KR101327148B1 - Appratus and method for setting attitude of slit nozzle for coating substrate - Google Patents

Abstract

The present invention relates to a device for setting a slit nozzle for substrate processing, comprising: a substrate chuck made of a stone material in which a plurality of suction holes suck and fix the substrate; An elastic seal arranged to surround a circumference of an area to which the substrate is fixed; A slit nozzle for applying a coating liquid to a surface of the substrate; A first moving unit for moving the slit nozzle relative to the substrate chuck; A vacuum chamber cover having a lower side open to form a sealed space including a lower portion of the upper surface of the substrate chuck in contact with the elastic seal; A vacuum forming unit for extracting air in the sealed space to depressurize the sealed space; A second moving unit configured to move the vacuum chamber cover so that the vacuum chamber cover forms the sealed space; The posture setting of the slit nozzle is performed by setting the posture of the slit nozzle while the substrate is fixed at one position by coating liquid application, drying, and coating layer thickness measurement using a slit nozzle setting device separate from the production equipment. The present invention provides a setting apparatus for a slit nozzle for processing a substrate, which enables the coating liquid coating step in the mass production step to be performed continuously so that the coating liquid coating process for the substrate to be processed can be performed more per unit time.

Description

Method of setting slit nozzle for substrate processing and setting device of slit nozzle using same {APPRATUS AND METHOD FOR SETTING ATTITUDE OF SLIT NOZZLE FOR COATING SUBSTRATE}

The present invention relates to a method for setting a slit nozzle for processing a substrate and an apparatus using the same, and more particularly, to apply a coating liquid to a surface of a substrate to be treated using the slit nozzle. The present invention relates to a method of setting a slit nozzle for processing a substrate that can be set more quickly and simply in a coated state, and to an apparatus using the same.

In the process of manufacturing flat panel displays, such as LCD, the coating process of apply | coating coating liquids, such as a resist liquid, on the surface of the to-be-processed substrate made from glass etc. is accompanied. Conventionally, in which the size of the LCD was small, a spin coating method was used in which the coating liquid was applied to the surface of the substrate by rotating the substrate while applying the coating liquid to the center of the substrate.

However, as the size of the LCD screen becomes larger, the spin coating method is rarely used, and the coating liquid is treated from the slit nozzle while relatively moving the slit-shaped slit nozzle having a length corresponding to the width of the substrate and the substrate to be processed. The coating method of the method of apply | coating to the surface of a board | substrate is used.

The coating method using the slit nozzle can apply the coating liquid over the entire width of the substrate to be processed at once, and has the advantage of coating the coating liquid with a uniform thickness as a whole. However, in order to coat the surface of the substrate with a uniform thickness using the slit nozzle, the gap between the slit nozzle and the substrate to be processed must be constant throughout the width direction, and the coating liquid is uniform from the slit nozzle. It must be injected.

However, before mounting the slit nozzle to the substrate processing apparatus, it is very difficult to check whether the slit nozzle posture is properly installed. Furthermore, when the coating liquid is applied to the substrate to be treated with the slit nozzle set in any one posture, the vacuum coated drying apparatus is applied to the substrate to be coated in the substrate coating apparatus to confirm that the coating liquid is sprayed at a constant thickness over the entire width. This is because it is only possible after the transfer to dry the coating solution.

By the way, it is very important that the newly replaced slit nozzle is installed in the correct position and posture with respect to the substrate to be processed. Accordingly, conventionally, after the slit nozzle is mounted on the substrate processing apparatus, the coating liquid is applied, the substrate to be processed is transferred to a vacuum pressure drying apparatus, the coating liquid applied to the substrate to be dried is dried, and the thickness of the coating layer is measured to measure the slit nozzle. It was checked whether or not it was coupled to the mobile unit in the correct posture, and if the coating layer applied by the slit nozzle was not formed to a certain thickness, it was necessary to repeat the step of adjusting the posture of the slit nozzle again. Such a process causes a problem of delaying the process because the coating process of the coating liquid of the substrate to be processed cannot be continuously performed.

Therefore, the necessity of the measure which makes it possible to use the slit nozzle used for application | coating of the coating liquid of a to-be-processed board | substrate immediately in a mass production stage has become high.

