KR101416628B1 - Device and method for fabricating wire grid polarizer - Google Patents

Abstract

The present invention relates to a wire grid polarizer and an apparatus and a method for manufacturing the wire grid polarizer, and more particularly, to a wire grid polarizer manufactured by using a metal mold having a nano pattern and a copper electroplating process, ≪ / RTI >
That is, the present invention provides a method of manufacturing a semiconductor device, which includes a planar metal mold or a cylindrical metal mold with nanopatterns and a polymer material cured by ultraviolet rays or heat to form a resin pattern on a metal layer surface of the substrate, So that the resin pattern and the metal plating pattern are adhered to the transparent adhesive of the flexible substrate and transferred, thereby enabling the wire grid polarizer to be manufactured in a continuous process, and the manufacturing time and production cost can be greatly reduced. Wire grid polarizer and an apparatus and a method for manufacturing the same.

Description

Technical Field The present invention relates to a device and method for manufacturing a wire grid polarizer,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire grid polarizer, and an apparatus and a method for manufacturing the wire grid polarizer, and more particularly, to a wire grid polarizer manufactured using a metal mold having a nano pattern and a copper electroplating process, Apparatus and method.

In general, a polarizer is an optical element that extracts linearly polarized light having a specific vibration direction from non-polarized light such as natural light. A wire grid polarizer, which is one type of optical element, uses a conductive wire grid Refers to an optical element that produces polarized light.

Since the wire grid polarizer has higher polarization separation performance than other polarizers, it is used as a useful reflective polarizer in the wavelength region of the infrared region.

Typical conventional processes for producing such wire grid polarizers include a process of depositing metal on a substrate and a number of processes such as photoresist coating and photolithography, metal layer etch process, photoresist strip process, The manufacturing cost is increased.

In addition, a conventional process for producing wire grid polarizers is a process of manufacturing a polymer pattern by using a nanoimprint process on the surface of a polarizer on which a metal layer is deposited, using a process of dry-etching the polymer pattern by masking the polymer pattern, A process of forming a pattern using a polymer pattern on a surface thereof, and a process of forming a desired pattern by continuously applying a deposition process or a deposition and wet etching process are applied.

The prior art for manufacturing such a conventional wire grid polarizer is disclosed in U.S. Patent No. 7,605,883, U.S. Patent Publication No. 2011/0286094, and Korean Patent Registration Nos. 10-0643965 and 10-0922186.

However, since most of the conventional techniques are manufactured using a vacuum process such as a vapor deposition process because the process is complicated and the product yield is low, a continuous process is difficult and a production cost is greatly increased when the polarizer is manufactured.

Disclosure of the Invention The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, which comprises a planar metal mold or a cylindrical metal mold with nanopatterns and a polymer material cured by ultraviolet rays or heat, And the resin pattern and the metal plating pattern are bonded to and transferred to the transparent adhesive of the flexible substrate, so that the wire grid polarizer can be manufactured by a continuous process A manufacturing time and a manufacturing cost of the wire grid polarizer, and an apparatus and a method for manufacturing the wire grid polarizer.

According to an aspect of the present invention, there is provided a wire grid polarizer comprising: a flexible substrate coated with a transparent adhesive; A resin pattern formed by transferring a nano pattern of the mold and adhered on the transparent adhesive of the flexible substrate; A plating pattern formed in a space between the resin patterns by electroplating process and adhered to the transparent adhesive of the flexible substrate together with the resin pattern; And a control unit.

According to an aspect of the present invention, there is provided an apparatus for manufacturing a wire grid polarizer, comprising: a substrate; A metal layer deposited on the surface of the substrate; A resin layer applied to the surface of the metal layer; A flat mold having a nano pattern formed at regular intervals on one surface thereof; And the resin is filled between the nano patterns of the planar metal mold so that a resin pattern is formed on the metal layer and a plating pattern is formed between the resin patterns by electroplating. do.

