KR101309813B1 - Composition for forming electrode and electrode produced thereby - Google Patents

Abstract

The present invention provides a composition for forming an electrode comprising (a) a conductive powder, (b) an organic binder, (c) a glass frit, and (d) a solvent, wherein the glass frit (c) comprises at least one of Sr 2 O 3 and Zr 2 O 3. It is characterized by including. The present invention can ensure the stability in the acid exposure process without a separate additional process for protecting the electrode by introducing a specific glass frit, and can prevent the Ag ionization to prevent vertical streaks caused by Ag migration during panel assembly in the future Can be suppressed.

Description

A composition for forming an electrode and an electrode formed therefrom {COMPOSITION FOR FORMING ELECTRODE AND ELECTRODE PRODUCED THEREBY}

The present invention relates to a composition for forming an electrode. More specifically, the present invention relates to an electrode forming composition having excellent acid resistance by introducing a glass frit containing a specific metal oxide component and an electrode formed therefrom.

In recent years, as display devices have increased in demand for larger size, higher density, higher precision, and higher reliability, various pattern processing technologies have been developed, and these various technologies are referred to as plasma display panels (hereinafter referred to as 'PDP'). Has been applied to the production of).

PDP lower plate process is peeled by etching method to make the structure of the partition wall after coating the electrode, dielectric, and bulkhead. In this case, prior to etching, the photosensitive PR coating or DFR is laminated and peeled with 0.4% to 6% by weight of nitric acid solution to form a partition wall. Or, it may change over time and short the electrode terminal may cause vertical streaks after panel assembly. In order to protect the electrode from the bulkhead stripping solution, it is necessary to apply the liquid PR liquid or to the film using DFR. However, liquid PR or DFR makes it difficult to achieve complete protection and intermittent failures occur.

In order to improve the above, it is necessary to improve the composition of the glass frit used in the electrode to have acid resistance. In the case of the glass frit used in the composition for electrode formation mainly used until now, lead oxide (PbO) was a main component. That is, PbO-SiO2-P2O5 type | system | group, PbO-B2O3 type | system | group, etc. which have PbO as a main component have been mainly used. However, there is a problem that PbO contains a lead component, which is a harmful substance to a human body or the environment, and because of this, it is gradually becoming a target of use in countries around the world, and thus a substance that can replace it is required. For this reason, glass frit that does not contain PbO or lead-free Bi-based glass frit is preferred. However, when Bi-based glass frit is used, acid resistance is weaker than that of conventional PbO, which causes a lot of damage in the bulkhead etching process. In order to overcome this problem, when the SiO2 content, which increases acid resistance, is increased, Tg and Tdsp of glass frit must be increased to raise the firing temperature. Firing temperature Even at 560 ~ 590 ℃, it is necessary to improve the glass frit for photosensitive electrode that can secure acid resistance while maintaining the basic characteristics of the electrode without deformation of the substrate.

The object of the present invention is the firing temperature It is to provide a composition for forming an electrode that can ensure acid resistance while maintaining the basic properties of the electrode, such as resistance, line width, even at 560 ~ 590 ℃.

Another object of the present invention is to provide a composition for forming an electrode, which has enhanced acid resistance and improved adhesion to a substrate.

Still another object of the present invention is to provide a composition for forming an electrode, which can prevent elution of glass frit, thereby suppressing Ag migration even after panel assembly and ACF bonding in a later process.

Still another object of the present invention is to provide an electrode formed from the composition for forming an electrode and a plasma display panel (PDP) including the same.

The technical objects to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical subjects which are not mentioned can be understood by those skilled in the art from the following description.

One aspect of the present invention relates to a composition for forming an electrode. The composition for forming an electrode includes (a) conductive powder, (b) organic binder, (c) glass frit, and (d) solvent, wherein the glass frit (c) comprises at least one of Sr 2 O 3 and Zr 2 O 3 in total glass frit. May contain 0.5 to 20% by weight.

