KR101288131B1 - Glass deposition apparatus - Google Patents

Abstract

A substrate deposition apparatus is disclosed. A substrate deposition apparatus according to an embodiment of the present invention includes: a view port coupled to one side of a chamber body in which a deposition process for a substrate is performed therein, and observing the inside of the chamber body; And an optical sensor provided at the other side of the chamber body opposite the view port, the light emitting unit having a light emitting unit emitting light toward the view port for detecting the presence of the substrate, and a light receiving unit receiving the light reflected from the substrate. In addition, a diffuse reflection pattern for diffusely reflecting light from the emitter may be formed in the viewport to prevent light emitted from the emitter from being reflected by the viewport toward the light receiver. According to the present invention, it is possible to detect the presence or absence of the substrate with a simple and efficient structure, as well as to improve the reliability of the detection result.

Description

Substrate deposition apparatus

The present invention relates to a substrate deposition apparatus, and more particularly, to a substrate deposition apparatus capable of detecting the presence or absence of a substrate as a simple and efficient structure and improving the reliability of the detection result.

Flat panel displays and semiconductor substrates, such as liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting diodes (OLEDs), are released as products through various processes such as thin film deposition and etching.

Among various processes, the deposition process of the substrate is performed by the substrate deposition apparatus. Substrate deposition processes can be divided into two categories.

One is Chemical Vapor Deposition (CVD), and the other is Physical Vapor Deposition (PVD), which is widely used in accordance with current process characteristics.

Chemical vapor deposition is a method in which plasma is formed by an external high frequency power source so that silicon-based compound ions having high energy are ejected from a showerhead through an electrode and deposited on a substrate.

In contrast, physical vapor deposition, which can be represented by a sputter device, is a method in which sufficient energy is applied to the ions in the plasma to impinge on the target and then ejected from the target, i.e., sputtered target atoms are deposited on the substrate.

Of course, physical vapor deposition includes a method such as E-Beam, Evaporation, and Thermal Evaporation in addition to the above-mentioned sputter method, but the sputtering method will be described below. The sputtering apparatus will be described as a substrate deposition apparatus.

The conventional sputtering apparatus has a chamber body through which a sputtering process is performed, and a target as a sputter source for providing a deposition material toward a glass placed at a deposition position within the chamber body, and the substrate is introduced into the chamber body. If so, a deposition material is provided from the target towards the substrate being transferred to deposit the surface of the substrate.

On the other hand, the deposition process of the substrate as described above should be performed when the substrate is present in the chamber body, if the deposition process in the absence of the substrate not only causes a cost loss but also increases the contamination in the chamber body.

Therefore, a sensor for detecting the presence of a substrate is applied to the sputter device. In the prior art as a sensor for detecting the presence of the substrate, a retroreflective light or laser sensor has been mainly used.

When the retroreflective sensor is applied, a reflection plate is disposed on the opposite side of the light source and the light source to detect the presence or absence of the substrate by using a light quantity difference from which light from the light source is reflected by the reflection plate and returned. In this case, the reflector is mainly installed in a view port having a window shape for observing the inside of the chamber body.

However, in the prior art of applying such a retroreflective sensor to a sputtering apparatus in which a deposition process is performed while the substrate is moved, the amount of detected light is not constant due to mechanical shaking during transportation of the substrate. As the difference between the amount of light and the detecting light fluctuates severely, there is a problem in that it is not reliable to detect the presence or absence of a substrate.

In addition, in the prior art, the reflector must be mounted on the viewport, which inevitably causes the viewport to be shielded, which causes a problem of losing the viewport's original function of visually observing the inside of the chamber body.

Therefore, it may be considered to apply a diffusely reflective sensor that has advantages in many areas than a retroreflective sensor. The diffuse reflection sensor is a sensor that detects the presence or absence of a substrate based on a zero amount of reflected light.

