KR101337043B1 - Optical film chip cutting device and method for cutting optical film chip - Google Patents

Abstract

The cutting device of an optical film chip acquires the data of the cutting device which cuts an optical film, and the in-plane distribution of the optical axis of the said optical film, and based on the data of the in-plane distribution of the optical axis of the said optical film, And a control device for varying the cutting direction of the optical film in the plane of the optical film.

Description

Cutting device of optical film chip and cutting method of optical film chip {OPTICAL FILM CHIP CUTTING DEVICE AND METHOD FOR CUTTING OPTICAL FILM CHIP}

The present invention relates to a cutting device for an optical film chip and a cutting method for an optical film chip.

This application claims priority based on Japanese Patent Application No. 2011-248060 for which it applied to Japan on November 11, 2011, and uses the content here.

Optical films, such as a polarizing film and retardation film, are important optical components which comprise a liquid crystal display device. For example, in a liquid crystal display device, a polarizing film is bonded one by one to the upper and lower surfaces of a liquid crystal panel as a rectangular optical film chip. An optical film chip is obtained by using a long optical film as a raw material and cutting this into a rectangular shape with a cutter (see Patent Document 1, for example).

It is a schematic diagram which shows the cutting method of the conventional optical film chip.

First, as shown to Fig.13 (a), the optical film 101 is sent out by the conveying apparatus 100. As shown to FIG.

Next, as shown to FIG. 13 (b), the optical film 101 sent out by the conveying apparatus 100 turns into a square cut with the cutting device not shown. Thereby, the optical film intermediate (1st intermediate film) 102 is cut off. In this square cut process, the first intermediate film 102 is cut from the optical film 101 at a predetermined angle so that the direction of the optical axis targeted by the optical film chip is a direction suitable for the target liquid crystal display device.

Next, as shown to Fig.13 (c), the sheet-like member is laminated | stacked on the 1st intermediate film 102 by the film lamination apparatus 110. Then, as shown to FIG. The film lamination apparatus 110 has the pair of rollers 111 and 112 and the reel 113 which sends out a sheet-like member. The sheet-like member sent out from the reel 113 and the first intermediate film 102 cut at a predetermined angle are laminated between the pair of rollers 111 and 112 and then sent out in the next step.

Next, as shown to Fig.13 (d), the laminated | multilayer film by which the sheet-like member sent out from the reel 113 and the 1st intermediate film 102 cut | disconnected at the predetermined angle were laminated | stacked is not shown in figure. It is cut in half by the device. As a result, the second intermediate film 103 is cut off.

Next, as shown in FIG. 13E, the quality of the cut second intermediate film 103 is visually inspected.

Next, as shown to FIG. 13 (f), the 2nd intermediate film 103 is set to the stage 120. FIG. On the stage 120, a marking 121 for positioning the second intermediate film 103 is provided. When setting the 2nd intermediate film 103 to the stage 120, it positions on the marking 121 with respect to the edge | corner which became a square cut in the process shown in FIG.13 (d).

And the some optical film chip | tip 104 is cut from the 2nd intermediate film 103 by the cutting device not shown. In the cutting device, a plurality of cutters are arranged at intervals corresponding to the lengths of the long sides of the optical film chip 104, and at intervals corresponding to the lengths of the short sides of the optical film chips 104, The plurality of cutters are arranged in a lattice shape in plan view, and the region cut into the rectangular shape by the four cutters is the cutting region of one optical film chip 104.

The cutting direction of the second intermediate film 103 by the cutting device (for example, the arrangement direction of the cutters arranged at intervals corresponding to the length of the long side of the optical film chip 104) is the length of the optical film 101. It is arrange | positioned so that the objective angle (an angle determined according to design specification) may be made with respect to a direction. For example, in the case where the optical axis of the optical film chip 104 is designed to form 7 degrees with respect to the long side of the optical film chip 104, 7 °.

Patent Document 1: Japanese Patent Publication No. 2003-255132

In the process of FIG. 13F, setting the cutting direction of the second intermediate film 103 based on the longitudinal direction of the optical film 101 is generally a long optical film 101. This is because the resin film dyed with this dichroic dye is produced by uniaxial stretching, and the direction of the optical axis of the optical film 101 generally coincides with the stretching direction of the resin film. However, the optical axis of the optical film 101 is not uniform in the whole optical film 101, but is shifted slightly in the width direction of the optical film 101. FIG. For example, when uniaxially stretching the resin film dyed with a dichroic dye to produce the optical film 101, the optical film 101 may be formed due to unevenness of the thickness of the resin film, dyeing unevenness of the dichroic dye, or the like. There exists a tendency for the shift | offset | difference to arise between the direction of the optical axis of a center part, and the direction of the optical axis of the part (edge part) near the edge part of the optical film 101. For this reason, when cut | disconnecting the some optical film chip | tip 104 from the optical film 101, the dispersion | variation of an optical axis also arises between the optical film chip | tips 104 reflecting the deviation of this optical axis.

Moreover, in the conventional method of cutting an optical film chip, there exists a process which affects the precision of the optical axis made into the objective in the optical film chip 104. FIG. For example, in the process of the square cut shown in FIG. 13B, the cutting precision of the cutting device affects the precision of the square cut edge serving as a reference for positioning. Moreover, in the process of the chip cut shown to FIG. 13 (f), the positioning precision of a 2nd intermediate film 103, the setting precision, and the cutting precision of a cutting device are the optical which the objective is an optical film chip. This affects the precision of the axis.

As mentioned above, in the conventional cutting method of an optical film chip, there exists a problem that a deviation generate | occur | produces in the direction of an optical axis between the some optical film chip cut off. In recent years, the high contrast of a display apparatus is advanced, and the precision of the optical axis which is stricter than before is calculated | required. For example, in a conventional mobile phone, the tolerance of the optical axis was ± 1 °, but the tolerance of the optical axis of ± 0.25 ° is required in a smartphone or tablet type information terminal, and the required accuracy is more stringent in the future. It is expected to be.

An object of this invention is to provide the cutting device of an optical film chip, and the cutting method of an optical film chip which can suppress that the deviation of an optical axis generate | occur | produces among some optical film chip | tips.

