KR101337598B1 - Led package with size reduced cavity - Google Patents

Led package with size reduced cavity Download PDF

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Publication number
KR101337598B1
KR101337598B1 KR1020070032003A KR20070032003A KR101337598B1 KR 101337598 B1 KR101337598 B1 KR 101337598B1 KR 1020070032003 A KR1020070032003 A KR 1020070032003A KR 20070032003 A KR20070032003 A KR 20070032003A KR 101337598 B1 KR101337598 B1 KR 101337598B1
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KR
South Korea
Prior art keywords
cup
led package
led chip
conductive
cavity
Prior art date
Application number
KR1020070032003A
Other languages
Korean (ko)
Other versions
KR20080089037A (en
Inventor
조재호
양승만
홍성호
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020070032003A priority Critical patent/KR101337598B1/en
Publication of KR20080089037A publication Critical patent/KR20080089037A/en
Application granted granted Critical
Publication of KR101337598B1 publication Critical patent/KR101337598B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Led Device Packages (AREA)

Abstract

The present invention relates to an LED package, which provides an LED package having a structure capable of significantly reducing the size of a cavity in which an LED chip is mounted and an encapsulant is formed.

An LED package according to the present invention includes a base on which an LED chip is mounted, a cup formed on the base to define a cavity around the LED chip, a conductive wire having one end connected to the LED chip, and the other end of the conductive wire. The electrical contact portion connected to the inner side of the cup is provided, and includes an electrical terminal extending from the inside of the cup to the outside of the cup, and a light-transmitting encapsulant formed to fill the cavity in the cup.

LED chip, package, wire, cup, base, encapsulant, color deviation, electric terminal, phosphor, luminance

Description

LED package with reduced cavities {LED PACKAGE WITH SIZE REDUCED CAVITY}

1 is a cross-sectional view showing an LED package according to an embodiment of the present invention.

Figure 2 is a perspective view of the exterior of the LED package shown in Figure 1;

3 is a cross-sectional view showing an LED package according to another embodiment of the present invention.

<Code Description of Main Parts of Drawing>

2, 2 ': LED chip 3, 3': cavity

6, 6 ': conductive wire 10, 10': base

30, 30 ': cup 50, 50': encapsulant

52, 52 ': 1st sealing part 54, 54': 2nd sealing part

The present invention relates to an LED package, and more particularly, to an LED package with reduced cavity size on which the LED chip is placed.

A light emitting diode (LED) is a device in which electrons and holes meet and emit light at a P-N semiconductor junction by application of current, and are generally manufactured in a package in which an LED chip is mounted.

Typically, an LED package includes a cup with a cavity in which the LED chip is placed, which cup is formed integrally with the package body or bonded onto the PCB. In addition, an encapsulant made of a light transmissive resin protecting the LED chip may be formed in the cavity of the cup, and an inclined reflective surface may be formed on the inner surface of the cavity of the cup. In addition, an LED package having a structure capable of changing a wavelength (or color) of light emitted from an LED chip by including a phosphor in an encapsulant in a cavity is known.

In a conventional LED package, a lead frame or a conductive pattern for applying current to the LED chip is provided on the bottom surface of the cavity in which the LED chip is mounted, that is, the bottom surface of the cavity of the package body or the top surface of the PCB in the cavity. In addition, the LED chip is connected to the lead frame or the conductive pattern by a conductive wire commonly referred to as a 'bonding wire'. In the conventional LED package, since both the lead frame or the conductive pattern are positioned together with the LED chip on the bottom surface of the cavity, the LED package is greatly limited in increasing the length of the conductive wire and reducing the size of the cavity. If the cavity is large, the size of the encapsulant also increases, and the phosphor is inevitably distributed in the encapsulant.

Conventional LED package has a problem that the color deviation of the light is large due to the phosphor widely unnecessarily distributed in the encapsulant. In addition, in the related art, the size of the encapsulation material is unnecessarily large compared to the size of the LED chip, and thus the amount of resin used to form the encapsulation material is not economical.

