KR101289704B1 - Quartz Crystal Sensor Device - Google Patents

Abstract

A crystal crystal sensor device is disclosed. Crystal crystal sensor device according to an embodiment of the present invention, a plurality of crystal disks for rotationally driving in a vacuum chamber and sequentially exposed to the deposition source to measure the thickness of the deposited film, and the alternating voltage exposed to the deposition source A sensor main body including a voltage supply unit for applying a; And a chopper unit detachably coupled to the upper portion of the sensor body.

Description

Crystal Crystal Sensor Device {Quartz Crystal Sensor Device}

The present invention relates to a crystal crystal sensor device, and more particularly, to a crystal crystal sensor device having an improved contact structure for applying an alternating voltage and a detachable structure of a chopper unit.

In general, vacuum deposition is mainly used to form organic films. The vacuum deposition method is a method of forming a thin film by providing a deposition source under the vacuum chamber and a substrate to be processed, which is a substrate for film formation, on the upper portion of the vacuum chamber.

Looking at the schematic configuration of the organic thin film forming apparatus using the vacuum deposition method, after maintaining the inside of the vacuum chamber to a constant vacuum, it is configured to evaporate the deposition material from one or more deposition sources disposed under the vacuum chamber.

The deposition source is composed of a crucible in which a deposition material, which is a thin film material, is accommodated, and a heating device wound around the crucible and electrically heated. Therefore, as the temperature of the heating apparatus rises, the crucible is also heated together and when the temperature reaches a certain temperature, the deposition material starts to evaporate.

In the vacuum chamber, a substrate to be formed on which a thin film is to be formed is located at a distance from an upper portion of the deposition source. One side of the substrate to be processed is provided with a quartz disk sensor for measuring the thickness of the thickness of the thin film deposited on the substrate.

The deposition material evaporated from the deposition source is transferred to the substrate to be processed and solidified on the substrate through a continuous process of adsorption, deposition, and re-evaporation to form a thin film. At this time, the thickness of the thin film formed on the substrate to be processed is determined by measuring the film formation speed by a quartz disk sensor.

In the method of measuring the thickness of the thin film by using the quartz sensor, the quartz is vibrated at a natural frequency according to the characteristics of the quartz disk when the electrode is made to the quartz sensor and an appropriate AC voltage is applied to both ends of the quartz disk. At this time, when the deposition material is deposited on the surface of the crystal disk, the vibration frequency is changed and the actual vibration frequency is out of the natural vibration frequency, and the amount of deviation is calculated by measuring the deviation.

Usually, the quartz disk sensor installed in the vacuum chamber is provided in plurality in order to increase the replacement cycle, a plurality of quartz disk sensors are sequentially exposed to the deposition source according to the life and to measure the deposition amount.

In order to cause the plurality of quartz disk sensors to sequentially come to the measurement position, a method of rotating the plurality of quartz disk sensors may be used. In this case, a voltage applying means for applying a stable AC voltage to the quartz disk sensor which is rotationally driven is required. .

On the other hand, in order to increase the life of the conventional quartz disk sensor is installed a chopper (Chopper) that rotates in the upper portion of the quartz disk sensor. The chopper serves to extend the life of the quartz disk sensor by periodically interrupting the exposure time of the quartz disk sensor to reduce the amount of deposition material deposited on the quartz disk sensor and to prevent degradation.

Such a chopper is usually mounted on the quartz disk sensor by a bolt and screw structure, and frequent disassembly is performed for maintenance of the chopper. Accordingly, a separate equipment for disassembly is required, and there is a problem in that disassembly and assembly of other components may be disturbed.

Therefore, the technical problem to be achieved by the present invention is to provide a crystal crystal sensor device having a chopper unit that can be applied to the crystal disk stably, detachable without a separate disassembly tool.

According to an aspect of the present invention, the voltage supply unit for rotationally driving in a vacuum chamber and sequentially exposed to the deposition source to measure the thickness of the deposition film and applying an alternating voltage to the crystal source exposed to the deposition source Sensor body comprising a; And a chopper unit detachably coupled to an upper portion of the sensor body.

The voltage supply unit may include a first contact module driven to rotate by a driving motor; And a second contact module having one side electrically connected to the first contact module and the other side connected to an AC voltage source.

The first contact module may include a rotating member in which the plurality of quartz plates are arranged in a circular shape; And a plurality of first contact members provided below the rotating member to be electrically connected to the plurality of quartz disks.