In one embodiment, the glass frit (c) is 15 to 45% by weight of Bi2O3, 25 to 50% by weight of SiO2, 10 to 25% by weight of B2O3, 1 to 15% by weight of Al2O3, at least one of 0.5 to 20 of Sr2O3 and Zr2O3. Wt%, ZnO may contain 1 to 20% by weight.

The glass frit (c) may have a weight ratio of at least one of SiO 2: Sr 2 O 3 and Zr 2 O 3 in a range of 3 to 20: 1.

In embodiments, the composition may comprise (a) 30 to 90% by weight of the conductive powder, (b) 1 to 20% by weight of the organic binder, (c) 1 to 20% by weight of the glass frit and the remaining amount (d) of the solvent. .

The conductive powder (a) includes gold, silver, copper, nickel, palladium, platinum, aluminum, and the like. These may be used alone or in combination of two or more.

The organic binder (b) may comprise at least one selected from a C _{1 -10} alkyl (meth) acrylate and an unsaturated copolymer and a cellulose-based polymer of the carboxylic acid.

In embodiments, the composition for forming an electrode may be trimethylolpropane ethoxy triacrylate, ditrimethylolpropane tetraacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate, 1, 6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentaerythritol penta Acrylate, dipentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, noblock epoxy acrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacryl Propylene glycol dimethacrylate, 1,4-butanediol A methacrylate, and 1,6-hexanediol dimethacrylate polyfunctional monomer of the rate or the like can be further included.

The electrode forming composition may further include a photoinitiator.

The composition may further comprise conventional additives. The additives include plasticizers, dispersants, viscosity stabilizers, antifoams, pigments, ultraviolet stabilizers, antioxidants, thermal polymerization inhibitors and coupling agents. These may be used alone or in combination of two or more.

Another aspect of the invention relates to an electrode formed of the composition for forming an electrode. The electrode may be at least 40 seconds after deformation of the electrode pattern in a 6% nitric acid solution after time-dipping test.

Firing temperature of the present invention It provides a glass frit that can ensure acid resistance while maintaining the basic characteristics of the electrode even at 560 ~ 590 ℃, and by applying the glass frit, the acid resistance is enhanced, the adhesion of the electrode to the substrate is improved, and the elution of the glass frit is prevented. Effect of the invention to provide a composition for forming an electrode that can suppress the generation of Ag migration even after the panel assembly and ACF bonding in the post-process, and to provide an electrode formed from the composition for forming the electrode and a plasma display panel comprising the same Has

1 is an electron scanning microscope (SEM) photograph of the electrode pattern prepared in Example 1 of the present invention.
Figure 2 is an electron scanning microscope (SEM) photograph of the electrode pattern prepared in Comparative Example 1 of the present invention.

The composition for electrode formation of this invention contains (a) conductive powder, (b) organic binder, (c) glass frit, and (d) solvent.

(a) conductive powder

As the conductive powder used in the present invention, both conductive organic and inorganic materials may be used. Preferably at least one metal powder selected from the group consisting of gold, silver, copper, nickel, palladium, platinum and aluminum can be used. Preferably, the conductive powder may be used as a metal powder, one selected from gold, silver, copper, nickel, platinum, palladium, aluminum, or an alloy powder thereof, or another metal coated on one of the metals. . Most preferably silver powder may be used.

It is preferable that the conductive powder has a spherical particle shape, since the spherical particles have better properties than plate-like or amorphous in filling rate and UV transmittance.

The average particle diameter (D50) of the conductive powder is 0.1 to 5 μm, preferably 0.2 to 2.5 μm, more preferably 0.5 to 1.8 μm, and most preferably 1.0 to 1.5 μm in consideration of the film thickness used.

The content of the conductive powder is 30 to 90% by weight, preferably 35 to 70% by weight, more preferably 40 to 60% by weight of the total composition. In the above range, the discharge voltage does not increase, and problems such as pinholes, cracks, and short circuits in the exposure and development processes do not occur, and are easy to paste.

(b) organic binder

The organic binder serves to disperse and bond the conductive powder and the glass frit forming the electrode, and to provide adhesion to the glass substrate until printing and drying and baking.