In order to achieve the above object, a cutting device for an optical film chip of one embodiment according to the present invention is a cutting device for cutting an optical film as a cutting device for cutting a plurality of optical film chips from an optical film, and The data of the in-plane distribution of the optical axis of the optical film is acquired, and the cutting direction of the optical film by the cutting device is determined based on the data of the in-plane distribution of the optical axis of the optical film. It includes a control device that differs in surface.

In the cutting device for the optical film chip, the cutting device includes a first cutting device for cutting a plurality of optical film intermediates from the optical film, and a second cutting device for cutting a plurality of the optical film chips from the optical film intermediate. To; The control device calculates the direction of the average in-plane average optical axis of the optical film intermediate body based on the data of the in-plane distribution of the optical axis of the optical film, and the direction of the average in-plane average optical axis of the optical film intermediate body is the second. Controlling the cutting direction of the optical film intermediate by the second cutting device to achieve a desired angle with respect to the cutting direction of the optical film intermediate by the cutting device; The cutting device cuts the plurality of optical film chips from the optical film intermediate by cutting the optical film intermediate in the cutting direction controlled by the control device.

In the cutting apparatus of the said optical film chip, it comprises the rotating stage which mounts the said optical film intermediate body; The control device rotates the rotating stage such that the direction of the average optical axis in the plane of the optical film chip forms a desired angle with respect to the cutting direction of the optical film intermediate by the second cutting device.

In the cutting apparatus of the said optical film chip, the said control apparatus detects the two optical axes which cross | intersect at the largest angle in the plane of the said optical film intermediate body, and divides the axis | shaft which divides the angle which the said two optical axes make into 2 said optical film It calculates as an average optical axis in the plane of an intermediate body.

In the cutting device of the said optical film chip, the imaging device which image | photographs the installation state on the said rotation stage of the said optical film intermediate body is provided between the said rotation stage and the said 2nd cutting device; The control device is configured such that the direction of the average optical axis in the plane of the optical film intermediate body forms a target angle with respect to the cutting direction of the optical film intermediate body by the second cutting device based on the imaging result of the imaging device. Rotate the rotating stage.

The cutting device of the said optical film chip is equipped with the memory | storage device which stores the data of in-plane distribution of the optical axis of the said optical film.

The cutting device of the said optical film chip is equipped with the inspection apparatus which examines the optical axis of the said optical film in the some inspection position of the width direction of the said optical film.

In the cutting apparatus of the said optical film chip, the said inspection apparatus is equipped with the analyzer which can move to the width direction of the said optical film; The inspection apparatus detects the optical axis of the optical film by the analyzer while moving the analyzer in the width direction of the optical film, the plurality of inspection positions of the optical axis of the optical film in the width direction of the optical film Check in

The cutting method of the optical film chip of another aspect which concerns on this invention is a cutting method of the optical film chip which cuts several optical film chips from an optical film, Comprising: The 1st step of acquiring the data of in-plane distribution of the optical axis of the said optical film, ; And a second step of cutting the plurality of optical film chips from the optical film while varying the cutting direction of the optical film in the plane of the optical film based on the data of the in-plane distribution of the optical axis of the optical film.

In the cutting method of the optical film chip, the second step includes a third step of cutting the plurality of optical film intermediates from the optical film and a fourth step of cutting the plurality of the optical film chips from the optical film intermediate; In the fourth step, the direction of the average optical axis in the plane of the optical film intermediate is calculated based on the data of the in-plane distribution of the optical axis of the optical film, and the direction of the average in-plane average of the optical film intermediate in the plane is By adjusting the cutting direction of the optical film intermediate to achieve the desired angle with respect to the cutting direction of the optical film intermediate, and cutting the optical film intermediate in the adjusted cutting direction, a plurality of the optical film from the optical film intermediate Cut the chip.

In the cutting method of the said optical film chip | tip, in the said 4th step, the said optical film intermediate body is mounted on a rotating stage, and the direction of the average optical axis in the plane of the said optical film chip is a target with respect to the cutting direction of the said optical film intermediate body. Rotate the rotating stage to achieve an angle.

In the cutting method of the said optical film chip | tip, it detects the two optical axes which cross | intersect with the largest angle in the plane of the said optical film intermediate body, and makes the axis | shaft which divides the angle which the said two optical axes make into 2 equals in-plane average of the said optical film intermediate body It calculates with an optical axis.

In the cutting method of the said optical film chip, in the 4th step, the installation state of the said optical film intermediate body on the said rotation stage is imaged, and the direction of the average in-plane average optical axis of the said optical film chip is based on the imaging result. The rotating stage is rotated to achieve a desired angle with respect to the cutting direction of the optical film intermediate by the second cutting device.

According to the aspect of the present invention, it is possible to provide a cutting device for an optical film chip and a cutting method for an optical film chip which can suppress the occurrence of variations in the optical axis between a plurality of optical film chips.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the manufacturing system of the optical film chip which concerns on 1st Embodiment of this invention.
2 is a plan view of a manufacturing apparatus of an optical film.
It is a top view which shows the principal part of the cutting device of an optical film chip.
It is a figure which shows in-plane distribution of the optical axis of an optical film.
It is a figure which shows in-plane distribution of the optical axis of an optical film.
It is a figure which shows in-plane distribution of the optical axis of an optical film.
It is explanatory drawing at the time of cutting several optical film intermediate bodies from an optical film.
It is explanatory drawing at the time of rotating an optical film intermediate in a rotating stage.
It is explanatory drawing at the time of rotating an optical film intermediate in a rotating stage.
It is explanatory drawing at the time of cutting several optical film chip | tips from the optical film intermediate body.
8 is a flowchart illustrating a cutting method of an optical film chip.
It is a top view which shows the principal part of the cutting device of the optical film chip of 2nd Embodiment of this invention.
It is a graph which shows how much the angle | corner which the direction of the optical axis and the cutting direction of the optical film with a 2nd cutting device makes at the each inspection position of an optical film shifts with respect to the angle determined by design specification.
It is a graph which shows the deviation of the optical axis of the optical film chip cut | disconnected from the optical film intermediate in the prior art example.
It is a graph which shows the deviation of the optical axis of the optical film chip cut | disconnected from the optical film intermediate in the Example.
It is a schematic diagram which shows the cutting method of the optical film chip of a prior art example.

