KR101341429B1 - Vacuum equipment for processing substrate - Google Patents

Abstract

A vacuum apparatus for processing a substrate is disclosed. According to an embodiment of the present invention, a substrate processing vacuum apparatus includes a chamber module in which a substrate is processed, a purge line part supplying a filling gas into the chamber module, and a chamber disposed adjacent to the purge line part and formed by the purge line part. A backfill line portion for replenishing the filling gas into the chamber module to finely control the pressure in the module, wherein the chamber module includes at least one of a purge line portion and a backfill line portion so that the filling gas is uniformly supplied downward from the top of the chamber module. An upper port to which one is connected; And a pumping line part which discharges the filling gas in the chamber module to provide a vacuum pressure in the chamber module and is disposed on the opposite side of the upper port.

Description

VACUUM EQUIPMENT FOR PROCESSING SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing vacuum apparatus, and more particularly, to a substrate processing vacuum apparatus capable of carrying a substrate in a reduced pressure atmosphere under vacuum conditions.

The deposition process is an essential process of the substrate: sol-gel method, sputtering method, electroplating method, evaporation method, chemical vapor deposition method, molecular beam epi It is a process of forming a process film on a board | substrate by a molecular beam eptaxy method, an atomic layer deposition method, etc.

The vacuum apparatus for substrate processing used in the chemical vapor deposition method includes an inlet load lock chamber module for introducing a substrate to be deposited into a deposition process, an ejection load lock chamber module for extracting a substrate having been deposited, and an inlet load lock The transfer chamber module is connected to the chamber module and the takeout load lock chamber module, and a transfer robot of the substrate is provided therein, and a plurality of process chamber modules connected to one side of the transfer chamber module to perform a substantial deposition process.

In this case, when depositing different types of deposition films through one process chamber module, contamination of the inside of the chamber module and the substrate may occur, so that a deposition process for one type of deposition film is usually performed in one process chamber module. do.

The transfer chamber module is provided with a pumping line for maintaining a vacuum, a purge line for creating an atmospheric pressure, and a nitrogen backfill line (N2 backfill) for maintaining a constant pressure inside the chamber module.

In the deposition process, the pressure of the transfer chamber module should be kept higher than the pressure of the process chamber module. That is, in order to prevent particles / gas generated in the process chamber module from being transferred to the transfer chamber module, the pressure of the transfer chamber module is maintained higher than that of other chamber modules. Contamination of the transfer chamber module can seriously damage the glass, or substrate.

In this way, the transfer chamber module forms a purge line and a nitrogen backfill line (N2 backfill) at the bottom of the chamber module so as to always put a proper gas to maintain the proper pressure of the transfer chamber module inside the chamber module. In order to put the chamber module inside, the control valve of the nitrogen backfill line and the throttle valve of the pumping line were configured to control the pressure inside the chamber module.

The transfer chamber module is equipped with a transfer robot to transport and take out substrates to each process chamber module, and fine particles generated therein may be deposited under the transfer chamber module due to the operation of the transfer robot.

In this case, the deposited fine particles of the transfer chamber module may be scattered inside the chamber module by the purge line or the nitrogen backfill line (N2 backfill) that always flows upward of the transfer chamber module, which may be a factor that may contaminate the substrate. there was.

The problem of particles being scattered by the gas supplied into the transfer chamber module as described above contaminates the substrate, as well as the transfer chamber module, but also in other chamber modules that process the substrate while injecting gas to maintain a constant vacuum pressure. May occur.

KR 10-0800377 B1

Therefore, the technical problem to be achieved by the present invention, substrate processing that can reduce the generation of contamination factors on the substrate by inhibiting and preventing the scattering of particles deposited on the bottom of the chamber module by the gas injected into the chamber module and evacuated It is to provide a vacuum device for.

According to an aspect of the invention, the chamber module is processed; A purge line unit supplying a filling gas into the chamber module; And a backfill line part disposed adjacent to the purge line part and replenishing the filling gas into the chamber module to finely control the pressure in the chamber module formed by the purge line part, wherein the chamber module includes: An upper port to which at least one of the purge line part and the backfill line part are connected such that the filling gas is uniformly supplied downward from an upper portion of the chamber module; And discharging the filling gas in the chamber module to provide a vacuum pressure in the chamber module, and may include a pumping line part disposed on an opposite side of the upper port.

