KR101321067B1 - Partial Adhesive Tape Manufacturing Method - Google Patents

Partial Adhesive Tape Manufacturing Method Download PDF

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KR101321067B1
KR101321067B1 KR1020110062066A KR20110062066A KR101321067B1 KR 101321067 B1 KR101321067 B1 KR 101321067B1 KR 1020110062066 A KR1020110062066 A KR 1020110062066A KR 20110062066 A KR20110062066 A KR 20110062066A KR 101321067 B1 KR101321067 B1 KR 101321067B1
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South Korea
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tape
roller
adhesive
wound
protective film
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KR1020110062066A
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Korean (ko)
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KR20130001375A (en
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이영민
손삼권
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(주)세경하이테크
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)

Abstract

본 발명은 부분점착 테이프 제조방법에 관한 것으로서, 본 발명에 따른 부분점착 테이프 제조방법은, 일측면에 점착제가 도포된 상태로 제1롤러(1)에 감겨 있는 제1테이프(10)가 제2롤러(2)에 권취되되, 권취시 상기 제1테이프(10)의 비점착면은 이송컨베이어(100)의 상면에 의해 지지되며, 상기 제1테이프(10)의 점착면에는 전자부품과 맞닿는 보호필름(30)이 공급호퍼(40)에 의해 격자형으로 부착되는 제1공정;과, 상기 제1공정을 거쳐 제2롤러(2)에 감겨진 제1테이프(10)가 제3롤러(3)에 권취되며, 이와 동시에 제2테이프(20)가 감겨있는 제4롤러(4)가 제5롤러(5)에 권취되되, 상기 제1테이프(10)와 제2테이프(20)의 점착면이 서로 맞닿도록 한 쌍의 가열된 가압롤러(50)에 의해 가압되어 제1테이프(10)의 점착면에 부착된 보호필름(30)이 제2테이프(20)의 점착면으로 이전되는 제2공정;이 포함되는 것을 특징으로 하는 부분점착 테이프 제조방법.
이상 상술한 바와 같은 본 발명에 의하면, 일측면에만 접착제가 도포된 테이프에 보호필름을 격자로 부착하여 별도의 커팅 공정이 생략되므로 완성품까지 소요되는 시간이 종래에 대비하여 현저히 줄어들어 단위 시간당 생산되는 완성품의 갯수가 증가되며, 불필요한 공정이 생략되므로 인하여 제작비용 또한 감소될 수 있는 장점이 있다.The present invention relates to a method of manufacturing a partial adhesive tape, wherein the method of manufacturing a partial adhesive tape according to the present invention includes a second tape having a first tape (10) wound around the first roller (1) in a state where an adhesive is applied to one side thereof. It is wound on the roller 2, the non-adhesive surface of the first tape 10 is supported by the upper surface of the conveying conveyor 100 at the time of winding, the adhesive surface of the first tape 10 to protect the contact with the electronic components A first process in which the film 30 is attached in a lattice form by the feed hopper 40; and the first tape 10 wound on the second roller 2 through the first process includes a third roller 3. ), And at the same time, the fourth roller 4 on which the second tape 20 is wound is wound on the fifth roller 5, and the adhesive surfaces of the first tape 10 and the second tape 20 are wound. The protective film 30 attached to the adhesive face of the first tape 10 is transferred to the adhesive face of the second tape 20 by being pressed by a pair of heated pressure rollers 50 so as to contact each other. Part 2 adhesive tape manufacturing method characterized in that it comprises a.
According to the present invention as described above, since the separate cutting process is omitted by attaching the protective film to the tape coated with the adhesive on only one side as a lattice, the time required for the finished product is significantly reduced compared to the conventional, finished product produced per unit time The number of increases, and because the unnecessary process is omitted, there is an advantage that the manufacturing cost can also be reduced.