The present invention provides a device for setting a slit nozzle for processing a substrate that can be used immediately without delaying the process in the mass production step to solve the above problems, the new slit nozzle used in the coating of the coating liquid of the substrate to be processed For that purpose.

In addition, the present invention, once the substrate is fixed to the setting apparatus of the slit nozzle for substrate processing as described above, so that even if the substrate is not moved, it is possible to finish both the coating process of the coating liquid, the vacuum drying process of the coating liquid and the thickness measurement process of the coating layer. Another object is to make the setting process of the slit nozzle faster and easier.

In addition, the present invention is to further improve the sealing performance of the space in which the substrate is mounted in the vacuum pressure drying process in a state where the substrate is mounted on the substrate chuck to further facilitate the drying process of the coating liquid It is done.

In order to achieve the above object, the present invention provides a substrate chuck made of a stone material in which a plurality of suction holes suck and fix a substrate; An elastic seal arranged to surround a circumference of an area to which the substrate is fixed; A slit nozzle for applying a coating liquid to a surface of the substrate; A first moving unit for moving the slit nozzle relative to the substrate chuck; A vacuum chamber cover having a lower side open to form a sealed space including a lower portion of the upper surface of the substrate chuck in contact with the elastic seal; A vacuum forming unit for extracting air in the sealed space to depressurize the sealed space; A second moving unit configured to move the vacuum chamber cover so that the vacuum chamber cover forms the sealed space; It provides a setting apparatus of the slit nozzle for substrate processing comprising a.

Through this, the present invention by using a setting device separate from the mass production equipment to set the posture, the position and the discharge state of the coating liquid of the slit nozzle, it is possible to continuously perform the coating liquid coating step in the mass production step per unit time It becomes possible to perform more application | coating processes of the coating liquid of a process board | substrate.

In addition, the apparatus for setting a slit nozzle for processing a substrate according to the present invention applies a coating liquid to a test substrate with a slit nozzle that is moved by the first moving unit while the test substrate is suction-fixed to the substrate chuck. The vacuum chamber cover which forms the vacuum chamber by the second moving unit without moving the substrate covers the test substrate to form a sealed space, and then vacuums by forming the vacuum by the vacuum forming unit to dry the substrate to be processed. It can be fixed to the coating liquid coating, drying and coating layer thickness measurement can all be performed. As a result, it is possible to easily check whether or not the attitude of the slit nozzle is correct in a much shorter time than in the related art.

First of all, as the elastic seal is arranged at a position where the bottom surface of the vacuum chamber cover abuts, the bottom surface of the vacuum chamber cover abuts the elastic seal to form a sealed space including the top surface of the substrate chuck as a vacuum drying chamber. By extracting the air from the air to allow the drying process to be carried out in a vacuum lower than atmospheric pressure, the coating liquid applied to the substrate is dried quickly and smoothly so that the coating state applied by the slit nozzle can be accurately confirmed.

Since the position of the elastic seal is fixed, the second moving unit is controlled to move the vacuum chamber cover to a position where the bottom surface of the vacuum chamber cover is in contact with the elastic seal. Sensing means for aligning the relative positions of at least one of the vacuum chamber cover and the periphery of the elastic seal may be provided so that the bottom surface of the vacuum chamber cover may be more in contact with the elastic seal.

For example, the sensing means may detect at least one of a light emitting part and a light receiving part in the vacuum chamber cover so that the bottom surface of the vacuum chamber cover is in contact with the elastic seal.

On the other hand, although the substrate chuck may move and only the slit nozzle and the vacuum chamber cover may move up and down, according to a preferred embodiment of the present invention, the substrate chuck is fixed in position and the second moving unit is a longitudinal type of the substrate. And apply a coating liquid to the surface of the substrate from the slit nozzle while moving in the direction.

After the vacuum chamber cover is in contact with the elastic seal to form a closed space, and vacuum-dried the coating liquid applied to the surface of the test substrate, the coating liquid is dried, and then the coating layer of the test substrate generated in the transverse direction (slit nozzle). And measuring means for measuring along the width direction). The measuring means may measure the thickness of the coating layer using light such as a laser, or may measure the thickness of the coating layer by contacting the coating layer with a structure similar to a dial gauge.