The second contact module may include: a second contact member contacting a first contact member connected to a quartz disk exposed to the deposition source among the quartz disks and applying an AC voltage; And an elastic member for elastically pressing the second contact member when the first contact member sequentially contacts the second contact member.

The elastic member may include a spring holder into which the second contact member is inserted; And a spring interposed between the spring holder and the second contact member.

The first contact member and the second contact member may be formed with flat surfaces on opposite sides to allow surface contact.

The sensor body may include a cover member in which a circular opening is formed such that only one quartz disk of the plurality of quartz disks is exposed to the deposition source.

The chopper unit may include: a rotating plate having at least one exposed hole formed therein, and rotating on an upper portion of the quartz disk so that only a part of the deposition material evaporated from the deposition source is deposited on the quartz disk; And a coupling member coupled to the rotating plate such that the rotating plate is detached from the sensor body by a one-touch method.

The coupling member may include a first coupling member to which the rotating plate is coupled; And a second coupling member to which the first coupling member is detachably fastened.

The second coupling member may include a cutout portion into which an insertion portion provided at the distal end of the first coupling member is inserted, and may be coupled by inserting the insertion portion into the cutout portion and rotating the insertion portion.

The chopper unit may further include a spring up-down member for urging the second coupling member toward the first coupling member so that the first coupling member and the second coupling member are coupled to each other.

It may include a case connected to the lower portion of the sensor body and maintained at atmospheric pressure.

One side of the case may include an atmospheric pressure box connected to maintain the case at atmospheric pressure.

Embodiments of the present invention, it is possible to stably apply a voltage to a plurality of quartz disk, it is possible to provide a crystal crystal sensor device having a chopper unit that can be removed without a separate disassembly tool.

1 is a schematic diagram of a vacuum chamber equipped with a crystal crystal sensor device according to an embodiment of the present invention.
2 is a perspective view of the crystal crystal sensor device of FIG.
3 is a plan view of the quartz crystal sensor device of FIG.
FIG. 4 is a cross-sectional view of portion AA of FIG. 3.
5 is a bottom perspective view of a first contact module of a crystal crystal sensor device;
6 is a perspective view of a second contact module of the crystal crystal sensor device.
7 is a cross-sectional perspective view illustrating a state in which the first contact module and the second contact module of the quartz crystal sensor device are coupled to each other.
8 is a perspective view of a chopper unit.
9 is a cross-sectional perspective view illustrating a state in which the first coupling member and the second coupling member of the chopper unit of FIG. 8 are coupled to each other.
10 is a cross-sectional perspective view illustrating a state in which the first coupling member and the second coupling member of the chopper unit of FIG. 8 are completed.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a schematic diagram of a vacuum chamber equipped with a crystal crystal sensor device according to an embodiment of the present invention.

Referring to FIG. 1, a process of depositing a thin film on a substrate by a vacuum deposition method is described. In the vacuum chamber 1, a deposition source 30 filled with a deposition material is installed, and the processing target is disposed above the deposition source 30. The substrate 20 is rotatably installed.

When the inside of the vacuum chamber 1 is maintained in a vacuum state, the power is applied to a heating device outside the deposition source 30 to heat the deposition source 30, and the deposition material in the deposition source 30 is vaporized or sublimed to avoid The thin film is formed by being deposited on the processing substrate 20. Herein, the deposition material may be an inorganic material or an organic material, and the thickness of the deposited thin film is measured by the crystal crystal sensor device 10.

FIG. 2 is a perspective view of the quartz crystal sensor device of FIG. 1, FIG. 3 is a plan view of the quartz crystal sensor device of FIG. 2, FIG. 4 is a cross-sectional view of part AA of FIG. 3, and FIG. 6 is a perspective view of a bottom surface of the first contact module, and FIG. 6 is a perspective view of a second contact module of the crystal crystal sensor device, and FIG. 7 is a cross-sectional perspective view illustrating a state in which the first contact module and the second contact module of the crystal crystal sensor device are coupled to each other. .

Referring to these drawings, the crystal crystal sensor device 10 according to an embodiment of the present invention, the sensor body 100, and the chopper unit 200 detachably coupled to the upper portion of the sensor body 100. do.

The sensor main body 100 measures the thickness of the deposition film in the vacuum chamber 1 in which the deposition process of the substrate is performed. The sensor main body 100 is rotationally driven in the vacuum chamber 1 and sequentially exposed to the deposition source 30 to determine the deposition film. A plurality of quartz disks 110 for measuring the thickness, and a voltage supply unit (120, 130) for applying an AC voltage to the quartz disk 110 exposed to the deposition source (30).

