KR101353580B1

KR101353580B1 - Apparatus for molding led package and method therefor

Info

Publication number: KR101353580B1
Application number: KR1020070065234A
Authority: KR
Inventors: 서은정
Original assignee: 서울반도체 주식회사
Priority date: 2007-06-29
Filing date: 2007-06-29
Publication date: 2014-01-22
Also published as: KR20090001108A

Abstract

The present invention relates to a molding method of an LED package, and to provide a molding apparatus and method of the LED package to form a molding member in which the phosphor is evenly distributed, the technical problem.

To this end, the molding method of the LED package according to the present invention comprises the steps of forming a molding space surrounding the LED chip on the substrate by using a mold, a resin inlet and an air outlet connected to the molding space; Injecting a resin containing phosphor particles into the molding space through the resin injection unit; And allowing the resin to flow into the air outlet after filling the molding space, and introducing the phosphor into the air outlet.

Transfer molding method, molding space, molding member, phosphor, dummy space, allowable, air outlet

Description

Molding apparatus for LED package and its method {APPARATUS FOR MOLDING LED PACKAGE AND METHOD THEREFOR}

1 is a view for explaining a conventional molding apparatus.

FIG. 2 is a sectional view of the molding apparatus shown in FIG. 1. FIG.

3 is a view showing a state in which molding is carried out using a conventional molding apparatus.

Figure 4 is a cross-sectional view for explaining a molding apparatus of the LED package according to the present invention.

5 is a view showing a state in which the molding proceeds using the molding apparatus according to the present invention.

6 is a view for explaining a molding method of the LED package according to the present invention.

DESCRIPTION OF THE REFERENCE SYMBOLS

11: mold 12: resin injection part

12a: Port 12b: Runner

12c: gate 15: molding space

16 substrate 17 air outlet

17a: first outlet 17b: dummy space

17c: second outlet 18: LED chip

The present invention relates to a molding method of the LED package, and more particularly to a molding apparatus and a method of the LED package for forming a molding member in which the phosphor is uniformly distributed.

In general, the LED package includes a package body and an LED chip mounted on the package body. LED chips have the advantages of small size, long life and low power compared to incandescent, fluorescent and discharge light sources.

On the other hand, a molding member is used to protect the LED chip from the external environment, such as moisture or dust. The molding member covers the LED chip and the bonding wires and protects them from the external environment.

As a method of forming the molding member, a transfer molding method using an epoxy molding compound (hereinafter referred to as 'EMC') having excellent economical efficiency, mass productivity, and excellent water absorption resistance is widely used.

The transfer molding method uses a solid EMC in which a phosphor and an epoxy in a powder form are evenly mixed. As shown in FIG. 1, the substrate 6, for example, a printed circuit board (PCB), is placed on the pot 2 so that the portion where the LED chip 8 (see FIG. 2) is attached to the mold is facing upward. When the molding press is operated after the solid EMC is put in, the epoxy is changed into a liquid phase in a high temperature mold, and molding is performed in the molding space 5 on the PCB 6 along the runner 3 connected to the port 2. . At this time, in the molding process, the phosphor particles are flowed from the resin inlet 4 toward the air outlet 7 through the liquefied epoxy and cured. The air outlet 7 of the mold is generally manufactured to a size of about 10㎛. This air outlet is used for the purpose of the air escapes while being molded, it is an air hole through which the air in the runner (3) connected to the molding space (5) during the molding proceeds.

However, due to the characteristics of the transfer molding method, the epoxy including the phosphor flows from the resin inlet 4 toward the air outlet 7 and the molding proceeds and hardens in a short time. The distribution is different from the resin inlet 4 to the air outlet 7.

As shown in FIG. 3, the distribution of the phosphors in the vicinity of the resin inlet portion 4 to the middle portion of the PCB 6 shows a similar tendency. Since the pressure is applied to a certain degree, a large number of relatively small and light fine phosphor particles are distributed. Fine phosphor particles are agglomerated and distributed at the inlet of the air outlet 7. As a result, the phosphor particle size and distribution in the vicinity of the resin inlet 4 to the middle of the PCB 6 and in the vicinity of the air outlet 7 are uneven, resulting in product defects. In particular, when producing a white LED package, the color uniformity is uneven for each LED package.

