KR101427983B1 - Method and apparatus for alignment - Google Patents

Abstract

An alignment method and apparatus are disclosed. According to a preferred embodiment of the present invention, an alignment error between the substrate and the mask is measured, and it is determined whether the measured alignment error is within a predetermined tolerance range. If the alignment error is within a predetermined tolerance range, And outputting a signal indicating normal when the magnitude error is within a preset tolerance range. The present invention also provides an alignment method for measuring a magnitude error of a mask, According to the present invention, the alignment state of the substrate and the mask can be measured simultaneously, and the size of the substrate and the mask can be simultaneously measured. Thus, the process can be simplified and the process time can be shortened. It is possible to find out and easily modify it.

Align, alignment, alignment, alignment, LCD, substrate, mask

Description

[0001] The present invention relates to a method and apparatus for alignment,

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram illustrating a configuration of an alignment apparatus according to a preferred embodiment of the present invention. Fig.

FIG. 2 illustrates a method of measuring an error when the size of the substrate and the mask are the same, and only one of the substrate or the mask is angled, in the alignment method according to the preferred embodiment of the present invention.

3 is a diagram illustrating a method of measuring an error when the size of the substrate and the mask are different from each other and only one of the substrate and the mask is misaligned in the alignment method according to the preferred embodiment of the present invention.

FIG. 4 is a diagram illustrating a method of measuring an error when the substrate and the mask are the same in size and the angle between the substrate and the mask is different from each other in the alignment method according to an exemplary embodiment of the present invention.

FIG. 5 illustrates a method of measuring an error when the size of the substrate is different from the size of the mask in the alignment method according to the preferred embodiment of the present invention and the angle between the substrate and the mask is different. FIG.

FIG. 6 is a flowchart showing a procedure in which an alignment method according to a preferred embodiment of the present invention is performed. FIG.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alignment method and apparatus, and more particularly, to an alignment method and apparatus that can be used, for example, for combining an LCD panel, a film and a substrate, or the like.

In order for a process to be normally performed in the combination of an LCD panel and a film and a substrate, a mask (a semiconductor substrate, a transparent substrate, etc.) as an object of the unit process and a mask spaced upward by a predetermined distance from the substrate are accurately aligned .

When alignment is performed between the substrate and the mask, alignment of the substrate and the mask is not accurately performed, problems such as electrode short-circuit and over-etching occur when the process is performed. Therefore, Is a very important process in the process of

On the other hand, in the conventional alignment method, an alignment mark is provided on a substrate and a mask such as another film or element to be bonded to the substrate, respectively, and alignment state between the substrate and the mask is checked through the alignment mark, Align the mask.

The accuracy of the alignment is measured, and the substrate and the mask are bonded or bonded together, and the size of the combined substrate and mask is measured to determine whether the size is defective or not.

Since the conventional alignment method can only measure the accuracy of alignment between the substrate and the mask using an allied mark, the alignment of the substrate and the mask and the measurement of the size of the substrate and the mask are separately performed, There is a problem in that the process time is increased.

Further, even when the sizes of the aligned substrate and the mask are poor, there is a problem in that it is difficult to modify the substrate or the mask because the substrate is coupled or bonded.

In order to solve the above-described problems, it is an object of the present invention to provide an alignment method and apparatus capable of simplifying a process and reducing a process time by simultaneously measuring the alignment state of the substrate and the mask, .

In addition, it is an object of the present invention to provide an alignment method and apparatus that can detect and correct substrate and mask sizes that are misaligned before bonding or coupling, even if they are poor.

Other objects of the present invention will become readily apparent from the following description of the embodiments.

According to an aspect of the present invention, there is provided an alignment method.

According to a preferred embodiment of the present invention, there is provided a method comprising: (a) measuring an alignment error between a substrate and a mask; (B) determining whether the measured alignment error is within a preset tolerance range; (C) measuring a size error between the substrate and the mask when the alignment error is within a predetermined tolerance range as a result of the determination in the step (b); (D) determining whether the measured magnitude error is within a preset tolerance range; And (e) outputting a signal indicating normal when the size error is within a predetermined tolerance range as a result of the determination in step (d).

