JP2005019963A - Substrate processor and method of adjusting substrate delivery position - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To align a substrate with high accuracy for a short time in acquiring the data of a substrate delivery position to a substrate holding part beforehand with respect to a substrate conveying means conveying the substrate in and out of a processing unit performing predetermined processes to the substrate. <P>SOLUTION: With respect to a mark that is formed on the surface of a substrate for alignment delivered to a substrate holding part by a substrate conveying means, the positions of the marks are respectively imaged before and after the time when the substrate holding part is rotated 180°, for example. After the misregistration between the positions of the center of the substrate and the rotational center of the substrate holding part is calculated on the basis of the positional data of this mark, the existence of the misregistration calculated by this means is decided. There is such a constitution that the substrate is rearranged to the substrate conveying means in such a manner that the center of the substrate coincides with the rotational center of the substrate holding part at the time when it is decided that there is misregistration. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention obtains in advance position data of a substrate transport means when delivering a substrate to a processing unit that performs predetermined processing such as resist application, development, and heating on the substrate held by the substrate holding unit. The present invention relates to a processing apparatus and a method for adjusting a delivery position of a substrate.

  Conventionally, in a photoresist process, which is one of semiconductor manufacturing processes, for example, a resist is applied in a thin film on the surface of a semiconductor wafer (hereinafter referred to as a wafer), the resist is exposed in a predetermined pattern, and then developed. A predetermined mask pattern is formed. Such processing is generally performed using a substrate processing apparatus in which an exposure apparatus is connected to a coating / developing apparatus that performs resist coating / development.

  Each of the substrate processing apparatuses includes a processing apparatus that performs a plurality of different processes on the substrate, such as a coating process, a developing process, and a heating / cooling process, in order to reduce the area occupied by the apparatus while ensuring a high throughput. The number of units necessary for each of these processes is incorporated, and a substrate transport means for loading / unloading the substrate to / from each processing unit is provided.

  Briefly describing such a substrate processing apparatus, for example, a coating / developing apparatus shown in FIG. 15 is given as an example. In this apparatus, for example, the substrate carrier 10 containing 25 wafers W is loaded into the carrier stage 11, and the wafer W is taken out by the transfer arm 12 and transferred to the processing zone 14 via the transfer unit of the shelf unit 13a. Is done. The processing zone 14 is provided with a transport means 15 at the center, around which a coating unit 16 for coating the wafer W with the coating liquid, a low-temperature heating unit for drying the coating liquid, and a baking process. For example, three shelf units 13 a, 13 b, and 13 c having processing units such as a baking unit for performing a curing process and a curing unit for performing a curing process are provided. W is delivered.

  By the way, in order for each processing unit to perform high-precision processing on the substrate, it is required to place the wafer W with high accuracy on a predetermined placement region of the processing unit. Specifically, for example, in the coating unit 16, after applying the coating liquid on the surface of the wafer W, a process called edge rinsing is performed in which the cleaning liquid is supplied to the peripheral edge by the cleaning liquid nozzle and cleaned while rotating the wafer W around the vertical axis. Therefore, when the center of the wafer W is deviated from the center of the rotation axis, there may be a portion where the edge is not cleaned and a portion where the edge is cleaned with a width of a predetermined width or more. In addition, in the heating / cooling unit, temperature variations may occur within the surface. Therefore, before actually starting the process, an operation is performed in which the transfer means 15 learns the delivery position of the wafer W in advance so that the wafer W is placed on an appropriate placement area. This operation is generally called teaching. In the conventional teaching method, first, for example, an edge of the wafer W placed on the placement area is detected using a reflective sensor, and the wafer W is placed in a predetermined placement area. And a method of adjusting the delivery position based on the determination result has been used (see, for example, Patent Document 1). An example of conventional teaching will be described with reference to FIG. 16, taking the case of the coating unit 16 as an example. In FIG. 2, reference numeral 2 denotes a wafer W held from the back side and rotated about the vertical axis. It is a spinner that can be made to do. Reference numeral 21 denotes a reflective sensor, which is configured to be advanced and retracted in the radial direction of the wafer W by a driving mechanism (not shown).

  Teaching is performed by the following method. First, the wafer W is transferred to the spinner 2 by the transfer means 15, and then the sensor 21 waiting on the outside of the periphery of the wafer W is moved laterally at a predetermined speed to pass above the periphery of the wafer W. Subsequently, the sensor 21 is returned to just before the position where the light is reflected, and the periphery of the wafer W is detected by slowly retracting the sensor 21 at intervals of one pulse, for example, in order to increase accuracy. Further, the same processing is performed in each state in which the wafer W is rotated three times at 90 ° intervals around the vertical axis, and calculation is performed on the basis of the position data of the four points on the periphery of the wafer W. Find the center position. Then, the wafer is repositioned (retry) until the center of the wafer coincides with the center of the rotation axis of the spinner that has been grasped in advance or is within the allowable range. At this time, as the retry is made, the deviation becomes smaller and generally converges at most 5 times.

JP 2000-349133 A (paragraphs 0069 to 0072, FIG. 9)

  However, in the above teaching, it is not economical to provide the sensors 21 for all the units of the substrate processing apparatus. Therefore, when the teaching is performed using the common sensor 21, The actual situation is that the sensor 21 is set. In particular, in the coating / developing apparatus in which a plurality of processing units are incorporated, each processing unit is miniaturized in order to reduce the area occupied by the apparatus. There was a problem that it took time to set up.

  Further, when the light reflection type sensor 21 is used, the sensitivity of the sensor 21 may vary depending on the surrounding atmosphere such as dust and illumination, so that the edge of the wafer W may not be detected with high accuracy. .

  The present invention has been made based on such circumstances, and an object thereof is to provide a substrate processing apparatus and a substrate alignment method capable of aligning a substrate with high accuracy and in a short time. is there.

The substrate processing apparatus of the present invention includes a processing unit that performs a predetermined process on a substrate held horizontally by a substrate holding unit that is rotatable about a vertical axis, and the substrate is transferred to the substrate holding unit by a substrate transfer unit in advance. In a substrate processing apparatus that acquires position data,
An imaging means for imaging a mark formed on the surface of the substrate for alignment delivered to the substrate holding unit by the substrate transport means;
The position of the center of the substrate and the center of rotation of the substrate holder based on the data of the position that halves the straight line connecting the positions of the marks imaged before and after the substrate holder is rotated 180 degrees. Means for calculating the deviation amount of
Means for determining the presence or absence of the amount of displacement obtained by this means;
Means for repositioning the substrate with respect to the substrate transport means so that the center of the substrate and the rotation center of the substrate holding portion coincide with each other when it is determined that there is a displacement amount;
And a storage unit that stores position data of the substrate transfer unit when the center of the substrate coincides with the rotation center of the substrate holding unit.

  For example, the mark may be formed at the center of the surface of the substrate. Further, the means for determining the positional deviation amount has an allowable value that is regarded as coincident with the rotation center according to a preset type of processing unit, and determines whether or not the positional deviation amount is larger than the allowable value. It may be.

According to another aspect of the present invention, there is provided a processing unit for performing a predetermined process on a substrate held horizontally by a substrate holding unit, and acquiring in advance substrate transfer position data with respect to the substrate holding unit by a substrate transfer unit. In the processing device,
An imaging means for imaging a mark formed at the center of the surface of the substrate for alignment delivered to the substrate holding unit by the substrate transport means;
Based on the imaging result of the mark by the imaging unit and the imaging result of the mark formed at the center of the substrate holding unit that has been imaged in advance, it is determined whether or not the center of the substrate matches the center of the substrate holding unit. And a judging means.

