KR101365257B1 - Heat resistant adhesive tape - Google Patents

Abstract

The present invention relates to a heat resistant adhesive tape and a semiconductor device using the same. More particularly, the adhesive flow is excellent in the process of taping the adhesive tape with the lead frame and the semiconductor chip, and high temperature solder reflow is also possible. The present invention relates to a heat-resistant adhesive tape capable of significantly suppressing the occurrence of delamination at the interface between a tape and an epoxy molding compound (EMC) in a process, and a semiconductor device using the same. To this end, the heat resistant adhesive tape according to the present invention is a heat resistant adhesive tape in which a heat resistant adhesive layer is applied to at least one surface of a heat resistant film and the heat resistant film, wherein the heat resistant adhesive layer comprises a polyimide resin composed of aromatic tetracarboxylic acid and diamine. In addition, the diamine of the polyimide resin includes a siloxane-based diamine and an aromatic diamine, the siloxane-based diamine is characterized in that it contains 40 to 60 mol% of the entire diamine.

Description

Heat Resistant Adhesive Tape {HEAT RESISTANT ADHESIVE TAPE}

The present invention relates to a heat resistant adhesive tape and a semiconductor device using the same. More particularly, the adhesive flow is excellent in the process of taping the adhesive tape with the lead frame and the semiconductor chip, and high temperature solder reflow is also possible. The present invention relates to a heat-resistant adhesive tape capable of significantly suppressing the occurrence of delamination at the interface between a tape and an epoxy molding compound (EMC) in a process, and a semiconductor device using the same.

Recently, as the demand for high speed, high integration, and miniaturized electronic components increases, a high density packaging technology of a package is required. To meet this, various semiconductor package methods have been developed, and a representative example thereof is a lead on chip package method, which is a memory semiconductor package method.

The lead on chip package is a method of bonding a semiconductor chip and a lead frame using a double-sided adhesive tape without a die pad to a lead frame on which the semiconductor chip is mounted. Miniaturization can be realized.

Such a lead on chip package may include: (a) attaching a lead frame to one surface of an adhesive tape; (b) cutting the leads; (c) attaching the semiconductor chip to the other side of the adhesive tape; (d) connecting the semiconductor chip and the lead with a wire; (e) encapsulating the lead frame and the semiconductor chip with an epoxy molding compound (EMC) resin; (f) It is manufactured by EMC (Epoxy molding compound) (after) curing process, and then the manufactured package is subjected to a solder reflow process that attaches to a substrate using solder. In this case, when the characteristics required for the adhesive tape are summarized, excellent adhesion to the lead frame and the semiconductor chip is required, and in particular, in the process of bonding with the lead frame, sufficient flowability of the adhesive under the taping conditions is required. In addition, reliability of the solder reflow process is required, which means that when a package stored in a high temperature / humidity environment is exposed to a high temperature (260 ° C) solder reflow process temperature, Inhibiting the occurrence of delamination at the interface with the bonded epoxy molding compound (EMC), the lead frame, and the semiconductor chip, and in particular, suppressing the delamination at the interface with the epoxy molding compound (EMC) Required.

For example, the double-sided adhesive tape used in the lead on chip package is described in Korean Patent Laid-Open Publication No. 2002-0079703, "A semiconductor chip is bonded to a lead frame by an adhesive member, and at least a semiconductor chip and a semiconductor chip. And a resin having an imide group, which is used in an adhesive member for manufacturing a lead-on chip (LOC) type semiconductor package by sealing the adhesive portion of the lead frame with a sealing material, and the adhesion start temperature is in the range of 230 to 330 ° C. The composite adhesive sheet formed by providing the heat-resistant adhesive coating film whose residual solvent amount is 0.03 to 1.00 weight%, and the residual solvent amount is 3.0 weight% or less in at least one surface of a heat resistant base film is shown.

However, the adhesive tapes up to and including the above-mentioned patent publication have a problem in that the flow of the adhesive and the suppression of delamination at the interface of the epoxy molding compound (EMC) are not satisfied at the same time.

