KR101436360B1 - surface treated copper foil, copper-clad laminate comprising the copper foil for a printed circuit board, preparation method of the printed circuit board, and preparation method of the surface treated copper foil - Google Patents

Abstract

An electrolytic copper foil including a bonding surface opposite to the insulating resin base; And a corrosion inhibiting layer disposed on the bonding surface, wherein the corrosion inhibiting layer comprises zinc alone or a surface treatment comprising an alloy of copper and one metal selected from the group consisting of nickel, zinc, chromium and tungsten A copper foil, a copper-clad laminate for a printed wiring board including the surface-treated copper foil, a method for producing the printed wiring board, and a method for producing the surface-treated copper foil.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper foil for surface-treated copper foil, a copper foil for surface-treated copper foil, a copper-clad laminate for printed wiring board including the copper foil, , preparation method of the printed circuit board, and preparation method of the surface treated copper foil}

A surface-treated copper foil, a copper-clad laminate for a printed wiring board including the copper foil, a method for producing the printed wiring board, and a method for producing the surface-treated copper foil.

A laminate for a printed circuit board used in the electronics industry is formed by impregnating a glass cloth, a kraft paper or a glass fiber nonwoven fabric with a thermosetting resin such as a phenolic resin or an epoxy resin, And a copper foil is laminated on one side or both sides of the prepreg. The multilayer printed wiring board is manufactured by forming a circuit on both sides of the copper-clad laminate to form an inner layer material and laminating the copper foil on both sides of the inner layer material through a prepreg.

The copper foil used in the production of the printed wiring board has a corrosion preventive layer including chromium, nickel, and the like formed on one surface thereof to prevent corrosion or the like. However, the use of chromium is limited due to environmental problems and the like. In addition, the corrosion-preventing layer containing nickel or the like is not removed by a conventional copper etching solution, and a separate etchant is used, which complicates the manufacturing process of the printed wiring board.

Therefore, there is a demand for a copper foil containing a corrosion inhibiting layer which is easy to etch even without environmental pollution.

One aspect is to provide a surface treated copper foil comprising an anti-corrosion layer that is easy to etch.

And another aspect thereof is to provide a copper-clad laminate for a printed wiring board comprising the surface-treated copper foil.

Another aspect provides a method for producing a printed wiring board comprising the surface-treated copper foil.

Another aspect provides a method for producing the surface-treated copper foil.

On one side

An electrolytic copper foil including a bonding surface opposite to the insulating resin base; And

And a corrosion preventing layer disposed on the bonding surface,

There is provided a surface treated copper foil wherein the corrosion inhibiting layer comprises zinc alone or an alloy of copper and nickel.

According to another aspect,

Prepreg; And

There is provided a copper-clad laminate for a printed wiring board comprising a surface-treated copper foil laminated on one side or both sides of the prepreg.

According to another aspect,

Preparing a copper clad laminate by adhering a bonding surface of the surface-treated copper foil to one surface or both surfaces of the prepreg;

Forming a hole in the laminate;

Completely removing the copper foil layer disposed on one side or both sides of the hole-formed laminate with a copper etchant;

Electroless-plating the copper layer on the laminated board from which the copper foil layer has been removed;

Patterning the photoresist;

Electroplating the copper layer;

Removing the photoresist; And

And a step of flash-etching the non-electrolytic plating layer.

According to another aspect,

Preparing an electrolytic copper foil including one surface which is not roughened;

Forming an anti-corrosive layer on one uncoated side of the electrolytic copper foil,

Wherein the corrosion inhibiting layer is formed from a first plating bath containing copper and nickel or a second plating bath containing zinc.

According to one aspect of the present invention, the surface-treated copper foil contains a corrosion-inhibiting layer containing only zinc or an alloy of copper and another metal, thereby making it possible to completely remove the corrosion- Can be facilitated.

