KR101259878B1 - Optical semiconductor based illuminating apparatus - Google Patents

Abstract

PURPOSE: An optical semiconductor based illuminating device is provided to comprise a main body of a distributor which is connected to main power line, thereby easily supplying power to a light emitting module. CONSTITUTION: An optical semiconductor based illuminating apparatus comprises multiple light emitting modules(100); a housing which the light emitting modules are arranged in; a distributor main body(310) which is connected to a main power line(301) and includes multiple distribution cables. The distributor distributes power which is supplied from the main power line to the multiple light emitting modules. The multiple light emitting modules have a heat sink(110) at the rear side.

Description

Optical semiconductor based lighting device {OPTICAL SEMICONDUCTOR BASED ILLUMINATING APPARATUS}

The present invention relates to an optical semiconductor-based lighting device, and more particularly, to a light emitting module suitable for a lighting device that requires high-power light, such as street lights, security lights and / or factories.

Fluorescent and incandescent lamps have been widely used as light sources for illumination. Incandescent lamps have high power consumption and are inferior in efficiency and economy, and for this reason, their demand is greatly reduced. This decline is expected to continue in the future. On the other hand, fluorescent lamps are more efficient and economical at about one-third of the power consumption of incandescent lamps. However, fluorescent lamps have a problem in that blackening occurs due to a high applied voltage, resulting in short lifespan. In addition, since the fluorescent lamp uses a vacuum glass tube in which mercury, which is a harmful heavy metal material, is injected together with argon gas, there is a disadvantage of being unfriendly to the environment.

Recently, the demand for an LED lighting device including an LED as a light source is rapidly increasing. LED lighting devices have the advantage of long lifetime and low power driving. In addition, the LED illumination device is environmentally friendly since it does not use environmentally harmful substances such as mercury.

Recently, a lighting device using a semiconductor optical element such as an LED as a light source has been widely used for lighting devices that require high light output, such as factory lamps, street lights, or security lamps. Such an illumination device involves a lot of heat during the light emission operation of the light emitting module including the semiconductor optical device.

A lighting device in which a plurality of light emitting modules are assembled in one housing structure has been developed by the inventors of the present invention. In implementing such a lighting apparatus, a distributor for distributing power lines from a main power line from a power supply to a plurality of light emitting modules is required.

Such a distributor must include a distributor body connected to the main power line on one side, and a plurality of distribution lines extending from the distributor body are required. This distributor has a structure in which a plurality of distribution lines are branched out of the distributor body and drawn out, and a problem of waterproofing of distribution lines at the distributed position has arisen.

Accordingly, an object of the present invention is to solve the problem, the power of the main power line to the plurality of light emitting modules through the adoption of a distributor in which a plurality of distribution lines come out and branched in a state of being sealed and integrated for a certain length from the distributor body, which is guaranteed to be waterproof. It is to provide a lighting device that can be provided reliably.

In accordance with an aspect of the present invention, an optical semiconductor-based lighting apparatus includes a plurality of light emitting modules, a housing including a space in which the plurality of light emitting modules are disposed, and power received from an external main power line to the plurality of light emitting modules. Includes a distributor to do this.

At this time, the distributor, the distributor main body connected to the main power line on one side; A cable jacket extending a predetermined length from the other side of the distributor body; Preferably, the distributor body includes a plurality of distribution cables connected to each of the plurality of light emitting modules through the cable jacket.

According to an embodiment, the distributor body may include a power distribution PCB including terminals connected to the main power line and the distribution cables and a power distribution circuit connected to the terminals, and formed to cover the power distribution PCB as a whole. It includes a molding part.

According to one embodiment, the cable jacket extends from the inside of the molding portion to the outside of the molding portion.

According to one embodiment, the housing includes an auxiliary space separated from the main space by a partition wall, the distributor body is located in the auxiliary space, the cable jacket extends through the partition wall and into the main space, Distribution cables branch from the cable jacket in the main space.