On the surface of the quartz disk 110, a deposition film is formed while vapor of deposition material is deposited on the surface of the substrate 20 to be processed. When the thickness and mass of the deposited film deposited on the surface of the quartz disk 110 are increased, the vibration frequency of the quartz disk 110 is also changed. The thickness of the thin film deposited on the substrate 20 may be calculated using the changed vibration frequency measured from the quartz disk 110.

In the present embodiment, the quartz disk 110 is provided in plurality in order to extend the replacement cycle, as shown in Figure 2, 10 quartz disks 110 are arranged in a circle, the measuring position sequentially by the rotation drive It is arranged to come in. However, the number and arrangement of the quartz disk 110 is not limited thereto, and may be appropriately selected according to the size or shape of the rotating member 121 on which the quartz disk 110 is mounted.

The voltage supply units 120 and 130 may include a first contact module 120 that rotates and a second contact module 130 having one side electrically connected to the first contact module 120 and the other side connected to a voltage source. It includes.

The first contact module 120 is provided in the lower portion of the rotating member 121 to be electrically connected to the rotating member 121, the plurality of quartz disk 110 is arranged in a circular shape, a plurality of quartz disk 110. A plurality of first contact member 122 is included.

The rotating member 121 is rotationally driven by connecting a rotary shaft feedthrough 301b connected to the first driving motor 301 to the central rotating shaft 121a.

A cover 101 having one circular opening 101a is disposed on the top of the rotating member 121. Since the crystal disk 110 is disposed in a circular shape, when the rotating member 121 is rotated, one of the crystal disks 110 of the plurality of crystal disks 110 is sequentially positioned below the circular opening 101a. When the life of the quartz disk 110 located in the lower portion of the circular opening (101a) is reached, by rotating the rotating member 121 using the first drive motor 301 the next crystal disk 110 of the circular opening ( Is adjusted to be located at the bottom of 101a).

The first contact member 122 is fixed to the rotating member 121 by the fixing bolt 123. The fixing bolt 123 serves to connect the first contact member 122 and the rotating member 121 and simultaneously apply an alternating voltage applied to the first contact member 122 to the quartz disk 110.

On the other hand, one side of the second contact module 130 is connected to the power supply line 303, the other side is in contact with the first contact member 122. The second contact module 130 elastically contacts the second contact member 131 when the second contact member 131 and the first contact member 122 sequentially contact the second contact member 131. It includes an elastic member 132 to press.

The second contact member 131 contacts the first contact member 122 connected to the quartz disk 110 exposed to the deposition source 30 among the quartz disks 110 and applies an AC voltage.

The elastic member 132 includes a spring holder 133 into which the second contact member 131 is inserted, and a spring 134 interposed between the spring holder 133 and the second contact member 131. The spring holder 133 and the second contact member 131 are coupled by the pin 135, and a flow groove 133a is formed in the spring holder 133 so that the pin 135 can flow up and down.

When the first contact member 122 and the second contact member 131 are in contact with each other by the rotation of the rotating member 121, the second contact member 131 is elastic by pressing the first contact member 122. When the first contact member 122 is in a complete contact position with the second contact member 131, the rotation of the rotating member 121 is stopped.

On the other hand, the contact between the first contact member 122 and the second contact member 131 is a surface contact so that a voltage is stably applied. To this end, surfaces where the first contact member 122 and the second contact member 131 start to contact each other are formed as spherical surfaces, but the final contact surfaces are formed as flat surfaces 122a and 131a. As a result, the first contact member 122 may easily ride up the second contact member 131 at the initial contact, and the flat surfaces 122a and 131a may be brought into contact with each other in a complete contact position. .

8 is a perspective view of the chopper unit, FIG. 9 is a cross-sectional perspective view illustrating a state in which the first coupling member and the second coupling member of the chopper unit of FIG. 8 are coupled, and FIG. 10 is a first coupling member of the chopper unit of FIG. 8. And a cross-sectional perspective view showing a state in which coupling of the second coupling member is completed.

The chopper unit 200 is to prevent the excessive deposition material is deposited on the quartz disk 110 to shorten the life of the quartz disk 110. That is, the minimum deposition material is deposited on the quartz disk 110 to extend the life of the quartz disk 110.

