KR101430871B1 - Apparatus for Polymer Foam Board Plate and method thereof - Google Patents

Apparatus for Polymer Foam Board Plate and method thereof Download PDF

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KR101430871B1
KR101430871B1 KR1020130052603A KR20130052603A KR101430871B1 KR 101430871 B1 KR101430871 B1 KR 101430871B1 KR 1020130052603 A KR1020130052603 A KR 1020130052603A KR 20130052603 A KR20130052603 A KR 20130052603A KR 101430871 B1 KR101430871 B1 KR 101430871B1
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high frequency
foam board
paper
frequency
roll
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KR1020130052603A
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Korean (ko)
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공규택
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공규택
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00Layered products comprising a layer of paper or cardboard
    • B32B29/002Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B29/007Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a foam layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00Layered products comprising a layer of paper or cardboard
    • B32B29/06Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0008Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • B32B41/02Safety arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material

Abstract

The present invention relates to an apparatus for manufacturing a foamed board configured to include a high frequency unit (20) that has a high-frequency pressing unit (21) and a high-frequency base roll (22) for high-frequency heating of a combination surface site of paper (9) to be combined with a foamed board base plate (2); a preheating unit (30) that vertically separates high-frequency treatment paper (9-2) which is high frequency-heated by the high frequency unit (20) and the foamed board base plate (2) for preheating at the same time; and a heating roll (10) that performs a heating and pressing operation on the preheated foamed board base plate (2-4) and the high-frequency treatment paper (9-2) passed through the preheating unit (30) for combination. The high frequency unit (20) has a high frequency unit housing (23) that has an inlet and an outlet for allowing the paper (9) to pass, an exhaust duct (24) that discharges smoke and exhaust gas which are generated in the high-frequency pressing unit (21), an encoder (25) that determines on transport in interworking with a rotary shaft of the high-frequency base roll (22), and a power transmission means (26) that transmits power of the high-frequency base roll (22) to the encoder (25).

Description

발포폼보드판 제조장치 및 방법{Apparatus for Polymer Foam Board Plate and method thereof}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an apparatus and a method for manufacturing a foamed foam board,

본 발명은 발포폼보드판 제조장치 및 제조방법에 관한 것으로, 발포 폼보드원판에 붙이는 종이를 화재발생 및 환경오염 없이 고주파 처리하고, 고주파 처리한 종이와 발포 폼보드 원판을 동시에 예열한 후 히팅롤로 눌러 종이와의 접착성을 향상시키고 종이의 표면이 매끄러운 발포폼보드판 제조장치 및 제조방법에 관한 것이다.The present invention relates to an apparatus and a method for manufacturing a foamed foam board, in which a paper attached to a foamed foam board is subjected to high-frequency treatment without causing fires and environmental pollution, and a high-frequency processed paper and a foamed foam board are preheated simultaneously, The present invention relates to a foam board board manufacturing apparatus and a manufacturing method thereof, which improve adhesion to paper and smooth the surface of paper.

압출 폴리스티렌 수지 발포 보드는 연속적이고 효과적으로 제조할 수 있으며 다양한 장점(예: 단열성, 경량, 저흡수성 및 가공성)이 있으므로, 일반 주택뿐만 아니라 기타의 구조물용 단열재로서 폭넓게 이용되어 왔다.Extruded polystyrene foam boards have been used extensively as insulation materials for general houses as well as for other structures because they can be manufactured continuously and effectively and have various advantages (for example, heat insulation, light weight, low absorption and workability).

압출 폴리스티렌 수지 발포 보드는 폴리스티렌 수지, 발포 보드 및 기타의 첨가제를 압출기의 실린더에서 혼합 및 용융시키고, 생성된 용융 혼합물을 고압영역으로부터 저압영역으로 압출기의 압출 다이를 통하여 압출시킨 다음, 압출물을 계속 발포시키면서 성형장치를 통과시켜 제조하여 왔다. 그러나, 이렇게 하여 수득한 압출 발포 보드는 압출 방향에 수직인 단면에서의 발포도가 균일하지 않으며, 발포 보드의 밀도분포와 기계적 강도분포가 불균일하다는 단점이 있다. 이는 압출 수지 혼합물의 온도가 높아서 보형성이 나쁘기 때문에, 이것을 냉각시키면서 성형장치에서 성형하고 압출물의 표면부가 압출물의 내부보다 급속히 냉각되어 표면부의 발포를 억제하기 때문이다. 따라서, 표면부의 밀도는 높으며 내부의 밀도는 낮다. 더우기, 성형장치에 의해 온도가 높은 압출 수지 혼합물을 냉각시키는 것은 혼합물의 전반적인 발포를 억제하므로, 압출 발포 보드의 바람직한 밀도에 악영향을 미친다.The extruded polystyrene resin foam board mixes and melts the polystyrene resin, the foam board and other additives in the cylinder of the extruder, extrudes the resulting molten mixture from the high pressure region to the low pressure region through the extrusion die of the extruder, And then passed through a molding apparatus while being foamed. However, the extruded foam board thus obtained has a disadvantage in that the degree of foaming at the cross section perpendicular to the extrusion direction is not uniform, and the density distribution and the mechanical strength distribution of the foam board are uneven. This is because the temperature of the extruded resin mixture is so high that the formation of the extruded resin mixture is poor, so that the extruded resin is molded in a molding apparatus while cooling it, and the surface of the extrudate is cooled more rapidly than the inside of the extrudate. Therefore, the density of the surface portion is high and the density of the inside portion is low. Furthermore, cooling the extruded resin mixture having a high temperature by the molding apparatus suppresses the overall foaming of the mixture, thereby adversely affecting the desired density of the extruded foam board.

