KR101416910B1 - Polymer composite material having high thermal conductivity and manufacturing method thereof - Google Patents

Abstract

The thermally conductive polymer composite material of the present invention comprises a first polymer particle and a plurality of unit materials including a thermally conductive layer which surrounds the surface of the first polymer particle and has a higher thermal conductivity than that of the first polymer particle, And the thermally conductive layers of the unit body are connected to each other to constitute a heat transfer passage. When the thermally conductive polymer composite material is used, excellent thermal conductivity can be provided in spite of its light weight as compared with a conventional composite material, and it can be produced through a simple process such as hot pressing, And a polymer composite material capable of forming a heat transfer path in the polymer composite material.

Description

TECHNICAL FIELD [0001] The present invention relates to a thermally conductive polymer composite material, and a method of manufacturing the same. More particularly, the present invention relates to a thermally conductive high-

TECHNICAL FIELD The present invention relates to a thermally conductive polymer composite material and a method of manufacturing the same, and more particularly, to a thermally conductive polymer composite material having improved thermal conductivity using metal particles or non-metal-coated polymer particles and a method for manufacturing the same.

Thermal management is becoming more and more important in almost all industries related to lighting, automobiles, electronic components, solar cells, etc., and thermal management can minimize heat losses in the equipment and reduce the total amount of energy consumed by the equipment. The thermally conductive composite material is expected to be applicable to various industrial fields.

The LED lighting market is expected to grow steadily in the future as global lighting regulations for incandescent lamps of more than 100 W are being widely used in the lighting market. However, since the LED light source emits 80% of the input energy to heat, the LED itself has a characteristic of being weak against heat, so that not only the light efficiency is lowered due to the heat energy which is not emitted to the outside of the LED, . In order to solve these problems, a metal such as aluminum is used as a heat-radiating material, but it is heavy and has a large thermal expansion coefficient.

In the automotive market, the metal materials currently in use can not contribute to the weight reduction of the vehicle body and greatly degrade the degree of freedom in the design phase. In addition, since the loss of the control function due to the overheating of the motor unit, the engine unit, and various electronic control parts can be directly related to the safety of the automobile itself, when a plastic material is applied to a vehicle, The use of thermally conductive plastic heat dissipation materials is essential.

In the electronic device market such as a panel, especially in the TV market, a problem of heat generation is greatly treated. Therefore, in order to solve such a problem, a method of installing a heat dissipation fan or a heat sink has been used. However, in the case of a heat radiating fan, there is a problem due to noise and vibration, and in the case of a metal heat sink, there is also a problem of heavy weight. In addition, due to the miniaturization and high integration of the elements in the TV, excessive heat generated in the system can not be emitted to the outside, which may cause a decrease in system stability. Particularly, it is known that such deterioration of the heat generating performance causes malfunction and failure of the apparatus, and also has a great influence on the performance and the life span degradation.

A variety of studies have been conducted on thermally conductive polymer composites prepared by dispersing metallic or non-metallic fillers having excellent thermal conductivity in a polymer matrix to overcome problems such as low thermal conductivity, large weight, noise and vibration. . However, existing researches on metal or non-metal filler / polymer composites with excellent thermal conductivity have found that only when the content of the filler accounts for more than half of the volume and the percolation threshold occurs, There is a problem that it is possible to secure the degree of freedom. In addition, the polymer composite material mixed with the metal filler having excellent thermal conductivity has a limited range of application because of the weight of the composite material due to the high specific gravity of the metal.

On the other hand, the non-metallic filler having excellent thermal conductivity is regarded as a thermally conductive filler for a thermally conductive polymer composite material because the metal and heat conduction mechanism are different from each other and thus the electrical insulation property can be maintained even when the thermal conductivity is increased. However, since nonmetallic fillers having excellent thermal conductivity corresponding to these metals are mostly very expensive, application to thermoconductive polymer composite materials is still limited. In addition, since the fillers having excellent thermal conductivity have an anisotropic shape and have a high thermal conductivity only in the major axis direction of the surface, studies are being conducted to improve the thermal conductivity by controlling the direction of the filler.

That is, as the present technology, metal or non-metal filler / polymer composite material having excellent thermal conductivity has a limited range of application depending on characteristics of filler, content and shape.