Still another invention includes a processing unit that performs a predetermined process on a substrate held horizontally by a substrate holding unit, and previously acquires substrate transfer position data with respect to the substrate holding unit by the substrate transfer means. In the processing device,
An imaging means for imaging a mark formed at the center of the surface of the substrate for alignment delivered to the substrate holding unit by the substrate transport means;
Means for calculating an amount of displacement between the center of the substrate and the center of the substrate holding unit based on the imaging result of the mark by the imaging unit and the imaging result of the mark formed at the center of the substrate holding unit imaged in advance; ,
Means for determining whether or not the amount of displacement obtained by this means is greater than an allowable value;
Means for repositioning the substrate with respect to the substrate transport means so that the center of the substrate and the center of the substrate holding part coincide with each other when it is determined that the amount of positional deviation is larger than the allowable value;
And storage means for storing position data of the substrate transport means when the center of the substrate coincides with the center of the substrate holder.

Still another invention is provided with a processing unit that performs a predetermined process on a substrate held horizontally by a substrate holding portion that is rotatable about a vertical axis, and is previously provided for a substrate holding portion by a plurality of transfer arms of a substrate transfer means. In a substrate processing apparatus that acquires substrate transfer position data,
One transfer arm that delivers a substrate for alignment to the substrate holding portion;
Imaging means for imaging the mark formed on the surface of the alignment substrate delivered to the substrate holding unit and the mark that can be the center position of the substrate holding unit;
Another transfer arm different from the one transfer arm holding the imaging means;
A position data acquisition program for obtaining coordinate position data from imaging data of the mark imaged by the imaging means and a mark that can be a center position of the substrate holding unit;
Each coordinate position data obtained from the imaging results of the marks respectively imaged before and after the alignment substrate is placed on the substrate holding unit and rotated 180 degrees by the position data acquisition program;
A calculation program for calculating a positional deviation amount by comparing the coordinate position data in which a straight line connecting the coordinate position data is halved with the coordinate position data obtained as the center position of the substrate holder;
A determination program for determining the presence or absence of a positional deviation amount obtained by calculation;
A retry program for repositioning the substrate with respect to the substrate transport means so that the coordinate position data determined as the center position of the substrate and the substrate holding portion coincides with the amount of displacement;
Storage means for storing position data of the substrate transfer means when coordinate data of the center of the substrate for alignment and coordinate data of the center position of the substrate holding part coincide with each other. . In this case, the determination program may have a predetermined allowable value depending on the type of processing unit set in advance.

  The substrate transport means includes a plurality of transport arms arranged vertically and independently movable forward and backward, and a substrate for alignment with one transport arm and the other transport arm of the plurality of transport arms, and A configuration in which the imaging unit is held may be employed. In this case, after the substrate transfer position in one transfer arm is determined, the alignment substrate is transferred to the substrate holder by the other transfer arm, and the imaging means is held in the transfer arm other than the other transfer arm. Thus, the transfer position data of the substrate in the other transfer arm may be acquired, or the image pickup means held in the other transfer arm may transfer the transfer arm other than the other transfer arm via the substrate holding unit. Alternatively, the other transfer arm may be a dedicated arm that holds the imaging means. Furthermore, the substrate support part which can be moved up and down while supporting the back side of the substrate may be provided, and the substrate transferred to the substrate holding part may be brought close to the imaging means by the substrate lifting part and imaged. .

The substrate transfer position adjusting method according to the present invention is provided in a processing unit that performs predetermined processing on a substrate, and is used when a substrate is transferred by a substrate transfer means to a substrate holding portion that is rotatable about a vertical axis. In the substrate transfer position adjustment method for acquiring the position data of the substrate transfer means,
A step of transferring a substrate for alignment on which a mark is formed on the surface to the substrate holder by a substrate transfer means;
Imaging the mark with an imaging means before and after the substrate holding part is rotated 180 degrees;
A step of calculating a positional shift amount between the center of the substrate and the rotation center of the substrate holding unit based on data of a position in which a straight line connecting the positions of the marks obtained in this step is halved;
Determining the presence or absence of the amount of misalignment determined in this step;
Repositioning the substrate with respect to the substrate transfer means so that the center of the substrate and the rotation center of the substrate holding portion coincide with each other when it is determined that there is a displacement amount;
Obtaining the position data of the substrate transport means when the center of the substrate coincides with the center of rotation of the substrate holding part.

According to another aspect of the present invention, there is provided a substrate transfer position for acquiring position data of the substrate transfer unit when the substrate transfer unit transfers the substrate to a substrate holding unit provided in a processing unit that performs predetermined processing on the substrate. In the adjustment method of
A step of transferring a substrate for alignment in which a mark is formed at the center of the surface to the substrate holding unit by a substrate transfer means;
Then, imaging the mark with an imaging means;
And determining whether or not the center of the substrate matches the center of the substrate holding portion based on the imaging result obtained in this step.

Still another invention provides a substrate transfer position for acquiring position data of the substrate transfer means when the substrate transfer means transfers the substrate to a substrate holder provided in a processing unit that performs predetermined processing on the substrate. In the adjustment method of
A step of transferring a substrate for alignment in which a mark is formed at the center of the surface to the substrate holding unit by a substrate transfer means;
Then, imaging the mark with an imaging means;
A step of calculating a displacement amount between the center of the substrate and the center of the substrate holding unit based on the imaging result obtained in this step;
Determining whether or not the amount of misalignment determined in this step is greater than an allowable value;
Repositioning the substrate with respect to the substrate transport means so that the center of the substrate and the center of the substrate holding part coincide when the amount of positional deviation is larger than the allowable value;
Obtaining the position data of the substrate transport means when the center of the substrate coincides with the center of rotation of the substrate holding part.

  The substrate transfer means includes a plurality of transfer arms arranged vertically and independently movable forward and backward, and one of the plurality of transfer arms is advanced to move a substrate for alignment to a substrate holding unit. After the transfer, the one transfer arm is retracted, and then the other transfer arm among the plurality of transfer arms is advanced to mark the position of the substrate for alignment by the image pickup means held by the other transfer arm. You may make it image. In this case, after the transfer position of the substrate in one transfer arm is determined, a step of transferring the alignment substrate to the substrate holding unit by another transfer arm, and then imaging to a transfer arm other than the other transfer arm Holding the means and acquiring the position data of the other transfer arm, or placing the imaging means held by the other transfer arm on the substrate holding part, and the substrate holding part And a step of receiving a transfer arm other than the other transfer arm to receive the image pickup means placed on the camera, or the other transfer arm may be a dedicated arm for holding the image pickup means. Furthermore, the step of imaging the mark on the front surface of the substrate may be performed by bringing the substrate transferred to the substrate holding unit close to the imaging means by the substrate lifting unit that lifts and lowers while supporting the substrate from the back side.

  According to the present invention, the alignment substrate having the mark formed on the surface is held by the substrate holder, and the center of the rotation axis is obtained based on the locus of the mark when the substrate is rotated about the vertical axis. By adopting the configuration, it becomes easy to grasp how much the center of the substrate is deviated from the center of the rotation axis, and to reduce this misalignment, and to make the centers coincide with each other in a short time. Even when the substrate holder does not rotate, more accurate alignment can be performed by grasping the center of the substrate holder and the center of the substrate with the imaging unit and aligning the substrate transport unit. In addition, the imaging means is supported by the substrate conveying means, and the substrate conveying means guides the imaging means to the photographing position in the processing unit, thereby reducing the time and effort required for setting. The delivery position can be adjusted.

