KR101234739B1 - Amoled pad pattern repair device - Google Patents

Abstract

The present invention relates to an apparatus for repairing a pad pattern of an organic light emitting diode, and in particular, a stage for loading an organic light emitting diode onto a reference plane, and a laser optical system for performing a repair process by irradiating a laser to the pad pattern of the organic light emitting diode, The laser optical system includes a laser oscillator for oscillating a laser beam; A beam transfer unit for changing the direction of the laser beam irradiated from the laser oscillation unit and transferring the laser beam to the pad pattern of the organic light emitting diode; A beam size adjusting unit for converting the size of the laser beam; And an image unit for capturing the organic light emitting layer image in real time.

Description

Pad pattern repair device for organic light emitting device {AMOLED PAD PATTERN REPAIR DEVICE}

The present invention relates to a device for repairing a defect of a pad pattern of an organic light emitting device by irradiating a laser.

OLED refers to a self-luminous display based on the principle that electrons and holes combine in an organic layer when a current is applied to a fluorescent or phosphorescent organic thin film. At this time, the color of light varies according to the organic material constituting the light emitting layer. OLEDs are again divided into passive matrix (PM) OLEDs and active AM OLEDs (Active Matrix Organic Light Emitting Diodes). The PM OLED is a line driving method in which one entire line is driven to emit light at a time, whereas the AM OLED is an individual driving method in which each of the light emitting elements is driven.

1, when electrons are generated between the anode electrode 4 and the cathode electrode 2, electrons generated from the cathode electrode 2 pass through the electron injection layer 1a And the electron transporting layer 1b to the light emitting layer 1c. The holes generated from the anode electrode 4 move toward the light emitting layer 1c through the hole injecting layer 1e and the hole transporting layer 1d. Thus, in the light-emitting layer 1c, an exciton is formed by recombination of electrons and electrons supplied from the electron-transporting layer 1b and the hole-transporting layer 1b, and the exciton is again excited to the ground state, And is discharged to the outside through the anode electrode 4, whereby an image is displayed.

Completion of the OLED manufacturing process is completed by lighting test on the pad pattern, which is an end portion of the pad connecting the OLED substrate and the driving printed circuit board (PCB). In order to perform such lighting test, a probe is applied to the pad pattern. It is common to perform a contact, ie a probe station test.

However, during the Probe Station Test, a scratch is generated at the portion where the probe tip contacts, or glass scribing or glass cut is performed. The scratches are generated by particles generated in the step, or the scratches and particles generated during loading / unloading of other substrates may cause electrical defects.

The present invention has been made to solve the above-described problems, an object of the present invention is to repair by repairing a laser short cut caused by a scratch generated in the pad end during the lighting test step in the manufacturing process of the organic light emitting device or The present invention provides a pad pattern repair apparatus for repairing a wiring, a disconnected part by laser deposition using an atmospheric pressure chamber.

In order to solve the above problems, the present invention, a stage for loading an organic light emitting device on a reference plane; A laser optical system for performing a repair process by irradiating a laser to the pad pattern of the organic light emitting device; including, The laser optical system, Laser oscillation unit for oscillating a laser beam; By switching the direction of the laser beam irradiated from the laser oscillation unit A beam transmitting unit transferring the pad pattern of the organic light emitting device; A beam size adjusting unit for converting the size of the laser beam; And an image unit for capturing the organic light emitting layer image in real time to provide a pad pattern repair apparatus for an organic light emitting device.

In addition, the repair process performed in the repair apparatus according to the present invention may be a process of cutting a defective part by irradiating a laser to a short or open defect occurring in the pad pattern part or the pad pattern. The deposition repair may be performed by irradiating a laser in a metal gas atmosphere to an open defect occurring in a site.

The pad pattern repair apparatus may further include an atmospheric pressure chamber disposed on the stage to create a sealed atmosphere of atmospheric pressure, wherein the atmospheric pressure chamber comprises: a chamber body; A laser light irradiation hole which is a passage through which laser light formed in the center of the chamber is irradiated; And a source gas outlet for supplying a source gas so that the metal source gas is collected at the lowermost end of the laser light irradiation hole.

The atmospheric pressure chamber may have a first exhaust port, a protective gas discharge port, and a second exhaust port sequentially formed on a bottom surface of the atmospheric pressure chamber.

