KR101287658B1 - Lighting apparatus using optosemiconductor - Google Patents

Abstract

The present invention relates to a lighting apparatus using an optical semiconductor that can generate light in the form of a surface, and includes a luminaire frame, a power supply pattern, and at least one lighting module. The luminaire frame includes first and second illumination supports arranged in positions with openings in the center and facing each other. The power application pattern is formed on at least one of the first and second illumination supports. The lighting module is disposed over the first and second lighting supports to emit light through the opening of the luminaire frame and is in electrical contact with the power application pattern. As such, as the illumination module is disposed over the first and second illumination supports such that light is emitted through the opening of the luminaire frame, the illumination module is freely movable on the first and second illumination supports.

Description

Lighting device using optical semiconductors {LIGHTING APPARATUS USING OPTOSEMICONDUCTOR}

The present invention relates to a lighting apparatus using an optical semiconductor, and more particularly to a lighting apparatus using an optical semiconductor capable of generating a planar light.

Recently, attention has been paid to efficient energy consumption due to continuous increase in electric bills, power shortage due to limited power transmission, and depletion of fossil fuel. Accordingly, LED (Light Emitting Diode) lighting has emerged as an alternative as a lighting device.

There are various types of LED lights, such as bulbs, tubes, downlights, street lights, and surface lighting, among which the surface lighting is installed on the ceiling of an office or home to generate light in the form of a surface. A general LED surface light is composed of a printed circuit board in which LED elements are regularly arranged at regular intervals, a frame on which the printed circuit board is mounted, and a luminaire for receiving and fixing the frame.

However, since the printed circuit board is fixedly mounted to the frame, it is difficult to control various types of light quantity or light direction. In particular, when the LED surface lighting is fixed to the ceiling, all the characteristics such as constant irradiation angle, constant luminous flux, constant light distribution, constant illuminance has a disadvantage that the user can not change without any change.

In addition, the LED surface lighting may further include a louver made of an opaque acrylic or aluminum lattice to prevent glare, in which case there is a disadvantage in that the light efficiency is lowered and power consumption is increased to obtain higher illuminance.

Accordingly, the present invention has been made in view of the above problems, and the present invention provides a lighting apparatus using an optical semiconductor capable of adjusting the amount of light and the direction of irradiation through free movement and replacement of the lighting module.

Lighting device using an optical semiconductor according to an aspect of the present invention includes a luminaire frame, a power application pattern and at least one lighting module.

The luminaire frame has first and second illumination supports, with openings formed in the center thereof, arranged in positions facing each other. The power application pattern is formed on at least one of the first and second illumination supports. The illumination module is disposed over the first and second illumination supports to emit light through the opening and is in electrical contact with the power application pattern.

The lighting module may include a driving substrate, at least one optical semiconductor element, and an electrode terminal part. The drive substrate is disposed over the first and second illumination supports. The optical semiconductor element is disposed on the driving substrate to emit light through the opening. The electrode terminal portion is disposed on and electrically connected to the driving substrate so as to face at least one of the first and second illumination supports, and is in electrical contact with the power application pattern.

The power application pattern may include a first application pattern transferring a first voltage and a second application pattern transferring a second voltage different from the first voltage, and the electrode terminal part may be electrically connected to the first application pattern. The first electrode terminal may be in contact with each other, and the second electrode terminal may be in electrical contact with the second application pattern. In this case, the first and second application patterns may be adjacent to each other in parallel to each other to have a shape extending in the longitudinal direction of the first or second illumination support.

The power supply pattern may be a pair formed on the first and second lighting support, the electrode terminal portion may be formed in a pair to be in electrical contact with the pair of power supply pattern, the pair One of the power supply patterns may transfer the first voltage, and the other may transfer the second voltage.

The lighting module may further include a module housing configured to receive and fix the driving substrate. The electrode terminal portion may have elasticity to improve contact force with the power application pattern.

The optical semiconductor device may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electro-luminescence device (EL). Alternatively, the optical semiconductor device may include light emitting diodes driven by an AC power source.

The driving substrate may include first and second crossing substrate portions disposed on the first and second lighting supports to cross each other. Alternatively, the driving substrate is an illumination substrate portion disposed in the opening to form a light of a predetermined illumination pattern, the first support substrate portion one side is connected to the illumination substrate portion and the other side is disposed on the first illumination support portion And a second support substrate part connected to the illumination substrate part on one side and disposed on the second illumination support part on the other side.

