KR101407412B1 - Package body and container - Google Patents

Abstract

The present invention realizes a package with a simple structure that not only releases the gas generated from the contents to the outside but also can uniformly heat the contents and prevent the container from sinking after heating.

A package body (100) for sealing a contents (130) accommodated in a container by adhering a resin film (120) to a first adhesive portion (111) of an upper edge of the container (110) A through hole 113 passing through the container wall and a portion surrounding the through hole 113 are formed in the resin film 120 Shaped second adhesive portion 114 for weakly adhering to the lower surface of the first adhesive portion 114 and a second protrusion 115 protruding higher than the upper edge of the second adhesive portion 114 are formed on the upper surface of the first protrusion 112 . When the internal pressure of the container 110 is increased, the resin film 120 is expanded upward and the second adhesive portion 114 is released, so that the internal gas of the container 110 passes through the through hole 113, And is discharged to the outside.

Description

[0001] PACKAGE BODY AND CONTAINER [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a package for allowing gas generated from contents to be discharged to the outside of the container, and containers used for the package.

Foods such as lunch boxes and side dishes are in the form of a package sealed inside a container made of a resin to prevent contamination of foreign substances or to prevent deterioration of quality There are many things that are sold. Among these foods, many of them can be cooked by heating in a packed state by microwave range or the like. However, if the food is heated in the state of being sealed in the container, there is a fear that the container expands to rupture (rupture) due to water vapor generated in the food at this time. In addition, since fermented foods such as kimchi and the like produce carbonic acid gas as the fermentation proceeds, there is a possibility that the container may be ruptured without heating the container. In recent years, a container that can discharge water vapor or carbon dioxide gas generated from the contents to the outside in consideration of such actual conditions has been developed.

For example, Patent Document 1 discloses a flexible container (flexible container) having at least one through hole and a sheet-like pressure adjustment valve (pressure adjustment wherein the sheet-shaped pressure regulating valve is opened when the internal pressure of the flexible container becomes equal to or more than a predetermined value. However, in the automatic cooking package of Patent Document 1, in order to install a sheet-shaped pressure regulating valve, a flexible sheet separately formed from the flexible container is adhered (tacky) to the flexible container There is a need. For this reason, the automatic cooking package of Patent Document 1 is disadvantageous in that the manufacturing process is complicated and the manufacturing cost is increased.

In Patent Document 2, a through hole is formed in a lid, and a paper strip is wound around the container body and the lid so that the through hole is closed (closed). When heat is applied by a microwave oven or the like, So that the paper strip around the through hole can be pushed up. However, the packaging container of Patent Document 2 has a disadvantage that not only the manufacturing cost is increased because a paper strip is wound around the container body and the lid, but also the opening operation (opening job) becomes troublesome because the paper strip needs to be peeled off.

In Patent Document 3, there is disclosed a food processing apparatus including a container in which a protrusion is formed, a cooked food (cooked food) accommodated in the container, a resin film (heat treated) adhered to the upper end of the container side wall (Resin film), a through hole is formed through a surface (top surface) and a back surface of a top surface (top surface) of the protrusion, and the through hole is covered with the resin film, Quot; food contained in a packaging container ".

Patent Document 4 discloses a package body which is sealed by adhering a lower surface of a resin film to an upper edge of an opening portion (opening portion) of a container body containing contents, wherein a through hole is formed in the container wall of the container body, And the upper surface of the convex portion and the lower surface of the resin film are brought into close contact with each other without adhering to release the gas generated from the contents from the through hole to the outside And a package body for allowing the package to be used.

Although the food contained in the packaging container of Patent Document 3 or the package of Patent Document 4 is capable of releasing gas generated from the contents from the through holes formed in the container despite the relatively simple structure, And the like. That is, the food contained in the packaging container of Patent Document 3 or the package of Patent Document 4 is liable to stay in a localized state in which the gas generated in the container is locally heated, and when heated by a microwave oven or the like , The temperature difference easily occurred depending on the place. Such a temperature difference may cause heating unevenness in the contents, which may cause a decrease in the taste of food to be cooked by heating.

In addition, the food contained in the packaging container of Patent Document 3 or the package of Patent Document 4 tends to be in a state in which the internal pressure of the container is lower than the external pressure after the gas inside the container is discharged from the through hole, There is a fear that it will fall into. These defects are not limited to the food stored in the packaging container of Patent Document 3 or the package of Patent Document 4, but also to other packages such as the automatic cooking package of Patent Document 1 and the packaging container of Patent Document 2 It is not.