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of this invention is described referring drawings, this invention is not limited only to the following embodiment.

In addition, in all the following drawings, in order to make drawing clear, a dimension, a ratio, etc. of each component are changed suitably. In addition, in the following description and drawings, the same code | symbol is attached | subjected to the same or corresponding element, and the overlapping description is abbreviate | omitted.

In the following description, the positional relationship of each member is demonstrated, setting an XYZ rectangular coordinate system as needed and referring this XYZ rectangular coordinate system. In this embodiment, the width direction of the long optical film is made into the X direction, and the Y direction, the X direction, and the Y direction are the directions (or conveyance direction of a long optical film) orthogonal to the X direction in surface inside of an optical film. The direction orthogonal to is made into the Z direction.

[First Embodiment]

1: is a schematic diagram which shows the manufacturing system of the optical film chip of 1st Embodiment of this invention. Hereinafter, although the example which manufactures a polarizing plate as an optical film chip is demonstrated, an optical film chip may be a retardation film, a brightness improving film, etc. other than a polarizing plate, and may laminate | stack several optical elements, such as a retardation film and a polarizing plate.

The manufacturing system 1 of an optical film chip is an optical film manufacturing apparatus 11 which manufactures an optical film (henceforth only called an "optical film", F) of long shape, and the manufacturing apparatus of an optical film ( The cutting device 12 of the optical film chip | tip which cuts several optical film chips from the optical film F manufactured by 11) is provided.

The manufacturing apparatus 11 of an optical film is a film lamination apparatus 2 and the film lamination apparatus 2 which laminated | stack several optical layers F1, F2, F3, and manufacture one optical film F, The inspection apparatus 3 which examines the optical axis of the manufactured optical film F in the some inspection position of the width direction of an optical film is provided.

The film lamination apparatus 2 is an apparatus which laminates three optical layers F1, F2, F3, and manufactures one optical film F. FIG. As for the optical film F used by this embodiment, the polarizer film F1 which consists of PVA (polyvinyl alcohol) etc. is TAC (triacetyl cellulose) film (F2) which is two cellulose films, for example. It is a structure sandwiched by F3). In addition, the polarizer film F1 is dyed with, for example, iodine, a dichroic dye, or the like, in order to block light other than light vibrating in a constant direction.

In the film lamination apparatus 2, a pair of rollers 21 and 22 are provided up and down. The plurality of optical layers F1, F2, and F3 overlap each other and are supplied between the rollers 21 and 22.

And by pressing by both rollers 21 and 22, some optical layer F1, F2, F3 is bonded together, and one optical film F is manufactured. Moreover, a peeling film, a protective film, etc. may further be laminated | stacked on the surface of the 1st film F2 and the 2nd film F3. This optical film F is conveyed toward the inspection apparatus 3 by the conveyance roller 23.

The inspection apparatus 3 is equipped with the light source 31 arrange | positioned above the optical film F, and the analyzer 32 arrange | positioned under the optical film F. As shown in FIG. The analyzer 32 is provided with the light receiving element which abbreviate | omits illustration which is emitted from the light source 31, and receives the light which permeate | transmitted the optical film F. As shown in FIG. In the inspection apparatus 3, the optical axis of the optical film F is detected by detecting the intensity | strength of the light which permeate | transmitted the optical film F and the analyzer 32 with a light receiving element. The analyzer 32 is comprised so that a movement to the width direction of the optical film F is possible. The inspection apparatus 3 detects the optical axis of the optical film F by the analyzer 32 while moving the analyzer 32 in the width direction of the optical film F. The optical axis is inspected at a plurality of inspection positions in the width direction of the optical film F. FIG.

In addition, as the inspection apparatus 3, it is not limited to the structure which moves the analyzer 32 to the width direction of the optical film F, The structure provided with several analyzer in the width direction of the optical film F may be sufficient. .

2 is a plan view of the manufacturing apparatus 11 of the optical film.

As shown in FIG. 2, some test | inspection area | region CP is provided in the width direction (X-axis direction) of optical film F. As shown in FIG. The analyzer 32 is movable along the arrangement direction of these some inspection area | region CP. Thereby, the direction of an optical axis is detected in each test | inspection area | region CP in the width direction of the optical film F. As shown in FIG.

The data of the optical axis of the optical film F detected by the inspection apparatus 3 is associated with the position of the optical film F (position in the longitudinal direction of the optical film F and the position in the width direction) of the storage device 9 Remembered). The optical film examined by the inspection apparatus 3 is conveyed toward the winding-up part 25 by the conveyance roller 24. And it winds up in roll shape by the winding-up part 25, and the roll original fabric R of the optical film F is manufactured.

Returning to FIG. 1, the cutting device 12 of the optical film chip is conveyed by the conveying apparatus 4 and the conveying apparatus 4 which take out and convey the optical film F from the roll disk R, and the conveying apparatus 4 The 1st cutting device 5 which cuts several intermediate-size optical film intermediates from the film F, The rotating stage 6 which mounts the optical film intermediate cut | disconnected by the 1st cutting device 5, And an optical film intermediate An imaging device 7 for imaging the installation state on the rotary stage 6, a second cutting device 8 for cutting a plurality of optical film chips from an optical film intermediate placed on the rotary stage 6, and optical Memory device 9 for storing data of in-plane distribution of the optical axis of film F, film laminating device 2, inspection device 3, conveying device 4, first cutting device 5, rotation stage (6) The control device 10 which controls the imaging device 7, the 2nd cutting device 8, and the storage device 9 collectively is calculated | required. It is not. By the 1st cutting device 5 and the 2nd cutting device 8, the cutting device which cut | disconnects several optical film chips from the optical film F is comprised.

The conveying apparatus 4 is equipped with the loading part 41 which loads the roll disk R. As shown in FIG. The roll disk R of the optical film F manufactured by the manufacturing apparatus 11 of the optical film, and the optical axis was inspected by the inspection apparatus 3 is loaded in the loading part 41. The optical film F loaded in the loading part 41 is conveyed downstream by the conveyance rollers 42 and 43, is cut | disconnected by the 1st cutting device 5 and the 2nd cutting device 8, and is optical Film chips are made.

The rotation stage 6 rotates by the control signal of the control apparatus 10.