In the present invention, the organic binder serves to disperse and bond the conductive material and the glass frit forming the electrode, and to provide adhesion to the glass substrate until printing and baking after drying.

As the organic binder, in addition to the acrylic polymer copolymerized with an acrylic monomer having a hydrophilic property such as a carboxyl group to impart alkali developability, ethyl cellulose, hydroxyethyl cellulose, and hydroxypropyl cellulose ( Cellulose-based polymers such as Hydroxypropyl Cellulose) or hydroxyethyl hydroxypropyl cellulose (Hydroxyethylhydroxypropyl) may be used alone or in combination of two or more thereof.

The content of the organic binder is 1 to 20% by weight, preferably 5 to 15% by weight of the total weight of the composition. It is possible to maintain a suitable viscosity after the paste production in the above range, to maintain the adhesive strength with the glass substrate after printing and drying, it is possible to form a pattern of high resolution. In addition, problems such as cracking, opening, and pinhole generation of the electrode during the firing process do not occur.

The organic binder of the present invention may have a viscosity in the range of 5 to 40 kcps. It is easy to disperse when compounding with an inorganic material in the above range, there is an advantage that can have suitable properties for printing.

(c) glass frit

Glass frit used in the present invention can improve the acid resistance while increasing the adhesion between the conductive powder and the PDP substrate.

When the electrode pattern is formed through the composition using the glass frit of the present invention, when exposed to an aqueous solution of nitric acid, strong adhesion is shown, thereby preventing damage to the electrode and maintaining a good pattern, and preventing elution of glass frit. Ag migration can be suppressed even after panel assembly and ACF bonding in the post process.

In embodiments, the glass frit may include at least one of Sr 2 O 3 and Zr 2 O 3. Preferably, the glass frit (c) may contain 0.5 to 20% by weight of at least one of Sr 2 O 3 and Zr 2 O 3 in the glass frit.

In one embodiment the glass frit (c) is 15 to 45% by weight of Bi2O3, 25 to 50% by weight of SiO2, 10 to 25% by weight of B2O3, 1 to 15% by weight of Al2O3, at least 0.5 to 20% by weight of Sr2O3 and Zr2O3 %, ZnO may contain 1 to 20% by weight.

Preferably the glass frit (c) is 20 to 40% by weight of Bi2O3, 30 to 45% by weight of SiO2, 15 to 20% by weight of B2O3, 3 to 12% by weight of Al2O3, at least 1 to 15% by weight of Sr2O3 and Zr2O3. , ZnO may contain 3 to 15% by weight.

More preferably the glass frit (c) is 25 to 35% by weight of Bi2O3, 35 to 40% by weight of SiO2, 15 to 20% by weight of B2O3, 5 to 10% by weight of Al2O3, at least one of 2 to 10 weight of Sr2O3 and Zr2O3 %, ZnO may contain 5 to 10% by weight.

In the glass frit of the present invention, a network former is introduced, and oxygen ions and cations of the network former are strongly bonded to form a kind of mesh, and metal ions by oxides are formed in the voids in the mesh. It has a structure that is embedded in the state of distorting the network structure, and has a high packing structure. For this purpose, the ratio of SiO2-Zr2O3-Sr2O3 content is optimized.

The glass frit (c) may have a weight ratio of 3 to 20: 1 in at least one of SiO 2: Sr 2 O 3 and Zr 2 O 3. In the above range, even at a firing temperature of 560 to 590 ° C., acid resistance can be ensured while maintaining basic characteristics of the electrode such as resistance and line width.

In embodiments, the glass frit may have a softening point of 470 to 540 ° C and a glass transition temperature of 385 to 475 ° C.

It is preferable that the average particle diameters (D50) of the said glass frit are 0.5-3 micrometers, More preferably, it is 1-1.5 micrometers. Pinhole defects do not occur in the developing process when forming the electrode in the above range.

The content of the glass frit is preferably contained 1 to 20% by weight, preferably 2 to 15% by weight, more preferably 2.5 to 10% by weight of the total composition. It is excellent in the adhesive force of the conductive powder and the glass substrate in the above range, there is no fear of resistance increase.