In the step (c), if the alignment error is out of the predetermined tolerance range as a result of the determination in step (b), the substrate and the mask may be rearranged and the steps (a) and (c) may be performed again.

If it is determined in step (e) that the magnitude error is out of the predetermined tolerance range, a signal indicating failure may be output.

A process of combining the substrate and the mask may be performed when a signal indicating the normal state is outputted and a process of unloading the substrate and the mask when a signal indicating the failure is outputted is performed .

The tolerance range of the alignment error and the size error may be set in advance according to the material and the process of the substrate and the mask.

According to another aspect of the present invention, an alignment device is provided.

According to a preferred embodiment of the present invention, an alignment error measuring unit for measuring an alignment error between a substrate and a mask; A size error measuring unit for measuring a size error between the substrate and the mask; And a determination unit for comparing the error information measured by the alignment error measuring unit and the size error measuring unit with alignment accuracy and size precision information of a predetermined substrate and a mask to determine whether the error is defective or not An alignment device is provided.

The alignment device may further include an input unit for receiving alignment accuracy and size precision information of the substrate and the mask.

The alignment device may further include an output unit for outputting a signal indicating failure or normal determined by the determination unit to another device.

The output unit may output a signal for realigning the substrate and the mask when the alignment error is out of a predetermined tolerance range as a result of the determination by the determination unit. If out of the set tolerance range, the output may output a signal to reorder the substrate and the mask.

When a signal indicating normal is output from the output unit, a process of combining the substrate and the mask may be performed.

When a signal indicative of a defect is output from the output unit, a process of unloading the substrate and the mask may be performed.

The alignment error measuring unit and the size error measuring unit may measure the alignment error and the size error using an alignment mark displayed on the substrate and the mask.

According to another aspect of the present invention, there is provided a recording medium on which a program for implementing an alignment method is recorded.

According to a preferred embodiment of the present invention, a program of instructions executable by a digital processing apparatus is implemented tangibly so that an alignment method is implemented, and a program recorded thereon which can be read by a digital processing apparatus (A) measuring an alignment error between the substrate and the mask; (B) determining whether the measured alignment error is within a preset tolerance range; (C) measuring a size error between the substrate and the mask when the alignment error is within a predetermined tolerance range as a result of the determination in the step (b); (D) determining whether the measured magnitude error is within a preset tolerance range; And outputting a signal indicating that the magnitude error is within a predetermined tolerance range as a result of the determination in step (d).

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Like reference numerals are used for like elements in describing each drawing. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, It should be.

On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention.

The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and a duplicate description thereof will be omitted.

First, a configuration of an alignment device according to a preferred embodiment of the present invention will be described with reference to FIG.

1 is a view illustrating a configuration of an alignment device according to a preferred embodiment of the present invention.

1, an alignment apparatus 100 according to a preferred embodiment of the present invention includes an input unit 110, an alignment error measuring unit 120, a size error measuring unit 130, a determining unit 140, And an output unit 150.

The input unit 110 can receive alignment accuracy and size precision information of a substrate and a mask that can be determined according to various types of processes and materials.

In addition, the input unit 110 may receive alignment information and size information of a substrate and a mask to be measured.

The alignment error measuring unit 120 measures an alignment error between the substrate and the mask.

The alignment error measuring section 120 may measure the alignment error using, for example, an alignment mark displayed on the substrate and the mask, as is conventional.

The size error measuring unit 130 measures the size error of the substrate and the mask.

The size error measuring unit 130 may measure the size error using, for example, an alignment mark displayed on the substrate and the mask.

The method of measuring the alignment error and the size error will be described in more detail in FIG. 2 to FIG.

The determining unit 140 determines the alignment accuracy and size of the mask input through the input unit 110 or the preset mask and the error information measured by the alignment error measuring unit 120 and the size error measuring unit 130, ) Accuracy information is compared to judge whether it is defective or not.

