KR101305444B1 - Touch panel and method for manufacturing thereof - Google Patents

Abstract

PURPOSE: A touch panel and a manufacturing method thereof are provided to form detection patterns connected in first and second directions on the same surface of one transparent substrate, thereby making a thickness of the touch panel thin. CONSTITUTION: First detection patterns connected in a first direction by lead portions (21) and second detection patterns (30) arranged in a second direction are formed in one side of a transparent substrate (10). The second detection patterns are not overlapped with the first detection patterns and are disconnected to the other in the cross-section. Each of Insulating layers (40) for insulating the lead portion is formed in each lead portion of the first detection patterns positioned in the cross-section of the first and second detection patterns. A resin layer (50) is applied to the entire surface of the transparent substrate formed with the insulating layers. Openings are formed in the resin layer. A width of a first opening portion of the openings is smaller than that of the insulating layer, and a length of the first opening portion is longer than that of the insulating layer. A second opening portion (51b) of the openings is in the same shape as the second detection pattern.

Description

TOUCH PANEL AND METHOD FOR MANUFACTURING THEREOF}

The present invention relates to a method of manufacturing a touch panel which is one of information input devices of various electric and electronic devices, and a touch panel manufactured according to the same manufacturing method.

Recently, the types of electronic devices have become very diverse, especially in the field of portable electronic devices such as laptops, mobile phones, smart phones, devices with new functions are pouring out every day. As the types of electronic devices are diversified and the functions of the electronic devices are advanced and complicated, the necessity of a user interface that can be easily learned and intuitively operated by the user has been raised.

The touch panel is an input device that allows a user's command to be input by touching (selecting) instructions displayed on a screen of an electric or electronic device with a human hand or an object. To this end, the touch panel is provided on the front of the screen of the electric, electronic devices to convert the contact position directly contacted by the human hand or an object into an electrical signal. Accordingly, the instruction selected at the contact position is received as an input signal.

As a touch panel, a resistive film method, a light sensing method, and a capacitive method are known. Among them, when a human hand or an object comes into contact with each other, a conductive sensing pattern is formed to form other sensing patterns or ground electrodes. Many capacitive methods for detecting a change in capacitance and converting a contact point into an electrical signal have been widely used.

A general touch panel forms first sensing patterns connected to a first transparent substrate in a first direction (for example, X-axis direction) and a plurality of first metal patterns electrically connecting the sensing patterns with a sensor circuit for position calculation. A plurality of second metal patterns for manufacturing the first panel and electrically connecting the second sensing patterns connected to the second transparent substrate in a second direction (for example, the Y-axis direction) and the sensor patterns to the sensor circuit for position calculation. After forming the second panel to form a second panel, the first panel and the second panel manufactured as described above is bonded to the adhesive (OCA) to produce a two-panel laminated structure.

However, according to the trend of recent miniaturization and slimming of electric and electronic devices, the touch panel of the two-panel laminated structure as described above acts as a factor for increasing the thickness of the electric and electronic devices. There is a problem against the trend of electronic devices.

In view of such a point, in Publication No. 10-2008-0110477, as shown in FIG. 1, a first ITO film, a silicon oxide film, and a second ITO film are sequentially stacked on one surface of one translucent substrate 1. The first translucent electrode pattern 2 and the second transmissive electrode pattern 3 are formed by the multilayered film, and the first transmissive electrode pattern 2 is connected at the intersection portion, while the second translucent electrode pattern 3 is formed. ) Is cut off, and the second transmissive electrode pattern 3 broken at the intersection is electrically connected by the relay electrode 5 formed on the upper layer of the interlayer insulating film 4. It is.

However, in the conventional capacitive input device as described above, in order to electrically connect two neighboring electrode patterns 3a and 3b of the second transmissive electrode pattern 3 which are broken at the intersection, the first transmissive electrode An interlayer insulating film 4 for insulating the pattern 2 is formed, and the relay electrode 5 for connecting the electrode patterns 3a and 3b adjacent to the interlayer insulating film 4 is partially formed. Therefore, as shown in FIG. 1, the second translucent electrode pattern 3 and the relay electrode 5 have a predetermined step h, and the intersection part is caused by the step h. Since the relay electrode 5 is conspicuous, there is a problem of poor visibility.