On the other hand, the conventional LED package has a problem in that the life is reduced due to heat damage because it does not smoothly discharge the heat generated from the LED chip. On the other hand, a technique of separately installing the heat dissipating slug or the heat sink in the LED package has been proposed, but the installation process of the heat dissipating slug or the heat sink is cumbersome and the installation may reduce the overall durability of the LED package.

One technical problem of the present invention is to provide an LED package having a structure that can significantly reduce the size of the cavity in which the LED chip is mounted and the encapsulant is formed, as compared with the related art.

Another technical problem of the present invention is to reduce the size of the cavity in which the encapsulant-containing encapsulant is filled, thereby allowing the phosphor to be distributed intensively near the LED chip, thereby reducing color deviation of light and improving luminance. To provide a package.

Another technical problem of the present invention is to reduce the size of the cavity formed by filling the encapsulant, and to provide an LED package employing a heat-dissipating substrate structure exposed to the outside with a large area under the cavity.

An LED package according to an aspect of the present invention includes a base on which an LED chip is mounted, a cup formed on the base to define a cavity in which the LED chip is placed, a conductive wire having one end connected to the LED chip, and the conductivity. An electrical contact portion to which the other end of the wire is connected is provided on an inner side surface of the cup, and includes an electrical terminal extending through the cup from the inside of the cup to the outside of the cup, and a light-transmissive encapsulant formed to fill a cavity in the cup. do.

According to an embodiment of the present invention, the cup comprises a first cup portion adjacent to the LED chip and a second cup portion provided on the first cup portion, and the electrical contact portion where the first cup portion and the second cup portion meet. A stepped surface on which additional positions are provided is provided. The first cup portion and the second cup portion may be joined to each other with the electric terminal therebetween. The encapsulant may be made of a light-transmitting resin including a phosphor, and may include a first encapsulation portion covering the LED chip and a second encapsulation portion of a transparent epoxy or silicon material formed on the first encapsulation portion. . The cup may be a reflective cup at least partially comprising a reflective material. More preferably, the first cup part includes a reflective surface formed of a reflective material and formed to be inclined. The reflective material is preferably made of Al 2 O 3 . The base may be formed by forming conductive patterns on an insulating substrate. The conductive patterns may include a first conductive pattern formed at a place where the LED chip is mounted and a second conductive portion connected to a portion of an electric terminal extending out of the cup. Contains a pattern. At this time, the insulating substrate is preferably made of AlN or SiC excellent in heat dissipation. In addition, a heat dissipation substrate of a metal material may be provided to support the insulation substrate under the insulation substrate. The heat dissipation board may include a printed circuit part formed on an upper surface of the heat dissipation board, and the printed circuit part may be electrically connected to the first conductive pattern and the second conductive pattern. The cup is formed of a plate-shaped first and second cup portions joined to each other with the electric terminals interposed therebetween to form the cavity, wherein the plate-shaped first cup portions are formed with a through-via conduction via formed therein, and the electrical terminals An outer side of the cavity may be connected to the second conductive pattern on the insulating substrate via the conductive via.

Other objects and advantages of the invention can be seen from the examples described below.

Example

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that the spirit of the invention to those skilled in the art can fully convey. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a cross-sectional view showing an LED package according to an embodiment of the present invention, Figure 2 is a perspective view of the LED package shown in FIG.

1 and 2, in particular, referring to FIG. 1, the LED package according to the present embodiment includes an LED chip 2, a base 10 on which the LED chip 2 is mounted, and a periphery of the LED chip 2. And a cup 30 formed on the base 10 to define the cavity 3, and a light-transmitting encapsulant 50 formed to fill the cavity 3 in the cup 30. In addition, the LED package also includes an electric terminal 60, a conductive wire 6, etc. for applying a current to the LED chip (2).