Korean Unexamined Patent Publication No. 2002-0079703

The present invention has been made to solve the above problems, an object of the present invention is to provide a heat-resistant adhesive tape excellent in the flow of the adhesive and a semiconductor device using the same.

Another object of the present invention is to provide a heat resistant adhesive tape capable of suppressing the occurrence of delamination at the interface between a tape and an epoxy molding compound (EMC) and a semiconductor device using the same.

Another object of the present invention is to provide a heat-resistant adhesive tape and a semiconductor device using the same that can satisfy all the characteristics required in the process of manufacturing a lead on chip package (Lead on chip package).

These and other objects and advantages of the present invention will become more apparent from the following description of a preferred embodiment thereof.

The object is a heat-resistant adhesive tape in which a heat-resistant adhesive layer is applied to at least one surface of a heat-resistant film and the heat-resistant film, wherein the heat-resistant adhesive layer comprises a polyimide resin composed of aromatic tetracarboxylic acid and diamine, and the polyimide resin The diamine of includes a siloxane-based diamine and an aromatic diamine, wherein the siloxane-based diamine is achieved by a heat-resistant adhesive tape, characterized in that containing 40 to 60 mol% of the total diamine.

Herein, the siloxane-based diamine has the structure of Formula 1,

[Chemical Formula 1]

Here, n is a natural number of 1 to 30, R1 and R6 are the same or different, but an alkylene group or phenylene group having 1 to 30 carbon atoms, R2 to R5 are the same or different alkyl groups having 1 to 30 carbon atoms, 1 to 30 carbon atoms It is characterized by being an alkoxy group, a phenyl group or a phenoxy group.

Preferably, the siloxane-based diamine of Formula 1 is characterized in that n is 1 to 5.

Preferably, the siloxane-based diamine of Formula 1 is characterized in that n is 1.

Preferably, the glass transition temperature of the polyimide resin is characterized in that 150 ~ 175 ℃.

Preferably, the residual solvent amount of the polyimide resin is 1 wt% or less.

Preferably, the aromatic tetracarboxylic acid is characterized in that it comprises 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (3,3', 4,4'-BPDA).

Preferably, the aromatic diamine is characterized in that it comprises 4,4'-diaminodiphenyl ether (4,4'-DPE).

Preferably, the heat resistant film is characterized in that the polyimide film.

The above object is also achieved by a semiconductor device using the above-mentioned heat resistant adhesive tape.

According to the present invention, the adhesive flow is excellent in the process of taping the adhesive tape with the lead frame and the semiconductor chip, and the delamination at the interface between the tape and the epoxy molding compound (EMC) in the high temperature solder reflow process. It is possible to considerably suppress the occurrence of Delamination.

1 is a cross-sectional view of a heat resistant adhesive tape according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to embodiments and drawings of the present invention. It will be apparent to those skilled in the art that these embodiments are provided by way of illustration only for the purpose of more particularly illustrating the present invention and that the scope of the present invention is not limited by these embodiments .

FIG. 1 is a cross-sectional view of a heat resistant adhesive tape according to an embodiment of the present invention, illustrating the formation of the heat resistant adhesive layer 20 on both sides of the heat resistant film 10.

The present invention is made of an aromatic tetracarboxylic acid and diamine in a conventional adhesive tape having a trade off relationship between flow of adhesive and ability to suppress delamination at the interface of epoxy molding compound (EMC). Adhesion that satisfies the flow of the adhesive to be solved above and suppression of delamination at the interface of the epoxy molding compound (EMC) by applying a polyimide resin and appropriately adjusting the composition and processing conditions of the polyimide resin. It is about tape.

The heat resistant adhesive tape according to the present invention is a heat resistant adhesive tape in which a heat resistant adhesive layer is applied to at least one surface of a heat resistant film and the heat resistant film, wherein the heat resistant adhesive layer is preferably a polyimide resin composed of aromatic tetracarboxylic acid and diamine. . Moreover, since the said diamine of the said polyimide resin contains a siloxane type diamine and aromatic diamine, it is preferable to form a polyimide resin by thermal imidation.