However, in the case of simply applying a diffusely reflective sensor instead of a retroreflective sensor, the light reflected from the view port opposite to the light source is detected even if there is no substrate or is reflected from the inner wall of the polished chamber body. Since there is a high possibility of detecting the presence of the substrate by detecting light, if the distance between the light source and the view port is very long, that is, the problem of applying to a very large chamber over a distance where the intensity of light reflected from the view port is very small is insufficient. Is generated.

In addition, when there is external lighting outside the chamber, such as sunlight or lighting, this effect may cause a change in the amount of reference light, which may cause a malfunction, and the vacuum and the atmospheric pressure of the lid (lid) opened. In the (ATM) state, there is a problem in that the amount of reference light is wrong and reliability is lowered.

Therefore, the technical problem to be achieved by the present invention is to provide a substrate deposition apparatus that can detect the presence of the substrate as a simple and efficient structure, as well as improve the reliability of the detection result.

According to an aspect of the present invention, the deposition process for the substrate is coupled to one side of the chamber body that proceeds therein, a view port (View Port) for observing the interior of the chamber body; And a light emitting part emitting light toward the view port to detect the presence of the substrate, and a light receiving part receiving light reflected from the substrate and provided on the other side of the chamber body opposite the view port. And an optical sensor, wherein the view port is provided with a diffuse reflection pattern for diffusely reflecting light from the light emitting unit so that light emitted from the light emitting unit is reflected by the view port and prevented from being directed toward the light receiving unit. May be provided.

The view port may be made of transparent or translucent glass or plastic, and the diffuse reflection pattern may be formed on at least one surface of the view port by a surface treatment method of the view port.

The surface treatment method may be a sand blast (sand blast) method.

The diffuse reflection pattern may be formed on both surfaces of the viewport.

The controller may further include a controller configured to determine whether the substrate is present based on the sensing signal from the optical sensor.

The optical sensor may be coupled to an outer wall of the chamber body by a sensor support module, and an optical passage hole may be formed in the chamber body in which the optical sensor is located.

The sensor support module has a donut shape and is detachably coupled to an outer wall of the chamber body; A light passing window coupled to the inside of the module body and communicating with the light passing holes; And a sensor support bracket for supporting the optical sensor in a state where one end is connected to the module body.

It may further include a view port support bracket that is detachably coupled to the chamber body while supporting the view port.

A pair of targets provided in an upper region of the chamber body to provide a deposition material toward the substrate; And a pair of magnet units provided on one side of the pair of targets and generating a magnetic field for deposition between the substrate and the view port, wherein the view port corresponds to any one of the targets. It may be disposed between one magnet unit and another target and another magnet unit corresponding thereto.

The optical sensor may be a diffuse reflective sensor, and the substrate deposition apparatus may be a sputter device.

According to the present invention, it is possible to detect the presence or absence of the substrate with a simple and efficient structure, and to improve the reliability of the detection result.

1 is a structural diagram of a sputtering apparatus as a substrate deposition apparatus according to a first embodiment of the present invention.
FIG. 2 is a plan view of the magnet unit shown in FIG. 1.
3 is an arrangement state diagram between the magnet unit and the target.
4 is a layout view between the light sensor and the view port for the case where the substrate is present.
FIG. 5 is a layout view of an optical sensor and a viewport in a case where there is no substrate.
6 is an enlarged perspective view of the sensor support module shown in FIG. 1.
7 is a side structural view of a viewport area in the sputtering apparatus as the substrate deposition apparatus according to the second embodiment of the present invention.
8 is a plan view of the viewport area in the sputtering apparatus as the substrate deposition apparatus according to the third embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

Before describing the drawings, the substrate to be described below may be a flat display substrate such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED) Hereinafter, the terms "substrate" and "substrate" are used in common.

In the substrate deposition apparatus, there are various apparatuses for performing chemical vapor deposition (CVD) and physical vapor deposition (PVD). Hereinafter, a sputter apparatus will be described as an example.