Description

부분점착 테이프 제조방법{.}Partial Adhesive Tape Manufacturing Method {.}

본 발명은 부분점착 테이프 제조방법에 관한 것으로서, 더 상세하게는 일측면에만 접착제가 도포된 테이프에 보호필름을 격자로 부착하여 별도의 커팅 공정이 생략되므로 완성품까지 소요되는 시간이 종래에 대비하여 현저히 줄어들어 단위 시간당 생산되는 완성품의 갯수가 증가되며, 불필요한 공정이 생략되므로 인하여 제작비용 또한 감소될 수 있는 부분점착 테이프의 제조방법에 관한 것이다.
The present invention relates to a method of manufacturing a partial adhesive tape, and more particularly, since a separate cutting process is omitted by attaching a protective film to a tape coated with an adhesive on only one side with a lattice, the time required for the finished product is remarkably compared with the conventional method. It decreases and the number of finished products produced per unit time increases, and because the unnecessary process is omitted, the manufacturing cost is also related to the manufacturing method of the partially adhesive tape can be reduced.

일반적으로 반도체 소자 등의 전자부품은 비교적 작은 크기를 갖는데, 이러한 전자부품들은 이동 및 보관이 용이하지 못한 실정이다.In general, electronic components such as semiconductor devices have a relatively small size, and these electronic components are not easily moved and stored.

이에 따라, 부분점착 테이프를 이용하여 전자부품을 별도로 보관하는데, 종래의 부분점착 테이프는 도 7 내지 도 8에 도시된 바와 같다.Accordingly, the electronic component is separately stored using the partial adhesive tape, but the conventional partial adhesive tape is as shown in FIGS. 7 to 8.

도 7은 종래기술에 따른 부분점착 테이프의 구성을 보인 분해사시도 및 도 8은 도 7의 단면도인데, 종래기술에 따른 부분점착 테이프는 상측부터 순서대로 보호필름, 양면테이프 및 이형지를 포함한다.Figure 7 is an exploded perspective view showing a configuration of a partial adhesive tape according to the prior art and Figure 8 is a cross-sectional view of Figure 7, the partial adhesive tape according to the prior art includes a protective film, a double-sided tape and a release paper in order from the top.

상기와 같은 종래의 부분점착 테이프의 제조방법은 다음과 같다.The manufacturing method of the conventional partial adhesive tape as described above is as follows.

먼저, 양면테이프를 1차로 커팅한 후, 커팅된 양면테이프에 전자부품이 보관될 공간인 비점착요구면을 2차로 커팅한다.First, the double-sided tape is cut first, and then the non-adhesive request surface, which is a space for storing electronic components, is cut secondarily.

이후, 양면테이프의 상면에는 보호필름을 합지하는 1차합지공정을 거치며, 제1합지공정에서 합지된 보호필름의 하면에 이형지를 합지하는 2차합지공정을 거쳐 부분점착 테이프가 완성된다.Thereafter, the upper surface of the double-sided tape is subjected to the first lamination process of laminating the protective film, and the partial adhesive tape is completed through the second lamination process of laminating the release paper on the lower surface of the protective film laminated in the first lamination process.

상기와 같은 종래의 부분점착 테이프는 비점착요구면의 커팅이 용이하지 못하므로 비점착요구면의 커팅시 소요되는 시간이 오래 걸리며, 그에 따른 소요 비용 또한 증가하게 되는 문제점이 있었다.Since the conventional non-adhesive tape is not easy to cut the non-adhesive request surface as described above, it takes a long time when cutting the non-adhesive demand surface, there is a problem that the required cost also increases.

또한, 비점착요구면의 커팅시 부산물로 발생되는 양면테이프는 재사용이 불가하여 폐기처분 해야 하므로 불필요한 비용이 발생되는 문제점이 있었다.
In addition, since the double-sided tape generated as a by-product when cutting the non-adhesive demanding surface cannot be reused, it has to be disposed of, thus causing unnecessary cost.