More specifically, Korean Patent Laid-Open Publication No. 1997-0074867 discloses a production method for producing a composite having high thermal conductivity by polymerizing flake-type graphite particles having a volume fraction of 60% or more and a polymer binder under compression, Korean Patent Laid-Open Publication No. 2001-0099969 discloses a liquid crystal polymer composite material composition containing up to 60 vol% of a filler having a high aspect ratio and having a high aspect ratio. The composite material thus produced has a high thermal conductivity of about 22 W / mK or more FIG. Korean Patent Laid-Open Publication No. 2005-0104280 discloses a thermal management material for electronic packaging having high thermal conductivity and low thermal expansion coefficient by filling inorganic particles having different shapes in a polymer resin.

Most of the above-mentioned prior arts have proposed a method of improving the thermal conductivity of a composite material by dispersing one or two kinds of fillers having a good thermal conductivity, which have the concept of particles, into a polymer matrix in a high- A method for producing the same is disclosed. However, this method is provided for the percolation threshold which can drastically improve the thermal conductivity when the content of the filler reaches a certain level or more. By mixing the high-content filler, There is a problem that smooth processing can not be performed when a product is produced through such processes as the above. In addition, when a metal filler having a high thermal conductivity is mixed in a high amount, there arises a problem that the product has a large weight.

Therefore, in order to solve the problems with the prior art, studies have been conducted to fabricate a composite material having excellent thermal conductivity under a relatively small filler content. Korean Patent Laid-Open Publication No. 2009-0041081 discloses a method for manufacturing a composite material having a high thermal conductivity even at a low filler content. To this end, a fibrous metal filler, a plate-like metal filler, and a low melting point metal are used as a mixed filler, Melting point of the molten low melting metal maximizes contact between the other fillers and minimizes phonon scattering.

In order to lower the contact thermal resistance at the interface between the pillars, Korean Patent Laid-Open Publication No. 2011-0075245 discloses a method of impregnating spherical Ag particles and carbon nanotubes in a polymer matrix in a complex manner to lower the interface contact resistance between conductive particles, Thereby producing a composite material having a high thermal conductivity of up to 13.9 W / mK.

It is an object of the present invention to provide a thermally conductive polymer composite material which can provide excellent thermal conductivity in spite of its light weight as compared with conventional composite materials having improved thermal conductivity. It is another object of the present invention to provide a polymer composite material in which a heat transfer path is formed in a composite material by hot press forming a unit body of a polymer particle having a thermally conductive layer formed thereon and thermal conductivity is improved using the same.

In order to achieve the above object, a thermally conductive polymer composite material according to an embodiment of the present invention includes a first polymer particle and a second polymer particle surrounding the surface of the first polymer particle and having a thermal conductivity higher than that of the first polymer particle. A plurality of unit bodies including a thermally conductive layer are included, and the thermally conductive layers of the unit bodies are connected to each other to constitute a heat transfer path.

The thermally conductive polymer composite material may further include second polymer particles.

The second polymer particles may be contained in an amount of 0 to 10000 parts by weight based on 100 parts by weight of the unit.

Any one of the polymer particles selected from the group consisting of the first polymer particles, the second polymer particles, and combinations thereof may include a thermoplastic polymer.

The thermally conductive layer may comprise any one selected from the group consisting of metal, non-metal, and combinations thereof.

Any one polymer particle selected from the group consisting of the first polymer particle, the second polymer particle, and a combination thereof may have a diameter of 1 nm to 10 mm.

The thickness of the thermally conductive layer may be 1 nm to 1 mm.

The thickness of the heat transfer passage may be 1 nm to 2 mm.

Wherein the metal comprises any one selected from the group consisting of Al, Ag, Au, Cu, Ni, Sn, Pt, Si, Ge, In, Sb, Pb, Bi, Cd, Zn, Mo, Lt; / RTI >

Wherein the base metal is selected from the group consisting of CuO, Cu ₂ O, SiO ₂ , Fe ₂ O ₃ , Fe ₃ O ₄ , CaO, B ₂ O ₃ , B ₂ O, B ₆ O, Al ₂ O ₃ , BeO, ZnO, MgO, , SiN, BN, BCN, Carbon Nanotube (CNT), graphite, graphene, diamond, fullerene, carbon black and combinations thereof And < / RTI >

According to another embodiment of the present invention, there is provided a method of manufacturing a thermally conductive polymer composite material, including: preparing a first polymer particle, a thermally conductive layer surrounding the surface of the first polymer particle and having a higher thermal conductivity than the first polymer particle, And a composite material forming step of manufacturing a thermally conductive polymer composite material having a heat transfer path formed by hot pressing a plurality of the unit pieces in a mold.

