KR101362636B1 - Apparatus for loading a wafer appling laser align method - Google Patents

Abstract

The wafer loading apparatus to which the laser alignment method is applied includes a laser module and a loading module. The laser module is located on the wafer stage where a plurality of satellite stages loaded with wafers are arranged, and calculates alignment data of satellite stages by checking images of an irradiation unit for irradiating laser light to the satellite stage and satellite stage irradiated with laser light. It includes a calculating unit. The loading module loads the wafer into the satellite stage based on the alignment data at a position adjacent to the wafer stage.

Description

Wafer loading device with laser alignment method {APPARATUS FOR LOADING A WAFER APPLING LASER ALIGN METHOD}

The present invention relates to a wafer loading apparatus, and more particularly, to an apparatus for loading a wafer into a satellite stage for manufacturing a semiconductor device.

In general, semiconductor devices are fabricated from wafers based on silicon. Specifically, the semiconductor device is manufactured by performing a deposition process, a photolithography process, an etching process, an ion implantation process, a cleaning process, an inspection process, and the like on the wafer.

In the above deposition process, an organic metal chemical vapor deposition (hereinafter referred to as MO-CVD) apparatus for depositing a thin film by supplying a source gas of an organic metal to the wafer surface in the vacuum space in the vacuum space in which the wafer is sealed. Can be used.

The MO-CVD apparatus includes a wafer stage in which a plurality of satellite stages in which the wafer is loaded are arranged. Accordingly, the wafer is loaded onto each of the satellite stages through a loading module while the cover of the MO-CVD apparatus is opened to expose the plurality of satellite stages.

At this time, before loading the wafer so that the wafer can be correctly loaded on each satellite stage, an alignment process for accurately determining the position of the satellite stage to be loaded and the loaded wafer after the wafer is loaded correctly A seating check process is necessary to ensure that the

The alignment process is to illuminate the satellite stage to be loaded, such as LED to confirm the image to calculate the necessary alignment data, the seating inspection process is irradiated with laser light on the loaded wafer of the laser light reflected It checks for correct seating through reception.

However, since the alignment process and the seating inspection process require different devices as different methods are applied, the overall process is complicated and the manufacturing cost increases.

An object of the present invention is to provide a wafer loading apparatus that can simplify the equipment by applying the laser method used in the seating inspection process in the alignment process to accurately determine the position of the satellite stage.

In order to achieve the above object of the present invention, the wafer loading apparatus to which the laser alignment method according to one feature is applied includes a laser module and a loading module.

The laser module is positioned on the wafer stage where a plurality of satellite stages loaded with wafers are arranged, and checks an image of an irradiation unit for irradiating a laser light to the satellite stage and an image of the satellite stage irradiated with the laser light to freeze the satellite stage. And a calculating unit for calculating phosphorus data. The loading module loads the wafer into the satellite stage based on the alignment data at a position adjacent to the wafer stage.

The calculation unit is connected to the sensing unit and the sensing unit for detecting the edge of the satellite stage having a circular shape by checking the irradiated laser light and the center point of the satellite stage as the alignment data through the position of the detected edge It includes a center point calculation unit for calculating the.

The irradiator may irradiate a slit laser light. Thus, the laser module may further include a driving unit for driving the irradiation unit to change the irradiation position of the laser light of the slit type.

In addition, the laser module is connected to the receiving unit and the receiving unit disposed adjacent to the irradiating unit so as to receive the laser light is irradiated to the wafer loaded on the satellite stage from the irradiating unit and the wafer is received depending on whether the laser beam is received It may further include a seating inspection unit for checking whether or not normally seated.

According to the wafer loading device to which the laser alignment method is applied, the laser loading method is used for the alignment process in the background art by performing an alignment process to accurately determine the position of the satellite stage using the laser light used in the seating inspection process. By eliminating the LED light, it is possible to simplify the overall equipment for performing the alignment process and the seating inspection process. As a result, the cost of manufacturing the equipment can be drastically reduced.

1 is a schematic view showing a wafer loading apparatus for performing an alignment process according to an embodiment of the present invention.
FIG. 2 is a view of the wafer stage of the wafer loading apparatus shown in FIG.
3 is a view illustrating a state in which laser light is irradiated onto the wafer stage of FIG. 2.
4 is an enlarged view of a portion A in Fig.
FIG. 5 is a view illustrating a state in which a seating inspection process is performed through the wafer loading apparatus illustrated in FIG. 1.
FIG. 6 is a diagram illustrating a reflection form of laser light according to a state in which a wafer is seated on the wafer stage illustrated in FIG. 5.