그러므로, 압출물을 발포 및 냉각 후에 재가열하거나, 진공장치로 또는 열용량이 크고 상온에서 액체인 증기를 대기속으로 계속해서 보내는 공정이 제안되었다. 그러나, 이러한 공정에 따라 제조한 발포 보드 역시 발포 보드의 압출 방향에 수직인 단면에서의 밀도와 기계적 강도가 여전히 불균일하다. 그러므로 두꺼운 발포 보드의 절단형으로 사용하는 경우, 이러한 발포 보드는 구부러지고 심지어는 작은 온도변화에도 파쇄되므로, 단일 시트 형태로만 사용해야 한다. 이는 생산성을 매우 저조하게 하며 단가를 상승시킨다.Therefore, a process has been proposed in which the extrudate is reheated after foaming and cooling, or is continuously fed to the atmosphere with a vacuum device or a vapor having a large heat capacity and a liquid at room temperature. However, the foam board manufactured according to such a process still has a nonuniform density and mechanical strength in a cross section perpendicular to the extrusion direction of the foam board. Therefore, when used as a cut type of thick foam board, such a foam board should be used only in a single sheet form, since it is bent and even shrunk even at small temperature changes. This makes the productivity very low and increases the unit price.

스티렌 수지 발포 보드 시트를 압출하면서 또는 압출 직후에 표면에서 "냉각시키고", 계속해서 또는 방치 후에, 표면에서 가열하여 발포시키는 공정이 문헌에 기술되어 있다[참조: 일본국 미심사 특허공보 제56-99635호]. 이는 공정에서, 수지를 압출하는 동안 또는 수지가 오리피스를 통과한 후에 오리피스 내의 선단에서 냉각함으로써 충분한 발포기능을 여전히 보유한 수지를 냉각시킨다. 그 결과로, 일단 냉각된 매우 두꺼운 발포 보드(즉, 발포성 단열재)를 발포되도록 재가열할 때, 발포 보드 심층부까지 가열되지 않아 균일성 및 저밀도를 갖는 발포 보드를 수득하기가 어렵다. 예를 들면, 열 용량이 크고 열이 발포 보드 심층부까지 용이하게 투과할 수 있는 폴리스티렌 수지에 대한 기체투과성이 높은 증기를 사용하여 가열할 때, 저밀도는 얻을 수 있지만, 증기의 투과성이 향상됨에 따라 표면층과 심층부의 밀도분포는 불균일해진다. 더우기 이러한 증기에 의한 가열은 특정 시간 또는 높은 단가 또는 열손실을 야기하는 잔류 발포 보드의 응축액 제거 단계를 필요로 한다. 그리고 일단 냉각된 발포 보드(즉, 단열재)를 추가로 가열하는 단계는 비경제적이며 최종 제품의 단가 면에서 매우 불리하다.A process of heating and foaming a surface of a foam sheet of a styrene resin foam sheet while extruding or immediately after extrusion and "cooling down" the surface immediately after extrusion or after leaving the surface of the foam board sheet is described in the literature (refer to Japanese Patent Application Laid- 99635]. This in the process cools the resin still having sufficient foaming function by cooling during extrusion of the resin or at the tip in the orifice after the resin has passed through the orifice. As a result, it is difficult to obtain a foam board having uniformity and low density because it is not heated up to the deep portion of the foam board when reheating the foamed foam board (i.e., foamed insulation material) once cooled. For example, a low density can be obtained when heating is carried out using a gas permeable high-polystyrene resin whose heat capacity is large and heat can easily permeate to the deep portion of the foam board, but as the permeability of the vapor is improved, And the density distribution of the deep part becomes uneven. Moreover, such vapor heating requires a condensate removal step of the residual foam board which results in a certain time or high unit price or heat loss. And the step of further heating the cooled foam board (i.e., insulation) is uneconomical and very disadvantageous in terms of the unit cost of the final product.

