apart from each other.

The first clamping bar 25 is lifted by grasping the packaging film 21 and the second clamping bar 26 moves in the horizontal direction along the second transport frame 24 so that the first clamping bar 25 And the second clamping bar 26 do not interfere with each other and are spaced apart. The four corners of the packaging film 21 are held by the first clamping bar 25 and the second clamping bar 26 so that the packaging film 21 can be moved upwardly of the loading part 30 in a state in which the upper part is completely opened .

5A, 5B and 5C, the loading unit 30 is disposed below the packaging film supply unit 20 and extends from the bottom surface of the frame 10, and the wafer storage box 70 is seated and raised . The loading unit 30 includes a pedestal 31 on which the wafer storage box 70 is seated and the pedestal 31 is provided with a driving device so that the wafer storage box 70 is positioned at the lower end Elevation.

Since the loading section 30 raises the wafer storage box 70 to a height at which the packing section 50 can be lowered to the maximum extent, the operator does not need to lift the wafer storage box 70 up to the packing section height for the packaging operation The working efficiency is greatly improved.

6A, 6B, and 6C, the moving unit 40 is slidably connected to the frame in a state in which the moving unit 40 is disposed above the packaging film supply unit 20 and holds the wafer storage box 70 Into the packaging film.

The moving unit 40 includes a connecting block 42, a gripper 44, a first guide frame 41, and a second guide frame 43. The first guide frame 41 may include a rail (not shown) that is fixedly connected to the frame 10 at one side thereof and guides the connection block 42 at an upper surface thereof.

The connection block 42 includes a driving unit and is movable in the horizontal direction along the first guide frame 41. One end of the second guide frame 43 is connected to the second guide frame 43, 1 guide frame 41 in the horizontal direction.

One end of the second guide frame 43 is connected to the connection block 42 and is disposed in a direction perpendicular to the first guide frame 41. The gripper 44 is connected to a driving device And is connected to the second guide frame 43 to be able to ascend and descend on the second guide frame 43.

The gripper 44 includes a plurality of grippers, and preferably four grippers are used to grip the edge of the outer surface of the wafer storage box 70 and lift the gripper. The gripper 44 grasps the wafer storage box 70 and ascends at a predetermined height along the second guide frame 43. When the second guide frame 43 moves horizontally according to the driving of the connection block on the first guide frame 41, the second guide frame 43 is accurately positioned on the packaging film supply part 20, And is positioned above the packaging film that is open at the top by the adsorption unit 27 of

When the gripper 44 is lowered in the vertical direction along the second guide frame 43 while holding the wafer storage box 70, the wafer storage box 70 is inserted into the packaging film.

7A, 7B and 7C, the packing unit 50 is disposed on a side surface of the moving unit, and is movably connected to one side of the frame 10, so that air inside the packaging film 21 And the packaging film 21 is sucked into the wafer storage box 70 while the wafer storage box 70 is inserted into the inside thereof.

The packing portion 50 includes a first rail bar 51, a second rail bar 53, a connecting fixture 54, and a guide block 52.

The first rail bar 51 is disposed on a side surface of the moving part 40 and has one end connected to the frame 10. The guide block 52 includes a driving device (not shown) and is slid on the first rail bar 51 and moved according to a signal from the control unit. One end of the second rail bar 53 is connected to the guide block 52 and includes a connecting fixture 54.

The connection block 42 is horizontally moved to the upper side of the wafer storage box 70 along the first rail bar 51 and the connection fixture 54 is lowered in the vertical direction along the second rail bar 53 So that the packing portion 50 is accurately positioned on the packaging film 21 in which the wafer storage box 70 is inserted.

The connecting rod 54 includes a first guide block 55, a second guide block 57 and an air suction pad 59. The first guide block 55 has one end connected to the second rail bar 53, and a first guide bar 56 is provided to move horizontally to closely contact one side of the upper side of the packaging film 21. The second guide block 57 is provided corresponding to the first guide block 55 and has a second guide bar 58 so that the first guide bar 56 approaches and approaches the first guide bar 56. The air suction table 59 is disposed between the first guide block 55 and the second guide block 57 and may be provided in a tubular shape to discharge the air inside the packaging film 21 to the outside.