The lighting apparatus may further include a power applying circuit board disposed on at least one of the first and second lighting support units and having the power applying pattern formed thereon.

The power application pattern may be formed in a power application pattern groove formed in at least one of the first and second lighting supports.

The lighting apparatus may further include a power supply module electrically connected to the power applying pattern to provide power.

The luminaire frame may further include first and second connection frame portions connecting both ends of the first and second lighting supports, respectively, and the power supply module is any one of the first and second connection frame portions. It can be placed on.

The lighting apparatus may further include an optical module coupled to the lighting module and disposed in the opening and configured to change the characteristic of the light emitted from the lighting module and to emit the light. In this case, a reflective layer may be formed on one side of the optical module to reflect light.

The illumination module may have a shape extending in one direction so as to span the first and second illumination support parts, and the optical module may have a rectangular parallelepiped shape extending in the one direction.

The optical module may have a shape in which one end is concave or protrudes convexly. Alternatively, the optical module may have a shape in which the width increases or decreases away from the illumination module.

The lighting device may further include a module moving unit coupled to the lighting module to move the lighting module in the longitudinal direction of the first or second lighting supports.

The module moving unit includes a bracket coupled to one end of the lighting module, a motor attached to and fixed to a side of the bracket, a pinion gear coupled to the shaft of the motor, and the first or second illumination support to be engaged with the pinion gear. It may include a rack gear disposed on the side of the.

The lighting apparatus may further include a module moving control unit for controlling the module moving unit in a wired or wireless manner so that the lighting module is moved.

According to the lighting apparatus using the optical semiconductor, as the lighting module is disposed over the first and second lighting supports to emit light through the opening of the luminaire frame, the lighting module is the first and second lighting It is free to move on the supports.

In addition, the total illuminance of the lighting apparatus may be adjusted by adjusting the number of the lighting modules, and the light emitted from the lighting apparatus may be concentrated to one side by moving the lighting modules to one side. In addition, the shape of the lighting module may be changed to form light of various optical patterns.

1 is a perspective view of a lighting apparatus using an optical semiconductor according to a first embodiment of the present invention.
FIG. 2 is an enlarged perspective view of portion A of FIG. 1.
3 is a view illustrating one end surface of the lighting apparatus of FIG. 1.
4 illustrates cross-sectional views of various modified embodiments of the optical module of the lighting apparatus of FIG. 1.
5 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the second embodiment of the present invention.
6 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the third embodiment of the present invention.
7 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the fourth embodiment of the present invention.
8 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the fifth embodiment of the present invention.
9 is a view showing one end surface of the optical module of the lighting apparatus using the optical semiconductor according to the sixth embodiment of the present invention.
10 is a plan view of a part of a lighting apparatus using an optical semiconductor according to a seventh embodiment of the present invention.
FIG. 11 is a plan view illustrating a part of a lighting apparatus using an optical semiconductor according to an eighth embodiment of the present invention.
12 is a perspective view illustrating a part of a lighting apparatus using an optical semiconductor according to a ninth embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, It will be possible. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

≪ Example 1 >

1 is a perspective view of a lighting apparatus using an optical semiconductor according to an embodiment of the present invention, Figure 2 is a perspective view showing an enlarged portion A of Figure 1, Figure 3 shows one end surface of the lighting device of Figure 1 4 is a cross-sectional view of various modified embodiments of the optical module of the lighting apparatus of FIG. 1.

1 to 4, the lighting apparatus using the optical semiconductor according to the present embodiment is a luminaire frame 100, power supply pattern 200, lighting module 300, optical module 400 and power supply module ( 500).

The luminaire frame 100 includes a frame body with an opening 102 in the center. In this case, the frame body may be a circular frame or a polygonal frame having the opening 102. For example, the frame body may be a rectangular frame having the opening 102. Specifically, the frame body may include first and second lighting supports 110 and 120 facing each other in parallel, and It may include first and second connection frame parts 130 and 140 connecting both ends of the first and second lighting support parts 110 and 120. In this case, a power support 150 for disposing the power supply module 500 may be formed in any one of the first and second connection frame parts 130 and 140.

The power application pattern 200 is formed on at least one of the first and second illumination support parts 110 and 120. That is, as shown in the drawing, the power applying pattern 200 may be formed on the first and second lighting support parts 110 and 120, respectively, and among the first and second lighting support parts 110 and 120. Any one, for example, may be formed only on the first lighting support 110.