1 is a cross-sectional schematic diagram of a surface-treated copper foil according to an exemplary embodiment of the present invention.
DESCRIPTION OF REFERENCE NUMERALS used in the drawings
1: Surface treated copper foil 2: Corrosion preventing layer
3: copper foil layer 4: primer resin layer

Hereinafter, a surface-treated copper foil according to one or more exemplary embodiments, a copper-clad laminate for printed wiring boards including the copper foil, a method for producing the printed wiring board, and a method for producing the surface-treated copper foil will be described in detail.

The surface-treated copper foil according to an embodiment of the present invention includes an electrolytic copper foil including a bonding surface opposite to an insulating resin base material; And a corrosion inhibiting layer disposed on the bonding surface, wherein the corrosion inhibiting layer comprises zinc alone or an alloy of one metal selected from the group consisting of copper and nickel, zinc, chromium and tungsten.

The surface-treated copper foil may contain only corrosion inhibiting zinc as a corrosion inhibiting component, or may include copper as a corrosion inhibiting component and nickel as an anticorrosive component. In this case, unlike conventional surface-treated copper foils, It is possible to facilitate the manufacture of the printed wiring board using the copper-clad laminate including the surface-treated copper foil.

For example, the corrosion resistant layer may comprise an alloy of copper and nickel.

In the surface-treated copper foil, the content of copper (atomic%) in the X-ray photoelectron spectrum with respect to the surface of the corrosion inhibiting layer may be higher than the content of nickel (atomic%).

If the content of copper in the corrosion inhibiting layer is too high, it may be difficult to prevent corrosion, and if the content of copper is too low, the corrosion preventing layer may not be completely etched by the copper etching solution.

The total adhesion amount of the anti-corrosion layer in the surface-treated copper foil may be 50 to 120 μg / dm ² . If the adhesion amount is too large, the corrosion inhibiting layer may not be completely etched into the copper etching solution, and if the adhesion amount is too small, corrosion prevention may be difficult.

The bonding surface of the surface-treated copper foil may be one surface which is not roughened. For example, the surface roughness (R _z ) of the electrolytic copper foil bonded surface may be 5 탆 or less. For example, the surface roughness (R _z ) of one surface of the copper foil without roughening may be 2 탆 or less. Since the surface roughness of the roughened copper foil is generally more than 5 占 퐉, the copper foil having a surface roughness of 5 占 퐉 or less corresponds to the roughened copper foil and the copper foil having a surface roughness of 2 占 퐉 or less has a similar level to that of the electrolytic copper foil.

Alternatively, the bonding surface of the surface-treated copper foil may be roughened. The roughening treatment can be achieved by attaching copper particles to the bonding surface of the surface-treated copper foil. By the above-mentioned roughening treatment, the adhesive strength between the insulating resin base material and the surface-treated copper foil can be further improved.

The surface treated copper foil may further include a silane coupling agent layer on the corrosion inhibiting layer. By introducing the silane coupling agent layer, the adhesive strength between the insulating resin base material and the surface treated copper foil can be further improved.

The formation of the silane coupling agent layer is not particularly limited such as a dipping method, a showering method and a spraying method which are generally used. A method that can adsorb the copper foil and the solution containing the silane coupling agent most uniformly in accordance with the process design may be arbitrarily adopted.

The available silane coupling agents are specified more specifically. A coupling agent similar to that used for a glass cloth of a prepreg for a printed wiring board is mainly composed of vinyltrimethoxysilane, vinylphenyltrimethoxysilane,? -Methacryloxypropyltrimethoxysilane,? -Glycidoxypropyltri (Aminoethyl)? -Aminopropyltrimethoxysilane, N-3- (4- (3-tert-butyldimethylsilyloxypropyltrimethoxysilane) Aminopropoxy) propoxy) propyl-3-aminopropyltrimethoxysilane, imidazole silane, triazinilane, gamma -mercaptopropyltrimethoxysilane, and the like.

The silane coupling agent may be used at a temperature of room temperature by dissolving 0.5 g / l to 10 g / l in water as a solvent. The silane coupling agent forms a coating film by condensation bonding with an OH group protruding from the surface of the copper foil. Even if a solution with a dark concentration is used, the effect is not remarkably increased. Therefore, it should be determined according to the processing speed of the process and the like. However, when the amount is less than 0.5 g / l, the adsorption rate of the silane coupling agent is slow, so that it does not conform to general commercial production and the adsorption becomes uneven. In addition, even at a concentration exceeding 10 g / l, the adsorption rate is not particularly accelerated, which is uneconomical.

