KR101433249B1 - Chip on board type light emitting device package and method for manufacturing the same - Google Patents

Abstract

The present invention, for a chip-on-board type light emitting device package capable of enhancing structural reliability and the thermal efficiency, and of reducing manufacturing costs, and a manufacturing method thereof, provides a chip-on-board type light emitting device package comprising a double frame which includes a base frame allowing a plurality of light emitting elements to be mounted, and an electrode frame spaced on the base frame and having two electrodes separated from each other; and a molding unit which is coupled to the double frame to separate the base frame from the electrode frame, and contains an aperture to emit light generated from the light emitting elements, wherein the base frame is configured to include a penetrated hole to which the electrode frame is exposed from a lower part.

Description

[0001] The present invention relates to a chip on-board type light emitting device package and a manufacturing method thereof,

The present invention relates to an electronic device, and more particularly, to a chip on-board type light emitting device package and a manufacturing method thereof.

In general, a light emitting device is used as a light source of a backlight module in an electronic device, for example, a display device, or as a light source of a lighting device. Such a light emitting device can be packaged in various forms to be coupled to a backlight unit or mounted on a lighting device. Such a light emitting device package or a light emitting device combined with various optical systems thereon is being studied for improving structural reliability, heat radiation efficiency, and manufacturing cost. The light emitting device package can be classified into a surface mount device (SMD) type package and a chip on board (COB) type. Chip on-board type package can be applied to a high-power, highly integrated light-emitting device package because the heat transfer path is not complicated as compared with the surface-seal type package, and the heat radiation characteristic can be improved.

Korean Patent Publication No. 10-2012-0034998

However, in the conventional chip-on-board type light emitting device package, heat dissipation characteristics due to high output still have a problem. Furthermore, there is a demand for a light emitting device package and a manufacturing method thereof that can reduce manufacturing cost as well as heat dissipation characteristics in order to secure market competitiveness. SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip on-board type light emitting device package and method of manufacturing the same which can solve various problems including the above problems and can improve structural reliability, thermal efficiency and manufacturing cost . However, these problems are exemplary and do not limit the scope of the present invention.

There is provided a chip on-board type light emitting device package according to one aspect of the present invention. Wherein the chip on-board type light emitting device package comprises: a double frame including a base frame on which a plurality of light emitting devices can be mounted, and an electrode frame including two electrodes separated from each other on the base frame; And a molding part coupled to the double frame to separate the base frame from the electrode frame and having an opening through which light generated from the light emitting device is emitted. The base frame has a through hole through which the electrode frame is exposed.

In the chip on-board type light emitting device package, the molding part forms side walls of the opening to expose a part of the electrode frame, and further extends to fill an overlapping area between the electrode frame and the base frame. .

In the chip on-board type light emitting device package, the molding part may further extend to cover at least a part of the side wall of the through hole.

In the above chip-on-board type light emitting device package, the molding part may be formed directly below a region where a bonding wire electrically connecting the light emitting device and the electrode frame is bonded to the electrode frame.

In the chip on-board type light emitting device package, the base frame has a first through hole penetrating the inside, and the first through hole is filled with the molding part, thereby enhancing the bonding between the base frame and the molding part.

In the chip on-board type light emitting device package, a cross section of the first through hole may be wider as it goes down to the base frame.

In the above chip-on-board type light emitting device package, the upper surface of the base frame may have a concavity and convexity in a portion in contact with the molding portion, so that the bonding between the base frame and the molding portion can be enhanced.

In the chip on-board type light emitting device package, the electrode frame has a second through hole at a position corresponding to the upward direction of the first through hole, and the second through hole is filled with the molding part, Can be strengthened.

A method of manufacturing a chip on-board type light emitting device package according to another aspect of the present invention is provided. A method of manufacturing a chip-on-board type light emitting device package includes: providing a base frame structure in which a plurality of base frames on which a plurality of light emitting devices can be mounted are connected and arrayed; Providing an electrode frame structure formed in a downsized structure in which a plurality of electrode frames are connected and arrayed; Aligning the electrode frame structure on the base frame structure to provide a double frame structure; And forming a molding part coupled to the double frame structure to separate the base frame and the electrode frame from each other and having an opening through which light generated from the plurality of light emitting devices is emitted, And a through hole through which the electrode frame is exposed from the bottom.