In this embodiment, the power applying pattern 200 may be formed on a power applying circuit board 250 disposed on the first lighting support parts 110. At this time, the power supply circuit board 250 may have a shape extending in the longitudinal direction of the first lighting support 110, the coupling groove 252 on one side or both sides of the power supply circuit board 250. This may be formed, the coupling protrusion 112 is inserted into the coupling groove 252 may be formed on the first lighting support (110).

The power application pattern 200 may include a first application pattern 210 for transferring a first voltage and a second application pattern 220 for transferring a second voltage different from the first voltage. In this case, the first and second application patterns 210 and 220 are adjacent to each other in parallel to each other and are formed on the power supply circuit board 250 in a shape extending in the longitudinal direction of the first lighting support parts 110. Can be.

The lighting module 300 is disposed on the first and second lighting support (110, 120) so that at least one of the light is emitted through the opening 102 of the luminaire frame 100, the power is applied In electrical contact with the pattern 200. For example, the plurality of lighting modules 300 may be spaced apart from each other and disposed on the first and second lighting supports 110 and 120, respectively, and may have a shape extending in one direction. .

Each of the lighting modules 300 may include a driving substrate 310, at least one optical semiconductor device 320, an electrode terminal unit 330, and a module housing 340.

The driving substrate 310 extends long in the one direction and is disposed on the first and second lighting supports 110 and 120. A plurality of wires (not shown) are formed on the driving substrate 310 to transfer power.

At least one optical semiconductor element 320 is disposed on the driving substrate 310 to generate light. In the present exemplary embodiment, the optical semiconductor device 320 may be disposed to be spaced apart from each other along the driving substrate 310 to be electrically connected to the wirings. The optical semiconductor device 320 may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electro-luminum emission device (EL). can do.

The electrode terminal part 330 is disposed on the driving substrate 310 to face at least one of the first and second lighting support parts 110 and 120. One end of the electrode terminal part 330 is electrically connected to wires of the driving substrate 310, and the other end of the electrode terminal part 330 opposite to the one end is in electrical contact with the power application pattern 200. . In this case, the electrode terminal part 330 may have elasticity to improve contact force with the power application pattern 200. On the other hand, the electrode terminal portion 330 is the first electrode terminal 332 in electrical contact with the first application pattern 210, and the second electrode terminal 334 in electrical contact with the second application pattern 220. ) May be included.

The module housing 340 accommodates and fixes the driving substrate 310. In detail, the module housing 340 has a shape extending in one direction to accommodate the driving substrate 310. On the other hand, the module housing 340 may be omitted in some cases, or may have a shape surrounding the outer portion of the drive substrate 310 sieve the bottom portion is removed.

The optical module 400 is combined with the lighting module 300 is disposed in the opening 102 of the luminaire frame 100, and changes the characteristics of the light emitted from the lighting module 300 to emit. Specifically, the optical module 400 may be a light guide plate having a rectangular parallelepiped shape extending in one direction to correspond to the driving substrate 310. Alternatively, the optical module 400 may be various optical means, for example, an optical lens or a diffusion plate, which may improve the characteristics of the light generated by the optical semiconductor device 320. In this case, the optical module 400 is disposed on the driving substrate 310 so that one surface thereof faces the optical semiconductor element 320, and at least one of the driving substrate 310 and the module housing 340. Can be combined and fixed.

The cross section of the optical module 400 may have various other shapes as well as a rectangular shape as shown in FIG.

For example, the end of the optical module 400 may be concave or protrude convex to round, otherwise it may be concave or protrude convex to form an angle like a triangular shape. In addition, the width of the optical module 400 may increase or decrease as it moves away from the driving substrate 310. In addition, one side or both sides of the optical module 400 may be concave or protrude convex to round, otherwise it may be concave or protrude convex to form an angle like a triangular shape.

The power supply module 500 is disposed on the power support unit 150 formed in the first connection frame unit 130 and electrically connected to the power application pattern 200 through a wire formed on the frame body. To provide power to the power application pattern 200. For example, the power supply module 500 may receive an AC voltage from the outside, change the DC voltage, and output the DC voltage. At this time, the positive voltage of the DC voltage is transmitted to the first application pattern 210 through the first electrode terminal 332, the negative voltage of the DC voltage through the second electrode terminal 334. The second application pattern 220 is transmitted.