As described above, various protective layers other than the silane coupling layer may be further included within a range that does not impair the effects of the present invention.

The surface-treated copper foil may further include a primer resin layer on the silane coupling agent layer. By further including the primer resin layer, it is possible to provide a high adhesive force to the insulating base resin without roughening the surface-treated copper foil. For example, as shown in Fig. 1, the surface-treated copper foil 1 may include a primer resin layer 4 formed on the corrosion inhibiting layer 2 formed on the copper foil layer 3. The silane coupling agent layer is not shown in FIG. 1 but may be disposed between the anti-corrosive layer 2 and the primer resin layer 4.

The primer resin layer is formed from a primer resin composition, and the primer resin composition may include an epoxy resin, a rubber resin, a sulfon resin, and a curing agent. The primer resin composition may include 20 to 40 parts by weight of a rubber resin and 5 to 70 parts by weight of a sulfonic resin based on 100 parts by weight of the total of the epoxy resin and the curing agent. The primer resin layer has excellent heat resistance and chemical resistance in addition to excellent adhesion, so that it is possible to prevent deterioration in adhesion with the copper foil during the production process of a printed wiring board or the like.

If the content of the epoxy resin in the composition is too low, the adhesion to the copper foil may be deteriorated. If the content of the epoxy resin is too high, when the resin solution is prepared with a solvent, the viscosity is too high, May be difficult to apply. The content of the epoxy resin in the composition may be 20 wt% to 80 wt% of the total weight of the primer resin composition.

If the content of the rubber resin is less than 20 parts by weight, the adhesive strength may be lowered. If the content of the rubber resin exceeds 40 parts by weight, the heat resistance may be deteriorated. When the content of the sulfonic resin in the composition is less than 5 parts by weight, the heat resistance may be lowered. When the content of the sulfonic resin exceeds 70 parts by weight, the adhesive strength may be lowered.

Since the content of the curing agent relative to the epoxy resin in the above composition is derived from each equivalent amount, it is judged that there is no need to specify the compounding ratio, and thus it is omitted. Therefore, the content of the curing agent in the present specification is not particularly limited.

For example, the primer resin composition may include 30 to 35 parts by weight of a rubber resin and 10 to 35 parts by weight of a sulfonic resin based on 100 parts by weight of the total amount of the epoxy resin and the curing agent.

The primer resin composition may further include a curing accelerator. The curing accelerator is a tertiary amine, an imidazole compound, a phosphorus compound typified by triphenylphosphine, a urea curing accelerator, and the like. The content of the curing accelerator in the primer resin composition may be 0.05 to 1 part by weight based on 100 parts by weight of the total amount of the epoxy resin and the curing agent, but is not limited thereto and may be suitably adjusted within a range that can achieve the object of the invention .

In the primer resin composition, the epoxy resin may be at least one selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, novolac epoxy resin, cresol novolak epoxy resin, alicyclic epoxy resin, And a diallylamine type epoxy resin. However, the epoxy resin is not necessarily limited to these, and may be used as an epoxy resin in the technical field, so long as it can improve adhesion between the primer resin layer and the copper foil. The epoxy resin is preferably a multifunctional epoxy resin having a plurality of functional groups at the terminal.

The curing agent of the epoxy resin in the primer resin composition may be selected from amines such as dicyandiamide, imidazoles and aromatic amines, phenols such as bisphenol A and bisphenol A bromide, novolacs such as phenol novolak resin and cresol novolak resin, Phthalic acid, and the like, but it is not limited thereto and can be used as a curing agent for an epoxy resin in the related art, so long as it can improve the bonding strength between the primer resin layer and the copper foil.