In addition, the siloxane-based diamine according to the present invention is preferably contained in the range of 40 to 60 mol%, more preferably in the range of 50 to 60 mol% of all diamine. In this case, when the content of siloxane diamine is less than 40 mol%, the flexibility of the polyimide resin is insufficient, and thus the flowability of the adhesive is reduced during taping. When the content of siloxane diamine exceeds 60 mol%, high temperature solder reflow ( Solder reflow may cause delamination at the interface between the adhesive and the epoxy molding compound (EMC).

In addition, the siloxane-based diamine used in the present invention preferably has a structure of the formula (1), it is preferable that the number of repeating unit n is a natural number of 1 to 30. More preferably, it is 1-5, More preferably, it is 1. In this case, when the number of repeating units (n) of the siloxane-based diamine exceeds 30, delamination may be induced at the interface between the hot solder reflow process and the epoxy molding compound (EMC).

[Chemical Formula 1]

Here, n is a natural number of 1 to 30, R1 and R6 are the same or different, but an alkylene group or phenylene group having 1 to 30 carbon atoms, R2 to R5 are the same or different alkyl groups having 1 to 30 carbon atoms, 1 to 30 carbon atoms Is an alkoxy group, a phenyl group or a phenoxy group.

In addition, the aromatic diamine used in the present invention is p-phenylene diamine (p-PDA), 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1 , 4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminocumyl) benzene, 1,4-bis (4-aminocumyl) benzene, 2,2-bis [4- (3- Aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4-amino Phenoxy) phenyl] sulfone, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane and the like 4,4'-diaminodiphenyl ether (= 4,4'-oxydiylene) Diaminodiphenyl derivatives such as), and the like, and in particular, 4,4'-diaminodiphenyl ether is preferably used. Moreover, these aromatic diamine can be used individually or in combination of multiple types.

Moreover, it is preferable to contain 95-105 mol% of aromatic tetracarboxylic acids which concerns on this invention with respect to all the diamine, and it is more preferable to contain 98-102 mol%. At this time, when containing less than 95mol% of aromatic tetracarboxylic acid, the adhesive strength with a metal material such as a lead frame may be lowered. If it contains more than 105mol%, the semiconductor chip and This is because the adhesion with the same plastic material may be lowered. In addition, when the aromatic tetracarboxylic acid is significantly different from the range of 95 to 105 mol compared to the total diamine, the molecular weight of the polyimide resin may be reduced, thereby lowering the mechanical strength and hygroscopic resistance of the tape.

The aromatic tetracarboxylic acid may be pyromellitic dianhydride, 4,4'-oxydiphthalic dianhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 2,3,3', 4'-biphenyltetracarboxylic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,2', 3,3'-benzophenonetetracarboxylic dianhydride, 2,3,3 ', 4'-benzophenonetetracarboxylic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride, 2,2-bis (2,3-dicarboxy Phenyl) -propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) -propane dianhydride, bis (2,3-dicarboxyphenyl) ether dianhydride, bis (2,3-dicarboxyphenyl) Methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, bis (2,3-dicarboxyphenyl) sulfone dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 1,1- Bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, etc. Be used, and is particularly preferred to use 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (3,3', 4,4'-BPDA). In addition, these aromatic tetracarboxylic acids can be used individually or in combination of multiple types.

In addition, the polyimide resin according to the present invention preferably has a glass transition temperature of 150 ~ 175 ℃, more preferably in the range of 150 ~ 165 ℃. At this time, if the glass transition temperature of the polyimide resin is lower than 150 ° C, the flowability of the adhesive is realized, but delamination may occur at the interface of the epoxy molding compound (EMC). May be superior, but degrades the flowability of the adhesive.

In addition, the polyimide resin according to the present invention preferably contains a residual solvent amount of 1.0wt% or less. In this case, when the amount of residual solvent is 1.0wt% or more, void and delamination due to evaporation of residual solvent in high temperature process such as taping process, wire bonding process, solder reflow process, etc. May cause.