In the method of manufacturing a chip-on-board type light emitting device package, the step of forming the molding part may include inserting a support pin into the through-hole to prevent short-circuiting between the electrode frame and the base frame .

In the method of manufacturing a chip-on-board type light emitting device package, the step of providing the double frame structure may include inserting a guide pin into the alignment holes formed in the base frame structure and the electrode frame structure, respectively.

In the method of manufacturing a chip-on-board type light emitting device package, the step of providing the base frame structure may include providing a base frame structure in which a plurality of base frames having a first through hole penetrating the base frame are arrayed and arrayed The forming of the molding part may include forming a molding part filling the first through hole to enhance bonding between the base frame and the molding part.

In the method of fabricating a chip-on-board type light emitting device package, the step of providing the electrode frame structure may include providing an electrode frame structure in which a plurality of electrode frames having a second through hole penetrating the electrode frame are arrayed and arrayed And the forming of the molding part may include forming a molding part filling the second through hole so as to enhance bonding between the electrode frame and the molding part.

According to an embodiment of the present invention as described above, a chip on-board type light emitting device package and a method of manufacturing the same can realize a structural reliability, a heat radiation efficiency, and a manufacturing cost can be reduced. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view schematically showing a chip on-board type light emitting device package according to an embodiment of the present invention.
2 is a plan view schematically showing a chip on-board type light emitting device package according to an embodiment of the present invention.
3A is a bottom view schematically showing a chip on-board type light emitting device package according to an embodiment of the present invention.
3B is a bottom view schematically showing a chip on-board type light emitting device package according to another embodiment of the present invention.
4A is a cross-sectional view illustrating a cross-section taken along line AA of FIG. 2 in a chip on-board type light emitting device package according to an embodiment of the present invention.
4B is a cross-sectional view of a chip on-board type light emitting device package according to another embodiment of the present invention taken along the line CC of FIG.
FIG. 4C is a cross-sectional view illustrating a cross-section taken along line CC of FIG. 2 in a chip on-board type light emitting device package according to another modified embodiment of the present invention.
FIG. 4D is a cross-sectional view illustrating a cross-section taken along line CC of FIG. 2 in a chip on-board type light emitting device package according to another modified embodiment of the present invention.
5 is an enlarged view of a portion E1 in Fig.
6 is an enlarged view of a portion E2 in Fig.
FIG. 7 is an enlarged cross-sectional view of a portion E3 in FIG. 4A. FIG.
8A is a view illustrating a step of providing a double frame structure in a method of manufacturing a chip on-board type light emitting device package according to an embodiment of the present invention.
8B is a view illustrating a step of providing a double frame structure in a method of manufacturing a chip on-board type light emitting device package according to another embodiment of the present invention.
9 is a plan view illustrating a part of a double frame structure having a molding part in a method of manufacturing a chip on-board type light emitting device package according to an embodiment of the present invention.
10A is a bottom view illustrating a part of a double frame structure in which a molding part is formed in a method of manufacturing a chip on-board type light emitting device package according to an embodiment of the present invention.
10B is a bottom view illustrating a part of a double frame structure in which a molding part is formed in a method of manufacturing a chip on-board type light emitting device package according to another embodiment of the present invention.
11 is a cross-sectional view illustrating a state in which a support pin is inserted in a portion E4 in Fig.
12 is a cross-sectional view illustrating a state in which a support pin is inserted in a portion E5 in Fig.
FIG. 13 is a cross-sectional view illustrating a state in which a support pin is inserted in a portion E6 in FIG. 10A. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

Terms such as "top" or "bottom" referred to in the process of describing the present embodiment can be used to describe the relative relationship of certain elements to other elements as illustrated in the drawings. That is, these relative terms may be understood to include directions other than those depicted in the figures. For example, if the top and bottom of the structure shown in the figures are inverted, the elements depicted as being on the top surface of the other elements are present on the bottom surface of the other elements. The term "topsheet " as used herein, therefore, may include both" top "and" bottom "directions, depending on the particular orientation of the figures.