  First, a coating / developing apparatus according to an embodiment of a substrate processing apparatus of the present invention will be described with reference to FIGS. In the figure, B1 is a cassette mounting section for loading and unloading a cassette 3 in which, for example, 13 wafers W serving as substrates are hermetically stored, and a cassette station having a mounting section 30a on which a plurality of cassettes 3 can be mounted. 30, an opening / closing part 31 provided on a wall surface in front of the cassette station 30, and a delivery means A 1 for taking out the wafer W from the cassette 3 through the opening / closing part 31. Further, a processing unit B2 is connected to the back side of the cassette mounting unit B1, and the processing unit B2 uses a shelf unit U1, U2, U3 in which heating / cooling units are multi-staged and a wafer using processing liquid. Liquid processing units U4 and U5 for performing predetermined liquid processing on W, and main transfer means A2 and A3 for delivering the wafer W to each unit are provided. That is, the main transfer means A2 and A3 are configured to be accessible to adjacent units, and the wafer W can freely move in the processing section B1 from the shelf unit U1 on one end side to the shelf unit U3 on the other end side. It has become. In the figure, reference numerals 32 and 33 denote temperature / humidity adjustment units each having a treatment liquid temperature adjustment device and a temperature / humidity adjustment duct used in each unit.

  For example, as shown in FIG. 2, the liquid processing units U4 and U5 are provided with a coating unit (COT) and a developing unit (DEV) on a storage unit 34 that forms a space for supplying a chemical solution such as a coating solution (resist solution) and a developing solution. The antireflection film forming unit (BARC) and the like are stacked in a plurality of stages, for example, five stages. In addition, the above-described shelf units U1, U2, and U3 are configured such that various units for performing pre-processing and post-processing of the processing performed in the liquid processing units U4 and U5 are stacked in a plurality of stages, for example, 10 stages. The combination includes a heating unit for heating (baking) the wafer W, a cooling unit for cooling the wafer W, and the like.

  An exposure unit B4 is connected to an inner side of the shelf unit U3 in the processing unit B2 through an interface unit B3 including, for example, a first transfer chamber 35 and a second transfer chamber 36. In addition to two transfer means A4 and A5 for transferring the wafer W between the processing unit B2 and the exposure unit B4, a shelf unit U6 and a buffer cassette C0 are provided inside the interface unit B3.

  An example of the flow of the wafer W in this coating / developing apparatus is as follows. First, when the cassette 3 storing the wafer W is placed on the placement portion 30a from the outside, the lid of the cassette 30 is removed together with the opening / closing portion 31. Then, the wafer W is taken out by the transfer means A1. Then, the wafer W is transferred to the main transfer means A2 via a transfer unit (not shown) that forms one stage of the shelf unit U1, and is pre-processed as a coating process on one shelf in the shelf units U1 to U3. For example, an antireflection film forming process and a cooling process are performed, and then a resist solution is applied by a coating unit (COT). Next, the wafer W is heated (baked) by a heating unit forming one shelf of the shelf units U1 to U3, and further cooled, and then transferred to the interface unit B3 via the delivery unit of the shelf unit U3. In this interface section B3, the wafer W is transferred to the exposure section B4 through a path of transfer means A4 → shelf unit U6 → transfer means A5, for example, and exposure is performed. After the exposure, the wafer W is transferred to the main transfer means A2 through the reverse path, and developed by a developing unit (DEV) to form a resist mask. Thereafter, the wafer W is returned to the original cassette 30 of the mounting portion 30a.

  Here, the main transfer means A2 (A3) which is the above-described substrate transfer means will be described in detail with reference to FIG. The main transfer means A2 (A3) includes a moving base 40 that can be moved up and down and rotated around a vertical axis by a driving mechanism (not shown). The moving base 40 supports the periphery of the wafer W from the back side and the wafer. For example, three transfer arms 4A (4B, 4C) for conveying W in a horizontal posture and a transfer arm 4D for teaching are arranged in the vertical direction, and each transfer arm 4A (4B) is driven by a drive mechanism (not shown). 4C, 4D) can be independently advanced and retracted. The transfer arm 4D is a dedicated arm provided for teaching as will be described later, and is removed when all teaching is completed. Further, the main transport means A2 (A3) is surrounded by a partition wall 41 that partitions the processing space, and the processing units of each stage are disposed through the transport ports 42 that are formed on the side wall surface of the partition wall 41 and are arranged vertically. The wafer W is carried in and out. That is, the main transport means A2 (A3) has a position in the plane direction determined by polar coordinates by the forward and backward direction (R axis) and the rotation axis (θ axis) of the transport arm 4A (4B, 4C), and the vertical direction (Z axis). ) Determines the position in the height direction. That is, the positions of the transfer arms 4A to 4C are specified by the position coordinates of R, θ, and Z, and the movement amount is controlled by controlling the operation of the drive mechanism provided independently for each axis using, for example, an encoder. Is done.

  By the way, in the coating / developing apparatus, as described above, a plurality of processing units having different apparatus configurations for performing different processes are provided, and a common main transport means A2 (A3) is provided for these processing units. Since the wafer W is loaded and unloaded using the method, it is advantageous to select and use a teaching method according to the apparatus configuration in order to perform teaching more efficiently. Therefore, in this example, as will be described later, different teaching methods are adopted when the wafer mounting table of the processing unit to be teaching is rotated and when it is not rotated. Here, FIG. 4 shows a coating unit (COT) as an example of a processing unit having a function of rotating the wafer W, and FIG. 5 shows an example of a processing unit having no function of rotating the wafer W. A heating unit (BAKE) for heating the wafer W is shown.

  The coating unit (COT) will be described in detail. Reference numeral 5 in the figure denotes a spin chuck that is a substrate holding unit for sucking and holding the back surface of the wafer W. The spin chuck 5 is connected to a drive mechanism 52 via a shaft portion 51, and is configured to be rotatable around a vertical axis while holding the wafer W in a horizontal posture. A cup 53 is provided so as to surround the periphery of the side of the wafer W held by the spin chuck 5. A coating solution supply nozzle 54 for coating a resist solution, which is a coating solution, is provided so as to face the surface of the wafer W. Further, a cleaning liquid discharge part 55 for supplying a cleaning liquid to the periphery of the wafer W is provided below the wafer W. Below the back surface side of the spin chuck 5, for example, three substrate support pins 56 that are substrate lifting portions are provided, and the substrate support pins 56 can be lifted by the lifting portion 57 to support the wafer W from the back surface side. It is configured as follows.

  In such a coating unit (COT), the transfer arm 4A (4B, 4C) enters the unit through the transfer port 42 of the partition wall 41 while holding the wafer W in a horizontal posture, and moves the wafer W to the unit. A predetermined delivery position, for example, a position above the substrate holding region of the spin chuck 5 is arranged. Then, the wafer W is placed on the surface of the spin chuck 5 by a cooperative operation with the substrate support pins 56 that move up and down. After the transfer arm 4A (4B, 4C) is retracted, the coating solution supply nozzle 54 supplies the resist solution to the center of the wafer W and rotates the wafer W about the vertical axis to apply the resist solution by the action of centrifugal force. Spread on the surface of the wafer W. Thereafter, the resist solution is spin-dried by rotating the wafer W at a high speed, and then the cleaning solution is supplied from the cleaning solution discharge unit 55 to the peripheral portion while the wafer W is further rotated, and the resist solution applied to the peripheral portion. An edge rinse is performed.

