KR101275672B1 - Sputtering magnetron - Google Patents

Abstract

The sputtering magnetron of the present invention, the fixed target; A backplate disposed on the target to support the target; A closed loop including first and second magnet groups disposed to face each other at a distance apart from each other on the back plate, and third and fourth magnet groups respectively disposed between corresponding opposite ends of the first and second magnet groups. Fixed magnet stage to form; A rotating body spaced upwardly from the fixed magnet end, the rotating body having a rotating cylinder portion rotating around a rotation axis extending in the longitudinal direction of the first and second magnet groups; And a rotatable magnet end having a plurality of magnet groups spaced apart from each other at angular intervals on the rotation cylinder to form the surface of the target by rotating the plurality of magnet groups by the rotation of the rotation cylinder. Move the plasma race track.

Description

Sputtering Magnetron {Sputtering Magnetron}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to sputtering magnetrons of sputtering apparatuses, and more particularly to moving a plasma race track of a target to widen the erosion area of the target. The present invention relates to a sputtering magnetron to increase the efficiency.

In general, a sputtering magnetron of a sputtering apparatus is used for depositing a metal, an organic material, or an inorganic material, and includes a target, a magnet assembly, and the like. The target, for example, the fixed target, may be divided into a circular target used for a semiconductor and the like and a large-area rectangular target widely applied in general industrial use.

One example of a conventional sputtering magnetron with a fixed target and a fixed magnet stage, used in large area sputters, is shown in FIGS. 1 and 2. As shown in Figs. 1 and 2, in the sputtering magnetron 100, the target 10 is disposed on the lower surface of the back plate 20, and the magnet end 30 as the magnetic preservation iron piece is back. The magnetic plate 40 is disposed on the upper surface of the back plate 20 while the magnetic plate 40 is disposed on the lower surface of the flexible magnetic plate 40 to face the upper surface of the plate 20, and the insulating plate 50 is the magnetic plate 40. It is disposed on the upper surface of the). In order to prevent the target shield 60 from depositing the material of the target 10 in an undesired area, the edge of the target 10, the back plate 20, the magnetic plate 40, And a side portion of the insulating plate 50. A coolant passage 70 is formed in the back plate 20 so as to distribute a coolant (not shown) for preventing demagnetization of the unit magnet of the magnet stage 30 due to external plasma heat and for efficient cooling of the target 10. The coolant input port 71 and the coolant output port 73 are respectively formed on the upper surface of the insulating plate 50, and sequentially communicate with the refrigerant passage 70 through the magnetic plate 40 and the insulating plate 50. . Insulating plate for the electrode 80 to apply power such as low frequency (LF), intermediate frequency (MF), high frequency (RF), direct current (DC), pulsed direct current (Pulsed DC) to the sputtering magnetron 1 It penetrates 50 and is electrically connected with the magnetic plate 40.

In addition, the magnet stage 30 is composed of a first magnet group 31 and a second magnet group 33 to generate a plasma race track while forming a constant magnetic force line on the surface of the target 10. The first magnet group 31 is arranged in a straight line shape, the second magnet group 33 is arranged in a shape surrounding the first magnet group 31 at a spaced interval from the first magnet group 31. Magnetization in which the first magnetic pole portion of the first magnet group 31, for example, the magnetic pole portion adjacent to the target 10 forms the N pole, and the second magnetic pole portion of the first magnetic group 31 is opposite to the first magnetic pole portion. Form an S pole, which is a magnetic pole with a direction. The first magnetic pole portion of the second magnet group 33, for example, the magnetic pole portion adjacent to the target 10 forms the S pole, and the second magnetic pole portion is the magnetic pole having a magnetization direction opposite to the first magnetic pole portion. Form.

In the conventional sputtering magnetron 100 having such a structure, the material of the target 10 is transferred to the substrate 1 as the sputtering proceeds while the substrate 1 is horizontally transferred by the transfer means, for example, the roller 3. It is deposited on the upper surface of.

However, since the sputtering magnetron 100 includes the fixed target 10 and the fixed magnet end 30, as shown in FIG. 3, the sputtering magnetron 100 is formed by the first magnet group 31 and the second magnet group 33. Plasma race tracks are formed on the surface 11 of the target 10 by the lines of magnetic force parallel to the surface 11 of the target 10 among the generated lines of magnetic force 35. That is, the plasma race track is formed on the surface 11 of the target 10 along the path of the magnetic field formed in the direction perpendicular to the electric field EF.