1 is a structural diagram of a sputtering apparatus as a substrate deposition apparatus according to a first embodiment of the present invention, FIG. 2 is a planar structural diagram of the magnet unit shown in FIG. 1, and FIG. 3 is a layout diagram of a magnet unit and a target.

As shown in these figures, the sputtering apparatus as the substrate deposition apparatus according to the present embodiment is coupled to one side of the chamber body 110, in which the deposition process for the substrate proceeds therein, and the chamber body 110. View port (170, Observation) for observing the interior of the light, the optical sensor 180 provided on the other side of the chamber body 110 opposite the view port 170 to detect the presence of the substrate, and the optical sensor 180 A controller (not shown) for controlling to determine the presence or absence of the substrate based on the sensing signal from the).

Referring to Figure 1 looks at the structure of the chamber body (110). A substrate transfer support 130 is provided inside the chamber body 110 to support the transfer of the substrate, and an upper region of the chamber body 110 is provided toward the substrate placed at the deposition position on the substrate transfer support 130. A target 140 is provided as a sputter source that provides. And a magnet unit 150 for generating a magnetic field (see FIG. 3) for deposition between the substrate and one side of the target 140 is provided.

The chamber body 110 is a part forming the exterior wall. During the deposition process on the substrate, the interior of the chamber body 110 is sealed and maintains a high vacuum state. To this end, a gate valve 111 is provided at one side of the lower region of the chamber body 110, and a vacuum pump 112 is coupled to the gate valve 111 region.

Thus, when the vacuum pressure from the vacuum pump 112 is generated in the state in which the gate valve 111 is opened, the interior of the chamber body 110 can maintain a high vacuum state, in the opposite operation, the chamber body 110 Inside maintains atmospheric (ATM) state.

A substrate inlet 113a through which a substrate is introduced into the chamber body 110 is formed at one side wall of the chamber body 110, and a chamber body (another body) is formed at the other side wall of the chamber body 110 opposite to the substrate inlet 113a. A substrate outlet 113b through which the substrate from 110 is drawn out is formed. Separate gate valves (not shown) are also provided at the substrate inlet 113a and the substrate outlet 113b to open and close the substrate inlet 113a and the substrate outlet 113b.

A cover 114 coupled to the chamber body 110 is provided in an upper region of the chamber body 110 to surround the target 140 and the magnet unit 150 regions from the outside.

In the present exemplary embodiment, since the two targets 140 and the magnet unit 150 are provided in the chamber body 110, the cover 114 may be formed in two regions in which the target 140 and the magnet unit 150 are located. It takes the form raised to the top of the chamber body (110).

In this case, the covers 114 are hermetically connected to each other by the leads 115, lid. That is, the leads 115 are disposed between the pair of targets 140 and the magnet unit 150, and the view port 170 may be provided at the leads 115 at these positions. Of course, since the scope of the present invention is not limited thereto, the target 140 and the magnet unit 150 may be provided one by one.

The substrate transfer support unit 130 is disposed in the chamber body 110 to support the substrate and simultaneously transfer the substrate introduced into the substrate inlet 113a to the substrate outlet 113b.

The substrate transfer support 130 may be applied by a roller. In view of the fact that the inside of the chamber body 110 maintains a high temperature, the substrate transfer support 130 may be made of a material having excellent heat resistance and durability. .

The lower region of the substrate transfer support 130 is provided with a heater 131 for heating the substrate placed on the substrate transfer support 130, in particular, the deposition surface of the substrate.

The heater 131 serves to heat the substrate to a few hundred degrees or more so that the deposition material provided from the target 140 can be deposited on the substrate well. The heater 131 may have a size that is similar to or larger than the size of the substrate so that the front surface of the substrate may be evenly and rapidly heated.

The target 140 serves as a sputter source provided in the upper region of the chamber body 110 to provide a deposition material toward the substrate placed in the deposition position on the substrate transfer support 130.