Hereinafter, a latch opening device for a test handler according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

FIG. 1 is a schematic view showing a wafer loading apparatus performing an alignment process according to an embodiment of the present invention, and FIG. 2 is a view of the wafer stage of the wafer loading apparatus illustrated in FIG. 1 as viewed from above.

1 and 2, a wafer loading apparatus 100 according to an embodiment of the present invention includes a laser module 200 and a loading module 300.

The laser module 200 is positioned above the wafer stage 10 in which a plurality of circular satellite stages 12 loaded with wafers W used to manufacture a semiconductor device are arranged. For example, the wafer stage 10 may be disposed in an organometallic chemical vapor deposition (hereinafter referred to as MO-CVD) for depositing a thin film by supplying a source gas of an organic metal to the wafer (W).

Accordingly, the laser module 200 may be configured to enter a cover (not shown) of the MO-CVD apparatus in an open state so that the wafer stage 10 is exposed. Alternatively, if the MO-CVD apparatus is sufficiently movable, the apparatus itself may be moved to be located under the laser module 200.

In addition, the plurality of satellite stages 12 may be arranged radially with respect to the center of the wafer stage 10. Meanwhile, the satellite stage 12 may be connected to a separate drive motor (not shown) so that the thin film may be uniformly deposited on the wafer W, and may be configured to rotate during the deposition process. In this case, the satellite stage 12 may have a structure that is inserted into the hole 14 of the wafer stage 10 for smooth rotation.

The laser module 200 includes an irradiator 210 and a calculator 220. The irradiator 210 irradiates the laser light L to the satellite stage 12. The calculator 220 checks an image of the satellite stage 12 irradiated with the laser light L and calculates alignment data of the satellite stage 12.

3 is a view illustrating a state in which laser light is irradiated onto the wafer stage of FIG. 2, and FIG. 4 is an enlarged view of portion A of FIG. 3.

3 and 4, the calculator 220 includes a detector 222 and a center point calculator 224.

The detector 222 detects an edge of the satellite stage 12 by checking the image of the satellite stage 12. In this case, since the satellite stage 12 has a structure inserted into the hole 14 of the wafer stage 10 and is spaced apart from the inner surface of the hole 14 so that the satellite stage 12 can rotate smoothly during the deposition process. The detector 222 may detect an edge of the satellite stage 12. In addition, since the satellite stage 12 is inserted with a predetermined stepped structure with the upper surface of the wafer stage 10 so that the wafer W is loaded on the satellite stage 12, the sensing unit 222. ) Can detect the edge of the satellite stage 12 more easily.

Thus, the irradiator 210 may detect the image of the satellite stage at a different position from the detector 222 as shown in FIG. 1 so that the detector 222 can check the image of the satellite stage 12 without interference. The laser beam L can be irradiated obliquely to 12.

The irradiator 210 may irradiate the laser light L in a slit form so that the edge of the satellite stage 12 can be checked at a time. In detail, the edge of the satellite stage 12 at the edge of the satellite stage 12 is spaced apart from the inner surface of the hole 14 and has a stepped structure with the top surface of the wafer stage 10. Since the laser light L having a slit form a broken shape as shown in FIG. 3 at the edge of the satellite stage 12, the detector 222 can easily detect the edge of the satellite stage 12 at one time. Can be.

The center point calculator 224 is connected to the detector 222. The center point calculator 224 calculates the center point of the satellite stage 12 based on the edge of the satellite stage 12 received from the detector 222.

In this case, in order for the center point calculator 224 to calculate the center point, at least three pieces of data of the satellite stage 12 are necessary. Thus, since the laser light L of the slit type irradiated from the irradiation unit 210 typically detects two edges of the satellite stage 12 from both sides, the position of the laser light L of the slit type that is irradiated It is necessary to further detect the edges of the satellite stage 12 at other locations by changing.

Therefore, the laser module 200 may further include a driving unit 230 which rotates or moves the irradiation unit 210 to change the irradiation position of the slit laser light L. FIG.

In detail, when the driving unit 230 drives the irradiation unit 210 once, as shown in FIG. 3, the two laser beams L having the slit type are irradiated with the satellite stage 12 at different positions. The detector 222 may detect four edges of the satellite stage 12.