The thermally conductive polymer composite material may further include second polymer particles.

In the composite material forming step, the second polymer particles may be included in a proportion of 0 to 10000 parts by weight based on 100 parts by weight of the unit body together with a plurality of the unit bodies to produce the thermoconductive polymer composite material.

Any one of the polymer particles selected from the group consisting of the first polymer particles, the second polymer particles, and combinations thereof may include a thermoplastic polymer.

The thermally conductive layer may comprise any one selected from the group consisting of metal, non-metal, and combinations thereof.

The thermally conductive layer may be formed by any one method selected from the group consisting of plating, spray coating, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, have.

Wherein the metal comprises any one selected from the group consisting of Al, Ag, Au, Cu, Ni, Sn, Pt, Si, Ge, In, Sb, Pb, Bi, Cd, Zn, Mo, Lt; / RTI >

Wherein the base metal is selected from the group consisting of CuO, Cu ₂ O, SiO ₂ , Fe ₂ O ₃ , Fe ₃ O ₄ , CaO, B ₂ O ₃ , B ₂ O, B ₆ O, Al ₂ O ₃ , BeO, ZnO, MgO, , SiN, BN, BCN, Carbon Nanotube (CNT), graphite, graphene, diamond, fullerene, carbon black and combinations thereof And < / RTI >

Any one polymer particle selected from the group consisting of the first polymer particle, the second polymer particle, and a combination thereof may have a diameter of 1 nm to 10 mm.

The thickness of the thermally conductive layer may be 1 nm to 1 mm.

The thickness of the heat transfer passage may be 1 nm to 2 mm.

The hot pressing may be direct hot pressing.

The temperature of the hot pressing may be higher than or equal to the glass transition temperature or the melting temperature of the polymer contained in any one of polymer particles selected from the group consisting of the first polymer particles, the second polymer particles, and a combination thereof.

Hereinafter, the present invention will be described in more detail.

In the present invention, terms including an ordinal number such as a first or a second are used only for the purpose of distinguishing one element from another, so that the elements are not limited by the term. That is, a component including an ordinal number is used in the same meaning as a component that does not include an ordinal number except for the purpose of avoiding confusion among the components, and the meaning of the component is not changed or reduced. For example, although the first polymer and the second polymer are distinguished from each other, the meaning of the polymer is not limited or reduced.

The thermally conductive polymer composite material according to an embodiment of the present invention is a polymer composite material having improved thermal conductivity including a unit body including first polymer particles and a thermally conductive layer, and a heat transfer passage formed by connecting the unit bodies.

The thermally conductive polymer composite material may be composed only of the unit pieces, and may further include second polymer particles together with the unit pieces. When the thermally conductive polymer composite material further comprises second polymer particles, the unit complexes and the second polymer particles may exist in the polymer composite material.

The polymer composite material may include the second polymer particles in an amount of 0 to 10,000 parts by weight based on 100 parts by weight of the monomer unit, and may include 0.1 to 10,000 parts by weight of the second polymer particles.

The polymer particle (hereinafter, the polymer particle means the first polymer particle and / or the second polymer particle) may include a thermoplastic polymer, or may be made of a thermoplastic polymer. When the polymer particles include a thermoplastic polymer having a melting temperature, the thermoplasticity of the polymer particles enables the hot press forming during the molding of the composite material, and the molding process of the composite material can be facilitated.

The polymer particles may have a diameter of 1 nm to 10 mm.

The shape of the polymer particle may be any one selected from the group consisting of a spherical shape, a plate shape, a needle shape, a rod shape, an amorphous shape, Lt; / RTI >

The thermally conductive layer may be formed to cover all or a part of the surface of the first polymer particle using a material having a higher thermal conductivity than the thermal conductivity of the polymer particle.