In addition, the atmospheric pressure chamber may further include driving means provided on the stage to move the atmospheric pressure chamber to a defective position of the pad pattern.

The pad pattern repair apparatus may further include a clamp installed on the stage to support the opposing surface of the organic light emitting device in close contact with the reference surface.

The beam size adjusting unit constituting the laser optical system, a slit driven by a motor; Slit lighting light source that can determine the size and location of the slit; And a slit illumination mirror for changing a path of light incident from the slit illumination light source. In this case, the slit illumination mirror may be a half mirror or a total reflection mirror capable of driving in and out. have.

In addition, the beam transfer unit, an imaging lens for the laser to form the shape of the laser beam deformed by the slit; And a half mirror for injecting a laser beam into the objective lens.

The imaging unit may further include an illumination device for illuminating a processed sample and an imaging lens for an image, wherein the imaging lens may be an imaging lens having a different magnification and coating than the laser imaging lens.

In addition, the lighting device in the present invention, may be a fall lighting device or a transmissive lighting device, the fall lighting device may be configured to include a half mirror for the fall lighting, in this case, the half mirror for the fall lighting It may be a cube-type half mirror.

The autofocus unit may include an autofocus camera for checking focus; An autofocus half mirror for entering a focus image into the autofocus camera; And

And Z-axis motion for driving the objective lens on the Z-axis.

According to the present invention, in the manufacturing process of the organic light emitting device, in the lighting test step, the short defect caused by the scratch generated on the pad end is repaired by laser cutting, or the wiring or disconnection part is repaired by using an atmospheric pressure chamber. There is an effect that can be repaired by laser deposition.

1 is a schematic diagram of a general OLED structure.
Figure 2 is a block diagram showing the overall configuration of the pad pattern repair apparatus of the organic light emitting device according to the present invention, Figure 3 and Figure 4 shows the configuration of the laser optical system according to the present invention.
5 to 8 are views showing the configuration and operation of the atmospheric pressure chamber added in addition to the laser optical system according to the present invention.
9 to 14 are images comparing before and after performing a repair using the pad pattern repair apparatus according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description with reference to the accompanying drawings, the same reference numerals denote the same elements regardless of the reference numerals, and redundant description thereof will be omitted. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Figure 2 is a block diagram showing the overall configuration of the pad pattern repair apparatus (hereinafter referred to as "the device") of the organic light emitting device according to the present invention, Figures 3 and 4 of the laser optical system according to the present invention The configuration is shown.

Hereinafter, the organic light emitting diode according to the present invention which performs the repair by applying the apparatus includes both a passive PM (Passive Matrix) OLED and an active AM OLED (Active Matrix Organic Light Emitting Diodes).

2, the apparatus according to the present invention includes a stage (S) for loading an organic light emitting element on a reference plane and a laser optical system 200 for performing a repair process by irradiating a laser to a pad pattern of the organic light emitting element. In particular, the laser optical system 200 of the present apparatus is configured to switch the direction of the laser oscillation unit (L) and the laser beam irradiated from the laser oscillation unit for oscillating the laser beam transmitted to the pad pattern of the organic light emitting device 210, and a beam size adjusting unit 220 for converting the size of the laser beam, and an image unit 230 for capturing the organic light emitting layer image in real time. In addition, the lens may further include an autofocus unit 240 and an objective lens 250 for adjusting the objective lens focus of the upper portion of the organic light emitting layer.

Referring to FIG. 3, the laser oscillator L of the optical system according to the present invention may further include beam output (intensity) adjusting means, which is an upper optical system, and beam forming control means for converting a beam profile. Reference numeral 210 denotes a first turning mirror 211 and a second turning mirror 212 for changing the direction of the laser beam, an imaging lens 213 for forming the shape of the laser beam, and an objective lens for the laser beam. It may be configured as a half mirror 214 for the laser to enter the (250).

The laser beam emitted from the laser oscillator (L) is processed by the slit 223 of the beam size adjusting unit 220, which is converted to the lower side by the first turning mirror 211 to adjust the path of the beam to be described later. It is changed to a suitable size. The laser beam passing through the slit 223 is reflected by the lower second turning mirror 212 and passes through the laser imaging lens 213 and is reflected by the laser half mirror 214 to enter the objective lens 250. It is irradiated to the pad pattern of the organic light emitting device described above to allow the laser processing such as cutting, wiring, deposition, etc. for the defective area to proceed.