  Next, the heating unit (BAKE) will be described in detail. In the figure, reference numeral 6 denotes a mounting table which is a substrate holding unit for mounting the wafer W. A heater 61 is provided inside the mounting table 6, and the surface of the mounting table 6 constitutes a heating plate that heats the wafer W. Further, the mounting table 6 is provided with a plurality of protrusions 62 called proxicity pins for slightly lifting the back surface of the wafer W from the mounting table 6 in order to prevent particles from adhering to the wafer W. One of them is provided at the center of the wafer W mounting area of the mounting table 6. Further, a through hole 63 penetrating vertically is provided on the surface of the mounting table 6, and a substrate support pin 64, which is a substrate elevating part, is provided through the through hole 63 so as to protrude and retract. In such a heating unit (BAKE), the transfer arm 4A (4B, 4C) enters the unit through the transfer port 42 of the partition wall 41 while holding the wafer W, and the wafer W is moved to a predetermined delivery position. For example, it arrange | positions in the upper position of the mounting area | region of the mounting base 6. FIG. Then, the wafer W is transferred to the substrate support pins 64 by a cooperative operation with the substrate support pins 64 that move up and down, and the substrate support pins 64 are further lowered to place the wafer W on the mounting table 6. The wafer W mounted on the mounting table 6 is heated to a predetermined temperature and then unloaded from the unit through a path opposite to the order described above.

  Next, the teaching means provided in the coating / developing apparatus will be described with reference to FIGS. In the drawing, W1 is a wafer for alignment used for teaching, and a circular mark M having a diameter of, for example, 5 mm is formed at a predetermined location, for example, at the center of the surface. Reference numeral 70 denotes a jig having the same size as the wafer W1, for example, and an opening 70a is formed in the central region thereof. Further, for example, a CCD camera 71 as an imaging means is provided on the upper surface side of the jig 70, and the CCD camera 71 is configured to be able to image a lower side region through the opening 70a. More specifically, during teaching, the jig 70 is guided to a position facing the surface of the wafer W1 held on the spin chuck 5 while being held in a horizontal posture on the teaching transfer arm 4D in the same manner as the wafer W1. Thus, the mark M of the wafer W1 can be imaged. The CCD camera 71 is connected to the control unit 8 which is a teaching control system through, for example, wiring.

  The control unit 8 will be described in detail. In the figure, 81 is an image data storage unit that stores image data picked up by the CCD camera 71, and 82 is the position of the mark M on the wafer W 1 at each rotational position of the spin chuck 5 (X, Working memories 83 and 84 for temporarily storing (Y coordinate) and the like are a first teaching program and a second teaching program, respectively. Actually, these programs 83 and 84 are stored in the memory (storage unit), but for convenience of explanation, the programs will be described with reference numerals. In this embodiment, main transfer means A2 (A3) for each of a processing unit such as a coating unit (COT) in which the mounting table for the wafer W1 rotates and a processing unit such as a heating unit (BAKE) in which the mounting table for the wafer W1 does not rotate. In order to perform teaching for the heating unit (BAKE) and the first teaching program 83 for teaching the coating unit (COT) and the like. And a second teaching program 84 are prepared. The first teaching program 83 acquires the position of the mark M at each rotational position (the coordinate position of the X and Y coordinates) based on the image data acquired by the CCD camera 71 at each rotational position of the spin chuck 5. Based on the data acquisition program 83a, the calculation program 83b for determining the amount of positional deviation between the rotation center of the spin chuck 5 and the center of the wafer W1 based on the position of the mark M at each rotation position, and the results obtained by this calculation program 83b And a retry program 83d for relocating (retrying) the wafer W1 by the transfer arm 4A (4B, 4C) when it is determined that the displacement amount is present. And.

  Further, the second teaching program 84 is based on the image data acquired by the CCD camera 71 and the position of the protrusion 62 that can be the center mark of the mounting table 6 (heating plate) of the heating unit (BAKE) and the wafer W1. The position data acquisition program 84a for acquiring the position of the mark M and the deviation between the position of the protrusion 62 and the position of the mark M on the wafer W1 are calculated based on the obtained result, and the position deviation amount is set in advance. A determination program 84b for determining whether or not the value is within the set range (allowable range), and a re-execution to reposition (retry) the wafer W1 by the transfer arm 4A (4B, 4C) when it is determined that the value is outside the allowable range. A trial program 84c.

  Furthermore, reference numeral 85 in the figure denotes a position where the center of the loaded wafer W1 coincides with the rotation center of the spin chuck 5, or a position of the protrusion 62 where the center of the wafer W1 can be a mark of the center of the mounting table 6. Is a storage unit for storing the transfer position of the wafer W1 of each transfer arm 4A (4B, 4C) for each processing unit when is within a predetermined allowable range. That is, the data stored in the storage unit 85 is the transfer position data of the transported arm 4A (4B, 4C) that has been taught, and is managed by the values of R, θ, and Z as described above. Note that 86 is an input means including an operation panel, for example, and an operation screen is displayed during teaching, for example. 87 is a CPU, 88 is a unit controller that controls the processing unit based on a control signal from the control unit 8, and 89 is an arm controller that controls the main transport means A2 and A3 based on a control signal from the control unit 8. B is a bus.

  Next, the process of teaching the transfer arm 4A (4B, 4C) will be described with reference to FIGS. 8 and 9. Here, in the case of a coating unit (COT) which is a processing unit having a function of rotating the wafer W1. explain. First, as shown in step S1, as preparation, the wafer W1 for alignment is supported by, for example, the upper transfer arm 4C where teaching is performed, and the jig 70 is supported by the transfer arm 4D dedicated for teaching. Next, for example, based on the position of the spin chuck 5 stored based on the design data, the transfer arm 4D is extended forward (in the R-axis direction), and in this state, the CCD camera 71 captures the spin chuck 5 while imaging its approximate center position. For example, the position of the vacuum hole formed at the center of the surface of the spin chuck 5 for adsorbing the back surface of the wafer W is confirmed (step S2). As a result, the center of the spin chuck 5 is positioned near the approximate center of the imaging area of the jig 70 supported by the transfer arm 4D. The position coordinates of the transfer arm 4D at this time are stored in the working memory 82. Thereafter, the transfer arm 4C is advanced based on the stored position coordinates, and the wafer W1 is placed at the transfer position. At this time, in the coating unit (COT), as described above, the wafer W1 is transferred from the transfer arm 4C to the spin chuck 5 via the substrate support pins 56 (step S3).

  Next, the transfer arm 4C moves backward, and as shown in step S4, the transfer arm 4D supporting the jig 70 enters the unit based on the position coordinate data acquired in step S2, and the wafer W1 held on the spin chuck 5 is moved. The jig 70 is guided to a position facing the surface of the wafer W, and the CCD camera 71 images the mark M on the surface of the wafer W1. The image data 200 obtained by the imaging is taken into the image data storage unit 81. Next, based on the position data acquisition program 83a, position data in the imaging region of the image data 200, for example, position coordinates such as X = 1 and Y = 1. Are obtained by calculation and stored in the working memory 82 (step S5). Subsequently, as shown in step S6, the rotation operation of the spin chuck 5 is controlled by the unit controller 88, whereby the wafer W1 is rotated around the vertical axis by a predetermined angle, for example, 90 degrees, and the position data in each phase is similarly set. Get each one. The position data to be acquired may be at least two places and an even number, for example, and may be opposed at a position of 180 ° before and after the rotation. For example, as shown in FIG. 9A, in the case of acquiring position data at four positions of 0 degrees, 90 degrees, 180 degrees, and 270 degrees as in this example, the steps are performed until all of these position data are acquired. The operations of S4 to S6 are repeated (step S7).

