KR101370156B1 - 하나 이상의 타겟 링크 구조 제거를 위한 레이저기반 방법 및 시스템 - Google Patents

하나 이상의 타겟 링크 구조 제거를 위한 레이저기반 방법 및 시스템 Download PDF

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Publication number
KR101370156B1
KR101370156B1 KR1020087021624A KR20087021624A KR101370156B1 KR 101370156 B1 KR101370156 B1 KR 101370156B1 KR 1020087021624 A KR1020087021624 A KR 1020087021624A KR 20087021624 A KR20087021624 A KR 20087021624A KR 101370156 B1 KR101370156 B1 KR 101370156B1
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KR
South Korea
Prior art keywords
laser
pulses
link structure
target link
wavelength
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KR1020087021624A
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English (en)
Korean (ko)
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KR20090061607A (ko
Inventor
보 구
도날드 브이. 스마트
제임스 제이. 코딩글리
주한 이
도날드 제이. 스베트코프
세파드 디. 존슨
조나단 에스. 어먼
Original Assignee
지에스아이 그룹 코포레이션
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Publication of KR20090061607A publication Critical patent/KR20090061607A/ko
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Publication of KR101370156B1 publication Critical patent/KR101370156B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
KR1020087021624A 2006-02-03 2007-02-05 하나 이상의 타겟 링크 구조 제거를 위한 레이저기반 방법 및 시스템 KR101370156B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US76540106P 2006-02-03 2006-02-03
US60/765,401 2006-02-03
PCT/US2007/061592 WO2007092803A2 (en) 2006-02-03 2007-02-05 Laser-based removal of target link structures

Publications (2)

Publication Number Publication Date
KR20090061607A KR20090061607A (ko) 2009-06-16
KR101370156B1 true KR101370156B1 (ko) 2014-03-06

Family

ID=38345903

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087021624A KR101370156B1 (ko) 2006-02-03 2007-02-05 하나 이상의 타겟 링크 구조 제거를 위한 레이저기반 방법 및 시스템

Country Status (5)

Country Link
JP (1) JP2009526383A (zh)
KR (1) KR101370156B1 (zh)
CN (1) CN101410219A (zh)
TW (1) TWI379724B (zh)
WO (1) WO2007092803A2 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10307862B2 (en) * 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
JP5552373B2 (ja) 2010-06-02 2014-07-16 浜松ホトニクス株式会社 レーザ加工方法
DE102010025966B4 (de) * 2010-07-02 2012-03-08 Schott Ag Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
TWI454006B (zh) * 2011-11-18 2014-09-21 Ind Tech Res Inst 雷射控制裝置
KR102007990B1 (ko) * 2013-02-27 2019-08-06 노바르티스 아게 타겟 재료를 레이저 가공하기 위한 레이저 장치 및 방법
KR101483759B1 (ko) * 2013-07-19 2015-01-19 에이피시스템 주식회사 멀티 레이저를 이용한 취성 기판 가공 장치 및 방법
CN106330329B (zh) * 2016-08-22 2018-07-03 浙江大学 基于直接调制dpssl的无线光通信装置及其方法
JP6781649B2 (ja) * 2017-03-13 2020-11-04 株式会社ディスコ レーザー加工装置
JP2018043034A (ja) * 2017-11-27 2018-03-22 ノバルティス アーゲー レーザー装置および標的材料をレーザー処理するための方法
US10352995B1 (en) 2018-02-28 2019-07-16 Nxp Usa, Inc. System and method of multiplexing laser triggers and optically selecting multiplexed laser pulses for laser assisted device alteration testing of semiconductor device
US10782343B2 (en) 2018-04-17 2020-09-22 Nxp Usa, Inc. Digital tests with radiation induced upsets
US20200316722A1 (en) * 2019-04-02 2020-10-08 Asm Technology Singapore Pte Ltd Optimised laser cutting
RU2736126C1 (ru) * 2020-02-10 2020-11-11 Федеральное государственное бюджетное учреждение науки Институт машиноведения им. А.А. Благонравова Российской академии наук (ИМАШ РАН) Способ трехстадийной лазерной наплавки
KR102363962B1 (ko) * 2020-04-21 2022-02-17 국방과학연구소 광자 기반의 표적 탐지 시스템, 방법, 컴퓨터 판독 가능한 기록매체 및 컴퓨터 프로그램

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020016758A1 (en) 2000-06-28 2002-02-07 Grigsby Calvin B. Method and apparatus for offering, pricing, and selling securities over a network
US20020162973A1 (en) 2001-03-29 2002-11-07 Cordingley James J. Methods and systems for processing a device, methods and systems for modeling same and the device
US20040134894A1 (en) 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US20050215985A1 (en) 2003-08-11 2005-09-29 Michael Mielke Method of generating an ultra-short pulse using a high-frequency ring oscillator

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US4914663A (en) * 1988-04-22 1990-04-03 The Board Of Trustees Of Leland Stanford, Jr. University Generation of short high peak power pulses from an injection mode-locked Q-switched laser oscillator
US5745284A (en) * 1996-02-23 1998-04-28 President And Fellows Of Harvard College Solid-state laser source of tunable narrow-bandwidth ultraviolet radiation
EP2648039A3 (en) * 1997-03-21 2014-07-09 Imra America, Inc. High energy optical fiber amplifier for picosecond-nanosecond pulses for advanced material processing applications
US7131968B2 (en) * 2003-06-02 2006-11-07 Carl Zeiss Meditec Ag Apparatus and method for opthalmologic surgical procedures using a femtosecond fiber laser

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040134894A1 (en) 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US20020016758A1 (en) 2000-06-28 2002-02-07 Grigsby Calvin B. Method and apparatus for offering, pricing, and selling securities over a network
US20020162973A1 (en) 2001-03-29 2002-11-07 Cordingley James J. Methods and systems for processing a device, methods and systems for modeling same and the device
US20050215985A1 (en) 2003-08-11 2005-09-29 Michael Mielke Method of generating an ultra-short pulse using a high-frequency ring oscillator

Also Published As

Publication number Publication date
WO2007092803A3 (en) 2008-09-18
TWI379724B (en) 2012-12-21
WO2007092803A2 (en) 2007-08-16
JP2009526383A (ja) 2009-07-16
TW200735992A (en) 2007-10-01
KR20090061607A (ko) 2009-06-16
CN101410219A (zh) 2009-04-15

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