When the coating liquid applied from the slit nozzle fixed to the first moving unit is inspected to be applied unevenly by using the setting apparatus of the substrate processing slit nozzle configured as described above, the slit nozzle fixed to the first moving unit Adjust the position and posture of the slit nozzle further by using the adjusting unit to adjust the posture of the slit nozzle. Through this, the posture can be set completely so that the coating liquid is applied to the surface of the substrate to be treated with a predetermined thickness from the slit nozzle on the setting device provided separately.

The vacuum forming unit is used to vacuum the pressure inside the sealed space to a vacuum lower than atmospheric pressure through a suction pipe communicating with the sealed space. In this case, the suction pipe may be connected to the vacuum chamber cover, or may be connected to a substrate chuck other than the vacuum chamber cover. On the other hand, the vacuum forming unit may be configured to extract the air in the sealed space also through the suction hole of the substrate chuck is not mounted.

As described above, the present invention uses the setting device of the slit nozzle to set the posture setting of the slit nozzle and the coating liquid coating, drying, and coating layer thickness measurement by using the setting device of the slit nozzle separate from the slit nozzle. By setting the posture, the coating liquid coating step in the mass production step can be continuously performed, thereby providing a setting apparatus for the slit nozzle for substrate processing that allows more coating steps of the coating liquid of the substrate to be processed per unit time.

Above all, the present invention forms a vacuum drying chamber by contacting the vacuum chamber cover using an elastic seal even when the substrate is fixed to the substrate chuck, so that the coating liquid applied on the substrate is dried even when the substrate is placed on the substrate chuck. An advantageous effect of allowing a simple measurement of the thickness of the coating layer in a state can be obtained.

That is, in the present invention, when the test substrate is suction-fixed to the substrate chuck once, the coating liquid is applied by a slit nozzle, and the vacuum pressure drying process is performed in the sealed space formed by the vacuum chamber cover. By holding the substrate to be fixed in one place and applying the coating solution, drying, and coating layer thickness measurement, it is possible to obtain an advantageous effect that the posture, position and application state of the slit nozzle can be easily confirmed in a much shorter time.

1 is a perspective view showing the configuration of a setting apparatus of a slit nozzle for processing a substrate according to an embodiment of the present invention;
Figure 2 is a front view of Figure 1
3 is a perspective view showing the configuration of the substrate chuck of FIG.
4 is an exploded perspective view of FIG.
5 is a cross-sectional view taken along the cutting line VV of FIG.
6A-6C are cross-sectional views of various embodiments taken along the line VI-VI of FIG. 4.
7 is a schematic diagram showing the configuration of the attitude adjustment mechanism of the slit nozzle of FIG.
8 is a flowchart sequentially illustrating a method of setting a slit nozzle for processing a substrate according to an embodiment of the present invention.
9A to 9F show the configuration according to the setting procedure of the slit nozzle for substrate processing;

Hereinafter, an apparatus 100 for setting a slit nozzle for processing a substrate according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention.

1 is a perspective view showing the configuration of a setting apparatus of a slit nozzle for processing a substrate according to an embodiment of the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a perspective view showing a configuration of the substrate chuck of FIG. 4 is an exploded perspective view of FIG. 3, FIG. 5 is a sectional view taken along the cutting line VV of FIG. 3, FIGS. 6A to 6C are sectional views of various embodiments taken along the cutting line VI-VI of FIG. 4, and FIG. 7 is a slit of FIG. 1. 8 is a schematic diagram showing a configuration of a nozzle adjusting mechanism of the nozzle, and FIG. 8 is a flowchart showing a method of setting a slit nozzle for substrate processing according to an embodiment of the present invention, and FIGS. 9A to 9F are views of a slit nozzle for substrate processing. It is a figure which shows the structure according to the setting procedure.