FIG. 3: is a top view which shows the principal part structure of the cutting device 12 of an optical film chip. In FIG. 3, the rotating stage 6, the 2nd cutting device 8, the memory | storage device 9, and the control apparatus 10 among the components of the cutting device 12 of the optical film chip are shown, The illustration is omitted.

The rotating stage 6 is equipped with the base 60 and the circular rotating base 61 provided so that rotation on the base 60 is possible. The marking 62 for positioning the optical film intermediate body Fa is given to the upper surface of the swivel base 61. Moreover, the fixing member 63 for fixing the optical film intermediate body Fa is provided in the upper surface of the rotating table 61. As shown in FIG. The fixing member 63 is an adhesive tape, for example.

In this embodiment, rather than cutting several optical film chips directly from the optical film F, the optical film intermediate body Fa of several intermediate sizes is cut out from the optical film F once, and after that, each optical film intermediate body is A plurality of optical film chips Fc are cut from (Fa) (refer FIG. 7). When the optical film chip Fc is cut directly from the long optical film F, the size of the optical film chip Fc is often much smaller than that of the long optical film F. This is because there is a possibility of becoming difficult.

The magnitude | size and shape of an optical film intermediate body Fa can be arbitrarily set according to the shape of the optical film chip Fc, the setting direction of the optical axis in the optical film chip Fc, etc.

In this embodiment, the optical film F is cut in the direction crossing the longitudinal direction (square cut), and after cutting the parallelogram-shaped film body, the optical film intermediate body Fa is cut by cutting it in half. Getting Cutting the film in half cuts one side into the inspection step, and causes defects in the film (parts in which at least one of solid, liquid, and gas exists inside the film, or irregularities on the surface of the film). This is to check whether or not there are a part where a flaw exists, a part which becomes a bright point due to deformation of the film body, material deflection or the like.

Data of the in-plane distribution of the optical axis of the optical film intermediate body Fa is produced by the control apparatus 10 based on the data of the in-plane distribution of the optical axis of the optical film F, and the in-plane distribution of the optical axis of the optical film F The data is stored in the storage device 9 together with the data.

The 2nd cutting device 8 is arrange | positioned in the position which adjoins each other to the rotation stage 6. The 2nd cutting device 8 is provided with cutters 8a and 8b (for example, a heating engraving blade) for cutting the some optical film chip | tip Fc from the optical film intermediate body Fa. The cutters 8a and 8b are arranged in a lattice form with a plurality of first cutters 8a arranged at regular intervals in the X direction and a plurality of second cutters 8b arranged at regular intervals in the Y direction as viewed from the Z direction. Has a configured configuration. The rectangular area cut by the 1st cutter 8a and the 2nd cutter 8b becomes one optical film chip Fc. In addition, as a structure which cuts several optical film chips Fc from the optical film intermediate body Fa, you may use a laser, not only a cutter.

4C are figures which show in-plane distribution of the optical axis of the optical film F. FIG. In addition, in FIG. 4A-FIG. 4C, the optical film F is conveyed from the conveying apparatus 4 in the longitudinal direction (+ Y-axis direction) of this optical film F. As shown in FIG.

As shown to FIG. 4A-FIG. 4C, various distribution exists in the in-plane distribution of the optical axis of the optical film F. As shown to FIG. The optical axis of the optical film F is arrange | positioned along the longitudinal direction of the optical film F generally.

However, looking at the in-plane distribution of the optical axis of the optical film F shown in FIG. 4A, the direction of an optical axis is inclined a little in the XY direction (rightward direction) with respect to the longitudinal direction of the optical film F. As shown in FIG. In the in-plane distribution of the optical axis of the optical film F shown in FIG. 4B, the direction of the optical axis is slightly inclined in the XY direction (rightward direction) with respect to the longitudinal direction of the optical film F and slightly inclined in the -XY direction (rightward direction). The ones are alternately arranged along the width direction of the optical film F. When the in-plane distribution of the optical axis of the optical film F shown to FIG. 4C is looked at, the direction of an optical axis shifts inward slightly compared with the center part of the optical film F in the width direction both ends of the optical film F. FIG.

The polarizer film constituting the optical film F is formed by uniaxially stretching a PVA film dyed with a dichroic dye, for example, as the in-plane distribution of the optical axis as shown in FIG. 4C, but when the stretching is a PVA film Between the direction of the optical axis of the center part of the optical film F, and the direction of the optical axis of the part (edge part) near the edge part of the optical film F, due to the nonuniformity of the thickness of the film, or the dyeing unevenness of the dichroic dye. This is because a deviation tends to occur. Hereinafter, the optical film F which has in-plane distribution of the optical axis shown to FIG. 4C as an example is given and demonstrated.

When cutting several small optical film chips from such an optical film F, between the optical film chip cut from the center part of the optical film F, and the optical film chip cut from the part near the edge part of the optical film F. FIG. , Deviation occurs in the direction of the optical axis. In the case where the deviation is large, the optical film chip cut from the portion close to the end cannot be used as a defective product, and the number of acquisitions of the optical film chip is reduced.

Therefore, in this embodiment, the cutting direction of the optical film F by the 2nd cutting device 8 is based on the data of the in-plane distribution of the optical axis of the optical film F previously memorize | stored in the memory | storage device 9. The inside of the optical film F is made different. Thereby, it is possible to reduce the dispersion | variation in the optical axis which arises between each optical film chip | tip Fc.

FIG. 5: is explanatory drawing at the time of cutting some optical film intermediates Fa and Fb from the optical film F. FIG.

In this embodiment, the optical film F conveyed by the conveying apparatus 4 becomes a square cut by a 1st cutting device (not shown). Thereby, two optical film intermediates Fa and Fb are cut off. Although not shown, each optical film intermediate body (Fa, Fb) has in-plane distribution of an optical axis, respectively. Hereinafter, a method of cutting the plurality of optical film chips Fc from the optical film intermediate body Fa by using the optical film intermediate body Fa among the two optical film intermediates Fa and Fb as an example will be described.

FIG. 6: A and 6B are explanatory drawing at the time of rotating the optical film intermediate body Fa in the rotating table 61. FIG. 6: A is a figure which shows the installation state of the optical film intermediate body Fa before rotating the rotating table 61, and FIG. 6B is a figure which shows the installation state of the optical film intermediate body Fa after rotating the rotating table 61. FIG. .