The output unit 150 outputs a signal indicating a defect or a signal indicating a normal to the other apparatus, for example, a combination apparatus of a substrate and a mask in accordance with a determination as to whether or not a defect is caused by the determination unit 140. [

According to the configuration of the alignment apparatus 100, it is possible to determine at once a defect in alignment and size of the substrate and the mask, thereby reducing the number of processes.

In addition, it is possible to reduce unnecessary consumption of the substrate and the mask because the final alignment of the substrate and the mask or the determination of the alignment state and the defective state of the size state are performed before the coupling or coupling.

A measurement method for measuring and determining the alignment error and the size error at a time will be described with reference to FIGS. 2 to 5. FIG.

FIGS. 2 to 5 illustrate a method of measuring the alignment error and the size error for each case by dividing each case for the alignment error and the size error.

Hereinafter, Figs. 2 to 5 illustrate the measurement with respect to an axis generated up to an alignment mark around an arbitrary reference point.

This method can measure alignment state and size error of a plurality of substrates and masks at a time.

Hereinafter, the case where the substrate and the mask are two, respectively, and the measurement is performed with respect to the axis generated up to the alignment mark around an arbitrary reference point will be exemplified.

Let r be the distance from the arbitrary reference point to the alignment mark around an arbitrary reference point with respect to the axis generated up to the alignment mark, let the errors generated in the x and y axes be Dx and Dy, respectively, Let the angle be a and the error be Dt.

The values to be rearranged in the x and y axes, including angles, are referred to as Ex and Ey, respectively, and the total value to be rearranged is denoted by E, and the difference in size between the substrate and the mask is denoted by S1 and S2 .

FIG. 2 is a diagram illustrating a method of measuring an error when the size of the substrate and the mask are the same, and only one of the substrate or the mask is angled, in the alignment method according to the preferred embodiment of the present invention.

As shown in FIG. 2, the sizes of the substrate and the mask are not defective, and only one of the substrate and the mask is changed in angle.

As shown in FIG. 2, when the sizes of the substrate and the mask are the same and only one of the substrate and the mask is angled, Dx and Dy become 0 and Dt becomes a.

In this case, the values to be rearranged in the x-axis and the y-axis including angles are r * cos (a), Ey is r * sin (a), and E is (Ex ² + Ey ² ) ^1/2 .

Since there is no size error, S1 and S2 become 0 respectively.

3 is a diagram illustrating a method of measuring an error when the size of the substrate and the mask are different from each other and only one of the substrate and the mask is misaligned in the alignment method according to the preferred embodiment of the present invention.

As shown in FIG. 3, when the sizes of the substrate and the mask are different and only one of the substrate and the mask is angled, Dx and Dy become 0 and Dt becomes a.

In this case, the values to be rearranged in the x-axis and the y-axis including angles are r * cos (a), Ey is r * sin (a), and E is (Ex ² + Ey ² ) ^1/2 .

As shown in Fig. 3, S1 and S2, which are size errors, are s1 and s2, which are distance differences between the alignment marks.

FIG. 4 is a diagram illustrating a method of measuring an error when the substrate and the mask are the same in size and the angle between the substrate and the mask is different from each other in the alignment method according to the preferred embodiment of the present invention.

As shown in FIG. 4, when the size of the substrate and mask are the same, and Dx and Dy are respectively x and y when the angle between the substrate and the mask is different, Dt becomes a.

Therefore, in this case, the values to be rearranged in the x and y axes, including angles, are | Ex | Dx | + | r * cos (a) |, Ey is | Dy | + | r * sin (a) |, and E becomes (Ex ² + Ey ² ) ^1/2 .

Since there is no size error, S1 and S2 become 0 respectively.

5 is a view illustrating a method of measuring an error when the size of the substrate and the mask are different from each other and the angle between the substrate and the mask is different from each other in the alignment method according to the preferred embodiment of the present invention.

As shown in FIG. 5, when the sizes of the substrate and the mask are the same, and Dx and Dy are respectively x and y when the angle between the substrate and the mask is different, Dt becomes a.