본 발명은 상술한 문제점을 해결하고자 안출된 것으로서, 본 발명의 목적은 일측면에만 접착제가 도포된 테이프에 보호필름을 격자로 부착하여 별도의 커팅 공정이 생략되므로 완성품까지 소요되는 시간이 종래에 대비하여 현저히 줄어들어 단위 시간당 생산되는 완성품의 갯수가 증가되며, 불필요한 공정이 생략되므로 인하여 제작비용 또한 감소될 수 있는 부분점착 테이프의 제조방법을 제공하는 것이다.The present invention has been made to solve the above-described problems, the object of the present invention is to attach a protective film to the tape coated with the adhesive only on one side by lattice, so that a separate cutting process is omitted, the time required for the finished product compared to the conventional This is to significantly reduce the number of finished products produced per unit time is increased, and to provide a method for producing a partial adhesive tape can also be reduced due to the unnecessary process is omitted.

또한, 테이프의 점착면에 보호필름을 부착하는 방식으로 제작됨으로 인해 점착제의 종류와 두께를 자유롭게 선택할 수 있는 부분점착 테이프의 제조방법을 제공하는 것이다.
In addition, it is to provide a method of manufacturing a partial adhesive tape that can be freely selected by the type and thickness of the pressure-sensitive adhesive because it is produced by attaching a protective film on the adhesive side of the tape.

상기와 같은 문제점을 해결하기 위해 본 발명에 따른 부분점착 테이프 제조방법은, 일측면에 점착제가 도포된 상태로 제1롤러(1)에 감겨 있는 제1테이프(10)가 제2롤러(2)에 권취되되, 권취시 상기 제1테이프(10)의 비점착면은 이송컨베이어(100)의 상면에 의해 지지되며, 상기 제1테이프(10)의 점착면에는 전자부품과 맞닿는 보호필름(30)이 공급호퍼(40)에 의해 격자형으로 부착되는 제1공정;과, 상기 제1공정을 거쳐 제2롤러(2)에 감겨진 제1테이프(10)가 제3롤러(3)에 권취되며, 이와 동시에 제2테이프(20)가 감겨있는 제4롤러(4)가 제5롤러(5)에 권취되되, 상기 제1테이프(10)와 제2테이프(20)의 점착면이 서로 맞닿도록 한 쌍의 가열된 가압롤러(50)에 의해 가압되어 제1테이프(10)의 점착면에 부착된 보호필름(30)이 제2테이프(20)의 점착면으로 이전되는 제2공정;이 포함되는 것을 특징으로 한다.
In order to solve the above problems, in the method of manufacturing a partial adhesive tape according to the present invention, the first tape 10 wound on the first roller 1 in a state where an adhesive is applied to one side thereof is the second roller 2. While being wound on, the non-adhesive surface of the first tape 10 is supported by the upper surface of the conveying conveyor 100, the protective film 30 in contact with the electronic component on the adhesive surface of the first tape 10. A first step of lattice-attaching by the feed hopper 40; and a first tape 10 wound on the second roller 2 through the first step; At the same time, the fourth roller 4 on which the second tape 20 is wound is wound around the fifth roller 5, so that the adhesive surfaces of the first tape 10 and the second tape 20 come into contact with each other. A second process of pressing the pair of heated pressure rollers 50 to transfer the protective film 30 attached to the adhesive surface of the first tape 10 to the adhesive surface of the second tape 20. And that is characterized.

또한, 상기 제2공정에서 가압롤러(50)에 의해 가열된 제2테이프(20)가 냉각기에 의해 냉각되는 제3공정;이 더 포함되는 것을 특징으로 한다.
In addition, a third step of cooling the second tape 20 heated by the pressure roller 50 in the second process by the cooler; characterized in that it further comprises.

또한, 상기 제2공정을 거쳐 제5롤러(5)에 감겨진 제2테이프(20)가 제6롤러(6)에 권취되되, 상지 제2테이프(20)의 점착면에 제7롤러(7)에 감겨진 이형지(70)가 첨착되도록 한 쌍의 부착롤러(60)에 의해 가압되는 제4공정;이 더 포함되는 것을 특징으로 한다.
In addition, the second tape 20 wound on the fifth roller 5 is wound around the sixth roller 6 through the second process, and the seventh roller 7 is attached to the adhesive surface of the upper limb second tape 20. The fourth step is pressed by a pair of attachment roller 60 so that the release paper (70) wound on the); characterized in that it further comprises.

