KR101264463B1 - Etching solution control system and etching apparatus and etching solution control method thereof - Google Patents

Abstract

The present invention relates to a first etching liquid storage tank for storing an etching liquid; An etchant waste line connected to the first etchant storage tank; An etchant analyzer for measuring the absorbance of the etchant stored in the first etchant storage tank and analyzing the state of the etchant stored in the first etchant storage tank; A second etchant storage tank connected to the first etchant storage tank; An extractor connected to the second etchant storage tank; And a control unit for controlling to transfer the etching liquid of the first etching liquid storage tank to any one of the etching liquid waste line and the second etching liquid storage tank according to the analysis result of the etching liquid analyzing apparatus. Provide an etchant management method.

Etchant, absorbance, management system

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an etching solution management system, an etching apparatus,

1 is a schematic diagram of an etchant management system and an etching apparatus according to a first embodiment of the present invention,

2 is a schematic diagram of an etchant management system and an etching apparatus according to a second embodiment of the present invention;

Figure 3 is a graph showing the relationship between the absorbance conversion value for each temperature change over time,

4 is an electron scanning microscope photograph after etching with an etchant changed color with time.

Description of the Related Art [0002]

10: first etchant storage tank

11: first etching liquid waste line

12: 1st flow cell supply line

13: 1st etchant storage tank supply line

14: first connection line

20: second etching liquid storage tank

21: second etching liquid waste line

22: second flow cell supply line

23: second etching liquid storage tank supply line

24: second connection line

30: etching machine

40: control unit

100, 200: first and second etching liquid analysis apparatus

101, 201: first and second flow cells

102, 202: light source

103 and 203: first and second spectrometers

104, 204: first and second etchant analysis control unit

The present invention provides an etching solution management system, an etching apparatus and an etching solution management method, which can manage the etching solution by automatically analyzing the color gradient according to the concentration change of the etching solution in real time and setting the usage criteria including the storage and exchange time of the etching solution. It is about.

A variety of etching solutions are used in the etching process during the manufacturing process of semiconductor devices, liquid crystal display devices, etc. The etching solution is composed of acid, which is an etching main component, and various additives.

However, since there is no system for supplying a stable etching solution by managing the performance change of the etching solution, if the wrong management, the composition may change depending on the time and temperature, the color change may appear compared to the etching solution in the initial state. If the array substrate of the liquid crystal display device is etched with such an etchant, an etching failure occurs. Such defects may be detected only after the etching process is completed, and the defective process may be ineffective, or the array substrate of the liquid crystal display device may be reworked I could not help it.

Accordingly, it is an object of the present invention to provide an etchant management system, an etching apparatus, and a manufacturing method thereof capable of managing an etchant by setting a use standard including automatic storage and replacement of an etchant by automatically analyzing color change degree according to concentration change of the etchant in real time The present invention also provides a method for managing an etchant.

According to an aspect of the present invention, there is provided an etching apparatus comprising: a first etchant storage tank for storing an etchant; An etchant waste line connected to the first etchant storage tank; An etchant analyzer for measuring the absorbance of the etchant stored in the first etchant storage tank and analyzing the state of the etchant stored in the first etchant storage tank; A second etchant storage tank connected to the first etchant storage tank; An extractor connected to the second etchant storage tank; And a controller for controlling the transfer of the etchant in the first etchant storage tank to one of the etchant retention line and the second etchant storage tank according to an analysis result of the etchant analyzer.

Here, the etching liquid analyzer may include a flow cell into which the etchant of the first etchant storage tank flows; A light source for irradiating measurement light onto the etchant of the flow cell; A spectroscope for measuring the absorbance of the etchant of the flow cell; And an etchant analysis controller for calculating and outputting an absorbance conversion value based on the absorbance measurement value measured by the spectroscope.

The etchant management system according to the present invention further comprises: a flow cell supply line for supplying the etchant of the first etchant storage tank to the flow cell; And a first etchant storage tank supply line for supplying the etchant of the flow cell to the first etchant storage tank.