한편, 폼 보드 원판의 상하면에 종이를 붙여 만든 폼보드 원판을 만드는 예로는 도 1 과 같이 권취롤(1)에 감긴 폼보드 원판(2)을 인출롤(3)을 통하여 인출하고 이를 예열부(4)에서 예열하고, 폼보드 원판(2)의 상하면에 고주파 누름부(5)를 통한 누름 작용으로 표면을 가열하는 고주파 처리부(6)를 통과하고, 고주파 처리부(6)에서 표면 처리된 고주파 처리 폼보드 원판(2-1)은 인출롤(7)을 통하여 인출되는 종이롤(8)을 통해 공급받은 종이(9)를 히팅롤(10)의 히팅으로 합체시켜 수득한다. (5-1)은 고주파 누름부(5)와의 누름 시 고주파를 발생토록 접지 전원을 인가받는 베이스롤 이다.As shown in FIG. 1, the foam board 2 wound around the winding roll 1 is taken out through the drawing roll 3, and the preform is wound on the preheating part 4 and passes through a high frequency processing section 6 for heating the surface of the foaming board disk 2 by pressing the upper and lower surfaces of the foaming board disk 2 through the high frequency pressing section 5, The foam board original 2-1 is obtained by incorporating the paper 9 supplied through the paper roll 8 drawn out through the drawing roll 7 by heating of the heating roll 10. [ (5-1) is a base roll that applies a ground power to generate a high frequency when it is pressed with the high frequency pressing part (5).

그러나 이러한 방식은 폼보드 원판(2)을 예열부(4) 및 고주파 처리부(6)를 통과토록 함으로써 가열하여 추가 발포가 일어나므로 두께가 불균일하고, 이를 종이롤(8)에서 인출되는 종이(9)와 합체하도록 한 상태에서 히팅롤(10)로 히팅하므로, 종이와 합체하는 동안 고주파처리 폼보드원판(2-1)의 표면이 일부 냉각되어 종이와의 합체 특성이 일정하지 못하여 불균일한 표면을 가지는 문제점이 있고, 접착성이 저하되어 쉽게 종이가 분리되는 요인이 된다. However, in this method, since the foaming board 2 is heated by passing through the preheating portion 4 and the high frequency processing portion 6 and further foaming occurs, the thickness is uneven, and the paper is fed out from the paper roll 9 The surface of the high frequency treated foam board original plate 2-1 is partially cooled and the coalescence property with the paper is not constant, so that a non-uniform surface is obtained And there is a problem that the adhesiveness is lowered and the paper is easily separated.

본 발명은 이를 해결하고자 하는 것으로, 본 발명의 목적은 폼보드판을 이루는 폼보드 원판이 아닌 합지용 종이를 화재위험 및 환경오염이 없도록 고주파 처리한 후 히팅롤에서 합지하여 합체된 표면을 매끄럽게 하고 종이와의 접착성을 향상시킨 발포폼보드판 제조장치 및 제조방법을 제공하려는 것이다.It is an object of the present invention to solve the above-mentioned problems, and an object of the present invention is to provide a plywood board, which is not a foam board board, is subjected to high frequency treatment to avoid fire risk and environmental pollution, And a method for manufacturing the foamed foam board.

본 발명의 다른 목적은 폼보드 원판과, 원판의 상하면에 각각 고주파처리종이를 동시에 예열한 후, 히팅롤을 사용하여 합체하므로 합체 성능을 향상시키고 합체 불량을 없애도록 하는 발포폼보드판 제조장치 및 제조방법을 제공하려는 것이다.
Another object of the present invention is to provide a foamed foam board manufacturing apparatus and method for manufacturing a foamed foam board which improves coalescence performance and eliminates defective coalescence by simultaneously preheating high frequency treated paper on a foam board and a top and bottom of a circular plate, Method.

이를 위하여 본원발명은 종이의 고주파 처리시 종이를 고주파 처리하는 중 인지를 인식하는 엔코더를 부가하고, 고주파 작동시 발생하는 연기 및 발생오염을 배기덕트로 배출시키고, 발포폼 보드원판을 예열부에서 예열토록 하고, 종이는 별도의 고주파부를 통하여 합체면에 요철에 생기도록 한 후, 예열부에서 발포폼보드원판과 고주파처리종이를 동시에 예열한 후, 동시에 히팅롤에서 접착되도록 한다.To this end, the present invention is characterized in that an encoder for recognizing whether a paper is subjected to high frequency processing during high frequency processing of paper is added, smoke and generated pollution generated during high frequency operation are discharged to an exhaust duct, and the foamed foam board is preheated And the paper is made to have unevenness on the joining face through a separate high-frequency part, and then the foamed foam board original plate and the high-frequency treated paper are preheated simultaneously in the preheating part, and then they are bonded at the same time on the heating roll.