In addition, in FIG. 6A and 6B, the code | symbol L1 is along the width direction edge part of the predetermined axis | shaft (axis | shaft along the side which is not a square cut, in other words, optical film F, for example PVA film F1). Axis), L2 and L3 are axes parallel to the axis L1. The symbol V1 denotes the optical axis having the largest deviation angle from the axis L1 (hereinafter referred to as' first optical axis'), and the symbol V2 denotes the optical axis having the smallest deviation angle from the axis L2 (hereinafter referred to as' 2 optical axis'), and code | symbol V3 is an axis | shaft (henceforth "an average optical axis") which divides the angle which the 1st optical axis V1 and the 2nd optical axis V2 make into 2 parts. θ _max is an angle formed by a predetermined axis L1 and the first optical axis V1 (hereinafter referred to as a 'maximum shift angle'), and θ _min is a predetermined axis L2 and the second optical axis V2. The angle to form (hereinafter, referred to as 'minimum deviation angle') and θ _mid are angles (hereinafter, referred to as 'average deviation angle') formed by the predetermined axis L3 and the average optical axis V3.

Here, the "deviation angle" in FIGS. 6A and 6B is an angle when the direction of left rotation is positive about a predetermined axis and the direction of right rotation with respect to a predetermined axis is negative. .

In this embodiment, the control apparatus 10 detects the 1st optical axis V1 and the 2nd optical axis V2 which cross | intersect with the largest angle mutually in the surface of the optical film intermediate body Fa, and 1st optical The axis | shaft which divides the angle which the axis | shaft V1 and the 2nd optical axis V2 make into 2 is made into the average optical axis (average optical axis V3) in surface inside of optical film intermediate body Fa.

In this embodiment, the minimum deviation angle θ _min is 0, and the angle difference between the maximum deviation angle θ _max and the minimum deviation angle θ _min is Δα. In this case, as shown in FIG. 6A, the maximum deviation angle θ _max is represented by the angle Δα. In addition, the average shift angle θ _mid is represented by an angle Δα / 2.

For example, in order to manufacture an optical film chip | tip, it cuts at a predetermined angle so that the direction of the average optical axis in surface inside of an optical film chip may become a direction suitable for the target liquid crystal display device. For example, in the case of the absorption axis of the polarizing plate, the predetermined angle is 7 deg.

Here, the case where the axis L1 along the side which does not become square cut is made into the direction of the optical axis made into the objective by an optical film chip is considered. In this case, since the shift angle from the axis L2 is the smallest in the second optical axis V2, the second optical axis V2 is generally aligned with the direction of the optical axis targeted for the optical film chip. On the other hand, since the shift angle from the axis L1 is the largest, the 1st optical axis V1 is largely shift | deviated from the direction of the optical axis made into the objective in an optical film chip. The first optical axis V1 is shifted by the angle Δα from the direction of the optical axis of interest in the optical film chip.

On the other hand, in this embodiment, in the control apparatus 10, the direction of the average optical axis in surface inside of the optical film chip Fc is the cutting direction of the optical film intermediate body Fa by the 2nd cutting device 8. The rotating stage 6 is rotated so as to achieve the desired angle with respect to the. In this embodiment, as shown to FIG. 6B, the axis | shaft (axis L3) which forms the predetermined angle (gamma) with respect to the average optical axis V3 is several film chips Fc from the optical film intermediate body Fa. The rotation table 61 is rotated so that it becomes a reference | standard at the time of cutting | disconnecting, and the attitude | position of the optical film intermediate body Fa is adjusted.

For example, the turntable 61 is rotated leftward by (γ-Δα / 2). As a result, the average optical axis V3 forms an angle γ with respect to the axis L3. Thereby, the axis | shaft L3 becomes a reference | standard when cutting the some film chip | tip Fc from the optical film intermediate body Fa. Moreover, the average optical axis V3 respond | corresponds to the direction of the optical axis made into the objective in the optical film chip Fc. In this case, the second optical axis V2 is shifted by (γ-Δα / 2) with respect to the axis L2. On the other hand, the first optical axis V1 is shifted by (γ + Δα / 2) with respect to the axis L1.

That is, the second optical axis V2 is shifted by (−Δα / 2) with respect to the direction of the optical axis of interest in the optical film chip Fc. On the other hand, the 1st optical axis V1 is shifted | deviated by ((DELTA) (alpha) / 2) with respect to the direction of the optical axis made into the objective in the optical film chip Fc.

Thus, according to this embodiment, since the average optical axis V3 is made to correspond to the direction of the optical axis made into the objective in the optical film chip Fc, the axis | shaft L1 which forms a predetermined angle with respect to the side which made square cut. ), The shift angle between both the first optical axis V1 and the second optical axis V2 can be reduced in half compared to the case where the optical film chip is in the direction of the target optical axis (shift angle? Α → Δα / 2).

FIG. 7: is explanatory drawing at the time of cutting some optical film chip | tip Fc from the optical film intermediate body Fa.

In addition, in FIG. 7, the code | symbol Lc1 is X among the cutting lines (cutting line along the X-axis direction, cutting line along the Y-axis direction) when cutting several optical film chips Fc from the optical film intermediate body Fa. The axis overlaps the cutting line along the axial direction. The axis Lc1 corresponds to the axis L3 shown in FIG. 6B.

The 2nd cutting device 8 cuts several optical film chips Fc from the optical film intermediate body Fa based on the axis Lc1 by the control signal of the control apparatus 10. FIG. In this embodiment, the axis | shaft (axis L3) which forms the predetermined angle (gamma) with respect to average optical axis V3 becomes a reference | standard when cutting some film chips Fc from optical film intermediate body Fa. . That is, when cutting the some film chip Fc from the optical film intermediate body Fa, the direction for aligning the optical axis made into the objective in the optical film chip Fc is set to the angle (gamma) from the axis L3. Thereby, the direction of the average optical axis in surface inside of several optical film chip | tip Fc is arrange | positioned at the target direction.

(Cutting Method of Optical Film Chip)

The cutting method of the optical film chip in this embodiment is based on the 1st step of acquiring the data of the in-plane distribution of the optical axis of an optical film, and the cutting direction of an optical film based on the data of the in-plane distribution of the optical axis of an optical film. And a second step of cutting a plurality of said optical film chips from the optical film while varying in-plane of the optical film.