The upper port and the pumping line part may be disposed to face in a diagonal direction of the chamber module.

The apparatus may further include a diffuser unit connected to the upper port to diffuse the filling gas supplied through the upper port.

The diffuser unit may include a connector plate coupled to an upper portion of the chamber module and having a through hole connected to the upper port; And a porous plate coupled to a bottom surface of the connector plate and disposed in the chamber module.

The porous plate may be provided in plurality, and a mesh may be disposed between the plurality of porous plates.

Any one of the plurality of porous plates may include a stepped portion surrounding the pores, and the mesh may be disposed between planes of the plurality of porous plates.

The stepped portion may have a circular shape, and the stepped portion may be provided with a fastening hole in a circumferential direction, and the fastening bolt coupled to the connector plate may be disposed in the fastening hole.

A fitting for connecting the upper port may be coupled to the through hole of the connector plate.

The connector plate may have a circular shape, and a fastening hole may be provided in the connector plate in a circumferential direction, and a fastening bolt may be disposed in the fastening hole to couple the connector plate to an upper surface of the chamber module.

The diffuser unit may be coupled to an upper portion of the chamber module, a through hole connected to the upper port is formed, and a mesh plate disposed in the chamber module may be provided on a bottom surface thereof.

The apparatus may further include a flow control valve module installed at the backfill line part to adjust a flow rate of the filling gas supplied to the backfill line part.

The purge line part and the backfill line part may be disposed independently of each other, and the chamber module may further include a lower port to which the purge line part is connected.

A first common pipe connected to the upper port with the purge line part and the backfill line part connected to the upper port; And a second common pipe connected between the first common pipe and the purge line part and the backfill line part disposed in parallel.

The chamber module may be a transfer chamber module in which a handling robot for transporting the substrate is installed, or a load lock chamber module in which the substrate loaded or unloaded from the transfer chamber module is accommodated.

A process gas for depositing a substrate may be injected into the transfer chamber module so that a plurality of process chamber modules for depositing a deposition material on the substrate may be adjacently connected.

A plurality of test tubing connected one to one to the plurality of process chamber modules; And the test pipe may be merged into a single pipe to further include a residual gas analyzer (RGA) module for analyzing a gas or leak for each of the plurality of process chamber modules.

According to the present invention, at least one of the purge line part or the backfill line part is connected to the upper port of the chamber module so that the filling gas is supplied downward from the upper part of the chamber module, and the filling gas is injected into the chamber module and evacuated. It is possible to provide a substrate processing vacuum apparatus that can reduce and prevent generation of contamination factors on a substrate by suppressing and preventing scattering of particles deposited on the bottom of the chamber module.

According to another aspect of the present invention, by providing a diffuser portion provided with a mesh structure for diffusing the filling gas in the upper port of the chamber module, when the filling gas is supplied from the top to the bottom of the chamber module to uniformly spread the bottom of the chamber module It is possible to provide a substrate processing vacuum apparatus that can avoid stimulation to particles deposited on the substrate.

1 is a schematic layout view of a substrate processing vacuum apparatus according to an embodiment of the present invention.
Figure 2 is a cross-sectional view showing a schematic configuration of the chamber module of the vacuum processing apparatus for substrate according to an embodiment of the present invention.
Figure 3 is a cross-sectional view showing a schematic configuration of the chamber module of the vacuum processing apparatus for substrate according to another embodiment of the present invention.
4 is a perspective view of a transfer chamber module according to an embodiment of the present invention.
5 is a right side view of FIG. 4.
6 is an exploded view of the diffuser unit of FIG. 4.
7 is a cross-sectional view of the diffuser unit of FIG. 4.
8 is a perspective view of a mesh plate according to another embodiment of the diffuser of FIG. 4.
9 is a plan view showing a substrate processing vacuum apparatus according to another embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a schematic layout view of a substrate processing vacuum apparatus according to an embodiment of the present invention.

As shown in FIG. 1, a substrate processing vacuum apparatus according to an embodiment of the present invention includes a load lock chamber module 100 into which a substrate is loaded and a substrate from a load lock chamber module 100. Transfer chamber module 110 to be loaded by a) to transfer to the process process to process the substrate, and a process chamber module 130 is connected adjacent to the transfer chamber module 110 to process the substrate.