The present invention has been made in view of the above, and by forming the first sensing pattern and the second sensing pattern together on one side of the transparent substrate, the thickness can be made thin and the example cut off at the intersection portion For example, it is an object of the present invention to provide a touch panel manufacturing method capable of improving visibility and a touch panel manufactured by the method, which makes the connection part connecting the second sensing pattern inconspicuous.

Another object of the present invention is to remove the step between the connecting portion and the sensing pattern as in the prior art, by forming a connecting portion which is disconnected at the intersection, for example, electrically connecting the second sensing pattern to the entire upper surface of the second sensing pattern, To provide a touch panel manufacturing method and a touch panel manufactured by the method that can improve the touch sensitivity by increasing the cross-sectional area of the sensing pattern to reduce the sheet resistance value.

According to an aspect of the present invention, there is provided a method of manufacturing a touch panel, including: a) a plurality of first sensing patterns connected to one surface of a transparent substrate in a first direction by a lid part, and the first sensing patterns; Forming a plurality of second sensing patterns arranged in a second direction so as not to overlap each other and separated from each other at an intersection; b) forming an insulating layer for insulating the lead portion in each lead portion of the first sensing pattern located at an intersection of the first sensing pattern and the second sensing pattern; c) a resin layer is formed on the transparent substrate having a plurality of insulating layers formed thereon, and a resin layer is formed on the resin layer, the first opening having a length smaller than the width of the insulating layer and having a length longer than that of the insulating layer; Forming a plurality of openings joined by two openings; d) filling the conductive material in each of the openings, the first connecting portion and the entire upper surface of the second sensing pattern electrically connecting the plurality of second sensing patterns arranged in the second direction while being separated from each other at the intersection; Forming a connecting portion having a second connecting portion positioned to increase a cross-sectional area of the second sensing pattern; And e) removing the resin layer.

According to a preferred embodiment of the present invention, a method of manufacturing a touch panel includes: f) electrically detecting the first sensing patterns and the second sensing patterns arranged to be connected in the first and second directions, respectively, with a sensor circuit for calculating a position. The method may further include forming a metal pattern for connecting to an outer portion of the transparent substrate.

In the step a), the transparent conductive film is entirely coated on the transparent substrate, and the plurality of first sensing patterns connected in a first direction by etching the transparent conductive film and arranged in a second direction and broken at intersections. May form a second sensing pattern. Here, the transparent conductive film may be any one of indium tin oxide (ITO), indium zinc oxide (IZN), and zinc oxide (ZnO), and the transparent conductive film may be etched by a photolithography method.

In addition, in the step b), a plurality of insulating layers may be formed by a silk screen method of printing an insulating paste using a screen having a plurality of openings having the same shape and arrangement as the insulating layer to be formed.

In addition, the step c) is a resin layer having a plurality of openings by silk screen printing a resin using a screen on which a plurality of blocking portions having the same shape and arrangement as the first opening and the second opening to be formed are formed. Can be formed. Here, the resin may use a photoresist.

In addition, in step d), a conductive material may be deposited by a sputtering process to form the connection part.

In addition, in step e), the resin layer may be removed by a lift-off method of dissolving resin using a solvent.

In addition, in step f), a metal pattern may be formed using any one of a silk screen process, a photolithography process, and a sputtering process.

On the other hand, the touch panel for achieving the object of the present invention, a plurality of first sensing patterns arranged in a first direction on the same surface of the transparent substrate and a plurality of second arranged in a second direction crossing the first direction A first sensing pattern is formed, and the first sensing patterns are continuous at the intersection of the first sensing pattern and the second sensing pattern, while the second sensing patterns are disconnected, and the first sensing pattern is continued at the intersection. An insulating layer is formed on an upper portion of the insulating layer, and a connecting portion for electrically connecting the second sensing patterns disconnected at the crossing portion is provided, wherein the connecting portion is provided to be positioned above the insulating layer. A first connection part electrically connecting the second connection part and a second connection part provided to be located on the entire upper surface of the second detection pattern to increase the cross-sectional area of the second detection pattern. .

According to the present invention, since a plurality of sensing patterns connected in the first and second directions are formed on the same surface of one transparent substrate, the thickness can be made thinner than that of a conventional touch panel using two transparent substrates. This makes it possible to miniaturize and slim down the electric and electronic equipment to be applied.