The laser half mirror 214 is an optical system that combines a laser axis and an image axis to reflect a beam of a laser wavelength used for processing, and transmits an image of a sample to a main camera 231. . In the case of using a laser having a visible wavelength, it overlaps with the visible region of the image axis. Therefore, a 50:50 transparent reflective coating should be applied in the visible region. The path of the laser beam guided by the configuration of the beam delivery unit 210 as described above has a path different from the optical path of the image axis until the laser half mirror 214 meets the image axis.

The beam size adjusting unit 220 includes a slit 223 driven by a motor, a slit illumination light source 221 capable of confirming the size and position of the slit, and a slit illumination half mirror 222. Illumination of visible light emitted by the slit illumination light source 221 is reflected by the half mirror 222 for slit illumination, passes through the slit 223 in the same way as the path of the laser beam, and then is reflected by the second turning mirror 212 to the laser. The light passes through the melting lens 213 and enters the objective lens 250 by the laser half mirror 214, and the image of the slit 223 is formed on the light emitting layer S of the organic light emitting diode. Based on the image of the slit 223 formed in the light emitting layer S of the organic light emitting device, the size and the processing position of the slit 223 are checked and processing is performed. At this time, the slit lighting half mirror 222 is separated from the optical path by the cylinder drive during laser irradiation to reduce the output loss of the laser. In other words, after confirming the processing area and the processing size by the slit illumination, when the laser oscillation, the loss of the laser by the slit lighting half mirror 222 is minimized when the laser oscillates.

In the case of In Out configuration as described above, instead of the half mirror, a general reflection mirror may be used. When using a laser in the visible region without using the In Out function, 50:50 transmission reflection coating should be applied in the visible region because the wavelength of the illumination and the laser is the same visible light. This results in 50% loss of laser and slit illumination respectively. The imaging unit 230 includes a main camera 231, an imaging lens 232 for images, a fall light source 233, a fall mirror half mirror 234, and a through light source 235. The main camera is a CCD (CMOS) camera. Light is illuminated on the organic light emitting element by the fall light illumination source 233 or the transmission illumination light source 235, and the image of the pad pattern of the organic light emitting element passes through the image forming lens 232 and forms an image on the main camera 231. do.

The imaging lens 232 for the image may be changed at a magnification of 0.5 times to make the field of view (FOV) wider. At this time, the fall mirror half mirror 234 reflects the fall illumination light source 233 and the reflection in the visible light region so that the image of the processing sample S by the objective lens 250 is transferred to the main camera 231. The transmittance is designed to be 50:50. If the fall illumination light source 233 has a sufficient amount of light and the transmission illumination light source 235 lacks a light amount, the reflection and transmittance of the fall illumination half mirror 234 may be designed in a ratio of 30:70 or the like.

In addition, according to an exemplary embodiment of the present invention, an autofocus unit 240 is disposed between the main camera 231 and the objective lens 250 in order to accurately focus the objective lens on the multilayer thin film S of the organic light emitting diode. ) Is provided. The autofocus unit 240 is an autofocus camera 241 for checking the focus of the objective lens 250, and an autofocus cube type half mirror 242 for injecting a focus image into the autofocus camera 241. ) And a Z-axis driving unit 243 for driving the objective lens 250 to adjust vertically in the Z-axis direction (substrate direction or substrate opposite direction).

The part image in which the defective area of the pad pattern of the organic light emitting element exists is focused by the auto focus unit 241 and output by the camera 242, and a controller (not shown) is based on the acquired image. The focus of the objective lens 250 is adjusted by transmitting a focus control signal to the Z-axis driver 243. The objective lens 250 is mounted on a revolver (not shown) that can change the objective lens so that the objective lens with different magnification can be processed and checked, and the revolver is a linear type of linear motion or It can be configured as a rotary type of rotary motion.

The present invention reduces the output loss of the laser generated in the existing coaxial structure by reducing the number of passes of the half mirror by separating the image axis and the laser axis as described above, while excluding the half mirror 214 for the laser, Half mirror is easy to use, so there is no double image. In addition, it is not only easy to mount the autofocus cube type half mirror 242 and the autofocus camera 241 of the image processing method, but also the amount of light deteriorated by the reflection reflectance of the cube type half mirror 242. Coordination can be overcome.

4 is an embodiment of an optical system according to another embodiment of the present invention.