The present invention has been made in an effort to provide a molding apparatus and a method of LED package for distributing the phosphor evenly. Accordingly, color uniformity may be uniformly implemented for each LED package when the white LED package is manufactured.

In order to achieve the above technical problem, the present invention discloses a molding method of the LED package. The molding method of the LED package according to an embodiment of the present invention comprises the steps of forming a molding space surrounding the LED chip on the substrate using a mold, a resin inlet and an air outlet connected to the molding space; Injecting a resin containing phosphor particles into the molding space through the resin injection unit; And allowing the resin to flow into the air outlet after filling the molding space, and introducing the phosphor into the air outlet.

According to the present embodiment, the air outlet includes a first outlet and a dummy space connected to the first outlet, and the inflow is a portion of the resin passing through the first outlet is introduced into the dummy space. In addition, the injecting step injects the resin by a transfer molding method.

On the other hand, the molding apparatus of the LED package according to an embodiment of the present invention is located on the substrate, the resin injection unit for supplying a resin containing phosphor particles, a molding space surrounding the LED chip, and the molding space A part of the filled resin is formed to form an air discharge portion, wherein the air discharge portion is configured to introduce the phosphor from the molding space.

The air outlet includes a first outlet and a dummy space into which a portion of the resin passing through the first outlet is introduced, wherein the dummy space is larger than the first outlet, and the resin injecting part is formed by a transfer molding method. Supply the resin. Furthermore, the air discharge portion further includes a second discharge port opened to the outside of the mold from the dummy space. The first outlet is formed to a size of 100um or less so that the phosphor of 1 ~ 10um contained in the resin passes, the second outlet is formed of a size of 10um or less so that the phosphor contained in the resin does not pass.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

4 is a cross-sectional view illustrating a molding apparatus of an LED package according to the present invention.

Referring to FIG. 4, the molding apparatus of the LED package according to the present invention is a device for forming a molding member covering the LED chip 18 on the substrate 16 by using the mold 11. The injection part 12, the molding space 15, and the air discharge part 17 are formed. Here, the resin injector 12 includes a port 12a, a runner 12b connected to the porter 12a, and a gate 12c into which the liquid resin is injected along the runner 12b. The port 12a is solid EMC is liquefied by the high pressure and high temperature is injected into the molding space 15 through the runner 12b and the gate 12c continuously.

In the present embodiment, the EMC is liquefied at high pressure and high temperature in the pot 12a by the transfer molding method. For example, liquefaction of a resin such as silicon by only a high temperature heating may be considered.

In the present embodiment, the resin injecting unit 12 injects the liquid resin containing the phosphor into the molding space 15 by the above-described transfer molding method, but the liquid resin includes a phosphor having a size of about 40 μm or less. do. Preferably, a phosphor having a size of 10 to 15 μm is used for the molding process.

The molding space 15 is formed with a molding member that is cured after the liquid resin is filled. The molding space 15 flows around the LED chip 18 positioned on the substrate 16 by flowing the liquid resin through the resin injecting part 12. In the embodiment, the molding space 15 has a plurality of LED chips 18 and bonding wires W connected to the LED chips 18, but the present invention is not limited thereto. The liquid resin filling the molding space 15 is discharged to the air discharge unit 17.

On the other hand, the above-described air outlet 17 is connected to the molding space 15 in the direction opposite to the resin injecting portion 12. The air outlet 17 includes a first outlet 17a, a dummy space 17b and a second outlet 17c.

The first outlet 17a may be formed to have a size such that the phosphor contained in the liquid resin passes, for example, 100 μm. It is more preferable to form the size of the first outlet 17a such that the size of the fine phosphor, for example, a phosphor of 10 μm or less is passed through.

The dummy space 17b stores a portion of the liquid resin introduced through the first outlet 17a. The second discharge part 17c opened from the dummy space 17b to the outside of the mold has a size such that a part of the liquid resin stored in the dummy space 17b does not pass outside the mold 11. Have That is, the second outlet 17c is formed to a size of 10 μm or less, which is such that the size of the fine phosphor cannot pass.