The air suction unit 59 may further include a nitrogen injection nozzle for discharging air to inject nitrogen into the packaging film 21 in a vacuum state.

The upper part of the packaging film 21 in which the wafer storage box 70 is inserted is placed between the first guide bar 56 and the second guide bar 58, And the second guide bar (58) approach each other to bring the upper portion of the packaging film (21) into close contact with each other.

The air suction table 59 is lowered along the second rail bar 53 between the first guide bar 56 and the second guide bar 58 and inserted into the packaging film 21, The air inside the film 21 is discharged to a vacuum state.

8A, 8B and 8C, the heat-sealed portion 60 is disposed on the lower side of the packing portion 50, and the wafer storage box 70 is inserted, The outer surface of the packaging film 21 in a state in which it is in close contact is heat-pressed and sealed.

The heat-sealed portion 60 includes a pair of heating guide portions 61 having one end connected to the frame 10 and having a driving device for moving horizontally. The heating guide portions 61 are disposed in parallel to face each other at the same height and are closely contacted by the packing portion 50 with the upper portion of the packaging film 21 in a sealed state therebetween. The heating guide part 61 includes a heating bar 62 heated by electric power supply and the heating guide part 61 is heated by heating bars 62 Is melted to melt the packaging film 21 in which the upper portion is closely adhered, and then the packaging is completed.

Hereinafter, an operation method of the automatic wafer packing apparatus 100 of the present invention will be described with reference to the accompanying drawings.

First, the wafer storage box 70 on which the wafer is loaded is positioned below the moving part 40. The gripper 44 descends along the second movable frame 43 to grip and fix the outer surface of the wafer storage box 70. When the gripper 44 rises again along the second guide frame 43 and the connecting block 42 connected to the second guide frame 43 moves horizontally along the first guide frame 41, Is accurately located on the upper side of the packaging film supply part 20. [

At the same time, the packaging film supply unit 20 grips the packaging film 21 loaded on the packaging film holder 22 and moves to the upper side of the loading unit 30. Since the first clamping bar 25 moves vertically and the second clamping bar 26 moves horizontally and spaced apart, the open top of the packaging film 21 is maximally expanded in a state where one side is inclined. Here, the film loaded on the packaging film holder 22 can be replaced with two kinds of packaging films 21 according to the packaging order.

When the gripper 44 is positioned on the packaging film 21, the gripper 44 descends along the second guide frame 43 and the wafer storage box 70 is accurately inserted into the packaging film 21. At this time, the pedestal of the loading unit 30 is raised at the lower side to support the wafer storage box 70 inserted in the packaging film 21 from the lower side.

The gripper 44 of the moving part 40 is extended and released from the wafer storage box 70 and returned to the original position along the first guide frame 41. [

The loading unit 30 is lifted up to the height of the lower end of the packing unit 50 in the wafer storage box 70 mounted on the pedestal 31 of the loading unit 30. [

The packing unit 50 moves horizontally through the first rail bar 51 while the wafer holder 70 is lifted up to the height of the packing unit 50, And descends to the upper side of the packaging film 21 in which the wafer storage box 70 is inserted through the second rail bar 53. [ The first guide bar 56 and the second guide bar 58 of the connection fixing table 54 are brought into contact with the outer surface of the packaging film 21 and the air suction table 59 is fixed to the packaging film 21 ).

When the first guide block 55 and the second guide block 57 approach each other, the first guide bar 56 and the second guide bar 58 connected to each other approach each other, 21 are brought into close contact with each other by the first and second guide bars 56, 59. The air suction table 59 discharges the air inside the packaging film 21 to make the inside of the packaging film 21 into a vacuum state while the upper surface of the packaging film 21 is in close contact with the upper surface of the packaging film 21, Is fixed in contact with the outer surface of the wafer storage box 70.

The wafer storage box 70 inserted into the packaging film 21 is lowered to the height of the heat fusion portion 60 by the loading portion 30. [ The heating guide part 61 having the heating bar 62 heated by the electric heat welding part 60 moves horizontally to face each other and is heated by the upper part of the packaging film 21 to be pressed, The upper part of the packaging film 21 is fused and packed in the wafer storage box 70 under vacuum.