The control unit may transfer the etchant of the first etchant storage tank to the second etchant storage tank when the absorbance conversion value is 10 or more based on the data output from the etchant analysis control unit, The etching liquid in the first etching liquid storage tank is controlled to be discharged to the etching liquid disposal line. Here, when the initial absorbance conversion value of the etchant stored in the first etchant storage tank is taken as an initial absorbance conversion value, the absorbance conversion value of the etchant supplied to the flow cell does not exceed the initial absorbance conversion value. The initial absorbance conversion value is different depending on the kind of etchant stored in the first etchant storage tank.

The etchant management system according to the present invention further comprises an etchant analyzer for measuring the absorbance of the etchant stored in the second etchant storage tank and analyzing the state of the etchant stored in the second etchant storage tank; And an additional etchant waste line connected to the second etchant storage tank.

At this time, the controller may control the transfer of the etching liquid in the second etching liquid storage tank to one of the additional etching liquid disposal line and the etching unit, according to the analysis result of the additional etching liquid analysis apparatus.

The additional etchant analyzer may further include a flow cell into which the etchant of the second etchant storage tank flows; An additional light source for irradiating the etchant of the additional flow cell with measurement light; An additional spectrometer to measure the absorbance of the etchant of the further flow cell; And an additional etchant analysis controller for calculating and outputting the absorbance conversion value based on the absorbance measurement value measured in the additional spectroscope.

The etchant management system according to the present invention further comprises a flow cell supply line for supplying etchant of the second etchant storage tank to the additional flow cell; And an additional second etchant storage tank supply line for supplying the etchant of the additional flow cell to the second etchant storage tank.

At this time, if the absorbance conversion value is 10 or more, the etchant of the second etchant storage tank is transferred to the etcher, based on the data output from the further etchant analysis control unit, and if the absorbance conversion value is less than 10 So as to discharge the etchant of the second etchant storage tank to the additional etchant waste line.

Meanwhile, the etchant may be an etchant including hydrogen peroxide as an etching main component. For example, the etchant may include 5 to 15 wt% of hydrogen peroxide, 1 to 5 wt% of organic acid, and 0.5 to 5 wt% of the total weight of the composition. Sulfate, 0.2 to 5% by weight of the cyclic amine compound, and 70 to 93.3% by weight of water.

The etchant management system according to the present invention can be managed by analyzing an etchant used in a process of forming a wiring of a double metal film of a copper alloy and a molybdenum alloy layer.

In another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: (a) measuring an absorbance of an etchant stored in a first etchant storage tank and analyzing a state of an etchant stored in the first etchant storage tank; (b) transferring the etchant of the first etchant storage tank to any one of an etch waste line connected to the first etchant storage tank and a second etchant storage tank connected to the first etchant storage tank according to the analysis result; And (c) supplying the etchant transferred to the second etchant storage tank to an etcher connected to the second etchant storage tank.

The step (a) includes the steps of: (a1) introducing the etchant of the first etchant storage tank into the flow cell; (a2) irradiating the etchant of the flow cell with measurement light; (a3) measuring the absorbance of the etchant of the flow cell; And (a4) calculating and outputting the absorbance conversion value based on the measured absorbance of the etchant.

And the etching solution management method according to the invention may further comprise the step of supplying the etching solution passed through the flow cell to the first etching solution tank.

In the step (b), when the absorbance conversion value is 10 or more, the etchant of the first etchant storage tank is transferred to the second etchant storage tank, and when the absorbance conversion value is less than 10, the etchant of the first etchant storage tank is transferred. It can be transferred to the etching liquid waste line.

In another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: (a) analyzing the state of an etchant stored in the first etchant storage tank by measuring an absorbance of the etchant stored in the first etchant storage tank; (b) transferring the etchant of the first etchant storage tank to any one of an etch waste line connected to the first etchant storage tank and a second etchant storage tank connected to the first etchant storage tank according to the analysis result; (c) analyzing the state of the etchant stored in the second etchant storage tank by measuring the absorbance of the etchant transferred to the second etchant storage tank; And (d) transferring the etching liquid of the second etching liquid storage tank to an additional etching waste line connected to the second etching liquid storage tank and an etching apparatus connected to the second etching liquid storage tank according to the analysis result. Provide a method for managing the etchant. Here, since the steps (a) and (b) are the same as those described above, a detailed description thereof will be omitted.