The chopper unit 200 includes a rotating plate 201, a first coupling member 202 to which the rotating plate 201 is coupled, and a second coupling member 203 to which the first coupling member 202 is detachably fastened. And a spring up-down member 204 for pressing the second coupling member 203 toward the first coupling member 202 such that the first coupling member 202 and the second coupling member 203 are coupled to each other. Include.

At least one exposure hole 201a exposing the quartz disk 110 is formed in the rotating plate 201. The rotating plate 201 is rotated by the second drive motor 302, and the deposition material is the quartz plate 110 only when the exposure hole 201a comes to the position of the circular opening 101a while the rotating plate 201 rotates. Is deposited on. Therefore, by reducing the amount of deposition material deposited on the quartz disk 110, it is possible to improve the life and sensitivity of the quartz disk 110.

The rotating plate 201 is coupled to the first coupling member 202 by a fixing bolt 202b. A pair of insertion portions 202a are provided on both sides of the lower portion of the first first coupling member 202 so as to face each other. The insertion part 202a is detachably coupled to the second coupling member 202 so that the first coupling member 202 and the second coupling member 203 are detachably coupled to each other.

The second coupling member 203 is coupled to the rotation shaft feedthrough 302b by a fixing bolt 203b. The second coupling member 203 is a cylindrical member provided with a pair of cutouts 203a on the outer circumference. The cutout 203a may have a substantially consonant 'b' shape so that the insertion portion 202a of the first coupling member 202 may be fastened along the cutout 203a. That is, when the insertion portion 202a of the first coupling member 202 is inserted and rotated along the cutout 203a, the coupling of the first coupling member 202 and the second coupling member 203 is completed.

The spring up-down member 204 provides an elastic force to keep the first coupling member 202 and the second coupling member 203 in close contact, and a spring slidably coupled to the outer circumference of the rotary shaft feedthrough 302b. The support 204b and the spring 204a interposed in the spring support 204b are included.

When the insertion portion 202a of the first coupling member 202 is inserted along the cutout 203a of the second coupling member 203 to press the spring support 204b, the spring support 204b is compressed and the insertion portion A space is secured between the first coupling member 202 and the second coupling member 203 so that the 202a can rotate along the cutout 203a. When the first coupling member 202 is rotated and then released, the spring up-down member 204 presses the second coupling member 203 again so that the coupling between the first coupling member 202 and the second coupling member 203 is performed. It stays in close contact.

As such, when the chopper unit 200 is coupled to the sensor body 100, the amount of deposition material deposited on the quartz disk 110 may be reduced. That is, since the circular opening 101a is periodically interrupted by the rotation of the rotating plate 201 in the deposition process, the amount of evaporation gas reaching the quartz disk 110 is reduced. This ultimately has the effect of increasing the life of the quartz disk 110. The amount of material deposited on the quartz disk 110 can be adjusted by adjusting the rotational speed of the rotating plate 201, the size of the exposure hole 201a, and the like.

Meanwhile, referring back to FIGS. 2 and 4, the first driving motor 301 for driving the rotating member 121 and the second driving motor for driving the rotating plate 201 may be disposed below the sensor body 100. 302, couplings 301a and 301b connected to the rotary shafts of the respective drive motors 301 and 302, a power supply line 303, and a case 300 accommodating the rotary shaft feedthroughs 301b and 302b. . And one side of the case 300 is connected to the outside of the vacuum chamber 1, the atmospheric pressure box 310 for maintaining the case 300 at atmospheric pressure is connected.

Here, the rotary shaft feedthroughs 301b and 302b rotate the rotational force from the driving motors 301 and 302 while maintaining a seal between the sensor body 100 maintained in a vacuum state and the case 300 maintained in an atmospheric pressure state. 201) or to the rotating member 121.

Hereinafter, the operation of the crystal crystal sensor device 10 according to an embodiment of the present invention will be described in detail.

The crystal crystal sensor device 10 according to an embodiment of the present invention is mounted in the vacuum chamber 1, and the deposition source 30 containing the deposition material for forming the thin film on the substrate 20 is supplied to an external power source. Heated by

The evaporation material evaporated from the evaporation source 30 is deposited on the substrate 20, and the evaporation material is also deposited on the surface of the quartz disk 110 exposed by the circular opening 101a among the quartz disks 110. . At this time, the rotating plate 201 rotates at a predetermined cycle and adjusts the amount of deposition material deposited on the quartz disk 110.

As the deposition material is deposited on the surface of the quartz disk 110, the frequency of the quartz disk 110 is changed, and the thickness of the thin film deposited on the substrate 20 is calculated by checking the change of the frequency.