On the other hand, the power supply module 500 is omitted, the AC voltage applied from the outside can be provided directly to the power application pattern 200, wherein the optical semiconductor element (on the driving substrate 310) 320 may include light emitting diodes (LEDs) driven by the AC power.

As described above, the lighting module 300 is disposed on the first and second lighting supports 110 and 120 to emit light through the opening 102 of the luminaire frame 100. Accordingly, the illumination module 300 can be freely moved on the first and second illumination support parts 110, thereby irradiating light to a desired position.

In addition, the total illuminance of the lighting apparatus may be adjusted by adjusting the number of the lighting modules 300 disposed on the first and second lighting support parts 110 and 120. In addition, by uniformly spaced apart the illumination modules 300 or by moving to one side, the light emitted from the illumination device can be uniformly irradiated or concentrated to one side. In addition, by using a variety of shapes of the cross-section of the optical module 400, it is possible to form a variety of optical patterns.

<Example 2>

5 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the second embodiment of the present invention.

The lighting apparatus shown in FIG. 5 is substantially the same as the lighting apparatus in the first embodiment except that the power-applied circuit board 250 in the first embodiment is omitted, and thus the same as the first embodiment. Like reference numerals refer to like elements and detailed descriptions thereof will be omitted.

Referring to FIG. 5, the power applying pattern 200 according to the present embodiment is not on the power applying circuit board 250 in the first embodiment, but at least one of the first and second lighting supports 110 and 120. It is formed directly on one. That is, the power supply circuit board 250 in the first embodiment may be omitted, and thus the coupling protrusion 112 in FIG. 2 may be omitted.

Meanwhile, instead of omitting the power supply circuit board 250, at least one portion of the first and second lighting supports 110 and 120 may serve as the power supply circuit board 250 instead. Can be. That is, upper surface portions of the first or second lighting support parts 110 and 120 may serve as circuit boards formed in the power application pattern 200.

As described above, according to the present embodiment, as the power applying pattern 200 is directly formed on at least one of the first and second lighting support parts 110 and 120, the power applying circuit board 250 may be omitted. The configuration of the lighting device can be further simplified, and the manufacturing cost can be reduced.

<Example 3>

6 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the third embodiment of the present invention.

Since the lighting apparatus shown in FIG. 6 is substantially the same as the lighting apparatus in the second embodiment except that the power-applied pattern groove 104 is further formed, the same components as those of the second embodiment are described. The same reference numerals will be given and detailed description thereof will be omitted.

Referring to FIG. 6, a power supply pattern groove 104 is formed in at least one of the first and second lighting support parts 110 and 120 according to the present embodiment, and the power supply is formed in the power supply pattern groove 104. The application pattern 200 is formed. In detail, the power applying pattern groove 104 includes a first pattern groove in which the first application pattern 210 is formed, and a second pattern groove in which the second application pattern 220 is formed.

As described above, according to the present embodiment, as the power applying pattern 200 is formed in the power applying pattern groove 104, the power applying pattern 200 may be caused by an external impact including friction with the electrode terminal portion 330. This peeling off or disconnection can be suppressed.

In addition, as the electrode terminal part 330 is disposed in the power application pattern groove 104, alignment work for contacting the electrode terminal part 330 and the power application pattern 200 with each other is easy. The electrode terminal 330 may be easily prevented from moving to an external impact.

<Example 4>

7 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the fourth embodiment of the present invention.

Since the lighting apparatus shown in FIG. 7 is substantially the same as the lighting apparatus of the first embodiment except for the electrical connection between the power supply module 500 and the power application pattern 200, the first embodiment is the same as the lighting apparatus of FIG. Like reference numerals refer to like elements, and detailed descriptions thereof will be omitted.

Referring to FIG. 7, a pair of power applying patterns 200 according to the present embodiment is formed on the first and second lighting support parts 110 and 120, and the power supply module 500 includes the pair. All of the power supply patterns 200 are electrically connected to provide driving power, for example, DC power.

Specifically, the positive voltage and the negative voltage of the DC power supply are divided into each of the pair of power application patterns 200 and provided. That is, the positive voltage is applied to the first application pattern 210 of each of the pair of power supply patterns 200, and the negative voltage is applied to each of the pair of power supply patterns 200. 2 is applied to the application pattern (210).

Meanwhile, when the optical semiconductor device 320 includes light emitting diodes (LEDs) driven by AC power, the power supply module 500 may be omitted. In this case, the first voltage and the second voltage of the AC power may be divided into each of the pair of power application patterns 200 and provided.