Subsequently, as shown in step S8, the center of the rotation axis is obtained by the arithmetic program 83b based on the position data obtained by the position data obtaining program 83a. Specifically, for example, FIG. 9 (b) are shown as 0 degree and the straight line and intersects the point connecting the position data of the straight line or 90 ° and 270 ° connecting the position data of the 180-degree _{(X 0 = 0, Y 0} = 0) is stored in the working memory 82 as center position coordinates corresponding to the transfer arm 4C so that the center of the rotation axis is the center. For example, when two pieces of position data are acquired, the position coordinates of a distance that is a half of the straight line connecting the position data are set as the center position coordinates of the rotation axis. Subsequently, after the wafer W1 on the spin chuck 5 is received by the transfer arm 4C and retracted to the outside of the unit (step S10), the spin chuck 5 is transferred to the spin chuck 5 based on the center position coordinates as a result of the position data acquired in step S8. The wafer W1 is delivered (step S11), and the process of steps S4 to S8 is performed to acquire data for the second time. Here, as shown in step S9, after the second position data acquisition operation, the position coordinate value of the mark M on the surface of the wafer W1 at each rotational position is not one, or an allowable range is set and the range is set. Otherwise, it is determined by the determination program 83c that there is a positional deviation. When it is determined that there is a positional deviation, as shown in step S10, the θ-axis and the R-axis are corrected based on the retry program 83d so that the deviation of the mutual positional coordinate value is reduced. Based on the above, the operations from step S3 to S8 are performed again. The allowable range is determined according to the type of the processing unit, for example, in the case of a coating unit (COT), for example, an eccentricity of 0.1 mm or less when converted to a distance, and in the case of a developing unit (DEV), for example, 0.3 mm. In the case of the following eccentricity, and further in the case of a heating unit described later, an example in which the difference is set to 0.5 mm or less is given. Thereafter, when it is determined in step S9 that the position data match each other (no positional deviation), as shown in step S11, the set value of the delivery position at this time is set to the transfer arm 4C for the coating unit (COT). Is stored in the storage unit 85 as a set value, and teaching of the transfer arm 4C is completed. By actually rotating the wafer W1 and checking whether or not the rotation trajectory of the mark M is decentered, the alignment accuracy can be increased more reliably.

  Subsequently, as shown in step S12, when there are other transfer arms 4B and 4A that are not taught, the intermediate transfer arm 4B to be taught next enters the unit and enters the spin chuck. 5, the wafer W1 is received and retracted, and the process returns to step S2 to teach the transfer arm 4B. Further, when teaching of the intermediate transfer arm 4B is completed, teaching of the lower transfer arm 4A is performed in the same manner. It should be noted that after the positioning of the transfer arms 4A to 4C is performed in the reference processing unit, for example, the processing unit that performed teaching first, it is sufficient to perform alignment for any one of the transfer arms 4A to 4C. . This is because relative position data has already been acquired for the remaining arm with respect to the transfer position of the one arm.

  According to the above-described embodiment, the mark M is formed on the surface of the wafer W1, which is the same substrate as the actual substrate to be processed, held on the spin chuck 5, and the locus of the mark M when the wafer W1 is rotated. By determining the center of the rotation axis based on the above, it is possible to easily figure out how much the deviation between the center of the wafer W1 and the center of the rotation axis is. For this reason, the setting value (correction value) when retrying can be easily set again. As a result, the number of retries can be reduced and the center of the wafer W1 and the center of the rotation axis can be matched, so that teaching can be performed in a short time. In the case of using the light transmission type sensor described in the “Background Art” column, for example, in order to adjust with an accuracy of 50 μm, it was necessary to retry about 5 times at most. The inventors have confirmed that the same accuracy could be achieved with a smaller number of retries, for example two retries. The inventor considers this reason as follows. For example, when the periphery of the wafer W1 is detected by the light transmission type sensor, the sensor and the transfer arm have different coordinate systems, and therefore the transfer arm enters at a right angle with respect to the moving direction of the light transmission type sensor. The data obtained by one detection is data in one direction (X or Y direction). For example, by rotating the wafer W1 by 90 degrees, two pieces of position data in the X direction are obtained. Two pieces of direction position data are acquired.

  On the other hand, in the present invention, the CCD camera 71 is attached to the transfer arm 4A to share the coordinate system of the CCD camera 71 and the coordinate system of the transfer arms 4A to 4D with each processing unit. In the invention, the position data of the mark M obtained by one detection (imaging) is data for specifying both the X and Y coordinates, and four pieces of this data can be collected by rotating the wafer W1 by 90 degrees. As a result, four pieces of data in the X direction and four pieces of data in the Y method are obtained. From these differences, it is considered that the positional deviation information of the wafer W1 is more accurate in the present invention, and the number of retries is reduced. Although the time required for one try is approximately 2 minutes, it can be seen that since a plurality of trials are made for a plurality of processing units, the time can be greatly shortened.

  Further, in order to obtain the rotation center of the spin chuck 5 based on the trajectory of the mark M, it is only necessary to acquire the position data of the mark M at at least two rotation positions. In this example, the four positions differ by 90 degrees from each other. Since the position data of the mark M at the rotation position is obtained and the intersection of straight lines connecting coordinates different from each other by 180 degrees is obtained as the rotation center, the calculation process is easy. If the position data of two locations are acquired and the straight line connecting the mutual position data is halved, that is, the position coordinate of the midpoint of the straight line is the center position coordinate of the rotation axis, This is advantageous because the center of the rotating shaft can be obtained with a small amount of position data, and teaching can be performed in a short time with a small amount of position data.

  Furthermore, according to the above-described embodiment, the jig 70 provided with the CCD camera 71 as the imaging means is supported by the transfer arm 4D, and the jig 70 is guided to the photographing position in the unit by the transfer arm 4D. By doing so, for example, the labor of the worker can be saved significantly compared with the case where the sensor is set on the unit side. As a result, the time required for teaching can be shortened, and further, The burden can be reduced.

  Next, a process for a heating unit that is a processing unit that does not have a function of rotating the wafer W1 will be described with reference to FIGS. First, as shown in step S101, as preparation, for example, the wafer W1 for alignment is supported on the upper transfer arm 4C where teaching is performed, and the jig 70 is supported on the transfer arm 4D dedicated for teaching. Next, for example, based on the center position of the heating unit stored based on the design data, the transfer arm 4D is extended forward (in the R-axis direction) and stopped, and becomes a mark at the center of the wafer mounting area of the mounting table 6. The projection 62 to be obtained is imaged and the image data 200 is taken into the image data storage unit 81 (step S102). Then, the position data acquisition program 84a acquires the position coordinates (position data of the center of the mounting table 6) of the projection 62 at the center position in the imaging region of the image data 200 and stores them in the working memory 82 (step S103).

