KR101311801B1 - 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법 및 이에 의해 제조된 투명도전막 - Google Patents
직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법 및 이에 의해 제조된 투명도전막 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000005229 chemical vapour deposition Methods 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 title claims abstract description 11
- 239000000243 solution Substances 0.000 claims abstract description 54
- 239000002243 precursor Substances 0.000 claims abstract description 48
- 238000000151 deposition Methods 0.000 claims abstract description 20
- 230000008021 deposition Effects 0.000 claims abstract description 17
- 239000010955 niobium Substances 0.000 claims abstract description 17
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 17
- 239000003960 organic solvent Substances 0.000 claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 16
- 230000000996 additive effect Effects 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- 238000002347 injection Methods 0.000 claims abstract description 12
- 239000007924 injection Substances 0.000 claims abstract description 12
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000012495 reaction gas Substances 0.000 claims abstract description 11
- 239000010936 titanium Substances 0.000 claims abstract description 11
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 11
- 239000011701 zinc Substances 0.000 claims abstract description 11
- 239000006200 vaporizer Substances 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 8
- 238000009834 vaporization Methods 0.000 claims abstract description 7
- 230000008016 vaporization Effects 0.000 claims abstract description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 12
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 9
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 150000002902 organometallic compounds Chemical class 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910001868 water Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 64
- 239000000203 mixture Substances 0.000 abstract description 11
- 239000010409 thin film Substances 0.000 abstract description 8
- 150000002736 metal compounds Chemical class 0.000 abstract description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 18
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 12
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 12
- 239000011787 zinc oxide Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- OBOYOXRQUWVUFU-UHFFFAOYSA-N [O-2].[Ti+4].[Nb+5] Chemical compound [O-2].[Ti+4].[Nb+5] OBOYOXRQUWVUFU-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- ZEIWWVGGEOHESL-UHFFFAOYSA-N methanol;titanium Chemical compound [Ti].OC.OC.OC.OC ZEIWWVGGEOHESL-UHFFFAOYSA-N 0.000 description 1
- ZTILUDNICMILKJ-UHFFFAOYSA-N niobium(v) ethoxide Chemical compound CCO[Nb](OCC)(OCC)(OCC)OCC ZTILUDNICMILKJ-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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Abstract
본 발명은 아연 또는 티타늄을 포함하는 금속 화합물을 유기 용매에 녹인 전구체 용액과 알루미늄, 갈륨 및 니오븀으로 이루어지는 그룹으로부터 선택된 1종 이상을 포함하는 첨가물을 유기 용매에 녹인 전구체 용액을 혼합하는 단계; 상기 혼합된 전구체 용액을 용액 주입기를 통해 기화기에 주입하여 기화시키는 단계; 상기 기화작용에 의해 생성된 증기와 반응 기체를 증착반응기에 도입하는 단계; 및 상기 도입된 증기와 반응 기체를 유리 기판과 접촉시켜 도전막을 형성시키는 단계를 포함하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법을 제공한다.
본 발명에 의하면 첨가물의 주입 조절이 용이하므로, 도전막의 조성 제어가 쉽고, 대면적 증착이 가능하며, 제조비용이 절감될 수 있는 투명도전막의 제조방법을 제공할 수 있다.
Description
도 2는 본 발명의 실시예 1 및 2에 따라 제조된 투명도전막의 Al 및 Nb의 함량 변화에 따라 변화하는 전도도를 나타내는 그래프이다.
도 3은 투명도전막 제조시 증착 온도가 변화함에 따른 증착 속도를 나타내는 그래프이다.
도 4는 본 발명의 실시예 1 및 2에 따라 제조된 투명도전막의 투명도 변화를 나타내는 그래프이다.
Claims (8)
- 아연 또는 티타늄을 포함하는 유기 금속 화합물을 유기 용매에 녹인 전구체 용액과 알루미늄, 갈륨 및 니오븀으로 이루어지는 그룹으로부터 선택된 1종 이상을 포함하는 첨가물을 유기 용매에 녹인 전구체 용액을 혼합하는 단계;
상기 혼합된 전구체 용액을 용액 주입기를 통해 기화기에 주입하여 기화시키는 단계;
상기 기화작용에 의해 생성된 증기와 반응 기체를 증착반응기에 도입하는 단계; 및
상기 도입된 증기와 반응 기체를 유리 기판과 접촉시켜 도전막을 형성시키는 단계를 포함하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법.
- 제1항에 있어서, 상기 유기 금속 화합물을 유기 용매에 녹인 전구체 용액과 상기 첨가물을 유기 용매에 녹인 전구체 용액이 1 : 0.001~1의 농도비로 혼합되는 것을 특징으로 하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법.
(단, 상기 농도비는 상기 아연 또는 티타늄의 원자수와 상기 알루미늄, 갈륨 및 니오븀으로 이루어지는 그룹으로부터 선택된 1종 이상의 원소의 원자수 합계의 비임.)
- 제1항에 있어서, 상기 유기 용매는 헥산, 헵탄, 옥탄, n-부틸아세테이트 및 테트라하이드로퓨란(THF)으로 이루어지는 그룹으로부터 선택된 1종 이상인 것을 특징으로 하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법.
- 제1항에 있어서, 상기 반응 기체는 산소, 물, 과산화수소, 질소산화물 및 이산화탄소로 이루어지는 그룹으로부터 선택된 1종 이상인 것을 특징으로 하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법.
- 제1항에 있어서, 상기 도전막을 형성시키는 단계는 200~600℃의 온도에서 이루어지는 것을 특징으로 하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법.
- 제1항에 있어서, 상기 도전막을 형성시키는 단계는 플라즈마를 이용하여 실온~250℃의 온도범위에서 이루어지는 것을 특징으로 하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법.
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WO2017086630A1 (ko) * | 2015-11-19 | 2017-05-26 | 주식회사 유진테크 머티리얼즈 | 유기 4족 화합물을 포함하는 전구체 조성물 및 이를 이용한 박막 형성 방법 |
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JP2010192294A (ja) * | 2009-02-19 | 2010-09-02 | Tokyo Institute Of Technology | 透明導電膜の製造方法、透明導電膜およびデバイス |
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---|---|---|---|---|
JP2010192294A (ja) * | 2009-02-19 | 2010-09-02 | Tokyo Institute Of Technology | 透明導電膜の製造方法、透明導電膜およびデバイス |
Non-Patent Citations (6)
Title |
---|
Kafizas, A.외 2명, J. Mater. Chem., Vol.20, pp.8336-8349 (2010.8.27.). * |
Kafizas, A.외 2명, J. Mater. Chem., Vol.20, pp.8336-8349 (2010.8.27.).* |
Liu, H.외 4명, Superlattices and Microstructures, Vol.48, pp.458-484 (2010.9.6.). * |
Liu, H.외 4명, Superlattices and Microstructures, Vol.48, pp.458-484 (2010.9.6.).* |
Song, M-.K. et al. Journal of The Electrochemical Society, Vol.153(11), G992-G995 (2006.9.20.). * |
Song, M-.K. et al. Journal of The Electrochemical Society, Vol.153(11), G992-G995 (2006.9.20.).* |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017086630A1 (ko) * | 2015-11-19 | 2017-05-26 | 주식회사 유진테크 머티리얼즈 | 유기 4족 화합물을 포함하는 전구체 조성물 및 이를 이용한 박막 형성 방법 |
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