KR101346341B1 - Light emitting device with submount and method for fabricating the same - Google Patents
Light emitting device with submount and method for fabricating the same Download PDFInfo
- Publication number
- KR101346341B1 KR101346341B1 KR1020070044552A KR20070044552A KR101346341B1 KR 101346341 B1 KR101346341 B1 KR 101346341B1 KR 1020070044552 A KR1020070044552 A KR 1020070044552A KR 20070044552 A KR20070044552 A KR 20070044552A KR 101346341 B1 KR101346341 B1 KR 101346341B1
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- KR
- South Korea
- Prior art keywords
- submount
- led die
- conductive pattern
- light emitting
- phosphor
- Prior art date
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Abstract
The present invention discloses a method of manufacturing a light emitting device including a submount on which an LED die is mounted and a phosphor coated on the submount. The disclosed light emitting device manufacturing method includes mounting an LED die on a submount on which a conductive pattern is formed, electrically wiring between the LED die and the conductive pattern on the submount, and the sub-except a partial region of the conductive pattern. Coating a phosphor on the mount and the LED die thereon; and electrically wiring between a portion of the conductive pattern excluded from coating the phosphor and an electrical terminal outside the submount.
LED, submount, phosphor layer, contact area, conductive pattern, light emitting chip,
Description
1A and 1B are a plan view and a sectional view of a submount in which a conductive pattern is formed according to an embodiment of the present invention.
2 (a) and 2 (b) are a plan view and a sectional view showing a state in which an LED die is mounted on the submount shown in FIG.
3 (a) and 3 (b) are a plan view and a sectional view showing a state in which the submount and the LED die shown in FIG. 2 are electrically wired.
4A and 4B are views for explaining a process of coating a phosphor on a submount on which the LED die shown in FIG. 3 is mounted;
FIG. 5 is a view for explaining a process of cutting a submount mounted with an LED die and coated with a phosphor; FIG.
6 is a cross-sectional view illustrating a light emitting chip formed by the cutting process illustrated in FIG. 5.
FIG. 7 is a cross-sectional view illustrating a light emitting device having a package structure in which the light emitting chip illustrated in FIG. 6 is connected to an electrical terminal outside the submount.
FIG. 8 is an enlarged plan view of the main part of FIG. 7; FIG.
<Code Description of Main Parts of Drawing>
10: submount 12: conductive pattern
15: insulation pattern 20: LED die
30: phosphor layer 100: light emitting chip
120: contact area M: mask jig
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly, to a light emitting device including a submount on which an LED die is mounted and a phosphor coated on the submount, and a method of manufacturing the same.
A light emitting diode (LED) is a device in which electrons and holes meet and emit light at a PN junction by applying current, and are generally manufactured in a package structure in which a chip-shaped LED die is mounted. Often referred to as an 'LED package'. The LED package as described above is generally mounted on a printed circuit board (PCB) and configured to emit light by receiving current from an electrode formed from the printed circuit board (hereinafter, referred to as 'PCB').
Conventionally, a light emitting device using a light emitting chip having a structure in which an LED die is mounted on a submount has been developed. Such a conventional light emitting device is manufactured through a package mounting process of electrically connecting a light emitting chip made of a submount and an LED die mounted thereon to a lead frame and forming a resin or ceramic body supporting the lead frame. In addition, the conventional light emitting device forms a phosphor layer on the light emitting chip by a spray method after the above package mounting process.
However, in the above conventional light emitting device, since the spray process for forming the phosphor layer is performed after package mounting of the light emitting chip, the spray process is performed on a very large area compared to the narrow area where the phosphor layer is actually required, and thereby the phosphor There is a problem that the loss of a lot, and the spray of the phosphor is concentrated in a narrow area, it is difficult to form a uniform phosphor layer.
Accordingly, a technical problem of the present invention is to use a method of coating phosphors on a submount and an LED die except for a portion to be electrically wired with an electrical terminal outside the submount in a state where the LED die is mounted on the submount, A method of reducing the amount of phosphor loss and enabling uniform phosphor coating on the submount region and the LED die, and a light emitting device manufactured by the method.
According to an aspect of the invention, the steps of mounting the LED die on a submount with a conductive pattern, electrically wiring between the LED die and the conductive pattern on the submount, and the above except for a portion of the conductive pattern Coating a phosphor on a submount and the LED die thereon, and electrically wiring between a portion of the conductive pattern excluded from coating the phosphor and an electrical terminal outside the submount A device manufacturing method is provided.
Preferably, in the mounting of the LED die, a plurality of LED dies are mounted on the submount, and in the electrical wiring step, each of the plurality of LED dies is connected with corresponding conductive patterns and bonding wires. The manufacturing method of the light emitting device may further include cutting the submount so that each of the LED dies is included after coating the phosphor, and a plurality of light emitting chips are formed by the cutting. Each of the light emitting chips has a partial region of the conductive pattern electrically connected to the electrical terminal.