The thermally conductive layer may include any one selected from the group consisting of a metal, a non-metal, and a combination thereof, and may include any one selected from the group consisting of a metal, a ceramic, a carbon-based thermally conductive material, have.

The metal may be any one selected from the group consisting of Al, Ag, Au, Cu, Ni, Sn, Pt, Si, Ge, In, Sb, Pb, Bi, Cd, Zn, Mo, Wherein the ceramic is selected from the group consisting of CuO, Cu ₂ O, SiO ₂ , Fe ₂ O ₃ , Fe ₃ O ₄ , CaO, B ₂ O ₃ , B ₂ O, B ₆ O, Al ₂ O ₃ , BeO, ZnO, MgO, SiC, AlN, SiN, BN, BCN, and combinations thereof. The carbon-based thermally conductive material may be selected from the group consisting of carbon nanotubes (CNT), graphite, graphene, For example, diamond, fullerene, carbon black, and combinations thereof.

The thermally conductive layer constitutes a heat transfer passage when the thermally conductive polymer composite material is formed using the unit body. The thermally conductive layer composes a heat transfer path in the thermally conductive polymer composite material without being disconnected by the polymer particles, Can play a role.

The metal or base metal constituting the thermally conductive layer is preferably superior in thermal conductivity to the polymer constituting the polymer particles and can be selectively applied according to the specific application of the composite material and the performance required thereby. The material of the thermally conductive layer preferably includes Al, Ag, Au, Cu, Ni, Sn, Pt, Si, Ge, In, Sb, Pb, Bi, Cd, Zn, Mo, And most preferably, the thermally conductive layer may be made of Al, Ag, Au, Cu, Ni, Sn, In, or a combination thereof.

The unit body includes the first polymer particles and a thermally conductive layer surrounding the surfaces of the first polymer particles, and the unit bodies are formed into a plurality of units to constitute the thermally conductive polymer composite material of the present invention. In addition, the thermally conductive polymer composite material has thermally conductive layers included in the respective unit bodies connected to each other to form a heat conduction path. Through the heat conduction pathway, a small amount of metal or nonmetal can be used A polymer having thermal conductivity can be obtained.

The thickness of the thermally conductive layer in the unit body may be 1 nm to 1 mm. When the thermally conductive layer of the unit body has the thickness range, the thermally conductive property improving effect can be effectively obtained.

In the thermally conductive polymer composite material, the thickness of the heat transfer passage may be 1 nm to 2 mm.

The thermally conductive polymer composite material of the present invention can constitute a heat transfer path in which the thermally conductive layer is connected to each other in the thermally conductive polymer composite material by the method of manufacturing the composite material after forming the unit body, Can be minimized while maximizing the thermal conductivity. When such a thermally conductive polymer composite material is used, it is possible to provide a polymer composite material which has a relatively small weight and maximizes thermal conductivity.

Another method of manufacturing a thermally conductive polymer composite material according to another embodiment of the present invention includes a step of preparing a monomer and a step of forming a composite material.

The step of preparing the unit body may include the steps of preparing a first polymer particle and a thermally conductive layer surrounding the surface of the first polymer particle and having a higher thermal conductivity than that of the first polymer particle.

The thermally conductive polymer composite material may further include second polymer particles.

In the composite material forming step, the second polymer particles may be included in a proportion of 0 to 10000 parts by weight based on 100 parts by weight of the unit body together with a plurality of the unit bodies to produce the thermoconductive polymer composite material.

The detailed description of the first polymer particles, the second polymer particles, the thermally conductive layer, and the composition, content, size, and the like for the unit body is the same as that described in the thermally conductive polymer composite material of one embodiment of the present invention, .

The process for producing the unit body may be applied to a method for forming the thermally conductive layer on the surface of the first polymer particles. Specifically, the material for forming the thermally conductive layer may be made into a solution or a fine particle to coat the first polymer particles A method of preparing a plating solution, and plating the first polymer particles, but the present invention is not limited thereto. Preferably, the thermally conductive layer is formed by any one method selected from the group consisting of plating, spray coating, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, Lt; / RTI >

The composite material forming step includes a step of hot-pressing a plurality of the unit pieces in a mold to produce a thermally conductive polymer composite material having a heat transfer path.