Patent Document 1: Japanese Patent Laid-Open Publication No. 6-329179

Patent Document 2: Japanese Patent Application Laid-Open No. 2000-344267

Patent Document 3: Japanese Utility Model Utility Model Publication No. 3-60279

Patent Document 4: JP-A-2003-221078

(Problem to be solved)

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a packaging structure capable of discharging gas generated from the contents to the outside of the container in a simple structure, And the gas is caused to move in the whole of the inside of the container so that the contents can be uniformly heated. It is also an object of the present invention to provide a package which is difficult to sink inward even after the gas inside the container is discharged from the through hole. It is also an object of the present invention to provide a container which can be suitably used for constituting such a package.

(Solution to Problem)

The above object is achieved by adhering (bonding) a lower surface of a resin film to a first bonding portion (first bonding portion) formed annularly along an upper edge of a container (container) (First protruding portion) protruding into the container and contacting the lower surface of the resin film is formed on the container wall (container wall), and the first protrusion A second annular bonding portion for weakly adhering a portion surrounding the through hole to the lower surface of the resin film and a second protruding portion projecting higher than the upper edge of the second adhering portion, When the inner pressure of the container is increased, the resin film is expanded upward to cause the second adhesive portion to fall, so that the gas inside the container is discharged through the through- The via is solved by providing a package which is characterized in that to release the container to the outside.

Accordingly, when the gas is discharged from the through hole formed in the container wall, the movement of gas generated in the container can be controlled by the second projection. Therefore, it is possible to cause the gas to move all over the inside of the container, thereby not only heating the contents uniformly but also efficiently discharging the gas inside the container. Further, when the resin film expanded upward by the internal pressure of the container is returned to its original state, the resin film can be temporarily (temporarily) supported by the second projection, It is also possible to cause natural inflow (natural inflow). Therefore, it is possible to prevent the container from sinking inward after the gas inside the container is discharged from the through hole.

Here, 'weak' in 'the second bonding part for weakly bonding to the lower surface of the resin film' means that the bonding strength of the resin film in the second bonding part is higher than that of the resin film in the first bonding part Which is lower than the adhesive strength. By weakly adhering the resin film to the second bonding portion in this way, when the inner pressure of the container is increased by heating the package, while maintaining the airtightness of the inside of the container, It is possible to allow the user to fall off. In the first bonding portion, the resin film is adhered with an adhesive strength so that it can not be peeled off unless it is intentionally (intentionally) peeled with a human hand in a normal case.

In the above-described package, the position at which the through hole is formed is not particularly limited, but it is preferable that the position is formed at a position apart from the upper edge (outer edge) of the container by 5 mm or more. Since the package body generally carries near the upper edge (outer edge) of the container, when the through hole is located near the upper edge (outer edge) of the container, when the package after heating is conveyed, There is a possibility that the heat generated from the heat source may easily come into contact with a finger of a person.

The position at which the second projection is formed is not particularly limited, but it is preferable that the position is located toward the center of the container when viewed from the through hole. As a result, the gas existing in the center of the container can be allowed to reach the through hole after bypassing the second protrusion, thereby making it possible to maintain the temperature inside the container more uniformly. The distance from the through hole to the second projecting portion is not particularly limited. However, if the through hole and the second projecting portion are too far apart, there is a fear that it is difficult to control the movement of the gas reaching the through hole. For this reason, the second projecting portion is usually disposed in a region having a radius of 30 mm or less from the center of the through hole.

The height from the front end (tip end) of the second bonding portion to the front end of the second projection is not particularly limited, but if it is excessively low, there is a fear that the movement of the gas in the second bonding portion can not be bypassed. On the other hand, if the height from the tip of the second adhesive portion to the tip of the second projecting portion is too high, a localized force tends to be applied to the resin film, which may easily break the resin film. Therefore, the height from the tip end of the second bonding portion to the tip end of the second projection is usually set to 0.1 to 3 mm.

It is also preferable that a slit is formed in the second projection. As a result, it is possible to easily introduce gas from the outside of the container into the inside of the container through the through hole, thereby preventing the container from sinking inward after heating. Therefore, it is also possible to form the container wall thinly. Therefore, it is easy to reduce the manufacturing cost of the container by reducing the amount of the material required for forming (molding) the container.

It is also preferable that the inside of the container is separated by the partition wall (boundary wall), and the first protrusion is formed continuously to the partition wall. Accordingly, the inside of the container can be separated into a plurality of compartments, and the contents can be accommodated in accordance with the type, size, and the like, so that a limited space inside the container can be efficiently used. It is also possible to increase the strength of the container. Further, in the case of the package in which the inside of the container is divided into the plurality of compartments as described above, a temperature difference easily occurs between the compartments at the time of heating, and the significance of employing the constitution of the present invention is further enhanced. Such a configuration is suitable when the foods such as lunch boxes and side dishes are accommodated as contents.

