KR101608120B1 - Method for manufacturing electrode for display apparatus, electrode for display apparatus manufactured using the same and display apparatus comprising the same - Google Patents

Abstract

The present invention provides a method of manufacturing a semiconductor device, comprising: printing and drying a conductive paste on a substrate; And a step of printing and patterning a glass paste on the dried paste of the conductive paste, a display device electrode manufactured by the method, and a display device including the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electrode for a display device, an electrode for a display device manufactured by the method, and a display device including the same. 2. Description of the Related Art [

The present invention relates to a method of manufacturing an electrode for a display device, an electrode for a display device manufactured by the method, and a display device including the same.

Conventionally, an electrode including silver has been used as a plasma display panel (PDP) electrode. Since the electrode including silver has high density, gas leaks do not occur after firing in the PDP process. However, since silver is expensive, it is not economical to manufacture electrodes and migration of silver may cause uneven resistance or short circuit in the electrode terminal portion.

Therefore, a photosensitive electrode using aluminum powder has been studied to replace expensive silver powder. However, the aluminum powder is oxidized with aluminum oxide (Al ₂ O ₃ ) powder coating, so that sufficient sintering does not occur between powders at the time of firing, and the thickness of the aluminum oxide coating can be increased during the firing process. This can increase the resistance of the aluminum electrode.

In addition, the aluminum powder has a low film density when baked, and the inside or the surface of the electrode becomes porous. Such porosity can cause bubbles in the dielectric film during dielectric firing, and can also cause the dielectric to permeate into the electrode, thereby causing the electrode to be excited. Further, the aluminum electrode lacks chemical resistance to the alkali solution used in the process of forming the barrier rib, and the electrode of the terminal portion may be damaged. Such a series of problems may cause a gas leak problem after sealing the front substrate and the rear substrate in the plasma display panel and injecting Ne and Xe gas.

In this regard, Korean Patent Laid-Open Publication No. 2009-0064029 discloses an electrode formed on a substrate and a substrate and including silver particles and mixed particles of metal particles of any one of copper, nickel and aluminum, Discloses a plasma display panel using a frit.

It is an object of the present invention to provide a method of manufacturing an electrode for a display device, in which there is no occurrence of gas leak even after sealing of a substrate and resistance is not increased.

Another object of the present invention is to provide a method of manufacturing an electrode for a display device in which no dielectric material is damaged due to no bubbles during dielectric firing.

It is still another object of the present invention to provide a method of manufacturing an electrode for a display device having an excellent chemical resistance to an alkali solution used in a process of forming a barrier rib.

Another object of the present invention is to provide an electrode for a display device manufactured by the above manufacturing method and a display device including the same.

A method of manufacturing an electrode for a display device according to one aspect of the present invention includes: printing and drying a conductive paste on a substrate; And printing and patterning a glass paste on the dried paste of the conductive paste.

An electrode for a display device, which is another aspect of the present invention, can be manufactured by the above manufacturing method.

A display device that is another aspect of the present invention may include an electrode for the display device.

The present invention relates to a display device capable of suppressing the breakdown of the dielectric layer during the firing process of the dielectric layer and having excellent chemical resistance against the alkali solution used in the process of forming the barrier ribs, Thereby providing a method of manufacturing an electrode.

1 is a cross-sectional view of an electrode for a display device of an embodiment of the present invention formed on a substrate.
2 is a perspective view of a panel for a display device according to one embodiment of the present invention.
3 and 4 are scanning electron microscope (SEM) images of the electrode surface and cross-section of the electrode of Example 1, respectively.
5 and 6 are SEM images of electrode surface and cross section of Comparative Example 2, respectively.
7 and 8 are SEM images of electrode surface and cross section of Comparative Example 3, respectively.

A method of manufacturing an electrode for a display device according to one aspect of the present invention includes: printing and drying a conductive paste on a substrate; And printing and patterning a glass paste on the dried paste of the conductive paste.

In one embodiment, the conductive paste may comprise a conductive metal powder, an organic binder, a photopolymerizable monomer, an initiator, and a solvent.