As described above, according to the present embodiment, the first voltage and the second voltage of the driving power generated by the power supply module 500 are dividedly provided into each of the pair of power application patterns 200, and thus the driving is performed. When the power is shortened to the application path applied to the optical semiconductor elements 320 via the driving substrate 310, the luminance between the optical semiconductor elements 320 is changed by the voltage drop (voltage drop) It can be suppressed.

<Example 5>

8 is a view showing one end surface of the lighting apparatus using the optical semiconductor according to the fifth embodiment of the present invention.

The lighting apparatus shown in FIG. 8 is substantially the same as the lighting apparatus in the first embodiment except for the electrical connection relationship between the power supply module 500 and the power application pattern 200, and thus, the first embodiment. Like reference numerals refer to like elements, and detailed descriptions thereof will be omitted.

Referring to FIG. 8, a pair of power applying patterns 200 according to the present embodiment is formed on the first and second lighting support parts 110 and 120, and the power supply module 500 is the pair. All of the power supply patterns 200 are electrically connected to provide driving power, for example, DC power.

Specifically, a positive voltage of the DC power is provided to any one of the pair of power application patterns 200, and a negative voltage of the DC power is different from the pair of power application patterns 200. Is provided in one.

Meanwhile, when the optical semiconductor device 320 includes light emitting diodes (LEDs) driven by AC power, the power supply module 500 may be omitted. In this case, the first voltage of the AC power is provided to any one of the pair of power application patterns 200, and the second voltage of the AC power is the other of the pair of power application patterns 200. Is provided.

As described above, according to the present embodiment, the first voltage of the driving power generated by the power supply module 500 is provided to any one of the pair of power application patterns 200, and the second voltage of the driving power is provided. Is provided to the other one of the pair of power application patterns 200, a short occurs between the first and second application patterns 210 and 220 of the pair of power application patterns 200. However, the first and second voltages may be prevented from colliding with each other to generate sparks.

In addition, the driving power shortens the application path applied to the optical semiconductor elements 320 through a wiring of the driving substrate 310 to reduce the voltage between the optical semiconductor elements 320 by a voltage drop. The change in luminance can be suppressed.

<Example 6>

9 is a view showing one end surface of the optical module of the lighting apparatus using the optical semiconductor according to the sixth embodiment of the present invention.

The lighting apparatus shown in FIG. 9 is substantially the same as the lighting apparatus in the first embodiment except that the reflective layer 410 is further formed on one side of the optical module 400, and thus the same as the first embodiment. Like reference numerals refer to like elements and detailed descriptions thereof will be omitted.

9, a reflective layer 410 capable of reflecting light is formed on one side of the optical module 400 according to the present embodiment. In this case, the reflective layer 410 may be formed directly on one side of the optical module 400, but may be disposed in the form of a separate reflective sheet. In addition, the reflective layer 410 may be formed on the front surface of one side of the optical module 400 as shown, but may be formed only on a part of one side of the optical module 400.

As such, according to the present exemplary embodiment, the reflective layer 410 is formed on one side of the optical module 400 so that the light emitted from the optical module 400 is irradiated only in a desired direction.

&Lt; Example 7 >

10 is a plan view of a part of a lighting apparatus using an optical semiconductor according to a seventh embodiment of the present invention.

The illumination device shown in FIG. 10 is substantially the same as the illumination device in the first embodiment except for the planar shape of the illumination module 300, and therefore the same reference numerals are used for the same components as in the first embodiment. And a detailed description thereof will be omitted.

Referring to FIG. 10, the lighting module 300 according to the present exemplary embodiment has a planar shape in which two straight lines cross each other in the opening 102 of the luminaire frame 100.

Specifically, the driving substrate 310 includes first and second crossing substrate portions disposed on the first and second lighting supports 110 and 120 to cross each other, and the first and second crossing substrate portions are disposed on the driving substrate 310. The optical semiconductor elements 320 are disposed on the crossing substrate portions at regular intervals.

The module housing 340 includes first and second housing portions 341 and 342 which receive and fix each of the first and second cross substrate portions. In addition, the optical module 400 may have a shape that crosses the opening 102 to correspond to the shape of the driving substrate 310.

As described above, according to the present embodiment, as the lighting module 300 has a planar shape in which two straight lines cross each other in the opening 102 of the luminaire frame 100, the lighting module 300 has a pattern corresponding to the planar shape. Light can be irradiated.