The hot pressing may be direct hot pressing, and the hot pressing temperature may be higher than the glass transition temperature or melting temperature of the polymer contained in the polymer particles. When the temperature of the hot pressurization is higher than the glass transition temperature of the polymer contained in the polymer particles, the deformation of the polymer particles can be induced during the hot pressing process, and the composite material can be easily molded.

1 is a conceptual view of a method of manufacturing a thermally conductive polymer composite material according to an embodiment of the present invention. 1, the thermally conductive polymer composite material of the present invention comprises a plurality of unit bodies including a first polymer particle portion and a thermally conductive layer surrounding the first polymer particle, and the unit body is formed of a composite material The composite material can be manufactured by gradually moving from the molding step to the void space between the unit pieces. Particularly, when the first polymer particles are spherical, the first polymer particles included in the unit gradually change into a hexagonal shape (honeycomb shape) by the hot pressing process in the composite material forming step, The shape of the thermally conductive layer surrounding the polymer particles can also provide a heat transfer path that is gradually changed and connected to each other to efficiently transfer heat.

The method for producing a thermally conductive polymer composite material can be produced by a simple process using a polymer composite material having both a light weight and an excellent thermal conductivity.

The thermally conductive polymer composite material of the present invention can provide excellent thermal conductivity in spite of its light weight as compared with a conventional composite material having improved thermal conductivity and can be produced by a simple process of manufacturing a unit body and hot pressing the unit body So that it is possible to provide a polymer composite material capable of efficient heat transfer in a composite material.

1 is a conceptual view of a method of manufacturing a thermally conductive polymer composite material according to an embodiment of the present invention.
2 is a scanning electron microscope (SEM) image of the copper / polystyrene unit produced according to the first embodiment.
3 is a scanning electron microscope (SEM) image of the copper / polystyrene composite material prepared in Example 1. FIG.
4 is a photograph obtained from an energy dispersive X-ray spectroscope of a copper / polystyrene composite material manufactured in Example 1. Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

< Example  1: Copper and With polystyrene  Made Thermal conductivity  Production of polymer composite material>

1. Copper / Polystyrene ( Thermally conductive layer / First polymer particle) &lt; / RTI &gt;

1 g of polystyrene particles (Dynoseeds® TS 40, diameter 38 to 42 μm) manufactured by Microbead was acid-treated to remove impurities on the surface to prepare first polymer particles.

7 ml of a copper sulfate aqueous solution of copper sulfate (CuSO ₄ .5H ₂ O), 0.7 ml of a reducing agent, formaldehyde (HCHO) and 2.8 g of complexing agent ethylenediaminetetraacetic acid (C ₁₀ H ₁₆ N ₂ O ₈ ) Preparing an electroless copper solution, and immersing and stirring the first polymer particles in the electroless copper solution for 120 minutes to prepare a polystyrene particle (core / shell structure, copper / polystyrene) having a thermally conductive layer formed of copper And the thickness of the coated copper was increased by repeating the above process to prepare a thermally conductive layer having a thickness of 2 μm.

2. Copper / Polystyrene  Composite material manufacturing

The copper / polystyrene monomer was charged into a mold of Φ 12.6 composed of the body and the piston at the lower and upper ends, and hot press-molded at a temperature of 300 ° C. at a pressure of about 5.6 kgf / ㎠ to form a copper / polystyrene composite material And the composite material of Example 1 was prepared.

2 is a scanning electron microscope (SEM) image of the copper / polystyrene monomer prepared in Example 1, FIG. 3 is a scanning electron micrograph of a copper / polystyrene composite material prepared using the monomer, and FIG. This is a photograph obtained from an energy dispersive X-ray spectroscope of a composite material.

Referring to FIGS. 2 to 4, in the case of the composite material having the spherical particles of the first embodiment and the hot press molding of FIGS. 3 and 4, the hexagonal shape in which the void spaces between the unit pieces are not visible And a copper layer connected to each other is formed at the interface between the hexagonal polymer and the heat conduction path formed by connecting the thermally conductive layers to each other.

< Example  2: Copper and With polyphenylene sulfide  Made Thermal conductivity  Production of polymer composite material>

1. Copper / Polyphenylene sulfide ( Thermally conductive layer / First polymer particle) &lt; / RTI &gt;

1 g of polyphenylene sulfide particles (100 탆 in diameter) of Asia plastic Co. was treated with an acid to remove impurities on the surface to prepare first polymer particles.