When the quartz disk 110 reaches its end of life due to deposition and deterioration of the deposition material, the first driving motor 301 is driven to rotate the rotating member 121. The rotating member 121 rotates until the adjacent quartz disk 110 of the quartz disk 110 at the end of its life is located under the circular opening 101a. Accordingly, the first contact member 122, which is connected to the quartz disk 110 newly positioned under the circular opening 101a, contacts the second contact member 131. The quartz disk 110 starts to vibrate again by the AC voltage supplied by the second contact member 131. In this case, since the surface contact is made between the first contact member 122 and the second contact member 131, it is possible to stably supply an AC voltage.

On the other hand, the chopper unit 200, which extends the life of the quartz disk 110, presses the rotating plate 201 when the disassembly and assembly for maintenance is separated from the first coupling member 202 and the second coupling member 203. In this state, the insertion portion 202a of the first coupling member 202 may be rotated along the cutout 203a to be separated. Thus, the chopper unit 200 of the present embodiment is detached to the sensor body 100 by a so-called spring one-touch type (Spring One-Touch type), and thus requires a separate disassembly and assembly tool for fastening bolts as in the prior art. This prevents the misalignment of other parts during bolting and dismounting.

It will be apparent to those skilled in the art that the present invention described above is not limited to the described embodiments, and various modifications and variations can be made without departing from the spirit and scope of the present invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: sensor body 101: cover
101a: circular opening 110: crystal disk
120: first contact module 121: rotating member
122: first contact member 123: fixing bolt
130: second contact module 131: second contact member
132: elastic member 133: spring holder
133a: flow groove 134: spring
200: chopper unit 201: rotating plate
201a: exposure hole 202: first coupling member
202a: insertion portion 203: second coupling member
203a: incision 204: spring up-down member
204a: Spring 204b: Spring Support

Claims (13)

A sensor body including a plurality of quartz disks rotating in a vacuum chamber and sequentially exposed to a deposition source to measure the thickness of the deposition film, and a voltage supply unit applying an alternating voltage to the quartz disk exposed to the deposition source; And
It includes a chopper unit detachably coupled to the upper portion of the sensor body,
The voltage supply unit,
A first contact module driven to rotate by a drive motor; And
A second contact module having one side electrically connected to the first contact module and the other side connected to an AC voltage source,
The first contact module,
A rotating member in which the plurality of quartz disks are arranged in a circular shape; And
And a plurality of first contact members provided below the rotating member so as to be electrically connected to the plurality of quartz disks. delete delete The method of claim 1,
The second contact module,
A second contact member applying an AC voltage in surface contact with a first contact member connected to the quartz disk exposed to the deposition source among the quartz disks; And
And an elastic member for elastically pressing the second contact member when the first contact member sequentially contacts the second contact member. 5. The method of claim 4,
The elastic member
A spring holder into which the second contact member is inserted; And
And a spring interposed between the spring holder and the second contact member. 5. The method of claim 4,
And the first contact member and the second contact member each having a flat surface formed on opposite sides to allow surface contact. The method of claim 1,
The sensor body,
And a cover member having a circular opening formed such that only one of the plurality of quartz disks is exposed to the deposition source. The method of claim 1,
The chopper unit,
At least one exposed hole is formed, the rotating plate to rotate on top of the quartz disk so that only a portion of the deposition material evaporated from the deposition source is deposited on the quartz disk; And
And a coupling member coupled to the rotating plate such that the rotating plate is detached from the sensor body by a one-touch method. 9. The method of claim 8,
The coupling member
A first coupling member to which the rotating plate is coupled; And
And a second coupling member to which the first coupling member is detachably fastened. 10. The method of claim 9,
The second coupling member includes a cutout portion into which the insertion portion provided at the distal end of the first coupling member is inserted.
And a first coupling member and the second coupling member to rotate by inserting the insertion portion into the incision portion and rotating the insertion portion. The method of claim 10,
The chopper unit,
And a spring up-down member for urging the second coupling member toward the first coupling member to maintain the first coupling member and the second coupling member in a coupled state. 8. The method according to any one of claims 1 to 7,
Crystal crystal sensor device comprising a case connected to the lower portion of the sensor body and maintained at atmospheric pressure. The method of claim 12,
One side of the case crystal crystal sensor device comprising an atmospheric pressure box connected to maintain the case at atmospheric pressure.

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