&Lt; Example 8 >

FIG. 11 is a plan view illustrating a part of a lighting apparatus using an optical semiconductor according to an eighth embodiment of the present invention.

11 is substantially the same as the lighting device of the first embodiment except for the planar shape of the lighting module 300, the same reference numerals are used for the same components as those of the first embodiment. And a detailed description thereof will be omitted.

Referring to FIG. 11, the lighting module 300 according to the present exemplary embodiment may be modified to have a predetermined lighting pattern, for example, a circle, a rectangle, or a star, in the opening 102 of the luminaire frame 100. .

Specifically, the driving substrate 310 is disposed in the opening 102 to form a light of the illumination pattern, one side is connected to the illumination substrate portion and the other side is on the first illumination support 110 A first support substrate portion disposed over, and a second support substrate portion connected to the illumination substrate portion on one side and disposed on the second illumination support portion on the other side. In this case, the optical semiconductor elements 320 may be disposed at regular intervals on the illumination substrate portion, but may be disposed on the first and second support substrate portions as well as the illumination substrate portion.

The module housing 340 includes a central housing part 343 for receiving and fixing the illumination substrate part and the first and second support substrate parts, and first and second support housing parts 344 and 345. can do. In addition, the optical module 400 may have a shape of the illumination pattern in the opening 102 to correspond to the shape of the driving substrate 310.

As described above, according to the present embodiment, as the lighting module 300 can be deformed to have a constant lighting pattern in the opening 102 of the luminaire frame 100, round, rectangular, and star according to the needs of the consumer It is possible to manufacture and sell lighting patterns of various shapes such as shapes.

&Lt; Example 9 >

12 is a perspective view illustrating a part of a lighting apparatus using an optical semiconductor according to a ninth embodiment of the present invention.

The lighting apparatus shown in FIG. 12 is substantially the same as the lighting apparatus in the first embodiment except that the lighting apparatus further includes a module moving unit 600, and thus the same components as in the first embodiment are the same. Reference numerals will be given and detailed description thereof will be omitted.

Referring to FIG. 12, the lighting apparatus according to the present exemplary embodiment may be coupled to the lighting module 300 to move the lighting module 300 in the length direction of the first or second lighting support parts 110 and 120. It further comprises a module moving unit (600). In this case, the module moving unit 600 may be coupled to one end of the lighting module 300, but a pair may be disposed to be coupled to both ends of the lighting module 300.

Specifically, the module moving unit 600 may be a rack and pinion moving means. That is, the module moving unit 600 may include a bracket 610, a motor 620, a pinion gear 630 and a rack gear 640. The bracket 610 may be coupled to one end of the lighting module 300, and may have a c-shape to be coupled to one end of the lighting module 300, for example. The motor 620 is attached and fixed to the side of the bracket 610, the pinion gear 630 is coupled to the shaft of the motor 620. The rack gear 640 is disposed on the side of the first or second lighting supports 110 and 120 to engage with the pinion gear 630, so that the rack gear 640 of the first or second lighting supports 110 and 120 may be disposed. Extend in the longitudinal direction.

In the present embodiment, the module moving unit 600 is a rack and pinion type moving means, as well as a variety of moving means that can be moved by changing the rotational movement to a linear movement, for example, the number of movement of the linear motor (LM) guide system It may be single.

Meanwhile, the lighting apparatus according to the present embodiment may further include a module moving control unit (not shown) for moving the lighting module 300 by controlling the module moving unit 600. That is, the module movement control unit may transmit a control signal to the module mobile unit 600 in a wired or wireless manner, and control the module mobile unit 600 according to a user's operation or a predetermined algorithm. .

As described above, according to the present exemplary embodiment, as the module moving unit 600 moves the illumination module 300 in the longitudinal direction of the first or second illumination support parts 110 and 120, the illumination module ( 300 may move to a desired position to change the irradiation position of the light according to the user's request.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: luminaire frame 110: first lighting support
120: second lighting support 130: first connection frame
140: second connection frame 150: power support
102: opening 104: power supply pattern groove
200: power supply pattern 210: first application pattern
220: second application pattern 250: power supply circuit board
300: lighting module 310: driving substrate
320: optical semiconductor element 330: electrode terminal portion
332: first electrode terminal 334: first electrode terminal
340: module housing 341: first housing portion
342: second housing portion 343: center housing portion
344: first support housing part 345: second support housing part
400: optical module 500: power supply module
600: module transfer unit