The above object is also achieved by a container in which a first adhesive portion for adhering a lower surface of a resin film is formed in an annular shape along an upper rim, the first protrusion protruding into the container and reaching a height equivalent to the upper edge of the container, And an annular second adhesive portion for adhering a portion surrounding the through hole to the lower surface of the resin film and a second protruding portion protruding higher than the upper edge of the second adhesive portion, Is formed on the upper surface of the first projecting portion. Such a container can be suitably used for the package.

(effect)

INDUSTRIAL APPLICABILITY As described above, according to the present invention, it is possible to realize a package having a small number of parts and a simple structure that can release the gas generated from the contents to the outside of the container. It is also possible to provide a package capable of generating gas movement throughout the container when the gas is discharged from the through hole formed in the container wall, thereby uniformly heating the contents. It is also possible to provide a container in which the gas in the container is hardly sinked inward after the gas is discharged from the through hole. It is also possible to provide a container which can be suitably used for constituting such a package.

1 is a perspective view showing an embodiment suitable for the package of the present invention.

2 is a perspective view showing an embodiment suitable for the container of the present invention.

Fig. 3 is a plan view of the container shown in Fig. 2 as viewed from above. Fig.

Fig. 4 is an enlarged view of the periphery of the left through hole in the container shown in Fig. 3; Fig.

Fig. 5 is a cross-sectional view showing a state in which the periphery of the left through hole is cut off on the Y-Y plane in the container shown in Fig. 4;

6 is a cross-sectional view showing a state in which the periphery of the left through hole in the package before the start of heating or immediately after the start of heating is cut off at the surface corresponding to the Y-Y plane in Fig.

7 is a cross-sectional view showing a state in which the periphery of the left through hole in the package after a while elapses from the start of heating is cut off at a plane corresponding to the Y-Y plane in Fig.

8 is a graph showing the results of measuring the temperatures (Ta, Tb) of water in the compartments (a) and (b) when the package of the present invention is heated by a microwave oven.

9 is a graph showing the results of measuring the temperatures (Ta, Tb) of water in the compartments (a, b) when the package of the comparative example was heated by a microwave oven.

Description of the Related Art [0002]

100: package body 110: container

111: first adhesive portion 112: first protrusion

113: through hole 114: second adhesive portion

115: second protrusion 116:

117: connection groove 120: resin film

130: Contents

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments suitable for a package of the present invention and a container (container) used therein will be described in more detail with reference to the drawings. 1 is a perspective view showing an embodiment suitable for the package 100 of the present invention. 2 is a perspective view showing an embodiment suitable for the container 110 of the present invention. Fig. 3 is a plan view of the container 110 shown in Fig. 2 as viewed from above. 4 is an enlarged view of the periphery of the left through hole 113 in the container 110 shown in Fig. 5 is a cross-sectional view showing a state in which the periphery of the left through hole 113 in the container 110 shown in Fig. 4 is cut along the Y-Y plane.

1. Overall structure of the package

As shown in Fig. 1, the package 100 of the present embodiment includes a first adhesive portion (first adhesive portion) formed annularly along the upper edge (outer edge) of the container (container) 110, (Bottom) of the resin film (resin film) 120 is adhered (adhered) to the container body 111 so that the contents 130 contained in the container 110 are sealed have. A first protrusion (first protrusion) 112 protruding into the interior of the container 110 and contacting the lower surface of the resin film 120 is formed in the container wall (container wall). A through hole 113 penetrating the container wall and a portion surrounding the through hole 113 are formed on the upper surface of the first protrusion 112 so as to be annularly attached to the lower surface of the resin film 120 And a second protruding portion 115 protruding higher than the tip of the second adhesive portion 114 are formed.

2. Contents

The kind of the contents 130 is not particularly limited, but it is preferable that sealing be required in order to maintain quality such as food. Among them, it is preferable to accommodate foods that generate gas such as water vapor or carbon dioxide gas.

Foods that generate water vapor are not particularly limited as long as they contain moisture (moisture). In addition to soup such as miso soup and stew, foods such as rice, fried rice, Noodles, meat dishes, vegetable dishes and fish dishes. The present invention relates to a food for microwave cooking which is intended to be cooked by heating in a microwave range, and is preferably used for cryopreserving (freezing) or refrigerating Do. Among them, the microwave cooking food which is frozen and stored is more likely to be uniformly heated by latent heat generated when condensation (condensation) of water vapor is controlled by controlling the movement of water vapor, Is suitable as the contents (130) of the body (100). The microwave cooking food which is frozen and stored is difficult to be heated because the ice portion is hardly heated by the dielectric heating (induction heating) when heated by the microwave oven. In contrast, since the water is melted and the water is easily heated, This is because heating unevenness is likely to occur depending on the place.