Typically, the region of the target 140 and the magnet unit 150 form a cathode and the region of the substrate forms an anode. In this embodiment, the target 140 is provided with a planar target 140 that provides a deposition material from the fixed position to the substrate in the lower region. However, the target 140 may be a curved target having a round surface or a rotating target rotated about a central axis.

In order to install the target 140 and also to install the magnet unit 150 in an airtight manner, a cathode backing plate 120 is provided in a form surrounding the magnet unit 150.

The cathode backing plate 120 is connected to the power (123, power) of the RF or DC power source. Between the cathode backing plate 120 and the cover 114, there is provided a cathode insulator 121 which hermetically seals them.

In this structure, the target 140 is coupled to one side of the surface of the cathode backing plate 120 facing the substrate, and the deposition material is directed toward the cathode backing plate 120 between the chamber body 110 and the cathode backing plate 120. A shield 122 for blocking is provided. The shield 122 may be coupled to the cover 114 in a manner surrounding the outer region of the cathode backing plate 120 except for the target 140. The cooling water inlet pipe 124 and the cooling water discharge pipe 125 are connected to the inside of the cathode backing plate 120 outside the chamber body 110 to cool the target 140 region.

The magnet unit 150 is disposed on one side of the target 140, that is, inside the cathode backing plate 120, and serves to make the deposition well by generating a magnetic field (see FIG. 3) for deposition between the substrate and the substrate. Do it.

2 and 3, the magnet unit 150 may include a plurality of magnets 161 to 163 and a base pole plate forming a base for the plurality of magnets 161 to 163. 164 is provided.

If the position of the magnets 161 to 163 can be adjusted with respect to the base pole plate 164, that is, if the distance between the target 140 and the magnets 161 to 163 is adjustable, the strength of the magnetic field may be changed. Can improve the deposition efficiency.

This is accomplished by coupling the individual pole plates 165 to the magnets 161-163 and assembling the individual pole plates 165 with adjustment screws 166 and 167 relative to the base pole plate 164 as shown in FIG. It is easy to implement.

In this case, it is possible to adjust the protruding length of the magnets 161 to 163 relative to the base pole plate 164 by loosening or tightening the adjusting screws 166 and 167, and consequently between the target 140 and the magnets 161 to 163. As the distance is adjusted, the strength of the magnetic field can be changed.

Of course, if the distance between the target 140 and the magnets (161 ~ 163) can be adjusted as shown in Figure 3 is expected to further improve the deposition efficiency, but the magnets (161 ~ 163) without adjusting screws (166, 167) The structure fixed to the base pole plate 164 is also sufficiently applicable.

4 is an arrangement state diagram between the optical sensor and the viewport when the substrate is present, FIG. 5 is an arrangement state diagram between the light sensor and the viewport when the substrate is not present, and FIG. An enlarged perspective view.

Referring to these drawings, as described above, the upper region of the chamber body 110, that is, the lid 115 is provided with a view port 170, and the chamber body 110 opposite the view port 170 is provided. An optical sensor 180 is provided in the lower region.

Of course, the view port 170 may be provided in the lower region of the chamber body 110, and the optical sensor 180 may be provided in the upper region of the chamber body 110.

The view port 170 coupled to the lid 115 is a kind of internal viewing window provided for observing the interior of the chamber body 110. The view port 170 may be made of transparent or translucent glass or plastic material.

Given that the inside of the chamber body 110 is a high temperature / high pressure, the view port 170 may be made of a tempered glass or a reinforced plastic material. The view port 170 may be detachably coupled to the chamber body 110 by the view port support bracket 171.

The optical sensor 180 is provided in the lower region of the chamber body 110 opposite the view port 170 to detect the presence of the substrate.

The installation structure of the optical sensor 180 will be described first with reference to FIG. 6. Considering that the inside of the chamber body 110 is a high temperature / high pressure, since the optical sensor 180 cannot be installed inside the chamber body 110, the optical sensor 180 is connected to the chamber by the sensor support module 190. It is coupled to the outer wall of the body 110. In this case, an optical passage hole 110a is formed in the chamber body 110 in which the optical sensor 180 is located.