The base 10 is composed of an insulating substrate 11 having first and second conductive patterns 12a and 12b formed on an upper surface thereof. In practice, the LED chip 2 has its own electrode (not shown). The first conductive pattern 12a is attached and connected to the first conductive pattern 12a. In addition, the other electrode (not shown) of the LED chip 2 is connected to one end of the conductive wire 6, the other end of the conductive wire 6 is connected to the electrical terminal 60. The electrical terminal 60 is connected from the inside of the cup 30 to the outside of the cup 30 and then connected to the second conductive pattern 12b on the insulating substrate 11 outside of the cup 30.

The insulating substrate 11 is made of a ceramic substrate having excellent insulation and excellent thermal conductivity, and most preferably, of an SiC or AlN substrate. In addition, the insulating substrate 11 is supported while being bonded on a heat dissipation substrate 70 made of a metal material having excellent thermal conductivity. Since both the insulating substrate 11 in direct contact with the LED chip 2 and the heat dissipation substrate 70 in contact with the lower surface of the insulating substrate 11 are exposed to the outside, made of a material having excellent thermal conductivity, The LED package of the embodiment has excellent heat dissipation characteristics and a simple structure for improving the heat dissipation characteristics.

The cup 30 is a reflective cup containing at least a portion of a reflective material, and the second cup portion 34 bonded to and formed on the first cup portion 32 adjacent to the LED chip 3 and the first cup portion 32. ) Both the first cup part 32 and the second cup part 34 are formed of Al 2 O 3 plate material having good reflectivity. In addition, the first cup 32 has a smaller cavity size than the second cup 34, whereby a stepped surface may be provided between the first cup 32 and the second cup 34. Can be. In addition, the inner side surface of the cavity 3 defined by the first cup part 32 is formed of an inclined surface of approximately 30 to 85 degrees so as to reflect light upward.

The electrical terminal 60 extends outside the cup 30 with an electrical contact portion 61 provided on an inner side surface of the cup 30, in particular, a step surface of the cup 30. In the embodiment of the present invention, the first cup portion 32 and the second cup portion 34 are bonded to each other with the electric terminal 60 therebetween, but the first cup portion 32 and the It may also be considered to form a passage in the cup 30 that allows the second cup portion 34 to be integrally formed and allows the electrical terminal 60 to extend out of the cavity 3.

The electrical terminal 60, according to its position, and the electrical contact portion 61 located on the inner side of the cup 30, in particular, the step surface between the first cup portion 32 and the second cup portion 34 and It consists of an extension 62 extending from the electrical contact portion 61 to the outside of the cavity 3. In addition, the electrical terminal 60 including the electrical contact part 61 and the extension part 62 is preferably a plating pattern formed on the upper surface of the first cup part 32. A configuration of connecting the electrical terminal 60 having a plating pattern to an external printed circuit unit will be described in more detail later.

Meanwhile, the encapsulant 50 includes a first encapsulation portion 52 surrounding the periphery of the LED chip 2 and a second encapsulation portion 54 formed above the first encapsulation portion 52. Is made of. The first encapsulation portion 52 is formed by curing a liquid permeable resin in which particulate phosphor is mixed in a cavity of the first cup portion 32. Since the first encapsulation portion 52 is positioned inside the first cup portion 32 having a relatively small cavity size, phosphors in the first encapsulation portion 52 can be concentrated around the LED chip 2. This suppresses or reduces the color deviation of light caused by the unnecessary wide distribution of the phosphor. The resin of the first encapsulation portion 52 may be a light-transmissive resin, but is preferably a transparent silicone resin with little change due to heat, in particular, yellowing.

The second encapsulation portion 54 is formed above the first encapsulation portion 52 and is mainly located in the cavity of the second cup portion 34. The second encapsulation portion 54 is formed by injecting and curing the transparent liquid resin into the cavity 3 in which the first encapsulation portion 52 is formed in advance, and made of transparent silicone or transparent epoxy resin. desirable.

Conductive patterns 12 on the insulating substrate 11, that is, a first conductive pattern 12a on the insulating substrate 11 to which the LED chip 2 is attached, and an insulating substrate connected to the electrical terminal 60. The second conductive pattern 12b on the 11 is a printed circuit portion 72 formed to avoid the insulating substrate 11 on the heat dissipation substrate 70 by the electrical bonding portion 7 made of solder or a metal paste (especially, Ag paste). Is electrically connected to the

The electrical terminal 60 made of a plating pattern will be described below in connection with the printed circuit unit 72 on the heat dissipation substrate 70.