(d) solvent

As the solvent used in the present invention, an organic solvent having a boiling point of 120 ° C. or higher, which is commonly used in an electrode forming composition, may be used. In one embodiment, methyl cellosolve, ethyl cellosolve, butyl cellosolve, aliphatic alcohol, α-terpineol, β-terpineol, Dihydro-terpineol, Ethylene Grycol, Ethylene glycol mono butyl ether, Butyl Cellosolve Acetate, Texanol, etc. may be used. May be, but is not necessarily limited thereto. These may be used alone or in combination of two or more.

The content of the solvent will vary depending on the specific application, it may be easy to control the viscosity by adjusting the amount of the solvent added. In the specific example, it is used in the range of 3-68 weight%, Preferably it is 10-60 weight%.

The composition for forming an electrode of the present invention may further include one or more polyfunctional monomers. The polyfunctional monomer may be a di-, tri-, tetra-, penta- or hexa- (meth) acrylate as a monomer containing 2 to 6 functional groups. Specific examples include trimethylolpropane ethoxy triacrylate, ditrimethylolpropane tetraacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate, and 1,6-hexanediol diacryl. Latene, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythrate Lithol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, noblock epoxy acrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, propylene glycol dimetha Acrylate, 1,4-butanedioldimethacrylate, 1,6-hexane Diol dimethacrylate, and the like, but is not necessarily limited thereto. These may be used alone or in combination of two or more.

The content of the multifunctional monomer is used in 1 to 20% by weight, preferably 3 to 15% by weight of the total composition. In the above range, there is no problem of pattern dropout during development and no decomposition of organic matters during firing.

The composition for forming an electrode of the present invention may further include a photoinitiator. The photoinitiator can be used without limitation so long as it can exhibit excellent photoreaction in the light wavelength band of 200 to 400nm.

Examples of such photoinitiators include chloroacetophenone, diethoxy acetophenone (DEAP), hydroxy acetophenone, 1-phenyl-2-hydroxy-2-methyl propane-1- 1-phenyl-2-hydroxy-2-methyl propane-1-one (Darocure 1173, HMPP), 1-hydroxy cyclohexyl phenyl ketone (Irgacure 184, HCPK), α Α-Amino Acetophenone (Irgacure-907), Benzoin Ether, Benzyl Dimethyl Ketal (Irgacure-651), BenzoPhenone, Thioxanthone , 2-ETAQ (2-EthylAnthraquinone), and the like, but are not necessarily limited thereto. These may be used alone or in combination of two or more.

The addition amount of the photoinitiator in the above is 0.1 to 10% by weight, preferably 1 to 5% by weight of the total composition. Sufficient curing is achieved in this range so that the pattern does not fall off from the substrate during development.

In an embodiment, the composition for forming an electrode may further include conventional additives as necessary to improve flow characteristics, process characteristics, and stability. The additives include plasticizers, dispersants, viscosity stabilizers, antifoams, pigments, ultraviolet stabilizers, antioxidants, thermal polymerization inhibitors, coupling agents, and the like. These may be used alone or in combination of two or more. These are all known enough to be commercially available to those of ordinary skill in the art, so specific examples and descriptions thereof will be omitted.

The composition for forming an electrode of the present invention can be used to form not only the rear substrate but also the electrode of the front substrate.

In one embodiment, using the composition of the present invention, it is possible to form an address electrode by photolithography. In an embodiment, the composition for forming an electrode is printed on a substrate with a thickness of 10 to 30 μm, and then dried, and then a cured film is formed by performing an ultraviolet exposure process using a photomask on the dried film. Thereafter, the cured film may be alkali-developed to form a pattern, and the film may be manufactured by firing the film on which the electrode pattern is formed.

The drying may proceed for about 15 to 50 minutes at a temperature of 0 ~ 150 ℃. In addition, the firing may be made at a temperature of 450 ~ 650 ℃.