The conductive metal powder may be at least one selected from the group consisting of Al, Ag, Au, Pd, Pt, Cu, Cr, Co, May include at least one of phosphorus (Pb), zinc (Zn), iron (Fe), iridium (Ir), osmium (Os), rhodium (Rh), tungsten (W), molybdenum have. In an embodiment, the conductive metal powder is selected from the group consisting of aluminum alone, or a metal selected from the group consisting of aluminum and a metal selected from the group consisting of Ag, Au, Pd, Pt, Cu, Cr, (1) of Sn, Pb, Zn, Fe, Ir, Os, Rh, W, Mo, Or more species.

The conductive metal powder may be at least one of spherical, needle-shaped, plate-like, and amorphous. For example, a spherical type can be used.

The conductive metal powder may have an average particle diameter (D50) of 0.1 占 퐉 to 20 占 퐉. In the above range, it is possible to fired at a temperature of 600 ° C or less, and the film density of the electrode after firing is improved, so that the effect of improving the conductivity can be obtained.

In the present specification, "average particle diameter (D50)" is measured using a 1064 LD model manufactured by CILAS after dispersing conductive metal powder or glass frit in isopropyl alcohol (IPA) by ultrasonication at 25 ° C for 3 minutes.

The conductive metal powder may be contained in an amount of 5-95% by weight, preferably 25-70% by weight, of the conductive paste. In the above range, the electrode manufactured using the paste can have a desired degree of conductivity, and adhesion with the substrate and printability can be good.

The organic binder is added to mix the components contained in the conductive paste and to produce a paste having a constant viscosity. As a result, it is possible to manufacture an electrode for undergoing a firing process.

The organic binder may be a copolymer of a carboxylic acid group-containing monomer such as (meth) acrylic acid or itaconic acid with a (meth) acrylic acid ester such as methyl acrylate, methyl methacrylate, styrene, (meth) acrylamide, At least one of a copolymer obtained by copolymerizing a monomer having an ethylenically unsaturated double bond, cellulose, and a water-soluble cellulose derivative can be used, but is not limited thereto.

The organic binder may be contained in an amount of 1-40% by weight, preferably 1-20% by weight, of the conductive paste. In the above range, the viscosity does not become too low after paste production or after the printing and drying, and the decomposition of the organic binder progresses smoothly during firing, so that the resistance may not rise.

Examples of the photopolymerizable monomer include (meth) acrylic monofunctional or polyfunctional monomers such as trimethylolpropane ethoxy tri (meth) acrylate, ethylene glycol di (meth) acrylate, triethylene glycol di (meth) , Diethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di Acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tri (Meth) acrylate, dipentaerythritol hexa (meth) acrylate, bisphenol A di (meth) acrylate, novolak epoxy (meth) acrylate, However, it is not limited thereto.

The photopolymerizable monomer may be contained in the conductive paste in an amount of 1-30% by weight, preferably 1-20% by weight. In the above range, photocuring is good, there is no problem of pattern drop-out at the time of development, and the content of photopolymerizable monomer is large, so that there is no problem of decomposition of organic matter during firing.

The initiator exhibits a photoreaction at a wavelength range of 200 nm to 400 nm, and at least one selected from the group consisting of benzophenone, acetophenone, and triazine-based compounds can be used, but is not limited thereto. For example, a mixture of 2-benzyl-2- (dimethylamino) -1- [4- (4-morpholinyl) phenyl] -1-butanone, alpha-dimethoxy-alpha-phenylacetophenone, But is not limited thereto.

The initiator may be contained in the conductive paste in an amount of 0.1 to 10% by weight, preferably 0.1 to 5% by weight. In the above range, no initiator remains in the remaining amount, the curing reaction is completely performed, there is no problem of pattern dropout, the printing property is good, and the resistance increase due to unreacted organic matter may not occur.