However, erosion of the plasma target 10 occurs intensively in the local area A of the surface 11 of the target 10 along the plasma race track thus formed. As a result, grooves (not shown) are intensively formed in the local area A of the target 10, resulting in low use efficiency of the target 10.

Accordingly, an object of the present invention is to provide a sputtering magnetron that moves the plasma race track of the target to increase the erosion area of the target to increase the use efficiency of the target.

Therefore, the sputtering magnetron according to the present invention, the fixed target; A backplate disposed on the target to support the target; A closed loop including first and second magnet groups disposed to face each other at a distance apart from each other on the back plate, and third and fourth magnet groups respectively disposed between corresponding opposite ends of the first and second magnet groups. Fixed magnet stage to form; A rotating body spaced upwardly from the fixed magnet end, the rotating body having a rotating cylinder portion rotating around a rotation axis extending in the longitudinal direction of the first and second magnet groups; And a rotatable magnet end having a plurality of magnet groups spaced apart from each other at angular intervals on the rotation cylinder to form the surface of the target by rotating the plurality of magnet groups by the rotation of the rotation cylinder. Move the plasma race track.

Preferably, the first and second magnet groups may have more unit magnets than the third and fourth magnet groups.

Preferably, the magnetic pole portions of each of the first and second magnet groups may be disposed horizontally with respect to the surface of the target, and the magnetic pole portions of each of the third and fourth magnet groups may be disposed horizontally with respect to the surface of the target. .

Preferably, the magnetic pole portions of each of the first and second magnet groups may be disposed perpendicular to the surface of the target, and the magnetic pole portions of each of the third and fourth magnet groups may be disposed perpendicular to the surface of the target. .

Preferably, the magnetic pole portions of each of the first and second magnet groups may be disposed horizontally with respect to the surface of the target, and the magnetic pole portions of each of the third and fourth magnet groups may be disposed perpendicular to the surface of the target. .

Preferably, the first and second magnet groups and the third and fourth magnet groups may be disposed on the back plate via a soft magnetic plate.

Preferably, the plurality of magnet groups may be arranged to be spaced apart from each other at the same angular interval as the rotation cylinder.

Preferably, the plurality of magnet groups may be disposed via the flexible magnetic plate in the rotating cylinder portion.

Preferably, in the plurality of magnet groups, it is possible for the magnetic pole portion adjacent to the rotary cylinder portion to form a first magnetic pole, and the magnetic pole portion tangential to the rotary cylinder portion to form a second magnetic pole.

Preferably, it is possible to form a refrigerant passage for circulating a refrigerant for cooling the target inside the back plate.

The sputtering magnetron according to the present invention includes a fixed magnet end and a rotating magnet end, and each of the magnet groups of the rotating magnet end is disposed to be spaced apart from each other at angular intervals in the rotating cylindrical part by rotating the rotating cylindrical part. The magnet groups in the stage may be rotated to move the plasma race track formed on the surface of the target. Therefore, since the erosion area of the target is widened, the use efficiency of the target is increased.

1 is a cross-sectional view schematically showing a structure of a sputtering magnetron having a conventional fixed target and a fixed magnet end.
FIG. 2 is a plan view illustrating the arrangement of the fixed magnet ends of FIG. 1. FIG.
FIG. 3 is an exemplary diagram illustrating local target erosion occurring on a surface of a target and magnetic force lines generated by the fixed magnet end of FIG. 1.
4 is a side view showing the structure of the sputtering magnetron according to the present invention.
FIG. 5 is a cross-sectional view of the sputtering magnetron of FIG. 4 taken along line AA. FIG.
6 (a) to 6 (d) are simulation diagrams showing the plasma race track movement on the target surface according to the rotation of the rotary magnet end of the sputtering magnetron according to the present invention.

Hereinafter, a preferred embodiment of the sputtering magnetron according to the present invention will be described in detail with reference to the accompanying drawings.

4 is a side view illustrating the structure of the sputtering magnetron according to the present invention, and FIG. 5 is a cross-sectional view of the sputtering magnetron of FIG. 4 taken along line A-A. For convenience of description, the structure of the sputtering magnetron will be described in conjunction with FIGS. 4 and 5.

4 and 5, the sputtering magnetron 200 of the present invention includes a target 210, a back plate 220, a fixed magnet end 230, a flexible magnetic plate 240, and a target shield 250. , An insulating plate 260, a rotating body 270, a flexible magnetic plate 280, and a rotating magnet end 290.