According to an aspect of the present invention, there is provided a method of manufacturing a wire grid polarizer, comprising: applying a resin to a surface of a metal layer of a substrate; Laminating the nanopattern fabricated on one surface of the flat metal mold with a certain force on the resin layer so that the resin penetrates through the nanopatterns; A step of demolding a flat metal mold and transferring a resin pattern at a predetermined interval on a metal layer of the substrate; Conducting a plating process of applying an electric current through a metal layer of the substrate in the electroplating furnace to form a plating pattern grown from the metal layer in an empty space between the resin patterns; Adhering a transparent adhesive attached to one surface of the flexible substrate to the resin pattern and the plating pattern to peel the resin pattern and the electroplated pattern from the substrate toward the flexible substrate; And a control unit.

According to another aspect of the present invention, there is provided an apparatus for manufacturing a wire grid polarizer, comprising: a conveyor having a metal layer deposited on a surface thereof; First and second transfer substrate rotating rolls circulatingly rotating the conveyor together with the substrate disposed in contact with the conveyor and on which the metal layer is deposited; An electroplating tank disposed at a lower end of the conveyor such that a substrate on which a metal layer is deposited passes; A cylindrical mold having a structure in which nanopatterns are formed at regular intervals on a surface thereof and is rotatably disposed adjacent to the outside of the first transfer substrate rotating roll; A pattern transfer roll rotatably disposed on the outside of the second transfer substrate rotation roll so that a flexible substrate coated with a transparent adhesive is wound around the pattern transfer roll; And a control unit.

According to another aspect of the present invention, there is provided a method of manufacturing a wire grid polarizer comprising the steps of circulating a substrate by rotating a conveyor by rotating a substrate having a metal layer attached to the conveyor; Applying resin to the surface of the metal layer of the substrate from the resin supply means; When a resin-coated substrate passes through a cylindrical mold, a nano-pattern of the cylindrical mold presses the resin to form a resin pattern at regular intervals on the metal layer of the substrate; The substrate on which the resin pattern is transferred is continuously moved along the conveyor and is contained in the plating solution of the electroplating bath; Forming a plating pattern grown from a metal layer in an empty space between resin patterns by a electroplating process for applying an electric current through a metal layer of the substrate; The substrate on which the resin pattern and the plating pattern are formed is continuously circulated along the conveyor and passes between the second transfer substrate rotation roll and the pattern transfer roll; Transferring a resin pattern and a plating pattern from a substrate to a transparent adhesive of a flexible substrate through which the pattern transfer roll is wound and transferred; And a control unit.

According to another aspect of the present invention, there is provided an apparatus for manufacturing a wire grid polarizer, comprising: an electroplating vessel; A cylindrical metal mold having a structure in which a nano pattern and a plating metal layer are formed on a surface at regular intervals and is half-immersed in the plating liquid of the electroplating bath and rotated; A pattern transfer roll rotatably disposed on an upper side of a cylindrical mold so that a flexible substrate having a transparent adhesive applied thereon is wound thereon; And a control unit.

According to another aspect of the present invention, there is provided a method of manufacturing a wire grid polarizer, comprising: rotating a cylindrical mold half-immersed in a plating solution of an electroplating bath; A step of forming a plating pattern between the nano patterns of the cylindrical metal mold by performing electroplating using a cylindrical mold as a conductive layer; A step of rotating the pattern transfer roll connected to the upper side of the cylindrical mold; Passing a flexible substrate on which a transparent adhesive is applied between a cylindrical mold and a pattern transfer roll, and transferring a plating pattern from a cylindrical mold adhered to a transparent adhesive; And a control unit.

Through the above-mentioned means for solving the problems, the present invention provides the following effects.

First, unlike the conventional process of manufacturing a polarizer using a deposition, etching process, vacuum process, etc., it is possible to manufacture a polarizer by a continuous process using a planar or cylindrical nano metal mold and electroplating process, The unit price can be greatly reduced.