Further, in the process of describing the present embodiment, when it is mentioned that an element is located on another element, or is " electrically connected " to another element, Directly or (directly) electrically connected to the other component, but may also mean that one or more intervening components may be present therebetween. However, when an element is referred to as being "directly on" another element, "(electrically) directly connected" to another element, or "directly contacting" another element, If there is no, it means that there are no intervening components in between.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

FIG. 1 is a perspective view schematically showing a chip on-board type light emitting device package according to an embodiment of the present invention, FIG. 2 is a plan view schematically showing a chip on-board type light emitting device package according to an embodiment of the present invention, 3B is a bottom view schematically illustrating a chip on-board type light emitting device package according to another embodiment of the present invention. FIG. 4A is a cross-sectional view of a chip on-board type light emitting device package according to an embodiment of the present invention, Sectional view taken along the line A-A '.

1, 2, 3A and 4A, a chip on-board type light emitting device package 100 according to an embodiment of the present invention includes a base frame 110a (not shown) on which a plurality of light emitting devices And an electrode frame 120a that is separated from the base frame 110a and includes two electrodes separated from each other on the base frame 110a. Further, the chip on-board type light emitting device package 100 is coupled to the double frame so as to separate the base frame 110a and the electrode frame 120a, and the opening 141, through which the light generated from the plurality of light emitting devices is emitted, And a molding portion 130a.

The base frame 110a may be mounted on the upper surface exposed by the opening 141 so that the plurality of light emitting elements are in contact with each other and may radiate heat generated from the plurality of light emitting elements to the outside. In the chip on-board type light emitting device package 100, the base frame 110a can function as a substrate on which a light emitting device can be mounted and as a heat sink. The base frame 110a may include a material having excellent heat transfer characteristics and heat dissipation characteristics, and may include, for example, a metal, and may include, for example, aluminum, copper, or an alloy thereof.

The electrode frame 120a may include a conductive material, for example, a metal, and may include, for example, copper, aluminum, gold, silver, palladium, or an alloy thereof. One of the two electrodes separated from each other in the electrode frame 120a may correspond to the anode (P in Fig. 2) and the other to the cathode (N in Fig. 2). The two electrodes separated from each other in the electrode frame 120a may be referred to as various types of electrodes such as input / output pads, electrode pads, chip pads, die pads, package electrodes, and substrate electrodes.

The plurality of light emitting devices may be disposed in an opening 141 defined by the molding part 130a and the electrode frame 120a and the base frame 110a and may be disposed on an electrical connecting member such as a bonding wire, They can be electrically connected to each other. The plurality of light emitting devices may be electrically connected to a predetermined region (for example, region B in FIG. 2) of the electrode frame 120a by an electrical connecting member, thereby supplying power from a power source And can emit light. In one embodiment, the direction in which light is emitted in the light emitting device may correspond to the upward direction (+ z direction) away from the chip on-board type light emitting device package 100. The light emitting device may be a light emitting diode (LED) chip, a flat LED, a vertical LED, or the like. . However, such a light emitting device is exemplary and the technical idea of the present invention is not limited thereto. The plurality of light emitting elements may be arranged in various forms, and may also be grouped into a plurality of groups. The grouped light emitting devices can receive the driving voltage / current independently of each other, and thus can be driven independently of each other. Various modifications can be made to the number, arrangement, grouping, electrical connection relation and driving method of the light emitting devices.