The rubber resin in the primer resin composition may be at least one selected from the group consisting of a carboxyl group-containing acrylonitrile butadiene rubber, a carboxyl group-containing acrylic rubber, a butadiene rubber, an epoxy modified butadiene rubber, an isoprene rubber, a phenoxy resin and a polyester resin But is not limited thereto and can be used as long as it can improve the heat resistance and / or chemical resistance of the primer resin layer as a rubber resin which can be used in the technical field. It is preferable that the rubber resin can react with an epoxy resin or the like by having various functional groups such as a carboxyl group at the terminal. The rubber resin is to be soluble in a solvent.

The sulfonic resin in the primer resin composition may be at least one selected from the group consisting of a polysulfone resin, a polyphenylsulfone resin and a polyether sulfone resin. However, the sulfonic resin is not necessarily limited thereto, and may be a primer resin Any material capable of improving the heat resistance and / or chemical resistance of the resin layer can be used. It is preferable that the sulfone resin can react with an epoxy resin or the like by having various functional groups such as a hydroxyl group and an amino group at the terminal. The sulfone resin should be soluble in a solvent.

A copper-clad laminate for a printed wiring board according to another embodiment includes a prepreg; And a surface-treated copper foil laminated on one side or both sides of the prepreg.

The prepreg can be obtained by impregnating a varnish of an insulating base resin composition with a substrate such as a woven fabric or a nonwoven fabric, followed by heating and drying, and then removing the solvent. The base resin may be polyimide, epoxy resin, phenolic resin, or the like, but is not limited thereto and can be used as long as it is used as an insulating base resin in the related art.

The above-mentioned surface-treated copper foil may be laminated on one side or both sides of the prepreg, and then the copper-clad laminate for a printer wiring board may be manufactured by heating and press-molding the same.

In the copper-clad laminate for a printed wiring board, the corrosion-resistant layer of the surface-treated copper foil can be completely removed by the copper etching solution. That is, since the corrosion-resistant layer of the surface-treated copper foil is completely removed by the conventional copper etching solution, it is not necessary to use a separate etching solution for removing the corrosion-resistant layer.

In the copper-clad laminate for a printed wiring board, the copper etchant may include sulfuric acid and / or hydrogen peroxide, but is not limited thereto. Copper etchant used for etching the copper foil layer is all that can be used in the art.

The anticorrosion layer of the surface-treated copper foil can be completely removed within 10 seconds after being immersed in the copper etchant. For example, the anticorrosive layer of the surface-treated copper foil can be completely removed within 7 seconds after being immersed in the copper etchant. The anticorrosion layer of the surface-treated copper foil can be completely removed within 4 seconds after being immersed in the copper etchant.

According to another embodiment of the present invention, there is provided a method for manufacturing a printed wiring board, comprising: preparing a copper clad laminate by attaching a bonding surface of the surface-treated copper foil to the one side or both sides of the insulating resin base; Forming a hole in the laminate; Completely removing the copper foil layer including the corrosion inhibiting layer disposed on one side or both sides of the laminate having the holes formed thereon with copper etching solution; Electroless-plating the copper layer on the laminated board from which the copper foil layer has been removed; Patterning the photoresist; Electroplating the copper layer; Removing the photoresist; And flash-etching the non-electrolytic plating layer.

It is not necessary to use a separate etchant for further removing the residual heavy metal by completely removing the copper foil layer containing the corrosion inhibiting layer by using the copper etchant by including the above surface treatment substrate in the above printed wiring board manufacturing method, Can be simplified.

The steps other than the step of using the surface-treated copper foil according to the above and the step of completely removing the copper etching solution in the above-mentioned printed wiring board manufacturing method may be omitted as necessary as those steps commonly used in the related art.

The copper etchant used in the printed wiring board may include sulfuric acid and / or hydrogen peroxide. However, the copper etchant is not limited thereto, and any copper etchant used in the copper foil layer etching may be used as long as it can be used in the art.

According to another aspect of the present invention, there is provided a method of manufacturing a surface-treated copper foil, comprising: preparing an electrolytic copper foil including one surface that is not roughened; And forming a corrosion preventing layer on one uncoated side of the electrolytic copper foil, wherein the corrosion preventing layer is formed from a first plating bath containing copper and nickel or a second plating bath containing zinc.