(C) introducing the etchant of the second etchant storage tank into the flow cell; (c2) irradiating the etchant of the flow cell with measurement light; (c3) measuring the absorbance of the etchant of the flow cell; And (c4) calculating and outputting the absorbance conversion value based on the measured absorbance of the etchant.

The etching liquid management method according to the present invention may further include supplying the etching liquid that has passed through the flow cell to the second etching liquid tank.

In the step (d), if the absorbance conversion value is 10 or more, the etchant of the second etchant storage tank is transferred to the etchant, and if the absorbance conversion value is less than 10, the etching solution of the second etchant storage tank is further added. Can be transferred to an etchant waste line.

Another embodiment of the present invention is a method of manufacturing a semiconductor device, comprising: a first etchant storage tank for storing an etchant; An etchant waste line connected to the first etchant storage tank; An etchant analyzer for measuring the absorbance of the etchant stored in the first etchant storage tank and analyzing the state of the etchant stored in the first etchant storage tank; A second etchant storage tank connected to the first etchant storage tank; An extractor connected to the second etchant storage tank; And a controller for controlling the transfer of the etchant of the first etchant storage tank to one of the etchant retention line and the second etchant storage tank according to an analysis result of the etchant analysis apparatus.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. The present invention will be described in detail. However, the present invention is not limited thereto.

As shown in FIG. 1, the etchant management system and the etching apparatus according to the first embodiment of the present invention include a first etchant storage tank 10 for storing an etchant; A first etchant waste line (11) connected to the first etchant storage tank (10); A first etching solution analyzer 100 for measuring the absorbance of the etching solution stored in the first etching solution storage tank 10 and analyzing the state of the etching solution stored in the first etching solution storage tank 10; A second etchant storage tank 20 connected to the first etchant storage tank 10; An etchant 30 connected to the second etchant storage tank 20; And a control unit for controlling the transfer of the etchant in the first etchant storage tank 10 to one of the first etchant retention line 11 and the second etchant storage tank 20 according to the analysis results of the first etchant analysis apparatus 100, (40).

As the first etching liquid storage tank 10, a CCSS (CENTRAL CHEMICAL SUPPLY SYSTEM) tank is used as an initial storage tank for the etchant used in the etching process.

The etchant may, for example, comprise from 5 to 15 wt% of hydrogen peroxide, from 1 to 5 wt% of organic acid, from 0.5 to 5 wt% of sulfate, from 0.2 to 5 wt% of cyclic amine compound, and from 70 to 93.3 wt% % Of water as an etchant for etching the double metal film of the copper alloy layer and the molybdenum alloy layer in the metal wiring film of the array substrate for a liquid crystal display device.

The change in temperature of the etchant in the first etchant storage tank 10 may cause color change of the etchant compared to the initially received etchant by the interaction of hydrogen peroxide and the additive without changing the hydrogen peroxide content. The change in absorbance due to this color change can be monitored using a spectrometer to monitor changes over time in the etchant.

In other words, the etchant management system and the etching apparatus according to the present invention including the first etching liquid analyzer 100 may change the performance of the etchant depending on the temperature and the time so that the copper alloy layer and the copper alloy layer in the metal wiring film of the array substrate for a liquid crystal display It is possible to prevent the etch characteristics of the double metal film of the molybdenum alloy layer from becoming defective and causing yield and product defects in the production process. Meanwhile, the spectroscope may be a UV-VIS spectroscope, and the wavelength of the irradiated light is preferably 340 nm to 360 nm, more preferably 350 nm. However, it is not limited thereto.

If the controller 40 determines that the etching solution in the first etching solution storage tank 10 can not be used in accordance with the analysis result of the first etching solution analyzer 100, the first etching solution discarding line 11 may store the first etching solution storage And discharges the etching liquid in the tank 10 to the outside of the first etching liquid storage tank 10.