The load lock chamber module 100 or the transfer chamber module 110 has an accommodating space in which the internal space can be selectively adjusted to an atmospheric pressure or a desired reduced pressure state. A gate valve (not shown) may be installed between the load lock chamber module 100 and the transfer chamber module 110 as a valve unit capable of maintaining airtightness from the outside. In addition, a transfer robot (not shown) is installed in the transfer chamber module 110 as a horizontal articulated robot having a hand part capable of supporting and transferring a substrate.

The substrate is loaded into the load lock chamber module 100 at atmospheric pressure, and the loading of the substrate from the load lock chamber module 100 to the transfer chamber module 110 is performed while the load lock chamber module 100 is decompressed by vacuum exhaust. Can proceed.

That is, the substrate may be loaded into the internal space of the transfer chamber module 110 in the atmospheric pressure state, and then the substrate may be loaded into the process chamber module 130 under the reduced pressure by vacuum evacuation. The process chamber module 130 in which the substrate is processed has a lower pressure than the transfer chamber module 110.

In the process of loading the substrate from the load lock chamber module 100 to the process chamber module 130, the pressure is set so that a contamination factor that may contaminate the substrate along the conveyance path of the substrate does not flow into the processing site. That is, the substrate is loaded while the transfer chamber module 110 has a higher pressure than the load lock chamber module 100, and the substrate is loaded while the process chamber module 130 has a lower pressure than the transfer chamber module 110. .

The load lock chamber module 100 or the transfer chamber module 110 may maintain a constant vacuum pressure by injecting and discharging filling gas in the process of loading the substrate, and contaminants on the substrate such as fine particles or foreign matter therein. May be discharged and removed together with the filling gas.

As described above, the process of adjusting the pressure when the substrate is loaded into the load lock chamber module 100, the transfer chamber module 110, and the process chamber module 130 has been described. Hereinafter, the specific components for the injection of the filling gas and the evacuation of the filling gas into the interior of the load lock chamber module 100 or the transfer chamber module 110 will be described. will be.

Figure 2 is a cross-sectional view showing a schematic configuration of the chamber module of the vacuum processing apparatus for substrate according to an embodiment of the present invention. Referring to Figure 2 will be described the specific components for the injection and vacuum evacuation of the filling gas to the interior space of the load lock chamber module 100 or transfer chamber module 110 of FIG.

1 and 2, a chamber module 140 such as a load lock chamber module 100 or a transfer chamber module 110, a purge line unit 142 for supplying a filling gas to increase pressure in an internal space. And a backfill line unit 145 and a pumping line unit 149 providing a vacuum pressure to the inside of the chamber module 140 are connected. The purge line unit 142, the backfill line unit 145, and the pumping line unit 149 according to the present exemplary embodiment are shown in a line with their pipes.

The purge line part 142 and the backfill line part 145 are disposed adjacent to each other. The purge line part 142 is connected to the lower part of the chamber module 140, and the backfill line part 145 is connected to the upper part of the chamber module 140. An upper port 150 to which the backfill line part 145 is connected is provided at the upper portion of the chamber module 140, and a lower port 151 to which the purge line part 142 is connected to the lower part is provided.

The purge line unit 142 supplies the filling gas so that the chamber module 140 can approach an atmospheric pressure state. In addition, the finer pressure on the chamber module 140 may be adjusted by the backfill line unit 145.

Since the backfill line unit 145 is connected to the upper port 150 of the chamber module 140, the filling gas injected through the backfill line unit 145 is supplied downward from the upper space of the chamber module 140. That is, when the backfill line unit 145 is connected to the lower portion of the chamber module 140 and the filling gas is injected through the backfill line unit 145, fine particles accumulated at the bottom of the chamber module 140 are scattered. This can prevent the situation.

As described above, the backfill line unit 145 is connected to the upper port 150 of the chamber module 140 to suppress the scattering of fine particles, and to control the pressure in the chamber module 140 formed by the purge line unit 142. Fine adjustment is possible.

The backfill line unit 145 may include a flow control valve module for controlling the flow amount of the filling gas. The flow control valve module may be a mass flow controller (MFC) 155, and may include a gas mass sensor and a flow control valve interworked with the gas mass sensor.