In addition, in the present invention, a filler may be additionally used to increase the mechanical strength of the tape and to give a slip property to the adhesive in the process of winding in a roll shape. The types of fillers are classified into inorganic fillers and organic fillers. Examples of the inorganic filler include gold, silver, copper powder, nickel, alumina, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, silica (mica) , Talc, boron nitride, titanium dioxide, glass, iron oxide, ceramic, and the like, and examples of the organic filler include polyimide, polyamide-imide, polyether ether ketone, polyether-imide, polyester-imi , Nylon, silicone and the like. The shape and size of such a filler are not particularly limited and may be used alone or in combination of two or more. In addition, the content of the filler is preferably 0.1 ~ 10wt% compared to 100wt% of the polyimide resin. At this time, when the amount of the filler is less than 0.1wt%, the effect of the filler is hardly observed, and when the amount of the filler is more than 10wt%, it may exhibit excellent physical properties in terms of imparting mechanical strength and slip resistance, but the flow of the adhesive The property may be degraded or the adhesion may be degraded.

In addition, in the present invention, an imidization catalyst may be further used to increase the efficiency in the process of performing imidization. This basically has an effect that the thermal imidization can proceed sufficiently even at 180 ~ 200 ℃ in the thermal imidization process requiring a temperature of 230 ℃ or more. At this time, the imidization catalyst may be imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, pyridine, isoquinoline, m-hydride. Although it is possible to use roxyanic acid, p-hydroxyphenylacetic acid, p-phenolsulfonic acid, p-aminophenol and the like, any material that can lower the thermal imidization temperature or reduce the imidization time is not particularly limited. The dehydration catalyst can be used individually or in combination of multiple types. In addition, the content of the imidization catalyst is preferably 0.1 to 20wt% compared to 100wt% of the polyimide resin. At this time, if the amount of the imidization catalyst is less than 0.1wt%, the effect of the catalyst is inadequate, and if it exceeds 20wt%, the catalyst is added in excess, so that the effect of lowering the imidization temperature even if the amount is increased further is lost. It may be included as an impurity in the polyimide resin.

In addition, the method of evaluating the properties of the adhesive tape in the present invention includes the evaluation of the glass transition temperature and the amount of residual solvent, etc. At this time, the method of evaluating the glass transition temperature is DMA (Dynamical mechanical analysis), DSC (Differential scanning calorimetry), There is a method using an analytical device such as TMA (Thermomechanical analysis). In the present invention, the evaluation was performed using NETZSCH DSC 200 F3 equipment, the temperature rising condition at this time is 20 ℃ / min, the temperature range is 30 ~ 250 ℃. In addition, as a method for evaluating the amount of the residual solvent can be evaluated using a TGA (Thermogravimetric analyzer) analysis equipment, in the present invention by using the TG 209 F3 equipment of NETZSCH Co. moisture content contained in the polyimide resin for 1 hour at 60 ℃ After removal, the amount of volatile components during treatment for 30 minutes at 260 ° C. was measured to evaluate the amount of residual solvent contained in the polyimide resin according to the following formula.

* TGA rated temperature conditions

Step 1: 30 → 60 ° C., 20 ° C./min

Step 2: 60 ° C, hold for 1 hour (value 1)

Step 3: 60 → 260 ° C., 20 ° C./min

Step 4: Hold at 260 ° C for 30 minutes (Value 2)

* Residual solvent amount (wt%) = [(value1)-(value2)] / (value2) x 100

Hereinafter, a process of manufacturing the heat resistant adhesive tape according to the present invention will be described in detail. The process of manufacturing the heat resistant adhesive tape according to the present invention may be divided into preparing a coating liquid and forming a polyimide resin layer.

First, in the step of preparing the coating liquid, the diamine component and the aromatic tetracarboxylic acid component are dissolved in a solvent, and reacted for about 1 to 10 hours at a temperature of about 0 to 80 ° C to prepare. At this time, in order to increase the degree of polymerization, the reaction temperature, reaction time, moisture content of solvent, purity of materials, etc. should be adjusted, and the inside of the reactor can be purged with nitrogen to prevent the reaction from proceeding smoothly by moisture. have. At this time, a polar organic solvent such as dimethylacetamide, dimethylformamide, N-methyl-2pyrrolidone is mainly used as a solvent.