On the other hand, examples of foods that generate carbon dioxide gas include fermented foods such as kimchi and soybean paste (fermented foods). In the package 100 of the present embodiment, a box-shaped lunch box type is employed in the container 110, and the compartment a of the container 110 (see Fig. 3) And the compartments b to d of the container 110 accommodate different kinds of side dishes.

3. Container (Container)

The shape of the container 110 is not particularly limited because it differs depending on the type of the contents 130 and the like. As shown in Fig. 2, the container 110 of the present embodiment has a substantially box-like shape with an open upper side. The inside of the container is divided into a plurality of sections (a to d) by a partition wall (boundary wall) 116 as shown in Fig. Therefore, the contents 130 can be accommodated in different compartments (a to d) according to their types and the like. The volume (volume) of the container 110 is not particularly limited, but the container 110 of the present embodiment is such that the compartment a is 270 cc, the compartments b and d are 50 cc, and the compartment c is 130 cc There is a total of 500cc. The arrangement of the compartments a to d is not particularly limited, but it is preferable to arrange the compartments a to d as symmetrically as possible so that the inner shape of the container 110 is left-right symmetrical. This makes it easier to control the gas movement inside the vessel, so that it becomes easy to suppress the temperature difference between the sections a to d at the time of heating to be small. Also in the container 110 of the present embodiment, the sections a to d are arranged symmetrically.

An upper rim of the portion dividing the compartment a and the compartment b and an upper rim of the portion dividing the compartment a and the compartment c and an upper rim of the portion dividing the compartment a and the compartment c, the upper rim of the part dividing the section (b) and the section (d) and the upper rim of the section dividing the section (b) and the section (c) And a connection groove 117 communicating with each of the segments a to d is formed in the boundary wall 116. [ Therefore, the gas in the container can pass through the compartments, so that even when the package body 100 is heated by a microwave oven or the like, the temperature of each of the compartments (a to d) is easily maintained uniformly.

The material of the container 110 is not particularly limited as long as it can exhibit strength to such an extent that it can not be easily broken even when the contents 130 are accommodated therein. However, the material of the container 110 is excellent in productivity (productivity) and sealing Plastic is usually employed. Examples of the plastic used for the container 110 include a polyolefin resin such as polyethylene or polypropylene, a polyester resin, a polyamide resin, a polystyrene resin, polystyrene-based resins), polyvinyl chloride resins (polyvinyl chloride resins), and polyacrylonitrile resins (polyacrylonitrile resins). Among them, polypropylene is preferable because it is excellent in moldability, rigidity and heat sealability. When heat resistance (heat resistance) is required for the container 110, it is preferable to use polypropylene mixed with an inorganic filler such as talc. Accordingly, the contents 130 can be subjected to a retort sterilization treatment (retort sterilization treatment). In this case, the blending amount of the inorganic filler is usually set to 10 to 50 wt%. The molding method (molding method) of the container 110 is not particularly limited, and examples thereof include vacuum molding, injection molding, sheet molding, and the like.

Although the thickness of the container wall is not particularly limited, if the container 110 is too thin, the rigidity of the container 110 can not be ensured, and the container 110 may be greatly deformed when the internal pressure of the container 110 is raised. Therefore, the thickness of the container wall is usually set to 0.2 mm or more. The thickness of the container wall is preferably 0.3 mm or more, more preferably 0.4 mm or more. On the other hand, if the container wall is too thick, a large amount of material is required for the container 110, and the manufacturing cost of the container 110 is increased. Therefore, the thickness of the container wall is usually set to 1.2 mm or less. The thickness of the container wall is preferably 0.8 mm or less, more preferably 0.6 mm or less. In the container 110 of the present embodiment, the thickness of the container wall is 0.4 mm.

4. First bonding portion (first bonding portion)

The first adhesive portion 111 is not particularly limited as long as it is formed in an annular shape along the upper edge (outer edge) of the container 110, and may be formed flat. In the container 110 of the present embodiment, as shown in Fig. 2, convex portions are formed along the upper edge (outer edge) of the container 110. Fig. The lower surface of the resin film 120 can be easily adhered along the first adhesive portion 111 with a uniform adhesive strength. The container 110 of the present embodiment has a substantially semicircular shape so that the first adhesive portion 111 is formed in a substantially semicircular shape. The shape of the convex portion formed on the first adhesive portion 111 is not particularly limited, So that it is difficult to form a wrinkle on the resin film 120 in the periphery. The height H ₁ (see FIG. 5) of the convex portion formed on the first bonding portion 111 is not particularly limited, but is about 1 mm in the container 110 of the present embodiment.