이상 상술한 바와 같은 본 발명에 의하면, 일측면에만 접착제가 도포된 테이프에 보호필름을 격자로 부착하여 별도의 커팅 공정이 생략되므로 완성품까지 소요되는 시간이 종래에 대비하여 현저히 줄어들어 단위 시간당 생산되는 완성품의 갯수가 증가되며, 불필요한 공정이 생략되므로 인하여 제작비용 또한 감소될 수 있는 장점이 있다.According to the present invention as described above, since the separate cutting process is omitted by attaching the protective film to the tape coated with the adhesive on only one side as a lattice, the time required for the finished product is significantly reduced compared to the conventional, finished product produced per unit time The number of increases, and because the unnecessary process is omitted, there is an advantage that the manufacturing cost can also be reduced.

또한, 테이프의 점착면에 보호필름을 부착하는 방식으로 제작됨으로 인해 점착제의 종류와 두께를 자유롭게 선택할 수 있는 장점이 있다.
In addition, there is an advantage in that the type and thickness of the pressure-sensitive adhesive can be freely selected because it is manufactured by attaching a protective film to the adhesive side of the tape.

도 1은 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법의 제1공정을 나타낸 개략도,
도 2는 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법의 제2,3공정을 나타낸 개략도,
도 3은 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법의 제4공정을 나타낸 개략도,
도 4는 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법으로 생산된 부분점착 테이프의 사시도,
도 5는 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법으로 생산된 부분점착 테이프의 분해사시도,
도 6은 도 5의 단면도,
도 7은 종래기술에 따른 부분점착 테이프의 분해사시도,
도 8은 도 7의 단면도이다.1 is a schematic view showing a first step of a method of manufacturing a partial adhesive tape according to a preferred embodiment of the present invention;
Figure 2 is a schematic view showing a second, third process of the method of manufacturing a partial adhesive tape according to an embodiment of the present invention,
3 is a schematic view showing a fourth step of the method of manufacturing a partially adhesive tape according to an embodiment of the present invention;
Figure 4 is a perspective view of a partial adhesive tape produced by a method of manufacturing a partial adhesive tape according to an embodiment of the present invention,
5 is an exploded perspective view of a partial adhesive tape produced by a method of manufacturing a partial adhesive tape according to a preferred embodiment of the present invention;
Fig. 6 is a sectional view of Fig. 5,
7 is an exploded perspective view of a partially adhesive tape according to the prior art,
Fig. 8 is a sectional view of Fig. 7. Fig.

이하, 첨부된 도면을 참조하여, 본 발명의 실시예들을 설명하기로 한다. 각 도면에 제시된 동일한 부호는 동일한 부재를 나타낸다. 본 발명을 설명함에 있어, 관련된 공지 기능 혹은 구성에 관한 구체적인 설명은 본 발명의 요지를 모호하지 않게 하기 위하여 생략한다.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The same reference numerals shown in the drawings denote the same members. In describing the present invention, a detailed description of known functions and configurations incorporated herein will be omitted so as to avoid obscuring the subject matter of the present invention.

도 1은 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법의 제1공정을 나타낸 개략도, 도 2는 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법의 제2,3공정을 나타낸 개략도, 도 3은 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법의 제4공정을 나타낸 개략도, 도 4는 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법으로 생산된 부분점착 테이프의 사시도, 도 5는 본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법으로 생산된 부분점착 테이프의 분해사시도, 도 6은 도 5의 단면도이다.
1 is a schematic view showing a first step of the method of manufacturing a partial adhesive tape according to a preferred embodiment of the present invention, Figure 2 is a schematic view showing a second, third process of the manufacturing method of a partial adhesive tape according to a preferred embodiment of the present invention, Figure 3 is a schematic view showing a fourth step of the method of manufacturing a partial adhesive tape according to a preferred embodiment of the present invention, Figure 4 is a perspective view of a partial adhesive tape produced by the method of manufacturing a partial adhesive tape according to a preferred embodiment of the present invention; 5 is an exploded perspective view of a partial adhesive tape produced by the method of manufacturing a partial adhesive tape according to an exemplary embodiment of the present invention, and FIG. 6 is a cross-sectional view of FIG.