The illustrated component is a structure having a laser oscillation unit (L) and the turning mirror 111, the illumination light source 321 and the half mirror 322, and the slit 323 and the configuration corresponding to the beam size control unit and The half mirror 337 under the slit is disposed, and then there is an optical system in which a tube mirror 332 and a half mirror under the tube lens 332 are disposed, and an object blend 350 is disposed below the organic lens. The light emitting device may include a stage S and a transmission illumination light source 335.

Figure 5 shows a configuration further comprising an atmospheric pressure chamber 100 on the stage (S) of the apparatus according to the present invention, Figure 6 is a conceptual diagram showing through a cross-sectional configuration of the atmospheric pressure chamber disposed in the apparatus. .

As shown in FIGS. 5 and 6, the apparatus is combined with a laser optical system 200 as shown in FIGS. 3 and 4 to allow the repair of disconnection defects through metal deposition in an atmospheric pressure atmosphere. It may be configured to include more.

That is, the apparatus includes a stage (S), an atmospheric pressure chamber (100), a driving means, and a clamp (C) on which the above-described organic electroluminescent device (E) is placed, and the electrode of the organic electroluminescent device (E). It serves to repair an electrode defect of the pad P.

In particular, in a pad P connecting an organic light emitting diode (E) substrate (hereinafter referred to as a 'substrate') and a driving printed circuit board (PCB), an open occurring at the metal electrode of the pad (P). A technique for laser chemical vapor deposition (CVD) repair equipment to repair (open) or short defects.

The stage S is loaded with an organic light emitting device E substrate to repair defects of the pad P electrode on the upper surface thereof, and a reference body 112 is provided at one end of the upper surface to give a reference point during loading. Here, the reference body 112 is preferably formed in a bent shape so that one side end of the substrate (E) can contact.

The chamber 100 has a laser beam irradiation hole 121 which is a passage through which the laser beam formed in the chamber body 110 and the chamber body is irradiated, and a raw material gas is collected at the lowermost end of the laser beam irradiation hole. It comprises a source gas outlet 122 for supplying gas.

Is provided on the stage (S) is moved by the driving means (not shown in the figure) to the defect position of the pad (P) electrode toward the X, Y, Z axis direction and focused, and irradiates laser light, A laser light irradiation hole 121 having a purge gas outlet 123 and a source gas outlet 122 is formed at a center thereof, and a first exhaust port 125a is protected on the bottom surface of the laser light irradiation hole 121. The gas exhaust port 126 and the second exhaust port 125b are sequentially formed.

That is, the chamber 100 is installed above the substrate E and spaced apart from each other, and is provided with a heating unit (not shown in the drawing) at the top thereof, and a laser light irradiation hole 121 which is a passage through which laser light is irradiated to a central portion thereof. Is formed, a source gas outlet 122 is introduced from the external gas supply unit (not shown in the figure) through the source gas supply line and inclined toward the laser light irradiation hole 121 in the source gas supply unit is formed The metal source gas discharged from the source gas outlet 122 is injected to collect at the lowermost end of the laser light irradiation hole 121.

In addition, a purification gas outlet 123 connected to an external purification gas supply unit (not shown) is connected to an upper end of the source gas supply unit in the chamber 100 such that the purification gas is introduced through the purification gas supply line at one end thereof. do.

In addition, the optical window 124 provided to the upper end of the purge gas discharge port 123 in the chamber 100 is fixed in an airtight state by an O-ring contacting the bottom surface thereof. .

In addition, the chamber 100 includes the first and second exhaust ports 125a and 125b connected to the exhaust means at the bottom of the laser light irradiation hole 121 and a shield gas supply unit (not shown in the drawing). The protection gas outlets 126 are formed to be connected to each other so that the inflow direction and the discharge direction are different.

Here, the protective gas outlet 126 injects a protective gas to prevent damage to the surface of the substrate when the thin film of the pad 16 is deposited. On the other hand, the protective gas outlet 126 is an air curtain (air curtain) is formed because the protective gas is discharged inclined toward the outside direction, the air curtain to prevent the leakage of the unreacted gas and the reaction additives.

Although not shown in the drawing, the driving means is a component installed in the stage 110 to move the chamber 120 in the X, Y, and Z directions, and the laser light irradiation hole 121 may be disposed on the pad ( 16) Move to the defective position of the electrode. At this time, the moving means can move only in the X, Y direction.

