KR101232990B1 - bath of semiconductor apparatus and method for manufactring the same - Google Patents

Abstract

It is more economical by forming and releasing the resin layer by flow-adhesive powdery material on the metal surface instead of the conventional sheet bending and welding method for the production of large-scale semiconductor-related production equipment bath that is difficult by conventional injection. It can produce high quality semiconductor related production equipment bath.

Description

Bath and semiconductor apparatus and method for manufactring the same

Structure of bath (BATH) using chemical solution or pure water used in semiconductor related equipment and its manufacturing method

In the semiconductor production process, the relevant baths (BATHs) that come into direct contact with the wafer are produced by injecting palletized resin into the mold because they are small in size and require large quantities of the same size. Since it is large in size, it is produced by folding and welding the resin of sheet state.

This type of production has been developed in the direction of reducing the amount of welding as much as possible due to the occurrence of stress in the bent portion, quality problems of the welded portion and the problem of foreign matter remaining in the welded edge.

The manufacturing equipment and its manufacturing method for semiconductor-related production equipment significantly improve such problems, but the welding parts need to be welded in the copper parts as in the past, and there are problems such as the stresses remaining due to the severe change of the cross section in the bent parts. Remains.

The technology of folding and welding the resin on the plate for the manufacture of baths for semiconductor-related production facilities involves the welding defects and foreign matters remaining in the welding edge and the stress caused by bending, and the production of the resin on the pallet by injection. Since there is a limit to producing a large jaw, it is possible to manufacture a larger size, but seeks a structure of a jaw that essentially eliminates welding and bending edges and a manufacturing method therefor.

In order to solve the above problems, a metal mold (mould) made of a metal that fits the required shape is manufactured, and a corner radius (round chamfer or 45 degrees chamfer) is given to each side of the metal mold where the surface is in contact with the rounded or obtuse angle. When the resin powder or micro pallet is put inside the mold and heated while moving the metal mold, the resin melts and moves along the inner surface of the metal mold to form a layer to be paired with the metal mold. Extraction of the terrain produces a bath for semiconductors (BATH) with rounded chamfers without welding.

Compared to the conventional method of folding and welding a plate, various defects due to welding are eliminated and a large-scale semiconductor-related production bath, which is difficult to produce by injection molding, can be produced in high quality. Even in the case of manufacturing the mold is more economical.

1 is a perspective view showing the appearance of a bath by a conventional sheet metal folding method.
Fig. 2 is a cutaway sectional view when the resin layer 16 is molded into a metal-like shape by melting the resin in the outer mold 10 in the bath molding method according to the present invention.
3 is a cross-sectional view of the resin when the resin layer 16 is molded into a metal-like shape by melting the resin outside the inner mold 10A in the bath molding method according to the present invention.
Fig. 4 is a cutaway sectional view after demoulding a molded bath 16 from a metal mold after cooling in a method of forming a bath according to the present invention.
5 is a perspective view of a bath made by the method of forming a bath according to the present invention;
6 is a perspective view of a chemical liquid tank manufactured by a method of forming a bath according to the present invention.
Figure 7 is an appearance photograph of a bath photographing the embodiment produced by the method of forming a bath according to the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bath for semiconductor related production equipment and a method for manufacturing the same, and a bath for semiconductor related production equipment is a washing tank using DI WATER or a chemical tank or cooler using chemicals. It is a container that contains condensate of harmful gas of CHILLER, and this bath is especially chemical resistant, and depending on the application, there is no residue of PARTICLE made of materials with mechanical strength and heat resistance.

Is preferably a structure.

 Baths for semiconductor-related production facilities vary in size and structure depending on the installation location of a particular device even in the above-mentioned applications, but basically, a container enclosed by a wall is formed to form an inlet and an outlet of a solution. Chloride), PP (Polypropylene), PC (Polycarbonate), Nylon (Nylon) resin and PVDF (Polyvinylidene fluoride), PFA (Perfluoroalkoxy), fluorine resin such as ETFE, ECTFE, MFA, PPS, Acatal, Polyes, LCP, PEEK, Manufactured using materials containing engineering plastics such as PEI.

 Preparation of a bath for a semiconductor-related production facility comprises the steps of first preparing a powder or micropallet (hereinafter referred to as a powder material) of the material and a metal mold suitable for the purpose; A material input step of applying the powder material to the metal mold; A molding step of forming a resin layer adhered by flowing the resin in the shape of a metal mold; Cooling step of cooling the molding; Release step of separating the metal mold and the molding; An inspection step of correcting and inspecting the molding; The process is made of.

The material to be prepared in the preparation step uses any one or two or more of the above-mentioned powder materials, when using two or more of them, physically mixed to exhibit the properties required for the material, or one resin is first applied to the metal mold Another resin is applied later to form a plurality of layers.

When using the resin of some of the powder material in the preparation step may be added to the antioxidant or UV stabilizer and processing stabilizer to maintain the physical properties of the material during molding and for the convenience of processing.

In the preparation step, the metal mold may be manufactured in an outer mold (outer mold) that fits into an outer surface of a bath shape to be molded, or manufactured into an inner mold (inner mold) that fits an inner surface of a bath shape to be molded, but for mold release. Divided into several pieces and assembled to the assembly line.
2 shows an example of an outer mold.
The resin molten layer which becomes a product is formed according to the inner surface shape of an outer mold in the hollow state inside the outer mold 10 with the code | symbol 16. As shown in FIG.
3 illustrates an example of an internal mold.
The resin molten layer which becomes a product is formed with the code | symbol 16 at the outer side of the inner mold 10A according to the shape of the outer surface of an inner mold.