Second, the wire grid polarizer manufacturing process using a conventional deposition and etching process is difficult to ensure uniformity when applied to a large area. However, according to the present invention, by using the electroplating process, a plating pattern Lt; / RTI >

Thirdly, since the space between the metal patterns is empty in the pattern formed by the conventional process, the durability of the polarizer manufactured by the present invention is durable because the resin (polymer) pattern is filled between the metal patterns. It can provide excellent advantages.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a wire grid polarizer according to a first embodiment of the present invention, and an apparatus and a method for manufacturing the same.
FIG. 2 is a schematic view showing a wire grid polarizer according to a second embodiment of the present invention, and an apparatus and a method for manufacturing the same.
3 is a schematic view showing a wire grid polarizer according to a third embodiment of the present invention, and an apparatus and a method for manufacturing the wire grid polarizer.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a wire grid polarizer capable of simple and high production efficiency by using a flat or cylindrical nano metal mold and electroplating process, unlike the conventional wire grid polarizer manufacturing method using vacuum equipment such as deposition and etching, and an apparatus and a method for manufacturing the wire grid polarizer. .

First Embodiment

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a wire grid polarizer according to a first embodiment of the present invention, and an apparatus and method for manufacturing the same.

First, the substrate 10 on which the metal layer 12 is deposited is prepared. The metal layer 12 is deposited as a conductive layer for plating.

At this time, a resin layer 14 is formed on the surface of the metal layer 12 of the substrate 10.

The resin layer 14 is a material for transferring the nano-pattern, and resin or resin cured by ultraviolet rays is uniformly applied to the surface of the metal layer of the substrate 10.

Next, a stamp or a flat plate-like mold 20 in which a nano pattern 22 is machined at regular intervals on one surface and a nano pattern 22 of a stamp or a flat plate- And transferred onto.

That is, after the stamp or the nano patterns 22 of the flat metal mold 20 are laminated on the resin layer 14 with a certain force so that the resin layer 14 penetrates the nano patterns 22, The resin pattern 16 identical to the nano pattern 22 is transferred and formed on the metal layer 12 of the substrate 10 by demolding the metal mold 20. [

When the substrate 10 onto which the resin pattern 16 is transferred is immersed in the plating solution of the electroplating bath and current is applied through the metal layer 12 of the substrate 10, Metal atoms are grown from the metal layer 12 and plated.

When the plating pattern 18 is formed between the resin patterns 16 to a height equal to the height of the resin pattern 16, the substrate is separated from the plating liquid by the plating process.

Subsequently, the flexible substrate 30 on which the transparent adhesive 32 is applied is adhered onto the resin pattern 16 and the plating pattern 18, whereby the metal pattern 12 is removed from the substrate 10 on which the metal layer 12 is deposited, And the electroplating pattern 18 are peeled together.

1, a substrate 10 having a metal layer 12 is separated and a flexible substrate (not shown) is formed, as shown in the lower portion of FIG. 1, according to the apparatus and method for manufacturing wire grid polarizers according to the first embodiment of the present invention. The wire grid polarizer of the present invention in which the resin pattern 16 and the electroplating pattern 18 are bonded to each other through the transparent adhesive 32 is completed.

Second Embodiment

FIG. 2 is a diagram illustrating an apparatus and method for manufacturing a wire grid polarizer according to a second embodiment of the present invention.

First, a conveyor 40 having a substrate 10 on which a metal layer 12 is deposited and circulating and rotating by first and second transfer substrate rotary rolls 41 and 42 is provided so that the metal layer 12 Allowing the deposited substrate 10 to circulate with the conveyor 40 while attached to the surface of the conveyor 40.

The electroplating vessel 43 is disposed at the lower end of the conveyor 40 with the substrate 10 on which the metal layer 12 is deposited so that the metal layer 12 is deposited when the conveyor 40 circulates and rotates The substrate 10 is contained in the plating liquid of the electroplating bath 43.

A cylindrical metal mold 44 is disposed so as to be connected to the outside of the first transfer substrate rotation roll 40 with the substrate 10 having the metal layer 12 interposed therebetween. A pattern transfer roll 46 is disposed in a state of being connected with the substrate 10 having the metal layer 12 therebetween.

Particularly, a nano pattern 22 is formed on the surface of the cylindrical mold 44 at a predetermined interval, and the flexible substrate 30 coated with the transparent adhesive 32 is wound around the pattern transfer roll 46 .

On the other hand, a resin supply means 48 for applying resin on the metal layer 12 of the substrate 10 is disposed at a predetermined position above the upper end of the conveyor.