The resin film 120 may be adhered to the first adhesive portion 111 by using an adhesive agent but it is preferable to use a heat adhesive or vibration welding It is preferable that the resin film 120 and the container 110 are fused by vibration welding. The bonding strength of the resin film 120 in the first bonding portion 111 is not particularly limited as long as it is higher than the bonding strength of the resin film 120 in the second bonding portion 114. However, The package 100 is adhered with an adhesive strength so that it can be easily peeled off with a hand of a person immediately after being heated by a microwave oven or the like. However, when the package 100 is at room temperature, Of the adhesive strength of the adhesive layer.

5. First protrusion (first protrusion)

The first protrusions 112 may be formed in only one place in one container 110, but it is preferable that the first protrusions 112 are formed at a plurality of places as shown in Fig. As a result, it is possible to form the through holes 113 at a plurality of locations, so that the gas inside the container can be more efficiently discharged (discharged) to the outside of the container. The arrangement of the first protrusions 112 is not particularly limited, but the arrangement of the first protrusions 112 at symmetric positions as much as possible in the arrangement of the compartments (a to d) is not limited to the temperature difference between the compartments (a to d) It is preferable because it is easy to suppress less. In the container 110 of the present embodiment, the first projecting portions 112 are provided at both ends (the left end portion and the right end portion in Fig. 3) / RTI >

The height of the top surface of the first projecting portion 112 is set to be substantially equal to or slightly lower than that of the first adhesive portion 111. The first protrusion 112 may be configured to protrude upward from the bottom wall of the container 110. The first protrusion 112 may be formed on the side wall of the container 110 May protrude inward. The first protrusion 112 of this type can be easily formed, for example, when the container 110 is vacuum-formed. In the container 110 of the present embodiment, as shown in FIG. 2, a container wall formed by the bottom wall and the side wall of the container 110 is protruded upward from the inside of the container 110 . The first projection 112 is formed continuously with the boundary wall 116, so that the first projection 112 can also function as a boundary. Therefore, the space inside the container can be used without waste.

6. Through-hole

In the container wall forming the upper surface of the first projecting portion 112, a through hole 113 is formed in the vertical direction as shown in Fig. The position of the through hole 113 is not particularly limited as long as it is the upper surface of the first projecting portion 112. If the through hole 113 is formed at a position separated by 5 mm or more from the upper edge (outer edge) desirable. Since the package body 100 generally holds and conveys near the upper edge (outer edge) of the container 110, when the through hole 113 is close to the upper edge (outer edge) of the container 110 , And there is a fear that the heat released from the through hole 113 when the package body 100 is heated is brought into contact with the fingers. The through hole 113 is preferably 10 mm or more away from the upper edge (outer edge) of the container 110 so as to deviate from the center, and more preferably 15 mm or more. In the container 110 of the present embodiment, a through hole 113 was formed at a position 20 mm away from the upper edge (outer edge) of the container 110 so as to deviate from the center.

7. Second bonding portion (second bonding portion)

The second adhesive portion 114 is not particularly limited as long as it is annularly formed around the through hole 113 on the upper surface of the first projecting portion 112 and may be formed flat. In the container 110 of the present embodiment, as shown in Fig. 2, a convex portion is formed in the second bonding portion 114. [ The lower surface of the resin film 120 can be easily adhered to the second adhesive portion 114 with a uniform adhesive strength. The cross-sectional shape of the convex portion formed on the second bonding portion 114 is not particularly limited. However, in the container 110 of the present embodiment, like the first bonding portion 111, it has a substantially semicircular shape. The height H ₂ (see FIG. 5) of the convex portion formed on the second bonding portion 114 is not particularly limited, but is about 0.4 mm in the container 110 of the present embodiment. The diameter of the convex portion of the second adhesive portion 114 is not particularly limited but is about 6 mm in the container 110 of the present embodiment and the through hole 113 and the second protrusion 115 So that the convex portion passes.