본 발명의 바람직한 실시예에 따른 부분점착 테이프 제조방법은 제1 내지 제3공정이 포함되되, 제4공정이 더 포함될 수 있다.
Partial adhesive tape manufacturing method according to a preferred embodiment of the present invention includes a first to third process, may further include a fourth process.

제1공정은 제1테이프(10)의 점착면에 보호필름(30)을 부착시키는 공정으로서, 이러한 제1공정에는 도 1에 도시된 바와 같이, 제1롤러(1), 제2롤러(2), 제1테이프(10), 보호필름(30), 공급호퍼(40) 및 이송컨베이어(100)가 구성요소로서 포함된다.The first step is to attach the protective film 30 to the adhesive surface of the first tape 10. In this first step, as shown in FIG. 1, the first roller 1, the second roller 2 ), The first tape 10, the protective film 30, the supply hopper 40 and the conveying conveyor 100 is included as a component.

상기 제1롤러(1)에는 일측면에 점착제가 도포된 제1테이프(10)가 권취되어 있는 부재로서, 이렇게 제1롤러(1)에 권취되어 있는 제1테이프(10)는 제2롤러(2)에 권취되는데, 권취시 제1테이프(10)의 비점착면은 이송컨베이어(100)의 상면에 의해 지지된 상태로 제1롤러(1)에서 제2롤러(2)로 이동된다.The first roller 10 is a member on which the first tape 10 coated with an adhesive is wound on one side of the first roller 1, and the first tape 10 wound on the first roller 1 is a second roller ( 2), the non-adhesive surface of the first tape 10 is moved from the first roller 1 to the second roller 2 in a state supported by the upper surface of the conveying conveyor 100 at the time of winding.

또한, 상기 이송컨베이어(100)의 상부에는 도 1에 도시된 바와 같이 공급호퍼(40)가 설치되는데, 이러한 공급호퍼(40)의 내부에는 보호필름(30)이 투입 및 보관되며, 내부에 보관된 보호필름(30)은 순차적으로 낙하되도록 한다.In addition, the supply hopper 40 is installed on the upper portion of the conveying conveyor 100, as shown in Figure 1, the protective film 30 is put and stored in the interior of the supply hopper 40, stored inside The protective film 30 is to fall sequentially.

상기 공급호퍼(40)에 보관되는 보호필름(30)은 이송컨베이어(100)로 이송되는 제1테이프(10)의 점착면으로 낙하되어 부착된 상태로 제2롤러(2)에 권취된다.The protective film 30 stored in the supply hopper 40 is wound on the second roller 2 in a state where it is attached to the adhesive surface of the first tape 10 transferred to the conveying conveyor 100.

여기서, 상기 보호필름(30)은 예컨대, 저경화성인 가열건조형 아크릴계 소재로 제작되며, 후술할 제2공정에서 열에 의해 경화되어 전자부품과 맞닿을시 이를 보호하는 역할을 하는데, 이러한 보호필름(30)은 후술할 제2테이프(20)로 전이된다.
Here, the protective film 30 is made of, for example, a low-curing heat-drying acrylic material, and serves to protect it when it is hardened by heat in contact with an electronic component in a second process, which will be described later. ) Is transferred to the second tape 20 to be described later.

제2공정은 상기 제1공정을 거쳐 제1테이프(10)에 부착된 보호필름(30)을 제2테이프(20)로 전이시키는 공정으로서, 이러한 제2공정에는 도 2에 도시된 바와 같이, 제2롤러(2), 제3롤러(3), 제4롤러(4), 제5롤러(5), 제1테이프(10), 제2테이프(20), 보호필름(30) 및 가압롤러(50)가 구성요소로서 포함된다.The second process is a process of transferring the protective film 30 attached to the first tape 10 to the second tape 20 through the first process, as shown in FIG. 2 in the second process. Second roller 2, third roller 3, fourth roller 4, fifth roller 5, first tape 10, second tape 20, protective film 30 and pressure roller 50 is included as a component.