The plating baths for forming the corrosion inhibiting layer may be acidic to less than pH 6.0. The pH of the plating bath may be 1.0 to 5.9. For example, the pH of the plating bath may be between 3.0 and 5.5. If the pH of the plating bath is too high, the plating bath may be contaminated by the precipitate.

The plating baths may additionally include at least one additive selected from the group consisting of phosphoric acid, metal salts of citric acid, and boric acid. However, the present invention is not limited thereto and any additive that can be used in the art may be used.

When the citric acid metal salt is added to the plating bath, it becomes a citrate ion. The metal salt of citric acid is preferably potassium citrate, sodium citrate, iron citrate, calcium citrate, tin citrate, iron ammonium citrate or a mixture thereof. The citrate ions serve to help the metal ions included in the plating bath to be plated and to lower the voltage of the plating bath.

For example, the first plating bath used in the method for producing a surface-treated copper foil may have a copper concentration of 1 to 30 g / L, a nickel concentration of 1 to 50 g / L, and a citric acid metal salt concentration of 5 to 200 g / / L. ≪ / RTI >

For example, the concentration of zinc contained in the second plating bath used in the method for producing a surface-treated copper foil may be 1 to 20 g / L and the concentration of phosphoric acid may be 0.1 to 10 g / L.

Hereinafter, the present invention will be described in further detail with reference to preferred examples, but the present invention is not limited thereto.

(Preparation of surface-treated copper foil and copper-clad laminate)

Example 1

(Preparation of surface-treated copper foil)

A surface-treated copper foil was prepared by sequentially forming an anticorrosion layer and a primer resin layer on the surface of a glossy surface having a surface roughness (Rz) of an untreated electrolytic copper foil having a thickness of 12 mu m of 1.0 mu m according to the following procedure.

Purification treatment:

Untreated electrolytic copper foil was washed with acid to remove oil component and surface oxide film on the surface of copper foil. The used acid was immersed in a dilute sulfuric acid solution having a sulfuric acid concentration of 150 g / l at a temperature of 30 ° C for 30 seconds and then washed with pure water.

Formation of anti-corrosive layer:

An anticorrosive layer was formed on the surface of the electrolytic copper foil using the following plating solution.

<Copper-nickel mixed plating bath>

CuSO ₄ O 5H ₂ O 20 g / L

NiSO ₄ ㅇ 6H ₂ O 40 g / L

C ₄ H ₄ O ₇ Na ₃ O ₂ 2H ₂ O 150 g / L (sodium citrate bihydrate)

pH 5.0 (1 mL / L added with H ₂ SO ₄ )

Plating bath temperature: 40 캜

Current density: 3A / dm ²

Power-on time: 3 seconds

The adhesion amount of the formed corrosion inhibiting layer was 69 μg / dm ² .

The adhesion amount of the anti-corrosion layer is a value calculated by dissolving the surface treatment layer and analyzing it by inductively coupled plasma emission spectrometry (ICP).

Formation of primer resin layer:

Thereby preparing a first resin composition constituting the primer resin layer. A nitrile butadiene rubber (KKPC 25H) soluble in a solvent (KNB 25H), and a polyether sulfone resin (Sumitomo Chemical, Sumika Excel) were added to the first resin composition in the same manner as in Example 1, except that bisphenol A type epoxy resin And used as a raw material. Then, a phenol-based curing agent (Nippon Kayaku Co., Ltd., GPH65) as a curing agent and triphenylphosphine as a curing accelerator were added to the mixture, and a resin composition having the following mixing ratio was prepared.

<Resin composition>

Bisphenol A type epoxy resin 60 parts by weight

Nitrile butadiene rubber resin 20 parts by weight

Polyethersulfone resin 10 parts by weight

Curing agent (GPH65) 30 parts by weight

Curing accelerator 0.1 part by weight

The above resin composition was again made into a resin solution by adjusting the resin solid content to 30 wt% using methyl ethyl ketone.

The resin solution was coated on the anticorrosive layer of the copper foil using a gravure coater. Then, air drying was carried out for 5 minutes, and then drying treatment was carried out in a heating atmosphere of 140 캜 for 3 minutes to form a semi-cured primer resin layer having a thickness of 1.5 탆.

