KR101376258B1 - A multi-step switch using bimetal - Google Patents

Abstract

The present invention relates to a multistage switch which includes: a bimetal part which includes a movable contact on one end thereof; a first connection plate part which includes a first fixed contact on one end thereof; a second connection plate part which includes a second fixed contact on one end thereof; and a first insulation layer which is interposed between the first connection plate part and the second connection plate part. Provided is the multistage switch which includes a function to switch the on state of the power into the off state of the power by controlling the on state of the power by stages when the power is switched from the on state to the off state and a function to maintain the on state of the power by stages in the off state when the power is switched from the off state to the on state.

Description

A multi-step switch using bimetal}

The present invention relates to a multi-stage switch using a bimetal, and more particularly, to a multi-stage switch capable of controlling the on state of a power supply step by step.

In general, electrical applications, such as electrical appliances, electrical devices, electrical installations are most often provided with a switch to interrupt, that is, on / off power.

Push switches and rocker switches are the most widely used switches for power interruptions.

The push type switch is a switch that is connected to the power when the user presses the button and the button is automatically returned when the button is released. The rocker type switch maintains the pressed state when the user presses one of the buttons. This is a switch that is connected or disconnected.

In addition, in addition to the push type and rocker type switches, a bimetal switch is used, and the bimetal switch is a switch in which a bimetal plate replaces a mover and cuts off power when overloaded.

1A to 1C are schematic cross-sectional views for explaining the principle of bimetal.

In general, a bimetal is a piece of two sheets of metal plates with very different thermal expansion coefficients. The bimetal is used to control the temperature of the device by using the bending properties when heat is applied.

As the temperature increases, the larger the thermal expansion coefficient is expanded, the more it bends to the opposite side. When the temperature is lowered again, the larger the thermal expansion coefficient, I can come back.

That is, as shown in FIG. 1A, the bimetal 1 can be made by overlapping and contacting a first metal 10 having a first coefficient of thermal expansion and a second metal 20 having a second coefficient of thermal expansion. When is increased, the metal having a large thermal expansion coefficient is elongated more, and since the first metal and the second metal are in contact with each other, the metal is bent toward the metal having a small thermal expansion coefficient.

At this time, iron or a nickel-iron alloy can be used as a metal having a large thermal expansion coefficient. Examples of the metal having a small thermal expansion coefficient include copper, a copper-zinc alloy, a nickel-chromium- Molybdenum-iron alloy, and nickel-manganese-copper alloy.

For example, assuming that the thermal expansion coefficient of the second metal 20 is greater than the thermal expansion coefficient of the first metal 10, when the temperature applied to the bimetal 1 is increased, as shown in FIG. 1B, the thermal expansion coefficient The larger second metal 20 is stretched more and these first metals and the second metal are in contact with each other, and thus are bent toward the first metal 10 having a smaller coefficient of thermal expansion.

Alternatively, assuming that the thermal expansion coefficient of the second metal 20 is greater than the thermal expansion coefficient 10 of the first metal, when the temperature applied to the bimetal 1 is lowered, as shown in FIG. 1C, thermal expansion is shown. Since the second metal 20 having a large coefficient contracts more and these first metals and the second metal are in contact with each other, the second metal 20 is in contact with the second metal 20 having a large coefficient of thermal expansion.

In this case, that is, when the thermal expansion coefficient of the second metal 20 is larger than the thermal expansion coefficient of the first metal 10, the second metal 20 may be iron or a nickel-iron alloy, (10) may be copper, a copper-zinc alloy, a nickel-chromium-iron alloy, a nickel-manganese-iron alloy, a nickel-molybdenum-iron alloy or a nickel-manganese-copper alloy.

As such, the switch has a conventional rocker method of connecting or disconnecting power using a mover, and a bimetal method of connecting or disconnecting a power using a bimetal plate, but cutting off the power when an overload occurs in a connected state. Includes only the function of intermittently turning off the power, i.e., turning on / off the power, and in switching the power from the on state to the off state, it is possible to control the on state of the power supply step by step to turn it off. There is a need for the development of a switch that includes a function that is present (or vice versa, that is, the function of maintaining the on state step by step in turning the power from the off state to the on state).