The sensor support module 190 has a donut shape and is detachably coupled to the outer wall of the chamber body 110 by a wrench bolt B, and is coupled to the inside of the module body 191 and is light. It includes a light passage and window 192 communicating with the passage opening (110a), and a sensor support bracket (193) for supporting the optical sensor 180 in a state where one end is connected to the module body (191).

After fabricating the sensor support module 190 including the module body 191, the light passing window 192 and the sensor support bracket 193, the sensor support bracket 190 of the sensor support module 190 When combining the optical sensor 180, there is an advantage that the installation and maintenance work of the optical sensor 180 is convenient.

In FIG. 6, the rod of the main surface of the optical sensor 180 is a power supply unit 195 for supplying power to the optical sensor 180.

As such, the optical sensor 180 disposed on the outer wall of the chamber body 110 through the sensor support module 190 in the state of being coupled to the sensor support module 190 may operate the view port 170 to detect the presence or absence of a substrate. A light emitting portion 181 for emitting light toward the substrate and a light receiving portion 182 for receiving light reflected by the substrate and returned.

In this embodiment, the optical sensor 180 is applied as a diffuse reflective sensor having an advantage in many parts than the retroreflective sensor which has been widely used. Diffuse reflection sensors are a type of laser sensor.

When the diffuse reflection sensor is applied as the light sensor 180 as described above, the light emitted from the light emitter 181 is prevented from being reflected by the view port 170 and directed toward the light receiver 182 in the view port 170. A diffuse reflection pattern 172 that diffusely reflects light from the light emitting portion 181 is formed.

As described above, in view of the fact that the view port 170 is made of transparent or translucent glass or plastic material, the diffuse reflection pattern 172 is formed by the surface treatment of the view port 170. It may be formed on one surface. In this case, the diffuse reflection pattern 172 may be formed in all sections of the view port 170.

The surface treatment method for forming the diffuse reflection pattern 172 on one surface of the view port 170 may be various. In this embodiment, a sand blast method is applied.

For reference, the sand blast surface treatment method is a method of spraying sand with compressed air on the surface of metal products such as castings and glass or plastic products such as the viewport 170. When sand is blown with compressed air, fine particles of concave-convex surface are formed while foreign matter particles attached to the surface drop off. There are two methods for spraying sand, which are compressed air and centrifugal force.

As described above, when one surface of the view port 170 is processed by the sand blast surface treatment method, a diffuse reflection pattern 172 having a fine feature pattern is formed on one surface of the view port 170 as shown in FIGS. 4 and 5. The diffuse reflection pattern 172 diffuses the light emitted from the light emitting unit 181 of the optical sensor 180 and enters straight into the light at various angles so that the light from the light emitting unit 181 receives the light receiving unit of the optical sensor 180. In other words, the amount of light incident on the light receiving unit 182 is prevented from entering 182.

When the diffuse reflection pattern 172 is formed on one surface of the view port 170 and the optical sensor 180 is disposed on the opposite side of the view port 170 as shown in the present embodiment, when there is a substrate as shown in FIG. 4. A portion of the light emitted from the light emitting unit 181 of the optical sensor 180 is reflected by the substrate and directed toward the light receiving unit 182 of the optical sensor 180.

As such, when the light incident on the light receiving unit 182 exists in a predetermined range or more, the controller (not shown) connected to the optical sensor 180 determines that the substrate exists based on the detection signal, and then the deposition process may proceed. have.

However, when there is no substrate as shown in FIG. 5, after all of the light emitted from the light emitting unit 181 of the optical sensor 180 hits the diffuse reflection pattern 172 of the view port 170, the diffuse reflection pattern 172 As the light is diffusely reflected in various directions, the amount of light incident on the light receiving unit 182 becomes zero. That is, as illustrated in FIG. 5, the amount of light reflected from the diffuse reflection pattern 172 of the viewport 170 in the absence of the substrate and reflected is zero.