제2공정에서는 상술한 바와 같은 제1공정에 의해 보호필름(30)이 부착된 상태로 제2롤러(2)에 권취되어 있던 제1테이프(10)가 제3롤러(3)에 권취되며, 이와 동시에 제4롤러(4)에 감겨진 제2테이프(20)가 제5롤러(5)에 권취되는데, 이러한 제1테이프(10)와 제2테이프(20)는 한 쌍의 가압롤러(50)의 사이로 진입되어 대 접착면으로 합지된 후 박리된다.In the second step, the first tape 10 wound on the second roller 2 is wound on the third roller 3 in the state where the protective film 30 is attached by the first step as described above. At the same time, the second tape 20 wound around the fourth roller 4 is wound around the fifth roller 5, and the first tape 10 and the second tape 20 are a pair of pressure rollers 50. ) And enter into the adhesive surface, and then peel off.

상기와 같이 제1테이프(10)의 점착면과 제2테이프(20)의 점착면이 맞닿으면 상기 보호필름(30)은 점착력이 높은 테이프로 전이되는데, 상기 제2테이프(20)의 점착력이 제1테이프(10)의 점착력보다 높은 것이 바람직하다.As described above, when the adhesive surface of the first tape 10 and the adhesive surface of the second tape 20 are in contact with each other, the protective film 30 is transferred to a tape having high adhesive force, and the adhesive force of the second tape 20 is increased. It is preferable that it is higher than the adhesive force of this 1st tape 10.

이에 따라, 상기 제1테이프(10)의 점착면에 부착되어 있던 보호필름(30)은 제2테이프(20)의 점착면으로 이전된 상태로 제5롤러(5)에 권취된다.Accordingly, the protective film 30 attached to the adhesive surface of the first tape 10 is wound on the fifth roller 5 while being transferred to the adhesive surface of the second tape 20.

상기 점착력은 테이프에 도포되는 종류에 따라 조절 가능한데, 예컨대, 제1테이프(10)의 점착면에 도포되는 점착제는 실리콘 저점착테이프가 좋을 것이며, 제2테이프(20)의 점착면에 도포되는 점착제는 아크릴 점착테이프가 좋을 것인데, 상기 제2테이프(20)는 상기 실리콘 저점착테이프 보다 점착력이 높은 점착제라면 다양하게 선택하여 사용할 수 있을 것이다. The adhesive force may be adjusted according to the type applied to the tape. For example, the adhesive applied to the adhesive face of the first tape 10 may be a silicone low adhesive tape, and the adhesive applied to the adhesive face of the second tape 20. The acrylic adhesive tape may be good, but the second tape 20 may be variously selected as long as the adhesive has a higher adhesive strength than the silicone low adhesive tape.

상기와 같이 2개의 점착제의 점착력 차이를 이용하여 부재가 점착력이 더 높은 일측 테이프로 전이되는 방법은 공지기술이므로 이에 대한 상세한 설명은 생략하기로 한다.As described above, a method of transferring the member to one side of the tape having higher adhesive force by using the difference in adhesive force between the two adhesives is well known, and thus a detailed description thereof will be omitted.

한편, 상기와 같이 가압롤러(50)는 한 쌍으로 이루어지되, 내부에 열선(H)이 구비되어 보호필름(30)이 제1테이프(10)의 점착면에서 제2테이프(20)의 점착면으로 전이가 쉽도록 하는데, 이에 따라, 상기 보호필름(30)은 저경화성 소재로 제작되는 것이 바람직하다.On the other hand, the pressure roller 50 is made of a pair as described above, the heating wire (H) is provided inside the protective film 30 is the adhesion of the second tape 20 on the adhesive surface of the first tape 10 To facilitate the transition to the surface, accordingly, the protective film 30 is preferably made of a low curing material.