According to one embodiment, the cable jacket is assembled to a cable gland installed in the partition wall.

According to one embodiment, the plurality of light emitting modules include a heat sink in the rear, the heat sink includes a passage in which at least one of the distribution cables is located and the heat radiation fins formed around the passage.

According to one embodiment, the plurality of light emitting modules are arranged parallel to each other, the passages are continuously connected.

According to one embodiment, the distribution cables are preferably of different lengths.

According to an embodiment, the distributor may receive DC power from an SMPS connected to the main power line, and the SMPS may be located inside the housing. According to another exemplary embodiment, the distributor may receive DC power from an SMPS connected to the main power line, and the SMPS may be located outside the housing.

According to embodiments of the present invention, the power of the main power line is divided into a plurality of light emitting modules by employing a distributor in which a plurality of distribution lines are branched out and branched in a state of being sealed and integrated from a distributor body of which waterproof or airtight is guaranteed. Can be provided reliably. Other advantages of the present invention will be readily apparent to those skilled in the art from the detailed description.

1 and 2 are a perspective view showing a separation process of the optical semiconductor-based lighting apparatus according to an embodiment of the present invention.
3 and 4 are views for explaining the process of removing the cover according to an embodiment of the present invention.
5 is an exploded perspective view illustrating a light emitting module applied to the lighting apparatus of FIGS. 1 to 4.
6 is a perspective view showing a light emitting module applied to the lighting device of FIGS. 1 to 4.
7 is a side view showing the light emitting module shown in FIGS. 5 and 6.
FIG. 8 is a perspective view illustrating the optical cover illustrated in FIGS. 6 and 7.
9 is a plan view showing the front surface of the light emitting module shown in Figures 6 and 7 with the optical cover omitted.
10 is a plan view showing the lighting device with the cover of the housing omitted so that the rear of the light emitting module can be seen.
FIG. 11 is a partial cutaway view of a portion of the distributor shown in FIG. 10;
12 is a view for explaining a lighting apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

The present invention proposes a distributor for supplying power to a plurality of light emitting modules in a lighting device including a plurality of light emitting modules as one of several features. Before the detailed description of the distributor, the overall structure of the lighting device and the structure of each of the light emitting modules that constitute the other features of the lighting device will be described first.

1 and 2 are perspective views illustrating a process of detaching an optical semiconductor based illumination device, and FIGS. 3 and 4 are views for explaining a process of detaching a cover of the optical semiconductor based illumination device.

As shown in FIGS. 1 and 2, the lighting apparatus includes a housing 200 and a plurality of light emitting modules 100, 100, 100 mounted on the housing 200. The housing 200 includes a box-shaped support frame 220 and outer frame 210 coupled to both left and right sides of the support frame 220. The outer frame 210 has a front portion closed and the upper and lower sides are open. By the coupling structure of the outer frame 210 and the support frame 220 as described above, the housing 200 is limited to a shape that is opened up and down and surrounds around the sides of the light emitting module (100).

The lighting device has a structure in which the housing 200 is open in the vertical direction of the light emitting module 100 and the light emitting module 100 can be detached from the housing 200 in the vertical direction. That is, when an abnormality occurs in a specific light emitting module 100 among the light emitting modules 100 or does not operate, the operator removes only the cover 240 and then only the corresponding light emitting module 100 from the housing 200 in the vertical direction. It allows for easy separation.

Looking at the process of disassembling the light emitting module 100 from the housing 200, after separating the cover 240 is detachably coupled to the upper housing 200 from the housing 200, each other in the housing 200 The light emitting module 100 can be easily separated by lifting the corresponding light emitting module 100 between the fixing plates 230 and 230 facing each other in the vertical direction. On the contrary, by inserting the light emitting module 100 to be repaired or replaced after disassembly into the housing 200 in the vertical direction, the light emitting module 100 can be easily mounted in the housing 200. Therefore, in order to attach and detach the light emitting module 100 which is performed after the light emitting module 100 is installed in the lighting device, it is not necessary to disassemble the housing 200 as a whole.