The clamp C is installed on the stage S to support the opposite surface of the substrate in close contact with the reference surface of the reference body 112.

On the other hand, the interval between the bottom surface of the chamber body 110 and the substrate (E) is different for each inside and outside the bottom surface of the chamber body 110, so that the discharge and exhaust pressure in the region where the defect is repaired is kept constant The interval between the chamber body 110 and the substrate E may be based on an inner region Area 2 of the protective gas outlet 126 and the second exhaust port 125b at the protective gas outlet 126. The first and second outer areas (Area 1, Area 3) up to) are different.

This is because air pressure in the process area, which is the inner area (Area 2) and the first and second outer areas (Area 1, Area 3), flows out of the process area to repair the defect of the pad 16 electrode. To prevent the difference is to form a gap step.

Furthermore, the gap between the chamber body 110 and the substrate E is an element that affects deposition during defect repair of the metal electrode of the pad P. It is preferable to adjust the spacing in the first and second outer areas (Area 1, Area 3) as a reference.

In addition, most of the remaining protective gas purification gas and the raw material gas are exhausted through the first exhaust port 125a. The interval between the chamber body 110 and the substrate E is based on the case where the thickness of the substrate E is 0.5t. The first outer area 1 is 0.5 mm, and the inner area is (Area 2) is 1 mm, and the second outer area (Area 3) is 1.5 mm. At this time, the interval between the chamber body 110 and the substrate E is relatively increased or decreased according to the thickness of the substrate E.

Alternatively, the distance between the bottom surface of the chamber body 110 and the bottom surface of the chamber body 110 of the clamp (C) provided in the second outer area (Area 3) of the space between the bottom surface of the chamber body 110 and the substrate (E). It is the same as or almost similar to the inner region Area 2. This maintains a constant distance between the bottom surface of the chamber body 110 and the substrate E in the inner region 2 and the second outer region 3 to evenly control the flow and pressure of the airflow. To do this. (See FIG. 7 and FIG. 8)

As a result, the apparatus repairs the method of connecting the electrodes of the open area by applying a deposition process to the area of the metal electrode of the pattern P provided on the substrate E. Deposition is the order of connection hole forming, contact hole filling, and wiring. At this time, if there is an insulating film on the metal electrode of the pattern (P), the deposition proceeds in the order of connection hole formation, wiring hole filling and wiring, if there is no insulating film, except for the connection hole forming and wiring hole filling step Defect repair can be done alone.

Furthermore, when there is an organic material such as an adhesive or the like remaining on the metal electrode of the pad pattern P, the organic material of the corresponding area is removed by using an UV laser. At this time, the metal source for forming the electrode uses molybdenum (Mo), tungsten (W), copper (Cu), silver (Ag), chromium (Cr) and the like.

Furthermore, a cutting process is applied to the region where the metal electrode is short on the substrate E to repair the region that is in the short state to be electrically opened. Further, a probe tip (not shown) is further provided to electrically connect the pad pattern P electrode to measure resistance, and the probe tip is disposed at both ends of the metal electrode of the pad pattern P after repair of the defect of the metal electrode. After measuring the resistance by touching (Probe Tip), it is possible to judge the success of processing. In addition, defect repair is possible in the state where the anisotropic conductive film (ACF), LDI, film, etc., which are attached to the pad pattern P, are removed or stuck.

9 to 12 show actual result images of repairing pad patterns of organic light emitting diodes using the apparatus according to the present invention.

9 and 10 illustrate the repair process results of irradiating and cutting off a short defect caused by scratches generated at the pad stage in the AMOLED lighting test step, before and after repair. Comparing the resultant image, the short defect of the dotted circle portion X found in the transmission light is clearly resolved.

In addition, using the pad pattern repair apparatus according to the present invention, as shown in FIG. 11, a scan cutting according to the type of the defect in the short state, or block short cutting as shown in FIG. cutting) can be used to cut the defect of the diagonal structure.

In addition to the repairing method, the AMOLED lighting inspection step may be repaired by wiring a defect caused by scratches generated on the pad end, or the portions removed between the pad patterns may be repaired through metal deposition.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined by the claims and equivalents thereof.