Therefore, in this case, the values to be rearranged in the x and y axes, including angles, are | Ex | Dx | + | r * cos (a) |, Ey is | Dy | + | r * sin (a) |, and E becomes (Ex ² + Ey ² ) ^1/2 .

As shown in Fig. 3, S1 and S2, which are size errors, are s1 and s2, which are distance differences between the alignment marks.

On the other hand, alignment is performed using Dt, which is the error between Dx and Dy and the changed angle, which are errors in the x and y axes, respectively.

The values to be rearranged on the x and y axes, including angles, are determined as Ex and Ey, respectively, and the value to be reordered is used as E to determine whether the alignment has been properly performed.

In addition, it is possible to measure and determine the alignment, that is, the alignment state, and the error of the size at a time by determining whether the size error is permitted by using the size difference S1 and S2 between the respective substrates and the mask .

An alignment method according to a preferred embodiment of the present invention will be described with reference to a measurement method that enables measurement and determination of alignment error and size error at one time according to a preferred embodiment of the present invention.

FIG. 6 is a flowchart showing a procedure in which an alignment method according to a preferred embodiment of the present invention is performed.

As shown in FIG. 6, the alignment method according to the preferred embodiment of the present invention firstly assumes that the substrate and the mask are loaded in order to combine the substrate and the mask, respectively, Size precision information is input (S600).

The alignment error between the loaded substrate and the mask is measured (S602), and the measured alignment error value is compared with the input alignment accuracy value to determine alignment accuracy (S604).

If it is determined that the alignment accuracy is not good, that is, if the alignment accuracy is out of the tolerance range, the substrate and the mask are rearranged (S606) and the alignment error is measured again.

On the other hand, if it is determined that the alignment precision is good, that is, if the alignment accuracy is within the tolerance range, the size error is measured (S608).

The measured size error value is compared with the received size accuracy value to determine the size accuracy (S610).

As a result of the determination, if the size precision is not good, that is, if it is out of the tolerance range, a defective signal is output (S614), and if the size precision is good, .

6 shows an example of outputting a defective signal and a normal signal. However, if it is determined that the size accuracy is not good, for example, the substrate and the mask may be unloaded from the corresponding device, It is obvious that a process can be performed to combine the substrate and the mask.

According to this alignment method, it is possible to judge whether the alignment state of the substrate and the mask is bad or not, and the process can be reduced.

In particular, since at least one of the substrate and the mask is defective, it is possible to replace only the defective substrate or the mask because the final alignment of the substrate and the mask, And unnecessary consumption such as a mask can be reduced.

It will be apparent to those skilled in the relevant art that various modifications, additions and substitutions are possible, without departing from the spirit and scope of the invention as defined by the appended claims. The appended claims are to be considered as falling within the scope of the following claims.

As described above, according to the alignment method and apparatus of the present invention, the alignment state of the substrate and the mask can be measured and the size of the substrate and the mask can be simultaneously measured, which simplifies the process and reduces the processing time have.

Further, even when the sizes of the substrate and the mask aligned before the bonding or coupling are poor, it can be detected and easily corrected.

Claims (15)