The solvent may be a solvent having a boiling point of 120 캜 or higher which is commonly used in conductive pastes. For example, those conventionally used for conductive pastes such as esters, aliphatic alcohols, carbitol solvents, cellosolve solvents and the like can be used. In an embodiment, the solvent is selected from the group consisting of 2,2,4-trimethyl-1,3-pentanediol mono-isobutyrate, methyl cellosolve, ethyl cellosolve, butyl cellosolve, aliphatic alcohol, terpineol, ethylene glycol, ethylene Glycol monobutyl ether, butyl cellosolve acetate, texanol, butyl carbitol acetate, and the like.

The solvent may be contained in the remaining amount of the conductive paste.

The content of the glass frit in the conductive paste may be 0 wt%. This is because the glass paste to be described later includes glass frit, and in the manufacturing method of the present invention, the conductive paste and the glass paste are simultaneously patterned. This is because the glass frit of the glass paste can play a sufficient role in forming the conductive pattern of the conductive paste.

For example, the conductive paste may contain 5-95 wt% of the conductive metal powder, 1-40 wt% of the organic binder, 1-30 wt% of the photopolymerizable monomer, 0.1-10 wt% of the initiator, and residual solvent. Preferably, it may comprise 25-70 wt% of conductive metal powder, 1-20 wt% of organic binder, 1-20 wt% of photopolymerizable monomer, 0.1-5 wt% of initiator, and residual solvent.

In other embodiments, the conductive paste may further comprise a small amount of glass frit. The glass frit is contained in a conductive paste to improve the adhesion to the substrate and to fill the voids in the conductive pattern after firing to improve the density of the electrode.

The glass frit may be contained in the conductive paste in an amount of 0.1-30% by weight, preferably 1-20% by weight. In the above range, the glass frit may be included in the conductive paste to improve the adhesiveness to the substrate and to fill the voids in the conductive pattern after firing, thereby improving the density of the electrode.

For example, the conductive paste may contain 5-95 wt% of conductive metal powder, 1-40 wt% of organic binder, 1-30 wt% of photopolymerizable monomer, 0.1-30 wt% of glass frit, 0.1-10 wt% of initiator, Solvent. Preferably, it comprises 30-70% by weight of conductive metal powder, 1-30% by weight of organic binder, 1-20% by weight of photopolymerizable monomer, 1-20% by weight of glass frit, 0.1-10% by weight of initiator, can do.

The glass frit is _{SiO 2, B 2 O 3,} Bi 2 O 3, Al 2 O 3, ZnO, Na 2 O, K 2 O, Li 2 O, BaO, CaO, MgO, SrO, PbO, TlO one or more of the ₂ But is not limited thereto. Preferably, the glass frit may comprise at least one of Bi ₂ O ₃ , B ₂ O ₃ , SiO ₂ , Al ₂ O ₃ .

The melting point of the glass frit can be from 350 [deg.] C to 650 [deg.] C. In the above range, it may be effective to improve the density of the electrode by filling the gap in the conductive pattern by melting.

The glass transition temperature of the glass frit can be from 300 ° C to 600 ° C. In the above range, the shrinkage ratio is appropriate, edge curl is not generated in the electrode formed thereon, and the sintering of the conductive powder is sufficiently performed, so that there is no problem that resistance rises.

The average particle diameter (D50) of the glass frit may be 0.5 占 퐉 to 3 占 퐉. In the above range, there may be an effect of improving the density of the electrode film by filling the voids of the conductive pattern.

The glass paste may include a glass frit, an organic binder, a photopolymerizable monomer, an initiator, and a solvent.

The glass frit, the organic binder, the photopolymerizable monomer, the initiator and the solvent contained in the glass paste may be the same as or different from those described above in the conductive paste.

The glass frit may be included in the glass paste in an amount of 30 to 80% by weight. Within this range, the printability can be good and the effect of uniformly printing on the conductive pattern can be obtained. Preferably 50 to 70% by weight.

The organic binder may be contained in an amount of 1-30% by weight of the glass paste. Within this range, it can have an effect of increasing the adhesion to the electrode. Preferably 1-20% by weight.

