KR101456269B1 - Multi light emitting diode package - Google Patents

Multi light emitting diode package Download PDF

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Publication number
KR101456269B1
KR101456269B1 KR1020080028793A KR20080028793A KR101456269B1 KR 101456269 B1 KR101456269 B1 KR 101456269B1 KR 1020080028793 A KR1020080028793 A KR 1020080028793A KR 20080028793 A KR20080028793 A KR 20080028793A KR 101456269 B1 KR101456269 B1 KR 101456269B1
Authority
KR
South Korea
Prior art keywords
led chip
led
light
heat sink
emitting
Prior art date
Application number
KR1020080028793A
Other languages
Korean (ko)
Other versions
KR20090103285A (en
Inventor
심주용
표병기
권유진
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020080028793A priority Critical patent/KR101456269B1/en
Priority to JP2008168544A priority patent/JP5431688B2/en
Priority to US12/164,456 priority patent/US7960744B2/en
Publication of KR20090103285A publication Critical patent/KR20090103285A/en
Priority to US13/090,862 priority patent/US8860049B2/en
Application granted granted Critical
Publication of KR101456269B1 publication Critical patent/KR101456269B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

A multi-LED chip is disclosed. Such a multi-LED chip includes at least one or more other LED chips emitting light different from the LED chip emitting white light, the LED chip emitting white light, the heat sink for heat dissipation, the white and the other A lead frame electrically connected to operate the LED chip, a housing supporting the heat sink and the lead frame, and a partition wall formed on the heat sink to receive the LED chip emitting the white light, An LED chip emitting light other than white light can be mounted to emit white light and other colors in a variety of colors. By mounting an ultraviolet LED chip and an infrared LED chip in a single LED package together with an LED chip emitting white light, Various functions can be provided.

LED, Multi, White, Partition, Heat sink

Description

[0001] MULTI LIGHT EMITTING DIODE PACKAGE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-LED (Light Emitting Diode) package, and more particularly, to a multi-LED package capable of separately emitting white light and other color light, infrared light or ultraviolet light.

Generally, the LED package includes a lead frame for applying current to the LED chip and the LED chip, and a housing for supporting the lead frame. Recently, there is a growing interest in lighting using LED packages. In order to use the LED package for illumination, light emission of not less than several thousand lumens is required as well as improvement in emission quality. Since such a high output light emission is proportional to the input current, if a high current is supplied to the LED chip, a desired light output can be obtained, but heat is generated due to the increase of the input current.

In the LED package, if the heat stays on the LED chip for a long time, dislocation and mismatch may occur in the semiconductor crystal structure of the LED chip, thereby reducing the lifetime of the LED chip. Therefore, a heat sink (heat sink) (also referred to as "slug" here) is added to the LED chip as a heat sink or a heat sink.

In addition, the LED package can be applied to an LED package that emits light of multiple colors by mounting a plurality of LED chips emitting light of different wavelengths on one heat sink and individually operating the LED chips. In general, LED chips that emit red light, green light, and blue light are mounted together in one LED package, or two or more are operated in multiple ways to emit light of various colors .

However, in the case of embodying all of the LED chips that emit red, green, and blue colors in a single LED package, when LEDs emitting red, green, and blue light are to emit white light, Both chips must be driven together. Therefore, in this case, there are many difficulties in adjusting the color balance.

In addition, in the case of a chip for emitting white light, since phosphors must be formed, there is a great difficulty in mounting an LED chip emitting white light and an LED chip emitting other light together in one LED package.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a multi-LED package capable of emitting various light by mounting an LED chip emitting light other than white light and white light in one LED package .

According to an aspect of the present invention, there is provided a multi-LED package including: a first LED chip; At least one second LED chip emitting light different from the first LED chip; A heat sink for providing a mounting region of the first and second LED chips and dissipating heat; A lead frame electrically connected to operate the first and second LED chips; A housing for supporting the heat sink and the lead frame; And a partition wall formed on the heat sink to receive the first LED chip.

Preferably, the first LED chip is an LED chip emitting white light.

Preferably, the second LED chip may be one or more selected from an LED chip emitting red light, an LED chip emitting green light, an LED chip emitting blue light, an infrared LED chip and an ultraviolet LED chip.

Preferably, the partition is integrally formed with the heat sink.

The phosphor may be filled in the partition wall to cover the first LED chip.

Preferably, the first LED chip and the second LED chip may be positioned on the same circumference with respect to the center of the opening formed in the housing.

The present invention provides an improved multi-LED package, which can emit white light and other colors of light by mounting an LED chip emitting light other than white light and white light in one LED package. Furthermore, the present invention can provide various functions to a user by mounting an ultraviolet LED chip and an infrared LED chip in an LED package together with an LED chip emitting white light.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation only as the description sets forth the invention and its embodiments as illustrative and not restrictive. It will not be.