Hereinafter, a polarizer manufacturing method of the present invention based on the above-described structure will be described.

The substrate 10 having the metal layer 12 attached to the conveyor 40 is rotated together with the conveyor 40 by rotating the conveyor 40 by driving the first and second transfer substrate rotating rolls 41 and 42, .

Resin is applied from the resin supply means 48 to the surface of the metal layer 12 of the substrate 10 to form a resin layer 14 on the surface of the metal layer 12 of the substrate 10.

Subsequently, when the substrate 10 to which the resin is applied passes the cylindrical mold 44 connected to the first transfer substrate rotating roll 41, the nano pattern 22 of the cylindrical mold 44 causes the resin layer 14 The resin pattern 16 which is the same as the nano pattern 22 is formed on the metal layer 12 of the substrate 10.

Subsequently, the substrate 10 to which the resin pattern 16 has been transferred is continuously circulated along the conveyor 40 and is contained in the plating solution of the electroplating bath 43.

Therefore, when an electric current is applied through the metal layer 12 of the substrate 10, metal atoms are grown from the metal layer 12 in an empty space between the resin patterns 16 and plated. By this electroplating process, the resin pattern 16 The plating pattern 18 is formed to the same height as the height of the resin pattern 16. [

Subsequently, the substrate 10 on which the resin pattern 16 and the plating pattern 18 are formed is continuously circulated along the conveyor 40 to be transferred to the pattern transfer roll 46 connected to the second transfer substrate rotating roll 42 The film is wound around the pattern transfer roll 46 and is in tight contact with the transparent adhesive 32 of the flexible substrate 30 passing therethrough.

The resin pattern 16 and the plating pattern 18 formed on the metal layer 12 of the substrate 10 are adhered to the transparent adhesive 32 of the flexible substrate 30 and transferred.

That is, the resin pattern 16 and the plating pattern 18 are adhered to the transparent adhesive 32 of the flexible substrate 30 while being separated from the metal layer 12 of the substrate 10 and transferred.

The flexible substrate 30, to which the resin pattern 16 and the plating pattern 18 are adhered and transferred, is rolled and discharged to a predetermined place through the pattern transfer roll 46.

1 and FIG. 2, a flexible substrate 30 is bonded to the flexible substrate 30 via a transparent adhesive 32. The flexible substrate 30 is bonded to the flexible substrate 30 via a transparent adhesive 32, The wire grid polarizer of the present invention in which the resin pattern 16 and the electroplating pattern 18 are bonded is completed.

Third Embodiment

FIG. 3 is a diagram illustrating an apparatus and method for manufacturing a wire grid polarizer according to a third embodiment of the present invention.

The manufacturing apparatus according to the third embodiment of the present invention is a manufacturing apparatus according to the third embodiment of the present invention in which the cylindrical mold 44 of the second embodiment is directly submerged in the plating liquid of the electroplate plating tank 43, And the rolls 46 are directly connected to each other so as to form a simple roll-to-roll method.

Preferably, the cylindrical metal mold 44 is fabricated by forming a nano pattern 22 at regular intervals on the surface, and a metal layer for plating is formed over the entire surface.

Therefore, when the cylindrical mold 44 is rotated at a predetermined speed and current is applied through the metal layer deposited on the surface of the cylindrical mold, metal atoms are grown in the void space between the nano patterns 22 of the cylindrical metal mold 44 So that a plating pattern 18 is formed.

At this time, when the flexible substrate 30 coated with the transparent adhesive 32 is passed between the cylindrical mold 44 and the pattern transfer roll 46 while being wound around the pattern transfer roll 46, the cylindrical mold 44 The plating pattern 18 is peeled off and bonded to the transparent adhesive 32 of the flexible substrate 30.

The flexible substrate 30 on which the cylindrical mold 44 and the pattern transfer roll 46 are rotated in different directions and on which the transparent adhesive 32 is applied is pressed against the cylindrical mold 44, The plating pattern 18 is peeled from the cylindrical metal mold 44 while being adhered to the transparent adhesive 32 of the flexible substrate 30 and transferred.