As shown in the drawings, the apparatus 100 for setting a slit nozzle for processing a substrate according to an embodiment of the present invention includes a stone in which a plurality of suction holes 111 suck and fix the test substrate G. The substrate chuck 110 is made of a material, an elastic seal 170 arranged to surround the circumference of the substrate chuck 110 to which the substrate G is fixed, and is formed long in the transverse direction 110k of the substrate G. The slit nozzle 120 for applying the coating liquid 55 to the surface of the substrate G, the first moving unit 130 for moving the slit nozzle 120 relative to the substrate chuck 110, and downwards are opened. The bottom surface is in contact with the elastic seal 170, the vacuum chamber cover 140 to form a closed space (140c) including at least a portion of the upper surface of the substrate chuck 110 and the air of the sealed space (140c) is drawn out A vacuum forming unit for depressurizing the sealed space 140c and moving the vacuum chamber cover 140 so that the vacuum chamber cover 140 forms the sealed space 140c. The key is a posture of the second moving unit 150, the coating layer thickness measuring means 180 for measuring the thickness of the coating layer formed on the surface of the test substrate (G), and the slit nozzle fixed to the first moving unit. And an adjusting unit 190 for adjusting.

The substrate chuck 110 is firmly positioned by applying a suction pressure to the suction hole 111 through the test substrate G, and is a stone such as granite so as not to be shaken by disturbance. It is made of material. Since the slit nozzle setting apparatus 100 is used for checking and setting the coating liquid 55 from the slit nozzle 120 to a uniform thickness, there is no need to use a large substrate to be manufactured. Therefore, the substrate chuck 110 is manufactured to a size enough to pass the test substrate (G) of a smaller size than the large to-be-processed substrate used in the mass production step.

The slit nozzle 120 is for applying the coating liquid 55 to the surface of the substrate to be processed in a mass production step, and a slit having a length corresponding to the width of the substrate to be processed is formed long in the width direction. The coating liquid 55 sprayed from the slit nozzle 120 is supplied from the coating liquid pump 121 while moving the surface of the test substrate G in a state in which a single amount is collected in the coating liquid pump 121.

The first moving unit 130 is referred to in the art as a gantry (gantry) (gantry) (120d) the slit nozzle 120 along the guide rail 131 is arranged along the longitudinal direction of the substrate chuck 110 And the slit nozzle 120 is operated to move in the vertical direction (120u).

The vacuum chamber cover 140 is formed in a rectangular parallelepiped shape having a downward opening, and when the vacuum chamber cover 140 moves downward and the bottom surface thereof contacts the upper surface or the periphery of the substrate chuck 110, the substrate chuck 110. The sealed space 140c including the upper surface of the () is formed. The vacuum chamber cover 140 is connected to a suction pipe 142 extending from the vacuum forming unit to suck and evacuate the air in the sealed space 140c.

Like the first moving unit 130, the second moving unit 150 moves the vacuum chamber cover 140 in the longitudinal direction 140d along the guide rail 151 arranged along the longitudinal direction of the substrate chuck 110. It also moves, and operates to move the vacuum chamber cover 140 in the vertical direction (140u).

When the vacuum chamber cover 140 is moved by the second moving unit 150 to cover the test substrate G fixedly mounted on the upper surface of the substrate chuck 110, the inner surface and the substrate chuck of the vacuum chamber cover 140 are moved. In order to improve the sealing performance of the closed space 140c formed by the upper surface of the 110, the elastic seal 170 formed of an elastic material such as rubber or urethane is fixed to contact the bottom surface of the vacuum chamber cover 140 Is installed.

The elastic seal 170 may be directly fixed to the substrate chuck 110, but according to a preferred embodiment of the present invention, it is difficult to directly fix the elastic seal 170 to the substrate chuck 110 made of granite. 5, since the seal holder 160 is made of a metal material such as stainless steel having high strength without deformation, as shown in FIG. 5, the elastic seal 170 is attached to the seal holder 160. It is configured to fix it to the substrate chuck 110 by installing.

Here, after the groove is processed so that the elastic seal 170 is seated in the seal fixing body 160, the elastic seal 170 is fixed in the form of being bonded to the groove. 3 and 4, the seal fixing body 160 includes a through portion 160a through which the substrate chuck 110 penetrates, and the substrate chuck 110 is disposed in the through portion 160a. The substrate chuck 110 is positioned around the substrate chuck 110 in a state where it is passed. Then, the substrate chuck 110 is fixed in position by the clasp 66 on the side. According to another embodiment of the present invention, the seal holder 160 may be fixed to the substrate chuck 110 using various means such as bolt fastening.