SUMMARY OF THE INVENTION An object of the present invention is to provide a multi-stage switch having a function of controlling an on state of a power supply step by step in switching a power state from an on state to an off state.

In addition, an object of the present invention is to provide a multi-stage switch having a function of maintaining an on state step by step in the off state in switching the power source from the off state.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to solve the above-mentioned problems, the present invention includes a bimetal part including a movable contact at one end; A first connection plate portion including a first fixed contact at one end; A second connection plate portion including a second fixed contact at one end; And a first insulating layer interposed between the first connection plate portion and the second connection plate portion.

The present invention also provides a multi-stage switch in which the movable contact is in contact with the first fixed contact to form a first current path, and the movable contact is in contact with the second fixed contact to form a second current path.

In addition, the second connection plate is a connection plate disposed on the lowermost of the connection plate, the second connection plate further comprises a second insulating layer located below the second connection plate, the movable contact is the second insulation Provided is a multi-stage switch characterized in that it does not constitute a current path when in contact with the layer.

The present invention also provides a multi-stage switch, wherein the other end of the bimetal part is connected to a heater, and the other ends of the first connection plate part and the second connection plate part are connected to an external connection terminal.

According to the present invention as described above, in switching the power from the on state to the off state, it is possible to provide a multi-stage switch having a function that can be switched to the off state by controlling the on state of the power in stages.

In addition, the present invention may provide a multi-stage switch having a function of maintaining the on state step by step in the off state in switching the power from the off state to the on state.

1A to 1C are schematic cross-sectional views for explaining the principle of bimetal.
2A and 2B are schematic cross-sectional views illustrating a switch having an on / off function of a general structure.
3A to 3C are schematic cross-sectional views for describing a multi-stage switch using a bimetal according to a first embodiment of the present invention.
4A to 4C are schematic cross-sectional views for describing a multi-stage switch using a bimetal according to a second embodiment of the present invention.
5A is a schematic front view illustrating a multi-stage switch using a bimetal according to a third embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along line II of FIG. 5A.
6 is a schematic cross-sectional view for describing a multi-stage switch using a bimetal according to a fourth embodiment of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. &Quot; and / or "include each and every combination of one or more of the mentioned items. ≪ RTI ID = 0.0 >

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A and 2B are schematic cross-sectional views illustrating a switch having an on / off function of a general structure.

2A and 2B show an overload protection device as an example of a switch having an on / off function, and FIG. 2A is a cross-sectional view illustrating an operation of the overload protection device in a normal state, and FIG. It is sectional drawing which shows operation | movement in the overheat state of a protective device.

2A and 2B, an overload protection device 100 having a general structure includes a first housing 101a and a second housing 105b of a metallic material having a sealed inner space and capable of heat transfer; A first external connection terminal 103 inserted into one side of the first housing to be insulated from each other and installed to serve as a terminal to receive power from the outside; A bimetal disk 108 installed in the first housing and the second housing, that is, the inner space of the housing and having a predetermined overheat temperature or more, the contact of one side surface is opened to block the electrical signal; And a heater 105b installed in the inner space of the housing to generate heat by an external factor.

The first external connection terminal 103 is inserted into the through hole of the first housing 101a to serve as an electrical terminal, and the insertion portion is hermetically fixed to the first housing 101a by an insulating filler 102, Power can be input from the outside.

At this time, the overload protection device 100 of the general structure includes a fixed contact 107 and a movable contact 108a, and whether or not on / off depending on the contact between the fixed contact 107 and the movable contact 108a. Will be determined.

The fixed contact 107 may be electrically connected to the first external connection terminal 103. In this case, the fixed contact 107 may be connected to the first external connection terminal 103 through a metal connection plate 105a. ) Can be electrically connected. Unlike the drawing, the fixed contact may be directly connected to the first external connection terminal.