즉, 본 발명은 폼보드 원판을 열처리하여 종이를 표면에 합체시킨 폼보드판 제조장치에서,That is, the present invention relates to a foam board manufacturing apparatus in which a foam board is heat-

폼보드 원판에 합체될 종이의 합체면 부위에 고주파 가열시키는 고주파 누름부와 고주파베이스롤을 가지는 고주파부;A high-frequency part having a high-frequency pressing part and a high-frequency base roll for high-frequency heating on a joining surface of a paper to be incorporated in a foam board;

고주파부에서 고주파 가열된 고주파 처리종이와, 폼보드 원판을 동시에 상하 이격 예열하는 예열부; 및A preheating unit for vertically and vertically heating the high frequency treated paper high in frequency at the high frequency part and the foam board original plate at the same time; And

예열부를 통과한 예열된 폼보드 원판 및 고주파 처리종이를 합체하도록 가열 누름 작용하는 히팅롤을 포함하는 발포폼보드판 제조장치를 제공하려는 것이다.And a heating roll that heats and presses the preheated foam board sheet and the high frequency treated paper that have passed through the preheating unit.

본 발명은 또한 폼보드 원단을 열처리하여 종이를 표면에 합체시킨 폼보드판 제조방법에 있어서,The present invention also relates to a method for manufacturing a foam board having a paper surface bonded to a surface by heat treating a foam board fabric,

폼보드 원판과 합체할 종이의 합체면 부위를 고주파 열처리하는 제 1 과정;A first process of high-frequency heat-treating the merged face portion of the foam board and the paper to be incorporated;

고주파 처리 종이와 이 고주파 처리 종이와 합체할 폼보드 원판을 수평상의 상하 차이를 두고 이동토록 하면서 동시에 예열시키는 제 2 과정; 및A second process of preheating simultaneously a high frequency treated paper and a foam board original to be combined with the high frequency treated paper while moving them horizontally up and down; And

예열된 폼보드 원판 및 고주파 처리 종이를 히팅롤에서 가열 합체하는 제 3 과정을 포함하여 수행함을 특징으로 하는 발포폼보드판 제조방법을 제공하려는 것이다.And a third step of heating and coalescing the preheated foam board and the high-frequency treated paper in a heating roll. The present invention also provides a method of manufacturing a foamed foam board.

본 발명에서 발포 보드 원료로 사용하는 스티렌 수지는, 예를 들면, 스티렌 유도체(예: 스티렌, α-메틸스티렌, 디클로로스티렌, 디메틸스티렌, 3급-부틸스티렌, 비닐톨루엔)의 단독중합체, 이들 중 적어도 두 개의 공중합체, 또는 스티렌 유도체와 다른 단량체와 용이하게 공중합 할 수 있는 화합물(예: 디비닐벤젠, 메틸 메타크릴레이트, 아크릴로 니트릴, 부타디엔) 소량과의 공중합체를 들 수 있다. 본 발명에서 사용하는 발포제로서는 휘발성 유기 발포제 및 열 분해성 화학적 발포제를 언급할 수 있다. 바람직한 발포제는 비점(제1기압 이하에서)이 기재 수지의 연화점보다 높지 않은 휘발성 유기 발포제(예: 트리클로로플루오로메탄, 디클로로디플루오로메탄, 디클로로플루오로메탄, 클로로디플루오로메탄, 1,1',2-트리클로로트리플루오로에탄, 1,2-디클로로테트라플루오로에탄, 1-클로로트리플루오로에탄, 1-클로로-1,1'-디플루오로에탄, 1,1-디플루오로에탄, 옥타플루오로디클로로부탄, 메틸 클로라이드, 에틸 클로라이든, 메틸렌 클로라이드, 에틸렌 클로라이드, 프로판, 부탄, 부텐, 프로필렌, 펜탄, 메탄올, 이산화탄소 등)이다. 또한, 난연제, 핵 생성제, 자외선 흡수제, 윤활제, 수지 개질제 및 착색제 등의 첨가제는 필요에 따라 첨가할 수 있다.The styrene resin used as a raw material for the foam board in the present invention may be a homopolymer of a styrene derivative (e.g., styrene,? -Methylstyrene, dichlorostyrene, dimethylstyrene, t-butylstyrene, vinyltoluene) At least two copolymers or copolymers of a styrene derivative and a small amount of a compound capable of easily copolymerizing with other monomers (e.g., divinylbenzene, methyl methacrylate, acrylonitrile, butadiene). As the foaming agent used in the present invention, volatile organic foaming agents and thermally decomposable chemical foaming agents can be mentioned. Preferred foaming agents are volatile organic foaming agents (e.g., trichlorofluoromethane, dichlorodifluoromethane, dichlorofluoromethane, dichlorodifluoromethane, 1, 2, 3, 4, 1 ', 2-trichlorotrifluoroethane, 1,2-dichlorotetrafluoroethane, 1-chlorotrifluoroethane, 1-chloro-1,1'-difluoroethane, 1,1-difluoro Methylene chloride, ethylene chloride, propane, butane, butene, propylene, pentane, methanol, carbon dioxide, etc.). In addition, additives such as a flame retardant, a nucleating agent, an ultraviolet absorber, a lubricant, a resin modifier, and a colorant may be added as needed.