The flexible substrate 30 on which the plating pattern 18 is adhered and transferred is rolled to a predetermined place through the pattern transfer roll 46 and discharged.

3, the electroplating pattern 18 is formed on the flexible substrate 30 through the transparent adhesive 32. The electroplating pattern 18 is formed on the flexible substrate 30, The bonded wire grid polarizer of the present invention is completed.

10: substrate
12: metal layer
14: Resin layer
16: Resin pattern
18: Plating pattern
20: Plate mold
22: nanopattern
30: flexible substrate
32: Transparent adhesive
40: Conveyor
41: first rotating substrate rotating roll
42: second transfer substrate rotating roll
43: Electroplating bath
44: Cylindrical mold
46: Pattern transfer roll
48: Resin feeding means

Claims (11)

delete delete delete delete delete delete A conveyor 40 on which an outer surface of the substrate 10 on which the metal layer 12 is deposited is adhered;
First and second transfer substrate rotating rolls 41 and 42 for circulating and rotating the conveyor 40 together with the substrate 10 placed in contact with the conveyor 40 and on which the metal layer 12 is deposited;
An electroplating bath (43) disposed at the lower end of the conveyor (40) so that the substrate (10) on which the metal layer (12) is deposited passes;
A cylindrical metal mold 44 having a structure in which nanopatterns 22 are formed on the surface at regular intervals, and is rotatably connected to the outside of the first transfer substrate rotating roll 40;
A pattern transfer roll (46) rotatably disposed adjacent to the outside of the second transfer substrate rotation roll (42) so that the flexible substrate (30) coated with the transparent adhesive (32) is wound therearound;
Wherein the wire grid polarizer is formed of a wire grid polarizer.
The method of claim 7,
And a resin supply means (48) for applying a resin on the metal layer (12) of the substrate (10) is disposed at an upper position of the upper end of the conveyor (40).
Circulating the conveyor 40 to circulate the substrate 10 together with the metal layer 12 attached to the conveyor 40;
Applying resin to the surface of the metal layer (12) of the substrate (10) from the resin supply means (48);
The nano pattern 22 of the cylindrical metal mold 44 presses the resin so that the metal pattern 12 of the substrate 10 has a resin pattern (16) is formed;
The substrate 10 to which the resin pattern 16 has been transferred continues to move along the conveyor 40 and is contained in the plating solution of the electroplating bath 43;
Forming a plating pattern 18 grown from the metal layer 12 in an empty space between the resin patterns 16 by an electroplating process for applying an electric current through the metal layer 12 of the substrate 10;
The substrate 10 on which the resin pattern 16 and the plating pattern 18 are formed is continuously circulated along the conveyor 40 and passes between the second transfer substrate rotary roll 42 and the pattern transfer roll 46 ;
The resin pattern 16 and the plating pattern 18 are adhered and transferred from the substrate 10 to the transparent adhesive 32 of the flexible substrate 30 which is wound and passed through the pattern transfer roll 46;
Wherein the wire grid polarizer comprises a plurality of wire grid polarizers.
An electroplating bath (43);
A cylindrical metal mold 44 having a structure in which a nano pattern 22 and a metal layer for plating are formed on the surface at regular intervals and is half-immersed and rotated in the plating liquid of the electroplating bath 43;
A pattern transfer roll (46) rotatably connected to the upper side of the cylindrical mold (44) so that the flexible substrate (30) coated with the transparent adhesive (32) is wound thereon;
Wherein the wire grid polarizer is formed of a wire grid polarizer.
Rotating a cylindrical metal mold (44) half-immersed in the plating liquid of the electroplating bath (43);
A step of forming a plating pattern 18 between the nano patterns 22 of the cylindrical metal mold 44 by electroplating with the cylindrical metal mold 44 as a conductive layer;
Rotating the pattern transfer roll (46) connected to the upper side of the cylindrical mold (44);
The metal mold 44 and the pattern transfer roll 46 are passed through the flexible substrate 30 coated with the transparent adhesive 32 and the plating pattern 18 is transferred from the cylindrical mold 44 to the transparent adhesive 32 Adhered and transferred;
Wherein the wire grid polarizer comprises a plurality of wire grid polarizers.

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