The packed film supply unit 20 repeats the same operation until the packed film supply unit 20 reaches the lower end of the packing unit 50. The packed film supply unit 20 is then returned to the wafer storage unit 70. [ (70). Thereafter, the wafer storage box 70 packed twice is gripped by the gripper 44 of the moving part 40 and returned to the position where the wafer storage box 70 is initially supplied, and the continuous packaging operation is completed.

According to the embodiment of the present invention, since the operator manually grips the wafer storage box 70 and does not insert the wafer storage box 70 into the packaging film, the required labor force is greatly reduced, and the space for continuously packing the wafer storage box is reduced, .

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: frame 20: packaging film supply part
21: Packaging film 22: Packaging film holder
23: first transfer frame 24: second transfer frame
25: first clamping bar 26: second clamping bar
27: suction part 30: loading part
31: pedestal 40: moving part
41: first guide frame 42: connecting block
43: second guide frame 44: gripper
50: packing part 51: first rail bar
52: guide block 53: second rail bar
54: connecting fixture 55: first guide block
56: first guide bar 57: second guide block
58: second guide bar 59: air suction port
60: heat fusion portion 61: heating guide portion
62: heating bar 70: wafer holder

Claims (7)

1. A wafer automatic packaging apparatus for inserting and packing a wafer storage box into an open top of a packaging film,
A frame having a storage space therein;
A packaging film supply unit connected to one side of the frame and holding both sides of the packaging film to open an upper portion of the packaging film;
A loading unit disposed below the packaging film supply unit and extending from the frame to move up and down in a state where the wafer storage box is seated;
A moving part that is slidably connected to the frame and is inserted into the packaging film while holding the wafer storage box in a state of being disposed above the packaging film supply part;
A packing unit disposed on a side surface of the moving unit and movably connected to one side of the frame for discharging air inside the packaging film and adsorbing the inside of the wafer while the wafer storage box is inserted; And
And a thermal fusing part disposed under the packing part for heating and sealing the upper part of the packaging film in a state where the wafer storage box is packed,
Wherein the packaging film supply unit comprises:
A packaging film holder that is spaced apart from the first transport frame and the second transport frame and has a cylinder at an upper portion of the frame and is connected to the frame and is continuously stacked with the packaging film folded;
A first clamping bar movably connected on one side of the first transfer frame and having a plurality of suction portions mounted on the other side thereof and capable of moving up and down and left and right while gripping one side of the packaging film,
And a second clamping bar movably connected to the second transfer frame and having a plurality of suction units mounted thereon to grip the other surface of the packaging film to separate an upper portion of the packaging film from the first transfer frame, Further comprising a transfer frame. delete Claim 1
The loading unit may include:
And a pedestal extending from a bottom surface of the frame and having the wafer storage box mounted thereon, the pedestal having a driving device to elevate the wafer storage box to a lower height of the packing unit. The method according to claim 1,
The moving unit includes:
A first guide frame having one side connected to the frame and having a rail on an upper surface thereof,
A connecting block having a driving device and moving along the first guide frame,
A second guide frame having one end connected to the connection block and disposed in a direction perpendicular to the first guide frame,
And a gripper which is lifted on the second guide frame to grip the wafer storage box and insert the wafer storage box into the packaging film. The method according to claim 1,
The packing portion
A first rail bar disposed on a side surface of the moving unit and having one end connected to the frame,
A guide block slid on the first rail bar and horizontally moving with a driving device;
Further comprising a second rail bar, one end of which is connected to the guide block and on which the connecting fixture is mounted. Claim 5
The connecting fixture includes:
A first guide block movably connected at one side to the second rail bar and provided with a first guide bar to horizontally move and closely contact one side of the packaging film; 2 guide bar, and the first guide bar engages the upper part of the packaging film and the second guide block and
Further comprising an air suction pad for sucking in air between the first rail bar and the second rail bar to discharge the air inside the packaging film. Claim 1
The heat-
And a pair of heating guide portions provided on the lower side of the packing portion and having a driving device, one end of which is connected to the frame and the other of which is horizontally movable inward, and the upper portion of the tightly packed packaging film is heat- Automatic packaging equipment for wafer storage.

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