Further, according to the present invention, since the connecting portion for electrically connecting the second sensing patterns broken at the intersection of the first sensing pattern and the second sensing pattern is formed over the entire upper surface of the second sensing pattern, the connecting portion and the second Since there is no step between the sensing patterns and is flat, the connection is inconspicuous so that the visibility can be improved, and the cross-sectional area of the second sensing pattern is increased by the connection, so that the sheet resistance value decreases, thereby reducing touch sensitivity. It is possible to provide an excellent touch panel.

1 is an enlarged cross-sectional view illustrating a main part structure of a conventional 1 panel type touch panel;
2A and 2B are views for explaining a method of manufacturing a touch panel according to the present invention, a plan view showing an example of forming a plurality of first sensing patterns connected to a transparent substrate in a first direction, and a cross-sectional view taken along line AA of FIG. 2A;
3A and 3B are plan views showing examples of forming a second sensing pattern arranged in a second direction on the transparent substrate of FIG. 2A and broken at an intersection portion, and a cross-sectional view taken along line BB of FIG. 3A;
4A and 4B are plan views illustrating an example of forming an insulating layer on the transparent substrate of FIG. 3A and cross-sectional views taken along line A1-A1 of FIG. 4A;
5A, 5B, and 5C are plan views illustrating an example in which a resin layer having first and second openings is formed on the transparent substrate of FIG. 4A; ,
6A and 6B are plan views illustrating examples in which a connection part is formed by filling a metal material in an opening of a resin layer formed on the transparent substrate of FIG. 5A, and a cross-sectional view taken along line A3-A3 of FIG. 6A;
7 is a cross-sectional view taken along the line B2-B2 in FIG. 6A, and
8 is a perspective view schematically showing a touch panel manufactured according to the method of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention illustrated below may be modified in various other forms, and the scope of the present invention is not limited to the embodiments illustrated below. The embodiments of the present invention described below are only provided to more completely explain the present invention to those skilled in the art.

In addition, in describing the embodiments of the present invention, when it is determined that detailed descriptions of related known functions or configurations may unnecessarily obscure the gist of the present invention, detailed descriptions thereof will be omitted and the same or corresponding configurations will be omitted. The same reference numerals are used in the drawings and redundant descriptions are omitted.

For reference, the touch panel according to the present invention is not only portable electronic devices such as mobile phones, smart phones, PDAs, navigation, digital cameras, PMPs, notebook computers, etc., but also home appliances such as TVs, refrigerators, microwave ovens, air conditioners (including a remote control). It can be applied to all types of electronic devices with display screens such as personal computers, automobiles, industrial equipment, and medical equipment.

2A to 7 illustrate a method of manufacturing a touch panel according to an embodiment of the present invention for each process step.

In order to manufacture the touch panel according to the present invention, first, as shown in FIGS. 2A and 2B, a plurality of first sensing patterns 20 are formed on one surface of the transparent substrate 10. The plurality of first sensing patterns 20 are connected to each other in the first direction, for example, the X-axis direction by the lead part 21.

The transparent substrate 10 may be made of a high strength material such as glass or acrylic, or a transparent film such as polyethylene terephthalaye (PET), polycarbonate (PC), polytherthersulfone (PES), or polyimide (PI) applied to a flexible display. In this case, the material selection of the transparent substrate 10 may be determined by the type of electronic device to which the touch panel is applied and the use environment. In this case, the transparent substrate 10 may be made of a material having a constant thickness and a constant dielectric constant. Do.

The first sensing patterns 20 are formed by coating a transparent conductive film on the transparent substrate 10 and etching the transparent conductive film. In this case, the first sensing patterns 20 are formed to be positioned at the center of the transparent substrate 10, and a plurality of metal patterns 140 (see FIG. 8) to be described later are formed on the outer portion of the transparent substrate 10. do. The metal patterns 140 are for electrically connecting the first sensing pattern 20 and the second sensing patterns 30 to be described later with a sensor circuit to calculate a position.

The transparent conductive film is a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZN), or zinc oxide (ZnO) on the transparent substrate 10, for example, using a vacuum deposition method such as electron beam evaporation or sputtering. It is formed by applying to a uniform thickness. Alternatively, the transparent conductive polymer may be printed by a silk screen method and used as a transparent conductive film.

The sensing pattern may be formed by etching the transparent conductive film by photolithography. That is, after the photosensitive film is coated on the transparent conductive film, the photosensitive film of the portion of the transparent conductive film to be removed through exposure and development is removed. Next, the transparent conductive film is etched using the photosensitive film formed as described above as a mask. By this process, the transparent conductive film applied on the transparent substrate 10 is partially removed to form the first sensing patterns 20.