The second step includes a third step of cutting the plurality of optical film intermediates from the optical film and a fourth step of cutting the plurality of optical film chips from the optical film intermediate. Hereinafter, it demonstrates concretely using FIG.

8 is a flowchart illustrating a cutting method of an optical film chip.

First, as a 1st step, the control apparatus 10 acquires the data of in-plane distribution of the optical axis of the optical film F memorize | stored in the memory | storage device 9. As shown in FIG. Data of the in-plane distribution of the optical axis of the optical film F is used in order to detect the in-plane distribution of the optical axis of the optical film intermediates Fa and Fb. Data of the in-plane distribution of the optical axes of the optical film intermediates Fa and Fb is stored in the storage device 9.

Next, as a 2nd step, the some optical film chip | tip Fc is cut out from the optical film F. FIG. Specifically, first, as a third step, a plurality of optical film intermediates (Fa, Fb) are cut from the optical film (F), and then, as a fourth step, a plurality of optical from the optical film intermediates (Fa, Fb) The film chip Fc is cut off.

In a 4th step, first, the optical film intermediate body Fa is provided in the rotating stage 6 (step S1 shown in FIG. 8). For example, when attaching the optical film intermediate body Fa to the swivel base 61, as shown in FIG. 3, the side which does not become the square cut of the optical film intermediate body Fa is aligned with the marking 62. FIG. . Moreover, the optical film intermediate body Fa is fixed by the fixing member 63. FIG. Thus, by positioning on the side of the optical film intermediate body Fa that is not square cut, the deviation of the optical axis due to the cutting precision can be avoided compared with the case of positioning on the basis of the square cut edge. Can be.

In addition, as for the optical film intermediate body Fa here, the two optical film intermediate bodies Fa, in which the optical film F sent out by the conveying apparatus 4 was cut into square cuts by the 1st cutting device 5, Let Fb) be one optical film intermediate (optical film intermediate (Fa)).

Next, the rotation stage 6 is rotated based on the data of the in-plane distribution of the optical axis of the optical film intermediate body Fa stored in the storage device 9 (step S2 shown in FIG. 8). For example, as shown to FIG. 6B, the axis | shaft (axis L3) which makes | forms predetermined angle (gamma) with respect to the average optical axis V3, has several film chips Fc from the optical film intermediate body Fa. The rotation stage 6 is rotated so that it becomes a reference | standard at the time of cutting, and the attitude | position of the optical film intermediate body Fa is adjusted. For example, the installation state on the rotation stage 6 of the optical film intermediate body Fa is imaged with a camera, and the rotation stage 6 is rotated based on an imaging result. This corrects the setting deviation of the optical film intermediate body Fa.

And the some film chip Fc is cut out from the optical film intermediate body Fa (step S3 shown in FIG. 8). For example, as shown in FIG. 7, the some optical film chip | tip Fc is cut out from the optical film intermediate body Fa based on the axis | shaft Lc1.

By the above process, the some optical film chip | tip Fc is obtained.

According to the cutting device 12 of the optical film chip of this embodiment and the cutting method of the optical film chip, based on the data of the in-plane distribution of the optical axis of the optical film intermediate body Fa previously memorize | stored in the memory | storage device 9, The cutting direction of the optical film intermediate body Fa by the 2 cutting devices 8 is controlled. In this control, the 2nd cutting device 8 so that the direction of the average optical axis in surface inside of the optical film intermediate body Fa may make the target angle with respect to the cutting direction of the optical film intermediate body Fa by the 2nd cutting device 8. ), The cutting direction of the optical film intermediate body Fa is controlled. And the some optical film chip Fc is cut out from the optical film intermediate body Fa by the 2nd cutting device 8 in which the cutting direction was controlled in this way. Therefore, the dispersion | variation in the optical axis which arises between each optical film chip Fc can be reduced.

In addition, in this embodiment, the example which cut | disconnected some optical film intermediate body Fa from the optical film F, and cuts several optical film chips Fc from the optical film intermediate body Fa was demonstrated. However, this invention is not limited to this, For example, it is applicable also when cutting several optical film chips Fc directly from the optical film F. As shown in FIG. In this case, based on the data of the in-plane distribution of the optical axis of the optical film F, the cutting direction of the optical film F is changed in surface inside of the optical film F, and it is several optical film chips from the optical film F. (Fc) will be cut.

In addition, in this embodiment, although the some optical film chip | tip Fc is cut out from the optical film F, the several optical film chip Fc which cut | disconnected is considered, and it ships to the outside, but this invention is based on this. It is not limited. For example, it can apply also when the optical film F is pulled out from a roll disk and bonded to optical display panels, such as a liquid crystal panel, and the optical film F is cut to the magnitude | size of an optical display panel. Also in this case, the optical axis of the optical film F of the position bonded to an optical display panel is acquired from a memory | storage device, and the bonding attitude | position of an optical display panel and the cutting direction of the optical film F are matched with the direction of the optical axis of the position. When it adjusts, the optical film chip Fc can be cut | disconnected, without large shift | deviating from the direction (direction determined by a design specification) made into the optical axis.

Moreover, in this embodiment, although the method of cutting the some optical film chip | tip Fc from the two optical film intermediate bodies Fa and Fb cut into the rectangular cut by the 1st cutting device 5 was demonstrated, It is not limited to. For example, this invention can be applied also when cutting 3 or more optical film intermediates with the 1st cutting device 5, and cutting several optical film chips Fc from each of these 3 or more optical film intermediates. have. That is, this invention can be applied also when the number of sheets of the optical film intermediate cut by the 1st cutting device 5 is 3 or more sheets.

[Second Embodiment]

Hereinafter, the imaging device 7 which picks up the installation state on the rotating stage 6 of the optical film intermediate body as a cutting device of the optical film chip of 2nd Embodiment of this invention using FIG. The example provided is demonstrated.

As shown in FIG. 9, the imaging device 7 includes a transfer stage 70, a first camera 71, and a second camera 72. The imaging device 7 is disposed between the rotation stage 6 and the second cutting device 8.