7 ml of a copper sulfate aqueous solution of copper sulfate (CuSO ₄ .5H ₂ O), 0.7 ml of a reducing agent, formaldehyde (HCHO) and 2.8 g of complexing agent ethylenediaminetetraacetic acid (C ₁₀ H ₁₆ N ₂ O ₈ ) The first polymer particles were immersed in the electroless copper solution for 120 minutes and stirred to form a thermally conductive layer of polyphenylene sulfide particles (core / shell structure, copper / polyphenylene Sulfide) was prepared and the above procedure was repeated to produce a thermally conductive layer of copper having a thickness of 2 탆.

2. Copper / Polyphenylene sulfide  Composite material manufacturing

The copper / polyphenylene sulfide unit was charged into a mold of? 12.6 composed of a body and a piston at the lower and upper ends, and hot press molded at a temperature of 340 占 폚 at a pressure of about 5.6 kgf / .

< Example  3: Nickel and With polystyrene  Made Thermal conductivity  Production of polymer composite material>

1. Nickel / Polystyrene ( Thermally conductive layer / First polymer particle) &lt; / RTI &gt;

1 g of polystyrene particles (Dynoseeds® TS 40, diameter 38 to 42 μm) manufactured by Microbead was acid-treated to remove impurities on the surface to prepare first polymer particles.

A composition comprising 7 ml of a nickel sulfate aqueous solution of nickel sulfate (NiSO ₄ .6H ₂ O), 0.7 ml of a reducing agent, formaldehyde (HCHO) and 2.8 g of complexing agent ethylene diamine tetraacetic acid (C ₁₀ H ₁₆ N ₂ O ₈ ) And the first polymer particles were immersed in the electroless nickel solution for 120 minutes and stirred to prepare a polystyrene particle (core / shell structure, nickel / polystyrene) having a thermally conductive layer formed of nickel The above procedure was repeated to increase the thickness of the coated nickel to produce a unit having a thickness of 2 탆 of the thermally conductive layer made of nickel.

2. Nickel / Polystyrene  Composite material manufacturing

A nickel / polystyrene composite material was produced in the same manner as in the 2. copper / polystyrene composite material of Example 1 to obtain a composite material of Example 3.

< Example  4: Alumina and With polystyrene  Made Thermal conductivity  Production of polymer composite material>

1. Alumina / Polystyrene ( Thermally conductive layer / First polymer particle) &lt; / RTI &gt;

1 g of polystyrene particles (Dynoseeds® TS 40, diameter 38 to 42 μm) manufactured by Microbead was acid-treated to remove impurities on the surface to prepare first polymer particles.

0.5 g of alumina particles coated with the above polystyrene particles and stearic acid were charged into a stirring apparatus and stirred to prepare a monolithic particle (core / shell structure, alumina / polystyrene) having thermally conductive layers formed of alumina. The thickness of the thermally conductive layer in the unit body was 400 nm.

2. Alumina / Polystyrene  Composite material manufacturing

The alumina / polystyrene composite material was prepared in the same manner as in the production of the copper / polystyrene composite material of Example 1 except that the alumina / polystyrene monomer material of Example 4 was used as the monolithic material alone. The composite material of Example 4 was used .

< Example  5: Containing a copper layer Polystyrene  Particles (monomers) and Polystyrene  Composed of particles (second polymer particles) Thermal conductivity  Production of polymer composite material>

2 g of the copper / polystyrene particles prepared in the same manner as in the production of the copper / polystyrene (thermally conductive layer / first polymer particle) unit of Example 1 and 2 g of polystyrene particles (Dynoseeds ® TS 40, Microbead, 42 탆) were mixed and then charged into a mold and hot press-molded at a temperature of 300 캜 at a pressure of about 5.6 kgf / cm 2 to prepare a composite material of Example 5.

< Comparative Example  1: Copper particles and Polystyrene  Composite Fabrication of Particles>

1 g of copper particles (99%, spheroidal shape, diameter 10 탆) of Sigma Aldrich Co. and 0.72 g of polystyrene particles (Dynoseeds 占 TS 40, diameter 38 to 42 탆) of Microbead Co. were mixed and charged into a mold The composite material of Comparative Example 1 was produced by hot pressing at a temperature of 300 캜 at a pressure of about 5.6 kgf / cm 2.