According to this embodiment, the air outlet 17 allows passage of a portion of the liquid resin containing the phosphor. A portion of the liquid resin passing through the first outlet 17a flows into the dummy space 17b connected to the first outlet 17a. The dummy space 17b is larger in size than the first outlet 17a through which a portion of the liquid resin passes, and a portion of the liquid resin passed through the first outlet 17a is stored.

A molding method using the molding apparatus of the LED package having such a configuration will be described with reference to FIG. 6 as follows.

Referring to FIG. 6, first, a substrate 16 on which an LED chip 18 is mounted is prepared (S1). Next, the mold 11 is used to form the molding space 15, the resin injection part 12 and the air discharge part 17 connected to the molding space 15 on the substrate 16 (S2). In the molding space 15, an LED chip 18, electrodes (not shown), and a bonding wire W may be positioned.

Next, the liquid resin containing the phosphor is injected into the molding space 15 through the formed resin injection unit 12 (S3). Here, the liquid resin injected into the molding space 15 is a liquid resin injected through the runner 12b and the gate 12c by liquefying the solid EMC by the port 12a of the resin injection part 12. .

Thereafter, the liquid resin injected by the resin injector 12 fills the molding space 15. Even after the liquid resin is filled in the molding space 15, mold pressure is continuously applied to pass a portion of the liquid resin through the first outlet 17a of the air outlet 17 (S4). In this case, a part of the liquid resin passing through the first outlet 17a may be a resin including fine phosphor particles. As described above, a part of the liquid resin that has passed through the first outlet 17a is stored while flowing into the dummy space 17b connected to the first outlet 17a (S5). Accordingly, the phosphor may be evenly distributed in the molding space 15. This is illustrated well in FIG.

After the liquid resin filled in the molding space 15 is cured, each LED chip 18 is cut to be separated (S6).

According to the exemplary embodiment of the present invention, the phosphor may be evenly distributed, thereby achieving a uniform color coordinate. As a result, the color deviation of the LED package can be reduced to produce high brightness as well as a low brightness backlight sensitive to color.

In addition, according to an embodiment of the present invention by introducing a portion of the liquid resin filling the molding space into the dummy space can solve the problem of the conventional product defects of the uneven phosphor particle size in the vicinity of the air outlet.

Claims

Forming a molding space surrounding the LED chip on the substrate using a mold, a resin injection portion and an air discharge portion connected to the molding space;

Injecting a resin containing phosphor particles into the molding space through the resin injection unit; And

After the resin fills the molding space to be introduced into the air discharge portion, including the step of introducing the phosphor to the air discharge portion,

The air outlet includes a first outlet, a dummy space connected to the first outlet and a portion of the resin introduced through the first outlet is stored, and a second outlet opening to the outside of the mold from the dummy space,

The inflowing step of molding the LED package, characterized in that a portion of the resin passing through the first outlet is introduced into the dummy space.

delete

The method according to claim 1,

The injecting step of molding the LED package, characterized in that for injecting the resin by a transfer molding method.

In the molding apparatus of the LED package for forming a molding member for covering the LED chip on the substrate using a mold,

The mold is formed on the substrate to form a resin injector for supplying a resin containing phosphor particles, a molding space surrounding the LED chip, and an air outlet through which a portion of the resin filling the molding space is introduced. However, the air discharge portion is configured to introduce the phosphor from the molding space,

The air outlet includes a first outlet, a dummy space connected to the first outlet and a portion of the resin introduced through the first outlet is stored, and a second outlet opening to the outside of the mold from the dummy space. Molding device for LED package.

delete

The method of claim 4,

Molding apparatus of the LED package, characterized in that the dummy space is larger than the first outlet.

The method of claim 4,

The resin injecting unit molding the LED package, characterized in that for supplying the resin by a transfer molding method.

delete

The method of claim 4,

The first outlet is formed of a LED package molding apparatus, characterized in that the size of less than 100um to pass through the phosphor of 10-15㎛ contained in the resin.

The method of claim 4,

The size of the phosphor contained in the resin is 10-15㎛,

The second outlet is formed of a LED package molding apparatus, characterized in that formed in a size less than 10㎛ to prevent passage of the phosphor contained in the resin.