The substrate chuck 110 has a central portion 110a protruding into an area capable of mounting the test substrate G, and a seal fixture 160 is fixed around the substrate chuck 110. Therefore, the suction hole 111 for positioning the substrate G is formed only in the central portion 110a, and the suction hole is not formed in the periphery thereof.

Since the elastic seal 170 is in contact with the bottom surface of the vacuum chamber cover 140 to form a closed space 140c which is blocked from the outside, the elastic seal 170 is formed in a closed curve along the contour of the bottom surface of the vacuum chamber cover 140. The elastic seal 170 fixed to the seal fixing body 160 may have a spherical or square cross section, but the sealing space 140c may be successfully formed even if there is a slight error in the position control of the vacuum chamber cover 140. 6A and 6C, the cross section is formed in an oval shape or a rectangular shape so that the surface exposed on the seal holder 160 is widely formed, and the long sides 170a and 170a of the cross section are formed. &Quot;) is fixed to the seal fixture so as to be exposed on the upper side.

5, 6A and 6C, the elastic seals 170 and 170 "are shown projecting from the surface of the seal fixture 160, but as shown in FIG. 6B, the elastic seals 170 'are sealed It may be fixed to the seal holder 160 so as not to protrude from the surface of the fixture 160. Furthermore, the elastic seal 170 'may be fixed to be recessed into the groove of the seal holder 160. The elastic seals 170, 170 ′, 170 ″ may be secured in a state where the bottom surface of the vacuum chamber cover 140 is in contact with the elastic seals 170, 170 ′, 170 ″. It is good to be elastically deformed more than this predetermined value.

The elastic seal 170 is located below the surface of the central portion 110a of the substrate chuck 110 by an interval indicated by a reference c, and the elastic seal 170 is moved during the movement of the slit nozzle 120 or the vacuum chamber cover 140. Do not interfere with. Similarly, when the elastic seal 170 does not protrude from the surface of the seal holder 160, the upper surface of the seal holder 160 is located below the surface of the central portion 110a of the substrate chuck 110. During the movement of the slit nozzle 120 or the vacuum chamber cover 140 is prevented from being damaged by interference with the seal fixture 160.

Since the elastic seal 170 is fixed to the substrate chuck 110, the bottom surface of the vacuum chamber cover 140 may be driven by driving the second moving unit 150 in a predetermined path and the surface of the elastic seal 170. It may be moved to contact. However, the light receiving unit 169 is provided on the seal fixture 160, which is the periphery of the substrate chuck 110, so that the bottom surface of the vacuum chamber cover 140 may be seated more firmly on the elastic seal 170. The cover 140 includes one or more pairs of detection sensors including a light emitting unit 149 for generating light to the light receiving unit 169. Therefore, when the light emitted from the light emitting unit 149 installed in the vacuum chamber cover 140 is received by the light receiving unit 169 of the seal fixing body 160, the bottom surface of the vacuum chamber cover 140 is the elastic seal 170 ) And the vacuum chamber cover 140 moves downwardly by the second moving unit 150 after the interaction between the light emitting unit 149 and the light receiving unit 169. 140c).

In the above embodiment, in order to align the bottom surface of the vacuum chamber cover 140 and the elastic seal 170 to each other, the vacuum chamber cover 140 is provided with a light emitting part 149 and the light receiving part (160) on the seal fixing body (160). Although 169 is provided as an example, according to another embodiment of the present invention, the light receiving unit may be installed in the vacuum chamber cover 140 and the light emitting unit may be installed on the seal fixing body 160.

On the other hand, as shown in Figures 4 and 6a to 6c, through the gap between the seal holder 160 and the central portion (110a) of the substrate chuck 110 formed of a stone material such as granite (granite) In order to prevent air from flowing in and out of the sealed space 140c, a sealed seal 165 is installed between the seal fixing member 160 and the substrate chuck 110 to prevent air from flowing in and out. The hermetic seal 165 is formed of a material having elasticity and fixed to the seal fixing body 160. As a result, the air in the sealed space 140c flows in and out only through the suction pipe 142 extending from the vacuum forming unit, so that it is easy to control and maintain the vacuum state in the sealed space 140c.