The resin film 120 may be adhered to the second adhering portion 114 with an adhesive, but it is preferable that the resin film 120 is fused by heat welding or vibration welding similarly to the first adhering portion 111. [ The bonding strength of the resin film 120 in the second bonding portion 114 is not particularly limited as long as it is lower than the bonding strength of the resin film 120 in the first bonding portion 111. [ As a method for lowering the bonding strength of the second bonding portion 114 to the bonding strength of the first bonding portion 111, for example, when the resin film 120 is thermally fused, the second bonding portion 114 The sealing temperature and the sealing pressure in the first adhesive section 111 are made lower than the sealing temperature and the sealing pressure in the first adhesive section 111 or the sealing area A method of making the area smaller than the area of adhesion in the attaching portion 111 is exemplified.

8. Second protrusion (second protrusion)

The second protrusion 115 is not particularly limited as long as it can control the movement of the gas reaching the through hole 113. The second protrusion 115 is formed substantially perpendicular to the radial direction of the through hole 113 It is preferable that the shape of the wall (wall) is as follows. This makes it possible to more reliably control the gas movement inside the container. In the container 110 of the present embodiment, as shown in Fig. 2, a wall-shaped second projection 115 perpendicular to the radial direction of the through hole 113 is formed in a substantially half-moon shape . The second projection 115 is disposed toward the center of the container 110 when viewed from the center of the through hole 113. When this reason, it is to be reached in the through hole 113 after bypass (迂回), the second projection 115, the gas in the vessel, the internal vessel the gas to be released into the container outside, large gas inside the container So that movement can be generated.

The distance from the through hole 113 to the second protrusion 115 is not particularly limited. However, if the through hole 113 and the second protrusion 115 are too close to each other, There is a fear that smooth adhesion can not be obtained. Therefore, the second projection 115 is normally arranged in a region of a radius of 5 mm or more from the center of the through hole 113. It is more preferable that the second projection 115 is disposed in an area of 7 mm or more in radius from the center of the through hole 113. On the other hand, if the through hole 113 and the second protrusion 115 are too far apart, it is difficult to control the movement of the gas reaching the through hole 113, so that a deviation occurs in the temperature inside the container 110 There is a possibility that it becomes easy to become. For this reason, the second projection 115 is usually disposed in a region of a radius of 30 mm or less from the center of the through hole 113. [ The second protrusion 115 is preferably arranged in a region of a radius of 20 mm or less from the center of the through hole 113, and more preferably in a region of a radius of 15 mm or less. In this embodiment, the second projection 115 is formed at a position about 10 mm away from the center of the through hole 113.

The height H ₃ (see FIG. 5) from the tip of the second adhesive 114 to the tip of the second projection 115 is not particularly limited, , The second bonding portion 114 may not be able to bypass the movement of the gas. Therefore, the height H ₃ is set to 0.1 mm or more in a normal case. The height H ₃ is preferably 0.3 mm or more, more preferably 0.5 mm or more. On the other hand, if the height H ₃ from the tip of the second adhesive portion 114 to the tip of the second protrusion 115 is too large, a local force tends to be applied to the resin film 120, The film 120 may be easily broken. Therefore, the height from the tip end of the second bonding portion to the tip end of the second projection is set to 3 mm or less in a normal case. The height (H ₃ ) is preferably 2 mm or less, more preferably 1 mm or less. In the container 110 of the present embodiment, the height H ₃ is 0.6 mm.

9. Slit

However, in the container 110 of the present embodiment, as shown in Fig. 4, a slit is formed in a substantially central portion in the longitudinal direction of the second projecting portion 115. As shown in Fig. Therefore, when the resin film 120, which has expanded upward due to the release (release) of gas from the through hole 113 and the internal pressure of the container 110 is lowered, returns to the original state, (Natural flow) of the gas into the container (arrow C in Fig. 4) so that deformation of the container 110 after heating can be prevented. The slits may be formed in only one place with respect to one second projection 115, or may be formed at a plurality of places in one second projection 115.

The width of the slit is not particularly limited because it varies depending on the distance from the through hole 113 to the second projection 115, the volume of the container 110, and the like. However, if the width of the slit is excessively narrow, there is a fear that it is difficult to introduce the external gas of the container 110 into the interior of the container 110 when the resin film 120 returns to its original state. Therefore, the width of the slit is usually set to 0.5 mm or more. The width of the slit is preferably 1 mm or more, more preferably 1.5 mm or more. On the other hand, if the width of the slit is too wide, there is a fear that the internal gas movement of the container 110 can not be controlled by the second projection 115. Therefore, the width of the slit is usually set to 5 mm or less. The width of the slit is preferably 4 mm or less, more preferably 3 mm or less. In the container 110 of the present embodiment, the width of the slit is about 2 mm.