The photopolymerizable monomer may be contained in an amount of 1-30% by weight of the glass paste. In the above range, the photo-curing is good and there is no problem of pattern drop-out at the time of development, and the content of the photopolymerizable monomer is large, so that there is no problem of decomposition of organic matter during firing. Preferably 1-20% by weight.

The initiator may be included in the glass paste in an amount of 0.1 to 10% by weight. Within the above range, the initiator of the remaining amount is not left, the curing reaction is completely performed, there is no problem of pattern dropout, the printing property is good, and the resistance increase due to the unreacted organic matter does not occur. Preferably 1 to 5% by weight.

The solvent may be contained in the remaining amount of the glass paste.

The manufacturing method may include printing and drying a conductive paste on a substrate. The substrate may be, for example, a glass substrate, a metal substrate, or the like.

A conductive paste is printed on a substrate with a thickness of 5 to 40 mu m and the printed paste is dried to produce a conductive paste dried product. Drying conditions should be such that the glass paste to be printed can be applied later, and it is dried at 80 ° C to 200 ° C for 5 minutes to 30 minutes.

The manufacturing method may include printing and patterning a glass paste on the dried product of the conductive paste.

The glass paste may be printed on the front side of the dried paste of the conductive paste or on a portion where a pattern is to be formed. The glass paste can be printed in a thickness of 0.1-2 times the thickness of the dried paste of the conductive paste. Within the above range, the effect of adding glass paste can be obtained while securing the conductivity of the electrode.

The printing thickness of the glass paste is not limited, and may be printed in a thickness of 0.1 占 퐉 to 40 占 퐉, for example, 5 占 퐉 to 40 占 퐉.

The glass paste is printed and patterned.

And drying the glass paste before patterning after printing the glass paste. By performing the drying step, the patterning of the conductive paste and the glass paste can be performed better. There is no particular limitation on the drying, but it is dried at 80 ° C to 200 ° C for 5 minutes to 30 minutes.

The patterning includes exposure, development and firing. The patterning simultaneously patterns the conductive paste dried material and the glass paste (or the dried material of the glass paste). As a result, the glass paste fired body can be formed on the conductive pattern, and the glass paste fired body can be included in the voids formed in the conductive pattern.

The exposure is performed by irradiating ultraviolet rays of 5 mW-30 mW and 100 mJ-400 mJ after placing a mask for pattern formation on a glass paste. The development is to remove the exposed or unexposed areas, for example, in a solution of Na ₂ CO ₃ at 20 ° C to 35 ° C. The firing is to treat the remaining composition at 450 ° C to 600 ° C for 20 minutes to 40 minutes. The organic binder and the solvent in the paste film patterned by firing are all desorbed and the conductive frit is melted and the conductive metal powder is bound. The firing process is not performed once but may be repeated 3-4 times depending on the dielectric forming process.

An electrode for a display device, which is another aspect of the present invention, can be manufactured by the above manufacturing method.

 The electrode of the present invention includes a conductive pattern; And a glass paste fired product formed on the conductive pattern, wherein the conductive pattern and the glass paste fired product have the same pattern. As a result, there is no gap on the surface of the conductive pattern, and there is no gas leakage problem of the conventional electrode for a display device.

In addition, the conductive paste and the glass paste can simultaneously undergo a patterning process including exposure, development and firing. As a result, in the patterning process of the conductive paste, the glass paste is infiltrated into the pores formed in the conductive pattern and sintered together, whereby the electrode comprises the first phase composed of the sintered product of the conductive paste and the second phase composed of the glass paste sintered product And the second phase may be included in the gap formed inside the first phase.

As described above, the electrode of the present invention can suppress the generation of gas leak and improve the resistance by including the glass paste sintered material in the conductive pattern and the upper surface as shown in Figs. 3 and 4 , The lifting phenomenon of the conductive pattern can be solved, and the damage of the dielectric layer can be solved when the dielectric layer is laminated.