The corners of the metal face and face shall form a corner radius or 45 degrees of intersecting angles so that powder material flows smoothly during molding and it is difficult to settle at the edges of foreign materials during the use of the product. At least 3mm, preferably at least 6mm, for inner corner radius of 120 to 60 degrees, and at least 2mm, preferably at least 3mm, for 60 ° angle between two sides. In the case of inner edge radius less than or equal to 10 mm or more, all corner radii are to be formed at one or less than 1/10 of the bath width or less than 100 times the metal wall thickness.

When the bath is used as a chemical bath (see Fig. 6 chemical bath), in the part where the wafer at the lower part of the bath does not touch, a semicircular or oval bottom is formed by tangentially the entire bottom of the rectangular bath, or The bottom of the tank is formed as a floor with an inclined surface bounded by a semicircle that tangentially conserves chemicals.

When the metal mold is the outer mold 10 in the material input step of applying the powder material to the metal mold, the powder material is put into the metal mold, and in the case of the inner mold 10A, the container with the powder material larger than the inner mold ( 23) The powder material is added and the inner mold 10A is immersed in the container 23 containing the powder material to a depth (resin pool) 22 containing the powder material.

In the forming step, as the temperature increases by heating the metal mold 10 or 10A, the powder material is adhered to the metal mold surface (hereinafter referred to as fluid adhesion), and then melted to form the resin layer 16. Over time, the thickness of the layer gradually increases.

In the case of the fluid adhesion, when the temperature of the metal mold rises, the powder material around the metal mold is attracted to the surface of the metal mold at a high temperature even though it is not yet melted. The adhesive layer is not chemically bonded to the surface of the metal mold and is separated from the surface of the metal mold with a small force. When the molten resin layer 16 reaches the desired thickness, the heating is stopped.

When the powder material is applied to the metal mold (10 or 10A) and the mold is moved, the powder resin, which is not yet fluid-flowing, flows to the lower part by gravity due to the movement of the metal mold. The thickness of the molten resin layer 16 is uniformed or the thickness of a specific portion is adjusted by rotating or oscillating, or simultaneously rotating about several axes, or oscillating about another axis while rotating about a specific axis.

When heating, the outer mold 10 is heated by a method such as a flame, direct heat radiation using a heating coil, an atmosphere heating using a blower using a heating coil, and the like using a hot gas stream in the cavity inside. Auxiliary heating is also possible. The inner mold 10A heats the inside of the metal mold by using the heat generated by the cartridge heater 21 or the mold heater and, if necessary, uses the hot gas stream to heat the specific part of the outer surface.

In the cooling step, the molded product is cooled to a release temperature, but the cooling method is cooled by air cooling or cooling water spray according to the characteristics of the resin.

In the release step of separating the molding, the molding is separated and removed from the metal mold by separating and removing the metal mold along the metal assembly line.
In the case of the outer mold, the resin is self-released from the metal mold as the cooling proceeds due to the difference in shrinkage between the resin and the metal mold unless a special restraint is added to the resin melt layer.

In the inspection stage to correct and inspect the moldings, they are calibrated to minimize the deformation of the dimensions during the complete cooling of the separated moldings, eliminating the marks on the assembly line of the mold, and inspecting and correcting the defects of dimensions and shapes.

Bath tub drains for semiconductor-related production equipment are integrally molded so that particles do not remain in the welded part at the connection with the pipe.

  The present invention can produce a large-scale semiconductor-related production facility bath, which could not be produced by injection by the above manufacturing method, at a higher quality instead of welding and bending.

10; Outer mold 10A; Internal mold
11; Outer corner radius 12; Inner corner radius
13; Mold cover 14; insulator
15; Mold fixture 16; Resin Melt Layer (molding bath)
17; Powder inlet 20; temperature Senser
21; Cartridge heater 22; Resin paste
23; Powder material container

Claims (9)

Preparing a metal mold and powdery material to manufacture a tank for semiconductor-related production equipment, applying the prepared powder material to the metal mold, a molding step of forming a resin melt layer by fluidly bonding the powder material to the metal mold, And a cooling step, a release step of separating the resin bath from the metal mold, and a calibration and inspection step of the resin bath.
The semiconductor material according to claim 1, wherein the powdery material is any one or more of PVC, PP, PC, nylon resin, fluorine-containing resin, PPS, Acatal, Polyes, LCP, Peek, PEI. Method of manufacturing flow adhesion of equipment tanks.


delete The method of claim 1, wherein the movement of the metal mold for fluid adhesion in the forming step causes the metal mold to rotate or oscillate, or to rotate simultaneously on several axes, or to swing about another axis while rotating about a specific axis. A method for manufacturing a fluid adhesive of a bath for a semiconductor related production equipment, characterized in that the thickness of the molten layer is uniformed or the thickness of a specific portion is adjusted to any one of the layers.
The method of claim 1, wherein the metal mold for flow adhesion is either an external mold or an internal mold.
delete A tank for semiconductor-related production equipment, characterized in that it is molded by flow-adhesive powdery resin material on a heated metal mold surface following the bath for semiconductor-related production equipment.
The tank for semiconductor-related production equipment molded by flow-adhesion according to claim 7, wherein any one of the corner radius or the chamfer of 45 degrees is formed at the corner.
8. The method according to claim 7, wherein the lower surface of the tank is either semicircular or oval with a tangent or a sloped surface with a semicircle tangent with the entire bottom of the tank to reduce chemical solution. A tank for semiconductor-related production equipment, characterized in that.

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