As such, even if there is no light incident on the light receiving unit 182 or if there is diarrhea, the controller (not shown) connected to the optical sensor 180 determines that there is no substrate based on the detection signal. Therefore, the deposition process does not proceed in this state.

As in the present embodiment, the application of the diffuse reflection sensor having advantages in more parts than the conventional retroreflective sensor generates the following advantages.

First, in case of using a conventional retroreflective sensor, other accessory amplifiers (AMP) should be installed to increase the sensitivity of the sensor. However, in the case of the diffuse reflective sensor of the present embodiment, since the sensor itself is detected, the additional cost is required. This does not occur.

Second, since the amount of light incident on the diffuse reflection type sensor in the absence of the substrate is zero as shown in FIG.

Third, since the diffuse reflection pattern 172 may be provided in a minute shape on one surface of the view port 170, it is not necessary to block the view port 170 with a reflector as before, and thus the view port 170 is inherently It can provide an internal observation function.

Fourth, since the diffuse reflection pattern 172 may be formed on one surface of the view port 170, the distance between the light sensor 180 and the view port 170 may not be longer than necessary. Therefore, it can be applied to a small chamber as well as a very large chamber.

Fifth, it is possible to receive less influence from the external light source, so that better sensitivity can be obtained, and the same reference light quantity can be obtained at atmospheric pressure (ATM) state and vacuum state without a separate device, thereby increasing the reliability of discriminating the presence or absence of a substrate. have.

The operation of the sputtering apparatus having such a configuration will now be described.

Before the deposition process, the presence of the substrate is determined. That is, light is generated from the light emitting unit 181 of the photosensor 180 and directed toward the view port 170.

If there is no substrate as shown in FIG. 5, after all of the light emitted from the light emitting unit 181 of the optical sensor 180 hits the diffuse reflection pattern 172 of the view port 170, the diffuse reflection pattern 172 As the light is diffusely reflected in various directions, the amount of light incident on the light receiving unit 182 becomes zero. As such, even if there is no light incident on the light receiving unit 182 or if there is diarrhea, the controller (not shown) connected to the optical sensor 180 determines that there is no substrate based on the detection signal. Therefore, the deposition process does not proceed in this state.

However, when there is a substrate as shown in FIG. 4, that is, when the substrate is introduced through the substrate inlet 113a of the chamber body 110 and disposed at the deposition position on the substrate transfer support 130, the light emitting unit of the optical sensor 180 is disposed. A portion of the light emitted from 181 is reflected by the substrate to be directed to the light receiving unit 182 of the optical sensor 180.

If light incident on the light receiver 182 is present in a predetermined range or more, a controller (not shown) connected to the optical sensor 180 determines that the substrate exists based on the detection signal, and then a deposition process may proceed. .

When the deposition process is disclosed, for example, argon (Ar) gas is filled into the chamber body 110, and the chamber body 110 maintains high vacuum while its interior is sealed.

When a negative voltage is applied from the power 123 to the target 140 in this state, the electrons emitted from the target 140 collide with the argon (Ar) gas to ionize the argon (Ar) gas.

The ionized argon (Ar) gas is accelerated in the direction of the target 140 by a potential difference to collide with the surface of the target 140. At this time, atoms of the target 140, that is, a deposition material are generated from the target 140, The deposition process of the substrate proceeds while falling on the deposition surface.

When the deposition process is completed, the vacuum in the chamber body 110 is released and the substrate outlet 113b is opened, and the substrate is taken out through the substrate outlet 113b, and a new substrate is introduced into the substrate inlet 113a to perform the deposition process. You will proceed.

According to the sputtering apparatus of this embodiment having such a structure and operation, it is possible to detect the presence or absence of the substrate with a simple and efficient structure as well as to improve the reliability of the detection result.

7 is a side structural view of a viewport area in the sputtering apparatus as the substrate deposition apparatus according to the second embodiment of the present invention.