The electrical terminal 60 extends from the inside of the cavity 3 to the outside of the cavity 3 along the upper surface of the plate-shaped first cup 32. In addition, top and bottom through conduction vias 322 are formed on an upper surface of the first cup part 32 outside the cavity 3. The electrical terminal 60 is connected to the second conductive pattern 12b on the insulating substrate 11 via the conducting via 322.

Referring to FIG. 2, the printed circuit unit 72 is a printed circuit 72b formed by a pattern in which an insulating layer 72a formed on a heat radiating substrate 70 and a portion of the insulating layer 72a are removed. Is done. The conductive patterns 12 may include a pattern connected to an electrical terminal 60 formed of a plating pattern and a pattern to which an LED chip 2 (see FIG. 1) is attached, and the conductive patterns 12 may be solder or It is connected to the printed circuit 72b of the printed circuit section 72 via an electrical joint 7 formed by a metal paste (especially Ag paste). Referring to FIG. 2, it can be seen that the electric terminal 60 and the conductive patterns 12 are provided in plural, which is for applying current to a plurality of LED chips.

Although not described in the above embodiment, when the LED chip 2 has a structure having a pair of electrodes thereon and the LED chip 2 is mounted on a non-conductive portion on the base, the conductive pattern 12a on the insulating substrate Rather than omit), a pair of conductive wires connected to the electrodes of the LED chip 2 and a pair of electrical terminals having a structure as described above connected to the pair of conductive wires are also provided. It is within the scope of the invention.

In addition, in the above embodiment, the base is described as an insulating substrate having a conductive pattern, the base may be a non-conductive bottom surface or a part of the lead frame in the cavity of the package body in which the lead frame is installed. 3 is a cross-sectional view showing an embodiment of one of the various embodiments of the present invention with reference to FIG. 3.

As shown in FIG. 3, the LED package according to the present embodiment includes a package body 130 ′ in which the base 10 ′ and the cup 30 ′ are integrated. The cavity 3 'is defined inside the cup 30' of the package body 130 '. In addition, the bottom surface of the cavity 3 'is made of a non-conductive portion, and the LED chip 2' is mounted on the non-conductive portion of the bottom surface of the cavity 3 '. The LED package includes an electrical terminal 60 'of a lead frame structure having an electrical contact portion 61' formed on an inner side surface of the cup 30 '. The electrical contact portion 61 'of the electrical terminal 60' is formed on the inner step surface of the cup 30 '. One end of each of the pair of conductive wires 6 'is connected to the LED chip 2', and the other end of the conductive wires 6 'is connected to the electrical contact portion 61'. .

Therefore, only the LED chip 2 'exists on the bottom surface of the cavity 3', and thus the size of the cavity 3 'and the size of the encapsulant 50' formed in the cavity 3 'are larger than in the prior art. Can be greatly reduced. The encapsulant 50 'includes a first encapsulation portion 52' covering the upper portion of the LED chip 2 'and a second encapsulation portion 54' formed on the first encapsulation portion 52 '. . In addition, the first encapsulation portion 52 'includes a particulate phosphor in the light transmitting resin.

According to the present invention, various problems caused by the large size of the cavity filled with the encapsulant are solved, and in particular, by reducing the size of the cavity, the phosphor of the encapsulant can be concentrated in the vicinity of the LED chip, whereby Therefore, the color deviation of the LED package light can be reduced and the brightness of the light can be improved. Furthermore, by reducing the size of the encapsulating material, there is an advantage that the amount of expensive resin used as the material of the encapsulating material can be greatly reduced. In addition, according to the present invention, a heat-dissipating substrate structure exposed to the outside with a large area under the cavity is provided, which may contribute to greatly reducing the lifespan and damage of the LED package due to the heat of the LED chip.