1 is a cross-sectional view of an electrode for a display device of an embodiment of the present invention formed on a substrate. 1, an electrode 117 for a display device is formed on a substrate 150, and an electrode 117 for a display device includes a conductive pattern 117b and a glass paste fired product 117a formed on the conductive pattern 117b And a glass paste fired product 117a may be included in the pores formed in the conductive pattern 117b.

The thickness of the electrode for a display device may be 5 占 퐉 to 20 占 퐉.

An electrode for a display device is not limited, but can be used as a plasma display electrode.

A panel for a display device according to another aspect of the present invention may include an electrode for the display device. For example, the panel for a display device may be a panel for a plasma display device.

More specifically, the panel for a display device includes a rear substrate and a front substrate arranged to face each other; A plurality of electrodes for the display device formed on the rear substrate; A first dielectric layer formed on the rear substrate while covering the electrodes for the display device; A plurality of barrier ribs contacting the first dielectric layer to form a discharge space; A fluorescent layer formed in the discharge space; A plurality of bus electrodes arranged on the lower surface of the front substrate in a direction crossing the address electrodes; And a second dielectric layer covering the bus electrode.

2 is a perspective view of a panel for a display device according to an embodiment of the present invention. Referring to FIG. 2, the panel 10 for a display device may include a rear substrate 150 and a front substrate 100. A plurality of address electrodes 117 arranged in the longitudinal direction are formed on the rear substrate 150. A first dielectric layer 115 covering the address electrodes 117 is formed on the rear substrate 150 on which the address electrodes 117 are formed. Is formed. A plurality of barrier ribs 120 forming a discharge space are formed on the first dielectric layer 115. A phosphor layer 132 including a fluorescent material corresponding to R, G and B is formed in the discharge space, . The front substrate 100 is disposed opposite to the rear substrate 150. A plurality of bus electrodes 112 are formed on the lower surface of the front substrate 100 so as to cross the address electrodes 117 in a lateral direction. A transparent electrode 110 may be provided between the front substrate 100 and the bus electrode 112 and a bus electrode 112 may be formed on the transparent electrode 110. A second dielectric layer 114 is formed on the transparent electrode 110 to cover the bus electrode 112 and store charges generated inside the panel. The MgO layer 118 may be formed on the transparent electrode 110 to protect the second dielectric layer 114 and facilitate electron emission. The address electrode may have the shape of FIG. An inert gas including Ne, Ar, Xe, Ne + Ar, and Ne + Xe is injected into the space between the rear substrate and the front substrate to generate light by discharge when a voltage higher than a threshold voltage is applied to the electrodes.

A display device that is another aspect of the present invention may include an electrode for the display device. The display device may be, but is not limited to, a plasma display device.

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Specific specifications of the components used in the following examples and comparative examples are as follows.

(A) Conductive metal powder: spherical powder having an average particle diameter (D50) of 7 mu m made of aluminum

(B) Glass frit: Bismuth glass frit (Bi203-B2O3-SiO2-Al2O3) (Partcollage Company)

(C) Organic binder: poly (methyl methacrylate-CO-methacrylic acid) solution (CCST, resin solid content: 40% by weight)

(D) Photopolymerizable monomer: trimethylol propane ethoxy triacrylate (Photonics)

(E) Initiator: (E1) Synthesis of (2-benzyl-2- (dimethylamino) -1- [4- (4-morpholinyl) phenyl] Alpha-phenylacetophenone (CIBA)

(F) Solvent: 2,2,4-trimethyl-1,3-pentanediol mono-isobutyrate

Manufacturing example  1: Conductive paste 1

16.6 parts by weight of an organic binder solution, 10.5 parts by weight of a photopolymerizable monomer and 0.8 parts by weight of an initiator were stirred at 40 占 폚 for 4 hours. 60 parts by weight of the conductive metal powder was put into the obtained mixture, milled and dispersed to prepare a paste.