(A) measuring an alignment error between the substrate and the mask; (B) determining whether the measured alignment error is within a preset tolerance range; (C) measuring a size error between the substrate and the mask when the measured alignment error is within a predetermined tolerance range as a result of the determination in step (b); (D) determining whether the measured magnitude error is within a preset tolerance range; And (E) outputting a signal indicating that the magnitude error is within a predetermined tolerance range as a result of the determination in step (d); , ≪ / RTI & The step (a) of measuring the alignment error is a step of measuring an alignment error E using a value Ex to be rearranged in the X-axis direction and a value Ey to be rearranged in the Y-axis direction, (Where Ex represents an error caused in the X axis direction by an angle formed between the substrate and the mask, Ey includes an error generated in the Y axis by an angle formed between the substrate and the mask, E = ((Ex ² + Ey ² )) ^1/2 ) The determining whether the measured alignment error is within a predetermined tolerance range may include determining an error generated in the X axis and the Y axis and an alignment error E including an error generated in the X axis and the Y axis by the angle Is within the tolerance range, The step (c) of measuring a size error between the substrate and the mask is a step of measuring the size error using the alignment mark displayed on the substrate and the mask, Wherein the size error is measured only when the alignment error is within a predetermined tolerance range, and the alignment error and the size error are measured in a single process. delete The method according to claim 1, In the step (e) And outputting a signal indicating that the magnitude error is out of a predetermined tolerance range as a result of the determination in step (d). The method according to claim 1, When a signal indicating the normal state is outputted, Wherein a process of combining the substrate and the mask is performed. The method of claim 3, When a signal indicating the failure is output, Wherein a process of unloading the substrate and the mask is performed. The method according to claim 1, Wherein the tolerance range of the alignment error and the size error is set in advance according to a material and a process of the substrate and the mask. An alignment error measuring unit for measuring an alignment error between the substrate and the mask; A size error measuring unit for measuring a size error between the substrate and the mask; And A determining unit for comparing the error information measured by the alignment error measuring unit and the size error measuring unit with alignment accuracy and size precision information of a predetermined substrate and a mask to determine whether the substrate is defective; , ≪ / RTI & The alignment error measuring unit measures an alignment error E using a value Ex to be rearranged in the X-axis direction and a value Ey to be rearranged in the Y-axis direction, (Where Ex represents an error caused in the X axis direction by an angle formed between the substrate and the mask, Ey includes an error generated in the Y axis by an angle formed between the substrate and the mask, E = ((Ex ² + Ey ² )) ^1/2 ) Wherein the determination unit determines whether the alignment error E including an error generated in the X axis and the Y axis and an error generated in the X axis and the Y axis within the tolerance angle is within an allowable error range, Wherein the size error measuring unit measures the size error using the alignment mark displayed on the substrate and the mask, Wherein the size error measuring unit measures the size error only when the alignment error is within a predetermined tolerance range, and measures the alignment error and the size error by one process. delete 8. The method of claim 7, Wherein the alignment device comprises: Further comprising an output section for outputting a signal indicating a failure or normal determined by the determination section to another apparatus. 10. The method of claim 9, If the alignment error is out of the predetermined tolerance range as a result of the determination, Wherein the output section outputs a signal to cause the substrate and the mask to be rearranged. 10. The method of claim 9, When the magnitude error is out of a predetermined tolerance range as a result of the determination, Wherein the output section outputs a signal to cause the substrate and the mask to be rearranged. 10. The method of claim 9, When a signal indicating normal is output from the output unit, Wherein a process of combining the substrate and the mask is performed. 10. The method of claim 9, When a signal indicating failure is output from the output unit, And a step of unloading the substrate and the mask is performed. delete A recording medium on which a program of instructions executable by a digital processing apparatus is implemented tangibly so that an alignment method is implemented and which can be read by a digital processing apparatus, (A) measuring an alignment error between the substrate and the mask; (B) determining whether the measured alignment error is within a preset tolerance range; (C) measuring a size error of the substrate and the mask when the measured alignment error is within a predetermined tolerance range as a result of the determination of step (b); (D) determining whether the measured magnitude error is within a preset tolerance range; And Outputting a signal indicating normal when the magnitude error is within a predetermined tolerance range as a result of the determination in step (d); , ≪ / RTI & The step (a) of measuring the alignment error is a step of measuring an alignment error E using a value Ex to be rearranged in the X-axis direction and a value Ey to be rearranged in the Y-axis direction, (Where Ex represents an error caused in the X axis direction by an angle formed between the substrate and the mask, Ey includes an error generated in the Y axis by an angle formed between the substrate and the mask, E = ((Ex ² + Ey ² )) ^1/2 ) The determining whether the measured alignment error is within a predetermined tolerance range may include determining an error generated in the X axis and the Y axis and an alignment error E including an error generated in the X axis and the Y axis by the angle Is within the tolerance range, The step (c) of measuring a size error between the substrate and the mask is a step of measuring the size error using the alignment mark displayed on the substrate and the mask, And measuring the size error only when the alignment error is within a predetermined tolerance range, and measuring the alignment error and the size error by one process.

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