  Subsequently, the transfer arm 4D is moved backward, and the transfer arm 4C is moved forward based on the position coordinates to place the wafer W1 at the transfer position. At this time, in the heating unit (BAKE), as described above, the wafer W1 is transferred from the transfer arm 4C to the mounting table 6 via the substrate support pins 64 (step S104). Next, the transfer arm 4C moves backward, and as shown in step S105, the upper transfer arm 4D that supports the jig 70 enters the unit based on the data of the center position coordinates acquired in step S103 and holds it on the mounting table 6. The jig 70 is guided to a position opposite to the surface of the wafer W1 and the CCD camera 71 images the mark M on the surface of the wafer W1 and takes in the image data 200 into the image data storage unit 81. And the position coordinate which is the position data of the mark M is acquired by the position data acquisition program 84a, and it memorize | stores in the working memory 82 (step S106).

  Subsequently, as shown in step S107, the determination program 84b is read and the position data of the wafer W1 is compared with the position data of the center of the mounting table 6 so that these position data match or match. If it is within a predetermined allowable range, it is determined that the wafer W1 is placed at an appropriate location. On the other hand, if the position data do not match and are not within the allowable range, the values of the θ-axis and the R-axis are corrected based on the retry program 84c so that the difference between the position data is reduced (step S108). Then, the transfer arm 4C receives the wafer W1 on the mounting table 6 and moves backward (step S109). Then, the operations from step S104 to S106 are performed again using the corrected delivery position as a new set value. Thereafter, if it is determined in step S107 that the position data match each other, as shown in step S110, the set value of the delivery position at this time is stored in the storage unit 85 as the set value of the transfer arm 4C for the heating unit. The teaching of the transfer arm 4C is completed.

  Subsequently, as shown in step S111, when there is another transfer arm that has not been taught, for example, the middle transfer arm 4B to be taught next enters the unit, and the wafer is removed from the spin chuck 5 to the wafer. Receiving W1 and moving backward, the operations shown in steps S104 to S110 are performed to teach the transfer arm 4B. Further, when the teaching of the middle transfer arm 4B is completed, the teaching of the lower transfer arm 4A is similarly performed.

  According to the above-described embodiment, even if the target processing unit does not have a function of rotating the wafer W1, the position data of the center of the wafer W1 is compared with the position data of the center of the mounting table 6. Since it is possible to easily grasp how much the deviation is, and it is possible to simplify the setting of a new set value (correction value) so that the deviation is further reduced, the same effect as in the above case Can be obtained. In the present example, the configuration is not limited to the adjustment of the delivery position, and for example, it is used only as a means for confirming whether or not the wafer W1 is placed at a predetermined location based on the determination result of step S107. May be.

  Next, an example of another process for teaching the above-described coating unit (COT) will be described with reference to FIG. The detailed operation in each step is the same as the example shown in FIG. 8 except that imaging is performed with the wafer W1 supported by the substrate support pins 56. First, for example, the wafer W1 for alignment is supported on the transfer arm 4C, and the jig 70 is supported on the transfer arm 4D (step S201). Next, the transfer arm 4D is extended forward (R-axis direction), the spin chuck 5 is imaged by the CCD camera 71, the approximate center position thereof is confirmed, and the position coordinates are stored in the working memory 82 (step S202). Subsequently, the transfer arm 4C is advanced based on the stored position coordinates, and the wafer W is delivered to the spin chuck 5 by the cooperative action of the substrate support pins 56 and the transfer arm 4C (step S203).

  Thereafter, after the transfer arm 4C is retracted to the outside of the unit, the substrate support pins 56 are raised to set the wafer W close to the ascending position (imaging position), for example, the transfer position with the transfer arm 4C, and the jig 70 The supported transfer arm 4D enters the unit, and the CCD camera 71 images the mark M of the wafer W1 on the substrate support pins 56 (step S204). That is, the mark M is imaged in a state where the wafer W, which is the object to be imaged, is brought close to the CCD camera 71 by the substrate support pins 56. The image data at the 0-degree position obtained by imaging is taken into the image data storage unit 81, and then the position data is acquired based on the position data acquisition program 83a and stored in the working memory 82 (step S205). Subsequently, the substrate support pins 56 are lowered to deliver the wafer W1 to the spin chuck 5, and the spin chuck 5 rotates the wafer W1 about the vertical axis by 90 degrees or 180 degrees, for example, and similarly marks M at opposite positions. Position data is acquired (steps S206 to S208). Then, the operations in steps S204 to 208 are repeated until at least two positions and, for example, an even number and position data facing each other at a position of 180 ° before and after the rotation are acquired (step S209).

  Thereafter, as shown in step S210, the center of the rotation axis is obtained by the arithmetic program 83b based on the acquired position data. Specifically, first, between the position coordinates corresponding to the 0 degree position acquired in step S205 and the position coordinates acquired in step S202 (the second and subsequent positions coordinates of the central axis acquired in the previous step S210). To determine whether there is a positional deviation. If it is determined that there is no positional deviation, a straight line connecting two opposing position data, for example, 0 degree and 180 degree position data or 90 degree and 270 degree position data. The position coordinate of the half distance is set as the center of the rotation axis. On the other hand, for example, when it is determined that the wafer W is laterally moved due to an air bearing phenomenon or the like when the wafer W descends and the position coordinates are misaligned, the misalignment direction and misalignment are obtained by calculation to correct each position data. And the position coordinate of the distance of half of the straight line connecting the corrected position data facing each other is set as the center position coordinate of the rotation axis.

  When the first data acquisition is completed in this way, the transfer arm 4C subsequently receives the wafer W from the substrate support pins 56, and once retracts to the outside of the unit (steps S211 and 212), the acquisition is performed as described above. Based on the coordinates of the center position, the unit enters the unit and delivers the wafer W1 to the spin chuck 5 by the cooperative action with the substrate support pins 56 (step S213). Similarly, the second data acquisition is performed by performing the operations of steps S204 to S210. After the second position data acquisition operation, one position coordinate value of the mark M on the surface of the wafer W1 when rotated is one. Or the set value of the delivery position at this time is stored in the storage unit 85 as the set value of the transfer arm 4C for the coating unit (COT) and transferred to the transfer arm 4C. This teaching is finished (step S214).

  On the other hand, if it is determined by the determination program 83c that the position coordinate value of the mark M on the surface of the wafer W1 when it is rotated in step S211 is not one or not within the allowable range, the transfer arm 4C supports the substrate. After receiving the wafer W from the pin 56 and once retracting to the outside of the unit (step S212), the delivery position obtained by correcting the θ axis and the R axis based on the retry program 83d so that the deviation of the mutual position data is reduced. As a new set value, the transfer arm 4C enters the unit and delivers the wafer M1 to the substrate support pins 56 (step S213). Then, the operations from step S204 to S210 are performed again.

  Subsequently, as shown in step S215, when there is another transfer arm that has not been taught, for example, the intermediate transfer arm 4B to be taught next enters the unit, and the wafer W1 is moved from the spin chuck 5 to the wafer W1. Is returned, and the process returns to step S2 to teach the transfer arm 4B. Further, when teaching of the intermediate transfer arm 4B is completed, teaching of the lower transfer arm 4A is performed in the same manner.

  Even with such a configuration, it is possible to easily grasp the amount of positional deviation between the center of the wafer W1 and the center of the rotation axis based on the acquired position data. Similar effects can be obtained. Further, in the case of this example, since the wafer W is imaged close to the CCD camera 71, the image can be obtained even when, for example, an inexpensive CCD camera 71 having a short imageable distance is used due to its performance. The accuracy of the data can be secured, and teaching can be performed while reducing the influence of raising and lowering the wafer W by the substrate support pins 56 before and after imaging as described in detail below.