The housing 200 has a shape surrounding an array edge of the light emitting modules 100. A pair of opposing fixing plates 230 and 230 crossing the inner space defined by the front side of the box-shaped support frame 220 and the outer frame 210 coupled to both sides of the support frame 220 may be provided. Placed before and after.

A plurality of light emitting modules 100, 100, 100 are arranged side by side between the fixing plates 230, 230. Accordingly, the outer frame 210 serves as a wall surrounding the outer edge of the light emitting module (100). The outer frame 210 may be slidably coupled to the support frame 220. The support frame 220 has a box shape partially blocked by the fixed plate 230 at the rear, and as described below, the cables connected to the external power supply pass through the inside of the support frame 220 and then the fixed plate. Passed through the 230 is connected to the light emitting module (100). By forming a plurality of holes 231 in the fixing plate 230, it is possible to quickly discharge heat in the housing 200.

When the operator applies a force in the direction indicated by the arrow transparently as shown in FIG. 3 to remove the cover 240, the cover 240 may be easily separated to the upper side of the light emitting module 100 as shown in FIG. 4. Can be. In addition, the operator is not particularly shown in addition to the separation method of the cover 240 as described above, by applying a force almost simultaneously from both sides of the cover 240, such as separating the cover 240 to the upper side of the light emitting module 100, etc. Of course, the embodiment may be applied.

Hereinafter, the entire structure of the housing in which the light emitting module is mounted has been described. Hereinafter, the light emitting module will be described in more detail. Note that although the light emitting module described below is well suited to a lighting device having a housing having the above-described structure, it may be usefully used for a lighting device including another structure.

5 is an exploded perspective view showing a light emitting module applied to the lighting device of Figures 1 to 4, Figure 6 is a combined perspective view showing a light emitting module applied to the lighting device of Figures 1 to 4, Figure 7 5 and 6 are side views illustrating the light emitting module shown in FIG. 6, FIG. 8 is a perspective view illustrating the optical cover shown in FIGS. 6 and 7, and FIG. 9 is a front view of the light emitting module shown in FIGS. 6 and 7. Is a plan view showing the optical cover is omitted.

5 to 9, the light emitting module 100 includes a heat sink 110 functioning as a heat radiating member, an optical cover 120 coupled to an upper end of the heat sink 110, and the heat. A printed circuit board 140 mounted on an upper surface of the heat sink 110 between the sink 110 and the optical cover 120, and a plurality of semiconductor optical devices 150 mounted on the printed circuit board 140. ).

In the present embodiment, the heat sink 110 has an upper end exposed higher than an upper surface on which the printed circuit board 140 is disposed, and the optical cover 120 covers the upper end of the heat sink 110. ) Is combined.

As mentioned above, the printed circuit board 140 is disposed and mounted on the top surface of the heat sink 110. In addition, the heat sink 110 includes a plurality of heat dissipation fins 118 integrally thereunder. In addition, the heat sink 110 includes a main region 111 on which a printed circuit board 140 is mounted, and an elongated recessed region 112 having a rectangle is formed inside the main region 111. The main region 111 has a substantially rectangular annulus by the recessed region 112. The recessed area 112 and the bottom surface of the main area 111 are provided flat. As described in detail below, the recessed region 112 is provided with a driving circuit board 160 provided to drive the semiconductor optical device 150 or the optical semiconductor chip 152 (see FIG. 9) included therein.

The printed circuit board 140 is preferably a metal core PCB (MCPCB) based on a metal having high thermal conductivity. However, it may be a typical FR4 PCB, for example.

The heat sink 110 integrally includes an inner wall 113 having a rectangular annular shape surrounding the main region 111. The inner wall 113 protrudes vertically from the top surface of the heat sink 110 to correspond to the insertable edge portion 124 of the translucent optical cover 120 which will be described in detail below. In addition, the inner wall 113 is formed along an edge of the heat sink 110. In addition, an insertion portion corresponding to the edge portion 124 is formed around the inner wall 113.