As a result, the center point calculator 224 may calculate the center point of the satellite stage 12 based on four or more satellite stage 12 edge data. In addition, since the edge data is four, the center point calculator 224 may calculate the center point more accurately according to various combinations of three pieces of data capable of calculating the center point. .

The loading module 300 loads the wafer W into the satellite stage 12 at a position adjacent to the wafer stage 10. For example, the loading module 300 may pick up the wafer W through a vacuum adsorption method in an air place and load the wafer W on the satellite stage 12.

In this case, the loading module 300 receives the center point data of the satellite stage 12 connected to the center point calculator 224 and transfers the wafer W to the satellite stage 12 based on the data. Load it correctly.

Therefore, since the center point data serves as alignment data, an alignment process for accurately loading the wafer W into the satellite stage 12 may be performed using the laser light L. FIG.

FIG. 5 is a view illustrating a state in which a seating inspection process is performed through the wafer loading apparatus illustrated in FIG. 1, and FIG. 6 is a view illustrating a reflection form of laser light according to a state in which a wafer is seated on the wafer stage illustrated in FIG. 5. to be.

5 and 6, the laser module 200 further includes a receiver 240 and a seating inspection unit 250.

The receiver 240 is disposed adjacent to the irradiator 210 to receive the laser light L that is irradiated and reflected from the irradiator 210 onto the wafer W loaded on the satellite stage 12. . Specifically, the irradiation unit 210 by irradiating the laser light (L) inclined, the receiving unit 240 is a vertical line passing through the point where the laser light (L) of the wafer (W) as shown in FIG. It may be arranged in a symmetrical structure with the irradiation unit 210 as a reference.

The seating inspection unit 250 is connected to the receiver 240. The seating inspection unit 250 inspects whether the wafer W is normally seated according to whether the receiver 240 receives the laser light L reflected from the wafer W, thereby checking Perform a seating test process.

Specifically, when the wafer W is normally seated as shown in FIG. 6, since the laser light L irradiated from the irradiation unit 210 to the wafer W is reflected toward the receiving unit 240 and is received. The seating inspection unit 250 determines that the seating of the wafer W is normal and, conversely, the wafer W is bad, for example, the hole of the wafer stage 10 around the satellite stage 12. When it is loaded inclined over 14, the laser light L irradiated from the irradiator 210 onto the wafer W is reflected to a position different from that of the receiver 240, and thus cannot be received by the receiver 240. As a result, the seating inspection unit 250 determines that the seating of the wafer W is poor.

As such, the above-described alignment process and the seating inspection process may be performed using the laser beam L, thereby simplifying the wafer loading apparatus 100 performing the above processes. As a result, the cost of manufacturing the wafer loading apparatus 100 can be drastically reduced, and the installation space required for the wafer loading apparatus 100 can be reduced.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

W: Wafer L: Laser Light
10: wafer stage 12: satellite stage
100: wafer loading device 200: laser module
210: irradiation unit 220: calculation unit
222: detection unit 224: center point calculation unit
230: driving unit 240: receiving unit
250: seating inspection unit 300: loading module

Claims (5)

Computing alignment data of the satellite stage by checking an image of an irradiation unit for irradiating a laser light to the satellite stage and an image of the satellite stage irradiated with the laser light, which is positioned on the wafer stage where a plurality of satellite stages on which the wafer is loaded is arranged. A laser module including a calculation unit to perform; And
And a loading module for loading the wafer into the satellite stage based on the alignment data at a position adjacent to the wafer stage. The method of claim 1, wherein the calculation unit
A detector configured to check the irradiated laser light and detect an edge of the satellite stage having a circular shape; And
And a center point calculator connected to the sensing unit and calculating a center point of the satellite stage using the alignment data through the position of the sensed edge. The wafer loading apparatus of claim 1, wherein the irradiator irradiates a slit laser beam. The wafer alignment apparatus of claim 3, wherein the laser module further comprises a driving unit driving the irradiation unit to change the irradiation position of the slit-shaped laser light. The method of claim 1, wherein the laser module
A receiver disposed adjacent to the irradiator to receive laser light reflected from the irradiator onto a wafer loaded on the satellite stage; And
And a seating inspection unit connected to the receiving unit and inspecting whether the wafer is normally seated according to whether the laser light is received.

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