< Comparative Example  2: Copper particles and Polyphenylene sulfide  Composite Fabrication of Particles>

1 g of copper particles (99%, spheroidal shape, diameter 10 탆) of Sigma-Aldrich Co. and 0.64 g of polyphenylene sulfide particles (100 탆 in diameter) of Asia plastic were charged into a mold, The composite material of Comparative Example 2 was prepared by hot pressing at a temperature of about 5.6 kgf / cm 2.

< Comparative Example  3: Alumina particles and Polystyrene  Composite Fabrication of Particles>

(99.5%, diameter &amp;le; 10 mu m) of Sigma Aldrich Co. and 1 g of polystyrene particles (Dynoseeds® TS 40, diameter: 38 to 42 μm) of Microbead Co. were charged into a mold, At a pressure of about 5.6 kgf / cm &lt; 2 &gt; to produce a composite material of Comparative Example 3.

< Measurement example : Example  And Comparative example  Thermal conductivity comparison results>

The thermal conductivities of the composite materials prepared in Examples 1 to 5 and the composite materials prepared in Comparative Examples 1 to 3 were compared. The composite materials of the above examples and comparative examples were processed to a thickness of 2 mm and the thermal diffusivity was measured based on the method of ASTM E 1461-92. The thermal conductivity was then calculated by multiplying the density by the specific heat, Are shown in Table 1.

Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Thermal conductivity
(W / mK) 26.14 29.38 12.5 3.12 14.89 0.37 0.54 0.18

As shown in Table 1, the thermal conductivity of the copper / polystyrene composite material prepared in Example 1 of the present invention was the same as that of Comparative Example 1 in which copper and polystyrenes were applied in the same manner due to an efficient heat- It was confirmed that it exhibits remarkably excellent thermal conductivity.

On the other hand, it was confirmed that the copper / polymer composite material prepared by the conventional method prepared in Comparative Example 1 and Comparative Example 2 exhibited a relatively low thermal conductivity, It is considered that the heat transfer of the copper present is relatively low because the heat transfer is reduced by the low thermal conductivity polymer. Also, it can be seen that the alumina / polymer composite material prepared in Comparative Example 3 has reduced thermal conductivity of the composite material due to alumina having lower thermal conductivity than copper.

In addition, the thermal conductivity of the copper-coated polyphenylene sulfide composite material prepared in Example 2 showed a higher thermal conductivity than that of the copper-coated polystyrene composite material provided in Example 1, which was higher than that of polystyrene It is considered that the composite material itself has higher thermal conductivity due to polyphenylene sulfide particles having high thermal conductivity.

Further, the thermal conductivity of the nickel-coated polystyrene composite material prepared in Example 3 was lower than that of the copper-coated polystyrene composite material provided in Example 1, which was lower than that of copper It is thought that nickel is applied.

The thermal conductivity of the alumina-coated polystyrene composite material prepared in Example 4 is inferior to that of the copper-coated polystyrene composite material provided in Example 1, which is lower than that of alumina having a lower thermal conductivity than copper This is because it is applied. However, when compared with the comparative example 3 constituted by the same material as the comparative example, the thermal conductivity was remarkably excellent.

The thermal conductivity of the copper-coated polystyrene particle (unit body) / polystyrene particle (second polymer particle) composite material prepared in Example 5 was lower than that of the copper-coated polystyrene composite material provided in Example 1 This is probably due to the fact that the heat transfer by copper in the composite material is reduced by the polystyrene particles not coated with copper. However, compared with the thermal conductivity of Comparative Example 1 manufactured by the conventional method, the thermal conductivity was remarkably excellent.

Referring to Table 1, the thermal conductivity of the metal coated polymer composite material prepared according to the present invention showed an improved thermal conductivity by providing an efficient heat transfer path by the thermally conductive layer formed on the surface of the particles. On the other hand, in the comparative example, it was found that the composite material of the metal and the polymer produced by the conventional method shows a relatively low thermal conductivity.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, Of the right.