Meanwhile, valleys having a predetermined depth are formed along a boundary between the inner wall 113 and the main region 111. In addition, the heat sink 110 integrally includes an outer wall 114 formed along the circumference of the inner wall 113. Each of the height of the inner wall 113 and the height of the outer wall 114 is constant, but the height of the inner wall 113 may be greater than the height of the outer wall 114. The groove-shaped insertion portion between the inner wall 113 and the outer wall 114 has a square annular shape that seals between the heat sink 110 and the optical cover 120 while being pressed by the edge portion 124 when combined with the optical cover 120. The sealing member 130 is installed in an insertable manner.

The optical cover 120 is made by injection molding a transparent plastic resin, and includes a transparent cover plate 121 having a plurality of lens units 122 in a predetermined arrangement. In addition, the optical cover 120 integrally includes an edge portion 124 of a square annular shape which is formed along an edge circumference of the cover plate 121 and extends downward.

The edge portion 124 is integrally provided with a plurality of hook portions 1242 partially cut away from itself and facing outwardly with elasticity. The plurality of hooks 1242 may be formed at substantially constant intervals along the edge portion 124. A plurality of engagement slits 1142 are formed on the inner wall inner surface of the insertion portion of the heat sink 110 described above corresponding to the plurality of hook portions 1242.

In this embodiment, as the fixing means for coupling the optical cover 120 to the heat sink 110, the hook portion 1242 and the engaging slit 1142 as described above are used, but, for example, one side of the optical cover It may also be considered to use the fastening member fastened through the fastening portion formed in the heat sink to correspond to the through portion formed in the heat sink and the optical cover.

When the optical cover 120 is coupled to the heat sink 110, the edge portion 124 of the optical cover 120 presses the sealing member 130 while the inner wall 113 of the heat sink 110 is pressed. And an annular insert between the outer wall 114 and the outer wall 114. At this time, the hook portions 1242 (as shown in FIG. 8) of the edge portion 124 mesh with the engagement slit 1142, whereby the optical cover 120 is fixed to the top of the heat sink 110. do. By interacting with the insertion wall 124 and the sealing member 130, the inner space between the optical cover 120 and the heat sink 110 can be more reliably sealed. With the edge portion 124 as a double wall structure, the hook portion 1242 is provided only on the outer wall surface of the double wall structure, and by the inner wall, sealing can be made more securely.

At this time, the installation location and the number of installation of the hook portion (1242) can be variously modified according to the environment in which the light emitting module 100 is applied, usually forming the hook portion 1242 at 45mm intervals of the optical cover 120 When a total of 12 hook portions 1242 are formed on each side of each of six hooks along the length direction, the dustproof waterproof grade of an outdoor security lamp or a street lamp satisfies the requirements.

The printed circuit board 140 is mounted on the upper main region 111 of the heat sink 110. The printed circuit board 140 has a shape in which a portion corresponding to the recessed region 112 inside the main region 111 is omitted. With this configuration, the printed circuit board 140 has a transverse mounting portion that connects two longitudinal mounting portions 142, 142 parallel to one another and one ends of the longitudinal mounting portions 142, 142 in a transverse direction. 144. The main region 111 is formed to be wider than the other region in which one region is opposed in the longitudinal direction, and the lateral mounting portion 144 is located in the wide region.

As mentioned above, two rows of semiconductor optical devices 150 are mounted on the printed circuit board 140 at regular intervals. Six semiconductor optical devices 150 in one row are mounted on one longitudinal mount 142 at regular intervals, and six semiconductor optical devices 150 in two rows on the other longitudinal mount 142. Are mounted at regular intervals.