The next step is to form a polyimide resin layer from the coating liquid. The polyimide resin is produced through dehydration and ring closure reaction. The thermal imide method is typically used in this step, and a poor solvent and a dehydration catalyst may be additionally used. The process of forming the polyimide resin layer is to apply the coating liquid on the base film and then imidized by applying heat, and after the application to one side of the base film in order to produce a double-sided adhesive tape after the thermal imidization Thermal imidization was performed after application to the other side of the film. In this case, the thermal imidization may be performed by applying a method of heat treatment for 1 to 30 minutes at 100 to 250 ° C. after the coating, and performing additional heat treatment for 1 to 15 minutes at 200 to 400 ° C. In this case, a coating method on the base film may be a knife coating method, a gravure coating method, a comma coating method, a reverse coating method, or the like, and the method may be selected according to the characteristics of the coating liquid and the thickness of the adhesive layer required. have.

In addition, the type of base film used in the present invention may be a heat-resistant film such as polyimide, polyamide, polycarbonate, polyamideimide, polyethylene terephthalate, polysulfone, and the like to improve the adhesion between the adhesive and the base film The substrate may be pre-treated or post-treated by corona discharge treatment, plasma treatment, chemical etching treatment, sand blast treatment, primer treatment, electrical treatment, or the like. Moreover, according to the purpose of use, the thickness of a base film can be adjusted, It is preferable that it is 5-200 micrometers thickness basically, and it is more preferable that it is 25-125 micrometers thickness.

The heat-resistant adhesive tape containing the polyimide resin thus prepared is made into a final product (adhesive tape) through a slitting process that is cut to a certain width according to the purpose of use, and then is a lead frame maker and an assembly house. It is provided as an (Assembly house) to be mounted in a package.

Hereinafter, the structure and effect of the present invention will be described in more detail with reference to examples and comparative examples. However, this embodiment is intended to explain the present invention more specifically, and the scope of the present invention is not limited to these embodiments.

[Example]

[Manufacturing Example]

N-methyl-2-pyrrolidone (NMP) was added to a reaction vessel provided with a nitrogen supply pipe, a thermometer, and a reactor, and diamine was added and dissolved according to the composition ratios in Table 1 below. Thereafter, tetracarboxylic acid was added according to the composition ratio of Table 1 below, followed by stirring at 50 ° C. at a stirring speed of 150 rpm for 5 hours to prepare an adhesive composition as a coating liquid.

* mol% is mol% of each component compared with 100mol% of total diamine component.

* SiDA-1: 1,3-bis (3-aminopropyl) tetramethyldisiloxane (SiDA-1, n = 1 of Formula 1)

* SiDA-4: 1,3-bis (3-aminopropyl) polydimethyldisiloxane (SiDA-4, n = 4 of Chemical Formula 1)

* SiDA-8: 1,3-bis (3-aminopropyl) polydimethyldisiloxane (SiDA-8, n = 8 of Chemical Formula 1)

[ Example 1 ]

The adhesive composition (A) was applied to a 125 μm-thick polyimide film (TDC, Kapton 500H) and thermally imidized for about 20 minutes in a 200 ° C. dryer to prepare an adhesive tape for evaluating adhesive flow, EMC delamination, and adhesion. . At this time, the thickness of the adhesive layer was confirmed to be 15 ± 2㎛.

Furthermore, said adhesive composition (A) was apply | coated to copper foil, and thermal imidation was advanced for about 20 minutes in 230 degreeC dryer. Thereafter, copper foil was removed using iron dichloride to prepare a polyimide resin to evaluate glass transition temperature and residual solvent amount.

[Example 2]

A sample for evaluation was produced in the same manner as in Example 1, except that the adhesive composition (B) was used.

[Example 3]

A sample for evaluation was produced in the same manner as in Example 1, except that the adhesive composition (C) was used.

Example 4

A sample for evaluation was produced in the same manner as in Example 1, except that the adhesive composition (D) was used.

[Comparative Example 1]

A sample for evaluation was prepared in the same manner as in Example 1 except that the adhesive composition (E) was used.