Here, the target 210 is disposed on one surface, for example, a bottom surface of the back plate 220 such that the target 210 faces in parallel with a substrate (not shown) in the sputtering chamber (not shown). On the surface 211 of the target 210, a material to be deposited on a deposition surface of a substrate (not shown) may be formed of a plurality of layers. The back plate 220 supports the target 210 and maintains a uniform distribution of heat generated by the target 210. The target 210 and the back plate 220 may have a rectangular shape, for example, and may have various other shapes usable.

In addition, the fixed magnet end 230 as the magnetic preservation iron piece is arranged in a substantially rectangular shape on the upper surface of the back plate 220 via the flexible magnetic plate 240. That is, the first and second magnet groups 231 and 233 on both sides of the fixed magnet end 230 are disposed to face each other with a spaced interval therebetween, and the third and fourth magnet groups on both side short sides of the fixed magnet end 230 ( 235, 237 are disposed to face each other at a spaced interval from each other. The first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237 form a closed loop. Each of the first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237 is composed of a plurality of unit magnets arranged in a line. The first and second magnetic pole portions of the first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237 are disposed horizontally with respect to the surface 211 of the target 210. That is, the first magnetic pole portions of the first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237 are located at the inner side, and the first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237. The second magnetic pole portion is located outside the first magnetic pole portion.

Here, as shown in the drawing, the opposing first magnetic pole portions of the unit magnets of the first and second magnet groups 231 and 233 form an N pole, and the opposing first magnets of the unit magnets of the third and fourth magnet groups 235 and 237. One magnetic pole part can form an N pole. The second magnetic pole portion of the unit magnets of the first and second magnet groups 231 and 233 may form the S pole, and the second magnetic pole portion of the unit magnets of the third and fourth magnet groups 235 and 237 may form the S pole. Although not shown in the drawings, the first magnetic pole portions of the unit magnets of the first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237 form an S pole, and the first and second magnet groups 231 and 233. The second magnetic pole portion of the unit magnets of the third and fourth magnet groups 235 and 237 may also form an N pole.

In addition, the flexible magnetic plate 240 is in contact with the bottom and outer surfaces of the first and second magnet groups 231 and 233 in a shape for arranging the fixed magnet end 230, for example, an approximately L shape in cross section. In addition, the lower and outer surfaces of the third and fourth magnet groups 235 and 237 may be contacted.

In addition, the target shield 250 is provided with an insulating plate 260 on the side surface of the back plate 220 to prevent the deposition of the material of the target 210 in the unwanted region.

In addition, the back plate 220 may allow the refrigerant passage 221 to distribute refrigerant (not shown) for preventing demagnetization of the unit magnet of the magnet stage 230 due to external plasma heat and for efficient cooling of the target 210. It is formed within. The coolant input port 223 and the coolant output port 225 are respectively formed at predetermined points of the upper surface portion of the back plate 220 and communicate with the coolant passage 221.

In addition, the rotating body 270 includes a rotating shaft 271 and a rotating cylinder portion 273, and is disposed at a distance from the upper center portion of the back plate 220 to an upper side thereof. The rotating shaft 271 is parallel to the target 210 and extends in the longitudinal direction of the first and second magnet groups 231 and 233 of the fixed magnet end 230, but is longer than the length of the first and second magnet groups 231 and 233. Extend. The rotation shaft 271 may be rotated in one direction, for example, in a clockwise direction, by the rotation driving means, for example, the motor 275, coupled to one end of the rotation shaft 271. The rotating cylinder portion 273 extends in the longitudinal direction of the rotating shaft 271 while being coupled to a portion of the rotating shaft 281, but slightly shorter than the length of the first and second magnet groups 231 and 233 of the fixed magnet end 230. It may extend and rotate in the same rotational direction as the rotation shaft 271 by the rotation of the rotation shaft 271.

In addition, a flexible magnetic plate 280 is disposed on the circumferential surface of the rotary cylinder portion 273, for example, the entire area of the circumferential surface. The rotatable magnet ends 290 are spaced apart from each other at angular intervals on the surface of the magnetic plate 280. For example, four magnet groups, that is, first, second, third and fourth magnet groups 291, 293, 295, and 297, are disposed at angular intervals of 90 degrees. Each of the first, second, third, and fourth magnet groups 291, 293, 295, and 297 may be configured of a plurality of unit magnets arranged in a line.