상기와 같이 보호필름(30)이 저경화성 소재로 제작될 경우, 가열된 한 쌍의 가압롤러(50)에 진입되면 초기에는 연화되어 전이를 쉽게하며, 중기에는 제2테이프(20)의 점착면으로 전이된 보호필름(30)의 경화를 진행시키고, 말기에는 제2테이프(20)와 보호필름(30)의 결합도를 높여주어 제2테이프(20)로부터 보호필름(30)의 이탈을 방지한다.When the protective film 30 is made of a low-curable material as described above, when entering the heated pair of pressure roller 50 is initially softened to facilitate the transition, and in the middle of the adhesive surface of the second tape 20 The curing process of the protective film 30 transferred to the advance, and at the end to increase the bonding of the second tape 20 and the protective film 30 to prevent the separation of the protective film 30 from the second tape 20 do.

또한, 상기와 같이 제2공정을 거쳐 제2테이프(20)로 보호필름(30)의 전이가 완료된 후, 가열된 제2테이프(20)를 냉각기(C)를 매개로 냉각하는 제3공정이 더 수행될 수 있다.In addition, after the transfer of the protective film 30 to the second tape 20 through the second process as described above, the third process of cooling the heated second tape 20 through the cooler (C) May be performed further.

한편, 상기와 같이 제2공정 또는 제3공정이 완료된 후, 제2테이프(20)의 점착면에 이형지(70)를 합지하는 제4공정이 선택적으로 수행될 수 있다.
Meanwhile, after the second process or the third process is completed as described above, a fourth process of laminating the release paper 70 on the adhesive surface of the second tape 20 may be selectively performed.

제4공정은 도 3에 도시된 바와 같이, 제5롤러(5), 제6롤러(6), 제7롤러(7), 제2테이프(20), 보호필름(30), 이형지(70) 및 부착롤러(60)가 더 포함될 수 있는데, 이러한 제4공정은 제2테이프(20)의 점착면에 이형지(70)를 합지하는 공정이다.As shown in FIG. 3, the fourth process includes the fifth roller 5, the sixth roller 6, the seventh roller 7, the second tape 20, the protective film 30, and the release paper 70. And the attachment roller 60 may be further included, this fourth process is a process of laminating the release paper 70 on the adhesive surface of the second tape (20).

제4공정은 상술한 제2공정을 거쳐 제5롤러(5)에 감겨진 제2테이프(20)가 제6롤러(6)에 권취되며, 이와 동시에 제7롤러(7)에 감겨진 이형지(70)가 한 쌍의 부착롤러(60) 사이로 진입되어 합지된다.
In the fourth process, the second tape 20 wound on the fifth roller 5 is wound around the sixth roller 6 through the second process described above, and at the same time, the release paper wound on the seventh roller 7 ( 70 is entered between the pair of attachment rollers 60 to be laminated.

한편, 도 4에는 상술한 바와 같은 제1 내지 제3공정을 거쳐 제작된 부분점착 테이프의 사시도가 도시되어 있는데, 보호필름(30)은 제2테이프(20)의 점착면에 격자형으로 배치되는 것이 바람직하다.On the other hand, Figure 4 is a perspective view of a partially adhesive tape produced through the first to third processes as described above, the protective film 30 is disposed in a lattice shape on the adhesive surface of the second tape 20 It is preferable.

또한, 도 5 내지 도 6에는 상술한 바와 같은 제1 내지 제4공정을 거쳐 제작된 부분점착테이프의 분해사시도와 단면도가 도시되어 있다.
5 to 6 illustrate exploded perspective views and cross-sectional views of the partial adhesive tapes produced through the first to fourth processes as described above.