[Comparative Example 2]

A sample for evaluation was produced in the same manner as in Example 1, except that the adhesive composition (F) was used.

[ Comparative Example 3 ]

A sample for evaluation was produced in the same manner as in Example 1 except that the adhesive composition (G) was used.

The evaluation results of the samples prepared in Examples 1 to 4 and Comparative Examples 1 to 3 are summarized in Table 2 below.

Item Glass transition temperature Adhesive flow EMC Delamination Adhesion Residual solvent amount Example 1 170 ℃ ○ ◎ ○ 0.7wt% Example 2 154 ℃ ◎ ◎ ◎ 0.8 wt% Example 3 162 ℃ ◎ ○ ○ 0.6 wt% Example 4 153 ℃ ◎ ○ Δ 0.7wt% Comparative Example 1 189 ℃ X ◎ Δ 0.8 wt% Comparative Example 2 138 ℃ ◎ X ○ 0.7wt% Comparative Example 3 164 ℃ Δ X Δ 0.7wt%

[ Example 5 ]

A sample for evaluation was prepared in the same manner as in Example 1 except that the adhesive composition (B) was used and thermal imidization was performed for about 5 minutes in a dryer.

[Example 6]

A sample for evaluation was prepared in the same manner as in Example 1, except that the adhesive composition (B) was used and thermal imidization was performed in a dryer for about 3 minutes.

The evaluation results of the samples prepared in Examples 5 to 6 are summarized in Table 3 below.

Item Adhesive flow EMC Delamination Adhesion
(gf / cm) Residual solvent amount Example 5 ◎ ○ ◎ 1.2wt% Example 6 ◎ Δ ◎ 1.6wt%

Example 7

A sample for evaluation was prepared in the same manner as in Example 1 except that the adhesive composition (H) was used.

[Example 8]

A sample for evaluation was produced in the same manner as in Example 1, except that the adhesive composition (I) was used.

[Example 9]

A sample for evaluation was produced in the same manner as in Example 1 except that the adhesive composition (J) was used.

[Example 10]

A sample for evaluation was produced in the same manner as in Example 1, except that the adhesive composition (K) was used.

[Example 11]

A sample for evaluation was produced in the same manner as in Example 1 except that the adhesive composition (L) was used.

[Example 12]

A sample for evaluation was produced in the same manner as in Example 1 except that the adhesive composition (M) was used.

The evaluation results of the samples prepared in Examples 7 to 12 are summarized in Table 4 below.

Item Adhesive flow EMC Delamination Example 7 ◎ ○ Example 8 ◎ ○ Example 9 ◎ Δ Example 10 ○ ○ Example 11 ○ ○ Example 12 ◎ Δ

The method of evaluating the physical properties using the heat resistant adhesive tape according to the Examples and Comparative Examples is the same as the Experimental Example.

[Experimental Example]

1. Evaluation Method of Glass Transition Temperature

The polyimide resin prepared in Examples and Comparative Examples was evaluated by DSC (Differential Scanning Calorimetry) equipment. At this time, the temperature increase rate was 20 degreeC / min, and the temperature range was 30-250 degreeC.

2. Adhesive Flow Evaluation

A pressure of 6 MPa and a time of 1 second or less using a hot press (Hot press, mold size: 15 cm × 15 cm) by cutting the adhesive tape prepared in Examples and Comparative Examples into a circle having a diameter of 0.5 cm. After pressing on the lead frame, the flow of the adhesive was confirmed. The results are summarized based on the hot press temperature at which resin is observed according to the criteria in Table 5 below.

Hot press temperature at which resin is observed result 230 ℃ ◎ 240 ℃ ○ 250 ℃ Δ Above 250 ℃ X

3. EMC Delamination Evaluation

The adhesive tapes prepared in Examples and Comparative Examples were encapsulated with an epoxy molding compound (EMC), cured at 180 ° C. for 2 hours, and then treated under the conditions of Table 6, and heat-treated in an oven at 260 ° C. for 15 minutes. After the heat treatment, delamination was observed at the interface between the adhesive tape and the epoxy molding compound (EMC). The results are summarized according to the criteria in Table 6 below.