1: first polymer particle 2: thermally conductive layer
3. Heat transfer passage 10: Unit
20: Thermoconductive polymer composite material

Claims (17)

A plurality of unit pieces including a first polymer particle and a thermally conductive layer surrounding the surface of the first polymer particle and having a higher thermal conductivity than the thermal conductivity of the first polymer particle,
Wherein the thermally conductive layers of the unit body are connected to each other to form a heat transfer passage
Wherein the first polymer particle comprises a thermoplastic polymer,
The thermally conductive layer may include any one selected from the group consisting of Al, Ag, Au, Cu, Ni, Sn, Pt, Si, Ge, In, Sb, Pb, Bi, Cd, Zn, Metal; Al ₂ O ₃ , CuO, Cu ₂ O, SiO ₂ , Fe ₂ O ₃ , Fe ₃ O ₄ , CaO, B ₂ O ₃ , B ₂ O, B ₆ O, Al ₂ O ₃ , BeO, ZnO, MgO, SiC, (BN), BCN, carbon nanotubes (CNT), graphite, graphene, diamond, fullerene, carbon black, and combinations thereof. A nonmetal comprising any one; And a combination thereof. The thermally conductive polymer composite material according to claim 1, The method according to claim 1,
Wherein the thermally conductive polymer composite material further comprises a second polymer particle comprising a thermoplastic polymer,
Wherein the second polymer particles are contained in an amount of 0 to 10000 parts by weight based on 100 parts by weight of the unit. delete delete 3. The method of claim 2,
Wherein one of the polymer particles selected from the group consisting of the first polymer particles, the second polymer particles, and combinations thereof has a diameter of 1 nm to 10 mm. The method according to claim 1,
Wherein the thickness of the thermally conductive layer is 1 nm to 1 mm. The method according to claim 1,
Wherein the thickness of the heat transfer passage is 1 nm to 2 mm. delete A step of preparing a unit body comprising a first polymer particle and a thermally conductive layer surrounding the surface of the first polymer particle and having a higher thermal conductivity than that of the first polymer particle, and
Forming a thermally conductive polymer composite material in which a plurality of the unit pieces are hot-pressed in a mold to form a heat transfer passage;
A method for producing a thermally conductive polymer composite material,
Wherein the first polymer particle comprises a thermoplastic polymer,
The thermally conductive layer may include any one selected from the group consisting of Al, Ag, Au, Cu, Ni, Sn, Pt, Si, Ge, In, Sb, Pb, Bi, Cd, Zn, Metal; Al ₂ O ₃ , CuO, Cu ₂ O, SiO ₂ , Fe ₂ O ₃ , Fe ₃ O ₄ , CaO, B ₂ O ₃ , B ₂ O, B ₆ O, Al ₂ O ₃ , BeO, ZnO, MgO, SiC, (BN), BCN, carbon nanotubes (CNT), graphite, graphene, diamond, fullerene, carbon black, and combinations thereof. A nonmetal comprising any one; And a combination thereof. The method of producing a thermally conductive polymer composite material according to claim 1, 10. The method of claim 9,
Wherein the thermally conductive polymer composite material further comprises a second polymer particle comprising a thermoplastic polymer,
Wherein the composite material forming step includes a step of preparing a thermally conductive polymer composite material including a plurality of the unit bodies and the second polymer particles in an amount of 0 to 10000 parts by weight based on 100 parts by weight of the unit material. delete 10. The method of claim 9,
The thermally conductive layer is formed by any one method selected from the group consisting of plating, spray coating, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, (Method for manufacturing thermally conductive polymer composite material). delete 11. The method of claim 10,
Wherein one of the polymer particles selected from the group consisting of the first polymer particles, the second polymer particles, and combinations thereof has a diameter of 1 nm to 10 mm. 10. The method of claim 9,
Wherein the thickness of the thermally conductive layer is 1 nm to 1 mm. 10. The method of claim 9,
Wherein the thickness of the heat transfer passage is 1 nm to 2 mm. 11. The method of claim 10,
The hot press is direct hot press,
Wherein the temperature of the hot pressing is not lower than a glass transition temperature or a melting temperature of the polymer contained in any one of polymer particles selected from the group consisting of the first polymer particles, the second polymer particles, and a combination thereof. Gt;

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