As described above, the first sensing pattern 20 is formed, and as shown in FIGS. 3A and 3B, a plurality of second sensing parts are formed on the transparent substrate 10 on which the first sensing patterns 20 connected in the X-axis direction are formed. The patterns 30 are formed so as not to overlap the first sensing patterns 20. In FIG. 3A, the second sensing patterns 30 are indicated by dotted lines, and the dotted line display is for distinguishing from the first sensing patterns 20, which means that the second sensing patterns 30 are hidden. The second sensing patterns 30 are formed on the same surface of the transparent substrate 10 together with the first sensing patterns 20.

In addition, the second sensing patterns 30 are arranged in a second direction, that is, in the Y-axis direction, which is different from the first sensing patterns 20, and as shown in FIG. 3B, the second sensing patterns 30 are separated from the first sensing patterns 20. It is broken at the intersection. In addition, since the second sensing patterns 30 are formed of the same material and method as the first sensing patterns 20 described above, a detailed description thereof will be omitted. In the drawing, the first sensing pattern 20 and the second sensing pattern 30 are separately shown as being formed by different processes. However, this is to help the reader to understand the first sensing pattern 20 and the second sensing pattern 20. The sensing patterns 30 are formed in one process.

As described above, the plurality of first sensing patterns 20 connected to the transparent substrate 10 in the X-axis direction and the second sensing patterns 30 arranged in the Y-axis direction are separated from each other at the intersection. Next, as shown in FIGS. 4A and 4B, each lead portion 21 of each of the lead portions 21 of the first sensing pattern 20 where the first sensing pattern 20 and the second sensing pattern 30 cross each other is shown. The insulating layer 40 for insulating () is formed, respectively.

The insulating layer 40 prevents the connecting portion 61 (see FIG. 6B) for electrically connecting the second sensing pattern 30 to be described later and the lead portion 21 of the first sensing pattern 20 to be shorted. For this purpose, the insulating layer 40 can be easily formed by a silk screen process.

The silk screen process is to pull up the ink paste on the screen, while pressing the pattern-formed screen (for example, cloth or paper with an opening formed in the form of a mesh in a specific area) with a strong tension, while pressing down the spatula-shaped squeegee By moving the paste through the mesh of the screen to the surface of the to-be-printed object.

In the method for manufacturing the touch panel of the present invention, the screen for forming the insulating layer 40 is not specifically illustrated, but includes a plurality of openings having the same shape and arrangement as the insulating layer 40 to be formed. When such a screen is placed on the transparent substrate 10, the insulating paste is placed on the screen, and then rubbed with a squeegee, the insulating paste is transferred to the transparent substrate 10 through the opening of the screen to identify the transparent substrate 10. An insulating layer 40 having a desired shape and arrangement is formed at a portion, that is, a portion where the first sensing pattern and the second sensing pattern intersect.

After forming the plurality of insulating layers 40 on the transparent substrate 10 as described above, as shown in Figures 5a, 5b and 5c, the plurality of insulating layers 40 and the second on the transparent substrate 10 A resin layer 50 having an opening 51 exposing the sensing patterns 30 is formed. Here, the opening 51 has a shape in which a first opening 51a having a width smaller than the width of the insulating layer 40 and a second opening 51b having the same shape as the second sensing pattern 30 are connected.

The resin layer 50 may be simply formed by, for example, a silk screen process as described above. That is, the part having the same shape and arrangement as the opening 51 to be formed is blocked, and other parts are provided on the transparent substrate 10 by providing an open screen, and the resin is placed on the screen and rubbed with a squeegee. The resin is transferred to the transparent substrate 10 through the open portion of the screen. At this time, since the resin is not transferred through the blocked portion of the screen, an opening 51 as shown in FIGS. 5A, 5B, and 5C is illustrated. It is possible to form a resin layer 50 having a).

After forming the resin layer 50 having the plurality of openings 51 as described above on the transparent substrate 10, a conductive material is deposited on the transparent substrate 10 using a sputtering process, for example, to form the opening 51. The conductive material is filled in to form a connection part 60 that electrically connects the second sensing patterns 30 that are broken at the intersections, and removes the resin layer 50. The state of completing the above process is shown in FIGS. 6A, 6B and 7.