In addition, the movable contact 108a is electrically connected to one side of the bimetal disc 108, and the other side of the bimetal disc 108 may be fixed to the heater 105b by the welding slug 109.

In addition, the heater 105b may be bonded to one side of the first housing 101a, and heat (H1) generated from the heater is transferred to the bimetal disk 108 to perform a function of an overload protection device. can do.

As described above, in general, a bimetal disk may be formed by joining two metal plates having different thermal expansion coefficients, and when the temperature reaches a predetermined temperature, the metals of the bimetal disk expand and deform differently.

By this deformation, it is determined whether the fixed contact 107 and the movable contact 108a is in contact, and whether the on / off is determined according to the contact thereof can perform the function of the overload protection device.

On the other hand, by including an insulator 104 between the first housing 101a and the metal connecting plate 105a, electrical insulation between the connecting plate 105a and the first housing 101a can be realized.

Next, the operating principle of the bimetal disk 108 will be described.

The bimetal disk 108 is a set temperature when the heat is applied, the curved portion of the disk is inverted to a horizontal state, and when cooled again to convert the heat into mechanical motion by using the characteristic of returning to the original position (curved state) Can be utilized as

In addition, on the contrary, the bimetal disk 108 becomes a set temperature when the heat is applied, and the disk in the horizontal state is curved. When the cooling is performed again, the bimetal disc 108 returns the heat to the home position (horizontal state) by using the characteristic of the mechanical motion. It can be used as a device to convert.

First, referring to FIG. 2A, the current flows through the first external connection terminal 103 through the connection plate 105a in the overload protection device 100 when the overload protection device is in normal operation. It flows to the bimetal disk 108 through the movable contact 108a of the circuit closed at one end of the bimetal disk 108.

Next, the flow of current passes through the heater 105b at the other end of the bimetal disk 108 and through the first housing 101a of the metal material in contact with the heater 105b, the second contacting the first housing. It flows through the external connection terminal (not shown).

As a result, the electrical application connected to the first external connection terminal 103 and the second external connection terminal (not shown) may be in an on state.

Next, referring to FIG. 2B, when an overcurrent flows into the electrical application, the flow of current through the first external connection terminal 103 passes through the connection plate 105a in the overload protection device 100 and the bimetal disk 108. It flows to the bimetal disk 108 through the movable contact 108a of the circuit closed at one end of the circuit.

At this time, the heater 105b generates heat H1 due to overcurrent and overheating of the electrical application, and the generated heat H1 is transmitted to the bimetal disk 108 through conduction, convection, or radiation.

In this way, when the temperature of the bimetal disk 108 rises and reaches a predetermined temperature, the curved portion of the bimetal disk 108 snaps to open the movable contact 108a as shown in FIG. This prevents the overload of electrical applications from acting as a protective device.

However, such a general switch includes only a function of intermittently turning off the power, that is, turning on / off the power, and controlling the on state of the power supply step by step in switching the power from the on state to the off state. It does not include a function that can be turned off to the off state or vice versa, that is, the function of maintaining the on state step by step in the off state in switching the power from the off state to the on state.

For example, as described above, when overcurrent flows into an electrical application, one may consider lowering the incoming current step by step, rather than simply turning off the function of the electrical application. It can't function.

Hereinafter, a multi-stage switch according to the present invention will be described.

3A to 3C are schematic cross-sectional views for describing a multi-stage switch using a bimetal according to a first embodiment of the present invention.

At this time, the multi-stage switch using the bimetal according to the first embodiment of the present invention, for convenience of description, only the bimetal part including the movable contact and the connection plate part including the fixed contact will be shown.

However, the multi-stage switch using the bimetal according to the first embodiment of the present invention may include the configuration of the overload protection device having the general structure of FIGS. 2A and 2B described above. The present invention is not limited to the configuration, and it is natural that various types of switches can be configured by using the configuration of the bimetal part including the movable contact described below and the connection plate part including the fixed contact.

3A to 3C, the multi-stage switch 200 using the bimetal according to the first embodiment of the present invention includes a bimetal part 202 including a movable contact 203 at one end and a fixed contact at one end. And connecting plate portions 221 and 231 including 223 and 233.