(Production of copper-clad laminate)

The primer resin layer of the surface-treated copper foil was laminated on a high heat-resisting FR-4 prepreg having a thickness of 40 占 퐉 and hot-pressed under a heating condition at 220 占 폚 for 120 minutes to manufacture a double-

Example 2

The surface-treated copper foil and copper-clad laminate were produced in the same manner as in Example 1 except that the energization time was increased to 6 seconds.

The adhesion amount of the formed corrosion inhibiting layer was 98 μg / dm ² .

Example 3

The surface-treated copper foil and copper-clad laminate were produced in the same manner as in Example 1, except that the copper-nickel mixed plating bath was changed to a zinc plating bath and plating was performed under the following conditions.

<Zinc plating bath>

ZnSO ₄ ㅇ 7H ₂ O 5 g / L

H ₃ PO ₄ 1 g / L

pH 3.0 (with 1 mL / L NaOH added)

Plating bath temperature: 30 캜

Current density: 0.3 A / dm ²

Power-on time: 2 seconds

The deposited amount of the formed corrosion inhibiting layer was 100 μg / dm ² , and the composition of the corrosion inhibiting layer was 100 wt% of Zn.

Comparative Example 1

A surface-treated copper foil and copper-clad laminate were produced in the same manner as in Example 1, except that a nickel corrosion-preventive layer was formed using a nickel plating bath instead of the copper-nickel mixed plating bath.

<Nickel plating bath>

NiSO ₄ O 6 H ₂ O 5 g / L

H ₃ BO ₃ 30 g / L

NaPH ₂ O ₂ H ₂ O 15 g / L (sodium hypophosphite monohydrate)

pH 4.0

Plating bath temperature: 40 캜

Current density: 3A / dm ²

Power-on time: 3 seconds

The adhesion amount of the formed corrosion inhibiting layer was 65 μg / dm ² , and the composition of the corrosion inhibiting layer was 100 wt% of Ni.

Comparative Example 2

The surface-treated copper foil and copper-clad laminate were produced in the same manner as in Example 1, except that a chromium corrosion-preventive layer was formed using a chromium plating bath instead of the copper-nickel mixed plating bath.

Comparative Example 3

The surface-treated copper foil and copper-clad laminate were produced in the same manner as in Example 1, except that a tungsten corrosion-inhibiting layer was formed by using a tungsten plating bath instead of the copper-nickel mixed plating bath.

Evaluation Example 1: Evaluation of etching characteristics

The corrosion inhibition layer was formed on the electrolytic copper foil in Examples 1 to 3 and Comparative Examples 1 to 3, and the surface composition of the corrosion inhibition layer was analyzed by X-ray photoelectron spectroscopy (XPS).

The copper-clad laminate produced in Examples 1 to 3 and Comparative Examples 1 to 3 was immersed in an etching solution having the following composition for 2 to 6 seconds to remove the copper foil layer. The surface of the prepreg was subjected to X-ray photoelectron spectroscopy (XPS) And the surface composition of the prepreg was analyzed. Part of the results are shown in Table 1 below.

&Lt; Desc /

The etching solution used in the evaluation was sulfuric acid / water type, and the manufacturer / product name was NH-9000M product of Nara Techno Co., Ltd.

Etching time
[second] Element type Formed
Corrosion resistant layer surface composition
[atom%] After etching
Prepreg surface composition
[atom%] Example 1 3 C 1s 43.73 79.99 O1s 33.55 20.01 Cu 2p 15.46 0.00 Ni 2p 7.25 0.00 Example 2 6 C 1s 39.26 77.54 O1s 31.91 22.46 Cu 2p 18.03 0.00 Ni 2p 10.81 0.00 Example 3 2 C 1s 38.45 68.52 O1s 32.56 31.48 Cu 2p 8.56 0.00 Zn 2p 20.43 0.00 Comparative Example 1 3 C 1s 47.26 58.61 O1s 32.58 29.01 Cu 2p 9.8 0.00 Ni 2p 10.36 12.38

The copper foil layer of the copper-clad laminate produced by using the surface-treated copper foils of Examples 1 to 3 shown in Table 1 was completely removed from the surface of the prepreg after the etching, , At least 10 atomic% of the corrosion inhibiting layer component remained on the surface of the prepreg.