As shown in FIGS. 6A, 6B, and 7, the connection part 60 is insulated from the lead part 21 of the first sensing pattern 20 by the insulating layer 40, and the insulating layer 40. And a second connection portion 62 having the same shape as the second detection pattern 30 positioned above the first detection portion 61 positioned above the second sensing pattern 30 adjacent thereto.

As described above, the second sensing patterns 30 are electrically connected in the Y-axis direction at the intersections. At this time, according to the features of the present invention, since the connecting portion, especially the second connecting portion 62 is formed on the entire upper surface of the second sensing patterns 30 arranged in the Y-axis direction, as in the conventional (see Fig. 1) As the relay electrode 5 is partially formed, a step h does not occur between the relay electrode 5 and the second sensing pattern 3, and as shown in FIG. 7, the relay electrode 5 has a flat surface. Therefore, the connecting portion 60 connecting the second sensing patterns 30 at the intersections becomes inconspicuous, thereby improving visibility.

In addition, in the touch panel according to the present invention, as shown in FIG. 7, a connecting portion for electrically connecting the second sensing pattern 30 at an intersection portion, in particular, the second connecting portion 62, has an upper portion of the second sensing pattern 30. Since the height H of the second sensing pattern 30 can be made as high as the height of the second connecting portion 62, since the entire surface is formed, the cross-sectional area of the second sensing patterns 30 is increased. When the cross-sectional area of the sensing patterns 30 is increased, there is a side effect of improving the touch sensitivity by decreasing the sheet resistance of the second sensing pattern.

Since the sputtering process for forming the connection portion 60 as described above can be understood by a known technique, a detailed description thereof will be omitted, and the process of removing the resin layer 50 after the sputtering process uses a lift-off method. Since the -off method can be understood by a known technique for dissolving and removing a resin layer using, for example, a solvent, a detailed description thereof will be omitted.

Meanwhile, in the method of manufacturing a touch panel according to an embodiment of the present invention, as shown in FIG. 8, the first sensing pattern 20 arranged to be connected in a first direction formed on the transparent substrate 10 by the above process. ) And forming a metal pattern 140 for electrically connecting the second sensing pattern 30 arranged to be connected in the second direction with the sensor circuit for position calculation.

The metal pattern 140 may be formed by a silk screen process, a photolithography process, or a sputtering process. Here, the metal pattern having a fine line width and line distance may be formed using the photolithography process or the sputtering process as compared to the silk screen process. 140 may be formed.

A schematic structure of a touch panel manufactured by the method according to an embodiment of the present invention is shown in FIG. 8.

As shown in FIG. 8, the touch panel according to the exemplary embodiment of the present invention may be connected to one side of the transparent substrate 10 in a second direction with a plurality of first sensing patterns 20 arranged to be connected in a first direction. A plurality of second sensing patterns 30 arranged to be connected are formed, and a plurality of second sensing patterns 30 are formed at an outer portion of the transparent substrate 10 to electrically connect the sensing patterns 20 and 30 to a sensor circuit for calculating a position. The metal pattern 140 is formed. In addition, the external substrate 150 having a chip electrically connected to the metal pattern 140 is connected to the transparent substrate 10 to drive and control the touch panel as a whole.

In addition, the first sensing patterns 20 are electrically connected to each other by the lead part 21, and the second sensing patterns 30 are electrically connected to each other by the connecting part 60. An insulating layer 40 is positioned between the lead portion 21 and the connecting portion 60, in particular, the first connecting portion 61 to insulate the lead portion 21 and the first connecting portion 61 from being shorted. .

In addition, the connection part 60 is provided as the first connection part 61 positioned on the insulating layer 40 and the second connection part 62 positioned on the second sensing pattern 30, thereby connecting the connection part 60. ) And the second sensing pattern 30 are maintained flat without a step, so that the connecting portion 60 is not visible and the visibility can be improved, and the second sensing portion 62 can detect the second sensing pattern 30. As the cross-sectional area of the pattern 30 is increased, the sheet resistance value is decreased, thereby providing a touch panel having excellent touch sensitivity.

On the other hand, the touch panel according to the present invention as described above, since the X-axis and Y-axis sensing patterns (20,30) are formed on one transparent substrate 10, it is configured by using two general transparent substrates The thickness thereof can be made thinner than that of the touch panel.