The electrode formed of the composition for forming an electrode of the present invention may be an electrode pattern deformation occurrence time of more than 40 seconds, preferably 45 ~ 350 seconds after the time dipping test in a 6% by weight aqueous nitric acid solution.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Example

The specifications of each component used in the following Examples and Comparative Examples are as follows:

(a) Conductive powder: Silver (Ag) powder (3-11F, DOWA) having an average particle diameter (D50) of 1.5 µm was used.

(b) organic binder

Poly (methyl methacrylate-co-methacrylic acid) (Photonics, HL370) was used.

(c) Glass frit: A glass frit having the composition shown in Table 1 below was used.

Composition A Composition B Composition C Composition D Composition E Composition F Composition G Composition H Composition I Bi2O3 25 27 25 25 27 25 - 25 25 SiO2 37 40 37 37 30 18 18 37 18 B2O3 18 18 18 18 17 17 17 18 17 Al2O3 10 7 7 7 9 5 5 10 5 Sr2O3 2 10 - - - - - One 22 Zr2O3 - - 2 10 - - - One - ZnO 8 8 8 8 - 35 35 8 13 CaO - - - - 8 - - - - PbO - - - - - - 25 - - P2O5 - - - - 9 - - - -

(d) Solvent: 2,2,4-trimethyl-1,3-pentanediol mono-isobutyrate (Eastman) was used.

(e) Polyfunctional monomer: trimethylolpropane ethoxy triacrylate was used.

(f) Initiators: 2-Benzyl-2- (dimethylamino) -1- [4- (4-morpholinyl) phenyl] -1-butanone (Ciba: Igacure 369) and α-dimethoxy-α-phenylacetophenone (Ciba : Igacure 651) was mixed and used in the ratio of 8: 2.

Example  1 to 7 and Comparative Example  1 to 6

Each of the components were formulated in the compositions of Tables 2 and 3, respectively, and the organics were dissolved and stirred at 40 ° C. for 4 hours, and then the inorganic materials (conductive powder, glass frit) were sufficiently dispersed using a 3-roll-mill electrode. A composition for formation was prepared. (Unit: wt%)

After printing the composition prepared in Examples 1 to 7 and Comparative Examples 1 to 6 using a screen mesh type mask (# SUS material) of 300 mmX 300 mm, an IR drying furnace having a temperature of 110 ° C. was used. Dried for 20 minutes. Subsequently, 20, 30, 40, 50, 60, 80, 100, and 120 μm electrode patterns were formed by photolithography, respectively, and developed by 0.4% aqueous alkali solution, and then line widths were measured. The prepared electrode developer was fired at 580 ° C. for 60 minutes, and then line width, thickness, resistance, specific resistance, and etching resistance were evaluated.

(1) Line width (µm): Measured using AXIO Scope of Karl-zeiss.

(2) Thickness (μm): The thickness was measured using Tencor P-10.

(3) Resistance (μΩ): The resistance was measured using a wire resistance measuring instrument (2000 Multimeter, KEITHLEY Co., Ltd.) for the formed electrode pattern.

(4) Specific resistance: It was calculated as line width X thickness X resistance / length.

(5) Acid resistance (sec): After forming the electrode pattern, a dipping test for each time period was performed in 6% nitric acid solution. After dipping, 3M tape was attached and the electrode pattern was examined by taping test. As a result of the inspection, the timing of occurrence of deformation of the electrode pattern (time) was measured and shown in Tables 2 and 3, respectively.

In addition, the results measured by the electron scanning microscope (SEM) for Example 1 and Comparative Example 1 of the present invention are shown in Fig. 1 and Fig. 2, respectively.