In the case of the copper-clad laminate produced by using the surface-treated copper foils of Comparative Examples 2 and 3 which were not shown in Table 1, the components of the corrosion inhibiting layer remained on the surface of the prepreg after etching.

Therefore, in the case of using the copper-clad laminate produced using the surface-treated copper foils of Examples 1 to 3, an additional process for removing the corrosion-resistant layer is unnecessary, so that the manufacturing process of the printed wiring board can be simplified.

Claims (20)

An electrolytic copper foil including a bonding surface opposite to the insulating resin base; And
And a corrosion preventing layer disposed on the bonding surface,
Wherein the corrosion inhibiting layer comprises an alloy of copper and nickel. delete The surface-treated copper foil according to claim 1, wherein the content of copper in the X-ray photoelectron spectrum to the surface of the corrosion inhibiting layer is higher than nickel. The surface-treated copper foil according to claim 1, wherein the total adhesion amount of the corrosion inhibiting layer is 50 to 120 μg / dm ² . The surface-treated copper foil according to claim 1, wherein the electrolytic copper foil bonded surface has a surface roughness (R _z ) of 5 μm or less. The surface-treated copper foil according to claim 1, wherein the electrolytic copper foil bonded surface is roughened. The surface treated copper foil of claim 1, further comprising a silane coupling agent layer on the corrosion inhibiting layer. The surface-treated copper foil according to claim 7, further comprising a primer resin layer on the silane coupling agent layer. The surface-treated copper foil according to claim 8, wherein the primer resin layer is formed from a primer resin composition, and the primer resin composition comprises an epoxy resin, a rubber resin, a sulfon resin, and a curing agent. The method according to claim 9, wherein the primer resin composition
20 to 40 parts by weight of a rubber resin and 5 to 70 parts by weight of a sulfonic resin, based on 100 parts by weight of the total of the epoxy resin and the curing agent. Prepreg; And
The copper-clad laminate for a printed wiring board according to any one of claims 1 to 10, which is laminated on one side or both sides of the prepreg. The copper-clad laminate for a printed wiring board according to claim 11, wherein the anticorrosion layer of the surface-treated copper foil is completely removed by the copper etchant. The copper-clad laminate for a printed wiring board according to claim 11, wherein the copper etchant comprises at least one selected from the group consisting of sulfuric acid and hydrogen peroxide. 12. The copper-clad laminate for a printed wiring board according to claim 11, wherein the anticorrosion layer of the surface-treated copper foil is completely removed within 10 seconds after being immersed in the copper etchant. Preparing a copper clad laminate by adhering a bonding surface of a surface-treated copper foil according to any one of claims 1 to 10 to one surface or both surfaces of a prepreg;
Forming a hole in the laminate;
Completely removing the copper foil layer including the corrosion inhibiting layer disposed on one side or both sides of the laminate having the holes formed thereon with copper etching solution;
Electroless-plating the copper layer on the laminated board from which the copper foil layer has been removed;
Patterning the photoresist;
Electroplating the copper layer;
Removing the photoresist; And
And a step of flash etching the non-electrolytic plating layer. 16. The method of claim 15, wherein the copper etchant comprises at least one selected from the group consisting of sulfuric acid and hydrogen peroxide. Preparing an electrolytic copper foil including one surface which is not roughened;
Forming an anti-corrosive layer on one uncoated side of the electrolytic copper foil,
Wherein said corrosion inhibiting layer is formed from a first plating bath comprising copper and nickel,
Wherein the first plating bath has a copper concentration of 1 to 30 g / L, a nickel concentration of 1 to 50 g / L, and a citric acid metal salt concentration of 5 to 200 g / L. The method for producing a surface-treated copper foil according to claim 17, wherein the pH of the plating bath is less than 6.0. delete delete

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