10. Resin film (resin film)

The material of the resin film 120 is not particularly limited, and various resins can be used. The resin film 120 may be a single layer film or a multilayer film. Among them, a multi-layer film in which a heat seal layer is formed on a resin layer (resin layer) extending in two axes is suitable as the resin film 120. This kind of multilayer film is less deformed by heat, so it can withstand heating by a microwave oven, and is also excellent in heat resistance. The resin film 120 in this embodiment is formed of a base layer (base layer) made of biaxially oriented polypropylene, an oxygen barrier resin layer (oxygen barrier resin layer) made of polyacrylonitrile resin, And a heat seal layer formed thereon. The lower surface (heat seal layer) of the resin film 120 is thermally welded to the first bonding portion 111 formed in an annular shape along the upper edge of the container 110.

The thickness of the resin film 120 is not particularly limited, but if it is too thin, the resin film 120 may be easily broken. Therefore, the total thickness of the resin film 120 is set to 30 μm or more in the ordinary case. The total thickness of the resin film 120 is preferably 55 占 퐉 or more, more preferably 60 占 퐉 or more. On the other hand, if the resin film 120 is too thick, the resin film 120 hardly expands outward even if the internal pressure of the container 110 rises, and the second adhering portion 114 may be difficult to fall off. Therefore, the total thickness of the resin film 120 is set to 80 μm or less in the ordinary case. The total thickness of the resin film 120 is preferably 70 mu m or less, more preferably 65 mu m or less. The total thickness of the resin film 120 of this embodiment is 60 mu m.

11. Operation (Operation)

Next, the operation when the package body 100 is heated by a microwave oven will be described. 6 is a cross-sectional view showing a state in which the periphery of the through hole 113 on the left side in the package body 100 before the start of heating or immediately after the start of heating is cut off at a plane corresponding to the Y-Y plane in Fig. Fig. 7 is a view showing a state in which the periphery of the through hole 113 on the left side in the package body 100 after a while elapses from the start of heating is cut off at the plane corresponding to the Y-Y plane in Fig.

6, the resin film 120 is adhered to the second adhering portion 114 and the through hole 113 is adhered to the resin film 120 As shown in Fig. The gas inside the container flows naturally between the high temperature zone and the low temperature zone through the connection groove 117 formed in the upper edge of the partition wall 116, So that the flow of water vapor can be ensured between the respective compartments. Therefore, a large temperature difference does not occur in the contents 130 accommodated in the respective compartments.

When a certain period of time elapses from the start of heating of the package body 100, water vapor is generated from the contents 130 and the internal pressure of the container 110 starts to rise. The resin film 120 starts to expand upward due to the internal pressure of the container 110. [ When the expansion of the resin film 120 reaches the limit, the resin film 120 is released from the weakly adhered second adhesive portion 114 so that the inside of the container and the outside of the container are covered with the through hole 113 ). ≪ / RTI > In the first bonding portion 111 which is strongly adhered, the resin film 120 is still adhered.

When the inside of the container and the outside of the container are communicated by the through hole 113, the gas inside the container is discharged to the outside of the container through the through hole 113 (arrow D in FIG. The gas discharged to the outside of the container is allowed to reach the through hole 113 by bypassing the second protrusion 115 in the inside of the container as indicated by the arrows A and B in Fig. , And when the gas is discharged from the through hole 113, a large amount of gas is caused to move in the entire inside of the container. Therefore, it becomes easy to maintain the temperature of the contents 130 contained in the compartments uniformly.

However, if the through hole 113 is clogged immediately after the gas is discharged from the through hole 113, the internal pressure of the container 110 becomes lower than the external pressure due to condensation or contraction of the gas inside the container, There is a fear that the container 110 after heating is dented into the inside. However, in the package 100 of the present invention, even after the gas is discharged from the through hole 113, the resin film 120 around the through hole 113 is supported by the second projection 115. Therefore, the gas outside the container is naturally introduced into the container through the through hole 113 again, so that the internal pressure of the container 110 is not significantly lowered after the heating of the package 100. The gas introduced into the container can be quickly reached to the center of the container 110 by passing through not only the periphery of the through hole 113 but also the slit formed in the second projection 115 (C)). Therefore, the depression of the container 110 after heating can be more reliably prevented.

12. Experiments

In order to demonstrate that the package body 100 of the present invention can uniformly heat the contents 130, the package body 100 containing water as the contents 130 is heated for 6 minutes in a microwave oven , The temperature (Ta) of the water in the section (a) and the temperature of the compartment (a) in the section (a) (see FIG. 3) (referred to as Tb) of the water of step (b). 90 cc of water was introduced into compartment (a), 30 cc of water was introduced into compartments (b, d), and 50 cc of water was introduced into compartment (c). The output of the microwave oven was set at 500W. In addition, as a comparative example, the same measurement was performed on a package using the same container as the container 110 shown in Fig. 3, except that the second projection 115 was not formed.