  That is, during the lowering operation of the wafer W by the substrate support pins 56, for example, as shown in FIG. 13A, a lateral displacement of the wafer W due to an air bearing phenomenon or the like occurs between the spin chuck 5 and the like. There is a case. If the wafer W1 has the same unit and the same size, the displacement direction and displacement amount of the wafer W1 due to this displacement phenomenon is substantially reproducible. Therefore, if teaching is performed and the delivery position is determined, each wafer W is processed during subsequent processing. The delivery position is not changed. In this example, however, the wafer W is raised and imaged by the substrate support pins 56 at each rotational position. Therefore, for example, if the amount of positional deviation differs between the 0 degree position and the 180 degree position, the rotational axis obtained by calculation The center position coordinates of the center of the axis may deviate from the center of the actual rotation axis, and teaching may not converge. Therefore, in this example, the wafer is obtained using the position coordinates corresponding to the 0 degree position acquired in step S205 and the position coordinates acquired in step S202 (from the second time onward, the position coordinates of the central axis previously acquired in step S210). By calculating the direction and amount of misalignment that occurs when W is lowered and correcting the position coordinates by the number of times the wafer W has been lowered, the wafer support W 56 is used to raise and lower the wafer W. Even if there is no effect, the effect can be made extremely small.

  In the above-described embodiment, after acquiring the position data of 0 degree and before acquiring the position data of 180 degrees opposite to the position data, the wafer W1 is placed on the transfer arm 4C (4A, 4B) performing teaching. You may be made to reposition. The timing for delivering the wafer W1 to the transfer arm 4C (4A, 4B) is, for example, between the above-described step S205 and step S206. In this case, when the wafer W1 is repositioned and rotated 180 degrees, the position data of 0 degrees including the position shift (see FIG. 13A) and the shift direction of 180 degrees as shown in FIG. 13B, for example. Since it is possible to obtain 180 degree position data including a position shift that is opposite to each other and obtain the center position of the rotation axis, the same effect as in the above case can be obtained. Further, even if the processing unit does not have a function of rotating the wafer W1 like the above-described heating unit, the wafer W may be imaged in a state of being close to the CCD camera 71 by the substrate support pins 56. However, it is advantageous in that teaching can be performed using, for example, an inexpensive CCD camera 71.

  In the present invention, the configuration is not limited to a configuration using a dedicated arm for holding the jig 70 serving as an imaging unit, and may be a configuration in which the jig is replaced by an operator's hand, for example. Specifically, when teaching the main transfer means A2 (A3) having the three transfer arms 4A (4B, 4C) that do not have the transfer arm 4D dedicated for teaching, the upper transfer arm 4C is first set to the upper transfer arm 4C. After the jig 70 is supported and teaching of another transfer arm 4A (4B) is performed, the jig 70 may be transferred to another arm, for example, the transfer arm 4A, and the transfer arm 4C may be taught. . Even if it is such a structure, the effect similar to the above-mentioned case can be acquired.

  Further, in the present invention, for example, a power source such as a battery is provided in the jig 70 and a transmission unit capable of transmitting image data wirelessly is provided to make the CCD camera 71 cordless, for example, via the spin chuck 5. The jig may be transferred between the transfer arms 4A to 4C. In this case, since the labor of replacing the jig 70 by an operator can be saved, it is advantageous in that teaching can be performed more reliably in a short time.

  Further, in the present invention, the mark M of the wafer W1 for alignment is not limited to the configuration formed at the center of the surface, and for example, as shown in FIG. 14, a plurality of marks M concentrically with respect to the center of the wafer W1. May be arranged. Even if it is such a structure, the effect similar to the above-mentioned case can be acquired.

  Furthermore, in the present invention, the substrate processing apparatus is not limited to the coating / developing apparatus, and may be applied to, for example, a substrate transport unit incorporated in a thin film forming apparatus for forming an interlayer insulating film or a device protective film. Further, the present invention is not limited to the wafer W, and can be applied to, for example, an LCD substrate, a heat cleaning device for a photomask reticle substrate, and an LCD device.

1 is a plan view showing a coating / developing apparatus according to an embodiment of the present invention. 1 is a perspective view showing a coating / developing apparatus according to an embodiment of the present invention. It is a perspective view which shows the board | substrate conveyance means of the said coating / developing apparatus. It is explanatory drawing which shows the coating unit integrated in the said coating / developing apparatus. It is explanatory drawing which shows the heating unit integrated in the said coating / developing apparatus. It is a perspective view which shows a mode that a CCD camera is attached to the main conveyance means, and the wafer for alignment is imaged. It is explanatory drawing which shows the teaching means used for the said coating / developing apparatus. It is process drawing which shows the process of teaching. It is explanatory drawing which shows the image data acquired at the time of teaching. It is process drawing which shows the other example of the process of teaching. It is explanatory drawing which shows the image data acquired at the time of teaching. It is process drawing which shows the other example of the process of teaching. It is explanatory drawing which shows the position shift phenomenon at the time of a wafer fall. It is explanatory drawing which shows the other example of the mark formed in the surface of the wafer for alignment. It is a top view which shows the conventional coating / developing apparatus. It is explanatory drawing which shows a mode that the conventional teaching is performed.

Explanation of symbols

W Wafer W1 Wafer for alignment A1, A2 Main transfer means COT coating unit BAKE Heating unit 4A, 4B, 4C Transfer arm 40 Moving substrate 70 Jig 71 CCD camera 8 Control unit 83 Storage unit

Claims (20)