수지와 발포제와의 혼합 및 이의 압출은 폴리스티렌 수지의 통상적인 제조시에 사용하는 것과 동일하다. 발포제는 수지를 압출기에 공급하기 전에 압출기 내에서 수지와 혼합한다. 발포제 등을 함유하는 수지 혼합물은 추진, 압축, 용융 및 혼합하면서 스크류에 의해 압출기 내에서 전진시키고, 압출 다이(오리피스)를 통과시킴으로써 고압영역으로부터 저압영역으로 이동시킨다.
The mixing of the resin and the foaming agent and the extrusion thereof are the same as those used in the conventional production of the polystyrene resin. The blowing agent is mixed with the resin in the extruder before the resin is fed to the extruder. The resin mixture containing the foaming agent and the like is advanced in the extruder by screws while being propelled, compressed, melted and mixed, and is moved from the high pressure area to the low pressure area by passing the extrusion die (orifice).

이상과 같이 본원발명은 폼보드판을 이루는 폼보드 원판이 아닌 합지용 종이를 고주파 처리한 후 히팅롤에서 합지하여 합체된 표면을 매끄럽게 하고 종이와의 접착성을 향상시킨다.As described above, according to the present invention, a paper for laminated paper, which is not a foam board, constituting a foam board, is subjected to high-frequency treatment and then joined together on a heating roll to smooth the combined surface and improve adhesion to paper.

본 발명은 또한 폼보드 원판과 고주파처리종이를 동시에 예열한 후 히팅롤을 사용하여 합체하므로 합체 성능을 향상시키고 합체 불량을 없애도록 한다.The present invention also improves coalescence performance and eliminates defective coalescence by simultaneously preheating the foam board disk and the high frequency treated paper using a heating roll.

도 1 은 일반적인 발포 폼보드판 제조장치의 구성도,
도 2 는 본 발명의 구성도,
도 3 은 본 발명의 요부 구성도이다.
1 is a schematic view of a general foamed foam board manufacturing apparatus,
Fig. 2 is a configuration diagram of the present invention,
3 is a block diagram of the main part of the present invention.

이하 본원 발명의 실시 예를 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

도 2 는 본 발명의 구성도, 도 3 은 본 발명의 요부 구성도로, 폼보드 원판을 열처리하여 종이를 표면에 합체시킨 폼보드판 제조장치에 있어서,FIG. 2 is a structural view of the present invention. FIG. 3 is a schematic view of a foam board manufacturing apparatus in which paper is combined with a surface of a foam board,

폼보드 원판(2)에 합체되며 종이롤(8)에서 제공되는 종이(9)의 합체면 부위를 고주파 가열시키는 고주파 누름부(21)와, 합체면 반대편에 고주파누름부(21)를 통과하는 종이(9)를 지지하는 고주파 베이스롤(22)을 가지는 고주파부(20);A high frequency pressing portion 21 which is incorporated in the foam board original plate 2 and which heats the cohesion face portion of the paper 9 provided in the paper roll 8 by high frequency and a high frequency pressing portion 21 which passes through the high frequency pressing portion 21 A high frequency section (20) having a high frequency base roll (22) for supporting the paper (9);

고주파 가열된 고주파 처리종이(9-2)와 폼보드 원판(2)을 동시에 수평상의 상하위치 차이를 두고 예열하는 예열부(30); 및A preheating unit 30 for preheating high-frequency-treated high-frequency treated paper 9-2 and a foam board disk 2 at the same time in a horizontal up-and-down position; And

예열부(30)를 동시에 통과한 예열된 폼보드 원판(2-4) 및 고주파 처리종이(9-2)를 합체하도록 가열 누름 작용하는 히팅롤(10)을 포함한다.And a heating roll 10 which performs a heating pressing action to coalesce the preheated foam board plate 2-4 and the high frequency treated paper 9-2 which have passed through the preheating portion 30 at the same time.

상기 고주파부(20)는 종이(9)가 통과하는 입출구를 가지는 고주파부 하우징(23), 고주파누름부(21)에서 발생하는 연기 및 배기가스를 배출하는 배기덕트(24), 고주파베이스롤(22)의 회전축에 연동하여 이송 여부를 판단하는 엔코더(25), 고주파베이스롤(22)의 동력을 엔코더(25)에 전달하는 동력전달수단(26)을 포함하여 구성한다.The high frequency section 20 includes a high frequency housing 23 having an inlet and an outlet through which the paper 9 passes, an exhaust duct 24 for discharging smoke and exhaust gas generated in the high frequency pressing section 21, An encoder 25 for determining whether or not to feed the high frequency base roll 22 in cooperation with the rotation axis of the high frequency base roll 22; and a power transmission means 26 for transmitting the power of the high frequency base roll 22 to the encoder 25.