The pumping line part 149 is disposed on the opposite side of the upper port 150 to discharge the filling gas in the chamber module 140 to provide a vacuum pressure in the chamber module 140. The pumping line part 149 is disposed to face in the diagonal direction between the upper port 150 and the chamber module 140. That is, if the upper port 150 is disposed on the upper right side of the chamber module 140, the pumping line unit 149 may be connected to the lower left side of the chamber module 140. On the contrary, if the upper port 150 is disposed at the upper left side, the pumping line unit 149 may be connected to the lower right side of the chamber module 140.

When the backfill line unit 145 is connected to the upper port 150 to supply the filling gas to the upper space of the chamber module 140, the pumping line unit 149 sucks the filling gas injected from the opposite side in the diagonal direction. Discharge. In this case, since the flow direction of the filling gas may be determined toward the pumping line part 149 in the diagonal direction, the filling gas may be discharged through the entire internal space of the chamber module 140. In addition, the fine particles generated inside the chamber module 140 may flow with the filling gas flowing in a diagonal direction from the top to the bottom may be discharged.

As described above, the upper port 150 and the lower port 151 are disposed to face up and down in the internal space of the chamber module 140, and the backfill line part 145 is connected to the upper port 150, and the lower portion An embodiment in which the purge line unit 142 is connected to the port 151 has been described. In this embodiment, when the purge line unit 142 supplies the filling gas to the lower port 151, the pressure of the chamber module 140 is increased by the backfill line unit 145 supplementing the filling gas through the upper port 150. It is finely set and can prevent the scattering of the fine particles by the backfill line unit 145, and the filling gas supplied through the upper port 150 is supplied with the filling gas supplied through the lower port 151. The power can be partially canceled to prevent the case where the fine particles are suddenly scattered.

Figure 3 is a cross-sectional view showing a schematic configuration of the chamber module of the vacuum processing apparatus for substrate according to another embodiment of the present invention. The upper port 150 coupled to the chamber module 140 of FIG. 3 is connected to the purge line part 142 and the backfill line part 145, and all the filling gas is transferred from the upper space to the lower space of the chamber module 140. Flows.

The purge line part 142 and the backfill line part 145 are connected together to the upper port 150 using the first common pipe 161 and the second common pipe 162. That is, the purge line part 142 and the backfill line part 145 are disposed in parallel between the first shared pipe 161 and the second shared pipe 162. The supply unit (not shown) of the filling gas may be connected to the second common pipe 162. The purge line unit 142 and the backfill line unit 145 may include an on / off valve 165 that can open and close the flow of the filling gas.

The filling gas flows into the upstream front end of the second common pipe 162 and branches from the downstream rear end of the second common pipe 162 corresponding to the branch point of the purge line part 142 and the backfill line part 145. It may be joined at an upstream front end of the first common pipe 161.

When the on-off valve 165 of the backfill line part 145 is locked, the filling gas of the second common pipe 162 passes through the purge line part 142 only and the upper portion of the chamber module 140 through the first common pipe 161. May be supplied to the port 150. On the contrary, when the opening / closing valve 165 of the purge line part 142 is locked, the filling gas of the second common pipe 162 passes through the first common pipe 161 via the backfill line part 145 only and the upper port 150. Is supplied.

In this case, the backfill line unit 145 may include the MFC 155 as a flow control valve module, and the flow rate of the filling gas passing through the backfill line unit 145 may be finely adjusted by the MFC 155. In addition, a lower portion of the chamber module 140 is connected to a pumping line unit 149 for exhausting the filling gas injected into the chamber module 140. The upper port 150 and the pumping line part 149 are disposed in a diagonal direction as shown in FIG. 2.

As described above, the embodiment in which the purge line part 142 and the backfill line part 145 are connected together to the upper port 150 of the chamber module 140 has been described. In this embodiment, not only the filling gas of the backfill line unit 145 but also the filling gas of the purge line unit 142 may be supplied to the lower space through the upper space of the chamber module 140, and thus to the purge line unit 142. It is possible to prevent the scattering of fine particles or foreign matter deposited on the bottom of the chamber module 140 by the.

4 is a perspective view of a transfer chamber module according to an embodiment of the present invention, FIG. 5 is a right side view of FIG. 4, FIG. 6 is an exploded view of the diffuser unit of FIG. 4, and FIG. 7 is a cross-sectional view of the diffuser unit of FIG. 4. .