In this case, in the present invention, the fixed contact point and the connection plate part may be formed in plural. More specifically, one end of the first connection plate part 221 and one end including the first fixed contact point 223 may be provided. The second connection plate portion 231 including the second fixed contact 233 is included.

On the other hand, although the drawing shows that the two fixed contact points and the connecting plate portion, respectively, alternatively, three may be formed respectively, that is, in the present invention at least two fixed contact points and the connection plate portion, respectively It may be formed by the above.

In this case, the other end of the bimetal part 202 may be connected to the heater 201, and the other end of the connection plate part, that is, the first connection plate part and the second connection plate part may be connected to the external connection terminal 210. .

3A to 3C, the connection plate portions 221 and 231 of the multi-stage switch 200 using the bimetal according to the first embodiment of the present invention are electrically insulated by the insulating layer 222. In more detail, the first insulating layer 222 is interposed between the first connection plate part 221 and the second connection plate part 231.

That is, the first insulating layer 222 prevents the first connection plate portion 221 and the second connection plate portion 231 from being electrically connected to each other, whereby the movable contact 203 is connected to the first fixed contact. Each of the current paths may be configured when the contact 223 or the movable contact 203 is in contact with the second fixed contact 233.

More specifically, when the movable contact 203 is in contact with the first fixed contact 223, the bimetal part 202 => movable contact 203 => first fixed contact 223 => first connection plate part (221) => When the first current path of the external connection terminal 210 is formed, and the movable contact 203 is in contact with the second fixed contact 233, the bimetal part 202 => movable contact 203 => Second fixed contact point 233 => second connection plate portion 231 => second current path of the external connection terminal 210 can be configured.

In this case, in the present invention, since the multi-stage current path may be configured through the first current path and the second current path, this means that the multi-stage switch function may be performed.

That is, in the case of a switch having a general structure, only the on / off function is merely performed, but in the present invention, since the current path of the first current path and the second current path may be configured in multiple stages, the current of each current path may be changed. By differing from each other, a multi-stage switch can be configured in the on function.

3A to 3C, the multi-stage switch 200 using the bimetal according to the first embodiment of the present invention may include an insulating layer disposed below the connection plate disposed at the lowermost portion. In detail, the second insulation layer 232 may include a connection plate disposed at the bottom thereof, that is, a second insulating layer 232 positioned under the second connection plate 231.

The insulating layer located below the connection plate disposed at the bottom of the multi-stage switch using the bimetal according to the first embodiment of the present invention performs an off function, that is, the connection plate part including the fixed contact is on. While performing the multi-stage on function, the insulating layer, that is, the second insulating layer positioned below the connection plate disposed at the lowermost part, may perform the off function of the multi-stage switch.

That is, when the movable contact 203 is in contact with the first fixed contact 223 and when the movable contact 203 is in contact with the second fixed contact 233, a multi-stage switch is implemented while performing an on function. The second insulating layer may perform the on / off function while performing the on / off function of the multi-stage switch, and perform the on function of the multi-stage switch.

Referring to FIGS. 3A through 3C, first, as shown in FIG. 3A, the movable contact 203 contacts the first fixed contact 223 by the first temperature applied to the bimetal part 202. Bimetal part 202 => movable contact 203 => 1st fixed contact 223 => 1st connection plate part 221 => can constitute the 1st current path | pass of the external connection terminal 210. FIG. have.

In addition, as shown in FIG. 3B, by the second temperature applied to the bimetal part 202, the movable contact 203 is in contact with the second fixed contact 233, whereby the bimetal part 202 => movable contact. (203) => Second fixed contact point 233 => Second connection plate part 231 => A second current path of the external connection terminal 210 can be configured to perform a multi-stage on function.

In addition, as shown in FIG. 3C, an insulating layer, that is, a second insulating layer, positioned below the connection plate at which the movable contact 203 is disposed at the lowermost level due to the third temperature applied to the bimetal part 202. In contact with 232, no further current paths are configured, so that the off function can be performed.