A processing unit for performing a predetermined process on a substrate held horizontally on a substrate holding portion that is rotatable around a vertical axis is provided, and data on a substrate delivery position with respect to the substrate holding portion by the substrate transfer means is acquired in advance. In substrate processing equipment,
An imaging means for imaging a mark formed on the surface of the substrate for alignment delivered to the substrate holding unit by the substrate transport means;
The position of the center of the substrate and the center of rotation of the substrate holder based on the data of the position that halves the straight line connecting the positions of the marks imaged before and after the substrate holder is rotated 180 degrees. Means for calculating the deviation amount of
Means for determining the presence or absence of the amount of displacement obtained by this means;
Means for repositioning the substrate with respect to the substrate transport means so that the center of the substrate and the rotation center of the substrate holding portion coincide with each other when it is determined that there is a displacement amount;
A substrate processing apparatus comprising: storage means for storing position data of the substrate transport means when the center of the substrate coincides with the rotation center of the substrate holder.   2. The substrate processing apparatus according to claim 1, wherein the mark is formed at the center of the surface of the substrate.   The means for determining the amount of misregistration has an allowable value that is considered to coincide with the rotation center according to a preset type of processing unit, and determines whether or not the amount of misregistration is larger than the allowable value. The substrate processing apparatus according to claim 1, wherein: In a substrate processing apparatus comprising a processing unit for performing a predetermined process on a substrate held horizontally by a substrate holding unit, and acquiring in advance data of a substrate delivery position with respect to the substrate holding unit by a substrate transfer means,
An imaging means for imaging a mark formed at the center of the surface of the substrate for alignment delivered to the substrate holding unit by the substrate transport means;
Based on the imaging result of the mark by the imaging unit and the imaging result of the mark formed at the center of the substrate holding unit that has been imaged in advance, it is determined whether or not the center of the substrate matches the center of the substrate holding unit. And a substrate processing apparatus. In a substrate processing apparatus comprising a processing unit for performing a predetermined process on a substrate held horizontally by a substrate holding unit, and acquiring in advance data of a substrate delivery position with respect to the substrate holding unit by a substrate transfer means,
An imaging means for imaging a mark formed at the center of the surface of the substrate for alignment delivered to the substrate holding unit by the substrate transport means;
Means for calculating an amount of displacement between the center of the substrate and the center of the substrate holding unit based on the imaging result of the mark by the imaging unit and the imaging result of the mark formed at the center of the substrate holding unit imaged in advance; ,
Means for determining whether or not the amount of displacement obtained by this means is greater than an allowable value;
Means for repositioning the substrate with respect to the substrate transport means so that the center of the substrate and the center of the substrate holding part coincide with each other when it is determined that the amount of positional deviation is larger than the allowable value;
A substrate processing apparatus comprising: storage means for storing position data of the substrate transport means when the center of the substrate coincides with the center of the substrate holder.   The substrate transfer means includes a plurality of transfer arms that are arranged vertically and are independently movable forward and backward, and one of the plurality of transfer arms and one of the transfer arms and a substrate for alignment and imaging, respectively. 6. The substrate processing apparatus according to claim 1, wherein the means is held. A processing unit for performing predetermined processing on a substrate held horizontally on a substrate holding portion that is rotatable about a vertical axis, and data on a substrate delivery position to the substrate holding portion by a plurality of transfer arms of the substrate transfer means in advance In the substrate processing apparatus for obtaining
One transfer arm that delivers a substrate for alignment to the substrate holding portion;
Imaging means for imaging the mark formed on the surface of the alignment substrate delivered to the substrate holding unit and the mark that can be the center position of the substrate holding unit;
Another transfer arm different from the one transfer arm holding the imaging means;
A position data acquisition program for obtaining coordinate position data from imaging data of the mark imaged by the imaging means and a mark that can be a center position of the substrate holding unit;
Each coordinate position data obtained from the imaging results of the marks respectively imaged before and after the alignment substrate is placed on the substrate holding unit and rotated 180 degrees by the position data acquisition program;
A calculation program for calculating a positional deviation amount by comparing the coordinate position data in which a straight line connecting the coordinate position data is halved with the coordinate position data obtained as the center position of the substrate holder;
A determination program for determining the presence or absence of a positional deviation amount obtained by calculation;
A retry program for repositioning the substrate with respect to the substrate transport means so that the coordinate position data determined as the center position of the substrate and the substrate holding portion coincides with the amount of displacement;
Storage means for storing position data of the substrate transfer means when coordinate data of the center of the substrate for alignment and coordinate data of the center position of the substrate holding part coincide with each other. Substrate processing equipment.   8. The substrate processing apparatus according to claim 7, wherein the determination program has a predetermined allowable value depending on a type of processing unit set in advance.   After the transfer position of the substrate in one transfer arm is determined, the substrate for alignment is transferred to the substrate holder by the other transfer arm, and the imaging means is held by the transfer arm other than the other transfer arm, The substrate processing apparatus according to claim 6, wherein data of a substrate transfer position in another transfer arm is acquired.   10. The substrate processing apparatus according to claim 9, wherein the imaging means held by the other transfer arm is transferred to a transfer arm other than the other transfer arm via the substrate holding unit.   8. The substrate processing apparatus according to claim 6, wherein the other transfer arm is a dedicated arm for holding the imaging means.   2. A substrate lifting / lowering unit capable of moving up and down while supporting the back side of the substrate, and picking up an image of the substrate transferred to the substrate holding unit close to an imaging means by the substrate lifting / lowering unit. The substrate processing apparatus according to any one of 11. Substrate delivery for obtaining position data of the substrate transport means when the substrate transport means delivers the substrate to a substrate holder that is provided in a processing unit that performs predetermined processing on the substrate and is rotatable about a vertical axis. In the position adjustment method,
A step of transferring a substrate for alignment on which a mark is formed on the surface to the substrate holder by a substrate transfer means;
Imaging the mark with an imaging means before and after the substrate holding part is rotated 180 degrees;
A step of calculating a positional shift amount between the center of the substrate and the rotation center of the substrate holding unit based on data of a position in which a straight line connecting the positions of the marks obtained in this step is halved;
Determining the presence or absence of the amount of misalignment determined in this step;
Repositioning the substrate with respect to the substrate transfer means so that the center of the substrate and the rotation center of the substrate holding portion coincide with each other when it is determined that there is a displacement amount;
Obtaining the position data of the substrate transport means when the center of the substrate coincides with the rotation center of the substrate holding portion, and a method for adjusting the substrate delivery position. In the substrate delivery position adjusting method for obtaining the position data of the substrate transport means when delivering the substrate by the substrate transport means to the substrate holding part provided in the processing unit that performs a predetermined process on the substrate,
A step of transferring a substrate for alignment in which a mark is formed at the center of the surface to the substrate holding unit by a substrate transfer means;
Then, imaging the mark with an imaging means;
And a step of determining whether or not the center of the substrate is coincident with the center of the substrate holding portion based on the imaging result obtained in this step. In the substrate delivery position adjusting method for obtaining the position data of the substrate transport means when delivering the substrate by the substrate transport means to the substrate holding part provided in the processing unit that performs a predetermined process on the substrate,
A step of transferring a substrate for alignment in which a mark is formed at the center of the surface to the substrate holding unit by a substrate transfer means;
Then, imaging the mark with an imaging means;
A step of calculating a displacement amount between the center of the substrate and the center of the substrate holding unit based on the imaging result obtained in this step;
Determining whether or not the amount of misalignment determined in this step is greater than an allowable value;
Repositioning the substrate with respect to the substrate transport means so that the center of the substrate and the center of the substrate holding part coincide when the amount of positional deviation is larger than the allowable value;
Obtaining the position data of the substrate transport means when the center of the substrate coincides with the rotation center of the substrate holding portion, and a method for adjusting the substrate delivery position. The substrate transfer means includes a plurality of transfer arms arranged vertically and independently movable forward and backward.
One of the plurality of transfer arms is moved forward to deliver the alignment substrate to the substrate holder, and then the one transfer arm is moved backward, and then the other transfer arm is moved out of the plurality of transfer arms. 16. The method for adjusting a substrate delivery position according to claim 13, wherein the mark on the substrate for alignment is picked up by an image pickup means that is moved forward and held by the other transfer arm. After the transfer position of the substrate in one transfer arm is determined, the step of transferring the substrate for alignment to the substrate holder by the other transfer arm;
The method for adjusting a substrate delivery position according to claim 16, further comprising: acquiring image data of another transfer arm by holding an imaging unit on a transfer arm other than the other transfer arm.   A step of placing the imaging means held on the other transfer arm on the substrate holding part, and a step of receiving the image pickup means placed on the substrate holding part by a transfer arm other than the other transfer arm. The method for adjusting a substrate delivery position according to claim 16.   17. The substrate transfer position adjusting method according to claim 16, wherein the other transfer arm is a dedicated arm for holding the image pickup means. The step of imaging the mark on the front surface of the substrate is performed by bringing the substrate transferred to the substrate holding unit close to the imaging means by the substrate elevating unit that moves up and down while supporting the substrate from the back side. The method for adjusting the substrate delivery position according to any one of the above.

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