Example One 2 3 4 5 6 7 (a) conductive powder 40 60 40 40 40 40 40 (b) organic binder 15 10 15 15 15 15 15 (c) glass frit Composition A 3 4 - - 1.5 - - Composition B - - 3 - - - - Composition C - - - 3 1.5 - - Composition D - - - - - 3 - Composition H - - - - - - 3 (d) solvent 27.2 15.8 27.2 27.2 27.2 27.2 27.2 (e) polyfunctional monomers 13 9 13 13 13 13 13 (f) initiator 1.8 1.2 1.8 1.8 1.8 1.8 1.8 Line width after firing (㎛) 98 100 103 100 99 105 98 Specific resistance (μΩ) 3.5 3.0 3.7 2.9 3.7 4.1 3.9 Thickness (㎛) 2.5 3.7 2.3 2.2 2.1 2.5 2.3 Acid resistance (sec) 50 120 120 40 50 100 60

Comparative example One 2 3 4 5 6 (a) conductive powder 40 40 40 40 40 40 (b) organic binder 15 15 15 15 15 15 (c) glass frit Composition A - - - - 1.5 - Composition E 3 10 - - - - Composition F - - 3 - 1.5 - Composition G - - - 3 - - Composition I - - - 3 - 3 (d) solvent 27.2 27.2 27.2 27.2 27.2 27.2 (e) polyfunctional monomers 13 13 13 13 13 13 (f) initiator 1.8 1.8 1.8 1.8 1.8 1.8 Line width after firing (㎛) 88 86 86 96 92 82 Specific resistance (μΩ) 3.2 3.5 3.2 2.5 3.0 5.5 Thickness (㎛) 2.6 3.7 3.0 2.6 2.8 3.2 Acid resistance (sec) 5 7 One 10 10 10

As shown in Tables 2 and 3, it can be seen that Examples 1 to 7 have excellent acid resistance. In addition, it is confirmed that the pattern holding performance is excellent due to the small change in the line width. On the other hand, Comparative Examples 1-6 are inferior in acid resistance, and it turns out that the line width change is large.

In addition, as shown in Figures 1 and 2, the composition of the present invention is excellent in acid resistance, it can be seen that the electrode pattern is formed stably well without damage.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the embodiments described above are in all respects illustrative and not restrictive.

Claims (10)

(a) conductive powder, (b) organic binder, (c) glass frit and (d) solvent, wherein the glass frit (c) has a weight ratio of at least one of SiO 2: Sr 2 O 3 and Zr 2 O 3 in a range of 3 to 20: 1. And at least one of Sr 2 O 3 and Zr 2 O 3 contains 0.5 to 20% by weight of the glass frit.
According to claim 1, wherein the glass frit (c) is 15 to 45% by weight of Bi2O3, 25 to 50% by weight of SiO2, 10 to 25% by weight of B2O3, 1 to 15% by weight of Al2O3, 0.5 to at least one of Sr2O3 and Zr2O3 20 wt%, ZnO 1 to 20 wt% composition for forming an electrode characterized in that it comprises.
delete The composition according to claim 1, wherein the composition comprises (a) 30 to 90% by weight of conductive powder, (b) 1 to 20% by weight of organic binder, (c) 1 to 20% by weight of glass frit, and (d) solvent as a balance. Electrode composition for forming.
The composition of claim 1, wherein the conductive powder (a) comprises at least one conductive powder selected from the group consisting of gold, silver, copper, nickel, palladium, platinum, and aluminum.
The method of claim 1, wherein the organic binder (b) is for forming an electrode comprising a C _{1 -10} alkyl (meth) acrylate and at least one selected from a copolymer and a cellulose-based polymer of the unsaturated carboxylic acid Composition.
According to claim 1, wherein the electrode forming composition is trimethylolpropane ethoxy triacrylate, ditrimethylolpropane tetraacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate , 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipenta Erythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, noblock epoxy acrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol Dimethacrylate, propylene glycol dimethacrylate, 1,4-butane Oldi methacrylate and 1,6-hexanediol dimethacrylate least one selected multi-functional further includes a composition for electrode formation, characterized in that the monomers from the group consisting of a rate.
The electrode forming composition of claim 1, wherein the electrode forming composition further comprises a photoinitiator.
The method of claim 1, wherein the composition further comprises at least one additive selected from the group consisting of plasticizers, dispersants, viscosity stabilizers, antifoaming agents, pigments, UV stabilizers, antioxidants, thermal polymerization inhibitors and coupling agents. A composition for forming an electrode.
An electrode formed from the composition of any one of claims 1, 2 and 4-9.

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