As a result, the multi-stage switch using the bimetal according to the first embodiment of the present invention has a multi-stage having a function of controlling the on-state of the power in a step-by-step manner when switching the power from the on state to the off state. A switch can be implemented.

4A to 4C are schematic cross-sectional views for describing a multi-stage switch using a bimetal according to a second embodiment of the present invention.

In this case, the multi-stage switch using the bimetal according to the second embodiment of the present invention may be the same as the multi-stage switch using the bimetal of the first embodiment described above, except as described below.

4A to 4C, the multi-stage switch 300 using a bimetal according to the second embodiment of the present invention includes a bimetal part 302 including a movable contact 303 at one end and a fixed contact at one end. Connecting plate portions 321, 331, and 341 including 323, 333, and 343.

At this time, in the present invention, the fixed contact and the connecting plate portion is characterized in that each formed a plurality, more specifically, one end of the first connecting plate portion 321 including a first fixed contact 323, one end A second connection plate portion 331 including a second fixed contact 333 and a second connection plate portion 341 including a third fixed contact 343 at one end.

On the other hand, it is shown in the drawing that the three fixed contact points and the connecting plate portion is formed, respectively, alternatively, at least two of the fixed contact point and the connection plate portion in the present invention may be formed.

In this case, the other end of the bimetal part 302 may be connected to the heater 301, and the other end of the connection plate part, that is, the first connection plate part, the second connection plate part, and the third connection plate may be an external connection terminal ( 310 may be connected.

4A to 4C, the connecting plate portions 321, 331, and 341 of the multi-stage switch 300 using the bimetal according to the second embodiment of the present invention may be formed on the insulating layers 322 and 332. Electrically insulated by, and more specifically, the first insulating layer 322 interposed between the first connecting plate portion 321 and the second connecting plate portion 331, also, the second connecting plate portion 331 And a second insulating layer 332 interposed between the third connection plate portions 341.

That is, the first insulating layer 322 prevents the first connecting plate portion 321 and the second connecting plate portion 331 from being electrically connected, and the second insulating layer 332 is the second connecting plate. The part 331 and the third connection plate part 341 are prevented from being electrically connected.

As a result, when the movable contact 303 is in contact with the first fixed contact 323, or the movable contact 303 is in contact with the second fixed contact 333, or the movable contact 303 is in the third fixed contact. When contacted with the contact 343, each current path may be configured to form a first current path, a second current path, and a third current path, respectively.

Since this is the same as the first embodiment described above, a detailed description thereof will be omitted.

Meanwhile, referring to FIGS. 4A to 4C, the multi-stage switch 300 using the bimetal according to the second embodiment of the present invention may also include an insulating layer located below the connection plate disposed at the lowermost portion. In detail, the third insulation layer 342 may include a connection plate disposed at the lowermost portion, that is, a third insulating layer 342 positioned under the third connection plate 341.

However, in the above-described first embodiment, the insulating layer located below the connecting plate disposed at the bottom performs the off function. However, in the second embodiment, the insulating layer functions as an insulator as shown in FIGS. 2A and 2B rather than this function. For example, the third insulating layer 342 is positioned between the metal housing (not shown) and the metal third connection plate 341, and thus, the third connection plate 341 and the housing (not shown). Electrical insulation can be realized between

In this case, performing the off function in the present invention is a case in which the bimetal part 302 maintains a horizontal state, and is an initial state in which the movable contact of the bimetal part and the fixed contact of the connecting plate part are not in contact with each other.

That is, the second embodiment of the present invention relates to a multi-stage switch having a function of maintaining the on state step by step in the off state in switching the power supply from the off state to the on state.

4A through 4C, first, as shown in FIG. 4A, when the bimetal part 302 which is an initial state is maintained in a horizontal state according to the first temperature applied to the bimetal part 302. As a result, since the movable contact 303 of the bimetal part and the fixed contacts 323, 333, 343 of the connecting plate part are not in contact with each other, a current path is not configured, and thus an off function can be performed.