Here, as shown in the drawing, the first magnetic pole portion of the unit magnets of the first, second, third, and fourth magnet groups 291, 293, 295, and 297, for example, the magnetic pole portion contacting the magnetic plate 280, for example, form an N pole. The second magnetic pole portion of the unit magnets of the first, second, third and fourth magnet groups 291, 293, 295 and 297, for example, the magnetic pole portion disposed on the first magnetic pole portion may form an S pole, for example. Of course, although not shown in the drawing, the first magnetic pole portion of the unit magnets of the first, second, third, and fourth magnet groups 291, 293, 295, and 297, for example, the magnetic pole portion contacting the magnetic plate 280, for example, forms an S pole. The second magnetic pole portion of the unit magnets of the first, second, third, and fourth magnet groups 291, 293, 295, and 297, for example, the magnetic pole portion disposed on the first magnetic pole portion may form an N pole, for example. A plurality of magnet groups may be arranged at other angular intervals other than 90 degrees.

In addition, the power supply stage 227 to apply a power source such as low frequency (LF), intermediate frequency (MF), high frequency (RF), direct current (DC), pulsed DC (Pulsed DC) to the back plate 220. It is installed on a part of the back plate 220.

In addition, in order to maintain the degree of vacuum in the sputtering chamber, an O-ring 229 is installed along the upper surface edge of the back plate 220 and an O-ring 251 along the lower surface edge of the target shield 250. ) Is installed.

In the sputtering magnetron 200 of the present invention configured as described above, the rotating shaft 271 is rotated in one direction, for example, clockwise, by using the motor portion 275 of the rotating body 270. When simulating the plasma race track formed on the surface 211 of the target 210 according to the rotation angle, the plasma race track is formed on the surface of the target as shown in Figs. 6 (a) to 6 (d). .

That is, when the rotation angle of the rotating body 270 is, for example, 0 degrees, that is, the S pole of the first magnet group 291 is located adjacent to the target 210, and the first magnet group 291 and the third magnet When the group 295 is located on the vertical line of the rotation axis 271, the plasma race track as shown in FIG. Is formed on the surface.

Subsequently, when the rotating body 270 rotates, for example, 30 degrees, that is, when the first magnet group 291 and the third magnet group 295 are rotated 30 degrees from the vertical line of the rotation axis 271, the target Plasma race tracks as shown in Fig. 6 (b), which are marked in red with the highest intensity of the magnetic field lines in the surface direction of, are formed on the surface of the target. Therefore, it can be seen that the plasma race track shown in FIG. 6B has moved laterally from the position of the plasma race track shown in FIG. 6A.

Next, when the rotating body 270 rotates, for example, 45 degrees, that is, when the first magnet group 291 and the third magnet group 295 are rotated 45 degrees from the vertical line of the rotation axis 271. Plasma race tracks are formed on the surface of the target, as shown in Fig. 6C, in which the intensity of the lines of magnetic force in the surface direction of the target is the highest in red. Therefore, it can be seen that the plasma race track shown in FIG. 6C has moved laterally from the position of the plasma race track shown in FIG. 6B.

Subsequently, when the rotating body 270 rotates, for example, 60 degrees, that is, when the first magnet group 291 and the third magnet group 295 are rotated by 60 degrees from the vertical line of the rotation axis 271, the target. Plasma race tracks as shown in Fig. 6 (d), which are marked in red with the highest intensity of the magnetic field lines in the surface direction of, are formed on the surface of the target. Therefore, it can be seen that the plasma race track shown in FIG. 6D has moved laterally from the position of the plasma race track shown in FIG. 6C.

In this manner, as the rotating body 270 rotates clockwise, for example, the S pole of the first magnet group 291, the S pole of the second magnet group 293, and the S of the third magnet group 295. The pole, the S pole of the fourth magnet group 297 rotates sequentially between the N poles of the first and second magnet groups 231 and 233 of the fixed magnet stage 230, so that the plasma race track is the target 210. It can be formed while continuously moving on the surface 211 of.

Therefore, in the present invention, the plasma race track can be moved on the surface of the target according to the rotation angle of the rotating body by adjusting the magnetic force line that is parallel to the surface of the target by combining the fixed magnet stage and the rotating magnet stage. Therefore, the present invention can increase the erosion area of the target and improve the use efficiency of the target, compared to the conventional sputtering magnetron.