상기 예열부(30)는 고주파처리종이(9-2)가 수평이동 가능하도록 수직으로 이격된 제 1 롤(31)과,The preheating unit 30 includes a first roll 31 vertically spaced such that the high-frequency treated paper 9-2 can move horizontally,

제 1 롤(31)을 지나 히팅롤(10)에 인가하는 제 2 롤(32), 및A second roll 32 which is applied to the heating roll 10 through the first roll 31, and

상기 제 1 및 제 2 롤(31,32)을 수용하며 예열용 열을 인가하는 예열 하우징(33)을 포함한다. (34)는 아이들롤 이다. And a preheating housing 33 for receiving the first and second rolls 31 and 32 and applying heat for preheating. (34) is an idol roll.

히팅롤(10)을 통과한 합체 폼보드원판은 냉각부(40)에서 냉각함으로써 발포의 진행을 멈추고 표면을 안정적으로 유지토록 한다. 바람직한 냉각부(40)의 예로는 합체 원판을 이송시키는 피딩롤(41)과, 피딩롤(41)에서 공급받은 합체 보드판을 냉각시키는 냉각챔버(42)를 포함한다. 냉각챔버(42)에서 냉각된 합체 보드판은 절단부(50)에서 일정 사이즈로 절단된다.The unified foam board original plate which has passed through the heating roll 10 is cooled in the cooling part 40 to stop the progress of the foaming and keep the surface stably. Examples of the preferable cooling unit 40 include a feeding roll 41 for feeding the coalesced original plate and a cooling chamber 42 for cooling the coalesced board supplied from the feeding roll 41. The combined board board cooled in the cooling chamber 42 is cut to a predetermined size at the cut portion 50.

이와 같이 구성한 본원발명은 폼보드 원판을 열처리하여 종이를 표면에 합체시킨 폼보드판을 제조함에 있어서,According to the present invention constructed as described above, the foam board is heat-treated to prepare a foam board,

폼보드 원판(2)에 합체할 종이(9)의 합체면 부위를 고주파 누름부(21)의 누름 작용으로 요철면(9-1)을 이루도록 고주파 열처리한다(제 1 과정). 이 경우 고주파 열처리 자체는 통상의 기술이므로 이에 대한 설명은 생략하나, 종이에 고주파 열처리를 하면 고주파에 의한 파장으로 종이의 내 표면이 요철 형태로 타서 도 3 과 같이 요철면(9-1)을 이룬다. The joining face portion of the paper 9 to be incorporated in the foam board original plate 2 is subjected to a high frequency heat treatment so as to form an uneven surface 9-1 by the pressing action of the high frequency pressing portion 21 (first process). In this case, since the high-frequency heat treatment itself is a conventional technique, a description thereof will be omitted. However, if a high-frequency heat treatment is performed on paper, the inner surface of the paper is irradiated with a wavelength of high frequency to form an uneven surface 9-1 as shown in FIG. .

이어 고주파 열처리하여 요철면(9-1)을 이룬 고주파 처리종이(9-2)와, 고주파 처리 종이(9-2)와 합체할 폼보드 원판(2)을 수평 상의 상하 차이를 두고 예열 하우징(33) 내에서 이동토록 하여 예열된 폼보드원판(2-4)을 이루도록 예열부(30)에서 동시에 예열시킨다(제 2 과정).The high frequency treated paper 9-2 having the uneven surface 9-1 and the foam board disk 2 to be combined with the high frequency treated paper 9-2 are subjected to a high frequency heat treatment to form a preheated housing 33) so as to be preheated in the preheating unit 30 so as to form the preformed foam board plate 2-4 (second process).

이어 예열된 폼보드 원판(2-4) 및 고주파 처리 종이(9-2)를 히팅롤(10)에서 가열 합체한다(제 3 과정). Next, the preheated foam board plate 2-4 and the high-frequency treated paper 9-2 are heated and combined in the heating roll 10 (third process).

상기 제 1과정과 제 2과정 사이에서 고주파처리중 인지를 고주파베이스롤(22)에 연동하는 엔코더(25)의 출력이상이 있는지로 판단하여 엔코더(25) 출력이상으로 종이(9) 이송이 중단된 상태로 판단되면, 고주파누름부(21) 작동을 오프시키는 안전과정을 더 수행한다.It is determined that there is an abnormality in the output of the encoder 25 interlocked with the high frequency base roll 22 between the first process and the second process so that the conveyance of the paper 9 is stopped more than the output of the encoder 25 The control unit 20 further performs a safety process of turning off the operation of the high frequency pressing unit 21. [

이 경우 예열시킨 예열된 폼보드 원판(2-4)과 예열시킨 고주파 처리종이(9-2)는 그 표면의 온도가 일치하고 동시에 고주파 처리종이(9-2)의 일 표면이 요철면(9-1)을 이루므로, 이는 예열시킨 예열된 폼보드 원판(2-4) 표면과 히팅롤(10)을 통과하면서 눌리어질 때 접촉 면적을 늘리는 효과를 제공하여 접착력을 증대시킨다. 아울러 동시에 예열한 다음 히팅롤(10)을 통하여 눌러서 합체함으로써, 합체된 발포 폼보드판의 표면이 균일하고 접착성이 향상되어 내구성을 증진시킨다.In this case, the preheated preformed foam board plate 2-4 and the preheated high-frequency treated paper 9-2 have the same surface temperature and at the same time one surface of the high-frequency treated paper 9-2 is covered with the uneven surface 9 -1). This increases the adhesion by providing the effect of increasing the contact area when pressed while passing through the preheated preformed foam board plate 2-4 surface and the heating roll 10. By simultaneously preheating and pressing together through the heating roll 10, the surface of the combined foamed foam board is uniform and the adhesion improves to improve the durability.