Referring to FIG. 7, which is an enlarged cross-sectional view taken along the section E3 of FIG. 4A, in the chip on-board type light emitting device package 100 according to the embodiment of the present invention, the electrode frame 120a is electrically connected to the base frame 110a Lt; / RTI > For this purpose, the electrode frame 120a is spaced apart from the base frame 110a. In order to maintain a distance between the electrode frame 120a and the base frame 110a, the electrode frame 120a is disposed between the electrode frame 120a and the base frame 110a. The molding part 130a may be interposed. For example, the molding part 130a forms the side wall 141_1 of the opening 141 so as to expose a part of the electrode frame 120a (for example, the area B in FIG. 2) 120a and the base frame 110a to fill at least part of the overlapping area between the base frame 110a and the base frame 110a. The molding portion 130a may further extend to cover at least a part of the side wall 112 of the through hole 142. [

An electrical connecting member 350 such as a bonding wire electrically connecting at least one of the plurality of light emitting devices 330 and the electrode frame 120a is electrically connected to the electrode frame 120a, The molding part 130a may be formed directly under the area (D5 in FIG. With this structure, it is possible to prevent the bouncing phenomenon in the bonding process of the bonding wire 350. If the molding part 130a_1 shown on the left side is not formed on the basis of the electrode frame 120a shown in FIG. 7 and only the molding part 130a_2 shown on the right side is present, the bonding wire 350 is bonded to the electrode frame 120a The bouncing phenomenon may occur. In order to prevent the bouncing phenomenon, for example, a region directly below the region D5 having a length of about 800 mu m may be supported by the molding portion 130a.

1 and 2, the molding part 130a is formed so as to cover a part of the electrode frame 120a when viewed from above the chip on-board type light emitting device package 100 according to an embodiment of the present invention And the remaining portion of the electrode frame 120a exposed without being covered by the molding portion 130a. The remaining portion of the exposed electrode frame 120a may be classified into various regions. For example, at least one of the plurality of light emitting elements (see FIG. 7 A pad region P and N for electrical connection to the outside of the chip on-board type light emitting device package 100 and a tie bar ) Region (T), and the like. The above-described pad regions P and N may constitute a positive electrode pad P and a negative electrode pad N separated from each other. Of course, the positions of the positive electrode and the negative electrode may be mutually changed depending on the circuit configuration.

The molding part 130a may be formed using a mold, and may be formed of resin through, for example, a transfer molding method. Of course, the molding part 130a may be formed by injection molding, injection molding, or the like in addition to the transfer molding method. Examples of the resin that can be used for the molding part 130a include epoxy and the like. The inventors of the present invention propose various configurations to solve various problems that may arise in the process of forming the molding part 130a while keeping the base frame 110a and the electrode frame 120a separated from each other.

4A and 7, the base frame 110a has a through hole 142 through which the electrode frame 120a is exposed. That is, the base frame 110a has a through hole 142 through which a part of the electrode frame 120a is exposed when viewed in the + z direction. The through hole 142 may include a space into which the support pin (242 in FIG. 12) can be inserted, which is disclosed in a manufacturing method of a chip on-board type light emitting device package described later. The support pin 242 is formed by pressing the electrode frame 120a in the process of injection molding the molding part 130a coupled to the double frame so as to separate the base frame 110a from the electrode frame 120a, May be introduced to prevent the base frame 110a and the electrode frame 120a from coming into contact with each other and being short-circuited. Also, the support pin 242 can be introduced to support the bonding region B of the electrode frame 120a in the wire bonding process to secure bondability. In addition, the support pins 242 can be introduced to prevent the flash phenomenon that the resin leaks in an undesirable manner during formation of the molding part 130a from appearing in the bonding area B. [

5, which is an enlarged view of the E1 portion of FIG. 2 including the above-described pad regions P and N, together with the base frame 110a and a predetermined offset of, for example, By setting the distance D1, it is possible to prevent the flash phenomenon in the base frame 110a during formation of the molding part 130a. The moldability can be ensured during formation of the molding part 130a by ensuring a predetermined distance D2 of, for example, about 600 mu m at the outer periphery of the electrode frame 120a.

On the other hand, referring to FIG. 6, which is an enlarged view of the portion E2 of FIG. 2 including the remaining tie bar region T after the above-described trimming, in the tie bar region of the electrode frame 120a, For example, securing a predetermined distance D3 of 800 占 퐉 to 1000 占 퐉 can ensure the moldability of the process of forming the molding part 130a.