100: atmospheric pressure chamber
110: chamber body 121: laser light irradiation hole
122: source gas outlet 123: purge gas outlet
124: optical window 125a, 125b: first, second exhaust port
126: outlet C: clamp
Area 1: first outer area Area 2: inner area
Area 3: second outer area
E; Organic light emitting device P: pad pattern
L: laser oscillation unit S: stage
210: beam delivery unit
220: beam size control unit
230: video unit
240: autofocus unit
250: objective lens

Claims (17)

A stage for loading the organic light emitting element on the reference plane;
An atmospheric pressure chamber disposed on the stage to create an atmospheric sealed atmosphere;
A clamp installed on the stage to support the opposing surface of the organic light emitting device in close contact with the reference surface;
It includes; Laser optical system for performing a repair process by irradiating a laser on the pad pattern of the organic light emitting device;
The laser optical system,
A laser oscillator for oscillating a laser beam;
A beam transfer unit for changing the direction of the laser beam irradiated from the laser oscillation unit and transferring the laser beam to the pad pattern of the organic light emitting diode;
A beam size adjusting unit for converting the size of the laser beam; And
An image unit which photographs a pad pattern image of the organic light emitting diode in real time;
And an autofocus unit for adjusting the focus of the objective lens disposed on the pad pattern of the organic light emitting diode.
The atmospheric pressure chamber,
Chamber body;
A laser light irradiation hole which is a passage through which laser light formed in the center of the chamber is irradiated;
A source gas outlet for supplying a source gas so that metal source gas is collected at a lowermost end of the laser beam irradiation hole;
And a first exhaust port, a protective gas discharge port, and a second exhaust port sequentially formed on both bottom surfaces of the laser light irradiation hole.
A clamp having a gap between the organic light emitting element and the chamber in an inner region (Area 2) and a clamp among the first and second outer regions (Area 1, 3) that are both sides of the inner region with respect to the protective gas outlet; 2. The pad pattern repair apparatus of an organic light emitting diode, wherein the distance between the chamber and the clamp surface in the outer area 3 is the same.
The method according to claim 1,
The repair process,
The pad pattern repair apparatus of an organic light emitting device, which is a step of cutting a defective part by irradiating a laser to a short or open defect occurring in the pad pattern part.
The method according to claim 1,
The repair process,
An apparatus for repairing a pad pattern of an organic light emitting diode, the method comprising performing deposition repair by irradiating a laser in a metal gas atmosphere to an open defect occurring in the pad pattern portion.
delete delete delete The method according to claim 1,
The atmospheric pressure chamber,
And a driving means provided on the stage to move the atmospheric chamber to a defective position of the pad pattern.
delete The method according to claim 1,
The beam size adjusting unit,
A slit driven by a motor;
Slit lighting light source that can determine the size and location of the slit; And
And a slit illumination mirror for changing a course of light incident from the slit illumination light source.
The method according to claim 9,
The slit lighting mirror,
The pad pattern repair apparatus of an organic light emitting device, characterized in that the half-mirror or a total reflection mirror capable of driving in and out.
The method according to claim 9,
The beam transmission unit,
A first turning mirror configured to change the direction of the laser beam irradiated from the laser detector into the slit;
A second turning mirror reflecting the laser beam passing through the slit;
An imaging lens for the laser to form the shape of the laser beam reflected by the second turning mirror; And
A laser half mirror for reflecting the laser beam transmitted through the laser imaging lens to the objective lens and transmitting the pad pattern image of the organic light emitting element to the image unit; and a pad of the organic light emitting element Pattern repair device.
The method of claim 11,
The video unit,
An apparatus for repairing a pad pattern of an organic light emitting device further comprising an illumination device for illuminating a processed sample and an imaging lens for an image.
The method of claim 12,
The imaging lens for the image,
The pad pattern repair apparatus of an organic light emitting device, characterized in that the imaging lens and the imaging lens is different magnification and coating.
The method of claim 12,
The illumination device includes:
A pad pattern repair apparatus for an organic light emitting device, characterized in that the fall lighting device or the transmission lighting device.
The method according to claim 14,
The fall lighting device,
Pad pattern repair apparatus for an organic light emitting device comprising a half mirror for illumination.
The method according to claim 15,
The half mirror for fall lighting,
Pad pattern repair apparatus for an organic light emitting device, characterized in that the cube-type half mirror.
The method according to claim 9,
The autofocus unit,
An autofocus camera for checking focus;
An autofocus half mirror for entering a focus image into the autofocus camera; And
And a Z-axis motion for driving the objective lens on the Z-axis.

Images