Temperature / humidity condition Dil lamination result 85 ° C / 85% RH, 168 hours None ◎ 85 ° C / 60% RH, 168 hours None ○ 30 ° C / 60% RH, 168 hours None Δ 30 ° C / 60% RH, 168 hours Generation (NG) X

4. Evaluation of adhesion

The adhesive tapes prepared in Examples and Comparative Examples were cut into 1 cm width x 10 cm lengths, and a hot press (Hot press, mold size: 15 cm x 15 cm) was used at a temperature of 230 ° C. and 3 MPa. The pressure and the adhesion at 90 ° peeling after pressing with the Shiny surface of the copper foil for 1 second time were measured. The results are summarized according to the criteria in Table 7 below.

Adhesion result 500gf / cm or more ◎ More than 300gf / cm ○ 100gf / cm or more Δ Less than 100gf / cm X

5. Evaluation of residual solvent amount

The polyimide resins prepared in Examples and Comparative Examples were evaluated using a TGA (Thermo Gravimetry Analyzer) equipment.

Step 1: 30 → 60 ° C., 20 ° C./min

Step 2: 60 ° C, hold for 1 hour (value 1)

Step 3: 60 → 260 ° C., 20 ° C./min

Step 4: Hold at 260 ° C for 30 minutes (Value 2)

* Residual solvent amount (wt%) = [(value1)-(value2)] / (value2) x 100

As can be seen in Tables 2 to 4, the flow of the adhesive and the delamination inhibitory force at the EMC interface have a trade-off relationship, and at least with respect to the polyimide resin comprising at least the tetracarboxylic acid component and the diamine component. When the polyimide resin contains a siloxane-based diamine component and an aromatic diamine component represented by Formula 1, and the siloxane-based diamine component represented by Formula 1 contains 40 to 60 mol% of all diamine components, flowability of the adhesive And with tape

It can be seen that it is possible to manufacture a heat resistant tape exhibiting excellent properties in the inhibition of delamination at the EMC interface.

It is to be understood that the present invention is not limited to the above embodiments and various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.

10: heat resistant film 2: heat resistant adhesive layer

Claims (10)

In the heat-resistant adhesive tape in which the heat-resistant adhesive layer is applied to at least one surface of the heat-resistant film and the heat-resistant film,
The heat resistant adhesive layer comprises a polyimide resin consisting of aromatic tetracarboxylic acid and diamine, wherein the diamine of the polyimide resin includes siloxane-based diamine and aromatic diamine, wherein the siloxane-based diamine is 40 to 60 mol in total of the diamine. %, Wherein the residual solvent amount of the polyimide resin is 1 wt% or less. The method of claim 1,
The siloxane-based diamine has the structure of Formula 1,
[Chemical Formula 1]

Here, n is a natural number of 1 to 30, R1 and R6 are the same or different, but an alkylene group or phenylene group having 1 to 30 carbon atoms, R2 to R5 are the same or different alkyl groups having 1 to 30 carbon atoms, 1 to 30 carbon atoms It is an alkoxy group, a phenyl group, or a phenoxy group, The heat resistant adhesive tape characterized by the above-mentioned. 3. The method of claim 2,
The siloxane-based diamine of Formula 1 is characterized in that n is 1 to 5, heat resistant adhesive tape. The method of claim 3,
The siloxane-based diamine of Formula 1 is characterized in that n is 1, heat resistant adhesive tape. The method of claim 1,
The glass transition temperature of the polyimide resin is 150 ~ 175 ℃, heat-resistant adhesive tape. delete The method of claim 1,
Wherein said aromatic tetracarboxylic acid comprises 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (3,3', 4,4'-BPDA). The method of claim 1,
The aromatic diamine is characterized in that it comprises 4,4'-diaminodiphenyl ether (4,4'-DPE), heat resistant adhesive tape. The method according to any one of claims 1 to 5, 7, and 8,
The heat resistant film is a polyimide film, heat resistant adhesive tape. delete

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