Manufacturing example  2: Conductive paste 2

16.6 parts by weight of an organic binder solution, 10.5 parts by weight of a photopolymerizable monomer and 0.8 parts by weight of an initiator were stirred at 40 占 폚 for 4 hours. 50 parts by weight of the conductive metal powder and 10 parts by weight of the glass frit were added to the obtained mixture, followed by milling and dispersing to prepare a paste.

Manufacturing example  3: Conductive paste 3

12.8 parts by weight of an organic binder solution, 8.3 parts by weight of a photopolymerizable monomer and 0.8 parts by weight of an initiator were stirred at 40 캜 for 4 hours. 27 parts by weight of a conductive metal and 45 parts by weight of a glass frit were put into the resulting mixture, milled and dispersed to prepare a paste.

Manufacturing example  4: Glass paste

16.6 parts by weight of an organic binder solution, 10.5 parts by weight of a photopolymerizable monomer and 0.8 parts by weight of an initiator were stirred at 40 占 폚 for 4 hours. 60 parts by weight of glass frit was added to the obtained mixture, milled and dispersed to prepare a paste.

Example  One

A screen mask was laid on a glass substrate, the paste of Preparation Example 1 was printed to a thickness of 13 mu m, and the printed composition was dried at 110 DEG C for 20 minutes. The paste of Production Example 4 was printed to a thickness of 16 탆 on the dried product of the paste of Production Example 1, and the printed paste was dried at 110 캜 for 20 minutes. The dried paste of Preparation Example 1 and the paste of Production Example 4 were simultaneously exposed at 14 mW and 200 mJ, and developed at 0.4% Na ₂ CO ₃ aqueous solution and at 30 ° C., dried and fired at 580 ° C. for 30 minutes, And an electrode for a display device composed of a glass paste fired product formed on the conductive pattern was produced.

Example  2

An electrode for a display device was manufactured in the same manner as in Example 1 except that the paste of Production Example 2 was used instead of the paste of Production Example 1.

Comparative Example  One

A screen mask was laid on a glass substrate, the paste of Preparation Example 1 was printed to a thickness of 13 mu m, and the printed composition was dried at 110 DEG C for 20 minutes. 14 mW and 200 mJ, developed with 0.4% Na ₂ CO ₃ aqueous solution and 30 캜, and dried and fired at 580 캜 for 30 minutes to prepare electrodes for a display device.

Comparative Example  2

A screen mask was laid on the glass substrate, the paste of Preparation Example 2 was printed to a thickness of 13 mu m, and the printed composition was dried at 110 DEG C for 20 minutes. 14 mW and 200 mJ, developed with 0.4% Na ₂ CO ₃ aqueous solution and 30 캜, and dried and fired at 580 캜 for 30 minutes to prepare electrodes for a display device.

Comparative Example  3

A screen mask was laid on the glass substrate, the paste of Preparation Example 3 was printed to a thickness of 13 mu m, and the printed composition was dried at 110 DEG C for 20 minutes. 14 mW and 200 mJ, developed with 0.4% Na ₂ CO ₃ aqueous solution and 30 캜, and dried and fired at 580 캜 for 30 minutes to prepare electrodes for a display device.

Using the electrode for a display device manufactured above, physical properties of the items listed in Table 1 were measured. In addition, the electrode surface and the electrode cross section were observed with an SEM image.

1. Line width of electrode after firing (탆): Line width was measured with AXIO scope (Karl-Zeiss) after firing.

2. Electrode thickness (占 퐉): The electrode thickness was measured using P-10 (Tencor).

3. Line resistance (Ω): Line resistance of the electrode was measured using a line resistance meter Multimeter (KEITHLEY).

4. Whether or not gas leakage occurred: Evaluation was made as to whether or not the lighting characteristics could be maintained after sealing the substrate and the substrate on which the electrodes manufactured in Examples and Comparative Examples were formed (whether dielectric bubbles were generated due to gas leakage). The case where the lighting characteristic is good, and the case where the lighting characteristic is not good is indicated by x.