7, in order to prevent the moldings 130a from being broken or molded during the process of forming the molding part 130a, a predetermined section D6 of, for example, The upper surface of the molding part 130a and the upper surface of the electrode frame 120a may have the same level. Further, the side surface of the through hole 142 in the base frame 110a may be, for example, , And a tilted inclination angle of about 45 degrees.

The inventor of the present invention has found that in the process of forming the molding part 130a while maintaining the state where the base frame 110a and the electrode frame 120a are spaced from each other, the base frame 110a and / or the electrode frame 120a, The present invention proposes various configurations as follows to enhance the bonding between the first electrodes 130a.

FIG. 3B is a bottom view schematically illustrating a chip on-board type light emitting device package according to another embodiment of the present invention. FIG. 4B is a cross-sectional view of the CC line of FIG. 2 in the chip on-board type light emitting device package according to another embodiment of the present invention. Sectional view taken along the line A-A '.

Referring to FIGS. 1, 2, 3B and 4B, the base frame 110a has a first through-hole 155a through which the first through-hole 155a is filled by the molding part 130a The bonding between the base frame 110a and the molding part 130a can be strengthened. Further, since the first through hole 155a is filled with the molding part 130a, the bonding between the electrode frame 120a and the molding part 130a can be enhanced. That is, the through hole 155 for reinforcing the connection between the base frame 110a and / or the electrode frame 120a and the molding part 130a includes a first through hole 155a penetrating the inside of the base frame 110a And the first through hole 155a is filled by the molding part 130a, thereby enhancing the bonding.

The cross section of the first through hole 155a may be formed so as to become wider toward the lower portion of the base frame 110a (toward the -z direction), thereby facilitating the process of forming the molding portion 130a And the bonding between the base frame 110a and the molding part 130a can be further strengthened. In the drawings, the shape of the cross section of the first through hole 155a is illustratively shown as a circle, but the technical idea of the present invention is not limited thereto. For example, the shape of the cross section of the first through hole 155a may have a polygonal shape, an elliptical shape, or any irregular shape. In order to further enhance the bonding between the base frame 110a and the molding part 130a, the cross-sectional shape of the first through-hole 155a may have a cross-sectional shape of the toothed wheel, To increase the joint area between the first and second portions 130a and 130a.

4C is a cross-sectional view taken along line C-C of FIG. 2 in a chip on-board type light emitting device package according to another modified embodiment of the present invention.

Referring to FIGS. 1, 2, 3B and 4C, the electrode frame 120a has a second through hole 155b at a position corresponding to the upward direction of the first through hole 155a, The joint between the electrode frame 120a and the molding part 130a can be strengthened by being filled with the molding part 130a. Further, since the first through hole 155a is filled with the molding part 130a, the bonding between the base frame 110a and the molding part 130a can be strengthened. That is, the through hole 155 for reinforcing the connection between the base frame 110a and / or the electrode frame 120a and the molding part 130a includes a first through hole 155a penetrating the inside of the base frame 110a, And the second through hole 155b penetrating the inside of the frame 120a and the first through hole 155a and the second through hole 155b are filled by the molding part 130a to enhance the bonding. On the other hand, the shape of the second through hole 155b can be variously modified as described above with respect to the shape of the first through hole 155a with reference to FIG. 4B.

The present embodiment is configured such that the second through hole 155b is disposed at a position corresponding to the direction directly above the first through hole 155a and the resin pillar passes through the first through hole 155a and the second through hole 155b . The resin pillars constitute a part of the molding part 130a, and may have, for example, a truncated cone shape. However, in the modification of this embodiment, the second through-hole 155b may not be disposed directly above the first through-hole 155a but may be disposed to be deviated from the first through-hole 155a. According to this modified example, since the structure in which the molding part 130a is combined with the first through-hole 155a and the second through-hole 155b forms a multi-step structure, the strength of the coupling can be further improved.

4D is a cross-sectional view taken along line C-C of FIG. 2 in a chip on-board type light emitting device package according to another modified embodiment of the present invention.