The touch panel according to the present invention as described above is mounted in the electronic device so as to be covered by a transparent window provided for the display of the screen in the electronic device having a display screen, such as a mobile phone, smart phone, PDA. These transparent windows are mainly transparent dielectrics such as glass or acrylic and usually serve to protect the touch panel. The transparent window and the touch panel are bonded by an optical clear adhesive (OCA).

In the above, the present invention has been described by way of example. It is to be understood that the terminology used herein is for the purpose of description and should not be regarded as limiting. Various modifications and variations of the present invention are possible in light of the above teachings. Therefore, unless otherwise indicated, the present invention may be practiced freely within the scope of the claims.

10; transparent substrate 20; first sensing pattern
21; lead portion 30; second sensing pattern
40; insulating layer 50; resin layer
51,52; first and second openings of the resin layer
60; connector 61, 62; first and second connector
140; metal pattern 150; external drive unit

Claims (12)

a) a plurality of first sensing patterns connected to one surface of the transparent substrate in a first direction by a lead portion, and a plurality of second sensing patterns arranged in a second direction so as not to overlap with the first sensing pattern and broken at an intersection; Forming a pattern;
b) forming an insulating layer for insulating the lead portion in each lead portion of the first sensing pattern located at an intersection of the first sensing pattern and the second sensing pattern;
c) a resin layer is formed on the transparent substrate having a plurality of insulating layers formed thereon, and a resin layer is formed on the resin layer, the first opening having a length smaller than the width of the insulating layer and having a length longer than that of the insulating layer; Forming a plurality of openings joined by two openings;
d) Filling the conductive material in each of the openings, the first connecting portion for electrically connecting a plurality of second sensing patterns arranged in the Y-axis direction and disconnected from each other at the intersection, and the entire upper surface of the second sensing pattern. Forming a connecting portion having a second connecting portion positioned to increase a cross-sectional area of the second sensing pattern; And
e) removing the resin layer. The method of claim 1,
f) forming a metal pattern on an outer portion of the transparent substrate to electrically connect the first sensing patterns and the second sensing patterns with the sensor circuit for position calculation, the first sensing patterns and the second sensing patterns arranged to be connected in the first and second directions, respectively; Touch panel manufacturing method characterized in that it further comprises a step. The method of claim 1, wherein step a) comprises:
A transparent conductive film is entirely coated on the transparent substrate, and the transparent conductive film is etched to form a plurality of first sensing patterns connected in a first direction and a plurality of second sensing patterns arranged in a second direction and broken at intersections. Method of manufacturing a touch panel, characterized in that. The method of claim 3,
The transparent conductive film is a touch panel manufacturing method using any one of indium tin oxide (ITO), indium zinc oxide (IZN), zinc oxide (ZnO). The method of claim 3,
The transparent conductive film is a method of manufacturing a touch panel, characterized in that the etching by photolithography. 2. The method of claim 1, wherein step b)
And a plurality of insulating layers are formed by a silk screen method of printing an insulating paste using a screen having a plurality of openings having the same shape and arrangement as the insulating layer to be formed. 2. The method of claim 1, wherein step c)
A touch screen characterized in that a resin layer having a plurality of openings is formed by a silk screen method of printing a resin using a screen on which a plurality of blocking portions having the same shape and arrangement as the first opening portion and the second opening portion are formed. Panel manufacturing method. The method of claim 7, wherein
The resin is a touch panel manufacturing method, characterized in that using a photoresist. The method of claim 1, wherein the d) step,
And forming a connection by depositing a conductive material through a sputtering process. The method of claim 1, wherein step e)
And removing the resin layer by a lift-off method in which resin is dissolved using a solvent. The method of claim 2, wherein f) is
Method of manufacturing a touch panel, characterized in that to form a metal pattern using any one of a silk screen process, photolithography process, sputtering process. A plurality of first sensing patterns arranged in a first direction and a plurality of second sensing patterns arranged in a second direction crossing the first direction are formed on the same surface of the transparent substrate, wherein the first sensing pattern and the first sensing pattern are formed. At the intersection of the two sensing patterns, the first sensing patterns are continued, while the second sensing patterns are disconnected, and an insulating layer is formed on the first sensing pattern which is continued at the intersection. In the touch panel provided with a connection part for electrically connecting broken 2nd sensing patterns,
The connecting portion
A first connection part provided to be positioned above the insulating layer to electrically connect the second sensing patterns, and a second connection part provided to be located on the entire upper surface of the second sensing pattern to increase a cross-sectional area of the second sensing pattern. A touch panel comprising:

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