5. Chemical resistance: The electrodes formed after firing were immersed in 2.5% NaOH aqueous solution for 5 minutes and then taped with 3M Tape. A case where the electrode was not dropped due to good resistance to an alkali solution was indicated by o, and a case where electrode dropout occurred was indicated by x.

6. SEM observation of electrode surface and cross section: The surface and cross-section of the prepared electrode were observed by SEM and are shown in Figs. 3 to 8. Fig.

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Line width after firing (탆) 105 100 100 97 99 Electrode thickness (탆) 8.3 7.5 7.2 7.4 8.6 Line resistance (Ω) 286 360 367 421 648 Whether gas leaks occur ○ ○ × × × Chemical resistance ○ ○ × × ×

As shown in Table 1, the electrode for a display device including the glass paste and the conductive pattern baked according to the present invention had low line resistance, no gas leakage, and excellent chemical resistance to an alkali solution. As shown in FIGS. 3 and 4, there is no gap on the surface of the electrode. As shown in the cross-section of the electrode, there is no void due to the glass-rich structure at the upper portion with respect to the center line. Conductive metal powder The rich structure also had no voids.

On the other hand, as shown in FIG. 5 and FIG. 6, the electrode for a display device of Comparative Example 1-2, which is made only of a conductive paste containing no glass paste or containing only a small amount of glass frit, there was. In addition, the electrode for a display device of Comparative Example 3, which was made only of a conductive paste containing an excessive amount of glass frit including the content of the glass frit contained in the glass paste of the present invention without the glass paste, Similarly, many voids were formed on the electrode surface. In addition, all of the electrodes for a display device of Comparative Example 1-3 had problems such as an increase in line resistance, gas leakage, or insufficient resistance to an alkali solution.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (13)

Printing and drying the conductive paste on the substrate; And
And printing and patterning a glass paste on the dried product of the conductive paste,
The dried product of the conductive paste and the glass paste are simultaneously patterned,
Wherein the glass paste comprises glass frit, an organic binder, a photopolymerizable monomer, an initiator and a solvent,
Wherein the conductive paste comprises a conductive metal powder, an organic binder, a photopolymerizable monomer, an initiator, and a solvent.
A method of manufacturing an electrode for a display device. The method according to claim 1, wherein the glass paste is printed at a thickness of 0.1-2 times the thickness of the dried paste of the conductive paste. delete delete The method of manufacturing an electrode for a display device according to claim 1, wherein the glass frit has a melting point of 350 ° C to 650 ° C. The glass frit of claim 1, wherein the glass frit is selected from the group consisting of SiO ₂ , B ₂ O ₃ , Bi ₂ O ₃ , Al ₂ O ₃ , ZnO, Na ₂ O, K ₂ O, Li ₂ O, BaO, CaO, MgO, SrO, PbO, and TlO < _{2 &} gt ;. The method of claim 1, wherein the glass paste comprises 30-80 wt% of the glass frit, 1-30 wt% of the organic binder, 1-30 wt% of the photopolymerizable monomer, 0.1-10 wt% of the initiator, And a second electrode formed on the second electrode. delete The method according to claim 1, wherein the conductive paste contains 5-95 wt% of the conductive metal powder, 1-40 wt% of the organic binder, 1-30 wt% of the photopolymerizable monomer, 0.1-10 wt% of the initiator, A method for manufacturing an electrode for a display device comprising a solvent. The method of claim 1, wherein the conductive metal powder is selected from the group consisting of aluminum (Al), silver (Ag), gold (Au), palladium (Pd), platinum (Pt), copper (Cu), chromium (Cr), cobalt (Sn), lead (Pb), zinc (Zn), iron (Fe), iridium (Ir), osmium (Os), rhodium (Rh), tungsten (W), molybdenum (Mo) Wherein the method comprises the steps of: The method according to claim 1, wherein the conductive paste further comprises 1-20 wt% glass frit. An electrode for a display device manufactured by the method for manufacturing an electrode for a display device according to any one of claims 1, 2, 5, 6, 7, 9, 10, A display device comprising the electrode for a display device according to claim 12.

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