The first etching solution analyzer 100 includes a first flow cell 101 through which the etching solution in the first etching solution storage tank 10 flows; A first light source part (102) for irradiating measurement light to the etchant of the first flow cell (101); A first spectrometer (103) for measuring the absorbance of the etchant of the first flow cell (101); And a first etchant analysis control unit 104 for calculating and outputting an absorbance conversion value based on the absorbance measurement value measured by the first spectroscope 103. Here, the absorbance value measured through the spectroscope is represented by a current value. The absorbance conversion value is a value obtained by dividing the absorbance value of the standard solution (water) measured by the spectrometer into the first flow cell measured by the spectroscope The etching current value indicating the absorbance value of the supplied etching liquid as the current value and the initial etching current value indicating the absorbance value of the etching liquid stored in the initial first etching liquid storage tank as the current value.

A first flow cell supply line 12 is provided between the first etchant storage tank 10 and the first flow cell 101 so that the etchant of the first etchant storage tank 10 can be supplied to the first flow cell 101. [ And a first etchant storage tank 10 is provided between the first flow cell 101 and the first etchant storage tank 10 so that the etchant of the first flow cell 101 can be supplied to the first etchant storage tank 10, Line 13 is provided.

As the second etchant storage tank 20, an ACQC (AUTOMATIC CLEAN QUICK COUPLER) tank can be used as a tank for storing the etchant supplied to the mold 30 in the etching process.

One side of the second etchant storage tank 20 is connected to the first etchant storage tank 10 by the first connection line 14 so that the etchant is supplied from the first etchant storage tank 10, And is connected to the molding machine 30 by the second connection line 24 so that the etching solution in the second etching solution storage tank 10 can be supplied to the molding machine 30.

Based on the data output from the first etchant analysis control unit 104, the control unit 40 transfers the etchant of the first etchant storage tank 10 to the second etchant storage tank 20 when the absorbance conversion value is 10 or more And controls the release of the etchant in the first etchant storage tank 10 to the first etchant waste line 11 when the absorbance conversion value is less than 10.

On the other hand, as shown in Figure 2, in the etching liquid management system and etching apparatus according to a second embodiment of the present invention, the second etching liquid management apparatus 200 having the same principle and configuration as the first etching liquid management apparatus 100 ) May be connected to the second etchant storage tank 20.

The second etchant analyzer 200 includes a second flow cell 201 into which the etchant of the second etchant storage tank 20 flows; A second light source part (202) for irradiating measurement light to the etchant of the second flow cell (201); A second spectrometer (203) for measuring the absorbance of the etchant of the second flow cell (201); And a second etchant analysis control unit 204 for calculating and outputting an absorbance conversion value based on the absorbance measurement value measured by the second spectroscope 203.

In addition, a second flow cell supply line between the second etchant storage tank 20 and the second flow cell 201 so that the etchant of the second etchant storage tank 20 may be supplied to the second flow cell 201. 22) and the second etchant storage tank 20 between the second flow cell 201 and the second etchant storage tank 20 to supply the etchant of the second flow cell 201 to the second etchant storage tank 20. The tank supply line 23 is provided.

Here, the control unit 40 transfers the etchant of the second etchant storage tank 20 to the extractor 30 when the absorbance conversion value is 10 or more based on the data output from the second etchant analysis control unit 204, And controls the release of the etchant in the second etchant storage tank 20 to the second etchant waste line 21 when the absorbance conversion value is less than 10.

Hereinafter, an etchant management system and an etchant management method using the etchant according to the present invention will be described.

The etchant management method according to the present invention is a method in which the etchant stored in the first etchant storage tank 10 is supplied to the first flow cell 101 through the first flow cell supply line 12, The measurement light is irradiated to the first flow cell 101 through the first etchant storage tank supply line 13 and then the absorbance of the first flow cell 101 is measured by the first spectroscope 103 and the etchant of the first flow cell 101 is supplied through the first etchant storage tank supply line 13 1 etchant storage tank 10, the first etchant analysis control unit 104 calculates the absorbance conversion value based on the measured absorbance of the etchant and outputs the calculated absorbance conversion value; When the absorbance conversion value is 10 or more based on the data output from the first etchant analysis controller 104, the controller 40 controls the second etchant from the first etchant storage tank 10 through the first connection line 14. Transferring to the etchant storage tank 20, and controlling the discharge of the etchant of the first etchant storage tank 10 to the first etchant waste line 11 when the absorbance conversion value is less than 10; the second etchant storage tank 20 The etchant transferred to) includes the step of controlling by the control unit 40 to supply to the etcher 30 through the second connection line (24).