Claims (16)

A base on which an LED chip is mounted; A cup formed on the base to define a cavity around the LED chip; A conductive wire having one end connected to the LED chip; An electrical contact portion to which the other end of the conductive wire is connected; And An electrical terminal extending through the cup from the inside to the outside of the cup, The base may be formed by forming conductive patterns on an insulating substrate. The conductive patterns may include a first conductive pattern formed at a place where the LED chip is mounted and a second conductive portion connected to a portion of an electric terminal extending out of the cup. LED package containing patterns. The method according to claim 1, The cup includes a first cup portion adjacent to the LED chip and a second cup portion located on the first cup portion, LED package, characterized in that the electrical contact portion is located on the first cup portion. The method of claim 2, The electrical terminal is an LED package, characterized in that interposed between the first cup portion and the second cup portion. The method according to claim 1, Further comprising an encapsulant filling the inside of the cup, The encapsulant, A first encapsulation part formed of a light-transmitting resin including a phosphor and covering directly on the LED chip; LED package comprising a second encapsulation of transparent epoxy or silicon material formed on the first encapsulation. The LED package of claim 1, wherein the cup is a reflective cup at least partially comprising a reflective material. The LED package of claim 2, wherein the first cup part comprises a reflective material and is formed to be inclined. The LED package according to claim 5 or 6, wherein the reflective material is made of Al 2 O 3 . delete The LED package of claim 1, wherein the insulating substrate is made of AlN or SiC. The LED package according to claim 1, further comprising a heat dissipation substrate of a metal material provided to support the insulation substrate under the insulation substrate. The LED package of claim 10, wherein the heat dissipation board includes a printed circuit part formed on an upper surface of the heat dissipation board, wherein the printed circuit part is electrically connected to the first conductive pattern and the second conductive pattern. The method according to claim 10, wherein the cup is made of a plate-shaped first and second cup portion joined to the electrical terminal between the forming the cavity, the plate-shaped first cup portion is formed through the through-through conducting vias And the electrical terminal is connected to a second conductive pattern on the insulating substrate through the conductive via at the outside of the cavity. The LED package according to claim 1, wherein the portion in which the LED chip is mounted is a conductive portion provided as part of the base. The LED package of claim 13, wherein the conductive portion is a leadframe or a conductive pattern. delete delete
KR1020070032003A 2007-03-30 2007-03-30 Led package with size reduced cavity KR101337598B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070032003A KR101337598B1 (en) 2007-03-30 2007-03-30 Led package with size reduced cavity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070032003A KR101337598B1 (en) 2007-03-30 2007-03-30 Led package with size reduced cavity

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KR20080089037A KR20080089037A (en) 2008-10-06
KR101337598B1 true KR101337598B1 (en) 2013-12-11

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100916158B1 (en) * 2009-02-16 2009-09-08 유트로닉스주식회사 Led package having radiation funetion
KR101466610B1 (en) * 2013-06-10 2014-12-01 한국화학연구원 Led lamp using uv led chip, and ultraviolet generation having the same
CN111969096A (en) * 2020-08-31 2020-11-20 福建天电光电有限公司 Chip packaging structure
KR102286120B1 (en) 2020-09-07 2021-08-05 박찬남 Grill Plate For Cook

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033520A (en) * 2000-07-14 2002-01-31 Toshiba Electronic Engineering Corp Semiconductor light emitting device
JP2004296999A (en) * 2003-03-28 2004-10-21 Okaya Electric Ind Co Ltd Light emitting diode
KR20050098038A (en) * 2004-04-06 2005-10-11 엘지이노텍 주식회사 Light emitting diode package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033520A (en) * 2000-07-14 2002-01-31 Toshiba Electronic Engineering Corp Semiconductor light emitting device
JP2004296999A (en) * 2003-03-28 2004-10-21 Okaya Electric Ind Co Ltd Light emitting diode
KR20050098038A (en) * 2004-04-06 2005-10-11 엘지이노텍 주식회사 Light emitting diode package

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