Referring to FIGS. 1, 2, 3B and 4D, the upper surface of the base frame 110a is formed with irregularities in a portion contacting the molding portion 130a, thereby forming a gap between the base frame 110a and the molding portion 130a The bonding can be strengthened. 4D, the base frame 110a has a first through hole 155a and a second through hole 155b. The base frame 110a has a concavity and convexity at a portion where the upper surface of the base frame 110a contacts the molding part 130a. The electrode frame 120a can be applied to the case having the second through hole 155b (FIG. 4c), but the case having the first through hole 155a only in the base frame 110a (FIG. (Fig. 4A).

Hereinafter, a method of manufacturing a chip on-board type light emitting device package according to an embodiment of the present invention will be described. 8A is a view illustrating a step of providing a double frame structure in a method of manufacturing a chip on-board type light emitting device package according to an embodiment of the present invention.

8A, a method of fabricating a chip on-board type light emitting device package according to an embodiment of the present invention includes a plurality of base frames 110a to which a plurality of light emitting devices (not shown) can be mounted, Providing an arrayed base frame structure (110); Providing an electrode frame structure (120) formed in a down set structure by arraying a plurality of electrode frames (120a) connected to each other; And aligning and arranging the electrode frame structure 120 on the base frame structure 110 to provide the double frame structure 125.

8A, for the sake of convenience, two base frames 110a are connected to provide a base frame structure 110 arranged in a 2 x 1 array, and two electrode frames 120a are connected to form a 2 x 1 array It is to be understood that the technical idea of the present invention is not limited to the number and arrangement of the base frame 110a and the electrode frame 120a. For example, the base frame structure 110 and the electrode frame structure 120 may be arranged in an mxn array in which a plurality of base frames 110a and electrode frames 120a are connected, where m and n are arbitrary Lt; / RTI >

The base frame structure 110 and the electrode frame structure 120 may include a plurality of base frames 110a and guide rails G forming a boundary between the plurality of electrode frames 120a. That is, the guide rail G in the base frame structure 110 and the electrode frame structure 120 may be configured to surround the edges of the base frame 110a and the electrode frame 120a, respectively.

The electrode frame structure 120 may have a down set structure in which the guide rail G and the electrode frame 120a form a step (see FIG. 11). Therefore, in the double frame structure 125 composed of the base frame structure 110 and the electrode frame structure 120, the base frame structure 110 and the electrode frame structure 120 are in contact with each other only in the region of the guide rail G The base frame 110a and the electrode frame 120a are separated from each other.

The base frame structure 110 and the electrode frame structure 120 are respectively formed with alignment holes 105 at predetermined positions. For example, the alignment holes 105 may be formed in the base frame structure 110 and the guide rail G region of the electrode frame structure 120. A guide pin is inserted into the alignment holes 105 while the base frame structure 110 and the electrode frame structure 120 are overlapped with each other in the process of forming the double frame structure 125, Mis-alignment between the structure 110 and the electrode frame structure 120 can be prevented.

The base frame 110a includes a plurality of through holes 120a so that a part of the electrode frame 120a disposed on the base frame 110a may be exposed when viewed in the + z direction from the lower surface of the double frame structure 125. [ (142, 143, 145).

FIG. 9 is a plan view illustrating a part of a double frame structure having a molding part in a method of manufacturing a chip on-board type light emitting device package according to an embodiment of the present invention. FIG. FIG. 8 is a bottom view illustrating a part of a double frame structure in which a molding part is formed in a method of manufacturing an element package.

9 and 10A, after the step of providing the double frame structure 125, a molding process is performed so as to be coupled to the double frame structure 125 so as to separate the base frame 110a and the electrode frame 120a from each other. Thereby forming a portion 130a. The structure shown in Figs. 9 and 10A is a unit structure constituting the double frame structure 125 having the molding part 130a. That is, a plurality of unit structures are connected and arrayed to form the double frame structure 125. The chip on-board type light emitting device package 100 shown in FIGS. 1 to 4A can be implemented by separating the guide rail G by trimming a tie bar (T) portion in the unit structure .