In addition, as shown in FIG. 4B, by the second temperature applied to the bimetal part 302, the movable contact 303 is in contact with the first fixed contact 323, whereby the bimetal part 302 => movable contact. (303) => First fixed contact point 323 => First connection plate part 321 => The 1st current path of the external connection terminal 310 can be comprised.

In addition, as shown in FIG. 4C, by the third temperature applied to the bimetal part 302, the movable contact 303 is in contact with the second fixed contact 333, whereby the bimetal part 302 => movable contact. (303) => Second fixed contact point 333 => Second connection plate part 331 => By making the 2nd current path of the external connection terminal 310, multi-stage on function can be performed.

As a result, the multi-stage switch using the bimetal according to the second embodiment of the present invention can implement a multi-stage switch having a function of maintaining an on state step by step in the off state in switching the power from the off state to the on state.

According to the present invention as described above, in switching the power from the on state to the off state, by controlling the on state of the power supply step by step, or switching the power from the off state to the on state In this case, it is possible to provide a multi-stage switch including a function of maintaining an on state step by step in an off state.

FIG. 5A is a schematic front view illustrating a multi-stage switch using a bimetal according to a third embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along line II of FIG. 5A.

The multi-stage switch using the bimetal according to the third embodiment of the present invention may be the same as the above-described second embodiment except for the following.

The biggest difference between the multi-stage switch according to the third embodiment of the present invention and the multi-stage switch according to the second embodiment relates to the moving direction of the bimetal part including the movable contact.

That is, in the case of the multi-stage switch according to the second embodiment, the movement direction of the bimetal part including the movable contact is up and down and vertical directions, whereas in the case of the multi-stage switch according to the third embodiment, the movement of the bimetal part including the movable contact is performed. The direction corresponds to the left and right, horizontal direction.

5A and 3B, the multi-stage switch 400 using a bimetal according to a third embodiment of the present invention includes a bimetal part 202 including a movable contact 403 at one end and a fixed contact at one end. Connecting plate portions 421, 431, and 441 including 423, 433, and 443.

In the present invention, the fixed contact and the connecting plate portion is characterized in that each formed a plurality, more specifically, the first connecting plate portion 421 including a first fixed contact 423 at one end, the second at one end A second connection plate portion 431 including a stationary contact 433 and a second connection plate portion 441 including a third fixed contact 443 at one end thereof.

In this case, the other end of the bimetal part 402 may be connected to the heater 401, and the other end of the connection plate part, that is, the first connection plate part, the second connection plate part, and the third connection plate may be an external connection terminal ( 410 may be connected.

5A and 5B, the connection plate portions 421, 431, and 441 of the multi-stage switch 400 using the bimetal according to the third embodiment of the present invention may be formed on the insulating layers 422 and 432. The first insulating layer 422, which is interposed between the first connecting plate portion 421 and the second connecting plate portion 431, and more specifically, the second connecting plate portion 431. And a second insulating layer 432 interposed between the third connecting plate portions 441.

Since this is the same as the second embodiment described above, a detailed description thereof will be omitted.

Meanwhile, referring to FIGS. 5A and 5B, the multi-stage switch 400 using the bimetal according to the third embodiment of the present invention may also include an insulating layer disposed below the connection plate disposed at the lowermost portion. In detail, the third insulation layer 442 may include a connection plate disposed at the bottom thereof, that is, a third insulating layer 442 disposed under the third connection plate 441.

Since the operation of the multi-stage switch by this configuration is the same as in the above-described second embodiment, a detailed description thereof will be omitted.

As described above, in the case of the multi-stage switch according to the second embodiment, the moving direction of the bimetal part including the movable contact is up and down and vertical directions, whereas in the case of the multi-stage switch according to the third embodiment, the movable contact includes the movable contact. The movement direction of the bimetal part corresponds to the horizontal direction.

For this reason, in the case of the multi-stage switch according to the second embodiment, the stacking of the connecting plate portions including the fixed contact at one end is vertical stacking, whereas in the case of the multi-stage switch according to the third embodiment, the fixed contact is included at one end. The stacking of connecting plate portions corresponds to the horizontal stacking.