Preferably, the conductive pattern includes first and second conductive patterns having different polarities separated by an insulating pattern, and coating the phosphor may include masking a portion of the region crossing the insulating pattern with a mask jig. In the hidden state, it is made by coating a phosphor on the submount on which the LED die is mounted. By the above-described phosphor coating, the portion covered by the mask jig becomes the first conductive pattern and the second conductive pattern adjacent to each other without the phosphor coated. In addition, an LED die is mounted on the first conductive pattern, and the LED die is connected to the second conductive pattern by electrical wiring. Furthermore, when the mask jig passes between neighboring LED dies, the first and second conductive patterns electrically connected to one LED die of one of the neighboring LED dies and the first electrically connected to the remaining LED dies. The first and second conductive patterns may be formed in common with each other.
Preferably, the step of coating the phosphor is by spray or electrophoresis.
Preferably, the submount on which the conductive pattern is formed is formed by metal plating leaving an insulating pattern on an insulating substrate. More preferably, the conductive pattern includes first and second conductive patterns having different polarities. The LED die is a vertical light emitting diode attached to the first conductive pattern and connected to the second conductive pattern by a bonding wire.
According to another aspect of the present invention, a submount having a conductive pattern formed thereon, an LED die mounted on the submount and electrically connected to the conductive pattern on the submount, and a phosphor coated on the submount and the LED die. And a contact region formed by exposing a portion of the conductive pattern on the submount to be excluded from the coating process, and an electrical terminal provided outside the submount and connected to the contact region by electrical wiring. A light emitting device is provided.
Preferably, the electrical terminal consists of a leadframe of the LED package supported by the package body.
Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
1 to 8 are views for explaining a method of manufacturing a light emitting device according to the present invention.
1A and 1B, a plan view and a cross-sectional view of the
Referring to FIG. 1A, the
2A and 2B are a plan view and a cross-sectional view showing a state in which a plurality of
3A and 3B are a plan view and a cross-sectional view showing a state in which electrical wiring is formed between the
Since the
Since the LED die 20 is a vertical light emitting diode, the bonding wire W1 is used only for the electrical wiring between the LED die 20 and the second
4A and 4B are views for explaining a process of coating a phosphor on a
By the phosphor coating process, a
5 shows a process of cutting the
As shown in FIG. 5, the
According to a preferred embodiment of the present invention, the portion covered by the mask jig (M), the contact region (120a, 120b) of each of the first conductive pattern and the second conductive pattern adjacent to each other without the phosphor is coated The LED die 20 is mounted on the first
6 illustrates a cross-sectional structure of the
The
FIG. 7 is a cross-sectional view illustrating a light emitting device having a package structure including the
Referring to FIG. 7, the
Referring to FIG. 8, the
The present invention mounts the LED die 20 on the
According to the present invention, in the manufacture of a light emitting device using a submount on which an LED die is mounted, a uniform phosphor layer can be formed on the LED die while leaving portions to be electrically wired on the submount, and the phosphor layer forming process It has the effect of greatly reducing the phosphor loss in.
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070044552A KR101346341B1 (en) | 2007-05-08 | 2007-05-08 | Light emitting device with submount and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070044552A KR101346341B1 (en) | 2007-05-08 | 2007-05-08 | Light emitting device with submount and method for fabricating the same |
Publications (2)
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KR20080099004A KR20080099004A (en) | 2008-11-12 |
KR101346341B1 true KR101346341B1 (en) | 2013-12-31 |
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KR1020070044552A KR101346341B1 (en) | 2007-05-08 | 2007-05-08 | Light emitting device with submount and method for fabricating the same |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000208822A (en) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | Semiconductor light-emitting device |
JP2003258310A (en) | 2002-03-01 | 2003-09-12 | Citizen Electronics Co Ltd | Surface mounting light emitting diode and its producing method |
KR20050034936A (en) * | 2003-10-10 | 2005-04-15 | 삼성전기주식회사 | Wavelength - converted light emitting diode package using phosphor and manufacturing method |
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2007
- 2007-05-08 KR KR1020070044552A patent/KR101346341B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000208822A (en) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | Semiconductor light-emitting device |
JP2003258310A (en) | 2002-03-01 | 2003-09-12 | Citizen Electronics Co Ltd | Surface mounting light emitting diode and its producing method |
KR20050034936A (en) * | 2003-10-10 | 2005-04-15 | 삼성전기주식회사 | Wavelength - converted light emitting diode package using phosphor and manufacturing method |
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KR20080099004A (en) | 2008-11-12 |
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