FIG. 1 is a perspective view of a multi-LED package according to an embodiment of the present invention, and FIG. 2 is a plan view of the multi-LED package of FIG. 1. Referring to FIG.

1 and 2, the multi-LED package 1 includes a first LED chip 12, second LED chips 14 and 16 emitting light different from the first LED chip 12, The first LED chip 12 and the second LED chips 14 and 16 are mounted on the heat sink 20 for heat dissipation and provide mounting areas of the first LED chip 12 and the second LED chips 14 and 16 A housing 30 for supporting the heat sink 20 and the lead frame 40 and a first LED chip 12 formed on the heat sink 20 to receive the first LED chip 12 (Not shown).

The second LED chips 14 and 16 may be at least one selected from an LED chip emitting red light, an LED chip emitting green light, an LED chip emitting blue light, an infrared LED chip and an ultraviolet LED chip. A phosphor is applied onto the first LED chip 12, and the light from the first LED chip 12 is converted into light of a white wavelength band by the phosphor. Since the first LED chip 12 of the present invention is located inside the one package with the second LED chips 14 and 16, it is preferable that a space for applying the phosphor is separately provided.

Accordingly, the partition wall 22 can provide a space for accommodating the first LED chip 12, and is formed so as to protrude on the heat sink 20. Preferably, the partition wall 22 may be formed of the same material as the heat sink 20. More preferably, the partition wall 22 may be integrally formed with the heat sink 20. [ Thus, the heat due to the operation of the first LED chip 12 can be dissipated more effectively. A phosphor (not shown) is formed in the first LED chip 12 accommodated in the partition 22 within the range of the partition wall 22. [

The partition wall 22 may be formed so that its upper portion is open and its side portion surrounds the first LED chip 12. That is, since the first LED chip 12 has approximately four sides, it may correspondingly have four wall faces for each of the four sides of the first LED chip 12. However, the shape of the partition 22 is not limited to having four wall surfaces as shown in the drawings, and any shape is acceptable as long as the first LED chip 12 can be received and the phosphor can be formed.

In operation, the first LED chip 12 is excited with light of a different wavelength by a phosphor in a predetermined wavelength range from itself, and white light is obtained by mixing light excited by the phosphor and light not excited.

The LED package 1 also includes a housing 30 for supporting the lead frame 40 and the heat sink 20. The LED package 1 is mounted on the upper portion of the housing 30 so as to surround the LED chips 12, That is, an opening portion 32 defining the cavity interior space is formed. Although not shown, an encapsulant of translucent material may be molded in the opening 32, and the encapsulant serves to protect the LED chips 12, 14, 16 from the outside of the package.

By including the above-described configuration, the multi-LED package 1 according to the present invention can be realized by mounting a plurality of LED chips including an LED chip, which has conventionally been converted into white light, It is possible to improve the problems of the present invention.

2, the LED chips 12, 14, 16 are arranged so as to be equally spaced from the center C of the heat sink 20 (i.e., to have a virtual radius R with a predetermined radius R about C) In the case of drawing a circle on the circumference). This allows the light emitted from the LED chips 12, 14, 16 to be emitted uniformly through the encapsulant when, for example, a hemispherical encapsulant (not shown) is formed in the opening 32. [ As a result, secondary optic design and application can be facilitated.

1 and 2, each of the chips 12, 14 and 16 is a lateral type which is bonded by two bonding wires W and is electrically connected to the lead frame. Therefore, It may be formed as a single body instead of being separated and isolated corresponding to each chip.

Although FIG. 1 and FIG. 2 illustrate the case where the number of the second LED chips is two, all the LED chips emitting red, green, and blue light that can simultaneously emit light of various colors can be mounted. That is, the second LED chips 14 and 16 may be any one or two or more chips selected from an LED chip emitting red light, an LED chip emitting green light, an LED chip emitting blue light, an infrared LED chip and an ultraviolet LED chip.

3 (a) shows a first LED chip 12, which is an LED chip having a phosphor to be converted into white light, and a second LED chip 12 which is arranged so as to surround the outer periphery of the first LED chip 12 And a second LED chip 14, which is one of red, green, blue, ultraviolet, or infrared emitting LED chips, is disposed on the heat sink 20, as shown in FIG.

3 (b) shows a first LED chip 12, which is an LED chip having a phosphor to be converted into white light accommodated in the partition wall 22, and three LED chips 12, which emit red, green, blue, 2 LED chips 14, 16, and 18 are arranged on the heat sink 20. As shown in FIG. For example, reference numeral 14 denotes an LED chip that emits red light, reference numeral 16 denotes an LED chip that emits green light, and reference numeral 18 denotes an LED chip that emits blue light.