In order to distinguish this, in the present invention, the multi-stage switch according to the first and second embodiments described above may be vertically stacked multistage switches, and the multistage switch according to the third embodiment may be divided into horizontal stacked multistage switches. Do.

Meanwhile, in the above description, the vertical stacked multistage switch according to the second embodiment is configured as a horizontal stacked multistage switch, but in the same manner, the vertical stacked multistage switch according to the first embodiment described above is a horizontal stacked multistage switch. It is also possible to configure.

6 is a schematic cross-sectional view for describing a multi-stage switch using a bimetal according to a fourth embodiment of the present invention.

The multi-stage switch using the bimetal according to the fourth embodiment of the present invention may be the same as the first embodiment described above except for the following description.

The biggest difference between the multistage switch according to the fourth embodiment of the present invention and the multistage switch according to the first embodiment relates to a connection plate including a fixed contact at one end.

That is, as shown in FIG. 6, the multi-stage switch 200 ′ according to the fourth embodiment of the present invention includes a bimetal part 202 including a movable contact 203 at one end and a fixed contact (at one end). Connecting plate portions 221 and 231 including 223 'and 233'.

The fixed contact and the connection plate portion is characterized in that each formed a plurality, more specifically, the first connection plate portion 221 including a first fixed contact 223 'at one end and a second fixed contact at one end And a second connection plate portion 231 including 233 '.

The biggest difference between the multi-stage switch according to the fourth embodiment of the present invention and the multi-stage switch according to the first embodiment relates to a connecting plate including a fixed contact at one end thereof, which is located between the fixed contact and the connecting plate. Elastic portions 224 and 234.

That is, the first fixed contact point 223 ′ is connected to the first connection plate part 221 through a first elastic part 224, and the second fixed contact point 233 ′ is a second elastic part 234. It may be connected to the second connecting plate portion 231 through.

As such, in the present invention, the elastic part positioned between the fixed contact point and the connection plate is provided to facilitate the movement of the bimetal part 202 including the movable contact point 203.

That is, as shown in FIG. 6, in the initial state where the movable contact 203 of the bimetal part 202 is in contact with the first fixed contact 223 ′, by a constant temperature applied to the bimetal part 202, As the movable contact 203 moves to contact the second fixed contact 233 ', the space in which the movable contact 203 of the bimetal part 202 can move while the first elastic portion 224 is compressed. Will be provided.

Thereafter, when the movable contact 203 is in contact with the second fixed contact 233 ′, the compressed first elastic portion 224 may return to the original position.

Accordingly, in the present invention, the bimetal part 202 including the movable contact 203 may be easily moved through the elastic part positioned between the fixed contact point and the connection plate.

On the other hand, in the above described on the basis of the first embodiment, it has been described to include an elastic portion between the fixed contact and the connection plate, on the contrary, in the second embodiment and the third embodiment also the fixed contact and the connection plate Of course, the elastic portion may be included in between.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

200, 300: multi-stage switch 203, 303: movable contact
202. 302: Bimetal part 223, 233, 323, 333, 343: Fixed contact
221, 231, 321, 331, 341: connection plate
222, 232, 322, 332, 342: insulating layer

Claims (4)

A bimetal part including a movable contact at one end;
A first connection plate portion including a first fixed contact at one end;
A second connection plate portion including a second fixed contact at one end; And
A first insulating layer interposed between the first connection plate portion and the second connection plate portion,
The second connection plate is a connection plate disposed at the bottom of the connection plate, and further comprises a second insulating layer located below the second connection plate,
And the movable contact does not constitute a current path when the movable contact is in contact with the second insulating layer. The method of claim 1,
And the movable contact is in contact with the first fixed contact to form a first current path, and the movable contact is in contact with the second fixed contact to form a second current path. delete The method of claim 1,
And the other end of the bimetal part is connected to a heater, and the other ends of the first connection plate part and the second connection plate part are connected to an external connection terminal.

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