The molding part 130a may be formed of a resin through a transfer molding method using an upper mold and a lower mold. Of course, the molding part 130a may be formed by injection molding, injection molding, or the like in addition to the transfer molding method. Examples of the resin that can be used for the molding part 130a include epoxy and the like. The molding part 130a forms the side wall of the opening 141 to expose a part of the electrode frame 120a and further fills at least a part of the overlapping area between the electrode frame 120a and the base frame 110a . Further, the molding portion 130a may be further formed to cover at least a part of the side wall of the through hole 142. [ The molding part 130a has been described above with reference to FIGS. 1 to 7, and therefore, a detailed description thereof will be omitted.

The electrode frame 120a can be bent by the pressing of the mold while the molding part 130a is formed while the base frame 110a and the electrode frame 120a are kept spaced from each other, 110a and the electrode frame 120a can not be separated from each other and short-circuited.

11 to 13, in order to solve such a problem, after the support pins 242, 243, 245 are inserted through the plurality of through holes 142, 143, 145 formed in the base frame 110a By forming the molding part 130a on the double frame structure 125, it is possible to prevent the electrode frame 120a from bending due to the pressing by the upper mold and the contact between the base frame 110a and the electrode frame 120a have. 11 illustrates an aspect in which the support pin is inserted in the through hole 143 shown in part E4 of Fig. 9, and Fig. 12 shows the support pin in the through hole 142 shown in part E5 in Fig. FIG. 13 illustrates an aspect in which a support pin is inserted in the through hole 145 shown in part E6 of FIG. 10A.

Hereinafter, a method of manufacturing a chip on-board type light emitting device package according to another embodiment of the present invention will be described. FIG. 8B is a view illustrating a step of providing a dual frame structure in a method of manufacturing a chip on-board type light emitting device package according to another embodiment of the present invention. FIG. FIG. 6 is a bottom view illustrating a part of a double frame structure in which a molding part is formed in a method of manufacturing a package. 8B and 10B are respectively a modification of the first embodiment shown in Figs. 8A and 10A. In order to strengthen the bonding between the base frame 110a and the electrode frame 120a and the molding part 130a, Two through holes 155b are introduced. Therefore, the description of other configurations is the same as that described above, and thus will not be described here.

8B, 9, and 10B, a method of manufacturing a chip on-board type light emitting device package according to another embodiment of the present invention includes a base frame 110a on which a plurality of light emitting devices (not shown) Providing a base frame structure (110) arrayed in a plurality of connection structures; Providing an electrode frame structure (120) formed in a down set structure by arraying a plurality of electrode frames (120a) connected to each other; And aligning and arranging the electrode frame structure 120 on the base frame structure 110 to provide the double frame structure 125.

For example, providing the base frame structure 110 may include providing a base frame structure 110 in which a plurality of base frames 110a having a first through hole 155a penetrating the base frame 110a are arrayed and arrayed And the step of forming the molding part 130a may include the step of filling the molding part 130a with the first through hole 155a so as to enhance the bonding between the base frame 110a and the molding part 130a have.

For example, in the step of providing the electrode frame structure 120, a plurality of electrode frames 120a having a second through hole 155b penetrating the electrode frame structure 120 may be connected to form an arrayed electrode frame structure 120 And the step of forming the molding part 130a includes the step of filling the molding part 130a with the second through hole 155b so as to enhance the bonding between the electrode frame 120a and the molding part 130a can do.

According to the chip-on-board type light emitting device package and the method of manufacturing the same of the present invention, a separate insulating layer may not be separately formed in order to electrically separate the base frame 110a and the electrode frame 120a from each other, The base frame 110a and the electrode frame 120a may be separated from each other only by a process of forming a molding part 130a having an opening 141 through which light is emitted. In addition, in order to separate the base frame 110a from the electrode frame 120a, it is possible to realize this by a molding process without forming a separate sacrificial layer interposed therebetween, thereby reducing the manufacturing cost. According to the chip on-board type light emitting device package manufacturing method of the present invention, a transfer molding process can be applied, which is easy to mass-produce, and the same process as a general package manufacturing process can be applied to ensure productivity. Furthermore, by applying an injection technique using a double frame, the heat capacity and heat dissipation performance can be maximized.