One row of semiconductor optical elements 150 and two rows of semiconductor optical elements 150 are symmetrically arranged with respect to the recessed area 112, and thus, each semiconductor in the two longitudinal mounting portions 142 and 142 is arranged symmetrically. The optical elements 150 face each other. Since each of the semiconductor optical devices 150 includes an optical semiconductor chip such as a light emitting diode chip therein, the arrangement of the optical semiconductor chips follows the arrangement of the semiconductor optical devices 150.

On the bottom surface of the recessed region 112, a driving circuit board 160 on which circuit components for operating the semiconductor optical device 150 or the optical semiconductor chips are mounted is mounted. Since the driving circuit board 160 is located in the relatively low recessed area 112, the driving circuit board 160 and the circuit components mounted thereon are greatly reduced in the propagation path of the light emitted from the semiconductor optical device 150. Can give This greatly contributes to reducing light loss.

FIG. 10 is a plan view showing the lighting apparatus with the cover of the housing omitted so that the rear of the light emitting module can be seen, and FIG. 11 is a partial cutaway view showing a portion of the distributor shown in FIG.

 The lighting apparatus may include a plurality of light emitting modules 100 including a structure as described above. As described above, the lighting device includes a box-shaped support frame 220 and an outer frame 210 coupled thereto. A space in which the plurality of light emitting modules 100, 100, 100 are arranged side by side is provided inside the outer frame 210. The power supply device 400 (hereinafter, SMPS), for example, a switching mode power supply (SMPS) may be provided inside the support frame 220. The SMPS 400 is connected to an AC power line drawn from the outside while being located in the support frame 220.

Each light emitting module 100 includes a heat sink 110 integrally provided with a plurality of plate-shaped heat dissipation fins 118 on the opposite side from which light is emitted. In the center of each heat sink 110, a cable passage 119 in which heat dissipation fins 118 are not formed is formed. The cable passages 119 of each of the plurality of light emitting modules 100 are connected to each other at the rear of the heat sink 110. The cable passages 119 of the entire light emitting modules 100 are entirely connected to the rear of the heat sink 110 to form one long cable passage. According to an embodiment of the present invention, the distributor 300 receives DC power through a main power line extending from the output terminal of the SMPS 400, and distributes the DC power to the plurality of light emitting modules 100 is provided. do.

10 and 11, the distributor 300 includes a distributor body 310, an external cable jacket 320, and a plurality of distribution cables 330a, 330b, and 330c.

The distributor body 310 is connected to the main power line 301 on one side and integrally connected to the external cable jacket 320 on the other side. In addition, the plurality of distribution cables 330a, 330b, and 330c are installed to be drawn out from the other side of the distributor body 310.

In this case, the plurality of distribution cables 330a, 330b, and 330c pass through the external cable jacket 320 for a predetermined length of time from or before being drawn out from the distributor body 310.

The outer cable jacket 320 surrounds the plurality of distribution cables 330a, 330b, and 330c while being integrally connected with the distributor body 310. Accordingly, the plurality of distribution cables 330a, 330b, and 330c are not exposed to the outside by being surrounded by the external cable jacket 320 for a predetermined length from the distributor body 310. The plurality of distribution cables 330a, 330b, and 330c have different lengths so that they can be connected to the light emitting modules 100, 100, and 100 placed at different positions. For electrical connection with the light emitting modules 100, 100, 100, each of the plurality of distribution cables 330a, 330b, and 330c has connectors 331a, 331b, and 331c at the ends thereof.

The distributor body 310 is located inside the box-shaped support frame 200. The outer cable jacket 320 is a partition wall partitioning between the box-shaped support frame 200 and the installation space (hereinafter, referred to as the "light emitting module space") of the light emitting module 100, the fixing plate 230 in the present embodiment It is arranged to penetrate. A cable gland 302 is installed in the through hole of the partition wall, and the outer cable jacket 320 is assembled to the cable gland 302. The distribution cables 330a, 330b, and 330c are connected to each of the light emitting modules 100, 100, and 100 which are positioned at different positions from the external cable jacket 320 in the light emitting module space. Since the outer cable jacket 320 covers the distribution cables 330a, 330b, and 330c in a sealed structure in a predetermined length section, particularly in a certain length section in which an environment requiring waterproofing is provided, due to moisture infiltration, The risk of disconnection can be blocked beforehand.