As shown in FIG. 7, distance sensors 181, 182, and 183 are installed in the slit nozzle 120 along the width direction 110k to provide a distance from the slit nozzle 120 to the substrate chuck 110. X1, X2, X3) can be measured. Using the distance measured using the distance sensors 181, 182, and 183 installed in the slit nozzle 120, the first movement even before applying the coating liquid to the test substrate G to check the thickness of the coating layer. The posture of the slit nozzle 120 may be fixed to the unit 130 to a certain degree initially. At least two such distance measuring sensors 181 to 183 may be installed to reflect the initial position setting of the slit nozzle 120.

When the coating quality by the state in which the slit nozzle 120 is primarily installed in the first moving unit 130 using the distance sensor 181, 182, 183 is less than the reference value, the slit nozzle 120 The posture is adjusted again by the slit nozzle adjusting unit 190.

To this end, one end of the slit nozzle 120 is coupled to one end of the first moving unit 130 and the hinge 123 so as to be rotatable, and the other end of the slit nozzle 120 extends from the slit nozzle 120. The rotating shaft 192 having a male thread portion engaged with the female thread portion formed in the block 191 is configured to rotate by the motor 193, and moves forward or in the form of a lead screw according to the rotation of the motor 193 in the forward and reverse directions. Retreat Accordingly, the slit nozzle 120 may adjust the posture in the direction indicated by reference numeral 120r according to the driving of the motor 191 of the adjusting unit 190. Reference numeral 194 in the figure is a bearing for supporting the rotating shaft 192.

In the drawings, one end of the slit nozzle 120 is coupled to the hinge and the configuration of moving the other end to adjust the posture, but according to another embodiment of the present invention in the form of advancing or retracting both ends of the slit nozzle 120, respectively The adjustment unit may be configured, or may be configured to adjust the posture of the slit nozzle 120 using a linear motor that does not use a lead screw and little play occurs.

Hereinafter, a method (S100) of setting a slit nozzle for substrate processing according to an embodiment of the present invention will be described in detail with reference to FIG. 8.

Step 1 : As shown in Figure 9a, the test substrate (G) is mounted on the substrate chuck 110 of the setting device 100 of the substrate processing slit nozzle configured as described above, the suction hole 111 A suction pressure is applied to fix the position of the test substrate G (S110).

Then, the new slit nozzle 120 to be used in the substrate processing apparatus (not shown) in the mass production stage is fixed to the first moving unit 130. At this time, the new slit nozzle 120 is distributed in the slit direction of the slit nozzle 120 so that the distances X1, X2, and X3 from the installed distance sensing sensors 181-183 to the substrate chuck 110 are constant. The position is primarily fixed to the first moving unit 130 to be in a posture.

Step 2 : Then, as shown in FIG. 9B, the coating liquid 55 is applied to the surface of the substrate G by moving the slit nozzle 120 to the front 120d with the first moving unit 130 ( S120). At this time, in order to check whether the coating liquid applied at the discharge port 121 of the slit nozzle 120 is uniformly applied to the surface of the substrate G with a uniform thickness, the coating liquid 55 is removed from the slit nozzle 120. The coating liquid 55 does not need to be applied to the entire surface of the substrate G because it is applied to the surface of the substrate G, and the coating liquid 55 is applied over the longitudinal length of about 1/3 to 1/2 of the substrate G. It is enough to apply.

Step 3 : Then, as shown in FIG. 9C, when the slit nozzle 120 coated with the coating liquid 55 retreats backward, the vacuum chamber cover 140 is rearward by the second moving unit 150 ( 140d), the light emitted from the light emitting portion 149 of the vacuum chamber cover 140 is received by the light receiving portion 169 on the seal holder 160, so that the bottom surface of the vacuum chamber cover 140 is elastically sealed. To be aligned with 170. Then, the vacuum chamber cover 140 is moved downward by 140u 'by the second moving unit 150 so that the bottom surface of the vacuum chamber cover 140 is in a state in which the elastic seal 170 is pressed. Through this, a space surrounded by the inner surface of the vacuum chamber cover 140, the upper surface of the substrate chuck 110, and a part of the upper surface of the seal fixing body 160 is formed to form a closed space 140c that is blocked from the outside (S130).

Step 4 : Then, as shown in Fig. 9D, the suction pressure from the vacuum forming unit extracts the air in the sealed space 140c through the suction pipe 142, and decompresses it to a pressure lower than atmospheric pressure, so as to test the substrate (G). The coating liquid 55 applied to the surface of the) is dried (S140).