Claims (23)

An luminaire frame having an opening in the center and including first and second illumination supports disposed in positions facing each other;
A power application pattern formed on at least one of the first and second illumination supports; And
At least one illumination module disposed over the first and second illumination supports to emit light through the opening and in electrical contact with the power application pattern;
The lighting module
A drive substrate disposed over the first and second illumination supports;
At least one optical semiconductor element disposed on the driving substrate to emit light through the opening; And
Illumination using an optical semiconductor, characterized in that it comprises an electrode terminal portion disposed on the drive substrate so as to face at least one of the first and second lighting support portion, the electrode terminal portion in electrical contact with the power application pattern Device. delete The method of claim 1, wherein the power application pattern
A first application pattern transferring a first voltage; And
A second application pattern transferring a second voltage different from the first voltage;
The electrode terminal portion
A first electrode terminal in electrical contact with the first application pattern; And
And a second electrode terminal in electrical contact with the second application pattern. The method of claim 3, wherein the first and second application patterns
Illuminating apparatus using an optical semiconductor, characterized in that the neighboring in parallel to each other having a shape extending in the longitudinal direction of the first or second lighting support. The method of claim 1, wherein the power application pattern is a pair is formed on the first and second lighting support,
The electrode terminal portion is formed in a pair to be in electrical contact with the pair of power application patterns,
Any one of the pair of power supply patterns transmits a first voltage, the other one transmits a second voltage. The method of claim 1, wherein the lighting module
Lighting device using an optical semiconductor, characterized in that it further comprises a module housing for receiving and fixing the drive substrate. The method of claim 1, wherein the electrode terminal portion
Lighting device using an optical semiconductor, characterized in that it has elasticity to improve the contact force with the power application pattern. delete delete The method of claim 1, wherein the driving substrate is
And first and second intersecting substrate portions disposed on the first and second illumination support portions so as to intersect with each other. The method of claim 1, wherein the driving substrate is
An illumination substrate unit disposed in the opening to form light of a predetermined illumination pattern;
A first support substrate portion having one side connected to the illumination substrate portion and the other side disposed on the first illumination support portion; And
The lighting device using an optical semiconductor, characterized in that one side is connected to the illumination substrate portion, and the other side includes a second support substrate portion disposed over the second illumination support portion. An luminaire frame having an opening in the center and including first and second illumination supports disposed in positions facing each other;
A power application pattern formed on at least one of the first and second illumination supports;
At least one lighting module disposed over the first and second lighting supports to emit light through the opening and in electrical contact with the power application pattern; And
And a power supply circuit board disposed on at least one of the first and second lighting support parts, wherein the power supply pattern is formed. The method of claim 1, wherein the power application pattern
Lighting device using an optical semiconductor, characterized in that formed in the power supply pattern groove formed in at least one of the first and second lighting support. The lighting apparatus using an optical semiconductor according to claim 1, further comprising a power supply module electrically connected to the power application pattern to provide power. 15. The luminaire frame of claim 14, wherein the luminaire frame is
Further comprising first and second connecting frame portions connecting both ends of the first and second lighting supports, respectively,
The power supply module is an illumination device using an optical semiconductor, characterized in that disposed on any one of the first and second connection frame portion. The lighting apparatus using an optical semiconductor according to claim 1, further comprising an optical module coupled to the lighting module and disposed in the opening, the optical module changing the characteristics of the light emitted from the lighting module. delete The method of claim 16, wherein the lighting module has a shape extending in one direction to extend over the first and second lighting support,
The optical module is an illumination device using an optical semiconductor, characterized in that it has a rectangular parallelepiped shape extending in one direction. delete delete The lighting apparatus using an optical semiconductor according to claim 1, further comprising a module moving unit coupled to the lighting module to move the lighting module in the longitudinal direction of the first or second lighting supports. The method of claim 21, wherein the module mobile unit
A bracket coupled to one end of the lighting module;
A motor fixed to the side of the bracket;
A pinion gear coupled with the shaft of the motor; And
And a rack gear disposed on side surfaces of the first or second lighting supports to be engaged with the pinion gear. 22. The lighting apparatus using an optical semiconductor according to claim 21, further comprising a module moving control unit for controlling the module moving unit in a wired or wireless manner so that the lighting module is moved.

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