The optical film intermediate body Fa is conveyed to the imaging area of the 1st camera 71 and the 2nd camera 72 by the conveyance stage 70 in the state mounted on the rotating stage 6.

The first camera 71 is disposed near the -X axis direction with respect to the transport stage 70. The 1st camera 71 image | photographs the edge part (edge part of + Y-axis direction side) of the optical film intermediate body Fa on the -X-axis direction side. The second camera 72 is disposed near the + X axis direction with respect to the transfer stage 70. The 2nd camera 72 image | photographs the edge part (edge part of + Y-axis direction side) of the optical film intermediate body Fa on the + X-axis direction side.

The optical film intermediate body (Fa) which the edge part of the -X axis direction side, and the edge part of the edge part of the + X axis direction side imaged is conveyed toward the 2nd cutting device 8 in the state mounted on the rotating stage 6. do.

In this embodiment, based on the imaging result of the imaging device 7 which has some camera 71 and 72, the direction of the average optical axis in surface inside of the optical film intermediate body Fa is made to the 2nd cutting device 8. The rotating stage 6 is rotated so as to achieve the desired angle with respect to the cutting direction of the optical film intermediate body Fa.

For example, the control apparatus 10 is based on the position of the edge part of the optical film intermediate body Fa on the -X-axis direction side, and the position of the edge part of the + X-axis direction based on the imaging result of the imaging device 7. The amount of deviation is calculated. The control apparatus 10 rotates the rotation stage 6, and correct | amends a cutting position before cutting the some optical film chip Fc from the optical film intermediate body Fa based on this calculation data.

Hereinafter, similarly to the said embodiment, the some optical film chip | tip Fc is cut out from the optical film intermediate body Fa.

By the above process, the some film chip | tip Fc is obtained.

In this embodiment, correction | amendment of the cutting position at the time of cut | disconnecting the some optical film chip Fc from the optical film intermediate body Fa based on the imaging result of the imaging device 7 which has some camera 71, 72 is carried out. This is done. Therefore, the positional accuracy of the optical film intermediate body Fa when cutting several optical film chips Fc from the optical film intermediate body Fa can be improved.

As mentioned above, although the example of preferable embodiment which concerns on this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. All shapes, combinations, and the like of each component shown in the above-described example are merely examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

Example

EMBODIMENT OF THE INVENTION Hereinafter, although this invention is demonstrated more concretely based on an Example and a prior art example, this invention is not limited to a following example.

FIG. 10 shows the angle formed between the direction of the optical axis and the cutting direction of the optical film (optical film intermediate) by the second cutting device at each inspection position of the optical film. It is a graph that shows the degree of deviation.

In FIG. 10, the horizontal axis represents the inspection position in the width direction of the optical film, and the vertical axis represents the angle between the direction of the optical axis of the optical film at each inspection position and the cutting direction of the optical film by the second cutting device. It shows how much shift is made with respect to the angle.

In FIG. 10, "+ X direction side" is in-plane distribution of the + X direction side part of the optical film shown in FIG. 4C. "-X direction side" is in-plane distribution of the -X direction side part of the optical film shown in FIG. 4C. The number of 1-9 shown to the "-X direction side" shows the inspection position from the edge of the -X direction side of an optical film in order. For example, the inspection position closest to the edge on the -X direction side of the optical film corresponds to the number 1, and the inspection position closest to the center portion of the optical film corresponds to the number 9. 1 shown in the "+ X direction side" The number of -9 shows the inspection position from the edge of the + X direction side of an optical film in order. For example, the inspection position closest to the edge on the + X direction side of the optical film corresponds to the number 1, and the inspection position closest to the center portion of the optical film corresponds to the number 9. That is, in the present Example, 18 inspection positions are provided in the width direction of an optical film, and the in-plane distribution of the optical axis of an optical film is detected.

In FIG. 10, a "conventional example" is an example which arrange | positioned the optical film intermediate body and cut | disconnected the chip | tip so that the longitudinal direction of an optical film may make the objective angle with respect to the cutting direction of the optical film intermediate body by a 2nd cutting device. Is an example in which the optical film intermediate is rotated so that the direction of the average in-plane average optical axis of the optical film intermediate reaches the desired angle with respect to the cutting direction of the optical film intermediate by the second cutting device.

As shown in FIG. 10, the graph of a prior art example reflects the in-plane distribution of the optical axis of an optical film as it is. That is, although the shift | offset | difference from a target angle is small in the center part of an optical film, the shift | offset | difference from a target angle is large in the edge part of an optical film. Looking at the graph of a prior art example, it turns out that it has a big shift angle at the 4th inspection position in the -X direction side of an optical film, and has a big shift angle at the 1st inspection position in the + X direction side of an optical film.

On the other hand, in the graph of an Example, the shift | offset | difference from the objective angle has generate | occur | produced in the center part of an optical film, but the shift | offset | difference from the objective angle in the edge part of an optical film is small. The magnitude | size of the shift | offset | difference from the objective angle in the center part and the edge part of an optical film is smaller than the magnitude | size of the shift | offset | difference from the objective angle in the edge part of the optical film in a prior art example. Looking at the graph of the example, it has a large shift angle at the 4th inspection position and the 7th inspection position in the -X direction side of an optical film, and a big shift angle at the 8th inspection position and a 3rd inspection position in the + X direction side of an optical film It can be seen that it has.

Thus, in the Example, since the cutting direction of an optical film intermediate body is adjusted based on the in-plane distribution of the optical axis of an optical film intermediate body, the magnitude | size of the shift | offset | difference from the objective angle is substantially uniform in the surface of an optical film intermediate body. For this reason, like the conventional example, the problem that the shift | offset | difference from the objective angle differs significantly in the center part and the edge part of an optical film does not arise. Therefore, even when cutting a some optical film chip | tip from an optical film, it is suppressed that the optical axis largely shifts among the some optical film chip | tips cut | disconnected.

11 and 12 are graphs showing the deviation of the optical axis of the optical film chip cut from the optical film intermediate. 11 shows the results of the conventional example, and FIG. 12 shows the results of the example. In FIG. 11 and FIG. 12, the horizontal axis shows how much the optical axis of the optical film chip is shifted with respect to the optical axis determined by the design specification (deviation angle of the optical axis), and the vertical axis shows the number (frequency) of the optical film chip. have.