Step 5 : When the coating liquid 55 applied to the surface of the test substrate G is dried to form a coating layer, the thickness distribution of the coating layer on the surface of the substrate is measured by the thickness measuring means 180 (S150).

At this time, if the interval between the slit nozzle 120 and the slit length between the processing target substrate G is not constant, thickness deviation in the width direction 110k of the substrate G is caused, and thus the thickness measuring means ( 180 is a measurement of the thickness of the coating layer while moving in the slit direction (180d) of the slit nozzle (120). This, even if the distance between the discharge port 121 and the substrate chuck 111 of the slit nozzle 120 by the distance sensor (181-183) to maintain a constant, a measurement error may occur, and finally This is done because it is necessary to constantly check the thickness of the resulting coating layer.

In addition, in order to check whether there is a thickness variation of the coating layer 55 in the process of moving the slit nozzle 120 in the longitudinal direction 120d by the first moving unit 130, it is perpendicular to the ground of FIG. 8E. The thickness of the coating layer is measured while moving in one direction 180d '.

Step 6 : When the thickness of the coating layer 55 applied on the surface of the test substrate G has a thickness deviation of the reference value or more, the slit nozzle for the first moving unit 130 based on the measured thickness data ( Adjust the posture of 120). As shown in FIG. 7, the distance between the slit nozzle 120 and the substrate chuck 110 through the forward and the retraction of the other end while one end of the slit nozzle 120 is hinged to the first moving unit 130. The slit nozzle 120 is rotated in the direction indicated by 120r by rotating both ends of the slit nozzle 120 forward or backward 120y and 120y 'as shown in Fig. 9F. 110 or the distance from the substrate to be processed may be adjusted to be constant (S160).

If the thickness of the coating layer 55 applied on the test substrate G is not constant, in addition to adjusting the posture of the slit nozzle 120, if there is a cause such as thin coating of the coating layer in a specific intermediate region, the slit It is checked whether a part of the discharge port 121 of the nozzle 120 is blocked by the solidified coating solution.

Then, the steps 2 to 5 are repeated until the thickness of the coating layer applied on the test substrate G is within a predetermined reference value. As a result, the slit nozzle 120 can be uniformly applied to the coating liquid from the discharge port, and at the same time the interval with the substrate to be processed is constant along the slit direction.

Then, the new slit nozzle 120, the setting of which is completed for the first moving unit 130, is installed together with the first moving unit 130 to the substrate processing apparatus of the mass production stage as a module, the substrate processing of the mass production stage The time required for mounting and setting a new slit nozzle 120 in the device can be drastically shortened, and the setting of the slit nozzle 120 can be much more accurate than before. Through this, when the coating liquid is applied to the substrate to be treated with the slit nozzle 120 set as described above, a coated substrate having excellent quality can be obtained, and an advantageous effect of greatly improving the efficiency of the substrate applying process can be obtained.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

100: slit nozzle setting device 110: substrate chuck
120: slit nozzle 130: the first moving unit
140: vacuum chamber cover 149: position sensing light emitting unit
150: second moving unit 160: seal fixing body 169: position sensing light receiving unit 170, 170 ', 170 ": elastic seal
180: gap detection sensor 190: slit nozzle adjustment unit

Claims (16)