As shown in FIG. 11, the distributor body 310 includes a power distribution PCB 311 and a molding part 312 formed to cover the power distribution PCB 311 as a whole. One end of the outer cable jacket 320 is located in the molding part 312 is protected from the outside. In addition, the power distribution PCB 311 is connected to the (+) and (-) terminals connected to the main power line 301 and (+) and (-) connected to the distribution cables 330a, 330b, and 330c. Parallel circuit patterns are formed between the terminals and between them. The distribution cables are integrated into the outer cable jacket 320 in the molding portion 312 of the distributor body 310.

As mentioned above, the main power line 301 may be connected to the SMPS 400 which is a power supply for converting external AC power into DC power. In this case, the main power line 301 distributes the DC power from the SMPS 400 to a plurality of light emitting modules.

 The outer cable jacket 320 is flexible to avoid interference with other components. Since the outer cable jacket 320 is flexible, for example, when a large device or component such as an SMPS is installed in the support frame 220, the outer cable jacket 320 may be bent to avoid interference with such large component.

12 is a view for explaining a lighting apparatus according to another embodiment of the present invention. According to the previous embodiment described with reference to FIG. 10, the SMPS 400 is located within the support frame 220 which is part of the housing. In contrast, in the lighting apparatus according to the present embodiment, as shown in FIG. 12, the SMPS 400 is located outside the housing of the lighting apparatus. DC power converted from AC power by the SMPS 400 outside the housing is supplied via the main power line 301 to the distributor 300 located in the support frame 220 of the housing. The rest of the configuration is substantially the same as the previous embodiment, so the description is omitted to avoid duplication.

Many other modifications and applications are also possible to those skilled in the art within the scope of the basic technical idea of the present invention.

Claims (11)

A plurality of light emitting modules,
A housing including a space in which the plurality of light emitting modules are disposed;
A distributor for distributing power received from the main power line to the plurality of light emitting modules, including a distributor main body connected to a main power line at one side, and a plurality of distribution cables connected to the plurality of light emitting modules from the distributor main body; ,
The plurality of light emitting modules include a heat sink at the rear,
The heat sink is an optical semiconductor-based illumination device, characterized in that it comprises a passage in which at least one of the distribution cables is located and the heat radiation fins formed around the passage. The method of claim 1, wherein the distributor,
Further comprising a cable jacket extending a predetermined length from the other side of the distributor body,
And the plurality of distribution cables are connected to each of the plurality of light emitting modules through the cable jacket from the distributor body. The method of claim 2, wherein the distributor body,
A power distribution PCB comprising terminals connected to the main power line and the distribution cables and a power distribution circuit connected to the terminals;
And a molding unit formed to cover the power distribution PCB as a whole. The optical semiconductor based lighting apparatus of claim 3, wherein the cable jacket extends from the inside of the molding to the outside of the molding. The method according to claim 2,
The housing includes an auxiliary space separated from the main space by a partition wall,
The distributor body is located in the auxiliary space,
The cable jacket extends through the partition into the main space,
And the distribution cables are branched from the cable jacket in the main space. The optical semiconductor based lighting apparatus of claim 5, wherein the cable jacket is assembled to a cable gland installed in the partition wall. delete The optical semiconductor based lighting apparatus of claim 1, wherein the plurality of light emitting modules are arranged in parallel with each other, and the passages are continuously connected to each other. The optical semiconductor based illumination device of claim 2, wherein the distribution cables have different lengths. The optical semiconductor based lighting apparatus of claim 2, wherein the distributor receives DC power from an SMPS connected to the main power line, and the SMPS is located inside the housing. The optical semiconductor based lighting apparatus of claim 2, wherein the distributor receives DC power from an SMPS connected to the main power line, and the SMPS is located outside the housing.

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