As shown in FIG. 11, in the conventional example, the value of standard deviation ((sigma)): 0.10 degree was obtained. The frequency of the optical film chip at each shift angle is substantially uniform.

As shown in FIG. 12, in the Example, the value of standard deviation (sigma): 0.06 degrees was obtained. The frequency of the optical film chip in each shift | offset | difference angle has shown the distribution of the mountain shape where the area | region with a small shift angle is large, and the area | region with a big shift angle is small. Even if the required precision becomes strict in the future, the ratio (excellent product rate) of the optical film chip that can satisfy the required precision does not drop significantly.

Thus, in the conventional example, since the frequency of the optical film chip in each shift angle is substantially uniform, when the required precision becomes strict in the future, the ratio (excellent product rate) of the optical film chip which can satisfy | fill the required precision is It is expected to fall significantly. On the other hand, in the Example, since the ratio of the optical film chip with a small displacement angle is larger than the ratio of the optical film chip with a large displacement angle, even if the required precision becomes strict in the future, this required precision can be satisfied. The proportion of the optical film chip does not drop significantly. Therefore, compared with the conventional example, many optical film chips can be cut from one optical film, and the production efficiency of an optical film chip can be improved.

3…. Inspection device 5. First cutting device
6 ... Rotation stage 7... Imaging device
8 … Second cutting device 9... store
10 ... Control device 12. Cutting device of optical film chip
32 ... Analyzer F… Optical film
Fa, Fb… Optical film intermediate Fc... Optical film chip
V1 ... First optical axis V2... Second optical axis
V3... Average optical axis (average optical axis in plane of the optical film intermediate)

Claims (13)

As a cutting device of an optical film chip to cut a plurality of optical film chips from an optical film,
A cutting device for cutting the optical film;
Data of the in-plane distribution of the optical axis of the optical film is acquired, and the cutting direction of the optical film by the cutting device is determined in-plane based on the data of the in-plane distribution of the optical axis of the optical film. Cutting device of an optical film chip comprising a control device to be different in. The method according to claim 1,
The cutting device includes a first cutting device for cutting a plurality of optical film intermediates from the optical film, and a second cutting device for cutting a plurality of the optical film chips from the optical film intermediate;
The said control apparatus calculates the direction of the average in-plane average optical axis of the said optical film intermediate body based on the data of the in-plane distribution of the optical axis of the said optical film, The direction of the average in-plane average of the optical film intermediate of the said optical film is said 2nd Controlling the cutting direction of the optical film intermediate by the second cutting device to achieve a desired angle with respect to the cutting direction of the optical film intermediate by the cutting device;
The said cutting device cut | disconnects the said optical film intermediate body in the cutting direction controlled by the said control apparatus, The cutting device of the optical film chip which cut | disconnects the some optical film chip | tips from the said optical film intermediate body. The method according to claim 2,
Further comprising a rotating stage for mounting said optical film intermediate;
The control device is a cutting of the optical film chip which rotates the rotating stage such that the direction of the average optical axis in the plane of the optical film chip forms a desired angle with respect to the cutting direction of the optical film intermediate by the second cutting device. Device. The method according to claim 3,
The control device detects two optical axes intersecting at the largest angle in the plane of the optical film intermediate, and divides the axis formed by the two optical axes into two equally average optical axes in the plane of the optical film intermediate. Cutting device for optical film chips to be calculated. The method according to any one of claims 2 to 4,
An imaging device for imaging an installation state of the optical film intermediate on the rotation stage between the rotation stage and the second cutting device;
The control device is configured such that the direction of the average optical axis in the plane of the optical film intermediate body forms a target angle with respect to the cutting direction of the optical film intermediate body by the second cutting device, based on the imaging result of the imaging device. Cutting device for optical film chips for rotating the rotating stage. The method according to any one of claims 1 to 4,
And a storage device for storing data of in-plane distribution of the optical axis of the optical film. The method according to any one of claims 1 to 4,
And an inspection device for inspecting the optical axis of the optical film at a plurality of inspection positions in the width direction of the optical film. The method of claim 7,
The inspection apparatus includes an analyzer movable in the width direction of the optical film;
The said inspection apparatus detects the optical axis of the said optical film with the said analyzer while moving the said analyzer in the width direction of the said optical film, The optical axis of the said optical film is the several inspection position of the width direction of the said optical film. Device for cutting optical film chips inspected by As a cutting method of an optical film chip which cuts a plurality of optical film chips from an optical film,
A first step of acquiring data of in-plane distribution of the optical axis of the optical film;
An optical film including a second step of cutting the plurality of optical film chips from the optical film while varying the cutting direction of the optical film in the plane of the optical film based on data of in-plane distribution of the optical axis of the optical film Cutting method of chips. The method of claim 9,
The second step includes a third step of cutting the plurality of optical film intermediates from the optical film and a fourth step of cutting the plurality of the optical film chips from the optical film intermediate;
In the fourth step, the direction of the average optical axis in the plane of the optical film intermediate is calculated based on the data of the in-plane distribution of the optical axis of the optical film, and the direction of the average in-plane average of the optical film intermediate in the plane is By adjusting the cutting direction of the optical film intermediate to achieve the desired angle with respect to the cutting direction of the optical film intermediate, by cutting the optical film intermediate in the adjusted cutting direction, a plurality of the optical film from the optical film intermediate Method of cutting an optical film chip to cut the chip. The method of claim 10,
In the fourth step, the optical film intermediate is placed on the rotating stage, and the rotating stage is rotated so that the direction of the average optical axis in the plane of the optical film chip forms a desired angle with respect to the cutting direction of the optical film intermediate. Method of cutting optical film chips. The method of claim 11,
An optical film that detects two optical axes intersecting at the largest angle in the plane of the optical film intermediate and calculates an axis that bisects the angle formed by the two optical axes as an average optical axis in the plane of the optical film intermediate. Cutting method of chips. The method according to any one of claims 10 to 12,
In said 4th step, the installation state of the said optical film intermediate body on the said rotation stage is imaged, and the direction of the average optical axis in surface inside of the said optical film chip | tip is based on the imaging result, The said optical by the said 2nd cutting device A method for cutting an optical film chip, by rotating the rotating stage to achieve a desired angle with respect to the cutting direction of the film intermediate.

Images