A substrate position fixing step of placing the test substrate on a substrate chuck on which a plurality of suction holes suck and fix the test substrate, and then sucking the test substrate and fixing the test substrate to the substrate chuck;
A nozzle position fixing step of positioning the slit nozzle to be used for the substrate processing apparatus to be used in the mass production step with respect to the first moving unit;
An application step of applying a coating liquid to a surface of the test substrate while moving the slit nozzle with respect to the test substrate by the first moving unit;
A sealing step of forming a sealed space surrounding the substrate chuck including the test substrate by moving the vacuum chamber cover by the second moving unit when the slit nozzle moves out of the surface of the test substrate;
A drying step of extracting air in the sealed space and reducing the pressure to a pressure lower than atmospheric pressure to dry the coating liquid applied to the surface of the test substrate;
A coating layer thickness measuring step of measuring a thickness of the coating layer formed by drying the coating solution on the surface of the test substrate mounted on the substrate chuck;
When the thickness deviation of the coating layer applied to the surface of the test substrate is more than a predetermined deviation, the nozzle attitude to adjust the attitude of the slit nozzle with respect to the first moving unit based on the thickness data obtained in the coating layer thickness measurement step Adjusting step;
A slit nozzle installation step of installing the slit nozzle adjusted with respect to the first moving unit in the nozzle posture adjusting step together with the first moving unit to the substrate processing apparatus used in the mass production step;
Method for setting a slit nozzle for substrate processing, characterized in that it comprises a.
According to claim 1, After the nozzle posture adjustment step,
And the coating step, the sealing step, the drying step, and the coating layer thickness measuring step are repeated until the thickness deviation of the coating layer falls within a predetermined deviation.
The method of claim 1, wherein the applying step,
The coating liquid is apply | coated to the surface of the said test board | substrate over the partial length in the moving direction of the said slit nozzle, The setting method of the slit nozzle for substrate processing.
The method of claim 1, wherein the substrate chuck,
And a center portion on which the substrate is mounted protrudes more than its periphery.
The method of claim 1,
An elastic seal surrounding the substrate chuck is arranged;
In the closing step, the lower surface of the vacuum chamber cover is in contact with the elastic seal to form the sealed space, characterized in that the setting method of the slit nozzle for substrate processing.
6. The method of claim 5,
And the upper surface of the seal fixture is formed lower than the surface of the center portion of the substrate chuck.
The method of claim 5, wherein the closing step,
And detecting and aligning the position of the elastic seal so that the second moving unit contacts the elastic seal with the bottom surface of the vacuum chamber cover.
According to claim 1, wherein the coating layer thickness measurement step,
The thickness of the coating layer formed on the surface of the test substrate is measured along the transverse direction.
A slit nozzle setting apparatus used in the method for setting a slit nozzle for processing a substrate according to any one of claims 1 to 8,
A substrate chuck made of stone material provided with a plurality of suction holes to suck and fix the test substrate;
A first moving unit which transfers the slit nozzle to be used in the substrate processing apparatus to be used in the mass production step in a fixed state, and applies a coating solution to the surface of the test substrate which is fixed to the substrate chuck from the slit nozzle;
An elastic seal arranged on a surface of the substrate chuck so as to surround a circumference of the area where the substrate is fixed;
A vacuum chamber cover having a lower side open to form a sealed space including a lower portion of the upper surface of the substrate chuck in contact with the elastic seal;
When the coating liquid is applied to the surface of the test substrate while the first moving unit is moved, the vacuum chamber cover is moved so that the bottom surface of the vacuum chamber cover is in contact with the elastic seal, so that the substrate chuck includes the test substrate. A second moving unit configured to form the sealed space surrounding a portion of the second moving unit;
A vacuum forming unit which extracts air in the sealed space and reduces the pressure to a pressure lower than atmospheric pressure to dry the coating liquid applied to the surface of the test substrate;
Coating layer thickness measuring means for measuring a thickness of the coating layer formed by drying the coating liquid on a surface of the test substrate mounted on the substrate chuck;
When the thickness deviation of the coating layer measured by the coating layer thickness measuring means is greater than or equal to a predetermined deviation, adjusting the attitude of the slit nozzle with respect to the first moving unit based on the thickness data obtained by the coating layer thickness measuring means. Nozzle posture adjusting unit;
And the slit nozzle which is adjusted with respect to the first moving unit by the nozzle posture adjusting unit together with the first moving unit to be installed in the substrate processing apparatus in the mass production step. Setting device for slit nozzle for processing.
The method of claim 9,
The said slit nozzle apply | coats the said coating liquid to the surface of the said test board | substrate over the partial length in the moving direction of the said slit nozzle, The setting apparatus of the slit nozzle for substrate processing.
The method of claim 9, wherein the substrate chuck,
And a center portion on which the substrate is mounted protrudes more than its periphery.
The method of claim 9,
And the sensing means for sensing the position of the elastic seal so that the second moving unit contacts the bottom surface of the vacuum chamber cover in alignment with the elastic seal.
The method of claim 9, wherein the coating layer thickness measuring means,
And a thickness of the coating layer formed on the surface of the test substrate along the transverse direction.

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