Meanwhile, in the sputtering magnetron of the present invention, as shown in FIG. 4, the first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237 of the fixed magnet stage 230 each have an N pole and an S pole. Instead of the configuration arranged horizontally with respect to the surface 211 of the target 210, although not shown in the drawings, the first and second magnet groups 231 and 233 and the third and fourth magnet groups 235 and 237 of the fixed magnet stage 230. Each of the N and S poles may be configured to be perpendicular to the surface 211 of the target 210. In addition, although not shown in the drawings, the N poles and the S poles of the first and second magnet groups 231 and 233 are disposed horizontally with respect to the surface 211 of the target 210 and the N of the third and fourth magnet groups 235 and 237. The pole and the S pole may be disposed perpendicular to the surface 211 of the target 210, but the N pole may be positioned below the S pole. For convenience of description, description of these components will be omitted in order to avoid duplication of description.

Although the preferred embodiment has been described above, the configuration of the sputtering magnetron according to the present invention is not limited to the above-described example, and various modifications, changes, substitutions, and the like can be made without departing from the technical spirit of the present invention.

1: substrate
3: roller
10: target
20: backplate
30: magnet
31: First magnet group
33: Second magnet group
40: flexible magnetic plate
50: insulating plate
60: target shield
70: refrigerant passage
71: refrigerant input port
73: refrigerant output port
80: electrode
100: sputtering magnetron
200: sputtering magnetron
210: target
211: surface of the target
220: backplate
221: refrigerant passage
223: refrigerant input port
225: refrigerant outlet
227: power off
229 O-ring
230: fixed magnet stage
231,233: first and second magnet group of the fixed magnet stage
235,237: group 3, 4 magnets of fixed magnet
240: soft magnetic plate
250: target shield
251: O-ring
260: insulating plate
270: rotating body
271: axis of rotation
273: rotating cylinder
275: motor unit
280 soft magnetic plate
290: rotating magnet stage
291,293,295,297: first, second, third and fourth magnet groups of rotating magnet

Claims (10)

A fixed target;
A backplate disposed on the target to support the target;
A closed loop including first and second magnet groups disposed to face each other at a distance apart from each other on the back plate, and third and fourth magnet groups respectively disposed between corresponding opposite ends of the first and second magnet groups. Fixed magnet stage to form;
A rotating body spaced upwardly from the fixed magnet end, the rotating body having a rotating cylinder portion rotating around a rotation axis extending in the longitudinal direction of the first and second magnet groups; And
Plasma magnets are formed on the surface of the target by rotating the plurality of magnet groups by the rotation of the rotary cylinder portion by including a rotary magnet end having a plurality of magnet groups disposed on the rotary cylinder spaced apart at an angular interval A sputtering magnetron characterized by moving a race track.
The sputtering magnetron of claim 1, wherein the first and second magnet groups have more unit magnets than the third and fourth magnet groups.
The magnetic pole portion of each of the first and second magnet groups is disposed horizontally with respect to the surface of the target, and the magnetic pole portions of each of the third and fourth magnet groups are disposed horizontally with respect to the surface of the target. A sputtering magnetron characterized by the above.
The magnetic pole portion of each of the first and second magnet groups is disposed perpendicular to the surface of the target, and the magnetic pole portions of each of the third and fourth magnet groups are disposed perpendicular to the surface of the target. A sputtering magnetron characterized by the above.
The magnetic pole portion of each of the first and second magnet groups is disposed horizontally with respect to the surface of the target, and the magnetic pole portions of each of the third and fourth magnet groups are disposed perpendicular to the surface of the target. A sputtering magnetron characterized by the above.
The sputtering magnetron according to claim 1, wherein the first and second magnet groups and the third and fourth magnet groups are disposed on the back plate via a soft magnetic plate.
The sputtering magnetron according to claim 1, wherein the plurality of magnet groups are arranged to be spaced apart from each other at equal angular intervals in the rotating cylinder portion.
The sputtering magnetron according to claim 1, wherein the plurality of magnet groups are arranged in the rotating cylinder via a flexible magnetic plate.
The sputtering magnetron according to claim 1, wherein the plurality of magnet groups have a magnetic pole portion adjacent to the rotary cylinder portion to form a first magnetic pole, and the magnetic pole portion tangential to the rotary cylinder portion to form a second magnetic pole.
The sputtering magnetron according to claim 1, wherein a refrigerant passage for circulating a refrigerant for cooling the target is formed in the back plate.

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