3C shows the LED chip 12 emitting white light and the LED chips emitting red, green, blue, ultraviolet rays or infrared rays, and two second LED chips 14 and 16 ) Is disposed on the heat sink 20. As shown in Fig.

3 (a) to 3 (c), a phosphor (not shown) necessary for emitting white light is formed in the partition wall 22 together with the LED chip 12 as described above. Further, in addition to those illustrated in FIGS. 3A to 3C, there may be considered cases in which more chips are disposed, including the LED chip 12 having the phosphor to be converted into white light. However, Those skilled in the art will appreciate that the present invention is not limited to the above embodiments, as long as it can be applied within the spirit and scope of the present invention.

In addition, as illustrated in FIGS. 1 to 3, when an LED chip having a phosphor to be converted into white light according to the present invention is to be mounted simultaneously with other LED chips in one LED package, A method of accommodating an LED chip emitting white light by employing a partition wall protruding on the heat dissipating plate is not limited to the above-described type other than the lateral type Type LED chip.

The multi-LED package according to the present invention is not limited to the above-described embodiments, but can be variously designed and applied in a range that does not depart from the basic principle of the present invention. It is self-evident.

1 is a perspective view of a multi-LED package according to an embodiment of the present invention;

2 is a plan view of the multi-LED package of Fig. 1; And

FIG. 3 is a schematic cross-sectional view illustrating a state in which an LED chip emitting white light accommodated in a partition on a heat sink and various numbers of other LED chips are arranged in a multi-LED package according to an embodiment of the present invention.

Description of the Related Art

1: multi-LED chip 12: first LED chip

14, 16, 18: second LED chip 20: heat sink

22: bulkhead W: bonding wire

30: housing 40: lead frame

Claims (6)

A first LED chip; At least one second LED chip emitting light different from the first LED chip; A heat sink for providing a mounting region of the first and second LED chips and dissipating heat; A lead frame electrically connected to operate the first and second LED chips; A housing for supporting the heat sink and the lead frame; And And a partition wall formed on the heat sink to receive the first LED chip, Wherein the barrier ribs surround the periphery of the first LED chip. The method according to claim 1, Further comprising a phosphor covering the first LED chip, wherein the phosphor is filled in the partition wall. The method according to claim 1, Wherein the second LED chip is at least one selected from an LED chip emitting red light, an LED chip emitting green light, an LED chip emitting blue light, an infrared LED chip, and an ultraviolet LED chip. delete The method according to claim 1, Wherein the first LED chip and the second LED chip are located on the same circumference with respect to the center of the opening formed in the housing. The method according to claim 1, And the partition wall is formed integrally with the heat sink.
KR1020080028793A 2007-06-29 2008-03-28 Multi light emitting diode package KR101456269B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020080028793A KR101456269B1 (en) 2008-03-28 2008-03-28 Multi light emitting diode package
JP2008168544A JP5431688B2 (en) 2007-06-29 2008-06-27 Multi LED package
US12/164,456 US7960744B2 (en) 2007-06-29 2008-06-30 Multi-light emitting diode package
US13/090,862 US8860049B2 (en) 2007-06-29 2011-04-20 Multi-light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080028793A KR101456269B1 (en) 2008-03-28 2008-03-28 Multi light emitting diode package

Publications (2)

Publication Number Publication Date
KR20090103285A KR20090103285A (en) 2009-10-01
KR101456269B1 true KR101456269B1 (en) 2014-11-04

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KR1020080028793A KR101456269B1 (en) 2007-06-29 2008-03-28 Multi light emitting diode package

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455089B1 (en) 2003-05-28 2004-11-06 서울반도체 주식회사 Package for high-power semiconductor light emitting devices and semiconductor light emitting device using the same
KR100524656B1 (en) * 2003-09-30 2005-10-31 서울반도체 주식회사 Polychromatic Light Emitting Diode Package and Polychromatic Light Emitting Diode System
KR100663906B1 (en) * 2005-03-14 2007-01-02 서울반도체 주식회사 Light emitting apparatus
KR100809210B1 (en) 2006-07-10 2008-02-29 삼성전기주식회사 High power light emitting diode package and method of producing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455089B1 (en) 2003-05-28 2004-11-06 서울반도체 주식회사 Package for high-power semiconductor light emitting devices and semiconductor light emitting device using the same
KR100524656B1 (en) * 2003-09-30 2005-10-31 서울반도체 주식회사 Polychromatic Light Emitting Diode Package and Polychromatic Light Emitting Diode System
KR100663906B1 (en) * 2005-03-14 2007-01-02 서울반도체 주식회사 Light emitting apparatus
KR100809210B1 (en) 2006-07-10 2008-02-29 삼성전기주식회사 High power light emitting diode package and method of producing the same

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KR20090103285A (en) 2009-10-01

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