아울러 본원발명은 고주파부(20)가 고주파부 하우징(23)으로 감싸지도록 하여 작업자의 환경오염과 전자파 등의 위험 노출을 막아준다. 아울러 고주파부 하우징(23)으로 인한 내부 공간의 오염은 배기덕트(24)를 통하여 배출한다. 또한 고주파베이스롤(22)에 동력전달수단(26)으로 연동하는 엔코더(25)를 부가하여, 엔코더(25)의 출력을 제어부(도시하지 않음)에서 인식하여 엔코더 출력이 없으면 종이(9)의 이송이 멈춘 것으로 판단하고, 고주파누름부(21)의 작동 출력을 중단시켜(중단하는 수단 및 기능은 스위치 작동을 가능하므로 스위치 작동수단의 도시는 생략 함), 종이(9)의 이송 중단시에도 고주파누름부(21)가 작동하여 연기발생과 화재위험의 우려를 원천적으로 제거하여 작업 안정성을 극대화시킨다.In addition, according to the present invention, the high-frequency unit 20 is enclosed in the high-frequency unit housing 23, thereby preventing environmental pollution and exposure to electromagnetic waves of the operator. In addition, the contamination of the inner space due to the high frequency housing 23 is discharged through the exhaust duct 24. An encoder 25 interlocked with the power transmission means 26 is added to the high frequency base roll 22 so that the output of the encoder 25 is recognized by a control unit It is judged that the feeding is stopped and the operation output of the high frequency pressing part 21 is stopped (the means for stopping and the function are not shown for the switch operating means since the switch operation is possible) The high frequency pressing portion 21 is actuated to remove the risk of smoke generation and fire risk, thereby maximizing work stability.

2;폼보드 원판 2-4;예열된 폼보드원판 8;종이롤 9;종이 9-1;요철면 9-2;고주파처리종이 10;히팅롤 20;고주파부 21;고주파 누름부 22;고주파 베이스롤 23;고주파부 하우징 24;배기덕트 25;엔코더 26;동력전달수단 30;예열부 31;제 1롤 32;제 2롤 33;예열하우징 34;아이들롤 40;냉각부 41;피딩롤 42;냉각챔버 50;절단부2, a foam board disk 2-4, a preformed foam board disk 8, a paper roll 9, a paper 9-1, an uneven surface 9-2, a high frequency treated paper 10, a heating roll 20, a high frequency section 21, a high frequency pressing section 22, A base roll 23, a high-frequency housing 24, an exhaust duct 25, an encoder 26, a power transmitting means 30, a preheating portion 31, a first roll 32, a second roll 33, a preheating housing 34, an idle roll 40, A cooling chamber 50,

Claims (4)