In this figure, diffuse reflection patterns 272a and 272b are formed on both surfaces of the viewport 270. In this case, light may be diffusely reflected by hitting the first diffuse reflection pattern 272a, or may be diffusely reflected by hitting the second diffuse reflection pattern 272b, and the efficiency of semi-reflective reflection may be further increased.

8 is a plan view of the viewport area in the sputtering apparatus as the substrate deposition apparatus according to the third embodiment of the present invention.

In this figure, the diffuse reflection pattern 372 is provided only locally in the center region of the viewport 370. The viewport 370 having such a structure can also be applied. In this case, it is preferable to arrange the light emitting unit 181 (see FIG. 1) of the light sensor 180 (see FIG. 1) in the vertically downward region of the diffuse reflection pattern 372. something to do.

Although the present embodiment has been described in detail with reference to the drawings, the scope of the present invention is not limited to the above-described drawings and descriptions.

The above embodiments all relate to a horizontal substrate deposition apparatus in which the substrate is disposed in a horizontal state and deposited, but the present invention also applies to a vertical substrate deposition apparatus in which the substrate is disposed and deposited in a vertical state (including an inclined angle). The scope of rights may apply.

When the substrate is placed in such a vertical state, unlike in the drawing of FIG. 1, the view port will be disposed in front or rear of the chamber body of the vertical substrate deposition apparatus, and an optical sensor will be disposed opposite the view port. Even if the structure is applied, it can provide the effect of the present invention.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

110: chamber body 111: gate valve
112: vacuum pump 114: cover
115: lead 120: cathode backing plate
121: cathode insulator 122: shield
123: power 130: substrate transfer support
140: target 150: magnet unit
170: viewport 171: viewport support bracket
172: diffuse reflection pattern 180: light sensor
181: light emitting unit 182: light receiving unit
190: sensor support module 191: module body
192: light passage window 193: sensor support bracket

Claims (10)

A view port coupled to one side of the chamber body in which the deposition process for the substrate proceeds therein, and observing the inside of the chamber body; And
A light emitting part emitting light toward the view port to detect the presence of the substrate, and a light receiving part receiving light reflected from the substrate and provided on the other side of the chamber body opposite the view port; Including an optical sensor,
The view port is provided with a diffuse reflection pattern that diffusely reflects the light from the light emitting portion so that the light emitted from the light emitting portion is reflected by the view port and blocked toward the light receiving portion,
The optical sensor is coupled to the outer wall of the chamber body by a sensor support module, the substrate deposition apparatus in which a light passage is formed in the chamber body in which the optical sensor is located. The method of claim 1,
The viewport is made of transparent or translucent glass or plastic material,
The diffuse reflection pattern is formed on at least one surface of the view port by the surface treatment method of the view port. The method of claim 2,
The surface treatment method is a substrate deposition apparatus of a sand blast (sand blast) method. The method of claim 2,
The diffuse reflection pattern is formed on both surfaces of the viewport. The method of claim 1,
And a controller for controlling the presence or absence of the substrate based on the sensing signal from the optical sensor. delete The method of claim 1,
The sensor support module,
A module body having a donut shape and detachably coupled to an outer wall of the chamber body;
A light passing window coupled to the inside of the module body and communicating with the light passing holes; And
And a sensor support bracket for supporting the optical sensor in a state where one end is connected to the module body. The method of claim 1,
And a view port support bracket detachably coupled to the chamber body while supporting the view port. The method of claim 1,
A pair of targets provided in an upper region of the chamber body to provide a deposition material toward the substrate; And
It is provided on one side of the pair of target, and further comprises a pair of magnet unit for generating a magnetic field for deposition between the substrate,
And the view port is disposed between one target and one magnet unit corresponding thereto, and the other target and another magnet unit corresponding thereto. The method of claim 1,
The optical sensor is a diffuse reflection sensor,
The substrate deposition apparatus is a sputtering apparatus.

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