According to the chip on-board type light emitting device package and the method of manufacturing the same of the present invention, a through hole 155 passing through the base frame 110a and / or the electrode frame 120a is formed and the through hole 155 is formed in the molding part 130a The bonding between the base frame 110a and / or the electrode frame 120a and the molding part 130a can be reinforced to improve the mechanical stability of the chip on-board type light emitting device package.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: Chip On-board type light emitting device package
110a: Base frame
120a: electrode frame
130a:
105: Alignment hole
141: opening
142, 143, 145: Through holes
155: Through hole
155a: first through hole
155b: second through hole
242, 243, 245:

Claims (13)

A double frame including a base frame on which a plurality of light emitting elements can be mounted, and an electrode frame including two electrodes separated from each other on the base frame; And
And a molding part coupled to the double frame to separate the base frame and the electrode frame from each other and having an opening through which light generated in the plurality of light emitting devices is emitted,
Wherein the base frame has a through hole through which the electrode frame is exposed in a lower portion thereof. The method according to claim 1,
Wherein the molding part forms a side wall of the opening to expose a part of the electrode frame and further extends to fill an overlapping area between the electrode frame and the base frame. 3. The method of claim 2,
Wherein the molding portion further extends to cover at least a part of a side wall of the through hole. 3. The method of claim 2,
Wherein the molding portion is formed immediately below a region where a bonding wire electrically connecting the light emitting device and the electrode frame is bonded to the electrode frame. The method according to claim 1,
Wherein the base frame has a first through hole penetrating the inside thereof, and the first through hole is filled with the molding part, thereby enhancing the bonding between the base frame and the molding part. 6. The method of claim 5,
Wherein a cross section of the first through hole is wider as the base frame is lowered. 6. The method of claim 5,
Wherein a top surface of the base frame is provided with a concavo-convex portion at a portion in contact with the molding portion, thereby enhancing bonding between the base frame and the molding portion. 6. The method of claim 5,
Wherein the electrode frame has a second through hole at a position corresponding to the upward direction of the first through hole and the second through hole is filled with the molding part to strengthen the bonding between the electrode frame and the molding part, A light emitting device package. Providing a base frame structure in which a plurality of base frames, on which a plurality of light emitting elements are mounted, are connected and arrayed;
Providing an electrode frame structure formed in a downsized structure in which a plurality of electrode frames are connected and arrayed;
Aligning the electrode frame structure on the base frame structure to provide a double frame structure; And
And forming a molding part coupled to the double frame structure to separate the base frame and the electrode frame from each other and having openings through which light generated from the plurality of light emitting devices is emitted,
Wherein the base frame has a through hole through which the electrode frame is exposed in a lower portion thereof. 10. The method of claim 9,
Wherein the step of forming the molding part includes inserting a support pin into the through hole to prevent short-circuiting between the electrode frame and the base frame. 10. The method of claim 9,
Wherein the step of providing the double frame structure includes inserting a guide pin into the alignment holes formed in the base frame structure and the electrode frame structure, respectively. 10. The method of claim 9,
Wherein the step of providing the base frame structure includes the step of providing a base frame structure in which a plurality of base frames having a first through hole penetrating the base frame are connected and arrayed,
Wherein forming the molding portion comprises forming a molding portion to fill the first through hole to enhance bonding between the base frame and the molding portion.
A method of manufacturing a chip on - board type light emitting device package. 13. The method of claim 12,
Wherein the step of providing the electrode frame structure includes the step of providing an electrode frame structure in which a plurality of electrode frames having a second through hole penetrating the electrode frame are connected and arrayed,
Wherein the forming of the molding portion comprises forming a molding portion to fill the second through hole to enhance bonding between the electrode frame and the molding portion.
A method of manufacturing a chip on - board type light emitting device package.

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