폼보드 원판을 열처리하여 종이를 표면에 합체시킨 폼보드판 제조장치에 있어서,
폼보드 원판(2)에 합체될 종이(9)의 합체면 부위를 고주파 가열시키는 고주파 누름부(21)와 고주파베이스롤(22)을 가지는 고주파부(20);
고주파부(20)에서 고주파 가열된 고주파 처리종이(9-2)와, 폼보드 원판(2)을 동시에 상하 이격시켜 예열하는 예열부(30); 및
예열부(30)를 통과한 예열된 폼보드 원판(2-4) 및 고주파 처리종이(9-2)를 합체하도록 가열 누름 작용하는 히팅롤(10)을 포함하며;
상기 고주파부(20)는 종이(9)가 통과하는 입출구를 가지는 고주파부하우징(23), 고주파누름부(21)에서 발생하는 연기 및 배기가스를 배출하는 배기덕트(24), 고주파베이스롤(22)의 회전축에 연동하여 이송 여부를 판단하는 엔코더(25), 고주파베이스롤(22)의 동력을 엔코더(25)에 전달하는 동력전달수단(26)을 포함하여 구성한 것을 특징으로 하는 발포폼보드판 제조장치.
A foam board manufacturing apparatus in which a foam board is heat-treated and a paper is incorporated on a surface,
A high frequency section (20) having a high frequency pressing section (21) and a high frequency base roll (22) for high - frequency heating the coplanar area of the paper (9) to be incorporated in the foam board original plate (2);
A preheating section 30 for preheating the high frequency treated paper 9-2 and the foam board disk 2 by vertically separating the high frequency treated paper 9-2 from the high frequency section 20 at the same time; And
And a heating roll 10 for heating and pressing to combine the preheated foam board plate 2-4 and the high frequency treated paper 9-2 that have passed through the preheating portion 30;
The high frequency section 20 includes a high frequency housing 23 having an inlet and an outlet through which the paper 9 passes, an exhaust duct 24 for discharging smoke and exhaust gas generated in the high frequency pressing section 21, And a power transmission means (26) for transmitting the power of the high frequency base roll (22) to the encoder (25), characterized in that it comprises an encoder Manufacturing apparatus.
제 1항에 있어서, 예열부(30)는 고주파처리종이(9-2)가 수평이동 가능하도록 수직으로 이격된 제 1 롤(31)과,
제 1 롤(31)을 지나 히팅롤(10)에 인가하는 제 2 롤(32), 및
상기 제 1 및 제 2 롤(31,32)을 수용하며 예열용 열을 인가하는 예열 하우징(33)을 포함하는 발포폼보드판 제조장치.
The preheating unit (30) according to claim 1, wherein the preheating unit (30) comprises a first roll (31) vertically spaced so that the high frequency treated paper (9-2)
A second roll 32 which is applied to the heating roll 10 through the first roll 31, and
And a preheating housing (33) for receiving the first and second rolls (31, 32) and applying heat for preheating.
폼보드 원판을 열처리하여 종이를 표면에 합체시킨 폼보드판 제조방법에 있어서,
폼보드 원판과 합체할 종이의 합체면 부위를 고주파 열처리하는 제 1 과정;
고주파 처리 종이와, 이 고주파 처리 종이와 합체할 폼보드 원판을 수평상의 상하 차이를 두고 이동토록 하면서 동시에 예열시키는 제 2 과정; 및
예열된 폼보드 원판 및 고주파 처리 종이를 히팅롤에서 가열 합체하는 제 3 과정을 포함하여 수행하고;
상기 제 1과정과 제 2과정 사이에서 고주파처리중 인지를 고주파베이스롤에 연동하는 엔코더의 출력이상이 있는지 여부로 판단하여, 엔코더출력이상으로 종이 이송이 중단된 상태이면 고주파누름부 작동을 오프시키는 안전과정을 더 수행함을 특징으로 하는 발포 폼보드판 제조방법.
A method of manufacturing a foam board board in which a foam board is heat treated to incorporate paper on a surface thereof,
A first process of high-frequency heat-treating the merged face portion of the foam board and the paper to be incorporated;
A second process of simultaneously heating the high frequency treated paper and the foam board original plate to be combined with the high frequency treated paper while moving them horizontally up and down; And
A third step of heating and coalescing the preheated foam board plate and the high frequency treated paper in a heating roll;
It is determined whether there is an abnormality in the output of the encoder interlocked with the high frequency base roll during the high frequency processing between the first and second processes and if the feeding of the paper is stopped above the encoder output, And further performing a safety process on the foamed foam board.
제 3항에 있어서, 예열시키는 제 2 과정은 예열하는 폼보드 원판을 중간에 두고 그 상하에 고주파 처리 종이를 동일 간격으로 이격 안치시킨 상태로 동시에 예열하는 것을 특징으로 하는 발포폼보드판 제조방법.



The foamed foam board manufacturing method according to claim 3, wherein the second step of preheating is a step of preheating the foamed board board in a state where the preformed foam board is placed in the middle and the high frequency treated paper is placed at the same interval.



KR1020130052603A 2013-05-09 2013-05-09 Apparatus for Polymer Foam Board Plate and method thereof KR101430871B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230023088A (en) * 2021-08-09 2023-02-17 공규택 A method for manufacturing a laminated detachable foam board with a constant thickness

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060114892A (en) * 2005-05-03 2006-11-08 장상준 Adhesion method of foam board and surface sheet, and product manufactured thereof
KR100824825B1 (en) 2007-02-09 2008-04-23 송영규 Apparatus for polystyrene foam board plate and method thereof
KR20090102395A (en) * 2008-03-26 2009-09-30 윤상구 Foam board maker
KR20120014451A (en) * 2010-08-09 2012-02-17 주식회사 진성통상 Apparatus for expanded foam board and method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060114892A (en) * 2005-05-03 2006-11-08 장상준 Adhesion method of foam board and surface sheet, and product manufactured thereof
KR100824825B1 (en) 2007-02-09 2008-04-23 송영규 Apparatus for polystyrene foam board plate and method thereof
KR20090102395A (en) * 2008-03-26 2009-09-30 윤상구 Foam board maker
KR20120014451A (en) * 2010-08-09 2012-02-17 주식회사 진성통상 Apparatus for expanded foam board and method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230023088A (en) * 2021-08-09 2023-02-17 공규택 A method for manufacturing a laminated detachable foam board with a constant thickness
KR102596047B1 (en) 2021-08-09 2023-10-31 공규택 A method for manufacturing a laminated detachable foam board with a constant thickness

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