The diffuser unit 170 capable of diffusing the filling gas may be connected to the upper port 150 of the chamber module 140 illustrated in FIGS. 2 and 3. That is, the chamber module 140 of FIGS. 2 and 3 may correspond to the transfer chamber module 110 shown in FIG. 4, and the diffuser unit 170 may be connected to the upper port 150. 4 and 5, the transfer chamber module 110 is provided with an upper port 150 to which the backfill line unit 145 is connected to the upper right side surface thereof, and a slot gate through which the substrate can be carried into the internal space ( 111 is provided.

4 to 7, the diffuser unit 170 includes a connector plate 171 having a through hole 171a to which the upper port 150 is connected, and a plurality of couplers coupled to the bottom surface of the connector plate 171. Porous plates 172 and 174. The lower portion of the connector plate 171 is disposed in the inner space of the transfer chamber module 110.

A fitting 173 for connecting the upper port 150 is coupled to the through hole 171a of the connector plate 171. The connector plate 171 is circular, and the connector plate 171 is provided with six fastening holes 175 in the circumferential direction, and each of the fastening holes 175 is provided with a connector plate 171 on the upper surface of the transfer chamber module 110. A fastening bolt 176 coupled to the part may be inserted and disposed. Although not shown, a screw hole to which the fastening bolt 176 is fastened is formed in an upper surface of the transfer chamber module 110. The fastening bolt 176 is coupled to the upper surface of the transfer chamber module 110 through the fastening hole 175 so that the connector plate 171 is coupled to the upper surface of the transfer chamber module 110.

A mesh 180 may be interposed between the plurality of porous plates 172 and 174 to reduce the flow pressure of the filling gas to diffuse into the inner space of the transfer chamber module 110. The filling gas passes through the through hole 171a of the connector plate 171 through the upper port 150, and then reaches the mesh 180 through the hole 172a of the porous plate 172, and then again the porous plate 174. It is supplied into the transfer chamber module 110 through the pores (174a) of the. At this time, the filling gas may be spread while spreading widely because the flow pressure and the speed decrease while passing through the plurality of porous plates 172 and 174 and the mesh 180 interposed therebetween.

The porous plate 172 includes a stepped portion 177 that surrounds the hole 172a on an upper surface thereof, and a mesh 180 is disposed between the planes of the plurality of porous plates 172. The stepped portion 177 is circular, and the stepped portion 177 is provided with a fastening hole 178 in the circumferential direction, and a fastening bolt 179 coupled to the connector plate 171 is disposed in the fastening hole 178.

The stepped portion 177 of the porous plate 172 spaces the pores 172a from the bottom surface of the connector plate 171. The filling gas may flow to the mesh 180 through the pores 172a in a state of being enclosed in the spaced space, and may be supplied to the internal space of the transfer chamber module 110 via the pores 174a.

As described above, the embodiment of the diffuser unit 170, which may be composed of the connector plate 171, the plurality of porous plates 172 and 174, and the mesh 180 interposed therebetween, has been described. The diffuser unit 170 is not limited thereto, and may be more simply configured by providing a mesh plate 181 for forming a mesh on the bottom surface of the connector plate 171 as shown in FIG. 8.

9 is a plan view showing a substrate processing vacuum apparatus according to another embodiment of the present invention.

Referring to FIG. 8, a substrate processing vacuum apparatus according to another embodiment of the present invention may be loaded into a transfer chamber module 110 and a transfer chamber module 110 in which a transfer robot for transferring a substrate is installed as shown in FIG. 1. A load lock chamber module 100, which receives a substrate to be loaded or unloaded from the transfer chamber module 110, and is adjacent to the transfer chamber module 110, and a process gas for depositing the substrate is injected to deposit a deposition material on the substrate. A plurality of process chamber modules 130 may be deposited. The upper port 150, the lower port 151, the purge line unit 142, the backfill line unit 145, the pumping line unit 149, the diffuser unit 170, and the like of the above-described embodiments may be transferred to the transfer chamber module 110. ) Or the load lock chamber module 100 may be configured in the same manner.