8 is a graph showing the results of measuring the temperatures (Ta, Tb) of water in the compartments (a, b) when the package 100 of the present invention is heated by a microwave oven. 9 is a graph showing the results of measuring the temperatures (Ta, Tb) of water in the compartments (a, b) when the package of the comparative example was heated by a microwave oven. In FIGS. 8 and 9, the elapsed time is the elapsed time from the start of heating in the microwave oven, and To is the air temperature outside the container.

8, in the package 100 of the present invention, the temperature Ta of the water in the compartment (a) and the temperature (Tb) of water in the compartment (b) are 100 It is found that they are approximately the same in the vicinity of the road. On the contrary, FIG. 9 shows that in the package according to the comparative example, the temperature of the water in the section (a) is reduced to about 250 seconds until the temperature Tb of the water in the section (b) becomes approximately equal. It was also found that the package of the present invention had a smaller difference between the temperature Ta and the temperature Tb than the package of the comparative example. From the above measurement results, it was found that the package body 100 of the present invention can heat the contents 130 uniformly.

Claims (8)

The lower surface of a resin film is adhered (bonded) to a first bonding portion (first bonding portion) formed annularly along the upper edge of the container (container) The present invention relates to a packaging material for sealing a container, (First protruding portion) protruding into the container and contacting the lower surface of the resin film is formed on the container wall (container wall) A through hole penetrating the container wall and a ring-shaped second bonding portion for weakly adhering a portion surrounding the through hole to the lower surface of the resin film, on the upper surface (upper surface) of the first projection, A second protruding wall which is arranged on the center side and protrudes higher than the upper edge of the second adhesive portion is formed, The second projecting portion is disposed in a region having a radius of 30 mm or less from the center of the through hole, When the inner pressure of the container is increased, the resin film expands upward and the second adhesive portion falls, so that the gas inside the container bypasses the second protrusion and is discharged to the outside of the container through the through- And the like. The lower surface of a resin film is adhered (bonded) to a first bonding portion (first bonding portion) formed annularly along the upper edge of the container (container) The present invention relates to a packaging material for sealing a container, (First protruding portion) protruding into the container and contacting the lower surface of the resin film is formed on the container wall (container wall) A through hole penetrating the container wall and a ring-shaped second bonding portion for weakly adhering a portion surrounding the through hole to the lower surface of the resin film, on the upper surface (upper surface) of the first projection, A second protruding wall which is arranged on the center side and protrudes higher than the upper edge of the second adhesive portion is formed, A slit having a width of 5 mm or less is formed on the second projection, When the inner pressure of the container is increased, the resin film expands upward and the second adhesive portion falls, so that the gas inside the container bypasses the second protrusion and is discharged to the outside of the container through the through- And the like. 3. The method according to claim 1 or 2 , Wherein the container is divided into a plurality of compartments by a partition wall, a first projection is formed continuously to the partition wall, and a plurality of compartments are arranged on both sides of the wall-shaped second projection. 3. The method according to claim 1 or 2 , Wherein the second adhesive portion is convex and the height from the tip of the second adhesive portion to the tip of the second protrusion is 0.1 to 3 mm. 3. The method according to claim 1 or 2 , Wherein the through hole is formed at a position spaced by 5 mm or more away from the upper edge of the container to the center. Wherein a first adhesive portion for adhering the lower surface of the resin film is annularly formed along the upper edge, A first protrusion protruding into the container and reaching a height equivalent to the upper edge of the container is formed in the container wall, An annular second adhering portion for adhering a through hole penetrating the container wall and a portion surrounding the through hole to the lower surface of the resin film on the upper surface of the first projecting portion; A second projection of a wall shape protruding higher than the upper edge of the second adhesive portion is formed , And the second projecting portion is disposed in a region having a radius of 30 mm or less from the center of the through hole . Wherein a first adhesive portion for adhering the lower surface of the resin film is annularly formed along the upper edge, A first protrusion protruding into the container and reaching a height equivalent to the upper edge of the container is formed in the container wall, An annular second adhering portion for adhering a through hole penetrating the container wall and a portion surrounding the through hole to the lower surface of the resin film on the upper surface of the first projecting portion; A second projection of a wall shape protruding higher than the upper edge of the second adhesive portion is formed , And a slit having a width of 5 mm or less is formed on the second projection . delete

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