Here, before the etching liquid is supplied from the second etching liquid storage tank 20 to the molding machine 30, the second etching liquid analyzer 200 is used as the same principle as the first etching liquid analyzer 100, The etchant of the second etchant storage tank 20 may be discharged into the mold opening unit 30 or the second etchant waste disposal line 21 according to the result of the analysis.

Hereinafter, preferred embodiments 1 (product name: MA-S07L, Dongwha Fine-Chem) for explaining the present invention will be described, but the scope of the present invention is not limited thereto.

In the following Example 1, the characteristics of the change of the absorbance of the etchant over time are analyzed, and a stable range for use is set in connection with the change in the characteristics of the etchant depending on the temperature and the number of days of storage.

Example 1

As can be seen from the graph showing the relationship between the absorbance conversion value and the temperature change with time in Example 1 (see FIG. 3), it can be seen that the etchant in the range of 13.56 to 10.030 can be used stably.

1 day 21st 23rd 24th Temperature 18 ℃ 22 ℃ 25 ℃ 30 ℃ Conversion value 13.560 11.180 10.510 10.030 37 days 29th Temperature 25 ℃ 30 ℃ Conversion value 9.747 9.834

Further, the measurement result of the electron-scanning microscope (the measurement result showing the relationship between the profile change and the absorbance conversion value by etching the etchant with the chromaticity change in the spray mode over time, as shown in FIG. 4) Table 1 also shows that the etching solution within the range of 13.56 to 10.030 can be used stably.

As described above, according to the present invention, it is possible to provide an etchant management system capable of managing the etchant by automatically analyzing the color change degree according to the concentration change of the etchant in real time, And an etching liquid management method therefor.

In addition, according to the analysis result of the etching solution analyzing apparatus according to the present invention, it is possible to accurately analyze the performance change of the etching solution in real time, so that the etching solution can be stably used in the etching process, The cost can be reduced.

Claims (23)

delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete (a) measuring the absorbance of the etchant stored in the first etchant storage tank, and analyzing the state of the etchant stored in the first etchant storage tank; (b) transferring the etchant of the first etchant storage tank to one of the first etchant storage line connected to the first etchant storage tank and the second etchant storage tank connected to the first etchant storage tank according to the analysis result; (c) analyzing the state of the etchant stored in the second etchant storage tank by measuring the absorbance of the etchant transferred to the second etchant storage tank; And (d) transferring the etchant of the second etchant storage tank to an additional second etchant waste line connected to the second etchant storage tank and an etchant connected to the second etchant storage tank according to the analysis result; Etching liquid management method comprising a. 18. The method of claim 16, The step (a) (a1) introducing the etchant of the first etchant storage tank into the flow cell; (a2) irradiating the etchant of the flow cell with measurement light; (a3) measuring the absorbance of the etchant of the flow cell; And (a4) calculating and outputting an absorbance conversion value based on the measured absorbance value of the etchant; Etching liquid management method comprising a. The method of claim 17, further comprising supplying the etchant passed through the flow cell to the first etchant storage tank. 18. The method of claim 17, In the step (b), when the absorbance conversion value is 10 or more, the etchant of the first etchant storage tank is transferred to the second etchant storage tank, and when the absorbance conversion value is less than 10, the etchant of the first etchant storage tank is transferred. Etching liquid management method to be transferred to the first etching liquid waste line. 18. The method of claim 16, The step (c) (c1) introducing the etchant of the second etchant storage tank into the flow cell; (c2) irradiating the etchant of the flow cell with measurement light; (c3) measuring the absorbance of the etchant of the flow cell; And (c4) calculating and outputting an absorbance conversion value based on the measured absorbance value of the etchant; Etching liquid management method comprising a. The method of claim 20, further comprising supplying the etchant passed through the flow cell to the second etchant storage tank. The method of claim 20, In the step (d), if the absorbance conversion value is 10 or more, the etchant of the second etchant storage tank is transferred to the etchant, and if the absorbance conversion value is less than 10, the etchant of the second etchant storage tank is the additional etching solution. Etching liquid management method to be transported to the waste line. delete

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