도면과 명세서에서 최적의 실시예들이 개시되었다. 여기서, 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로, 본 기술 분야의 통상의 지식을 가진자라면, 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.
The best embodiments have been disclosed in the drawings and the specification. Herein, specific terms have been used, but they are used only for the purpose of illustrating the present invention and are not intended to limit the scope of the present invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

(C)-냉각기 (C)-열선
1-제1롤러 2-제2롤러
3-제3롤러 4-제4롤러
5-제5롤러 6-제6롤러
7-제7롤러
10-제1테이프 20-제2테이프
30-보호필름 40-공급호퍼
50-가압롤러 60-부착롤러
70-이형지
100-이송컨베이어(C) -cooler (C) -heater
1-first roller 2-second roller
3-roller 4-roller 4-roller
5th-5th roller 6-6th roller
7-seventh roller
10-first tape 20-second tape
30-protective film 40-feed hopper
50-press roller 60-attach roller
70-release paper
100-transfer conveyor

Claims (3)

일측면에 점착제가 도포된 상태로 제1롤러(1)에 감겨 있는 제1테이프(10)가 제2롤러(2)에 권취되되, 권취시 상기 제1테이프(10)의 비점착면은 이송컨베이어(100)의 상면에 의해 지지되며, 상기 제1테이프(10)의 점착면에는 전자부품과 맞닿는 보호필름(30)이 공급호퍼(40)에 의해 격자형으로 부착되는 제1공정;과
상기 제1공정을 거쳐 제2롤러(2)에 감겨진 제1테이프(10)가 제3롤러(3)에 권취되며, 이와 동시에 제2테이프(20)가 감겨있는 제4롤러(4)가 제5롤러(5)에 권취되되, 상기 제1테이프(10)와 제2테이프(20)의 점착면이 서로 맞닿도록 한 쌍의 가열된 가압롤러(50)에 의해 가압되어 제1테이프(10)의 점착면에 부착된 보호필름(30)이 제2테이프(20)의 점착면으로 이전되는 제2공정;이 포함되는 것을 특징으로 하는 부분점착 테이프 제조방법.
The first tape 10 wound on the first roller 1 is wound on the second roller 2 while the adhesive is applied on one side thereof, and the non-adhesive surface of the first tape 10 is transferred during the winding. A first process supported by an upper surface of the conveyor 100 and having a protective film 30 contacting the electronic component on the adhesive surface of the first tape 10 in a lattice form by a feed hopper 40; and
The first tape 10 wound on the second roller 2 through the first process is wound on the third roller 3, and at the same time, the fourth roller 4 on which the second tape 20 is wound It is wound on the fifth roller 5, and is pressed by a pair of heated pressure rollers 50 so that the adhesive surfaces of the first tape 10 and the second tape 20 come into contact with each other. And a second step of transferring the protective film (30) attached to the adhesive face of the second tape to the adhesive face of the second tape (20).
청구항 1에 있어서,
상기 제2공정에서 가압롤러(50)에 의해 가열된 제2테이프(20)가 냉각기에 의해 냉각되는 제3공정;이 더 포함되는 것을 특징으로 하는 부분점착 테이프 제조방법.
The method according to claim 1,
And a third step of cooling the second tape (20) heated by the pressure roller (50) in the second step by a cooler.
청구항 1에 있어서,
상기 제2공정을 거쳐 제5롤러(5)에 감겨진 제2테이프(20)가 제6롤러(6)에 권취되되, 상지 제2테이프(20)의 점착면에 제7롤러(7)에 감겨진 이형지(70)가 첨착되도록 한 쌍의 부착롤러(60)에 의해 가압되는 제4공정;이 더 포함되는 것을 특징으로 하는 부분점착 테이프 제조방법.
The method according to claim 1,
The second tape 20 wound on the fifth roller 5 is wound around the sixth roller 6 through the second process, and the seventh roller 7 is attached to the adhesive surface of the upper limb second tape 20. And a fourth step of being pressed by a pair of attachment rollers 60 so that the wound release paper 70 is attached.
KR1020110062066A 2011-06-27 2011-06-27 Partial Adhesive Tape Manufacturing Method KR101321067B1 (en)

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JP2002220574A (en) * 2001-01-26 2002-08-09 Yamagata Gravure Co Ltd Adhesive laminated sheet, method for producing the same and method for transferring adhesive layer using the sheet

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JP2002220574A (en) * 2001-01-26 2002-08-09 Yamagata Gravure Co Ltd Adhesive laminated sheet, method for producing the same and method for transferring adhesive layer using the sheet

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