In particular, according to another embodiment of the present invention, a plurality of test pipes 185 and test pipes 185 connected to the plurality of process chamber modules 130 in a one-to-one manner are merged into a single pipe to provide a plurality of process chamber modules ( 130 may further include a residual gas analyzer (RGA) module for analyzing a gas or analyzing a leak for each of 130). The RGA module 186 may inspect the state of the gas for the plurality of process chamber modules 130 by obtaining gas from each process chamber module 130 through each inspection pipe 185.

On the other hand, although not shown, embodiments of the present invention are not limited to the arrangement of the respective chamber modules shown in Figs. 1 and 9, various modifications are possible in the layout or configuration of each part. For example, a configuration in which the plurality of transfer chamber modules 110 are connected in series may be possible.

Although the above chamber module has been mainly described as a chamber module applied to a deposition apparatus capable of processing a single substrate, the chamber module may not only be a batch chamber module capable of simultaneously processing a plurality of substrates, but also heat-treat the substrates. It may be an annealing chamber module to.

The filling gas may be argon or nitrogen gas as an inert gas.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: load lock chamber module 110: transfer chamber module
111: slot gate
130: process chamber module 140: chamber module
142: purge line portion 145: backfill line portion
149: pumping line portion 150: upper port
151: lower port 155: MFC
161: first public pipe 162: second public pipe
165: on-off valve 170: diffuser portion
171: connector plate
172, 174: perforated plate 173: fitting
175, 178: fastening hole 176, 179: fastening bolt
177: stepped 180: mesh
181: mesh plate 185: inspection piping
186: RGA module

Claims (16)

A chamber module in which a substrate is processed;
A purge line unit supplying a filling gas into the chamber module; And
A backfill line portion disposed adjacent to the purge line portion and replenishing the filling gas into the chamber module to finely control the pressure in the chamber module formed by the purge line portion,
The chamber module comprises:
An upper port to which at least one of the purge line part and the backfill line part are connected such that the filling gas is uniformly supplied downward from an upper portion of the chamber module;
A pumping line part configured to discharge the filling gas in the chamber module to provide a vacuum pressure in the chamber module, the pumping line part being disposed opposite the upper port; And
A diffuser part connected to the upper port to diffuse the filling gas supplied through the upper port,
The diffuser unit,
A connector plate coupled to an upper portion of the chamber module and having a through hole connected to the upper port; And
It is coupled to the bottom surface of the connector plate, and comprises a porous plate disposed inside the chamber module,
The porous plate is a plurality, the mesh is disposed between the plurality of the porous plate,
The chamber module is a transfer chamber module provided with a handling robot for transporting the substrate,
In the transfer chamber module, a plurality of process chamber modules in which a process gas for deposition of a substrate is injected to deposit a deposition material on the substrate are adjacently connected.
A plurality of test tubing connected one to one to the plurality of process chamber modules; And
And the inspection pipe is merged into one pipe and further includes a residual gas analyzer (RGA) module for analyzing a gas or leak for each of the plurality of process chamber modules. The method of claim 1,
And the upper port and the pumping line part are disposed to face in a diagonal direction of the chamber module. delete delete delete The method of claim 1,
One of the plurality of porous plates includes a stepped portion surrounding the pores,
And said mesh is disposed between a plurality of planes of said porous plate. The method according to claim 6,
The stepped portion is circular, the stepped portion is provided with a fastening hole in the circumferential direction, the fastening hole is disposed in the fastening hole coupled to the connector plate, characterized in that the substrate processing vacuum apparatus. The method of claim 1,
The through hole of the connector plate is a substrate processing vacuum apparatus, characterized in that the fitting for the connection of the upper port is coupled. The method of claim 1,
The connector plate is circular, and the connector plate is provided with a fastening hole in the circumferential direction, and the fastening hole for coupling the connector plate to the upper surface of the chamber module is disposed in the fastening hole. Device. delete The method of claim 1,
And a flow rate control valve module installed in the backfill line part to adjust a flow rate of the filling gas supplied to the backfill line part. The method of claim 1,
The purge line portion and the backfill line portion are disposed independently of each other,
The chamber module further includes a lower port to which the purge line part is connected. The method of claim 1,
The purge line portion and the backfill line portion are connected together to the upper port,
A first common pipe connected to the upper port; And
And a second common pipe in which the purge line part and the backfill line part are arranged in parallel between the first common pipe and connected to each other. delete delete delete

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